Camera modules and electronic equipment

Abstract

A camera module and electronic equipment, the camera module includes a circuit board, a mounting bracket, a lens holder, a chip and a lens, the mounting bracket includes a frame body and a baffle structure, the frame body includes a first surface facing the circuit board and a second surface arranged opposite to the first surface, the baffle structure includes a plurality of first baffles convexly arranged on the first surface and a plurality of second baffles convexly arranged on the second surface; the circuit board is provided with a plurality of first card slots corresponding to the first baffles, and the first baffles are used to be inserted into the first card slots; the lens holder is provided with a plurality of second card slots corresponding to the second baffles, and the second baffles are used to be inserted into the second card slots. The camera module provided by the present invention can prevent external stray light from entering the module, improve imaging quality, increase the strength of the module, and can also avoid external electromagnetic interference and improve the heat dissipation capacity of the module.

Description

Technical Field

[0001] The present invention relates to the field of optical lenses, and in particular to a camera module and electronic equipment. Background Art

[0002] The camera module, also known as a computer camera, computer eye, electronic eye, etc., is a video input device that is widely used in remote video, real-time monitoring, etc.

[0003] The bracket and circuit board of a traditional camera module, as well as the bracket and lens mount, need to be fixed with an adhesive layer. However, the adhesive layer has a certain degree of light transmittance, which causes external light to enter the internal photosensitive chip through the adhesive layer from the side of the camera module, causing stray light in the image and affecting the imaging effect. Summary of the invention

[0004] In view of this, it is necessary to provide a camera module that can prevent stray light from appearing in images.

[0005] In addition, the present invention also provides an electronic device including the camera module.

[0006] The present invention provides a camera module, comprising: a circuit board; a mounting bracket arranged on the circuit board; a lens seat arranged on the mounting bracket; a chip arranged on the circuit board and accommodated in the mounting bracket; and a lens arranged in the lens seat.

[0007] The mounting bracket includes a frame body and a baffle structure, the frame body includes a first surface facing the circuit board and a second surface arranged opposite to the first surface, the baffle structure includes a plurality of first baffles protruding from the first surface and a plurality of second baffles protruding from the second surface; the circuit board is provided with a plurality of first card slots corresponding to the first baffles, and the first baffles are used to be inserted into the first card slots; the lens mount is provided with a plurality of second card slots corresponding to the second baffles, and the second baffles are used to be inserted into the second card slots.

[0008] In an embodiment of the present application, the baffle structure further includes a connecting piece, the first baffle and the second baffle are located on opposite sides of the connecting piece, the frame body covers the connecting piece, and the first baffle and the second baffle are exposed from the frame body.

[0009] In the embodiment of the present application, the first blocking piece, the second blocking piece and the connecting piece are an integrally formed structure.

[0010] In the implementation manner of the present application, the blocking piece structure is made of metal.

[0011] In an embodiment of the present application, the camera module also includes a filter, the frame body includes a hollow first mounting portion and a second mounting portion extending from the inner side of the first mounting portion, the first mounting portion covers the connecting plate, and the filter is arranged on the second mounting portion.

[0012] In the implementation manner of the present application, the frame body and the baffle structure are both made of plastic material.

[0013] In the implementation manner of the present application, the first card slot and the second card slot are both L-shaped slots or U-shaped slots.

[0014] In the implementation manner of the present application, the mounting bracket is bonded to the circuit board via a first adhesive layer, and the first adhesive layer is disposed around the first baffle.

[0015] In the implementation manner of the present application, the mounting bracket and the lens mount are bonded together via a second adhesive layer, and the second adhesive layer is disposed around the second baffle.

[0016] The present invention also provides an electronic device, comprising the camera module as described above.

[0017] Compared with the prior art, the camera module provided by the present invention can effectively prevent external stray light from entering the camera module by respectively arranging the first baffle and the second baffle on the upper and lower surfaces of the mounting bracket, thereby improving the imaging quality; the strength of the overall module can be increased through the structural design of the mounting bracket; when the first baffle, the second baffle and the frame are made of metal material, external electromagnetic interference can also be effectively avoided, thereby improving the heat dissipation capacity of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an exploded view of a camera module provided by one embodiment of the present invention.

[0019] Figure 2 This is a structural diagram of a camera module provided by one embodiment of the present invention.

[0020] Figure 3 yes Figure 2 The camera module shown is a cross-sectional view along III-III.

[0021] Figure 4 It is a schematic structural diagram of a mounting bracket provided in one embodiment of the present invention.

[0022] Figure 5 It is a schematic structural diagram of a framework provided by one embodiment of the present invention.

