Packaged antenna module and preparation method thereof

Abstract

The present invention provides a packaged antenna module and a preparation method thereof, wherein the packaged antenna module comprises a rewiring layer, an antenna structure, a semiconductor chip, a third packaging layer and a packaged antenna connector, wherein the antenna structure comprises a connector window and at least a first antenna structure and a second antenna structure stacked on a second surface of the rewiring layer, and the packaged antenna connector is located in the connector window and electrically connected to the rewiring layer. The present invention reduces signal loss by electrically leading out the packaged antenna connector located in the connector window, and does not require the preparation of metal bumps electrically connected to the rewiring layer, and does not require the use of a flip chip process for electrical connection, thereby improving the flexibility of the packaged antenna module position layout, and further improving the overall competitive advantage of WLP AiP.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and relates to a packaged antenna module and a preparation method thereof. Background Art

[0002] With the popularization of high-tech electronic products, especially in order to meet the needs of mobility, most high-tech electronic products have added wireless communication functions.

[0003] Antenna in Package (AiP) is a technology that integrates antenna and chip in the package based on packaging materials and processes to achieve system-level wireless functions. Its advantages are: simplified system design, product miniaturization, and low cost. AiP technology conforms to the trend of increasing integration of silicon-based semiconductor processes and provides good antenna and packaging solutions for system-level wireless chips. With the rapid development of communication information, AiP technology has become a must-have technology for 5G (5th Generation) communications and automotive radar chips, so AiP technology has received widespread attention.

[0004] In traditional AiP modules, the antenna is usually made directly on the circuit board, and the connector is used as the antenna to interconnect with the outside world. One side of the circuit board serves as the antenna radiation surface, while the other side is connected to the encapsulated chip and the motherboard. This method has low feasibility for partially encapsulating chips, is not suitable for modularization and connector connection, and will cause the antenna to occupy additional circuit board area, resulting in poor integration. For various high-tech electronic products, if the antenna is made directly on the surface of the circuit board, a larger circuit board will be required, which will cause the high-tech electronic product to occupy a larger volume, which is contrary to people's demand for miniaturization and convenience of high-tech electronic products.

[0005] Wafer-level package antenna (WLP AiP) uses the whole wafer as the workpiece, and makes the antenna on the plastic layer. Compared with the traditional AiP module, it has higher precision and is thinner and smaller in size, so it has been widely used. However, the current WLP AiP does not have the support of the core layer, and the redistribution layer (RDL) is thin, so it is difficult to use the front and back sides of the RDL to directly interconnect with other devices at the same time. Therefore, the WLP AiP still needs to be interconnected with the outside world through the motherboard, which makes the signal loss of the package antenna higher. When interconnecting with the motherboard, the metal bumps of the WLP AiP need to be soldered to the motherboard through the flip chip process, which limits the flexibility of the package antenna position layout.

[0006] In view of this, it is necessary to design a new packaged antenna module and its preparation method so that WLP AiP can be directly interconnected with the outside world without going through the motherboard, so as to reduce the signal loss of the packaged antenna, improve the flexibility of the packaged antenna position layout, and further enhance the overall competitive advantage of WLP AiP. Summary of the invention

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a packaged antenna module and a preparation method thereof, which is used to solve the problems of packaged antenna signal loss and position layout limitations caused by the packaged antenna being interconnected with the outside world through a motherboard in the prior art.

[0008] To achieve the above object and other related objects, the present invention provides a method for preparing a packaged antenna module, comprising the following steps:

[0009] A packaged antenna structure is provided, the packaged antenna structure comprising: a rewiring layer, the rewiring layer comprising a first surface and a second surface arranged opposite to each other; an antenna structure, the antenna structure comprising at least a first antenna structure and a second antenna structure stacked and arranged on the second surface of the rewiring layer; the first antenna structure comprising a first antenna feed line, a first antenna metal layer and a first packaging layer, the first end of the first antenna feed line is electrically connected to the rewiring layer, the first packaging layer covers the second surface of the rewiring layer and the first antenna feed line and exposes the second end of the first antenna feed line, the first antenna metal layer is located on the first packaging layer and is electrically connected to the second end of the first antenna feed line; the second antenna structure comprising a second packaging layer and a second antenna metal layer, the second packaging layer covers the first antenna metal layer and the first packaging layer, and the second antenna metal layer is located on the second packaging layer; a semiconductor chip, the semiconductor chip is located on the first surface of the rewiring layer and is electrically connected to the rewiring layer; a third packaging layer, the third packaging layer covers the semiconductor chip and the first surface of the rewiring layer;

[0010] forming a connector window in the antenna structure;

[0011] A package antenna connector is formed in the connector window, and the package antenna connector is electrically connected to the rewiring layer.

