Array substrate, color film substrate and preparation method thereof, and display panel

Abstract

The present application discloses an array substrate, a color film substrate and a preparation method thereof, and a display panel. The array substrate is divided into a display area and a non-display area. The array substrate includes a first insulating layer, which is located in the display area and the non-display area. The array substrate also includes a first heat dissipation layer, which is arranged in the first insulating layer in the non-display area. The present application can effectively reduce the substrate temperature by arranging a heat dissipation layer in the non-display area of ​​the substrate and absorbing heat by phase change of the heat dissipation layer, thereby reducing the risk of panel liquid crystal polarization and improving product quality.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate, a color film substrate and a preparation method thereof, and a display panel. Background Art

[0002] With the development of optoelectronic display technology and semiconductor manufacturing technology, Thin Film Transistor-Liquid Crystal Display (TFT-LCD) has become the mainstream of display panels due to its advantages of lightness, energy saving, high display quality and mature and stable manufacturing process. TFT-LCD mainly includes array substrate and color filter substrate (CF), as well as liquid crystal layer (LC) disposed between the array substrate and the color filter substrate.

[0003] In TFT-LCD, the electrical and optical properties of liquid crystal directly affect the display effect. Liquid crystal is a soft substance between the crystal state of liquid crystal box, with both the fluidity of liquid and the optical anisotropy of crystal. Ordinary liquid crystal is in a viscous fluid state at room temperature. If the temperature rises to about 80℃, the clearing point of liquid crystal is reached. When the liquid crystal reaches the clearing point, it will polarize, which will affect the display effect.

[0004] In the prior art, a gate driven on array (GOA) design is usually used on the array substrate to replace the integrated circuit drive to reduce the manufacturing cost of the liquid crystal panel. However, the power consumption of GOA is relatively high, which will cause the load of the metal bus line to increase. When the product is subjected to a high-temperature aging test, the high temperature in the furnace causes the resistance of the metal line to increase, the leakage of the TFT increases, and the current of each line in the GOA also increases, resulting in high temperature in the panel, causing the liquid crystal to reach the clearing point and polarize, resulting in poor display, and ultimately affecting the product quality. Summary of the invention

[0005] The main technical problem solved by the present application is to provide an array substrate, a color film substrate and a preparation method thereof, and a display panel. By setting a heat dissipation layer in the non-display area of ​​the substrate, the problem of liquid crystal polarization caused by high temperature in the substrate can be solved.

[0006] In order to solve the above-mentioned technical problems, the first technical solution adopted in the present application is to provide an array substrate, which is divided into a display area and a non-display area. The array substrate includes a first insulating layer, and the first insulating layer is located in the display area and the non-display area. The array substrate also includes a first heat dissipation layer, and the first heat dissipation layer is arranged in the first insulating layer in the non-display area.

[0007] Therefore, the first heat dissipation layer can effectively reduce the ambient temperature of the array substrate and avoid polarization of the liquid crystal layer.

[0008] Wherein, the first heat dissipation layer is arranged around the display area.

[0009] Therefore, the first heat dissipation layer can effectively prevent the liquid crystal around the display area from being polarized.

[0010] The first heat dissipation layer includes a plurality of first heat dissipation blocks, which are arranged at intervals and dispersed in the non-display area.

[0011] Therefore, the first heat dissipation blocks are arranged at intervals, which can reduce the effective area of ​​the first heat dissipation layer, thereby reducing the usage of heat dissipation materials and further reducing the preparation cost.

[0012] In order to solve the above technical problems, the second technical solution adopted in the present application is to provide a color film substrate, which is divided into a display area and a non-display area. The color film substrate includes a flat layer, which is located in the display area and the non-display area. The color film substrate also includes a second heat dissipation layer, which is arranged in the flat layer in the non-display area.

[0013] Therefore, the second heat dissipation layer can effectively reduce the ambient temperature of the color filter substrate and avoid polarization of the liquid crystal layer.

[0014] Wherein, the second heat dissipation layer is arranged around the display area.

