Integrated circuit for laser chip removal

Abstract

The present invention discloses an integrated circuit for laser chip removal, including an MCU controller, a laser switch control circuit, a laser control circuit, a laser drive circuit, a power supply circuit and an indication circuit, wherein the indication circuit is turned on by default, the laser control circuit is controlled by the MCU controller, and the laser drive circuit is controlled by the laser control circuit; after the MCU controller reads the effective level of the laser switch control circuit, the MCU controller controls DA to convert the corresponding voltage value to MOS through IIC communication, and controls the size of the current passing through the laser through a closed loop, thereby changing the intensity of the laser light emission to control the temperature. The present invention integrates a circuit for finely controlling the heating temperature, accurately locating the chip to be removed, and controlling the heating range, thereby improving the efficiency and accuracy of chip removal and the stability of the whole machine.

Description

Technical Field

[0001] The invention relates to an integrated circuit, in particular to an integrated circuit used for laser chip removal. Background Art

[0002] The electronics repair industry frequently replaces chips. The current equipment used to disassemble chips is inconvenient and cannot accurately adjust the heating temperature; the heating range cannot be controlled; careful operation is required, and the chip to be removed must be visually aligned, which can easily loosen the chips around the target chip; and the disassembly process requires one hand to hold the disassembly equipment frequently, which is inefficient, time-consuming, and prone to fatigue. Summary of the invention

[0003] The technical problem to be solved by the present invention is an integrated circuit for laser chip removal, which integrates a circuit for precisely controlling the heating temperature, accurately positioning the chip to be removed, and controlling the heating range, thereby improving the efficiency and accuracy of chip removal and the stability of the entire machine.

[0004] The present invention is realized by the following technical scheme: an integrated circuit for laser chip removal, comprising an MCU controller, a laser switch control circuit, a laser control circuit, a laser drive circuit, a power supply circuit and an indication circuit, wherein the indication circuit is turned on to facilitate user positioning, the laser control circuit is controlled by the MCU controller, and the laser drive circuit is controlled by the laser control circuit;

[0005] After the MCU controller reads the effective level of the laser switch control circuit, the MCU controller controls DA through IIC communication to convert it into a corresponding voltage value to MOS, and controls the current passing through the laser through a closed loop, thereby changing the intensity of the laser light to control the temperature.

[0006] As a preferred technical solution, the indicator circuit adopts an LED indicator circuit, and the indicator circuit is turned on by default to facilitate user positioning.

[0007] As a preferred technical solution, a protection circuit is also included, which is connected to the laser driving circuit. When the protection circuit detects current abnormality, the protection circuit triggers to disconnect the laser driving circuit to achieve the purpose of protection.

[0008] As a preferred technical solution, it also includes a gear setting display circuit, which has a digital tube for display. The gear setting display circuit is controlled by an MCU controller. After the MCU controller is powered on and reads the gear set by the user for the last time, the gear is displayed through the digital tube.

[0009] As a preferred technical solution, the range value of the gear setting display circuit is limited by software, and the range value is limited to within 5%.

[0010] As a preferred technical solution, the LED indication circuit adopts a constant current circuit.

[0011] The beneficial effects of the present invention are:

[0012] 1. Solve the temperature regulation problem:

[0013] The MCU detects the key value pressed by the user and changes the voltage value of the driving circuit through the IIC protocol to control the size of the constant current passing through the MOS tube to achieve the purpose of controlling temperature regulation;

[0014] 2. Solve the problem of heating range:

[0015] 1. The gear range value on the software is limited to within 5%;

[0016] Second, by detecting the current size, the current passing through the laser is kept within the specified range, thereby controlling the temperature range.