[0012] Optionally, the packaged antenna connector matches a circuit board connector located on a circuit board, and the electrical connection between the packaged antenna connector and the circuit board connector is achieved; the circuit board includes one or a combination of a flexible circuit board and a rigid circuit board.

[0013] Optionally, the first antenna structure also includes a metal column and a metal connector, the first end of the metal column is electrically connected to the rewiring layer, the first packaging layer covers the metal column and exposes the second end of the metal column, the metal connector is located on the first packaging layer and is electrically connected to the second end of the metal column; the bottom of the connector window exposes the metal connector, and the packaged antenna connector is electrically connected to the metal connector so as to be electrically connected to the rewiring layer through the metal connector and the metal column.

[0014] Optionally, the bottom of the connector window exposes the metal wiring of the rewiring layer, and the packaged antenna connector is electrically connected to the metal wiring.

[0015] Optionally, a dielectric layer is further included between the first antenna structure and the second antenna structure.

[0016] Optionally, the second antenna structure further includes a second antenna feeder located between the second antenna metal layer and the first antenna metal layer, and the second antenna metal layer is connected to the first antenna metal layer via the second antenna feeder.

[0017] Optionally, the method of forming the packaged antenna connector in the connector window includes one or a combination of reflow soldering and laser welding.

[0018] Optionally, a method for forming the first antenna feed line includes one or a combination of wire bonding, electroplating and chemical plating, and a material of the first antenna feed line includes one or a combination of copper, gold, silver and aluminum.

[0019] Optionally, the method of forming the connector window includes one or a combination of dry etching and wet etching.

[0020] Optionally, the semiconductor chip includes one or a combination of active components and passive components; the active component may include one or a combination of a transceiver chip and a power management chip; the passive component may include one or a combination of a resistor, a capacitor and an inductor.

[0021] Optionally, the packaged antenna module includes one or a combination of a GPS antenna, an FM headphone jack antenna, a WIFI antenna, a BT antenna, a diversity antenna and a main antenna.

[0022] The present invention also provides a packaged antenna module, the packaged antenna module comprising:

[0023] A rewiring layer, the rewiring layer comprising a first surface and a second surface arranged opposite to each other;

[0024] An antenna structure, the antenna structure comprising a connector window and at least a first antenna structure and a second antenna structure stacked and arranged on a second surface of the rewiring layer, wherein the first antenna structure comprises a first antenna feed line, a first antenna metal layer and a first packaging layer, a first end of the first antenna feed line is electrically connected to the rewiring layer, the first packaging layer covers the first antenna feed line and exposes the second end of the first antenna feed line, the first antenna metal layer is located on the first packaging layer and is electrically connected to the second end of the first antenna feed line; the second antenna structure comprises a second packaging layer and a second antenna metal layer, the second packaging layer covers the first antenna metal layer, and the second antenna metal layer is located on the second packaging layer;

[0025] a semiconductor chip, the semiconductor chip being located on the first surface of the rewiring layer and being electrically connected to the rewiring layer;

[0026] a third packaging layer, the third packaging layer covering the semiconductor chip and the first surface of the rewiring layer;

[0027] A packaged antenna connector is located in the connector window and is electrically connected to the rewiring layer.

[0028] Optionally, the packaged antenna connector matches a circuit board connector located on a circuit board, and the circuit board connector is electrically connected via the packaged antenna connector; the circuit board includes one or a combination of a flexible circuit board and a rigid circuit board.

[0029] Optionally, the first antenna structure also includes a metal column and a metal connector, the first end of the metal column is electrically connected to the rewiring layer, the first packaging layer covers the second surface of the rewiring layer and the metal column and exposes the second end of the metal column, the metal connector is located on the first packaging layer and is electrically connected to the second end of the metal column; the bottom of the connector window exposes the metal connector, and the packaged antenna connector is electrically connected to the metal connector so as to be electrically connected to the rewiring layer through the metal connector and the metal column.

[0030] Optionally, the bottom of the connector window exposes the metal wiring of the rewiring layer, and the packaged antenna connector is electrically connected to the metal wiring.

[0031] Optionally, a dielectric layer is further included between the first antenna structure and the second antenna structure.

[0032] Optionally, the second antenna structure further includes a second antenna feeder located between the second antenna metal layer and the first antenna metal layer, and the second antenna metal layer is connected to the first antenna metal layer via the second antenna feeder.

