A semiconductor chip high and low temperature testing device

Abstract

The present invention proposes a semiconductor chip high and low temperature test device, which is mainly used to perform high and low temperature tests on different semiconductor chips. The main structures of the device are as follows: a linear guide motion structure; an electric push rod structure; a fixed bracket structure; an infrared temperature sensor structure; a socket structure; and a controller. The semiconductor chip high and low temperature test device proposed by the present invention can perform high and low temperature tests on different semiconductor chips, improve test efficiency, reduce test costs, and improve the accuracy and reliability of high and low temperature tests.

Description

Technical Field

[0001] The invention relates to a semiconductor chip high and low temperature testing device, which is used for testing semiconductor chips at high and low temperatures and realizing the screening of semiconductor chips at high and low temperatures. Background Art

[0002] At present, when semiconductor chips are subjected to large-scale high and low temperature mass production tests in factories, the chip to be tested is mainly placed on a socket fixed on a metal plate for heating or cooling. When the chip to be tested reaches the predetermined temperature, it is moved to the testing department for testing by a robotic arm. The disadvantage of this testing method is that the chip is not continuously heated and cooled during the test, resulting in the actual temperature of the chip being lower than the required temperature during the test, causing deviations in the test results, especially for chips with longer test times.

[0003] When factories conduct large-scale mass production tests, they mainly test multiple chips at the same time. If only a single chip is tested under the same test environment, it will cause a waste of test resources. Another common method of high and low temperature testing of a single chip is manual testing, that is, the entire test process is controlled manually. This method is not only inefficient, but also because it cannot continuously monitor the temperature, resulting in low test accuracy and reliability.

[0004] This test device mainly performs automated testing on single chips. It automatically heats and cools the chip in real time during the test, dynamically monitors and adjusts the temperature of the chip, so that the chip is always within the specified range, improving the test accuracy and reliability. Summary of the invention

[0005] The present invention proposes a high and low temperature testing device for semiconductor chips. The device is an auxiliary testing device, which is used in coordination with a testing machine and a processing machine, wherein the testing machine is mainly used to test the chip, and the processing machine is mainly used to transport the chip. The device includes: a linear track motion structure, a fixed bracket structure, an electric push rod structure, a temperature sensor structure, a socket structure, and a controller. The linear track motion structure is fixed to the right side of the processing machine, and can drive the fixed bracket to transport the high and low temperature gas pipelines to the top of the semiconductor chip through the sliding module. The electric push rod structure is located above the chip to be tested, and is used to transport the high and low temperature gas pipelines to the surface of the semiconductor chip. The temperature sensor structure is fixed directly below the socket structure, and is used to monitor the temperature of the metal spring probe in real time.

[0006] The testing device based on the present invention can be used to improve the accuracy and reliability of semiconductor single chips during high and low temperature testing.

[0007] Among them: the linear track motion structure is a sliding device of a motor-controlled lead screw, the sliding distance can be controlled by adjusting the position of the switch sensor, and the sliding speed can be controlled by a controller.

[0008] The electric push rod structure is a telescopic device of the motor, and the telescopic length of the air path can be controlled by a controller.

[0009] The socket structure is mainly used to fix the semiconductor chip to be tested on the test board through the socket test clip. At the same time, the semiconductor chip presses down the metal spring probe during the pressing process, completing the close contact between the semiconductor chip and the metal spring probe.

[0010] The motor has the characteristics of stepping control. Through forward and reverse rotation, the electric push rod can move up and down, and the sliding module can move forward and backward.

[0011] The infrared temperature sensor structure is used to monitor the temperature of the metal spring probe in real time. Since the metal probe is closely connected to the semiconductor chip, the temperature of the metal probe is equivalent to the temperature of the semiconductor chip according to thermal conductivity. The infrared temperature sensor receives the infrared radiation of the metal probe and generates a corresponding electrical signal. The temperature change of the semiconductor chip will eventually cause the change of the infrared temperature sensor electrical signal.

[0012] The snap-fit ​​device is used to transfer the high and low temperature gases generated by the heat flow cover to the metal pipeline of the fixing device in a sealed environment to avoid gas leakage.

