Automatic burn-in test equipment

Abstract

The present invention discloses an automatic pre-burning test device, comprising: a loading area for placing a carrier carrying a wafer to be tested; a unloading area for collecting the carrier carrying the tested wafer; a plurality of test units arranged side by side between the loading area and the unloading area, the test unit comprising at least one layer and a plurality of test modules, the layer frame being composed of a plurality of platforms of different heights to form a plurality of test areas; a plurality of test modules being respectively arranged in the test areas of corresponding heights, the test modules being capable of preheating and testing operations; a loading and unloading transfer area, connecting the loading area, the unloading area and a plurality of test units, comprising a mechanical arm, a moving mechanism and a track group, the moving mechanism carrying the mechanical arm moves the carrier to a predetermined position on the track group, and the mechanical arm moves the carrier from the loading area to the test area, or from the test area to the unloading area; thereby, the present invention utilizes a three-dimensional multi-layered test area to reduce the area occupied by the equipment, improve the test output and efficiency, and also reduce the cost.

Description

Technical Field

[0001] The invention belongs to the technical field of automatic pre-burning test equipment, and in particular to a device which provides a three-dimensional multi-layered multiple test area and can perform preheating temperature rise test. Background Art

[0002] like Figure 1 FIG. 1 is a schematic diagram of an existing wafer burn-in test device, which includes a burn-in plate 11, a lifting mechanism 12, a buckling mechanism 13, a conveyor belt 14, and a control computer 15. A plurality of wafers to be tested (not shown) are carried by a metal carrier 16. The metal carrier 16 is sequentially advanced by the conveyor belt 14, and the burn-in plate 11 is controlled by the lifting mechanism 12 to descend and contact the metal carrier 16, and the buckling mechanism 13 is locked when in contact. In addition to the heating device, the burn-in plate 11 is also provided with a needle holder responsible for contacting the wafer to be tested. The heating temperature is controlled by the control computer 15, and the needle holder performs electrical connection and related burn-in test operations.

[0003] Since the preheating test operation needs to be performed before the relevant electrical test can be performed, the required test time is relatively long. The operation mode of the conveyor belt 13 is to move the next set of metal trays 16 only after all the test operations are completed, which wastes a lot of invalid waiting time. Although the manufacturer places multiple sets of metal trays 16 and multiple sets of preheated boards 11 on the conveyor belt 13 at the same time to test them in order to improve efficiency, thereby increasing the number of tests and improving efficiency, the long transportation waiting time is an insurmountable problem. This method still cannot meet the needs of manufacturers, and a large area of ​​factory buildings is required to install such a production line. For this reason, the inventor designed this automatic preheating test equipment. Summary of the invention

[0004] The purpose of the present invention is to provide an automated burn-in test device, which is mainly designed with multiple test areas of a three-dimensional multi-layer structure. During the pre-burn-in, temperature rise and test waiting process, other carriers that are ready for testing or have completed testing can be transferred, thereby improving the overall test efficiency and solving the problems in the prior art.

[0005] In order to achieve the above purpose, the technical solution provided by an embodiment of the present invention is as follows:

[0006] In one embodiment, an automated burn-in test device is provided, including: a loading area for placing a carrier carrying a wafer to be tested; a unloading area for collecting a carrier carrying a wafer that has been tested; a plurality of test units arranged side by side between the loading area and the unloading area, the test unit including at least one shelf and a plurality of test modules, the shelf consisting of a plurality of platforms of different heights forming a plurality of test areas; a plurality of test modules are respectively arranged in the test areas of corresponding heights, the test modules can perform preheating and testing operations; a loading and unloading transfer area, connecting the loading area, the unloading area and a plurality of test units, including a robotic arm, a moving mechanism and a track group, the moving mechanism carrying the robotic arm moves the carrier to a predetermined position on the track group, and the robotic arm moves the carrier from the loading area to the test area, or from the test area to the unloading area.

[0007] Preferably, the test unit is provided with two shelves, and the two shelves are respectively arranged at two opposite sides of the material loading and unloading transfer area, so that the number of test areas can be expanded and increased, and the test efficiency can be improved.

[0008] Preferably, the number of the test units disposed between the loading area and the unloading area can be increased or decreased according to demand, thereby adjusting to an optimal test configuration according to the test time required for different wafers.

[0009] Preferably, the loading area includes: at least one loading storage area, a loading exchange area and a loading transport module, the carrier trays are stacked in the loading storage area, and the loading transport module moves the carrier trays from the loading storage area to the loading exchange area.

