Smart headset system to prevent bowing, side tilt, myopia and protect cervical vertebra

Abstract

The present invention discloses an intelligent headset system for preventing bowing, lateral deflection, myopia and protecting cervical vertebra, comprising a charging power supply module, a single-chip computer module, a 3-axis acceleration sensor module, an infrared laser ranging module and a Bluetooth headset module, wherein the 3-axis acceleration sensor module and the infrared laser ranging module are respectively connected to the single-chip computer module, the single-chip computer module is connected to the Bluetooth headset module, and the charging power supply module supplies power to the remaining modules. The present invention can help mobile phone users develop correct mobile phone usage habits, thereby reducing the risk of cervical vertebra and myopia of mobile phone users.

Description

Technical Field

[0001] The invention relates to the field of earphones, and in particular to an intelligent earphone system for preventing head bowing, side tilting, myopia and cervical vertebrae protection. Background Art

[0002] The headset is worn on the human head and can receive external audio and voice information through wired or wireless means, and is used to play audio and voice transmitted by broadcast or audio sources. At present, the headset can be used to play the voice information of the mobile phone. When the mobile phone user wears the headset and uses the mobile phone for a long time, there is a phenomenon of lowering the head and tilting the head to the side. Using the mobile phone for a long time is easy to cause cervical fatigue, and in severe cases, it can cause cervical spondylosis. In addition, if the user uses the mobile phone at a close distance for a long time, it is also easy to have myopia problems. Especially for young children, cervical spondylosis and myopia caused by long-term use of mobile phones and tablets have been reported frequently. Therefore, when using mobile phones and tablets, a headset that can correct the lowering and tilting of the head and close-range reminders is needed at all times to effectively prevent the occurrence of cervical spondylosis and myopia. Summary of the invention

[0003] The purpose of the present invention is to provide an intelligent headset system for preventing head bowing, side tilting, myopia and protecting cervical vertebrae, so as to solve the problem that the headsets in the prior art do not have head posture reminder and close distance reminder.

[0004] In order to achieve the above object, the technical solution adopted by the present invention is:

[0005] The intelligent headset system for preventing head bowing, side tilting, myopia and protecting cervical vertebrae is characterized by comprising a charging power supply module, a single-chip computer module, a 3-axis acceleration sensor module, an infrared laser ranging module and a Bluetooth headset module, wherein:

[0006] The charging power supply module includes a charging socket J1 of model TYPE-C6P and a lithium battery charging chip IC2 of model TP4056; wherein the GND pin of the charging socket J1 is connected to the digital ground, and the VBUS pin of the charging socket J1 is connected to the VCC pin of the lithium-ion charging chip IC2; the VCC pin of the lithium-ion charging chip IC2 is connected to the digital ground through a capacitor C8, and the VCC pin of the lithium-ion charging chip IC2 is also connected to the CE pin of the lithium-ion charging chip IC2, and the PROG pin of the lithium-ion charging chip IC2 is connected to the digital ground with the TEMP pin and the GND pin through a resistor R5, and a wire leads out of the VCC pin of the lithium-ion charging chip IC2 and is connected to the two positive poles of a red and green dual-color LED lamp LED1 through a resistor R1, and the two negative poles of the red and green dual-color LED lamp LED1 correspond one to one with the lithium-ion charging chip IC2. Pins, Pin connection, the BAT pin of the lithium-ion charging chip IC2 is connected in parallel with the capacitor C9 to the digital ground, and the digital ground is connected in series with a resistor R19 to the analog ground of the Bluetooth module. At the same time, the BAT pin of the lithium-ion charging chip IC2 is also connected to the positive electrode of a lithium battery BT1, the negative electrode of the lithium battery BT1 is connected to the digital ground, the positive electrode of the lithium battery BT1 is also connected to the source of a MOS tube Q1 of model CJ2301, the source of the MOS tube Q1 is also connected to the gate of the MOS tube Q1 through the resistor R4, the gate of the MOS tube Q1 is also connected to the collector of a transistor Q2, the emitter of the transistor Q2 is connected to the digital ground, the base of the transistor Q2 is connected to the microcontroller module through the resistor R6, and the drain power supply of the MOS tube Q1 is connected to the Bluetooth module;

[0007] The single-chip microcomputer module includes a single-chip microcomputer IC3 of model STM8S003F3P. The VDD pin of the single-chip microcomputer IC3 is connected to the digital ground through the capacitor C13, and the VCAP pin is connected to the digital ground through the resistor C14. At the same time, the VDD pin of the single-chip microcomputer IC3 is connected to the regulated VCC3.3V output of the Bluetooth module, and the VSS pin of the single-chip microcomputer IC3 is connected to the digital ground; the T1_2 / PC7 pin of the single-chip microcomputer IC3 is pulled up and connected to VCC3.3V through the resistor R12, and the pin is connected to the pin 2 of the four-pin connector J4, the T1_1 / PC6 pin of the single-chip microcomputer IC3 is pulled up and connected to VCC3.3V through the resistor R11, and the pin is connected to the pin 3 of the four-pin connector J4, and the pin 1 of J2 is connected to the VCC3.3V. Connected to the regulated VCC3.3V output of the Bluetooth module, pin 4 of J2 is connected to the digital ground, and the four-pin connector is connected to the four-pin connector J5 of the infrared laser ranging module; pin 1 of the four-pin connector J2 is connected to the regulated VCC3.3V output of the Bluetooth module, pin 2 of J2 is connected to the SWIM / PD1 pin of the microcontroller IC3, pin 3 of the four-pin connector J2 is connected to the analog ground, pin 4 of the four-pin connector J2 is connected to the NRST pin of the microcontroller IC3, and the pin is also connected to VCC3.3V through a resistor R7 for pull-up, and the pin is connected to the digital ground through a capacitor C4; the T1_3 / PC3 pin of the microcontroller IC3 is connected to the resistor R6 on the base of the transistor Q2 in the charging power supply module;

