Optical device ceramic substrate patch positioning fixture and optical device packaging method

Abstract

The present invention discloses a positioning jig for optical device ceramic substrate patch, including a tube seat positioning member, a substrate limiting member and a substrate flattening member. The tube seat positioning member is provided with a plurality of placement grooves for placing optical devices. The substrate limiting member has a plurality of limiting parts, each limiting part corresponds to a placement groove, and the displacement of the ceramic substrate in the horizontal direction is limited by the substrate limiting member to control the position accuracy of the ceramic substrate patch. The substrate flattening member includes a plurality of abutting members, which apply a vertical force of the heat sink to the ceramic substrate, so that the ceramic substrate is close to the heat sink, with a simple structure and low cost. In addition, the present invention also discloses an optical device packaging method, which realizes the positioning of the optical device and the precise control of the position of the ceramic substrate patch through a positioning jig; by placing the positioning jig on an existing glue dispensing machine for glue dispensing, and then heating the positioning jig through a heating device to melt the gold-tin solder paste, the eutectic welding of the high-frequency signal pin and the high-frequency signal line is completed, and the operation is simple.

Description

Technical Field

[0001] The present invention relates to the technical field of high-speed optical device packaging, and in particular to an optical device ceramic substrate patch positioning fixture and an optical device packaging method. Background Art

[0002] 25G and 50G optical modules are used in 5G optical communication networks. Due to the high transmission rate of lasers, ultra-low signal insertion loss and reflection are required in the entire transmission link to ensure signal integrity. In traditional 10G and below optical device packaging, the high-frequency signal lines 2031', 2032' on the ceramic substrate 203' are electrically connected to the high-frequency signal pins 204', 205' on the TO56 socket 201' by gold wire (e.g. Figure 1 This method has the problems of large parasitic inductance and impedance mismatch. When applied to high-speed signal transmission, the reflection and insertion loss will be very large, which will lead to a reduction in the bandwidth of the optical device module, ultimately affecting the performance of the optical device module and shortening the transmission distance.

[0003] In order to solve the problems of high-frequency signal transmission loss and large reflection of optical devices in the prior art, the high-frequency signal line on the ceramic substrate must be soldered to the high-frequency signal pin on the TO56 tube holder using gold-tin solder, and at the same time, it is necessary to ensure that the high-frequency signal pin is in the center of the high-frequency signal line on the ceramic substrate (such as Figure 2 As shown), the integrity of its high frequency signal is ensured.

[0004] Since the ceramic substrate of the optical device is electrically connected to the high-frequency signal pins on the TO56 socket using gold-tin solder, this structure determines that the traditional eutectic chip mounter cannot be used to implement the chip mounting action in the packaging chip mounting process. Therefore, special equipment is specially designed in the prior art to perform eutectic welding, which is expensive and complex in process. Summary of the invention

[0005] The object of the present invention is to provide an optical device ceramic substrate patch positioning jig with a simple structure and high ceramic substrate patch position accuracy.

[0006] Another object of the present invention is to provide an optical device packaging method with simple operation and high efficiency.

[0007] In order to achieve one of the above-mentioned purposes, the present invention provides a positioning fixture for a ceramic substrate patch of an optical device, wherein the optical device includes a tube seat, a heat sink arranged on the tube seat, a ceramic substrate, and a plurality of pins inserted into the tube seat. The positioning fixture includes a tube seat positioning member, a substrate limiting member, and a substrate flattening member. The tube seat positioning member is provided with a plurality of placement grooves, each of which is used to place an optical device. The substrate limiting member has a plurality of limiting parts, each of which corresponds to a placement groove, and the limiting part is used to limit the displacement of the ceramic substrate in the horizontal direction so that the back of the ceramic substrate is attached to a preset position of the heat sink. The substrate flattening member includes a plurality of abutting members, each of which is opposite to a placement groove, and the abutting members are used to apply a force perpendicular to the heat sink to the ceramic substrate so that the ceramic substrate is close to the heat sink.