[0010] Preferably, the robot arm moves the carrier from the loading and exchanging area to the testing area.

[0011] Preferably, the loading area also includes at least one empty tray storage area and a chip pick-up and placement module. The empty tray storage area is provided with at least one empty carrier tray. The chip pick-up and placement module is used to take out the chip to be tested at a specific position on the carrier tray in the loading exchange area and move it to the empty carrier tray.

[0012] Preferably, the material unloading area includes: at least one material unloading storage area, a material unloading exchange area and a material unloading transport module, and the material unloading transport module moves the carrier from the material unloading exchange area to the material unloading storage area for storage.

[0013] Preferably, the unloading area also includes at least one good product storage area, at least one defective area storage area, and an unloading chip picking and placing module. The good product storage area is provided with at least one good product carrier; the defective area storage area is provided with at least one defective product carrier; the unloading chip picking and placing module moves the defective chips on the carrier in the unloading exchange area to the defective product carrier, and moves the good chips on the good product carrier to the empty space on the carrier in the unloading exchange area.

[0014] Preferably, the robot arm moves the carrier from the testing area to the material exchange area.

[0015] Compared with the prior art, the present invention has the following specific effects:

[0016] 1. The shelf is composed of multiple platforms of different heights to form multiple test areas. The multiple test areas of this multi-layer structure can transfer other carriers carrying wafers to be tested or completed during the pre-burning, heating and testing process of a single carrier, thereby improving the overall test efficiency.

[0017] 2. Multiple testing areas are set up on both sides of the loading and unloading area to increase production and improve efficiency.

[0018] 3. The number of test units between the loading area and the unloading area can be increased or decreased according to demand, thereby adjusting to the best working configuration according to the pre-burning temperature and test time required for different chips to achieve the best operating efficiency.

[0019] 4. Wafers that do not need to be tested can be picked out in the loading area, and then defective products can be removed and filled with good products based on the test results to meet the actual mass production needs.

[0020] 5. The use of a three-dimensional multi-layer test area architecture can increase the number of tests that can be performed per unit area, save the required factory area, reduce factory investment costs, increase test volume and improve profits. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 is a schematic diagram of an existing wafer burn-in test device;

[0023] Figure 2 This is a schematic diagram of the planar configuration of an automated burn-in test device in one embodiment of the present application;

[0024] Figure 3 A vertical configuration diagram of an automated burn-in test device in one embodiment of the present application;

[0025] Figure 4 This is an enlarged schematic diagram of a test module of an automated burn-in test device in one embodiment of the present application;

[0026] Figure 5 This is a planar configuration diagram illustrating the operation of an automated burn-in test device in one embodiment of the present application.

[0027] Description of Figure Numbers:

[0028] 11: pre-burning plate; 12: lifting mechanism; 13: buckling mechanism; 14: conveyor belt; 15: control computer; 16: metal carrier plate;

[0029] 20: loading area; 21: loading storage area; 211: lifting mechanism; 22: loading exchange area; 23: loading and handling module; 24: empty tray storage area; 25: wafer pick-up and placement module;

[0030] 30: unloading area; 31: unloading storage area; 311: lifting mechanism; 32: unloading exchange area; 33: unloading transport module; 34: good product storage area; 35: bad area storage area; 36: unloading wafer pick-up and placement module;

[0031] 40: test unit; 41: shelf; 411: platform; 412: test area; 42: test module; 421: needle test seat; 4211: test circuit board; 422: heating seat; 423: lifting mechanism;

[0032] 50: loading and unloading area; 51: mechanical arm; 52: moving mechanism; 53: track group;

[0033] 60: carrier tray; 61: carrier tray for good products; 62: carrier tray for defective products. DETAILED DESCRIPTION

[0034] The present invention will be described in detail below in conjunction with the various embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0035] like Figure 2 As shown, a planar configuration diagram of an automated burn-in test device in one embodiment of the present invention. An embodiment of the present invention provides an automated burn-in test device comprising: a loading area 20, a unloading area 30, a plurality of test units 40, and an in-and-out material transfer area 50. The loading area 20 is provided with a carrier 60 carrying the wafer to be tested. The unloading area 30 collects the carrier 60 carrying the tested wafer. A plurality of test units 40 are arranged side by side between the loading area 20 and the unloading area 30. The mechanism in the in-and-out material transfer area 50 is responsible for moving the carrier 60 from the loading area 20 to the test unit 40, or from the test unit 40 to the unloading area 30. As shown in FIG. Figure 3 The figure shows a longitudinal configuration diagram of an automated burn-in test device in one embodiment of the present invention, wherein the test unit 40 is designed as a three-dimensional multi-layer test environment, which can improve the test volume and efficiency.