[0008] The 3-axis acceleration sensor module includes a 3-axis accelerometer IC4 of model LIS3DH. The VDDIO pin, VDD pin, and CS pin of the 3-axis accelerometer IC4 are simultaneously connected to the regulated VCC3.3V output of the Bluetooth module. At the same time, the VDDIO pin of the 3-axis accelerometer IC4 is also connected to the digital ground through a capacitor C22. The VDD pin of the 3-axis accelerometer IC4 is also connected to the digital ground through a capacitor C21. The GDN pin and RES pin of the 3-axis accelerometer IC4 are connected to the digital ground in common. The SCL pin of the 3-axis accelerometer IC4 is connected to the T1_2 / PC7 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module. The SDA pin of the 3-axis accelerometer IC4 is connected to the T1_1 / PC6 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module.

[0009] The infrared laser ranging module includes a linear regulator IC6 of model ME6209A28M3G and an optical ranging sensor IC4 of model VL53L0CXV0DH. The Vin pin of the linear regulator IC6 is connected to pin 1 of a four-pin connector J5. At the same time, the Vin pin of the linear regulator IC6 is also connected to the digital ground through a capacitor C23. Pin 1 of the four-pin connector J5 is connected to the drain of the MOS tube Q1 in the charging power supply module. Pins 2 and 3 of the four-pin connector J5 are connected to the T1_2 / PC7 pin and T1_3 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module in a one-to-one correspondence. _1 / PC6 pin, pin 5 of the four-pin connector J5 is connected to the digital ground; the GND pin of the linear regulator IC6 is connected to the digital ground, the Vout pin of the linear regulator IC6 is connected to the digital ground at the same time through capacitors C24 and C25, and the Vout pin of the linear regulator IC6 is also connected to the VDD pin and AVDD pin of the optical distance sensor IC4 respectively; the VSS pin, GND pin, GND2 pin, GND3 pin, and GND4 of the optical distance sensor IC4 are connected to the digital ground in common, and the SCL pin and SDA pin of the optical distance sensor IC4 are connected to the T1_2 / PC7 pin and T1_1 / PC6 pin of the microcontroller IC3 in the microcontroller module in a one-to-one correspondence through pins 2 and 3 of the four-pin connector;

[0010] The Bluetooth headset module includes a 5.0 Bluetooth audio chip IC1 of model AC6926A, an audio input AUX interface JK1 of model PJ-3420-A, a microphone MK1, and an IC5 of model W25Q32; the VCOM pin of the Bluetooth audio chip IC1 is connected to the analog ground through capacitor C11, the DACVDD pin is connected to the analog ground through capacitor C10, and the VDDIO pin of the Bluetooth audio chip IC1 is connected to the digital ground through capacitor C12, and the pin outputs the regulated VCC3.3V output, the PGND pin of the Bluetooth audio chip IC1 is connected to the digital ground, the PB1 / ADC7 pin of the Bluetooth audio chip IC1 is connected to the PD5 / TX pin of the microcontroller IC3 in the microcontroller module, the PB0 pin of the Bluetooth audio chip IC1 is connected to the PD6 / RX pin of the microcontroller IC3 in the microcontroller module, the VBAT pin of the Bluetooth audio chip IC1 is connected to the digital ground through capacitor C6, the RTCVDD pin is connected to the capacitor C15, and the BT_AVDD pin is connected to the digital ground through capacitor C5. The VBAT pin of the Bluetooth audio chip IC1 is also connected to the drain of the MOS tube Q1 in the charging power supply module, and the BT_RF pin of the Bluetooth audio chip IC1 is connected to the digital ground through capacitor C6, the RTCVDD pin is connected to the capacitor C15, and the BT_AVDD pin is connected to the digital ground through capacitor C5. Capacitor C3 is connected to Bluetooth antenna E1, crystal oscillator XT1 is connected between BT_OSCI pin and BT_OSCO pin of Bluetooth audio chip IC1, ADC2 / PA5 pin of Bluetooth audio chip IC1 is connected to pin 2 of audio input AUX interface JK1, WM1 / PA4 pin and ADC0 / PA3 pin of Bluetooth audio chip IC1 are connected to pin 3 and pin 4 of audio input AUX interface JK1 through capacitors C1 and C2 respectively, pin 3 of audio input AUX interface JK1 is also connected to analog ground through resistor R2, pin 4 is also connected to analog ground through resistor R3 with pin 1 of audio input AUX interface JK1; DA of Bluetooth audio chip IC1 The CL pin is connected to pin 3 of the four-pin connector J3 through capacitor C17, and pins 2 and 4 of the four-pin connector J3 are connected to the digital ground; pins 1 and 2 of the four-pin connector J3 are used to connect the right channel speaker, and pins 3 and 4 are used to connect the left channel speaker; the PWMH1H / PC1 pin of the Bluetooth audio chip IC1 is connected to the anode of a light-emitting diode LED2 through resistor R14, and the cathode of the light-emitting diode LED2 is connected to the digital ground; the positive electrode of the microphone MK1 is connected to the MIC / PA0 pin of the Bluetooth audio chip IC1 through capacitor C19, and the positive electrode of the microphone MK1 is also connected to the DACVDD pin of the Bluetooth audio chip IC1 through resistor R10. The positive electrode of microphone MK1 is also connected to analog ground through capacitor C20 and the negative electrode of microphone MK1. The CS pin of IC5 is connected to the PB3 / SD0DAT pin of Bluetooth audio chip IC1. The SDO pin of IC5 is connected to the SDI pin of IC5 through resistor R20. The WP pin, HOLD pin and VCC pin of IC5 are connected to the VDDIO pin of Bluetooth audio chip IC1. The GND pin of IC5 is connected to digital ground. The SDI pin of IC5 is connected to the PB5 / SD0CLK pin of Bluetooth audio chip IC1. The SCLK pin of IC5 is connected to the PB4 / SD0CMD pin of Bluetooth audio chip IC1. .