[0023] Figure 6 It is a structural schematic diagram of a camera module provided by another embodiment of the present invention.

[0024] Figure 7 It is a schematic structural diagram of a mounting bracket provided in another embodiment of the present invention.

[0025] Figure 8 It is a schematic diagram of the structure of a circuit board provided in another embodiment of the present invention.

[0026] Main component symbols

[0027] Camera module 100、200 Circuit Board 1 First card slot 11、16 Circuit board body 12 Extension 13 Grooves 14 Connectors 15 Mounting Bracket 2、8 First surface 21、81 Second surface 22、82 Baffle structure 27、85 First stopper 23、83 Second stopper 24、84 Connector 25 Framework body 26、86 First installation part 261 Second installation part 262 Lens mount 3 Second card slot 31、36 First side wall 32 Second side wall 33 First cavity 34 Second cavity 35 Lenses 4 chip 5 First glue layer 6 Optical Filters 7 Second adhesive layer 9

[0028] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0031] The system implementation described below is only illustrative. The division of the modules or circuits is only a logical function division. There may be other division methods in actual implementation. In addition, it is obvious that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the system claims can also be implemented by the same unit or device through software or hardware. The words first, second, etc. are used to indicate names, and do not indicate any specific order.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] See also Figures 1 to 8 As shown, a camera module 100 provided by an embodiment of the present invention includes a circuit board 1, a mounting bracket 2 disposed on the circuit board 1, a lens holder 3 disposed on the mounting bracket 2, a lens 4 disposed in the lens holder 3, and a chip 5 disposed on the circuit board 1. The chip 5 is accommodated in the mounting bracket 2, the lens 4 is located above the chip 5, and the lens 4 and the chip 5 are coaxially arranged.

[0034] The mounting bracket 2 includes a frame body 26 and a baffle structure 27. The frame body 26 includes a first surface 21 facing the circuit board 1 and a second surface 22 opposite to the first surface 21. The baffle structure 27 includes a plurality of first baffles 23 protruding from the first surface 21 and a plurality of second baffles 24 protruding from the second surface 22. The circuit board 1 is provided with a plurality of first card slots 11 corresponding to the first baffles 23. The first baffles 23 are used to be inserted into the first card slots 11 to achieve the connection between the mounting bracket 2 and the circuit board 1. The lens holder 3 is provided with a plurality of second card slots 31 corresponding to the second baffles 24. The second baffles 24 are used to be inserted into the second card slots 31 to achieve the connection between the mounting bracket 2 and the lens holder 3. By providing the first baffles 23 and the second baffles 24, it is possible to prevent external stray light from entering the camera module 100 from the joints between the mounting bracket 2 and the circuit board 1 and the joints between the mounting bracket 2 and the lens holder 3.

[0035] In this embodiment, the circuit board 1 further comprises a circuit board body 12 and an extension portion 13 disposed on one side of the circuit board body 12, and a connector 15 is disposed on the extension portion 13. The first slot 11 is disposed on a side surface of the circuit board body 12 close to the mounting bracket 2.

[0036] In this embodiment, since dense circuits are arranged on the protruding portion 13 , in order to avoid damaging the circuits by providing a slot, the first slot 11 is not provided on the circuit board body 12 corresponding to the protruding portion 13 .

[0037] In this embodiment, the circuit board body 12 is a substantially rectangular structure, and the number of the first card slots 11 is three. The three first card slots 11 are respectively disposed on the edges of the three sides of the circuit board body 12 except for the protruding portion 13 .

[0038] In this embodiment, the first slot 11 may be an L-shaped slot, which facilitates the insertion of the first blocking piece 23 .

[0039] like Figure 8As shown, in another embodiment, the first card slot 16 corresponding to the camera module 200 can be a U-shaped slot structure. The U-shaped slot structure can make the first baffle 23 and the first card slot 16 more firmly combined, and better prevent external stray light from entering the interior of the module.

[0040] In this embodiment, a groove 14 is provided on the circuit board body 12 , and the chip 5 is disposed in the groove 14 . Specifically, the chip 5 is fixed in the groove 14 by bonding with an adhesive layer.

[0041] In this embodiment, the connecting piece 25 frame body 26 baffle structure 27 also includes a connecting piece 25, the first baffle 23 and the second baffle 24 are located on the two opposite sides of the connecting piece 25, the frame body 26 is covered on the outside of the connecting piece 25, and the first baffle 23 and the second baffle 24 are exposed from the frame body 26.

