Electronic modules

Abstract

The present invention discloses an electronic module, which comprises: a circuit board, wherein a plurality of electronic devices are arranged on the upper surface of the circuit board; an inductor, which is arranged on the lower surface of the circuit board; and a plurality of waveform pins, which are arranged below the lower surface of the circuit board, wherein each waveform pin comprises a conductive body and at least one recessed portion on the lower surface of the conductive body, wherein the inductor is electrically connected to at least one waveform pin of the plurality of waveform pins of the circuit board. The electronic module provided by the present invention can be, for example, a voltage regulator module, having a power inductor and a power waveform pin arranged on the lower surface of the circuit board, so as to reduce the size and increase the heat dissipation capacity of the voltage regulator module.

Description

Technical Field

[0001] This invention relates to an electronic module, and more particularly to a voltage regulator module (VRM). Background Technology

[0002] As electronic circuitry, such as voltage regulator modules (VRMs), is increasingly being deployed at higher frequencies and with smaller sizes, the distance between VRMs and processors in server systems is decreasing to reduce parasitic noise interference. Consequently, VRMs in server systems become heat sources for other components, such as the processor, which can affect processor performance.

[0003] Therefore, the industry needs a better solution to address these issues. Summary of the Invention

[0004] One objective of this invention is to provide an electronic module with a smaller size and greater heat dissipation capacity, such as a voltage regulator module (VRM).

[0005] An embodiment of the present invention discloses an electronic module comprising: a circuit board, wherein a plurality of electronic devices are disposed on an upper surface of the circuit board; an inductor disposed on a lower surface of the circuit board; and a plurality of waveform pins disposed below the lower surface of the circuit board, wherein each waveform pin includes a conductive body and at least one recess on the lower surface of the conductive body, wherein the inductor is electrically connected to at least one of the plurality of waveform pins of the circuit board.

[0006] In one embodiment, the inductor is a power inductor, wherein the power inductor is electrically connected to a power source.

[0007] In one embodiment, the circuit board is a PCB.

[0008] In one embodiment, the recess has a semi-circular shape.

[0009] In one embodiment, the plurality of electronic devices includes a first MOSFET and a second MOSFET.

[0010] In one embodiment, the plurality of waveform pins and the plurality of signal pins are disposed on a connection board, wherein the plurality of waveform pins and the plurality of signal pins are electrically connected to the circuit board.

[0011] In one embodiment, the connection board is a PCB.

[0012] In one embodiment, a heat sink is disposed above the plurality of electronic devices.

[0013] In one embodiment, a continuous metal layer is electroplated on the upper surfaces of the first MOSFET and the second MOSFET to dissipate heat generated by the first MOSFET and the second MOSFET.

[0014] In one embodiment, a first metal layer is electroplated on the upper surface of the first MOSFET, and a second metal layer is electroplated on the upper surface of the second MOSFET to dissipate heat generated by the first MOSFET and the second MOSFET, wherein the first metal layer and the second metal layer are separated by a horizontal gap.

[0015] In one embodiment, the plurality of waveform pins and the plurality of signal pins are metal-injected to form an insert-molded connection board, wherein the plurality of waveform pins and the plurality of signal pins are electrically connected to the circuit board.

[0016] In one embodiment, the plurality of waveform pins and the plurality of signal pins are on a connector, wherein the plurality of waveform pins and the plurality of signal pins are electrically connected to the circuit board.

[0017] In one embodiment, the plurality of waveform pins and the plurality of signal pins are made of a lead frame, wherein the plurality of waveform pins and the plurality of signal pins are electrically connected to the circuit board.

[0018] In one embodiment, a package is disposed on the upper surface of the circuit board to encapsulate the plurality of electronic devices and the continuous metal layer, wherein the upper surface of the continuous metal layer is exposed from the package.

[0019] In one embodiment, a package is disposed on the upper surface of the circuit board to encapsulate the plurality of electronic devices and the first metal layer and the second metal layer, wherein the first metal layer and the second metal layer are exposed from the package.

[0020] In one embodiment, each waveform pin includes a conductive body and a plurality of recesses on the lower surface of the conductive body.

[0021] In one embodiment, the electronic module is a voltage regulator module (VRM).

[0022] In one embodiment, the conductive body includes a conductive post.

[0023] An embodiment of the present invention discloses an electronic module comprising: a circuit board, wherein a plurality of electronic devices are disposed on an upper surface of the circuit board; a power inductor is disposed on a lower surface of the circuit board; and a plurality of power supply pins and a plurality of signal pins are disposed on the lower surface of the circuit board, wherein the size of the power supply pins is larger than the size of the signal pins, and the power inductor is electrically connected to at least one of the plurality of power supply pins.