[0011] The intelligent headset system for preventing head bowing, side tilting, myopia and protecting cervical vertebrae is characterized in that the AD4 / PD3 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is connected to the analog ground through a resistor R22.

[0012] The described intelligent headset system for preventing head bowing, side tilting, myopia and protecting cervical vertebrae is characterized in that: the AD3 / PD2 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a diode D2, and the cathode of the diode D2 is connected to two wires, one of the wires of the cathode of the diode D2 is connected to the cathode of a diode D1, the anode of the diode D1 is connected between the resistor R4 and the gate of the MOS tube Q1 in the charging power supply module, the other wire of the cathode of the diode D2 is connected to one end of a key switch S5, and the other end of the key switch S5 is grounded, and the PD4 / BP pin of the single-chip microcomputer IC3 is also connected to one end of a key switch S6, and the other end of the key switch S6 is grounded.

[0013] The described intelligent headset system for preventing head bowing, side tilting, myopia and protecting cervical vertebrae is characterized by: also including a flash memory chip IC5 of model W25Q32, the CS pin of the flash memory chip IC5 is connected to the PB3 / SD0DAT pin of the Bluetooth audio chip IC1, the SDO pin of the flash memory chip IC5 is connected to the SDI pin of the flash memory chip IC5 through a resistor R20, the WP pin, HOLD pin and VCC pin of the flash memory chip IC5 are connected together and then connected to the drain of the MOS tube Q1 in the charging power supply module, the WP pin, HOLD pin and VCC pin are connected together and then connected to the analog ground through a capacitor C16, the SDI pin of the flash memory chip IC5 is also connected to the PB5 / SD0CLK pin of the Bluetooth audio chip IC1, and the SCLK pin of the flash memory chip IC5 is also connected to the PB4 / SD0CMD pin of the Bluetooth audio chip IC1.

[0014] The anti-bowing, anti-lateral deflection, anti-myopia and cervical vertebra protection intelligent headset system is characterized by: further comprising key switches S1, S2, S3, and S4, one end of each of the key switches S1, S2, S3, and S4 being connected to a digital ground, the other end of the key switch S1 is connected through a resistor R9, the other end of the key switch S2 is connected through a resistor R13, the other end of the key switch S3 is connected through a resistor R15, and the other end of the key switch S4 is connected through a resistor R17, and then connected to the drain of the MOS tube Q1 in the charging power supply module through a resistor R8, and at the same time, the common end of the resistor R9, the resistor R13, the resistor R15, and the resistor R17 is also connected to the analog ground through a capacitor C18, and the SCL / PB4 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the common end of the resistor R9, the resistor R13, the resistor R15, and the resistor R17 through a resistor R18.

[0015] The invention is used for a headset worn on a human head. The headset can be wirelessly connected to a mobile phone audio source and play audio voice through a Bluetooth headset module. The posture angle of the wearer's head when lowering or tilting to the side can be detected in real time through a six-axis acceleration sensor module. The distance between the human head and the mobile phone can be measured through an infrared laser distance measurement module. The posture angle and the distance are respectively sent to a single-chip microcomputer in a single-chip microcomputer module, which is compared with a set corresponding threshold value. When an early warning is needed, the single-chip microcomputer generates a signal and sends it to a Bluetooth audio chip in the Bluetooth headset module. The Bluetooth audio chip stops playing normal voice information, and plays a reminder voice information through a connected microphone.

[0016] Compared with the prior art, the present invention can give corresponding voice prompts when the mobile phone user's head is at risk of bowing, tilting to the side, and myopia, reminding the mobile phone user to adjust the posture, and can help the mobile phone user develop correct mobile phone usage habits by stopping playing normal voice, thereby reducing the risk of cervical vertebrae and myopia for the mobile phone user. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a system principle block diagram of the present invention.

