A plasma surface cleaning device

Abstract

The present invention is a plasma surface cleaning device, comprising a main body, one side of the main body is provided with a vacuum pump group, two ends of the main body are also provided with an inert gas box and an active gas box, one side of the inert gas box and the active gas box are respectively provided with a high-voltage power supply and an electric control box, the inert gas box and the active gas box are communicated with the main body through a pipeline, the interior of the main body is hollow to form a cavity, and in the present invention, graphite is used as an electrode to ionize the active gas and the inert gas, and the graphite electrode reacts with the active gas to generate gas, which will not cause residue on the surface of the semiconductor to be cleaned; the cleaned parts enter different atmospheres in a rotating manner for cleaning, which greatly improves the cleaning effect, and the structure is simple and easy to use; the cleaned parts can be rotated, so that different positions of the cleaned parts can face the plasma directly, ensuring that the surface of the parts is cleaned.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor cleaning, and in particular to a plasma surface cleaning device. Background Art

[0002] Plasma is a state of matter. Usually, matter exists in three states: solid, liquid and gas. However, in some special cases, there is a fourth state, such as matter in the ionosphere in the earth's atmosphere. The following substances exist in the plasma state: electrons in high-speed motion; neutral atoms, molecules, and atomic groups (free radicals) in an activated state; ionized atoms and molecules; unreacted molecules and atoms, etc. However, the matter generally remains electrically neutral. In a vacuum chamber, a high-energy disordered plasma is generated by ignition of a radio frequency power supply under a certain pressure, and the surface of the product to be cleaned is bombarded by the plasma to achieve the cleaning purpose.

[0003] Existing plasma surface cleaning devices mostly use metal electrodes. When the metal electrodes ionize the active gas, they easily react with the active gas. The oxides after the reaction cause residues on the surface of the product, and the cleaning is continuously performed at a fixed position, which cannot fully clean the cleaned parts. Summary of the invention

[0004] In view of this, the present invention aims to propose a plasma surface cleaning device to solve the problem that the existing plasma surface cleaning devices mostly use metal electrodes. When the metal electrodes ionize the active gas, they are easy to react with the active gas. The oxides after the reaction cause residues on the semiconductor surface, and the fixed position is continuously cleaned, and the cleaned parts cannot be fully cleaned.

[0005] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0006] A plasma surface cleaning device comprises a main body, wherein the interior of the main body is hollow to form a cavity, an isolation plate is arranged inside the cavity for isolating the cavity into two parts, a rotating frame is arranged in the cavity, a graphite electrode is arranged in the cavity, the graphite electrode is electrically connected to a high-voltage power supply, the main body is respectively connected to a vacuum pump group, an active gas box, and an inert gas box through pipelines, an electric control box is arranged on one side of the main body, and the electric control box is respectively electrically connected to the vacuum pump group, the active gas box, and the inert gas box.

[0007] Furthermore, there are two graphite electrodes, which are respectively arranged on both sides of the cavity.

[0008] Furthermore, the gas outlets of the active gas box and the inert gas box face the graphite electrode.

[0009] Furthermore, solenoid valves are provided on the pipelines connecting the active gas box, the inert gas box and the main body, and the solenoid valves are electrically connected to the electric control box.

[0010] Furthermore, the rotating frame is connected to the rotating motor via a shaft, a sealing plate is arranged above the rotating frame, a hole is opened on the sealing plate, and the shaft of the rotating frame is connected to the rotating motor via the hole.

[0011] Furthermore, a plurality of adhesive stickers are arranged on the rotating frame.

[0012] Furthermore, a flexible joint is provided at the end of the isolation plate, and the flexible joint is in contact with and connected to the rotating frame.

[0013] Furthermore, there are two vacuum pump groups, which are connected to the cavities on both sides of the isolation plate through pipelines.