[0015] Therefore, the second heat dissipation layer can effectively prevent the liquid crystal around the display area from being polarized.

[0016] In order to solve the above technical problems, the third technical solution adopted in the present application is to provide a method for preparing an array substrate, including: obtaining a first substrate, and sequentially forming a gate insulating layer, a first metal layer and a first insulating layer on a non-display area of ​​the first substrate; using a first photomask to expose and develop the first insulating layer located in the non-display area to form a plurality of evenly distributed first grooves on the first insulating layer; and filling the first grooves with heat dissipation material to form a first heat dissipation layer.

[0017] Therefore, by setting a first heat dissipation layer in the non-display area of ​​the array substrate and utilizing the phase change of the first heat dissipation layer to absorb heat, the temperature of the array substrate can be effectively reduced, thereby reducing the risk of panel liquid crystal polarization and improving product quality.

[0018] The first grooves are evenly distributed around the display area.

[0019] Therefore, the first grooves are distributed around the display area, and after being filled with heat dissipation material, the edges of the display area can be effectively cooled, thereby preventing the display effect from being affected by high-temperature polarization of the liquid crystal.

[0020] The phase change temperature of the heat dissipation material is 50-70° C., and the heat dissipation material includes organic silicon material or graphene material.

[0021] Therefore, the heat dissipation material can undergo a phase change from solid to liquid before the liquid crystal reaches the clearing point (70-100°C), and at a higher temperature, from liquid to gas to absorb more heat.

[0022] In order to solve the above technical problems, the fourth technical solution adopted in the present application is to provide a method for preparing a color film substrate, including: obtaining a second substrate, and sequentially forming a black matrix and a flat layer on the non-display area of ​​the second substrate; using a second photomask to expose and develop the flat layer located in the non-display area to form a plurality of evenly distributed second grooves on the flat layer; filling the second grooves with heat dissipation material to form a second heat dissipation layer.

[0023] By setting a second heat dissipation layer in the non-display area of ​​the color film substrate and utilizing the phase change of the second heat dissipation layer to absorb heat, the temperature of the color film substrate can be effectively reduced, thereby reducing the risk of panel liquid crystal polarization and improving product quality.

[0024] The second grooves are evenly distributed around the display area.

[0025] Therefore, the second grooves are distributed around the display area, and after being filled with heat dissipation material, the edges of the display area can be effectively cooled, thereby preventing the display effect from being affected by high-temperature polarization of the liquid crystal.

[0026] In order to solve the above technical problems, the fifth technical solution adopted in the present application is to provide a method for preparing a display panel, including: obtaining the above-mentioned array substrate and the above-mentioned color film substrate; injecting liquid crystal on the array substrate or the color film substrate, and aligning the array substrate and the color film substrate to form a display panel.

[0027] Therefore, by providing a heat dissipation layer on the non-display area around the display area of ​​the array substrate and the color film substrate, the temperature of the display panel can be effectively reduced, thereby reducing the risk of panel liquid crystal polarization and improving product quality.

[0028] The beneficial effect of the present application is as follows: Different from the prior art, the present application provides an array substrate and a color film substrate and a preparation method thereof, and a display panel preparation method. By setting a heat dissipation layer in the non-display area of ​​the substrate and utilizing the phase change of the heat dissipation layer to absorb heat, the substrate temperature can be effectively reduced, thereby reducing the risk of panel liquid crystal polarization and improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 is a top view of the first embodiment of the array substrate of the present application;

[0031] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the array substrate;

[0032] Figure 3 It is a schematic diagram of a process of an embodiment of a method for preparing an array substrate of the present application;

[0033] Figure 4 is a top view of the first embodiment of the color filter substrate of the present application;

[0034] Figure 5 yes Figure 4 A schematic diagram of the cross-sectional structure of a medium color film substrate;

[0035] Figure 6 It is a schematic flow chart of an embodiment of a method for preparing a color film substrate of the present application;

[0036] Figure 7 It is a schematic diagram of a process of an embodiment of a method for preparing a display panel of the present application.