[0008] Compared with the prior art, the present invention positions the optical device through the tube seat positioning part, limits the horizontal displacement of the ceramic substrate through the substrate limiter, can control the position accuracy of the ceramic substrate patch, and applies a vertical force to the ceramic substrate through the substrate flattening part, so that the ceramic substrate is close to the heat sink, and then the ceramic substrate can be accurately and firmly attached to the heat sink. The present invention has a simple structure and low cost, and can achieve mass production and rapid replication. In addition, when it is necessary to apply gold-tin solder paste between the high-frequency signal pin and the high-frequency signal line of the ceramic substrate, the present invention can be placed on an existing glue dispensing machine for glue dispensing, and after the glue dispensing is completed, the positioning fixture is heated by a heating device to melt the gold-tin solder paste, and the eutectic welding of the high-frequency signal pin and the high-frequency signal line of the ceramic substrate can be completed. The operation is simple, which is conducive to improving production efficiency and has low production cost.

[0009] Preferably, the plurality of placement grooves are located on the same straight line, the plurality of abutting members are located on the same straight line, and the plurality of limiting portions are located on the same straight line.

[0010] Preferably, the substrate limiting member is horizontally arranged on the upper surface of the tube seat positioning member.

[0011] Preferably, the substrate limiting member and the tube seat positioning member are separately arranged.

[0012] Preferably, the limiting portion is an arc-shaped limiting groove penetrating the upper and lower surfaces of the substrate limiting member, and the side wall of the limiting portion can contact the ceramic substrate to limit the displacement of the ceramic substrate in the horizontal direction.

[0013] Preferably, the placement groove includes a first placement groove for positioning the tube seat and a second placement groove for accommodating the tube pin, the first placement groove and the second placement groove are opposite to each other and connected in vertical direction; the plurality of abutment members are installed on a base body, and the base body is provided with a plurality of accommodating grooves on one side close to the tube seat positioning member, each of the accommodating grooves includes a first accommodating groove adapted to the tube seat and a second accommodating groove for accommodating the tube pin, the first accommodating groove and the second accommodating groove are opposite to each other and connected in vertical direction, each of the first accommodating grooves is opposite to one of the first placement grooves, and each of the second placement grooves is opposite to one of the second placement grooves for the tube pin.

[0014] Preferably, the seat body is provided with a plurality of mounting holes, and each of the abutting members is respectively inserted and fixed in one of the mounting holes.

[0015] Preferably, the plurality of abutting members are mounted on a base, the abutting members include a first abutting top portion and a second abutting top portion, the first abutting top portion is fixed to the base, the first abutting top portion is provided with a through hole penetrating a side thereof away from the base, a spring is provided in the through hole, the second abutting top portion is passed through the through hole and one end thereof abuts against the spring, and the other end extends out of the through hole, the second abutting top portion can move in the through hole to adjust the length of the abutting top portion extending out of the first abutting top portion.

[0016] Preferably, the plurality of abutting members are mounted on a seat body, and an upper surface of the seat body is flush with an upper surface of the tube seat positioning member.

[0017] In order to achieve the second objective above, the present invention provides an optical device packaging method, wherein the optical device comprises a tube holder, a heat sink disposed on the tube holder, a ceramic substrate, and a plurality of pins inserted into the tube holder, and a high-frequency signal line disposed in two gaps is disposed on the front side of the ceramic substrate. The optical device packaging method comprises:

[0018] A positioning fixture is provided, the positioning fixture comprising a tube seat positioning member, a substrate limiting member and a substrate flattening member, the tube seat positioning member is provided with a plurality of placement grooves, each of the placement grooves is used to place an optical device, the substrate limiting member has a plurality of limiting parts, each of the limiting parts corresponds to a placement groove, and the substrate flattening member comprises a plurality of abutting members;

[0019] Placing a plurality of optical devices in the placement slots respectively;

[0020] Placing the ceramic substrate in front of the heat sink of each optical device, and limiting the offset of the ceramic substrate in the horizontal direction by the limiting part, so that the back side of the ceramic substrate is attached to the preset position of the heat sink;