[0017] 3. Solve the problem of accurately indicating the disassembled components:

[0018] Use constant current circuit to make LED indication brighter;

[0019] 4. Improved the stability of the whole machine:

[0020] The dual protection circuits of hardware overcurrent protection and software overcurrent protection improve the reliability of the whole machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is the circuit control principle diagram of the present invention;

[0023] Figure 2 It is a system block diagram of the present invention. DETAILED DESCRIPTION

[0024] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0025] Any feature disclosed in this specification (including any additional claims, abstract and drawings), unless otherwise stated, may be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0026] In the description of the present invention, it is necessary to understand that the terms "one end", "the other end", "outside", "upper", "inside", "horizontal", "coaxial", "center", "end", "length", "outer end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] In addition, in the description of the present invention, “plurality” means at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0028] Terms such as "upper", "above", "lower", and "below" used in the present invention to indicate spatial relative positions are used for the purpose of convenience to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. Terms of spatial relative position may be intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the drawings. For example, if the device in the drawings is turned over, units described as being "below" or "beneath" other units or features will be "above" the other units or features. Therefore, the exemplary term "below" can encompass both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations) and the spatially relative descriptive terms used herein interpreted accordingly.

[0029] In the present invention, unless otherwise clearly specified and limited, the terms "disposed", "socketed", "connected", "through", "plugged" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] like Figure 1 and Figure 2As shown, an integrated circuit for laser chip removal of the present invention includes an MCU controller, a laser switch control circuit, a laser control circuit, a laser driving circuit, a power supply circuit and an indication circuit. The indication circuit is turned on by default to facilitate user positioning. The laser control circuit is controlled by the MCU controller, and the laser driving circuit is controlled by the laser control circuit.

[0031] After the MCU controller reads the effective level of the laser switch control circuit, the MCU controller controls DA through IIC communication to convert it into a corresponding voltage value to MOS, and controls the current passing through the laser through a closed loop, thereby changing the intensity of the laser light to control the temperature.

[0032] In this embodiment, the indicator circuit adopts an LED indicator circuit, and the indicator circuit is turned on by default to facilitate user positioning.

[0033] It also includes a protection circuit, which is connected to the laser driving circuit. When the protection circuit detects current abnormality, the protection circuit triggers to disconnect the laser driving circuit to achieve the purpose of protection; it also includes a gear setting display circuit, which has a digital tube for display. The gear setting display circuit is controlled by the MCU controller. After the MCU controller is powered on and reads the gear set by the user for the last time, the gear is displayed through the digital tube.

[0034] In this embodiment, the range value of the gear setting display circuit is limited by software, and the range value is limited to within 5%. The current passing through the laser is within the specified range, thereby controlling the temperature range, which is safer.

[0035] In this embodiment, the LED indication circuit adopts a constant current circuit, and the LED indication is brighter.

[0036] The working principle is as follows: the MCU reads the gear position set by the user for the last time when it is powered on, and displays the gear position through the digital tube for easy use. At this time, the LED indicator is turned on. After the MCU reads the effective level of the turn-on switch, the MCU controls the DA through IIC communication to convert it into a corresponding voltage value to the MOS, and controls the current passing through the laser through a closed loop, thereby changing the intensity of the laser light emission to achieve the purpose of controlling the temperature. During work, if the current detection circuit detects an abnormal current, the protection circuit triggers the disconnection of the laser drive circuit to achieve the purpose of protection.

[0037] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope defined in the claims.

Claims

1. An integrated circuit for laser chip removal, characterized in that: It includes an MCU controller, a laser switch control circuit, a laser control circuit, a laser drive circuit, a power supply circuit and an indication circuit. When the indication circuit is turned on, the laser control circuit is controlled by the MCU controller, and the laser drive circuit is controlled by the laser control circuit. After the MCU controller reads the effective level of the laser switch control circuit, the MCU controller controls DA through IIC communication to convert it into a corresponding voltage value to MOS, and controls the current passing through the laser through a closed loop, thereby changing the intensity of the laser light emission to control the temperature. The indication circuit adopts an LED constant current circuit, which indicates through an LED indicator light; It also includes a protection circuit, which is connected to the laser driving circuit. When the protection circuit detects current abnormality, the protection circuit triggers to disconnect the laser driving circuit to achieve the purpose of protection; It also includes a gear setting display circuit, which has a digital tube for display. The gear setting display circuit is controlled by an MCU controller. After the MCU controller is powered on and reads the gear set by the user for the last time, the gear is displayed through the digital tube. The range value of the gear setting display circuit is limited by software, and its range value is limited to within 5%; The LED indication circuit adopts a constant current circuit.

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