[0037] Description of reference numerals:

[0038] 100 - array substrate; 10 - display area; 20 - non-display area; 101 - first substrate;

[0039] 102-gate insulating layer; 201-first heat dissipation layer; 202-first heat dissipation block;

[0040] 301 - first metal layer; 302 - second metal layer; 401 - first insulating layer;

[0041] 402 - second insulating layer; 501 - amorphous silicon layer; 502 - indium tin oxide layer;

[0042] 200-color film substrate; 60-display area; 70-non-display area; 701-second heat dissipation layer;

[0043] 702 - second heat sink; 801 - second substrate; 802 - black matrix; 803 - color resistance layer;

[0044] 804 - flat layer; 805 - indium tin oxide layer; 806 - spacer. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0046] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said", and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless otherwise clearly indicated above, and "multiple" generally includes at least two, but does not exclude the inclusion of at least one.

[0047] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0048] It should be understood that the terms "include", "comprises" or any other variations used herein are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "includes..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0049] See also Figure 1 , Figure 1 It is a top view of the first embodiment of the array substrate of the present application.

[0050] like Figure 1 As shown, in this embodiment, the array substrate 100 is divided into a display area 10 and a non-display area 20. The array substrate 100 includes a first insulating layer (not shown), the first insulating layer is located in the display area 10 and the non-display area 20, and the array substrate 100 also includes a first heat dissipation layer 202, and the first heat dissipation layer 201 is arranged in the first insulating layer of the non-display area 20.

[0051] It can be understood that the first heat dissipation layer 201 can effectively reduce the ambient temperature of the array substrate 100 and avoid polarization of the liquid crystal layer.

[0052] The first heat dissipation layer 201 is disposed around the display area 10 .

[0053] It can be understood that since liquid crystal polarization generally occurs in the corners of the display area 10, setting the first heat dissipation layer 201 around the display area 10 can play a better role in reducing the temperature, and the larger the setting area of ​​the first heat dissipation layer 201, the better the cooling effect on the array substrate 100.

[0054] In this embodiment, the first heat dissipation layer 201 includes a plurality of first heat dissipation blocks 202, which are arranged at intervals and dispersed in the non-display area 20. In this embodiment, the shape of the first heat dissipation block 202 is circular, and in other embodiments, the shape of the first heat dissipation block 202 can also be rectangular, which is not limited in this application.

[0055] In this embodiment, the first heat dissipation block 202 is filled with a heat dissipation material that absorbs heat by phase change, wherein the phase change temperature of the heat dissipation material is 50-70° C. The heat dissipation material includes organic silicon material or graphene material.

[0056] It can be understood that the first heat dissipation blocks 202 are arranged at intervals, which can reduce the effective area of ​​the first heat dissipation layer 201, thereby reducing the amount of heat dissipation material used, and further reducing the manufacturing cost.

[0057] Specifically, a liquid crystal layer is provided in the display area 10. When the ambient temperature of the display area 10 reaches 50-60°C, the liquid crystal begins to polarize, and at this time the temperature of the array substrate 100 itself will reach 70-80°C or even higher, so the heat dissipation material needs to undergo a phase change from solid to liquid before the liquid crystal reaches a clearing point (70-100°C), and when the temperature is higher, from liquid to gas, to absorb more heat.

[0058] In other embodiments, the first heat dissipation layer 201 may be disposed only in the metal wiring region of the array substrate 100 to reduce the influence of high temperature on the liquid crystal caused by excessive load of the metal wiring.

[0059] For further information, see Figure 2 , Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure of the array substrate. Figure 2 As shown, the display area 10 of the array substrate 100 includes a first substrate 101, a first metal layer 301, a gate insulating layer 102, an amorphous silicon layer 501, a second metal layer 302, a first insulating layer 401, a second insulating layer 402 and an indium tin oxide layer 502 which are stacked in sequence. The non-display area 20 includes a first substrate 101, a gate insulating layer 102, a second metal layer 302, a first insulating layer 401, a first heat dissipation layer 201 and a second insulating layer 402 which are stacked in sequence.