[0018] Figure 2 It is a circuit diagram of the charging power supply module of the present invention.

[0019] Figure 3 It is a circuit diagram of a single chip microcomputer module of the present invention.

[0020] Figure 4 It is a circuit diagram of a 3-axis acceleration sensor module of the present invention.

[0021] Figure 5 It is a circuit diagram of the infrared laser ranging module of the present invention.

[0022] Figure 6 It is a circuit diagram of a Bluetooth headset module of the present invention.

[0023] Figure 7 The invention discloses a circuit diagram of a light emitting diode connected to a single chip microcomputer.

[0024] Figure 8 The invention discloses a key switch circuit diagram for connecting a single chip microcomputer and a charging power supply module.

[0025] Fig. 9 It is a circuit diagram of the flash memory chip of the present invention.

[0026] Fig.10 The invention discloses a key switch circuit diagram connected to a single chip microcomputer. DETAILED DESCRIPTION

[0027] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0028] like Figure 1 As shown, the intelligent headset system for preventing head bowing, side tilting, myopia and protecting cervical vertebrae is characterized by comprising a charging power supply module, a single-chip computer module, a 3-axis acceleration sensor module, an infrared laser ranging module and a Bluetooth headset module, wherein:

[0029] like Figure 2 As shown, the charging power supply module includes a charging socket J1 of model TYPE-C6P and a lithium battery charging chip IC2 of model TP4056; wherein the GND pin of the charging socket J1 is connected to the digital ground, and the VBUS pin of the charging socket J1 is connected to the VCC pin of the lithium ion charging chip IC2; the VCC pin of the lithium ion charging chip IC2 is connected to the digital ground through a capacitor C8, and the VCC pin of the lithium ion charging chip IC2 is also connected to the CE pin of the lithium ion charging chip IC2, and the PROG pin of the lithium ion charging chip IC2 is connected to the digital ground with the TEMP pin and the GND pin through a resistor R5, and a wire is led out of the VCC pin of the lithium ion charging chip IC2 and connected to the two positive poles of a red and green dual-color LED lamp LED1 through a resistor R1, and the two negative poles of the red and green dual-color LED lamp LED1 correspond one to one with the lithium ion charging chip IC2 in Pins, Pin connection, the BAT pin of the lithium-ion charging chip IC2 is connected in parallel with the capacitor C9 to the digital ground, and the digital ground is connected in series with a resistor R19 to the analog ground of the Bluetooth module. At the same time, the BAT pin of the lithium-ion charging chip IC2 is also connected to the positive electrode of a lithium battery BT1, the negative electrode of the lithium battery BT1 is connected to the digital ground, the positive electrode of the lithium battery BT1 is also connected to the source of a MOS tube Q1 of model CJ2301, the source of the MOS tube Q1 is also connected to the gate of the MOS tube Q1 through the resistor R4, the gate of the MOS tube Q1 is also connected to the collector of a transistor Q2, the emitter of the transistor Q2 is connected to the digital ground, the base of the transistor Q2 is connected to the microcontroller module through the resistor R6, and the drain power supply of the MOS tube Q1 is connected to the Bluetooth module;

[0030] like Figure 3As shown, the single-chip microcomputer module includes a single-chip microcomputer IC3 of model STM8S003F3P, the VDD pin of the single-chip microcomputer IC3 is connected to the digital ground through the capacitor C13, the VCAP pin is connected to the digital ground through the resistor C14, and the VDD pin of the single-chip microcomputer IC3 is connected to the regulated VCC3.3V output of the Bluetooth module, and the VSS pin of the single-chip microcomputer IC3 is connected to the digital ground; the T1_2 / PC7 pin of the single-chip microcomputer IC3 is pulled up and connected to VCC3.3V through the resistor R12, and the pin is connected to the pin 2 of the four-pin connector J4, the T1_1 / PC6 pin of the single-chip microcomputer IC3 is pulled up and connected to VCC3.3V through the resistor R11, and the pin is connected to the pin 3 of the four-pin connector J4, and the pin of J2 1 is connected to the regulated VCC3.3V output of the Bluetooth module, pin 4 of J2 is connected to the digital ground, and the four-pin connector is connected to the four-pin connector J5 of the infrared laser ranging module; pin 1 of the four-pin connector J2 is connected to the regulated VCC3.3V output of the Bluetooth module, pin 2 of J2 is connected to the SWIM / PD1 pin of the microcontroller IC3, pin 3 of the four-pin connector J2 is connected to the analog ground, pin 4 of the four-pin connector J2 is connected to the NRST pin of the microcontroller IC3, and the pin is also connected to VCC3.3V through a resistor R7 for pull-up, and the pin is connected to the digital ground through a capacitor C4; the T1_3 / PC3 pin of the microcontroller IC3 is connected to the resistor R6 on the base of the transistor Q2 in the charging power supply module;