[0024] In one embodiment, a metal layer is electroplated on the upper surface of the first MOSFET and the upper surface of the second MOSFET to dissipate the heat generated by the first MOSFET and the second MOSFET.

[0025] To make the above and other features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings for detailed explanation. Attached Figure Description

[0026] Figure 1A A side view of an electronic module according to an embodiment of the present invention is shown.

[0027] Figure 1B A top view of an electronic module according to an embodiment of the present invention is shown.

[0028] Figure 1C A bottom view of an electronic module according to an embodiment of the present invention is shown.

[0029] Figure 2 A side view of an electronic module according to an embodiment of the present invention is shown.

[0030] Figure 3A A side view of an electronic module according to an embodiment of the present invention is shown.

[0031] Figure 3B A top view of an electronic module according to an embodiment of the present invention is shown.

[0032] Figure 3C A side view of an electronic module according to an embodiment of the present invention is shown.

[0033] Figure 4A A bottom view of an electronic module according to an embodiment of the present invention is shown.

[0034] Figure 4B A bottom view of an electronic module according to an embodiment of the present invention is shown.

[0035] Figure 4C A bottom view of an electronic module according to an embodiment of the present invention is shown.

[0036] Figure 5 A top view of an electronic module according to an embodiment of the present invention is shown.

[0037] Explanation of reference numerals in the attached figures: 100, 200, 300A, 300B - Electronic module; 113 - Circuit board; 101, 102, 103, 104 - Electronic device; 105 - Waveform pin; 105a - Groove; 105B - ​​Power pin; 106 - Inductor; 107 - Signal pin; 109A - First part of heat sink; 109B - Second part of heat sink; 111 - Motherboard; 114 - Heat sink; 115 - Package; 116 - First metal layer; 117 - Second metal layer; 120 - Connector plate; 133 - Leadframe pin; 140 - Connector plate; 150 - Connector; 160 - Heat sink. Detailed Implementation

[0038] Figure 1A A side view of an electronic module 100 according to an embodiment of the present invention is shown. The electronic module 100 includes: a circuit board 113, wherein a plurality of electronic devices 101, 102, 103, and 104 are disposed on the upper surface of the circuit board 113. The circuit board 113 includes a plurality of conductive patterns; an inductor 106 is disposed on the lower surface of the circuit board 113 and electrically connected to the conductive patterns of the circuit board 113; a plurality of waveform pins 105 are disposed below the lower surface of the circuit board 113 and electrically connected to the conductive patterns of the circuit board 113, wherein each waveform pin 105 includes at least one recess, such as a groove 105a, disposed on its lower surface, wherein the inductor 106 is electrically connected to the waveform pin 105 for connection to external circuitry, such as a motherboard. In one embodiment, the plurality of electronic devices include active elements. In another embodiment, the plurality of electronic devices include both active and passive elements.

[0039] In one embodiment, each waveform pin includes a conductive body and a plurality of grooves on the lower surface of the conductive body.

[0040] In one embodiment, each conductive body includes a conductive post.

[0041] In one embodiment, each conductive body includes a conductive post made of metal.

[0042] In one embodiment, each conductive body includes a copper pillar.

[0043] In one embodiment, the electronic module includes a voltage regulator module (VRM), and the inductor 106 is a power inductor for connection to a power source, wherein the power inductor can maintain a larger current flowing from the power supply.

[0044] In one embodiment, electronic module 100 is a voltage regulator module (VRM), and inductor 106 is a power inductor for connection to a power source, wherein the power inductor can maintain a larger current flowing from the power supply.

[0045] In one embodiment, circuit board 113 is a PCB.

[0046] In one embodiment, the circuit board 113 includes a metal substrate.

[0047] In one embodiment, the circuit board 113 includes a ceramic substrate.

[0048] In one embodiment, circuit board 113 includes a lead frame.

[0049] In one embodiment, the groove 105a has a semi-circular shape.

[0050] In one embodiment, the groove 105a has a semi-square shape.

[0051] In one embodiment, the plurality of electronic devices include a first MOSFET and a second MOSFET.

[0052] Figure 1B A top view of the electronic module 100 is shown. Figure 1C A bottom view of the electronic module 100 is shown. (As shown) Figure 1B and Figure 1C As shown, multiple signal pins 107 are disposed in a connection board 120, wherein the multiple signal pins 107 are electrically connected to a circuit board 113.