[0021] The substrate flattening member is mounted on the tube seat positioning member, and a force perpendicular to the heat sink is applied to the ceramic substrate through the abutting member so that the ceramic substrate is closely attached to the heat sink;

[0022] Place the positioning fixture equipped with the optical device on the operating table of the dispensing machine, and use the dispensing machine to apply gold-tin solder paste to the gap between the high-frequency signal pin and the high-frequency signal line of the ceramic substrate;

[0023] The positioning fixture of the optical device with the gold-tin solder paste is heated to melt the gold-tin solder paste to complete the eutectic welding of the high-frequency signal pin and the high-frequency signal line.

[0024] Compared with the prior art, the present invention realizes the positioning of the optical device and the precise control of the position of the patch of the ceramic substrate through a positioning jig, has a simple structure, low cost, and can realize mass production and rapid replication; by placing the positioning jig equipped with the optical device on an existing dispensing machine for dispensing, and then heating the positioning jig by a heating device to melt the gold-tin solder paste, the eutectic welding of the high-frequency signal pin and the high-frequency signal line of the ceramic substrate can be completed, the operation is simple, which is conducive to improving production efficiency and has low production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of an optical device in the prior art.

[0026] Figure 2 Schematic diagram of an optical device according to an embodiment of the present invention.

[0027] Figure 3 It is a schematic diagram of the three-dimensional structure of the optical device ceramic substrate patch positioning fixture according to an embodiment of the present invention.

[0028] Figure 4 yes Figure 3 Top view of the .

[0029] Figure 5 yes Figure 3 Exploded view of the positioning fixture shown.

[0030] Figure 6 yes Figure 3 A further exploded view of the positioning fixture shown.

[0031] Figure 7 yes Figure 6 Another angle of .

[0032] Figure 8 It is a schematic diagram after the positioning fixture of the present invention is used to apply gold-tin solder paste on the packaging points.

[0033] Fig. 9 It is a schematic diagram of the packaging during heating using the positioning fixture of the present invention. DETAILED DESCRIPTION

[0034] In order to explain the technical content, structural features and achieved effects of the present invention in detail, the following is a detailed description in conjunction with the implementation methods and the accompanying drawings.

[0035] In the description of the present invention, it is necessary to understand that the orientations or positional relationships indicated by terms such as “upper”, “lower”, “bottom”, “top”, “inside”, “outside”, “front”, “back”, “horizontal” and “vertical” are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and therefore cannot be understood as limiting the protection content of the present invention.

[0036] The present invention discloses an optical device ceramic substrate patch positioning fixture 100 for positioning an optical device 200 to facilitate eutectic welding between high-frequency signal lines 2031, 2032 on a ceramic substrate 203 and high-frequency signal pins 204, 205 on a socket 201. Figure 2 FIG. 2 shows a schematic diagram of the optical device 200 after eutectic welding of the high-frequency signal lines 2031 and 2032 and the high-frequency signal pins 204 and 205 on the tube base 201 and mounting of the laser chip 206. Figure 2 As shown, the optical device 200 includes a tube seat 201, a heat sink 202 arranged on the upper surface of the tube seat 201, a ceramic substrate 203 attached to the front side of the heat sink 202, and a plurality of pins inserted into the tube seat 201. The front side of the ceramic substrate 203 has two high-frequency signal lines 2031 and 2032, and there is a gap between the two high-frequency signal lines 2031 and 2032. A laser chip 206 is attached to the upper part of one of the high-frequency signal lines 2032. The bottom surface (negative pole) of the laser chip 206 is electrically connected to the high-frequency signal line 2032, and the top surface (positive pole) of the laser chip 206 is electrically connected to the other high-frequency signal line 2031. The lower parts of the two high-frequency signal lines 2031 and 2032 are eutectic welded to the two high-frequency signal pins 204 and 205 respectively.