[0060] The first heat dissipation layer 201 includes a plurality of first heat dissipation blocks 202 , and the plurality of first heat dissipation blocks 202 are arranged at intervals and dispersed in the non-display area 20 .

[0061] It can be understood that a plurality of grooves are provided on the first insulating layer 401 , and the grooves are filled with heat dissipation material to form the first heat dissipation block 202 . The heat dissipation material in the first heat dissipation block 202 will not affect the film structure of the device when a phase change occurs.

[0062] Correspondingly, the present application provides a method for preparing an array substrate.

[0063] See also Figure 3 , Figure 3 FIG. 1 is a flow chart of an embodiment of a method for preparing an array substrate of the present application. Figure 3 As shown, in this embodiment, the method includes:

[0064] S11: obtaining a first substrate, and sequentially forming a gate insulating layer, a first metal layer, and a first insulating layer on a non-display area of ​​the first substrate.

[0065] In this embodiment, after obtaining the first substrate, a first metal layer is first formed in the display area of ​​the first substrate, and then a gate insulating layer is formed in the display area and the non-display area, and a first metal layer is formed on the gate insulating layer in the non-display area. Thereafter, an amorphous silicon layer and a second metal layer are sequentially formed on the gate insulating layer in the display area, and finally a first insulating layer is formed in the display area and the non-display area.

[0066] S12: using a first photomask to expose and develop the first insulating layer located in the non-display area, so as to form a plurality of uniformly distributed first grooves on the first insulating layer.

[0067] In this embodiment, the first light mask may be any one of a normal light mask, a half tone light mask or a gray tone light mask, and this application does not limit this.

[0068] Among them, the normal mask is a fully transparent exposure part, the half tone mask is a partially transparent light-transmitting part, and the gray tone mask is a micro-slit made below the resolution of the exposure machine, and the micro-slit part blocks a part of the light source to achieve a half-exposure effect. All three types of masks can form grooves on the first insulating layer.

[0069] In this embodiment, the first grooves are evenly distributed around the display area.

[0070] It can be understood that the first grooves are distributed around the display area, and after being filled with heat dissipation material, the edges of the display area can be effectively cooled, thereby preventing the display effect from being affected by high-temperature polarization of the liquid crystal.

[0071] S13: filling the first groove with a heat dissipation material to form a first heat dissipation layer.

[0072] In this embodiment, the heat dissipation material includes a high thermal conductivity insulating organic silicon material or a graphene material.

[0073] Wherein, the phase change temperature of the heat dissipation material is 50-70°C.

[0074] It can be understood that when the ambient temperature of the display area reaches 50-60°C, the liquid crystal begins to polarize. At this time, the temperature of the array substrate itself will reach 70-80°C or even higher. Therefore, the heat dissipation material is required to undergo a phase change from solid to liquid before the liquid crystal reaches the clearing point (70-100°C), and then change from liquid to gas when the temperature is higher to absorb more heat. Therefore, a heat dissipation material with a phase change temperature of 50-70°C is required.

[0075] In this embodiment, the organic silicon material or graphene material is filled into the first groove by dripping. In other embodiments, a coating method can also be selected, which is not limited in this application.

[0076] In this embodiment, after forming the first heat dissipation layer, a second insulating layer is formed on the first heat dissipation layer and the first insulating layer, and an indium tin oxide layer (ITO layer) is formed on the second insulating layer in the display area.

[0077] In other embodiments, after forming the first heat dissipation layer, a planarization layer is formed on the first heat dissipation layer and the first insulating layer, and an indium tin oxide layer (ITO layer) is formed on the planarization layer in the display area, which is not limited in the present application.

[0078] Different from the prior art, this embodiment can effectively reduce the temperature of the array substrate by setting a first heat dissipation layer in the non-display area of ​​the array substrate and utilizing the phase change of the first heat dissipation layer to absorb heat, thereby reducing the risk of panel liquid crystal polarization and improving product quality.

[0079] See also Figure 4 , Figure 4 It is a top view of the first embodiment of the color filter substrate of the present application.