[0014] Compared with the prior art, the plasma surface cleaning device described in the present invention has the following advantages:

[0015] 1. Use graphite as an electrode to ionize active gas and inert gas. The graphite electrode reacts with the active gas to generate gas, which will not cause residue on the surface of the cleaned semiconductor;

[0016] 2. The cleaned parts enter different atmospheres for cleaning in a rotating manner, which greatly improves the cleaning effect. It has a simple structure and is easy to use.

[0017] 3. The cleaned parts can be rotated, so that different positions of the cleaned parts can face the plasma directly, ensuring that the surface of the parts is cleaned. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings of the embodiments of the present invention, wherein the drawings are only used to illustrate some embodiments of the present invention, but not to limit all embodiments of the present invention thereto.

[0019] Figure 1 It is a schematic diagram of the first structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the main body structure of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of the isolation plate of the present invention;

[0022] Figure 4 It is a schematic diagram of the material distribution state of the present invention;

[0023] Figure 5 is a schematic diagram of the cleaning system of the present invention;

[0024] Figure 6 Schematic diagram of ion distribution area in the cleaning system.

[0025] Reference numerals:

[0026] 1. Main body; 2. Cavity; 3. Vacuum pump group; 4. Isolation plate; 5. Flexible joint; 6. Rotating frame; 601, Adhesive patch; 7. Graphite electrode; 8. Inert gas box; 9. Solenoid valve; 10. Vacuum detector; 11. High voltage power supply; 12. Active gas box; 13. Electric control box; 14. Rotating motor; 15. Sealing plate. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0028] Embodiment 1:

[0029] See attached Figure 1 A plasma surface cleaning device comprises a main body 1, wherein the main body 1 is hollow inside to form a cavity 2, wherein an isolation plate 4 is arranged inside the cavity 2 for isolating the cavity 2 into two parts, wherein a rotating frame 6 is arranged in the cavity 2, wherein a graphite electrode 7 is arranged in the cavity 2, wherein the graphite electrode 7 is electrically connected to a high-voltage power supply 11, wherein the main body 1 is respectively connected to a vacuum pump group 3, an active gas box 12, and an inert gas box 8 through pipelines, wherein an electric control box 13 is arranged on one side of the main body 1, wherein the electric control box 13 is respectively electrically connected to the vacuum pump group 3, the active gas box 12, and the inert gas box 8.

[0030] Specifically, the main body 1 is cylindrical as a whole, and the cavity 2 is opened inside the main body 1. The isolation plate 4 divides the atmosphere of the cavity 2 into two parts. The two cavities 2 are connected to the vacuum pump group 3 through pipelines, one of the cavities 2 is connected to the active gas box 12 through a pipeline, and the other cavity 2 is connected to the inert gas box 8. The two cavities 2 are provided with the graphite electrode 7, and the graphite electrode 7 is connected to the high-voltage power supply 11. The high-voltage power supply 11 supplies power to the graphite electrode 7, and the inert gas and the active gas introduced into the cavity 2 from the inert gas box 8 and the active gas box 12 are ionized. The graphite electrode 7 is used to ionize the inert gas and the active gas to generate gas, and no solid residue is generated, and no residue is caused on the surface of the cleaned parts. The rotating frame 6 fixes the cleaned parts and rotates with the rotating frame 6, so that each part of the parts can face the plasma directly, thereby improving the surface cleanliness of the cleaned parts. The vacuum pump group 3 evacuates the cavity 2.

[0031] Preferably, there are two graphite electrodes 7 , which are respectively arranged on both sides of the cavity 2 , and the two graphite electrodes 7 ionize the inert gas and the active gas introduced into the cavity 2 by the inert gas box 8 and the active gas box 12 , respectively.

[0032] Preferably, the gas outlets of the active gas box 12 and the inert gas box 8 face the graphite electrode 7, and the active gas and the inert gas in the active gas box 12 and the inert gas box 8 directly contact the graphite electrode 7 after coming out, so that the graphite electrode 7 can ionize the active gas and the inert gas.