[0037] See also Figures 3 to 7The positioning fixture 100 includes a tube seat positioning member 1, a substrate stopper 2 and a substrate flattening member 3. The tube seat positioning member 1 is provided with a plurality of placement grooves 11, each of which is used to place an optical device 200. The substrate stopper 2 has a plurality of stopper portions 21, each of which corresponds to a placement groove 11. The stopper portions 21 are used to limit the horizontal displacement of the ceramic substrate 203, so that the ceramic substrate 203 is attached to the preset position of the heat sink 202, so as to avoid the laser chip 206 being attached to the gap between the two high-frequency signal lines 2031 and 2032 in the subsequent process due to the position deviation of the ceramic substrate 203, thereby causing the laser chip 206 to short-circuit. The substrate flattening member 3 includes a seat body 31 and a plurality of abutting members 32 installed on the seat body 31, each of which is opposite to a placement groove 11, and the abutting members 32 are used to apply a force perpendicular to the heat sink 202 to the ceramic substrate 203 so that the ceramic substrate 203 is attached to the heat sink 202. Among them, a plurality of placement grooves 11 are located on the same straight line, a plurality of abutting members 32 are located on the same straight line, and a plurality of limiting portions 21 are located on the same straight line, so as to facilitate subsequent dispensing through an automated process.

[0038] The present invention positions the optical device 200 through the tube seat positioning member 1, limits the offset of the ceramic substrate 203 in the horizontal direction through the substrate limiting member 2, can control the patch position accuracy of the ceramic substrate 203, and applies a force perpendicular to the heat sink 202 to the ceramic substrate 203 through the substrate flattening member 3, so that the ceramic substrate 203 is closely attached to the heat sink 202, and then the ceramic substrate 203 can be accurately and firmly attached to the heat sink 202. The present invention has a simple structure and low cost, and can achieve mass production and rapid replication. In addition, when it is necessary to apply gold-tin solder paste between the high-frequency signal pins 204 and 205 and the high-frequency signal lines 2031 and 2032 of the ceramic substrate 203, the present invention can be placed on an existing glue dispenser for glue dispensing, and after the glue dispensing is completed, the positioning fixture 100 is heated by a heating device to melt the gold-tin solder paste, so that the high-frequency signal pins 204 and 205 and the high-frequency signal lines 2031 and 2032 of the ceramic substrate 203 can be eutectic welded, which is simple to operate, is conducive to improving production efficiency, and has low production cost.

[0039] like Figure 5 , Figure 6 As shown, the substrate stopper 2 is horizontally arranged on the upper surface of the tube seat positioning member 1, and the stopper portion 21 is located above the placement groove 11. The substrate stopper 2 and the tube seat positioning member 1 are separately arranged, whereby before placing the optical device 200 in the placement groove 11 or removing the optical device 200 from the placement groove 11, the substrate stopper 2 can be removed from the tube seat positioning member 1, which facilitates the placement and removal of the optical device 200. Of course, the substrate stopper 2 and the tube seat positioning member 1 can also be arranged in one piece, so it should not be limited to this. Figure 4 , Figure 6In the illustrated embodiment, the limiting portion 21 is an arc-shaped limiting groove penetrating the upper and lower surfaces of the substrate limiting member 2. The side wall of the limiting portion 21 can contact the ceramic substrate 203 to limit the ceramic substrate 203 in the arc-shaped limiting groove. The structure is simple and easy to implement.

[0040] like Figure 5 , Figure 6 As shown, the placement groove 11 includes a first placement groove 111 and a second placement groove 112. The first placement groove 111 and the second placement groove 112 are opposite to each other and connected. The first placement groove 111 is used to position the tube seat 201. The inner wall of the first placement groove 111 is adapted to the outer peripheral shape of the tube seat 201 of the optical device 200; the second placement groove 112 is used to accommodate the pin. Furthermore, an alignment boss 12 is provided on the tube seat positioning member 1. One side of the alignment boss 12 is exposed in the first placement groove 111. The alignment boss 12 is adapted to the alignment groove 2010 on the tube seat 201. When the optical device 200 is placed in the placement groove 11, the alignment boss 12 is embedded in the alignment groove 2010, thereby realizing the precise positioning of the tube seat 201. Figure 7 As shown, in this embodiment, a plurality of accommodating grooves 310 are provided on one side of the seat body 31 close to the tube seat positioning member 1, each accommodating groove 310 includes a first accommodating groove 311 adapted to the tube seat 201 and a second accommodating groove 312 for accommodating a tube pin, and the first accommodating groove 311 and the second accommodating groove 312 are opposite to each other and connected to each other. Each first accommodating groove 311 is opposite to a first placement groove 111, and the tube seat 201 is positioned through the first placement groove 111 and the first accommodating groove 311. Each second placement groove 112 is opposite to a second placement groove 112 for a tube pin, and the tube pin is accommodated through the second placement groove 112 and the second accommodating groove 312.