[0042] In this embodiment, the first baffle 23, the second baffle 24 and the connecting piece 25 are an integrally formed structure. Specifically, the connecting piece 25, the first baffle 23 and the second baffle 24 can be made of metal (such as copper). In addition, the metal material can avoid external electromagnetic interference and improve the heat dissipation capacity of the camera module 100.

[0043] In this embodiment, the first blocking piece 23 and the second blocking piece 24 are symmetrically arranged on two sides of the connecting piece 25 .

[0044] In this embodiment, the connecting piece 25 is roughly a rectangular frame, the number of the first baffles 23 is three, and the number of the second baffles 24 is four, wherein the first baffles 23 and the second baffles 24 are symmetrically arranged on the three sides of the connecting piece 25, and the fourth side has only the second baffle 24, and the position where the first baffle 23 is not arranged is to facilitate the extension of the extending portion 13 of the circuit board 1.

[0045] The heights of the first baffle 23 and the second baffle 24 can be designed according to the thickness of the circuit board 1 and the thickness of the lens mount 3, wherein the height of the first baffle 23 is smaller than the thickness of the circuit board 1, and the height of the second baffle 24 is smaller than the thickness of the lens mount 3.

[0046] The lengths of the first baffle 23 and the second baffle 24 can be designed according to the size of the connecting piece 25, wherein the first baffle 23 and the second baffle 24 are used to prevent external light from entering the module and affecting the chip 5. Therefore, the lengths of the first baffle 23 and the second baffle 24 need to be designed to be longer than the lengths of the corresponding sides of the chip 5. It can be understood that the maximum length of the second baffle 24 is consistent with the circumference of the connecting piece 25, that is, a circle of the second baffle 24 is set on the connecting piece 25. In addition, it is also possible to design a circle of the first baffle 23 on the connecting piece 25. Of course, the first baffle 23 corresponding to the extension 13 needs to be removed so that the extension 13 can extend.

[0047] In this embodiment, the frame body 26 is a plastic layer, which is directly molded on the connecting piece 25 by injection molding, while the first blocking piece 23 and the second blocking piece 24 are exposed.

[0048] In this embodiment, the frame body 26 includes a hollow first mounting portion 261 and a second mounting portion 262 extending from the inner side of the first mounting portion 261, the first mounting portion 261 covers the connecting piece 25, and the second mounting portion 262 is provided with a filter 7. Specifically, the filter 7 is bonded to the second mounting portion 262 through an adhesive layer, and the chip 5, lens 4 and filter 7 are coaxially arranged.

[0049] In this embodiment, a first adhesive layer 6 is provided between the mounting bracket 2 and the circuit board 1, and the first adhesive layer 6 is provided around the first blocking piece 23. The mounting bracket 2 and the circuit board 1 are connected and fixed together by the first adhesive layer 6.

[0050] In this embodiment, the first adhesive layer 6 may be a light-shielding adhesive, which can further block external light from entering the interior of the module.

[0051] In this embodiment, the lens holder 3 includes a first side wall 32 and a second side wall 33 connected to the first side wall 32. The first side wall 32 is arranged to form a first cavity 34, and the second side wall 33 is arranged to form a second cavity 35. The lens 4 is arranged in the first cavity 34, and the filter 7 is arranged in the second cavity 35. The first side wall 32 is provided with an internal thread corresponding to the inner surface of the lens 4, and the outer surface of the lens 4 is provided with an external thread corresponding to the internal thread, and the lens 4 is threadedly connected to the first side wall 32.

[0052] In this embodiment, the second card slot 31 is disposed at one end of the second side wall 33 away from the first side wall 32 . Specifically, the depth of the second card slot 31 is consistent with the height of the second blocking piece 24 , and the depth of the second card slot 31 is less than the height of the first side wall 32 .

[0053] In this embodiment, the second card slot 31 is a U-shaped slot. The U-shaped slot structure can make the second baffle 24 and the second card slot 31 more firmly combined, and better prevent external stray light from entering the interior of the module.

[0054] like Figure 6 As shown, in another embodiment, the second slot 36 may also be an L-shaped slot structure, which facilitates the engagement of the second blocking piece 24 .

[0055] In this embodiment, one end of the second side wall 33 away from the first side wall 32 is fixed to the mounting bracket 2 via a second adhesive layer 9. The second adhesive layer 9 is disposed around the second blocking piece 24.

[0056] In this embodiment, the second adhesive layer 9 is a light-shielding adhesive, which can further block external light from entering the interior of the module.

[0057] In this embodiment, the lens holder 3 is an integrally formed structure, specifically a plastic holder obtained by injection molding.