[0036] Next, we will give a detailed description of each component. Please refer to Figure 2 and Figure 3 :

[0037] The loading area 20 is used for placing a carrier 60 carrying a plurality of wafers to be tested. The loading area 20 includes: at least one loading storage area 21, a loading exchange area 22, and a loading transport module 23. The carrier 60 carrying the wafers to be tested can be stacked in the loading storage area 21. In this embodiment, there are two loading storage areas 11, which are respectively located on both sides of the loading exchange area 22. The loading storage area 21 is provided with a lifting mechanism 211, which can maintain the height of one of the carriers 60 flush with the loading exchange area 22. The loading transport module 23 is used to move the carrier 60 from the loading storage area 21 to the loading exchange area 22. The loading transport module 23 can be a push rod or a slide rail mechanism to facilitate the movement of the carrier 60.

[0038] During long-term operation, the test unit 40 may partially test the probe holder 421 of the module 42 (please refer to Figure 4 ) internal test site (Site) failure, so before the test operation, the wafer to be tested at the relative position on the carrier 60 must be taken out in advance to avoid unnecessary pre-burning and testing operations. Therefore, the loading area 20 of this embodiment also includes at least one empty tray storage area 24 and a wafer pick-up and placement module 25. In this embodiment, there are two empty tray storage areas 24. The empty tray storage area 24 can be used to place at least one empty carrier 60. The wafer pick-up and placement module 25 is a set of mechanical pick-up and placement arms that can move horizontally (XY axis). When the carrier 60 carrying the wafer to be tested moves to the loading exchange area 22, the controller inside the automatic pre-burning test equipment starts the wafer pick-up and placement module 25 based on the specific position that cannot be tested. Then, the wafer to be tested at the specific position on the carrier 60 in the loading exchange area 22 is taken out, and it is moved to the empty carrier 60 in the empty tray storage area 24, so that the carrier 60 in the loading exchange area 22 carries the correct number and position of wafers to be tested.

[0039] The unloading area 30 is used to collect the carrier 60 carrying the tested wafers. The unloading area 30 at least includes: at least one unloading storage area 31, an unloading exchange area 32, and an unloading transport module 33. The carrier 60 carrying the tested wafers is first placed in the unloading exchange area 32, and then the unloading transport module 33 moves the carrier 60 from the unloading exchange area 32 to the unloading storage area 31 for storage and collection. The unloading storage area 31 has a lifting mechanism 311, so that the carriers 60 moved to this area can be stacked in sequence. The unloading transport module 33 can be a push rod or a slide rail mechanism to facilitate the movement of the carrier 60.

[0040] In addition, the present invention is to ensure that all the chips on the carrier 60 in the unloading storage area 31 are good products. The unloading area 30 also includes at least one good product storage area 34, at least one bad product storage area 35 and an unloading chip pick-up and placement module 36. The good product storage area 34 is provided with at least one good product carrier 61, and the good product carrier 61 can be filled with good product chips in advance. The bad product storage area 35 is provided with at least one bad product carrier 62, and the bad product carrier 62 can be an empty carrier. The unloading chip pick-up and placement module 36 is a mechanical pick-up and placement arm that can move horizontally. The unloading chip pick-up and placement module 36 can move the bad product chips on the carrier 60 in the unloading exchange area 32 to the bad product carrier 62 according to the chip test results, and move the good product chips on the good product carrier 61 to the empty space on the carrier 60 in the unloading exchange area 32, or fill the empty space. Afterwards, the carrier 60 is moved to the material storage area 31 through the material unloading and conveying module 33 for stacking and collection.

[0041] A plurality of test units 40 are arranged side by side between the loading area 20 and the unloading area 30. The number of test units 40 arranged between the loading area 20 and the unloading area 30 can be increased or decreased according to demand to achieve the most efficient production configuration. The test unit 40 includes: at least one shelf 41, which is composed of a plurality of platforms 411 of different heights to form a plurality of test areas 412; a plurality of test modules 42, which are respectively arranged in the test areas 412 of corresponding heights, and the test modules 42 perform preheating and testing operations.