[0033] Optionally, the first antenna feed line includes one or a combination of a copper feed line, a gold feed line, a silver feed line and an aluminum feed line.

[0034] Optionally, the semiconductor chip includes one or a combination of active components and passive components; the active component may include one or a combination of a transceiver chip and a power management chip; the passive component may include one or a combination of a resistor, a capacitor and an inductor.

[0035] Optionally, the packaged antenna module includes one or a combination of a GPS antenna, an FM headphone jack antenna, a WIFI antenna, a BT antenna, a diversity antenna and a main antenna.

[0036] As described above, the packaged antenna module and preparation method of the present invention electrically connect the packaged antenna connector located in the connector window to the rewiring layer through the connector window, and electrically lead out through the packaged antenna connector, so that the packaged antenna module can be directly interconnected with the outside world, thereby reducing signal loss. In addition, the present invention does not need to prepare metal bumps electrically connected to the rewiring layer, and does not need to use a flip-chip process for electrical connection, thereby improving the flexibility of the position layout of the packaged antenna module and further improving the overall competitive advantage of WLP AiP. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 Shown is a process flow chart for preparing the packaged antenna module of the present invention.

[0038] Figure 2 to Figure 8 It is a schematic diagram showing the structure of each step of preparing the packaged antenna module in the first embodiment, wherein: Figure 8 Shown is a schematic structural diagram of the packaged antenna module in Example 1.

[0039] Fig. 9 It is a schematic diagram of the structure of interconnecting the packaged antenna module and the circuit board in the first embodiment.

[0040] Fig.10 and Fig.11 It is a schematic diagram showing the structure of the antenna package module prepared in the second embodiment, wherein: Fig.11 Shown is a schematic structural diagram of the packaged antenna module in the second embodiment.

[0041] Fig.12 It is a schematic diagram of the structure of the interconnection between the packaged antenna module and the circuit board in the second embodiment.

[0042] Component number description

[0043] 101 Support base

[0044] 102 Separation Layer

[0045] 103, 203 Rewiring Layer

[0046] 113, 213 Wiring medium

[0047] 123, 223 Metal wiring

[0048] 104, 204 first antenna structure

[0049] 1141, 214 first antenna feeder

[0050] 1142 Metal Column

[0051] 124, 224 First packaging layer

[0052] 1341, 234 first antenna metal layer

[0053] 1342 Metal connectors

[0054] 105, 205 dielectric layer

[0055] 106, 206 second antenna structure

[0056] 116, 216 Second packaging layer

[0057] 126, 226 Second antenna metal layer

[0058] 107, 207 semiconductor chips

[0059] 108, 208 Third packaging layer

[0060] 109, 209 Connector Window

[0061] 110, 210 connectors

[0062] 111, 211 package antenna connector

[0063] 112, 212 circuit board connector

[0064] 120, 220 circuit boards DETAILED DESCRIPTION

[0065] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0066] It should be noted that the illustrations provided in the embodiments are only used to schematically illustrate the basic concept of the present invention. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0067] Embodiment 1

[0068] like Figure 8 The present embodiment provides a packaged antenna module, which includes a rewiring layer 103, an antenna structure, a semiconductor chip 107, a third packaging layer 108 and a packaged antenna connector 111. The rewiring layer 103 includes a first surface and a second surface that are arranged opposite to each other; the antenna structure includes a connector window 109 and at least a first antenna structure 104 and a second antenna structure 106 that are stacked and arranged on the second surface of the rewiring layer 103; the first antenna structure 104 includes a first antenna feed line 1141, a first antenna metal layer 1341 and a first packaging layer 124; a first end of the first antenna feed line 1141 is electrically connected to the rewiring layer 103; the first packaging layer 124 covers the first antenna feed line 1141 and exposes the second end of the first antenna feed line 1141; the first antenna metal layer 1341 is located in the first packaging layer 124. The second antenna structure 106 includes a second packaging layer 116 and a second antenna metal layer 126, the second packaging layer 116 covers the first antenna metal layer 1341, and the second antenna metal layer 126 is located on the second packaging layer 116; the semiconductor chip 107 is located on the first surface of the rewiring layer 103 and is electrically connected to the rewiring layer 103; the third packaging layer 108 covers the semiconductor chip 107 and the first surface of the rewiring layer 103; the packaged antenna connector 111 is located in the connector window 109 and is electrically connected to the rewiring layer 103.

[0069] The packaged antenna module of the present embodiment electrically connects the packaged antenna connector located in the connector window to the rewiring layer through the connector window, and electrically leads out through the packaged antenna connector, so that the packaged antenna module can be directly interconnected with the outside world, thereby reducing signal loss. In addition, the present embodiment does not need to prepare metal bumps electrically connected to the rewiring layer, and does not need to use a flip-chip process for electrical connection, thereby increasing the flexibility of the packaged antenna module position layout and further improving the overall competitive advantage of WLP AiP.