[0013] The controller mainly includes an MCU processor, a drive circuit, and a regulated power supply, which are used to receive and process the motor and infrared temperature sensor signals. The MCU controls the motor and temperature sensor electrical signals, and then controls the heat flow hood. The drive circuit is used to drive the MCU system signal, and the regulated power supply is used for power supply. The controller is connected to the upper-level processing software. The MCU sends the collected motor and temperature electrical signals to the upper-level processing software, which analyzes them and then controls the heat flow hood.

[0014] The metal gas pipe mainly transports the gas generated by the heat flow hood to the surface of the semiconductor chip. The function of the sealing hood is mainly to reduce the gas leakage to the semiconductor chip during the heating or cooling process.

[0015] The joints of the metal air pipes are connected and sealed with high and low temperature resistant hoses, and have sufficient margin to prevent the air pipes from falling off during movement. At the same time, the metal pipes are isolated and insulated to prevent gas leakage during transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of the high and low temperature testing device.

[0017] Figure 2 This is a flow chart of the high and low temperature testing device. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be clearly described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "sliding module", "clip", "Socket", "connection", "test clip", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] The present invention is limited to semiconductor chips in plastic-encapsulated modules and is not applicable to semiconductor chips in other packaging forms.

[0021] Turn on the power of the test machine and the processor, start the high temperature or low temperature test through the software, and the processor moves the chip to the socket (13) after receiving the instruction. After the transfer is completed, the processor returns to the initial position.

[0022] After the high and low temperature test device detects that the processor has returned to the initial position, the controller (17) controls the linear track motion structure (1) to drive the sliding module (7) to slide forward, and when the upper limit baffle (5) enters the upper limit switch (2), the motor (4) stops rotating in the forward direction.

[0023] After the controller (17) receives the upper limit baffle (5) entering the upper limit switch (2), it controls the electric push rod structure (10) to drive the metal air pipe (12) with the sealing cover to reach the chip packaging surface, so that the sealing cover of the metal air pipe (12) completely covers the chip package.

[0024] After the metal air pipe (12) reaches the set height, the heat flow hood switch is turned on through software to generate the expected temperature. At this time, the heat flow hood generates high and low temperature gases. The high and low temperature gases generated by the heat flow hood reach the chip package surface through the metal air pipe (16), the metal air pipe (9) and the metal air pipe (12), and the chip package is heated and cooled by the air flow.

[0025] When the temperature sensor (15) detects that the temperature of the metal spring probe reaches the expected temperature, the temperature signal is converted into an electrical signal and transmitted to the controller (17). The controller (17) controls the test machine through software to test the semiconductor chip.

[0026] After the test is finished, the controller (17) controls the heat flow hood to stop heating or cooling.

[0027] The controller (17) controls the linear track motion structure (1) to drive the sliding module (7) to slide backwards, and when the lower limit block (6) enters the lower limit switch (3), the motor (4) stops rotating in the reverse direction.

[0028] When the controller (17) receives the lower limit baffle (6) entering the lower limit switch (3), it controls the electric push rod structure (10) to drive the metal air pipe (12) with the sealing cover to leave the chip packaging surface and return to the initial position.

[0029] After the controller (17) detects that the electric push rod structure (10) has returned to the initial position, it controls the processor through the program to move the next semiconductor chip to the socket (13) and repeats steps

[0019] to

[0025] until the test is completed.

[0030] The advantages of this device are low cost, high test accuracy, and small test temperature error range. The controller and software coordinate the automatic testing of the test machine, processor, and high and low temperature devices.