[0058] Please refer again Figures 1 to 3 , the assembly process of the camera module 100 is as follows:

[0059] The chip 5 is mounted on the circuit board 1 by surface mounting technology (SMT).

[0060] First, install the filter on the mounting bracket 2, and then assemble the mounting bracket 2 with the above-mentioned circuit board 1, and stick the first adhesive layer 6 on the upper surface of the circuit board 1. At the same time, the first adhesive layer 6 prevents the first card slot 11 from being blocked, and the extension portion 13 extends out of the mounting bracket 2 from the side where the first baffle 23 is not provided, and then the first baffle 23 is inserted into the first card slot 11, and the first semi-finished product is obtained by pressing and assembling.

[0061] Install the lens 4 into the first cavity 34 on the lens holder 3, and then stick the second adhesive layer 9 on the surface of the mounting bracket 2 close to the lens holder 3, wherein the second adhesive layer 9 exposes the second baffle 24, align the second baffle 24 with the second slot 31 and insert it into the second slot 31, so that the chip 5, the filter and the lens 4 are coaxially arranged to obtain the camera module 100.

[0062] See also Figure 7In another embodiment, the mounting bracket 8 comprises a frame body 86 and a baffle structure 85, wherein the frame body 86 comprises a first surface 81 facing the circuit board 1 and a second surface 82 disposed opposite to the first surface 81, and the baffle structure 85 comprises a first baffle 83 formed on the first surface 81 and a second baffle 84 formed on the second surface 82. The mounting bracket 8 is an integrally formed structure.

[0063] In this embodiment, the mounting bracket 8 is a plastic structural member, and the frame body 86 and the baffle structure 85 are formed by one-time injection molding, and the molding process is simple.

[0064] The present invention further provides an electronic device (not shown), comprising the camera module 100 as described above.

[0065] Compared with the prior art, the camera module provided by the present invention can effectively prevent external stray light from entering the camera module by respectively arranging the first baffle and the second baffle on the upper and lower surfaces of the mounting bracket, thereby improving the imaging quality; the strength of the overall module can be increased through the structural design of the mounting bracket; when the first baffle, the second baffle and the frame are made of metal material, external electromagnetic interference can also be effectively avoided, thereby improving the heat dissipation capacity of the camera module.

[0066] In addition, for those skilled in the art, various other corresponding changes and modifications can be made based on the technical concept of the present invention, and all these changes and modifications should fall within the protection scope of the claims of the present invention.

Claims

1. A camera module, characterized in that: include: Circuit board; A mounting bracket, arranged on the circuit board; A lens mount is disposed on the mounting bracket, and the lens mount is an integrally formed structure; A chip, disposed on the circuit board and accommodated in the mounting bracket; as well as A lens, disposed in the lens seat; The mounting bracket includes a frame body and a baffle structure, wherein the frame body includes a first surface facing the circuit board and a second surface disposed opposite to the first surface, and the baffle structure includes a plurality of first baffles protruding from the first surface and a plurality of second baffles protruding from the second surface; the circuit board is provided with a plurality of first card slots corresponding to the first baffles, and the first baffles are used to be inserted into the first card slots; the lens mount is provided with a plurality of second card slots corresponding to the second baffles, and the second baffles are used to be inserted into the second card slots, The blocking piece structure further includes a connecting piece, the first blocking piece and the second blocking piece are located on two opposite sides of the connecting piece, the frame body covers the connecting piece, and the first blocking piece and the second blocking piece are exposed from the frame body.

2. The camera module according to claim 1, wherein: The first blocking piece, the second blocking piece and the connecting piece are an integrally formed structure.

3. The camera module according to claim 2, wherein: The baffle structure is made of metal.

4. The camera module according to claim 1, wherein: It also includes a filter. The frame body includes a hollow first mounting portion and a second mounting portion extending from the inner side of the first mounting portion. The first mounting portion covers the connecting plate, and the filter is arranged on the second mounting portion.

5. The camera module according to claim 1, wherein: The frame body and the baffle structure are both made of plastic.

6. The camera module according to claim 1, wherein: The first card slot and the second card slot are both L-shaped slots or U-shaped slots.

7. The camera module according to claim 1, wherein: The mounting bracket is bonded to the circuit board via a first adhesive layer, and the first adhesive layer is arranged around the first baffle.

8. The camera module according to claim 1, wherein: The mounting bracket and the lens holder are bonded together via a second adhesive layer, and the second adhesive layer is arranged around the second baffle.

9. An electronic device, characterized in that: A camera module comprising any one of claims 1-8.

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