[0070] like Figure 1This embodiment provides a method for preparing the packaged antenna module, but the method for preparing the packaged antenna module is not limited thereto.

[0071] Specifically, Figure 2 to Figure 8 , which illustrates the structural schematic diagram presented in each step of preparing the packaged antenna module in this embodiment.

[0072] First, a packaged antenna structure is provided, wherein, as Figure 2 to Figure 6 , illustrates a structural schematic diagram presented in each step of preparing the packaged antenna structure in this embodiment, but the preparation method of the packaged antenna structure is not limited to this.

[0073] like Figure 2 First, a supporting substrate 101 is provided, and a separation layer 102 is formed on the supporting substrate 101 .

[0074] Specifically, the support substrate 101 may include one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate; the separation layer 102 may include a polymer layer whose viscosity decreases under heating or light irradiation conditions, and the polymer layer may include an LTHC light-to-heat conversion layer. Since the glass substrate has a low cost, it is easy to form the separation layer 102 on its surface, and it can reduce the difficulty of the subsequent stripping process, so in this embodiment, the support substrate 101 is preferably a glass substrate; the separation layer 102 is preferably coated on the surface of the support substrate 101 by a spin coating process, and the LTHC light-to-heat conversion layer is cured by an ultraviolet curing or thermal curing process, so that in the subsequent stripping process, the LTHC light-to-heat conversion layer can be heated based on a laser to separate the support substrate 101 from the LTHC light-to-heat conversion layer.

[0075] like Figure 3 , the rewiring layer 103 is formed on the separation layer 102, and the rewiring layer 103 includes a first surface in contact with the separation layer 102 and a second surface opposite to the separation layer 102.

[0076] Specifically, the rewiring layer 103 includes a wiring medium 113 and a metal wiring 123. The material of the wiring medium 113 may include one or a combination of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass and fluorine-containing glass; the material of the metal wiring 123 may include one or a combination of copper, aluminum, nickel, gold, silver and titanium. The method of making the wiring medium 113 may include one or a combination of physical vapor deposition and chemical vapor deposition, and the method of making the metal wiring 123 may include one or a combination of physical vapor deposition, chemical vapor deposition, electroplating process or chemical plating process. The specific materials, number of layers and distribution morphology of the wiring medium 113 and the metal wiring 123 can be selected according to specific needs and are not limited here.

[0077] like Figure 4 , forming the first antenna structure 104 on the second surface of the rewiring layer 103 .

[0078] As an example, the first antenna structure 104 may also include a metal pillar 1142 and a metal connector 1342, wherein the first end of the metal pillar 1142 is electrically connected to the rewiring layer 103, the first packaging layer 124 covers the second surface of the rewiring layer 103 and the metal pillar 1142 and exposes the second end of the metal pillar 1142, and the metal connector 1342 is located on the first packaging layer 124 and is electrically connected to the second end of the metal pillar 1142.

[0079] Specifically, in this embodiment, the metal connector 1342 is exposed at the bottom of the connector window 109 , and the packaged antenna connector 111 is electrically connected to the metal connector 1342 , so as to be electrically connected to the rewiring layer 103 through the metal connector 1342 and the metal column 1142 .

[0080] The step of forming the first antenna structure 104 may include:

[0081] The first antenna feed line 1141 and the metal column 1142 are formed on the second surface of the rewiring layer 103, and the first end of the first antenna feed line 1141 and the first end of the metal column 1142 are both electrically connected to the rewiring layer 103;

[0082] A first packaging layer 124 is formed on the second surface of the re-distribution layer 103, wherein the first packaging layer 124 covers the second surface of the re-distribution layer 103, the first antenna feed line 1141 and the metal column 1142 and exposes the second end of the first antenna feed line 1141 and the second end of the metal column 1142;

[0083] The first antenna metal layer 1341 and the metal connector 1342 are formed on the first packaging layer 124 . The first antenna metal layer 1341 is electrically connected to the second end of the first antenna feed line 1141 , and the metal connector 1342 is electrically connected to the second end of the metal column 1142 .

[0084] As an example, the method of forming the first antenna feed line 1141 may include one or a combination of wire bonding, electroplating and chemical plating, and the material of the first antenna feed line 1141 may include one or a combination of copper, gold, silver and aluminum; the method of forming the metal column 1142 may include one or a combination of wire bonding, electroplating and chemical plating, and the material of the metal column 1142 may include one or a combination of copper, gold, silver and aluminum.