[0042] The test module 42 is a device that can perform preheating and testing operations. Different methods can be designed according to the needs of manufacturers. The present invention only describes one method and does not limit the use of only this method. Figure 4 As shown, the test module 42 includes a needle test seat 421, a heating seat 422 and a lifting mechanism 423. A plurality of test circuit boards 4211 are installed on the top of the needle test seat 421, and a plurality of probe groups (not shown in the figure) are provided on the bottom. Each probe group corresponds to a wafer to be tested, and is used to contact and test the wafer to be tested. The heating seat 422 can be driven by the lifting mechanism 423 to rise. After the carrier 60 carrying the wafer to be tested is moved in, it is placed on the heating seat 422. The heating seat 422 can be preheated to a temperature higher than the test temperature before testing, so that when the carrier 60 contacts the heating seat 422, the heating time for the internal wafer to be tested to rise to the test temperature can be shortened, which also helps to improve the test efficiency. The operating mode of the test module 42 is: when the carrier 60 is placed on the heating seat 422, it will be heated synchronously, and the rising mechanism 423 will also be activated synchronously. When it rises to the highest point, the chip to be tested in the carrier 60 will contact the needle test seat 421, and the relevant electrical test operations will be performed when the predetermined temperature is reached.

[0043] The loading and unloading transfer area 50 connects the loading area 20, the unloading area 30 and a plurality of test units 40. The loading and unloading transfer area 50 includes: a robot arm 51, a moving mechanism 52 and a track group 53. The track group 53 is composed of a plurality of tracks connected in series, and the length corresponds to the number of test units 40, for the moving mechanism 52 to move on the track group 53. The moving mechanism 52 is responsible for carrying the robot arm 51 to move to a predetermined position, and the predetermined position includes: adjacent to the loading area 20, each test unit 40 or adjacent to the unloading area 30. The robot arm 51 is an automated robot arm that can rotate and move in three axes. The robot arm 51 can take the carrier 60 from the loading exchange area 22 of the loading area 20, move it to the test unit 40 at the corresponding position by the moving mechanism 52, and then turn to put it into the test area 412 of the corresponding height, and then the test module 42 performs preheating and testing operations. While waiting for the test results, the robot arm 51 is driven by the moving mechanism 52 to move again, taking the carrier 60 and moving it to a different test area 412, thereby improving the test efficiency. After the test is completed, the robot arm 51 takes the carrier 60 out of the test area 212, and is driven by the moving mechanism 52 to the unloading area 30, and the carrier 60 is placed in the unloading exchange area 33.

[0044] In this embodiment, in order to increase the number and efficiency of tests, the test unit 40 can be provided with two sets of shelves 41, which are respectively located on both sides of the loading and unloading transfer area 50, thereby increasing the overall test volume, and the multi-layer structure can further reduce the area occupied by the overall equipment. In addition, when the number of test units 40 set between the loading area 20 and the unloading area 30 is increased or decreased according to demand, the length of the track set 53 set in the loading and unloading transfer area 50 will also increase or decrease synchronously to meet actual needs.

[0045] Next, the operation flow of the automatic burn-in test equipment in this embodiment is described: Figure 3 and Figure 5 As shown:

[0046] The operation mode in the loading area 20 is as follows: the carrier 60 carrying the wafers to be tested is stacked in the loading storage area 21, and then moved to the loading exchange area 22 by the loading transfer module 23. The abnormal site data of each site (Site) of the probe seat 421 of the test module 42 in the test unit 40 that cannot perform the test operation and the position data of the wafer to be tested at a specific position on the carrier 60 corresponding to the abnormal site will be returned to the internal controller, and the wafer pick-up and placement module 25 will first take out the wafer to be tested according to the position data of the wafer to be tested at a specific position on the carrier 60 corresponding to the abnormal site, and move it to the empty carrier 60 in the empty tray storage area 24, so that the carrier 60 in the loading exchange area 22 carries the correct number and position of the wafers to be tested. Once the carrier 60 is taken away for testing, the loading area 20 will cycle the above mode and provide the next carrier 60 carrying the wafer to be tested in the loading exchange area 22.

[0047] The operation mode in the unloading and transferring area 50 is as follows: the moving mechanism 52 continuously moves on the track set 53, and the robot arm 51 moves the carrier 60 from the loading exchange area 22 to the test area 412 of the test unit 40 at the corresponding position for testing. Or the tested carrier 60 is moved from the test area 412 to the unloading exchange area 32. With such a design, during the long time of the single wafer heating test, the operation of the multi-layer three-dimensional multiple test areas 412 and the robot arm 51 is coordinated to complete the movement of multiple groups of carriers 60, thereby improving the test efficiency.

