A height-adjustable silicon carbide power device packaging shell

Abstract

The present invention discloses a height-adjustable silicon carbide power device packaging shell, comprising: a main cover, a sub-cover and a chip-carrying body; the main cover is provided with a first plug-in slot at the bottom; the sub-cover is detachably connected to the first plug-in slot at the top and provided with a second plug-in slot at the bottom; the second plug-in slot is detachably connected to the top of the chip-carrying body; and a SiC chip is arranged in the chip-carrying body. The present invention can disassemble or connect the sub-cover between the main cover and the chip-carrying body through the detachable connection between the main cover and the sub-cover and the detachable connection between the sub-cover and the chip-carrying body. When the sub-cover is connected between the main cover and the chip-carrying body, the overall height (thickness) of the SiC device is increased, so that a more reliable protection can be formed for the SiC chip when in use. When the sub-cover is removed from between the main cover and the chip-carrying body, the overall height of the SiC device is low, which meets the testing requirements and improves the convenience of using and testing the SiC device.

Description

Technical Field

[0001] The invention belongs to the technical field of microelectronic equipment, and in particular relates to a height-adjustable silicon carbide power device packaging shell. Background Art

[0002] In recent years, with the continuous development of microelectronics technology, the application of Si-based power electronic devices in some extreme environments such as high temperature, high pressure, and high humidity has been increasingly restricted. As a representative of the third generation of semiconductor materials, silicon carbide (SiC) materials have a bandgap width of about 3 times that of silicon materials, a breakdown electric field of 8 times that of silicon materials, and a thermal conductivity of 3 times that of silicon, which greatly improves the withstand voltage and current density of SiC devices. Due to the different characteristics of the two materials, the breakdown electric field of SiC materials is about 10 times that of Si materials, resulting in an on-resistance of only 1 / 100 to 1 / 200 of that of Si devices at the same breakdown voltage, which greatly reduces the conduction loss and switching loss of SiC devices, while improving system efficiency. It also makes the device more reliable in harsh environments such as high temperature, high power, and high humidity.

[0003] Therefore, SiC devices can double the power, temperature, frequency and radiation resistance of power electronic systems. At the same time, due to the high thermal conductivity of silicon carbide, the volume and weight of the heat dissipation system in the system can be greatly reduced, making the system more efficient. Therefore, SiC devices are not only widely used in traditional industrial fields such as DC and AC power transmission, uninterruptible power supply, switching power supply, industrial control, etc., but also have broad application prospects in new energy such as solar energy and wind energy.

[0004] In the related art, SiC devices need to be packaged before testing or use. After the packaging is completed, the packaging shell of the SiC device is a fixed structure. However, since the restrictions on the height of the packaged device are different under different test instruments and equipment, some equipment needs to maintain good airtightness in a small space, which requires the packaging height of the SiC device to be lower in order to complete the corresponding test. During the use of the packaged device, the strength of the package shell with a lower height (thinner thickness) has poor reliability for chip protection. Therefore, since the size and structure of the package shell are fixed, the packaging height that meets the test cannot meet the strength required for use, and the strength and height required for use cannot be tested in the test equipment, which makes the testing and use of the packaged device extremely inconvenient. Summary of the invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides a height-adjustable silicon carbide power device packaging shell. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0006] A height-adjustable silicon carbide power device packaging shell comprises: a main cover, a sub-cover and a chip-carrying body;

[0007] The main cover has a first plug-in slot at the bottom;

[0008] The auxiliary cover is detachably connected to the first plug-in slot at the top and is provided with a second plug-in slot at the bottom;

[0009] The second plug-in slot is detachably connected to the top of the chip carrier body;

[0010] A SiC chip is arranged in the chip carrier body.

[0011] In one embodiment of the present invention, the first plug-in slot is a T-slot structure and a through-slot structure;

[0012] The first plug-in slot comprises a first slot and a first opening;

[0013] The middle portion of the first slot is connected to the first opening;

[0014] The top of the sub-cover is inserted into the first slot and the first opening.

[0015] In one embodiment of the present invention, the auxiliary cover comprises: a first insertion portion and a connecting portion;

[0016] The first insertion portion is a T-shaped structure matching the first insertion slot, including: a first horizontal insertion portion and a first vertical insertion portion;

[0017] The first transverse insertion portion is inserted into the first slot, the middle portion is connected to the upper end of the first vertical insertion portion, and two first receiving through grooves are formed between the two sides and the connecting portion;

[0018] The first vertical insertion portion has a lower end connected to the connection portion and inserted into the first opening;

[0019] Both sides of the first opening are respectively accommodated in the two first accommodating grooves.