[0085] Specifically, it is preferred that the first antenna feed line 1141 and the metal column 1142 are made of the same material; the first antenna metal layer 1341 and the metal connector 1342 are made of the same material, so that the first antenna feed line 1141 and the metal column 1142 can be formed in the same process, and the first antenna metal layer 1341 and the metal connector 1342 can be formed in the same process, so as to improve production efficiency and reduce production costs.

[0086] As an example, the material of the first encapsulation layer 124 may include one of polyimide, silicone and epoxy resin. The method of forming the first encapsulation layer 124 may include one of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating. After forming the first encapsulation layer 124, a chemical mechanical polishing method may be used to act on the upper surface of the first encapsulation layer 124 to provide a flat first encapsulation layer 124, thereby further improving product quality.

[0087] As an example, a method of forming the first antenna metal layer 1341 and the metal connector 1342 may include one or a combination of physical vapor deposition, chemical vapor deposition, electroplating or chemical plating.

[0088] Specifically, a metal layer may be formed on the surface of the first packaging layer 124 by physical vapor deposition or chemical vapor deposition, and then an etching process may be used to form the first antenna metal layer 1341 and the metal connector 1342 of the required pattern. Of course, the first antenna metal layer 1341 and the metal connector 1342 may also be formed by an electroplating process or a chemical plating process, such as first forming a metal seed layer on the surface of the first packaging layer 124, then forming a patterned photoresist, and then forming the first antenna metal layer 1341 and the metal connector 1342 by an electroplating process, and finally removing the photoresist and the excess metal seed layer.

[0089] As an example, a dielectric layer 105 may be further included between the first antenna structure 104 and the second antenna structure 106 formed subsequently.

[0090] like Figure 4 The dielectric layer 105 covers the first packaging layer 124, the first antenna metal layer 1341 and the metal connector 1342. The dielectric layer 105 can further improve the bonding force between the first packaging layer 124 and the second packaging layer 116, thereby improving the stability of the package antenna structure. The dielectric layer 105 can be formed by the same material and preparation method as the first packaging layer 124 and the second packaging layer 116, so as to reduce the process complexity and improve the bonding performance between the first packaging layer 124 and the second packaging layer 116.

[0091] like Figure 5 , forming the second antenna structure 106.

[0092] Specifically, the second antenna structure 106 includes the second packaging layer 116 and the second antenna metal layer 126, the second packaging layer 116 covers the dielectric layer 105, and the second antenna metal layer 126 is located on the second packaging layer 116. The preparation method and material selection of the second antenna structure 106 can be the same as the first antenna structure 104, which will not be repeated here. Preferably, the second packaging layer 116, the dielectric layer 105 and the first packaging layer 124 are made of the same material to improve the stability of the structure.

[0093] As an example, the second antenna metal layer 126 has a window in the vertical area of ​​the metal connector 1342 to avoid the second antenna metal layer 126 from blocking the metal connector 1342, so as to further reduce the process difficulty and cost when the second packaging layer 116 is subsequently removed to reveal the metal connector 1342.

[0094] As an example, the second antenna structure 106 may also include a second antenna feed line (not shown) located between the second antenna metal layer 126 and the first antenna metal layer 1341 to connect the second antenna metal layer 126 and the first antenna metal layer 1341 to further reduce the signal loss of the packaged antenna structure.

[0095] As an example, the second surface of the rewiring layer 103 may include N layers of antenna structures stacked together, where N≥2, so as to further improve the integration and integration performance of the packaged antenna structure.

[0096] Specifically, in this embodiment, N is 2, including the first antenna structure 104 and the second antenna structure 106 that are stacked. In another embodiment, N can also be 3, 4, 5, etc., to further improve the integration and integration performance of the packaged antenna structure. The specific value of N is not limited here.

[0097] like Figure 6 , remove the separation layer 102 and the supporting substrate 101 to expose the first surface of the rewiring layer 103 ; and form the semiconductor chip 107 and the third packaging layer 108 on the first surface of the rewiring layer 103 .

[0098] Specifically, the third packaging layer 108 can protect the rewiring layer 103 and the semiconductor chip 107, and the third packaging layer 108 can also be used as a supporting layer to improve the stability of the structure. The material and preparation method of the third packaging layer 108 can be the same as the first packaging layer 124, which will not be repeated here.

[0099] As an example, the semiconductor chip 107 may include one or a combination of active components and passive components; the active components may include one or a combination of a transceiver chip and a power management chip; the passive components may include one or a combination of resistors, capacitors and inductors.