[0041] like Figure 5 As shown, the upper surface of the seat body 31 is flush with the upper surface of the tube seat positioning member 1, and the structure is neat and beautiful. The seat body 31 is provided with a plurality of mounting holes, and each abutting member 32 is respectively inserted and fixed in one mounting hole. Specifically, the abutting member 32 includes a first abutting top portion 321 and a second abutting top portion 322. The first abutting top portion 321 is inserted and fixed in the seat body 31. The first abutting top portion 321 is provided with a through hole (not shown) penetrating the side away from the seat body 31. A spring (not shown) is provided in the through hole. The second abutting top portion 322 is passed through the through hole and one end thereof abuts against the spring, and the other end extends out of the through hole. The second abutting top portion 322 can move in the through hole to adjust the length of the extension of the first abutting top portion (such as Fig. 9 With this design, the pressure exerted by the abutting member 32 on the ceramic substrate 203 is adjusted.

[0042] Another embodiment of the present invention discloses an optical device packaging method, wherein the optical device 200 includes a tube seat 201, a heat sink 202 disposed on the tube seat 201, a ceramic substrate 203, and a plurality of pins inserted into the tube seat 201, and the front side of the ceramic substrate 203 is provided with two high-frequency signal lines 2031 and 2032 (such as Figure 2 The optical device packaging method includes:

[0043] A positioning fixture 100 is provided, the positioning fixture 100 includes a tube seat positioning member 1, a substrate stopper 2 and a substrate flattening member 3, the tube seat positioning member 1 is provided with a plurality of placement grooves 11, each placement groove 11 is used to place an optical device 200, the substrate stopper 2 has a plurality of stopper portions 21, each stopper portion 21 corresponds to a placement groove 11, and the substrate flattening member 3 includes a plurality of abutting members 32 (see Figures 3 to 7 ).

[0044] A plurality of optical devices 200 are placed in the placement grooves 11 respectively.

[0045] The ceramic substrate 203 is placed in front of the heat sink 202 of each optical device 200, and the displacement of the ceramic substrate 203 in the horizontal direction is limited by the limiting part 21, so that the back of the ceramic substrate 203 is attached to the preset position of the heat sink 202. In this embodiment, the limiting part 21 ensures that the displacement of the patch position of the ceramic substrate 203 is within ±30um.

[0046] The substrate flattening member 3 is loaded on the tube seat positioning member 1 , and a force perpendicular to the heat sink 202 is applied to the ceramic substrate 203 through the abutting member 32 , so that the ceramic substrate 203 is closely attached to the heat sink 202 .

[0047] The positioning fixture 100 with the optical device 200 is placed on the operating table of the glue dispenser, and the gap between the high-frequency signal pins 204 and 205 and the high-frequency signal lines 2031 and 2032 of the ceramic substrate 203 is dotted with gold-tin solder paste 300 (such as Figure 8 shown).