[0048] The operating mode of the test unit 40 is as follows: the heating seat 422 can be preheated to a temperature higher than the test temperature before the test. When the robot arm 51 places the carrier 60 on the heating seat 422, the heating time for the internal wafer to be tested to reach the test temperature can be shortened, which helps to shorten the test time. After that, the lifting mechanism 423 rises, allowing the wafer to be tested in the carrier 60 to contact the needle test seat 421. When the predetermined temperature is reached, the relevant test operation can be carried out.

[0049] The operation mode of the unloading area 30 is as follows: when the robot arm 51 places the carrier 60 carrying the tested wafers in the unloading exchange area 32, the wafer pick-up and placement module 36 can move the defective wafers on the carrier 60 in the unloading exchange area 32 to the defective carrier 62 according to the test results, and then move the good wafers on the good carrier 61 to fill the empty spaces on the carrier 60 in the unloading exchange area 32. After that, the carrier 60 is moved to the unloading storage area 31 by the unloading transport module 33 for stacking and collection, and the efficiency is improved by using the automated operation mode.

[0050] In summary, the automated burn-in test equipment of the present invention comprises a test unit 40 and a platform 411 of different heights on a shelf 41 to form a three-dimensional multi-layer test area 412. While a single carrier 60 is undergoing pre-burning, heating, and waiting for testing, other carriers 60 carrying wafers to be tested or that have completed testing can be simultaneously transferred, thereby improving the overall test efficiency, increasing the test volume, and also increasing profits. The equipment can also reduce the overall area occupied, reduce the investment cost of plant equipment, and increase market competitiveness.

[0051] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0052] In addition, it should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that those skilled in the art can understand.

Claims

1. An automated burn-in test device, characterized in that: include: A loading area for placing a carrier carrying a wafer to be tested; A material unloading area, where the trays carrying the tested wafers are collected; A plurality of test units are arranged side by side between the loading area and the unloading area, and the test units include: at least one shelf, which is composed of a plurality of platforms of different heights to form a plurality of test areas; a plurality of test modules are respectively arranged in the test areas at corresponding heights, and the test modules can perform preheating and testing operations. The test modules include a needle test seat, a heating seat and a lifting mechanism. A plurality of test circuit boards are installed on the top of the needle test seat, and a plurality of probe groups are arranged on the bottom. Each probe group corresponds to a wafer to be tested, which is used to contact and test the wafer to be tested. The heating seat is driven by the lifting mechanism to rise, and is heated synchronously when the carrier is placed on the heating seat. The lifting mechanism is also actuated synchronously. When it rises to the highest point, the wafer to be tested in the carrier will contact the needle test seat, and relevant electrical testing operations will be performed when the predetermined temperature is reached; and a loading and unloading transfer area, connecting the loading area, the unloading area and the plurality of test units, the loading and unloading transfer area comprising: a robot arm, a moving mechanism, and a track group, the moving mechanism carrying the robot arm moves the robot arm to a predetermined position on the track group, and the robot arm moves the carrier from the loading area to the test area, or from the test area to the unloading area; The loading area includes: at least one loading storage area, a loading exchange area and a loading transfer module, the carrier is stacked in the loading storage area, and the loading transfer module moves the carrier from the loading storage area to the loading exchange area. The robot arm moves the carrier from the loading and exchanging area to the testing area. The loading area also includes at least one empty tray storage area and a chip placement module. The empty tray storage area is provided with at least one empty carrier tray. The chip placement module is used to take out the wafer to be tested at a specific position on the carrier tray in the loading exchange area and transfer it to the empty carrier tray.

2. The automated burn-in test equipment according to claim 1, characterized in that: The testing unit is provided with two shelves, and the two shelves are respectively arranged at two opposite sides of the material inlet and outlet transfer area.

3. The automated burn-in test equipment according to claim 1, characterized in that: The number of the testing units disposed between the loading area and the unloading area can be increased or decreased according to demand.

4. The automated burn-in test equipment according to claim 1, characterized in that: The material unloading area includes: at least one material unloading storage area, a material unloading exchange area and a material unloading transport module, and the material unloading transport module moves the carrier from the material unloading exchange area to the material unloading storage area for storage.

5. The automated burn-in test equipment according to claim 4, characterized in that: The unloading area also includes at least one good product storage area, at least one defective area storage area and an unloading chip placement module. The good product storage area is used to place at least one good product carrier; the defective area storage area is used to place at least one defective carrier; the unloading chip placement module moves the defective chips on the carrier in the unloading exchange area to the defective carrier, and moves the good chips on the good product carrier to the empty position on the carrier in the unloading exchange area.

6. The automated burn-in test equipment according to claim 5, characterized in that: The robot arm moves the carrier from the testing area to the material exchange area.

Images