[0020] In one embodiment of the present invention, the second plugging slot is provided on the bottom of the connecting portion;

[0021] The second plug-in slot is a T-slot structure and a through-slot structure;

[0022] The second plug-in slot includes a second slot and a second opening;

[0023] The middle portion of the second slot is connected to the second opening;

[0024] The chip carrying body has a top portion inserted into the second slot and the second opening.

[0025] In one embodiment of the present invention, the chip carrying body comprises: a second insertion portion and a carrying portion;

[0026] The second insertion portion is a T-shaped structure matching the second insertion slot, including: a second horizontal insertion portion and a second vertical insertion portion;

[0027] The second transverse insertion portion is inserted into the second slot, the middle portion is connected to the upper end of the second vertical insertion portion, and two second accommodating through grooves are formed between the two sides and the bearing portion;

[0028] The second vertical insertion portion has a lower end connected to the bearing portion and inserted into the second opening;

[0029] Both sides of the second opening are respectively accommodated in the two second accommodating grooves;

[0030] A SiC chip is arranged in the carrying part.

[0031] In one embodiment of the present invention, the first plugging slot and the second plugging slot have the same size.

[0032] In one embodiment of the present invention, the first insertion portion and the second insertion portion have the same size.

[0033] Beneficial effects of the present invention:

[0034] The present invention can disassemble or connect the sub-cover between the main cover and the chip-carrying body through the detachable connection of the main cover and the sub-cover and the detachable connection of the sub-cover and the chip-carrying body. When the sub-cover is connected between the main cover and the chip-carrying body, the overall height (thickness) of the SiC device is increased to increase the strength of the main cover and the chip-carrying body, so that a more reliable protection can be formed for the SiC chip during use, thereby improving the reliability of the SiC device. When the sub-cover is removed from between the main cover and the chip-carrying body, the overall height of the SiC device is relatively low, so that it can be tested in some smaller and narrow spaces, meeting the testing requirements and improving the convenience of the SiC device during use and testing. In addition, the main cover and the sub-cover are detachable, which is convenient for opening the main cover and the sub-cover when the device is opened for an experiment.

[0035] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a structural schematic diagram of the main cover provided by the embodiment of the present invention;

[0037] Figure 2 It is a schematic diagram of the structure of the auxiliary cover provided by the embodiment of the present invention;

[0038] Figure 3It is a schematic diagram of the structure of the chip carrier body provided by the embodiment of the present invention;

[0039] Figure 4 It is a schematic diagram of assembling a highly adjustable silicon carbide power device packaging shell provided by the embodiment of the present invention;

[0040] Figure 5 It is a schematic diagram of assembling a sub-cover and a chip-carrying body of a height-adjustable silicon carbide power device packaging shell provided by the embodiment of the present invention;

[0041] Figure 6 The present invention is a schematic diagram of assembling a main cover and a chip-carrying body of a height-adjustable silicon carbide power device packaging shell provided by the present invention.

[0042] Description of reference numerals:

[0043] 10-main cover; 11-first plug-in slot; 111-first slot; 112-first opening; 20-sub-cover; 21-second plug-in slot; 211-second slot; 212-second opening; 22-first insertion portion; 221-first horizontal insertion portion; 222-first vertical insertion portion; 23-connecting portion; 24-first accommodating slot; 30-chip carrier body; 31-second insertion portion; 311-second horizontal insertion portion; 312-second vertical insertion portion; 32-carrying portion; 33-second accommodating slot; 40-SiC chip. DETAILED DESCRIPTION

[0044] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0045] Embodiment 1

[0046] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 A height-adjustable silicon carbide power device package shell includes: a main cover 10, a sub-cover 20 and a chip carrier body 30. The main cover 10 has a first plug-in slot 11 at the bottom. The top of the sub-cover 20 is detachably connected to the first plug-in slot 11, and the bottom of the sub-cover 20 is provided with a second plug-in slot 21. The second plug-in slot 21 is detachably connected to the top of the chip carrier body 30. A SiC chip 40 is arranged in the chip carrier body 30.