Claims

1. A semiconductor chip high and low temperature test device, used to perform high and low temperature tests on different semiconductor chips, characterized in that The device comprises: a linear track motion structure (1), a fixed bracket (8), an electric push rod structure (10), an infrared temperature sensor structure (15), a metal air pipe with a buckle (16), a socket structure (13), and a controller (17), wherein: the linear track motion structure (1) controls the sliding module (7) to move forward and backward through the operation of a motor (4) according to the high and low temperature test requirements of the chip; the linear track motion structure (1) is composed of a motor (4), a screw rod (18), a sliding module (7), an upper limit switch (2), a lower limit switch (3), an upper limit baffle (5), and a lower limit baffle (6); The output of the motor 1 (4) in the linear track motion structure (1) is connected to the screw rod (18), and the motor 1 (4) rotates the screw rod (18) to drive the sliding module (7) to slide, and the sliding module (7) drives the fixed bracket (8), the metal air pipe 1 (9), the electric push rod structure (10), the upper limit baffle (5), and the lower limit baffle (6) to perform linear motion; The electric push rod structure (10) controls the metal air pipe (12) with a sealing cover to move up and down according to the actual height of the test socket structure (13) through the operation of the motor (11), one end of the metal air pipe (12) with a sealing cover is connected to the metal air pipe (9) on the fixed bracket (8), and the other end of the metal air pipe (12) with a sealing cover covers the chip on the socket structure (13) through the sealing cover; The socket structure (13) is customized into different socket types according to the chip packaging form. A metal spring probe (14) is arranged in the middle position of the socket structure (13). After the chip is placed in the socket structure (13), the metal spring probe (14) is pressed against the middle position of the chip package, and the metal spring probe (14) passes through the PCB board of the socket structure (13); The infrared temperature sensor structure (15) detects the actual temperature of the chip on the socket structure (13) and converts the actual temperature into an electrical signal, which is then transmitted to the controller (17); the infrared temperature sensor structure (15) mainly consists of an infrared temperature sensor and a fixing component; The metal air pipe three (16) with a clip is sealed and fixed to the output end of the heat flow cover and the metal air pipe three (16) with a clip by a clip device according to the high and low temperature test requirements of the chip, and the other end of the metal air pipe three (16) with a clip is connected to the metal air pipe one (9) on the fixed bracket (8); The input of the controller (17) is connected to the control output ports of the upper limit switch (2), the lower limit switch (3) and the infrared temperature sensor structure (15), and the output of the controller (17) is connected to the control input ports of the motor 1 (4), the motor 2 (11) and the heat flow cover; the controller (17) controls the rotation of the motor by closing the control switch, and adjusts the state of the heat flow cover according to the received temperature electrical signal; The controller (17) is mainly composed of an MCU, a drive circuit, and a voltage-stabilized power supply. The MCU controls the electrical signals of the motor 1 (4), the motor 2 (11), and the infrared temperature sensor structure (15), thereby controlling the heat flux cover. The drive circuit is used to drive the MCU system signal, and the voltage-stabilized power supply is used to supply power.

2. The semiconductor chip high and low temperature testing device according to claim 1, characterized in that: The metal gas pipe three (16) with a buckle adopts a buckle device made of high and low temperature resistant material to be fixedly sealed with the gas output port of the heat flow cover, and transmits the high and low temperature gas generated by the heat flow cover to the chip surface through the metal gas pipe one (9) and the metal gas pipe two (12) with a sealing cover.

3. The semiconductor chip high and low temperature testing device according to claim 1, characterized in that: The linear track motion structure (1) detects whether the sliding module (7) slides to the specified position of the module to be tested through the upper limit switch (2); when the upper limit baffle (5) enters the upper limit switch (2), the motor 1 (4) stops rotating in the forward direction; when the lower limit baffle (6) enters the lower limit switch (3), the motor 1 (4) stops rotating in the reverse direction.

4. The semiconductor chip high and low temperature testing device according to claim 1, characterized in that: The electric push rod structure (10) drives the metal air pipe (12) with a sealing cover to perform an ascending and descending movement on the chip packaging surface. When the metal air pipe (12) with a sealing cover completely covers the chip packaging surface, the motor (11) stops rotating in the forward direction. When the test is completed, the metal air pipe (12) with a sealing cover leaves the chip packaging surface. When the metal air pipe (12) with a sealing cover returns to its initial position, the motor (11) stops rotating in the reverse direction.

5. The semiconductor chip high and low temperature testing device according to claim 1, characterized in that: The motor 1 (4) and the motor 2 (11) are controlled by a controller (17), and the control signals include start, stop, forward rotation and reverse rotation. At the same time, the controller (17) can receive signals from the motor 1 (4) and the motor 2 (11).

6. The semiconductor chip high and low temperature testing device according to claim 1, characterized in that: The infrared temperature sensor structure (15) focuses the infrared rays emitted by the infrared temperature sensor on the bottom of the metal spring probe (14) on the socket structure (13); when the chip package temperature changes, the infrared rays are conducted through the metal spring probe (14); at the same time, the metal spring probe (14) emits infrared radiation outward, and the radiation intensity changes with the temperature; the infrared temperature sensor is a thermal electronic sensor that receives infrared radiation and converts it into a testable electrical signal.

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