[0031] like Figure 4 As shown, the 3-axis acceleration sensor module includes a 3-axis accelerometer IC4 of model LIS3DH, the VDDIO pin, VDD pin, and CS pin of the 3-axis accelerometer IC4 are simultaneously connected to the regulated VCC3.3V output of the Bluetooth module, and the VDDIO pin of the 3-axis accelerometer IC4 is also connected to the digital ground through a capacitor C22, the VDD pin of the 3-axis accelerometer IC4 is also connected to the digital ground through a capacitor C21, the GDN pin and RES pin of the 3-axis accelerometer IC4 are connected to the digital ground, the SCL pin of the 3-axis accelerometer IC4 is connected to the T1_2 / PC7 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module, and the SDA pin of the 3-axis accelerometer IC4 is connected to the T1_1 / PC6 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module;

[0032] like Figure 5As shown, the infrared laser ranging module includes a linear regulator IC6 of model ME6209A28M3G, an optical ranging sensor IC4 of model VL53L0CXV0DH, a Vin pin of the linear regulator IC6 is connected to pin 1 of a four-pin connector J5, and the Vin pin of the linear regulator IC6 is also connected to the digital ground through a capacitor C23, a pin 1 of the four-pin connector J5 is connected to the drain of the MOS tube Q1 in the charging power supply module, and pins 2 and 3 of the four-pin connector J5 are connected to the T1_2 / PC7 pin and T1_3 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module in a one-to-one correspondence. 1_1 / PC6 pin, pin 5 of the four-pin connector J5 is connected to the digital ground; the GND pin of the linear regulator IC6 is connected to the digital ground, the Vout pin of the linear regulator IC6 is connected to the digital ground at the same time through the capacitor C24 and the capacitor C25, and the Vout pin of the linear regulator IC6 is also connected to the VDD pin and the AVDD pin of the optical distance sensor IC4 respectively; the VSS pin, GND pin, GND2 pin, GND3 pin, and GND4 of the optical distance sensor IC4 are connected to the digital ground in common, and the SCL pin and SDA pin of the optical distance sensor IC4 are connected to the T1_2 / PC7 pin and the T1_1 / PC6 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module through the 2 and 3 pins of the four-pin connector respectively.

[0033] like Figure 6As shown, the Bluetooth headset module includes a 5.0 Bluetooth audio chip IC1 of model AC6926A, an audio input AUX interface JK1 of model PJ-3420-A, a microphone MK1, and an IC5 of model W25Q32; the VCOM pin of the Bluetooth audio chip IC1 is connected to the analog ground through a capacitor C11, the DACVDD pin is connected to the DACVSS pin through a capacitor C10, and the VDDIO pin of the Bluetooth audio chip IC1 is connected to the digital ground through a capacitor C12, and the pin outputs a regulated VCC3.3V output, the PGND pin of the Bluetooth audio chip IC1 is connected to the digital ground, the PB1 / ADC7 pin of the Bluetooth audio chip IC1 is connected to the PD5 / TX pin of the microcontroller IC3 in the microcontroller module, the PB0 pin of the Bluetooth audio chip IC1 is connected to the PD6 / RX pin of the microcontroller IC3 in the microcontroller module, the VBAT pin of the Bluetooth audio chip IC1 is connected to the digital ground through capacitor C6, the RTCVDD pin is connected to the capacitor C15, and the BT_AVDD pin is connected to the digital ground through capacitor C5. The VBAT pin of the Bluetooth audio chip IC1 is also connected to the drain of the MOS tube Q1 in the charging power supply module, and the BT_RF pin of the Bluetooth audio chip IC1 is connected to the digital ground through capacitor C6, the RTCVDD pin is connected to the capacitor C15, and the BT_AVDD pin is connected to the digital ground through capacitor C5. Capacitor C3 is connected to Bluetooth antenna E1, crystal oscillator XT1 is connected between BT_OSCI pin and BT_OSCO pin of Bluetooth audio chip IC1, ADC2 / PA5 pin of Bluetooth audio chip IC1 is connected to pin 2 of audio input AUX interface JK1, WM1 / PA4 pin and ADC0 / PA3 pin of Bluetooth audio chip IC1 are connected to pin 3 and pin 4 of audio input AUX interface JK1 through capacitors C1 and C2 respectively, pin 3 of audio input AUX interface JK1 is also connected to analog ground through resistor R2, pin 4 is also connected to analog ground through resistor R3 with pin 1 of audio input AUX interface JK1; DA of Bluetooth audio chip IC1 The CL pin is connected to pin 3 of the four-pin connector J3 through capacitor C17, and pins 2 and 4 of the four-pin connector J3 are connected to the digital ground; pins 1 and 2 of the four-pin connector J3 are used to connect the right channel speaker, and pins 3 and 4 are used to connect the left channel speaker; the PWMH1H / PC1 pin of the Bluetooth audio chip IC1 is connected to the anode of a light-emitting diode LED2 through resistor R14, and the cathode of the light-emitting diode LED2 is connected to the digital ground; the positive electrode of the microphone MK1 is connected to the MIC / PA0 pin of the Bluetooth audio chip IC1 through capacitor C19, and the positive electrode of the microphone MK1 is also connected to the DACVDD pin of the Bluetooth audio chip IC1 through resistor R10. The positive electrode of microphone MK1 is also connected to analog ground through capacitor C20 and the negative electrode of microphone MK1. The CS pin of IC5 is connected to the PB3 / SD0DAT pin of Bluetooth audio chip IC1. The SDO pin of IC5 is connected to the SDI pin of IC5 through resistor R20. The WP pin, HOLD pin and VCC pin of IC5 are connected to the VDDIO pin of Bluetooth audio chip IC1. The GND pin of IC5 is connected to digital ground. The SDI pin of IC5 is connected to the PB5 / SD0CLK pin of Bluetooth audio chip IC1. The SCLK pin of IC5 is connected to the PB4 / SD0CMD pin of Bluetooth audio chip IC1. .