[0100] Then, if Figure 7 , forming the connector window 109 in the antenna structure.

[0101] Specifically, in this embodiment, a portion of the second packaging layer 116 and the dielectric layer 105 is removed to expose the metal connector 1342. The method of removing the second packaging layer 116 and the dielectric layer 105 may include dry etching and wet etching or a combination thereof.

[0102] Then, if Figure 8 , the packaged antenna connector 111 is formed in the connector window 109, and the packaged antenna connector 111 is electrically connected to the rewiring layer 103 to prepare the packaged antenna module.

[0103] As an example, a method of forming the package antenna connector 111 in the connector window 109 may include one or a combination of reflow soldering and laser soldering.

[0104] Specifically, the type and kind of the packaged antenna connector 111 are not limited here. In this embodiment, the packaged antenna connector 111 is electrically connected to the metal connector 1342 by reflow soldering, and the packaged antenna connector 111 is electrically connected to the rewiring layer 103 through the metal connector 1342 and the metal column 1142. After the packaged antenna connector 111 is formed, a cleaning step may be performed to improve cleanliness.

[0105] As an example, the packaged antenna connector 111 matches with a circuit board connector 112 located on a circuit board 120, and the electrical connection between the packaged antenna connector 111 and the circuit board connector 112 is used to realize the electrical connection between the packaged antenna connector 111 and the circuit board connector 112; the circuit board 120 includes one or a combination of a flexible circuit board and a rigid circuit board.

[0106] Specifically, Fig. 9, providing the circuit board 120 and the circuit board connector 112, wherein the circuit board 120 may include one or a combination of a flexible circuit board and a rigid circuit board, the circuit board connector 112 is electrically connected to the circuit board 120, and the circuit board connector 112 matches the package antenna connector 111 to form a connector 110 that can be well electrically connected, thereby achieving interconnection through the connector 110. The first packaging layer 124 can be used as a core layer to provide support.

[0107] As an example, the packaged antenna module may include one or a combination of a GPS antenna, an FM headphone jack antenna, a WIFI antenna, a BT antenna, a diversity antenna and a main antenna.

[0108] Specifically, the packaged antenna module is electrically led out through the packaged antenna connector 111, so that the packaged antenna module can be directly interconnected with the outside world, thereby reducing signal loss, and there is no need to prepare metal bumps electrically connected to the rewiring layer 103, and there is no need to use a flip-chip process for electrical connection. Instead, the packaged antenna connector 111 is directly used as the electrical lead-out terminal, thereby improving the flexibility of the position layout of the packaged antenna module. Therefore, the packaged antenna module can be flexibly used in devices such as mobile phones, computers, smart homes, etc. Taking a mobile phone as an example, the packaged antenna module can include one or a combination of a GPS antenna, an FM headphone jack antenna, a WIFI antenna, a BT antenna, a diversity antenna and a main antenna, and the circuit board 120 can adopt a mobile phone casing.

[0109] Embodiment 2

[0110] like Fig.11 This embodiment provides a structural diagram of a packaged antenna module, and the main difference from the first embodiment is that the position of the connector window in the packaged antenna module is different to expand the selection range of the packaged antenna connector.

[0111] The packaged antenna module includes a rewiring layer 203, an antenna structure, a semiconductor chip 207, a third packaging layer 208 and a packaged antenna connector 211. The rewiring layer 203 includes a first surface and a second surface that are arranged opposite to each other; the antenna structure includes a connector window 209 and at least a first antenna structure 204 and a second antenna structure 206 that are stacked and arranged on the second surface of the rewiring layer 203; the first antenna structure 204 includes a first antenna feed line 214, a first antenna metal layer 234 and a first packaging layer 224; a first end of the first antenna feed line 214 is electrically connected to the rewiring layer 203; the first packaging layer 224 covers the first antenna feed line 214 and exposes the second end of the first antenna feed line 214; the first antenna metal layer 234 is located in the first packaging layer 2 24 and is electrically connected to the second end of the first antenna feed line 214; the second antenna structure 206 includes a second packaging layer 216 and a second antenna metal layer 226, the second packaging layer 216 covers the first antenna metal layer 234, and the second antenna metal layer 226 is located on the second packaging layer 216; the semiconductor chip 207 is located on the first surface of the rewiring layer 203 and is electrically connected to the rewiring layer 203; the third packaging layer 208 covers the semiconductor chip 207 and the first surface of the rewiring layer 203; the packaged antenna connector 211 is located in the connector window 209 and is electrically connected to the rewiring layer 203.