[0053] In one embodiment, the connection board 120 is a PCB.

[0054] In one embodiment, the connecting plate 120 includes a metal substrate.

[0055] In one embodiment, the connecting plate 120 includes a ceramic substrate.

[0056] In one embodiment, the connection plate 120 includes a wire frame.

[0057] In one embodiment, the circuit board 113 and the connector plate 120 are made of the same monolithic insulating substrate, so it is not necessary to have two separate circuit boards 113 and connector plates 120.

[0058] In one embodiment, the circuit board 113 and the connector 120 are made of the same monolithic metal substrate, so it is not necessary to have two separate circuit boards 113 and connector 120.

[0059] Figure 2A side view of an electronic module 200 according to an embodiment of the present invention is depicted, wherein a heat sink having a first portion 109A and a second portion 109B is disposed on a plurality of electronic devices 101, 102, 103, 104. In one embodiment, portions 109A and 109B are made of the same material and are integrally formed. In another embodiment, the first portion 109A and the second portion 109B are made of different materials, wherein the first portion 109A may be integrated with active elements 102, 103, or may be made of a material having a greater heat dissipation capacity than the second portion 109B. In one embodiment, a spacer 110 may be disposed between the second portion 109B of the heat sink and a motherboard 111.

[0060] Figure 3A A side view of an electronic module 300A according to an embodiment of the present invention is depicted, wherein a heat sink 114 made of metal is electroplated on the upper surfaces of a first MOSFET and a second MOSFET for dissipating heat generated by the first MOSFET and the second MOSFET.

[0061] In one embodiment, such as Figure 3A As shown, molding material is disposed on the upper surface of circuit board 113 to encapsulate multiple electronic devices 101, 102, 103, 104 and heat sink 114 to form package 115, wherein the upper surface of heat sink 114 protrudes from the package 115 for heat dissipation portion 114, as shown. Figure 3B As shown, Figure 3B A bottom view of the electronic module 300A is shown.

[0062] In one embodiment, the molded body 115 is made of EMC (epoxy molding compound).

[0063] Figure 3C A side view of an electronic module 300B according to an embodiment of the present invention is depicted, wherein a first metal layer 116 is electroplated on the upper surface of a first MOSFET and a second metal layer 117 is electroplated on the upper surface of the first MOSFET to dissipate heat generated by the first and second MOSFETs, wherein the first metal layer 116 and the second metal layer 117 are separated by a gap. In one embodiment, a molding material encapsulates a plurality of electronic devices 101, 102, 103, 104 to form a package 115. In one embodiment, the molding material encapsulates a plurality of electronic devices 101, 102, 103, 104 and extends into the gap. A package 115 is formed between the first metal layer 116 and the second metal layer 117.

[0064] In one embodiment, the upper surfaces of the first metal layer 116 and the second metal layer 117 are exposed from the package 115.

[0065] In one embodiment, refer to Figure 4A It depicts a bottom view of electronic modules 100, 200, 300A, and 300B when the power wave pin 105 is not used, as shown below. Figure 4A As shown, a plurality of power supply pins 105B and a plurality of signal pins 107 may be disposed on the lower surface of the circuit board 113, wherein each pin is electrically connected to the lower surface of the circuit board 113, wherein the power supply pins 105B have a larger size than the signal pins 107, and wherein the lower surface of each power supply pin 105B may have a flat surface.

[0066] In one embodiment, such as Figure 4A As shown, multiple power pins 105B and multiple signal pins 107 are fabricated by an insertion molding process to form an insertion molded connection board 140, wherein the multiple power pins 105B and multiple signal pins 107 are electrically connected to a circuit board 113.

[0067] In one embodiment, a plurality of pins 133 are made of a lead frame, wherein the plurality of pins 133 are electrically connected to a circuit board 113, such as Figure 4B As shown.

[0068] In one embodiment, a plurality of pins 133 are on connector 150, wherein the plurality of pins 133 are electrically connected to circuit board 113, such as Figure 4C As shown.

[0069] Figure 5 A top view of an electronic module according to an embodiment of the present invention is shown, wherein a heat sink 160 may be disposed on the package 115 to dissipate heat generated by the electronic module.

[0070] Although the present invention has been described with reference to the above embodiments, it will be apparent to those skilled in the art that modifications can be made to the described embodiments without departing from the spirit of the invention. Therefore, the scope of the invention is defined by the appended claims, not by the detailed description above.