[0034] like Figure 7As shown, the AD4 / PD3 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is connected to the analog ground through a resistor R22.

[0035] like Figure 8 As shown, the AD3 / PD2 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a diode D2, and the cathode of the diode D2 is connected to two wires, one of the wires of the cathode of the diode D2 is connected to the cathode of a diode D1, the anode of the diode D1 is connected between the resistor R4 and the gate of the MOS tube Q1 in the charging power supply module, and the other wire of the cathode of the diode D2 is connected to one end of a key switch S5, and the other end of the key switch S5 is grounded. The PD4 / BP pin of the single-chip microcomputer IC3 is also connected to one end of a key switch S6, and the other end of the key switch S6 is grounded.

[0036] like Fig. 9 As shown, the present invention also includes a flash memory chip IC5 of model W25Q32, the CS pin of the flash memory chip IC5 is connected to the PB3 / SD0DAT pin of the Bluetooth audio chip IC1, the SDO pin of the flash memory chip IC5 is connected to the SDI pin of the flash memory chip IC5 through a resistor R20, the WP pin, the HOLD pin, and the VCC pin of the flash memory chip IC5 are connected together and then connected to the drain of the MOS tube Q1 in the charging power supply module, the WP pin, the HOLD pin, and the VCC pin are connected together and then connected to the analog ground through a capacitor C16, the SDI pin of the flash memory chip IC5 is also connected to the PB5 / SD0CLK pin of the Bluetooth audio chip IC1, and the SCLK pin of the flash memory chip IC5 is also connected to the PB4 / SD0CMD pin of the Bluetooth audio chip IC1.

[0037] like Fig.10 As shown, the present invention also includes key switches S1, S2, S3, and S4. One end of each of the key switches S1, S2, S3, and S4 is commonly connected to the digital ground. The other end of the key switch S1 is connected through a resistor R9, the other end of the key switch S2 is connected through a resistor R13, the other end of the key switch S3 is connected through a resistor R15, and the other end of the key switch S4 is connected through a resistor R17, and then connected to the drain of the MOS tube Q1 in the charging power supply module through a resistor R8. At the same time, the common end of the resistor R9, the resistor R13, the resistor R15, and the resistor R17 is also connected to the analog ground through a capacitor C18. The SCL / PB4 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the common end of the resistor R9, the resistor R13, the resistor R15, and the resistor R17 through a resistor R18.

[0038] The embodiments described in the present invention are merely descriptions of the preferred implementation modes of the present invention, and are not intended to limit the concept and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made to the technical solutions of the present invention by engineers and technicians in this field should fall within the protection scope of the present invention. The technical contents for which protection is sought in the present invention have all been recorded in the claims.