[0047] In this embodiment, Figure 4 , Figure 5 and Figure 6As shown, the SiC chip 40 is arranged in the chip carrier body 30, the main cover 10 is detachably connected to the auxiliary cover 20, and the auxiliary cover 20 is detachably connected to the chip carrier body. When testing or use is required, the main cover 10, the auxiliary cover 20 and the chip carrier body can be plugged together for use, as shown in FIG. Figure 4 As shown, the main cover 10 can also be removed as needed, and only the auxiliary cover 20 and the chip carrying body are used, such as Figure 5 As shown, or remove the auxiliary cover 20, and only plug the main cover 10 and the chip carrier body together for use, as shown in FIG. Figure 6 The package shell of this embodiment can disassemble or connect the sub-cover 20 between the main cover 10 and the chip carrying body 30, and the disassembly is very convenient.

[0048] Specifically, the first plugging slot 11 may be plugged with the top of the auxiliary cover 20 , and the second plugging slot 21 may be plugged with the top of the chip carrier body, wherein the first plugging slot 11 may also be plugged with the top of the chip carrier body.

[0049] When the device is in use, the auxiliary cover 20 is connected between the main cover 10 and the chip carrier body 30, increasing the overall height (thickness) of the SiC device to increase the strength of the main cover 10 and the chip carrier body 30, so that the SiC chip 40 can be more reliably protected during use, thereby improving the reliability of the SiC device. When the device needs to be tested in a small space, the package shell needs to be smaller in size, and the auxiliary cover 20 is removed from between the main cover 10 and the chip carrier body 30. The overall height of the SiC device is lower, so it can be tested in some smaller and narrow spaces to meet the testing requirements. Therefore, the convenience of using and testing the SiC device is also improved to meet different usage requirements.

[0050] In a feasible implementation, the height of the portion between the top and the bottom of the sub-cover 20 can be made into sub-covers 20 of different heights according to actual needs. When in use, different sub-covers 20 can be replaced according to actual needs to adjust the overall height of the packaging shell, which expands the usage scenarios and greatly improves the flexibility and convenience of use.

[0051] Furthermore, if Figure 1 As shown, the first plug-in slot 11 is a T-slot structure and a through slot structure. The first plug-in slot 11 includes a first slot 111 and a first opening 112. The middle of the first slot 111 is connected to the first opening 112. The top of the sub-cover 20 is inserted into the first slot 111 and the first opening 112. In this embodiment, the top of the sub-cover 20 can be inserted into the first plug-in slot 11 from one end of the first plug-in slot 11, which is convenient to operate.

[0052] Furthermore, if Figure 2As shown, the sub-cover 20 includes: a first insertion portion 22 and a connecting portion 23. The first insertion portion 22 is a T-shaped structure matching the first insertion slot 11, and the structure of the first insertion portion 22 matches the structure of the first insertion slot 11. The first insertion portion 22 includes: a first horizontal insertion portion 221 and a first vertical insertion portion 222.

[0053] The first horizontal insertion portion 221 is inserted into the first insertion slot 111, the middle portion of the first horizontal insertion portion 221 is connected to the upper end of the first vertical insertion portion 222, and two first receiving slots 24 are formed between the two sides of the first horizontal insertion portion 221 and the connecting portion 23. The parts of the main cover 10 on both sides of the first opening 112 can be received in the two first receiving slots 24. The lower end of the first vertical insertion portion 222 is connected to the connecting portion 23, and the first vertical insertion portion 222 can be inserted into the first opening 112.

[0054] In this embodiment, the first insertion portion 22 constitutes the top of the auxiliary cover 20 and matches the structure of the first insertion slot 11 of the main cover 10, so that the main cover 10 and the auxiliary cover 20 can be manually plugged in and removed.

[0055] Furthermore, if Figure 2 As shown, the second plug-in slot 21 is provided on the bottom of the connecting portion 23. The second plug-in slot 21 is a T-slot structure and a through slot structure. The structure of the second plug-in slot 21 is the same as that of the first plug-in slot 11. The second plug-in slot 21 comprises a second slot 211 and a second opening 212. The middle of the second slot 211 is connected to the second opening 212. The top of the chip-carrying body 30 is inserted into the second slot 211 and the second opening 212. In this embodiment, the top of the chip-carrying body 30 can be inserted into the second slot 21 from one end of the second plug-in slot 21, which is convenient for operation.