Claims

1. An electronic module, characterized in that: include: a circuit board, wherein a plurality of electronic devices are disposed on an upper surface of the circuit board; an inductor disposed on a lower surface of the circuit board; as well as A plurality of waveform pins are arranged below the lower surface of the circuit board, wherein each waveform pin includes a conductive body and at least one recessed portion on a lower surface of the conductive body, wherein the inductor is electrically connected to at least one waveform pin among the plurality of waveform pins of the circuit board, wherein a first portion of the conductive body of a first waveform pin vertically extends from the upper surface of the conductive body of the first waveform pin to a first recessed portion on a lower surface of the conductive body of the first waveform pin, and a second portion of the conductive body of the first waveform pin vertically extends from the upper surface of the conductive body of the first waveform pin to a corresponding portion on the lower surface of the conductive body of the first waveform pin located on the side of the first recessed portion.

2. The electronic module according to claim 1, characterized in that: The inductor is a power inductor, wherein the power inductor is electrically connected to a power source.

3. The electronic module according to claim 1, characterized in that: The circuit board is a PCB.

4. The electronic module according to claim 1, characterized in that: The recessed portion has a semicircular shape.

5. The electronic module according to claim 1, characterized in that: The plurality of electronic devices include a first MOSFET and a second MOSFET.

6. The electronic module according to claim 1, characterized in that: The plurality of waveform pins and the plurality of signal pins are disposed on a connection board, wherein the plurality of waveform pins and the plurality of signal pins are electrically connected to the circuit board.

7. The electronic module according to claim 6, characterized in that: The connecting board is a PCB.

8. The electronic module according to claim 1, characterized in that: A heat sink is disposed above the plurality of electronic devices.

9. The electronic module according to claim 1, characterized in that: A continuous metal layer is electroplated on an upper surface of a first electronic device and an upper surface of a second electronic device to dissipate heat generated by the first electronic device and the second electronic device.

10. The electronic module according to claim 1, characterized in that: A first metal layer is electroplated on an upper surface of a first electronic device, and a second metal layer is electroplated on an upper surface of a second electronic device to dissipate heat generated by the first and second electronic devices, wherein the first and second metal layers are separated by a horizontal gap.

11. The electronic module according to claim 1, characterized in that: The plurality of waveform pins and the plurality of signal pins are formed by metal injection to form an insert-molded connection board, wherein the plurality of waveform pins and the plurality of signal pins are electrically connected to the circuit board.

12. The electronic module according to claim 1, characterized in that: The plurality of waveform pins and the plurality of signal pins are on a connector, wherein the plurality of waveform pins and the plurality of signal pins are electrically connected to the circuit board.

13. The electronic module according to claim 1, characterized in that: The plurality of waveform pins and the plurality of signal pins are made of a lead frame, wherein the plurality of waveform pins and the plurality of signal pins are electrically connected to the circuit board.

14. The electronic module according to claim 9, characterized in that: A package body is disposed on the upper surface of the circuit board to package the plurality of electronic devices and the continuous metal layer, wherein the upper surface of the continuous metal layer is exposed from the package body.

15. The electronic module according to claim 10, characterized in that: A package body is disposed on the upper surface of the circuit board to package the plurality of electronic devices and the first metal layer and the second metal layer, wherein the first metal layer and the second metal layer are exposed from the package body.

16. The electronic module according to claim 1, characterized in that: Each wave pin includes a conductive body and a plurality of recessed portions on a lower surface of the conductive body.

17. The electronic module according to claim 1, characterized in that: The electronic module is a voltage regulator module.

18. The electronic module according to claim 1, characterized in that: The conductive body includes a conductive column.

19. An electronic module, characterized in that: include: a circuit board, wherein a plurality of electronic devices are disposed on an upper surface of the circuit board; a power inductor, disposed on the lower surface of the circuit board; as well as A plurality of power pins and a plurality of signal pins are arranged below the lower surface of the circuit board, wherein the size of the power pin is larger than the size of the signal pin, and the power inductor is electrically connected to at least one power pin among the plurality of power pins, wherein a first power pin includes a conductive body and a first recessed portion located on the lower surface of the conductive body, wherein a first portion of the conductive body of the first power pin extends vertically from the upper surface of the conductive body of the first power pin to the first recessed portion on the lower surface of the conductive body of the first power pin, and a second portion of the conductive body of the first power pin extends vertically from the upper surface of the conductive body of the first power pin to a corresponding portion on the lower surface of the conductive body of the first power pin located on the side of the first recessed portion.

20. The electronic module according to claim 19, characterized in that A metal layer is electroplated on an upper surface of a first electronic device and an upper surface of a second electronic device to dissipate heat generated by the first electronic device and the second electronic device.

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