[0112] As an example, the bottom of the connector window 209 exposes the metal wiring 223 of the re-wiring layer 203 , and the package antenna connector 211 is electrically connected to the metal wiring 223 .

[0113] Specifically, the rewiring layer 203 includes a wiring medium 213 and the metal wiring 223. In this embodiment, the bottom of the connector window 209 directly exposes the metal wiring 223 of the rewiring layer 203, and the packaged antenna connector 211 is electrically connected to the metal wiring 223 to be electrically led out through the packaged antenna connector 211, thereby expanding the selection range of the packaged antenna connector 211.

[0114] like Fig.10 and Fig.11 , shows a schematic diagram of the structure of the packaged antenna module prepared in this embodiment, wherein a dielectric layer 205 may be included between the first antenna structure 204 and the second antenna structure 206. The specific structure and preparation method of the packaged antenna module can be found in Embodiment 1, which will not be described here.

[0115] like Fig.12, providing a circuit board 220 and a circuit board connector 212, wherein the circuit board 220 may include one or a combination of a flexible circuit board and a rigid circuit board, the circuit board connector 212 is electrically connected to the circuit board 220, and the circuit board connector 212 matches the packaged antenna connector 211 to form a connector 210 that can be electrically connected, thereby achieving interconnection through the connector 210, and the third packaging layer 208 can serve as a core layer to provide support.

[0116] In summary, the packaged antenna module and preparation method thereof of the present invention electrically connects the packaged antenna connector located in the connector window to the rewiring layer through the connector window, and electrically leads out through the packaged antenna connector, so that the packaged antenna module can be directly interconnected with the outside world, thereby reducing signal loss. In addition, the present invention does not need to prepare metal bumps electrically connected to the rewiring layer, and does not need to adopt a flip-chip process for electrical connection. Instead, the packaged antenna connector is directly used as the electrical lead-out terminal, thereby improving the flexibility of the position layout of the packaged antenna module and further improving the overall competitive advantage of WLP AiP.

[0117] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A method for preparing a packaged antenna module, characterized in that: The following steps are involved: A packaged antenna structure is provided, the packaged antenna structure comprising: a rewiring layer, the rewiring layer comprising a first surface and a second surface arranged opposite to each other; an antenna structure, the antenna structure comprising at least a first antenna structure and a second antenna structure stacked and arranged on the second surface of the rewiring layer; the first antenna structure comprising a first antenna feed line, a first antenna metal layer and a first packaging layer, the first end of the first antenna feed line is electrically connected to the rewiring layer, the first packaging layer covers the second surface of the rewiring layer and the first antenna feed line and exposes the second end of the first antenna feed line, the first antenna metal layer is located on the first packaging layer and is electrically connected to the second end of the first antenna feed line; the second antenna structure comprising a second packaging layer and a second antenna metal layer, the second packaging layer covers the first antenna metal layer and the first packaging layer, and the second antenna metal layer is located on the second packaging layer; a semiconductor chip, the semiconductor chip is located on the first surface of the rewiring layer and is electrically connected to the rewiring layer; a third packaging layer, the third packaging layer covers the semiconductor chip and the first surface of the rewiring layer; forming a connector window in the antenna structure, wherein the connector window penetrates the second antenna structure, or the connector window penetrates the second antenna structure and the first antenna structure; A package antenna connector is formed in the connector window, and the package antenna connector is electrically connected to the rewiring layer.

2. The method for preparing a packaged antenna module according to claim 1, wherein: The packaged antenna connector matches with a circuit board connector on a circuit board, and the electrical connection between the packaged antenna connector and the circuit board connector is used to realize the electrical connection between the packaged antenna structure and the circuit board; the circuit board includes one or a combination of a flexible circuit board and a rigid circuit board.

3. The method for preparing a packaged antenna module according to claim 1, wherein: The first antenna structure also includes a metal column and a metal connector, the first end of the metal column is electrically connected to the rewiring layer, the first packaging layer covers the metal column and exposes the second end of the metal column, the metal connector is located on the first packaging layer and is electrically connected to the second end of the metal column; the bottom of the connector window exposes the metal connector, and the packaged antenna connector is electrically connected to the metal connector to be electrically connected to the rewiring layer through the metal connector and the metal column.

4. The method for preparing a packaged antenna module according to claim 1, wherein: The bottom of the connector window exposes the metal wiring of the rewiring layer, and the package antenna connector is electrically connected to the metal wiring.

5. The method for preparing a packaged antenna module according to claim 1, characterized in that: A dielectric layer is also included between the first antenna structure and the second antenna structure.