[0056] Furthermore, if Figure 3 As shown, the chip carrier body 30 includes: a second insertion portion 31 and a bearing portion 32. The second insertion portion 31 is a T-shaped structure matching the second insertion slot 21, and the structure of the second insertion portion 31 matches the structure of the second insertion slot 21. The second insertion portion 31 includes: a second horizontal insertion portion 311 and a second vertical insertion portion 312. The second horizontal insertion portion 311 is inserted into the second slot 211, the middle part of the second horizontal insertion portion 311 is connected to the upper end of the second vertical insertion portion 312, and two second accommodating through grooves 33 are formed between the two sides of the second horizontal insertion portion 311 and the bearing portion 32. Parts of the connecting portion 23 on both sides of the second opening 212 are accommodated in the two second accommodating through grooves 33. The lower end of the second vertical insertion portion 312 is connected to the bearing portion 32, and the second vertical insertion portion 312 is inserted into the second opening 212. Among them, the second insertion portion 31 and the first insertion portion 22 have the same structure. The SiC chip 40 is arranged in the bearing portion 32.

[0057] In this embodiment, the second insertion portion 31 constitutes the top of the chip carrier body 30 and matches the structure of the second insertion slot 21 of the auxiliary cover 20 , so that the auxiliary cover 20 and the chip carrier body 30 can be manually plugged in and removed.

[0058] Furthermore, the first inserting slot 11 and the second inserting slot 21 have the same structure and size. The first inserting portion 22 and the second inserting portion 31 have the same structure and size.

[0059] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0060] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0061] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0062] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0063] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0064] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A height-adjustable silicon carbide power device packaging shell, characterized in that: include: A main cover (10), a sub-cover (20) and a chip carrying body (30); The main cover (10) has a first plug-in slot (11) at the bottom; The auxiliary cover (20) is detachably connected to the first plug-in slot (11) at the top and is provided with a second plug-in slot (21) at the bottom; The second plug-in slot (21) is detachably connected to the top of the chip carrier body (30); A SiC chip (40) is arranged in the chip carrier body (30).

2. The height-adjustable silicon carbide power device package housing according to claim 1, characterized in that: The first plug-in slot (11) is a T-slot structure and a through-slot structure; The first plug-in slot (11) comprises a first insertion slot (111) and a first opening (112); The middle portion of the first slot (111) is connected to the first opening (112); The top of the sub-cover (20) is inserted into the first slot (111) and the first opening (112).

3. The height-adjustable silicon carbide power device package housing according to claim 2, characterized in that: The auxiliary cover (20) comprises: a first insertion portion (22) and a connecting portion (23); The first insertion portion (22) is a T-shaped structure matching the first insertion slot (11), comprising: a first horizontal insertion portion (221) and a first vertical insertion portion (222); The first transverse insertion portion (221) is inserted into the first slot (111), the middle portion is connected to the upper end of the first vertical insertion portion (222), and two first accommodating through grooves (24) are formed between the two sides and the connecting portion (23); The first vertical insertion portion (222), the lower end of which is connected to the connection portion (23), is inserted into the first opening (112); Both sides of the first opening (112) are respectively accommodated in the two first accommodating through grooves (24).

4. The height-adjustable silicon carbide power device package housing according to claim 3, characterized in that: The second plug-in slot (21) is provided on the bottom of the connecting portion (23); The second plug-in slot (21) is a T-slot structure and a through-slot structure; The second plug-in slot (21) comprises a second slot (211) and a second opening (212); The middle portion of the second slot (211) is connected to the second opening (212); The chip carrying body (30) has a top portion inserted into the second slot (211) and the second opening (212).

5. The height-adjustable silicon carbide power device package housing according to claim 4, characterized in that: The chip carrying body (30) comprises: a second insertion portion (31) and a carrying portion (32); The second insertion portion (31) is a T-shaped structure matching the second insertion slot (21), comprising: a second horizontal insertion portion (311) and a second vertical insertion portion (312); The second transverse insertion portion (311) is inserted into the second slot (211), the middle portion is connected to the upper end of the second vertical insertion portion (312), and two second accommodating through grooves (33) are formed between the two sides and the bearing portion (32); The second vertical insertion portion (312), the lower end of which is connected to the bearing portion (32) and inserted into the second opening (212); Both sides of the second opening (212) are respectively accommodated in the two second accommodating through grooves (33); A SiC chip (40) is arranged in the carrying portion (32).

6. The height-adjustable silicon carbide power device package housing according to claim 3, characterized in that: The first plugging slot (11) and the second plugging slot (21) have the same size.

7. The height-adjustable silicon carbide power device package housing according to claim 5, characterized in that: The first insertion portion (22) and the second insertion portion (31) have the same size.

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