Claims

1. An intelligent headset system, characterized by: It includes a charging power supply module, a single-chip microcomputer module, a 3-axis acceleration sensor module, an infrared laser ranging module, and a Bluetooth headset module, among which: The charging power supply module includes a charging socket J1 with a model of TYPE-C6P and a lithium-ion charging chip IC2 with a model of TP4056; the GND pin of the charging socket J1 is connected to the digital ground, and the VBUS pin of the charging socket J1 is connected to the VCC pin of the lithium-ion charging chip IC2; the VCC pin of the lithium-ion charging chip IC2 is connected to the digital ground through the capacitor C8, and the VCC pin of the lithium-ion charging chip IC2 is also connected to the CE pin of the lithium-ion charging chip IC2, and the PROG pin of the lithium-ion charging chip IC2 is connected to the digital ground with the TEMP pin and the GND pin through the resistor R5. A wire is led out from the VCC pin of the lithium-ion charging chip IC2 and is connected to the two positive poles of a red and green dual-color LED lamp LED1 through the resistor R1, and the two negative poles of the red and green dual-color LED lamp LED1 correspond one to one with the lithium-ion charging chip IC2. Pins, Pin connection, the BAT pin of the lithium-ion charging chip IC2 is connected in parallel with the capacitor C9 to the digital ground, the digital ground is connected in series with a resistor R19 to the analog ground of the Bluetooth headset module, and at the same time, the BAT pin of the lithium-ion charging chip IC2 is also connected to the positive electrode of a lithium battery BT1, the negative electrode of the lithium battery BT1 is connected to the digital ground, the positive electrode of the lithium battery BT1 is also connected to the source of a MOS tube Q1 model CJ2301, the source of the MOS tube Q1 is also connected to the gate of the MOS tube Q1 through the resistor R4, the gate of the MOS tube Q1 is also connected to the collector of a transistor Q2, the emitter of the transistor Q2 is connected to the digital ground, the base of the transistor Q2 is connected to the microcontroller module through the resistor R6, and the drain power supply of the MOS tube Q1 is connected to the Bluetooth headset module; The single-chip microcomputer module includes a single-chip microcomputer IC3 of model STM8S003F3P. The VDD pin of the single-chip microcomputer IC3 is connected to the digital ground through the capacitor C13 and the VCAP pin is connected to the digital ground through the resistor C14. At the same time, the VDD pin of the single-chip microcomputer IC3 is connected to the regulated VCC3.3V output of the Bluetooth headset module, and the VSS pin of the single-chip microcomputer IC3 is connected to the digital ground; the T1_2 / PC7 pin of the single-chip microcomputer IC3 is pulled up to VCC3.3V through the resistor R12, and the T1_2 / PC7 pin is connected to the pin 2 of the four-pin connector J2. The T1_1 / PC6 pin of the single-chip microcomputer IC3 is pulled up to VCC3.3V through the resistor R11, and the T1_1 / PC6 pin is connected to the pin 1 of the four-pin connector J4. Pin 1 is connected to the regulated VCC3.3V output of the Bluetooth headset module, and pin 4 of J2 is connected to digital ground. This four-pin connector is connected to the four-pin connector J5 of the infrared laser ranging module; pin 1 of the four-pin connector J2 is connected to the regulated VCC3.3V output of the Bluetooth headset module, pin 2 of J2 is connected to the SWIM / PD1 pin of the microcontroller IC3, pin 3 of the four-pin connector J2 is connected to analog ground, and pin 4 of the four-pin connector J2 is connected to the NRST pin of the microcontroller IC3. Pin 4 of J2 is also connected to VCC3.3V through resistor R7 for pull-up, and pin 4 of J2 is connected to digital ground through capacitor C7; pin T1_3 / PC3 of the microcontroller IC3 is connected to resistor R6 on the base of transistor Q2 in the charging power supply module; The 3-axis acceleration sensor module includes a 3-axis accelerometer IC4 model LIS3DH. The VDDIO pin, VDD pin, and CS pin of the 3-axis accelerometer IC4 are simultaneously connected to the regulated VCC3.3V output of the Bluetooth headset module. At the same time, the VDDIO pin of the 3-axis accelerometer IC4 is also connected to the digital ground through a capacitor C22. The VDD pin of the 3-axis accelerometer IC4 is also connected to the digital ground through a capacitor C21. The GDN pin and RES pin of the 3-axis accelerometer IC4 are connected to the digital ground. The SCL pin of the 3-axis accelerometer IC4 is connected to the T1_2 / PC7 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module. The SDA pin of the 3-axis accelerometer IC4 is connected to the T1_1 / PC6 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module. The infrared laser ranging module includes a linear regulator IC6 with a model number of ME6209A28M3G and an optical ranging sensor IC7 with a model number of VL53L0CXV0DH. The Vin pin of the linear regulator IC6 is connected to pin 1 of a four-pin connector J5. At the same time, the Vin pin of the linear regulator IC6 is also connected to the digital ground through the capacitor C23. Pin 1 of the four-pin connector J5 is connected to the drain of the MOS tube Q1 in the charging power supply module. Pins 2 and 3 of the four-pin connector J5 are connected to the T1_2 / PC7 pin and T1_1 / PC6 pin of the microcontroller IC3 in the microcontroller module in a one-to-one correspondence. Pin 4 of the four-pin connector J5 is connected to the digital ground. The GND pin of the linear voltage regulator IC6 is connected to the digital ground, and the Vout pin of the linear voltage regulator IC6 is connected to the digital ground at the same time through capacitors C24 and C25. The Vout pin of the linear voltage regulator IC6 is also connected to the VDD pin and AVDD pin of the optical distance sensor IC7 respectively; the VSS pin, GND pin, GND2 pin, GND3 pin, and GND4 of the optical distance sensor IC7 are connected to the digital ground in common, and the SCL pin and SDA pin of the optical distance sensor IC7 are connected to the T1_2 / PC7 pin and T1_1 / PC6 pin of the microcontroller IC3 in the microcontroller module in a one-to-one correspondence through pins 2 and 3 of the four-pin connector; The Bluetooth headset module includes an AC6926A 5.0 Bluetooth audio chip IC1, a PJ-3420-A audio input AUX port JK1, a microphone MK1, and a W25Q32 IC5. IC1's VCOM pin is connected to analog ground via capacitor C11, and its DACVDD pin and DACVSS pin are connected to analog ground via capacitor C10. IC1's VDDIO pin is connected to digital ground via capacitor C12, and the VDDIO pin outputs a regulated voltage, VCC3.3V output, the PGND pin of the Bluetooth audio chip IC1 is connected to the digital ground, the PB1 / ADC7 pin of the Bluetooth audio chip IC1 is connected to the PD5 / TX pin of the microcontroller IC3 in the microcontroller module, the PB0 pin of the Bluetooth audio chip IC1 is connected to the PD6 / RX pin of the microcontroller IC3 in the microcontroller module, the VBAT pin of the Bluetooth audio chip IC1 is connected to the digital ground through capacitor C6, the RTCVDD pin is connected to the capacitor C15, and the BT_AVDD pin is connected to the digital ground through capacitor C5. The VBAT pin of the Bluetooth audio chip IC1 is also connected to the drain of the MOS tube Q1 in the charging power supply module, and the BT_RF pin of the Bluetooth audio chip IC1 is connected through Capacitor C3 is connected to the Bluetooth antenna E1. Crystal oscillator XT1 is connected between the BT_OSCI and BT_OSCO pins of the Bluetooth audio chip IC1. The ADC2 / PA5 pin of the Bluetooth audio chip IC1 is connected to pin 2 of the audio input AUX interface JK1. The WM1 / PA4 and ADC0 / PA3 pins of the Bluetooth audio chip IC1 are connected to pins 3 and 4 of the audio input AUX interface JK1 through capacitors C1 and C2 respectively. Pin 3 of the audio input AUX interface JK1 is also connected to pin 1 of the audio input AUX interface JK1 through resistor R2, and pin 4 is also connected to pin 1 of the audio input AUX interface JK1 through resistor R3. The DA pin of the Bluetooth audio chip IC1 The CL pin is connected to pin 3 of the four-pin connector J3 through capacitor C17, and pins 2 and 4 of the four-pin connector J3 are connected to the digital ground. Pins 1 and 2 of the four-pin connector J3 are used to connect the right channel speaker, and pins 3 and 4 are used to connect the left channel speaker. The PWMH1H / PC1 pin of the Bluetooth audio chip IC1 is connected to the anode of a light-emitting diode LED2 through resistor R14, and the cathode of the light-emitting diode LED2 is connected to the digital ground. The positive electrode of the microphone MK1 is connected to the MIC / PA0 pin of the Bluetooth audio chip IC1 through capacitor C19. At the same time, the positive electrode of the microphone MK1 is also connected to the DACVDD pin of the Bluetooth audio chip IC1 through resistor R10. The positive electrode of microphone MK1 is also connected to the analog ground together with the negative electrode of microphone MK1 through capacitor C20. The CS pin of IC5 is connected to the PB3 / SD0DAT pin of Bluetooth audio chip IC1. The SDO pin of IC5 is connected to the SDI pin of IC5 through resistor R20. The WP pin, HOLD pin, and VCC pin of IC5 are connected to the VDDIO pin of Bluetooth audio chip IC1. The GND pin of IC5 is connected to the digital ground. The SDI pin of IC5 is connected to the PB5 / SD0CLK pin of Bluetooth audio chip IC1. The SCLK pin of IC5 is connected to the PB4 / SD0CMD pin of Bluetooth audio chip IC1.