6. The method for preparing a packaged antenna module according to claim 1, characterized in that: The second antenna structure further includes a second antenna feed line located between the second antenna metal layer and the first antenna metal layer, and the second antenna metal layer is connected to the first antenna metal layer via the second antenna feed line.

7. The method for preparing a packaged antenna module according to claim 1, characterized in that: The method of forming the package antenna connector in the connector window includes one or a combination of reflow soldering and laser soldering.

8. The method for preparing a packaged antenna module according to claim 1, characterized in that: The method of forming the first antenna feed line includes one or a combination of wire bonding, electroplating and chemical plating, and the material of the first antenna feed line includes one or a combination of copper, gold, silver and aluminum.

9. The method for preparing a packaged antenna module according to claim 1, characterized in that: The method of forming the connector window includes one or a combination of dry etching and wet etching.

10. The method for preparing a packaged antenna module according to claim 1, characterized in that: The semiconductor chip includes one or a combination of active components and passive components; the active component may include one or a combination of a transceiver chip and a power management chip; the passive component may include one or a combination of a resistor, a capacitor and an inductor.

11. The method for preparing a packaged antenna module according to any one of claims 1 to 10, characterized in that: The packaged antenna module includes one or a combination of a GPS antenna, an FM headphone jack antenna, a WIFI antenna, a BT antenna, a diversity antenna and a main antenna.

12. A packaged antenna module, characterized in that: The packaged antenna module comprises: A rewiring layer, the rewiring layer comprising a first surface and a second surface arranged opposite to each other; An antenna structure, the antenna structure comprising a connector window and at least a first antenna structure and a second antenna structure stacked and arranged on a second surface of the rewiring layer, wherein the first antenna structure comprises a first antenna feed line, a first antenna metal layer and a first packaging layer, the first end of the first antenna feed line is electrically connected to the rewiring layer, the first packaging layer covers the first antenna feed line and exposes the second end of the first antenna feed line, the first antenna metal layer is located on the first packaging layer and is electrically connected to the second end of the first antenna feed line; the second antenna structure comprises a second packaging layer and a second antenna metal layer, the second packaging layer covers the first antenna metal layer, the second antenna metal layer is located on the second packaging layer, the connector window passes through the second antenna structure, or the connector window passes through the second antenna structure and the first antenna structure; a semiconductor chip, the semiconductor chip being located on the first surface of the rewiring layer and being electrically connected to the rewiring layer; a third packaging layer, the third packaging layer covering the semiconductor chip and the first surface of the rewiring layer; A packaged antenna connector is located in the connector window and is electrically connected to the rewiring layer.

13. The packaged antenna module according to claim 12, characterized in that: The packaged antenna connector matches with a circuit board connector on a circuit board, and is electrically connected to the circuit board connector via the packaged antenna connector; the circuit board includes one or a combination of a flexible circuit board and a rigid circuit board.

14. The packaged antenna module according to claim 12, characterized in that: The first antenna structure also includes a metal column and a metal connector, the first end of the metal column is electrically connected to the rewiring layer, the first packaging layer covers the second surface of the rewiring layer and the metal column and exposes the second end of the metal column, the metal connector is located on the first packaging layer and is electrically connected to the second end of the metal column; the bottom of the connector window exposes the metal connector, and the packaged antenna connector is electrically connected to the metal connector so as to be electrically connected to the rewiring layer through the metal connector and the metal column.

15. The packaged antenna module according to claim 12, characterized in that: The bottom of the connector window exposes the metal wiring of the rewiring layer, and the package antenna connector is electrically connected to the metal wiring.

16. The packaged antenna module according to claim 12, characterized in that: A dielectric layer is also included between the first antenna structure and the second antenna structure.

17. The packaged antenna module according to claim 12, characterized in that: The second antenna structure further includes a second antenna feed line located between the second antenna metal layer and the first antenna metal layer, and the second antenna metal layer is connected to the first antenna metal layer via the second antenna feed line.

18. The packaged antenna module according to claim 12, characterized in that: The first antenna feed line includes one or a combination of a copper feed line, a gold feed line, a silver feed line and an aluminum feed line.

19. The packaged antenna module according to claim 12, characterized in that: The semiconductor chip includes one or a combination of active components and passive components; the active component may include one or a combination of a transceiver chip and a power management chip; the passive component may include one or a combination of a resistor, a capacitor and an inductor.

20. The packaged antenna module according to any one of claims 12 to 19, characterized in that: The packaged antenna module includes one or a combination of a GPS antenna, an FM headphone jack antenna, a WIFI antenna, a BT antenna, a diversity antenna and a main antenna.

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