[0033] Preferably, solenoid valves 9 are provided on the pipes connecting the active gas box 12 and the inert gas box 8 to the main body 1, and the solenoid valves 9 are electrically connected to the electric control box 13. The solenoid valves 9 are controlled by the electric control box 13 to control the opening and closing of the active gas box 12 and the inert gas box 8, and at the same time, the amounts of active gas and inert gas entering the active gas box 12 and the inert gas box 8 and passing into the cavity 2 are controlled.

[0034] Preferably, see the attached Figure 2 The rotating frame 6 is connected to the rotating motor 14 through an axis, a sealing plate 15 is arranged above the rotating frame 6, a hole is opened on the sealing plate 15, the axis of the rotating frame 6 is connected to the rotating motor 14 through the hole, the rotating motor 14 provides power for the rotating frame 6 to work, the sealing plate 15 isolates the rotating motor 14 to put the rotating frame 6 in a closed state, and the axis of the rotating frame 6 is connected to the rotating motor 14 through the hole.

[0035] Embodiment 2:

[0036] On the basis of the first embodiment, the plasma surface cleaning device of the first embodiment is further optimized:

[0037] The rotating frame 6 is provided with a plurality of adhesive stickers 601 .

[0038] Specifically, the cleaned parts are fixed by the adhesive patch 601 so that the cleaned parts rotate along with the rotation of the rotating frame 6 .

[0039] Preferably, see the attached Figure 3 A flexible joint 5 is provided at the end of the isolation plate 4, and the flexible joint 5 is in contact with the rotating frame 6. The cavity 2 is isolated by the isolation plate 4 and the flexible joint 5. When the rotating frame 6 rotates, the cleaned parts are rotated out from the flexible joint 5 without affecting the sealing effect of the flexible joint 5 and the isolation plate 4.

[0040] Preferably, the curvature of the flexible joint 5 on the side close to the rotating frame 6 is the same as the curvature of the rotating frame 6 , so that the flexible joint 5 and the rotating frame 6 are in closer contact.

[0041] Embodiment three:

[0042] On the basis of the first embodiment, the plasma surface cleaning device of the first embodiment is further optimized:

[0043] There are two vacuum pump groups 3, which are connected to the cavities 2 on both sides of the isolation plate 4 through pipelines.

[0044] Specifically, the two vacuum pump groups 3 respectively and synchronously evacuate the cavities 2 on both sides of the isolation plate 4, so that both sides of the isolation plate 4 are in a vacuum state.

[0045] Preferably, a vacuum detector 10 is provided in the cavity 2. By detecting the vacuum of the cavity 2 through the vacuum detector 10, the cleaned parts can be cleaned under different vacuum degrees.

[0046] See attached Figure 4-6 In the specific use process, the parts to be cleaned are placed on the rotating frame 6, and the multiple groups of adhesive stickers 601 are used to fix the parts to be cleaned to prevent the parts from falling off. The vacuum pump group 3 first evacuates the cavity 2 of the main body 1 to make the cavity 2 a vacuum cavity 2; the vacuum detector 10 detects the vacuum degree inside the cavity 2, and can be cleaned at different vacuum degrees according to different parts. Then, the graphite electrode 7 is electrically connected to the high-voltage power supply 11 to form an electric field in the cavity 2. Then, inert gas and active gas are introduced into the cavity 2 through the inert gas box 8 and the active gas box 12. When oxygen is introduced, the target surface is slightly oxidized, and the sputtered substances, including secondary electrons, CO2, CO, CC, C, etc., fly to the substrate and react with the oxygen and oxygen ions in the vacuum to generate oxygen compounds, which collide with the substrate. Part of the oxygen reacts with the graphite electrode 9 to generate carbon dioxide to form gas. When the negative ions are accelerated to collide with the substrate and the C and CC that have not been oxidized, the surface of the target is slightly oxidized, and the surface of the target is slightly oxidized. When the surface of the target is slightly oxidized, the surface of the target is slightly oxidized, and the sputtered substances, including secondary electrons, CO2, CO, CC, C, etc., fly to the substrate and react with the oxygen and oxygen ions in the vacuum to generate oxygen compounds, which collide with the substrate. The reaction generates CO2, CO escapes from the substrate and is sucked away by the vacuum pump. The isolation plate 4 isolates the cavity 2 so that the two sides of the isolation plate 4 are respectively in an inert gas atmosphere and an active gas atmosphere. In the inert gas atmosphere, the inert gas is ionized under the high-voltage electric field of the vacuum to generate plasma. The inert gas can be helium, neon, argon, etc., which can be selected according to production needs. The plasma impact cleans the residues on the surface of the product. For pollutants that strongly remain on the surface of the product, the product surface is bombarded with plasma. Ion bombardment cleaning is a green and residue-free cleaning.