[0048] The positioning fixture 100 of the optical device 200 with the gold-tin solder paste is heated to melt the gold-tin solder paste 300 to complete the eutectic welding of the high-frequency signal pins 204, 205 and the high-frequency signal lines 2031, 2032 of the ceramic substrate 203. Specifically, the eutectic welding can be achieved in the following three ways: First, the positioning fixture 100 of the optical device 200 with the gold-tin solder paste is placed in a vacuum reflow furnace, and the temperature is set to the melting point of the gold-tin solder paste. After the temperature rises to the melting point, the welding of the high-frequency signal pins 204, 205 and the high-frequency signal lines 2031, 2032 of the ceramic substrate 203 can be completed. 2. Place the positioning jig 100 of the optical device 200 with the gold-tin solder paste dotted on it onto a high-temperature heating table. The temperature of the high-temperature heating table is pre-set to be 80°C to 100°C higher than the melting point of the gold-tin solder paste. The temperature of the high-temperature heating table is quickly transferred to the ceramic substrate 203 and the high-frequency signal pins 204 and 205. When the melting point of the gold-tin solder paste is reached, welding is completed. 3. Place the positioning jig 100 of the optical device 200 with the gold-tin solder paste dotted on it under the titanium alloy pressure head 400 of the pulse hot pressing welding machine. Select the pre-set temperature curve, turn on the switch, press the pressure head 400 downward, and fully attach it to the top of the heat sink 202. The heat is quickly transferred to the ceramic substrate 203 and the high-frequency signal pins 204 and 205. When the melting point of the gold-tin solder paste is reached, eutectic welding is completed (such as Fig. 9 shown).

[0049] The present invention realizes the positioning of the optical device 200 and the precise control of the patch position of the ceramic substrate 203 through a positioning fixture 100, which has a simple structure and low cost, and can realize mass production and rapid replication; by placing the positioning fixture 100 equipped with the optical device 200 on an existing dispensing machine for dispensing, and then heating the positioning fixture 100 through a heating device to melt the gold-tin solder paste, the eutectic welding of the high-frequency signal pins 204 and 205 and the high-frequency signal lines 2031 and 2032 of the ceramic substrate 203 can be completed, which is simple to operate, is conducive to improving production efficiency, and has low production cost. Among them, the specific structure of the positioning fixture 100 is as described in the previous embodiment, and will not be repeated here.

[0050] The above disclosure is only a preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.

Claims

1. A positioning fixture for a ceramic substrate patch of an optical device, wherein the optical device comprises a tube seat, a heat sink arranged on the tube seat, a ceramic substrate and a plurality of high-frequency signal pins inserted in the tube seat, and the front side of the ceramic substrate is provided with high-frequency signal lines arranged in two gaps. The positioning fixture equipped with the optical device is placed on the operating table of a dispensing machine, and the dispensing machine is used to apply gold-tin solder paste to the gap between the high-frequency signal pin and the high-frequency signal line of the ceramic substrate, and the positioning fixture of the optical device equipped with the gold-tin solder paste is heated to melt the gold-tin solder paste to complete the eutectic welding of the high-frequency signal pin and the high-frequency signal line, characterized in that: The positioning fixture includes a tube seat positioning member, a substrate limiting member and a substrate flattening member, the tube seat positioning member is provided with a plurality of placement grooves, each of the placement grooves is used to place one of the optical devices, the substrate limiting member has a plurality of limiting parts, each of the limiting parts corresponds to one of the placement grooves, the limiting parts are used to limit the displacement of the ceramic substrate in the horizontal direction, so that the ceramic substrate is attached to a preset position of the heat sink, the substrate flattening member includes a plurality of abutting members, the plurality of abutting members are respectively opposite to one of the placement grooves, and the abutting members are used to apply a force perpendicular to the heat sink to the ceramic substrate so that the ceramic substrate is attached to the heat sink; The substrate limiting member is horizontally arranged on the upper surface of the tube seat positioning member; The limiting portion is an arc-shaped limiting groove that passes through the upper and lower surfaces of the substrate limiting member, and the side wall of the limiting portion can contact the ceramic substrate to limit the displacement of the ceramic substrate in the horizontal direction; The placement groove includes a first placement groove for positioning the tube seat and a second placement groove for accommodating the tube pin, the first placement groove and the second placement groove are opposite to each other and connected in vertical direction; the plurality of abutting members are installed on a seat body, and the seat body is provided with a plurality of accommodating grooves on one side close to the tube seat positioning member, each of the accommodating grooves includes a first accommodating groove adapted to the tube seat and a second accommodating groove for accommodating the tube pin, the first accommodating groove and the second accommodating groove are opposite to each other and connected in vertical direction, each of the first accommodating grooves is opposite to one of the first placement grooves, and each of the second accommodating grooves is opposite to one of the second placement grooves.