2. The smart headset system according to claim 1, wherein: The AD4 / PD3 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is connected to the analog ground through the resistor R22.

3. The smart headset system according to claim 1, wherein: The AD3 / PD2 pin of the microcontroller IC3 in the microcontroller module is connected to the anode of a diode D2. The cathode of the diode D2 is connected to two wires. One of the wires of the cathode of the diode D2 is connected to the cathode of a diode D1. The anode of the diode D1 is connected between the resistor R4 and the gate of the MOS tube Q1 in the charging power supply module. The other wire of the cathode of the diode D2 is connected to one end of a push button switch S5. The other end of the push button switch S5 is grounded. The PD4 / BP pin of the microcontroller IC3 is also connected to one end of a push button switch S6. The other end of the push button switch S6 is grounded.

4. The smart headset system according to claim 1, wherein: It also includes a flash memory chip IC5 of model W25Q32. The CS pin of the flash memory chip IC5 is connected to the PB3 / SD0DAT pin of the Bluetooth audio chip IC1. The SDO pin of the flash memory chip IC5 is connected to the SDI pin of the flash memory chip IC5 through a resistor R20. The WP pin, HOLD pin, and VCC pin of the flash memory chip IC5 are connected together and then connected to the drain of the MOS tube Q1 in the charging power supply module. The WP pin, HOLD pin, and VCC pin are connected together and then connected to the analog ground through a capacitor C16. The SDI pin of the flash memory chip IC5 is also connected to the PB5 / SD0CLK pin of the Bluetooth audio chip IC1. The SCLK pin of the flash memory chip IC5 is also connected to the PB4 / SD0CMD pin of the Bluetooth audio chip IC1.

5. The smart headset system according to claim 1, wherein: It also includes key switches S1, S2, S3, and S4. One end of each of the key switches S1, S2, S3, and S4 is connected to the digital ground. The other end of the key switch S1 is connected through a resistor R9, the other end of the key switch S2 is connected through a resistor R13, the other end of the key switch S3 is connected through a resistor R15, and the other end of the key switch S4 is connected through a resistor R17. The common end is then connected to the drain of the MOS tube Q1 in the charging power supply module through a resistor R8. At the same time, the common end of the resistors R9, R13, R15, and R17 is also connected to the analog ground through a capacitor C18. The SCL / PB4 pin of the microcontroller IC3 in the microcontroller module is connected to the common end of the resistors R9, R13, R15, and R17 through a resistor R16, and the SDA / PB5 pin is connected to the common end of the resistors R9, R13, R15, and R17 through a resistor R18.

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