[0047] The rotating motor 14 drives the rotating frame 6 to rotate, so that the cleaned parts are rotated from the inert gas atmosphere to the active gas. In / near the anode plasma area, the floating argon molecules / ions, oxygen molecules / ions and accelerated oxygen ions are collided with accelerated CO2, CO compounds, secondary electrons, etc., so that the substrate is physically and chemically cleaned. The cleaned parts are first bombarded by ions in the inert gas atmosphere and then oxidatively cleaned in the active gas. The electrical control box 13 controls the opening and closing of the vacuum pump group 3, and at the same time controls the opening and closing of the inert gas box 8 and the active gas box 12.

[0048] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A plasma surface cleaning device, characterized in that: It comprises a main body, one side of which is provided with a vacuum pump group, and both ends of the main body are provided with an inert gas box and an active gas box, one side of the inert gas box and the active gas box are provided with a high-voltage power supply and an electric control box respectively, the inert gas box and the active gas box are connected with the main body through a pipeline, and the interior of the main body is hollow to form a cavity; An isolation plate for isolating the cavity into two parts is provided inside the cavity, a rotating frame and a graphite electrode are provided in the cavity, the graphite electrode is connected to the high-voltage power supply, and the high-voltage power supply is electrically connected to the vacuum pump group, the active gas box and the inert gas box respectively, the graphite electrodes are respectively provided on both sides of the cavity, the gas outlets of the active gas box and the inert gas box correspond to the graphite electrodes, the pipelines connecting the active gas box, the inert gas box and the main body are provided with solenoid valves, the solenoid valves are electrically connected to the electric control box, and the main body is also provided with a rotating electric The rotating frame is connected to the rotating motor through a shaft, a sealing plate is arranged in the main body, a hole is opened on the sealing plate, the shaft of the rotating frame is connected to the rotating motor through the hole, a plurality of adhesive stickers are arranged on the rotating frame, the adhesive stickers are used to fix the cleaned parts, so that the cleaned parts are rotated into different gas atmospheres for cleaning, the rotating frame is connected to the isolation plate, and a flexible joint is arranged at the connection between the isolation plate and the rotating frame, the flexible joint is in contact with the rotating frame, and there are two vacuum pump groups, which are connected to the cavities on both sides of the isolation plate through pipelines; The main body is cylindrical as a whole, and the cavity is opened inside the main body. The isolation plate divides the atmosphere of the cavity into two parts. The two cavities are connected to the vacuum pump group through pipelines, one of the cavities is connected to the active gas box through a pipeline, and the other cavity is connected to the inert gas box. The two cavities are provided with graphite electrodes, and the graphite electrodes are connected to the high-voltage power supply. The high-voltage power supply supplies power to the graphite electrodes, and the inert gas and active gas introduced into the cavity from the inert gas box and the active gas box are ionized, and the graphite electrodes are used to ionize the inert gas and the active gas to generate gas.

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