2. The positioning fixture according to claim 1, characterized in that: The plurality of placement grooves are located on the same straight line, the plurality of abutting members are located on the same straight line, and the plurality of limiting portions are located on the same straight line.

3. The positioning fixture according to claim 1, characterized in that: The substrate limiting member and the tube seat positioning member are separately arranged.

4. The positioning fixture according to claim 1, characterized in that: The seat body is provided with a plurality of mounting holes, and each of the abutting members is respectively inserted and fixed in one of the mounting holes.

5. The positioning fixture according to claim 1 or 2, characterized in that: The plurality of abutting members are mounted on a base, and the abutting members include a first abutting top and a second abutting top. The first abutting top is fixed to the base, a through hole is formed in the first abutting top and passes through a side thereof away from the base, a spring is provided in the through hole, the second abutting top is passed through the through hole and one end of the second abutting top abuts against the spring, and the other end extends out of the through hole, and the second abutting top can move in the through hole to adjust the length of the abutting top extending out of the first abutting top.

6. The positioning fixture according to claim 1 or 2, characterized in that: The plurality of abutting members are mounted on a seat body, and the upper surface of the seat body is flush with the upper surface of the tube seat positioning member.

7. A method for packaging an optical device, the optical device comprising a tube holder, a heat sink disposed on the tube holder, a ceramic substrate, and a plurality of high-frequency signal pins inserted into the tube holder, the front side of the ceramic substrate being provided with two high-frequency signal lines disposed in gaps, characterized in that: The optical device packaging method comprises: A positioning fixture is provided, the positioning fixture comprising a tube seat positioning member, a substrate limiting member and a substrate flattening member, the tube seat positioning member is provided with a plurality of placement grooves, each of the placement grooves is used to place an optical device, the substrate limiting member has a plurality of limiting parts, each of the limiting parts corresponds to a placement groove, and the substrate flattening member comprises a plurality of abutting members; Placing a plurality of optical devices in the placement slots respectively; Placing the ceramic substrate in front of the heat sink of each optical device, and limiting the offset of the ceramic substrate in the horizontal direction by the limiting part, so that the back side of the ceramic substrate is attached to the preset position of the heat sink; The substrate flattening member is mounted on the tube seat positioning member, and a force perpendicular to the heat sink is applied to the ceramic substrate through the abutting member so that the ceramic substrate is closely attached to the heat sink; Place the positioning fixture equipped with the optical device on the operating table of the dispensing machine, and use the dispensing machine to apply gold-tin solder paste to the gap between the high-frequency signal pin and the high-frequency signal line of the ceramic substrate; The positioning fixture of the optical device with the gold-tin solder paste is heated to melt the gold-tin solder paste to complete the eutectic welding of the high-frequency signal pin and the high-frequency signal line; The substrate limiting member is horizontally arranged on the upper surface of the tube seat positioning member; The limiting portion is an arc-shaped limiting groove that passes through the upper and lower surfaces of the substrate limiting member, and the side wall of the limiting portion can contact the ceramic substrate to limit the displacement of the ceramic substrate in the horizontal direction; The placement groove includes a first placement groove for positioning the tube seat and a second placement groove for accommodating the tube pin, the first placement groove and the second placement groove are opposite to each other and connected in vertical direction; the plurality of abutting members are installed on a seat body, and the seat body is provided with a plurality of accommodating grooves on one side close to the tube seat positioning member, each of the accommodating grooves includes a first accommodating groove adapted to the tube seat and a second accommodating groove for accommodating the tube pin, the first accommodating groove and the second accommodating groove are opposite to each other and connected in vertical direction, each of the first accommodating grooves is opposite to one of the first placement grooves, and each of the second placement grooves is opposite to one of the second placement grooves.

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