[0080] like Figure 4 As shown, in this embodiment, the color film substrate 200 includes a display area 60 and a non-display area 70, the color film substrate 200 includes a flat layer (not shown), the flat layer is located in the display area 60 and the non-display area 70, the color film substrate 200 also includes a second heat dissipation layer 701, and the second heat dissipation layer 701 is arranged in the flat layer of the non-display area 70.

[0081] It can be understood that the second heat dissipation layer 701 can effectively reduce the ambient temperature of the color filter substrate 200 and avoid polarization of the liquid crystal layer.

[0082] The second heat dissipation layer 701 is disposed around the display area 60 .

[0083] It is understandable that, since liquid crystal polarization generally occurs in the corners of the display area 60, setting a second heat dissipation layer 701 around the display area 60 can play a better role in reducing the temperature, and the larger the setting area of ​​the second heat dissipation layer 701, the better the cooling effect on the color film substrate 200.

[0084] In this embodiment, the second heat dissipation layer 701 includes a plurality of second heat dissipation blocks 702, which are arranged at intervals and dispersed in the non-display area 70. In this embodiment, the second heat dissipation block 702 is rectangular in shape, and in other embodiments, the second heat dissipation block 702 may also be circular in shape, which is not limited in this application.

[0085] In this embodiment, the second heat dissipation block 702 is filled with a heat dissipation material that absorbs heat by phase change, wherein the phase change temperature of the heat dissipation material is 50-70° C. The heat dissipation material includes organic silicon material or graphene material.

[0086] It can be understood that the second heat dissipation blocks 702 are arranged at intervals, which can reduce the effective area of ​​the second heat dissipation layer 701, thereby reducing the amount of heat dissipation material used and further reducing the manufacturing cost.

[0087] Specifically, a liquid crystal layer is provided in the display area 60. When the ambient temperature of the display area 60 reaches 50-60°C, the liquid crystal begins to polarize, and at this time the temperature of the color film substrate 200 itself will reach 70-80°C or even higher, so the heat dissipation material needs to undergo a phase change from solid to liquid before the liquid crystal reaches the clearing point (70-100°C), and when the temperature is higher, from liquid to gas, to absorb more heat.

[0088] In other embodiments, the second heat dissipation layer 701 may be disposed only in the metal wiring region of the color filter substrate 200 to reduce the influence of high temperature on the liquid crystal caused by excessive load of the metal wiring.

[0089] For further information, see Figure 5 , Figure 5 yes Figure 4 Schematic diagram of the cross-sectional structure of the color film substrate. Figure 5As shown, the display area 60 of the color filter substrate 200 includes a second substrate 801, a black matrix 802, a color resist layer 803 separated by the black matrix 802, a flat layer 804, an indium tin oxide layer 805, and a spacer 806 which are stacked in sequence. The non-display area 70 includes a second substrate 801, a black matrix, a flat layer 804, a second heat dissipation layer 701, and an indium tin oxide layer 805 which are stacked in sequence.

[0090] The second heat dissipation layer 701 includes a plurality of second heat dissipation blocks 702 , and the plurality of second heat dissipation blocks 702 are arranged at intervals and dispersed in the non-display area 70 .

[0091] It can be understood that a plurality of grooves are provided on the flat layer 804 , and the grooves are filled with heat dissipation material to form the second heat dissipation block 702 . The heat dissipation material in the second heat dissipation block 702 will not affect the film structure of the device when a phase change occurs.

[0092] Correspondingly, the present application provides a method for preparing a color film substrate.

[0093] See also Figure 6 , Figure 6 FIG. 1 is a flow chart of an embodiment of a method for preparing a color film substrate of the present application. Figure 6 As shown, in this embodiment, the method includes:

[0094] S21: obtaining a second substrate, and sequentially forming a black matrix and a planarization layer on a non-display area of ​​the second substrate.

[0095] In this embodiment, after obtaining the second substrate, a black matrix and a color resist layer separated by the black matrix are first formed, and then a planar layer is formed on the black matrix and the color resist layer.

[0096] The color resist layer is arranged in the display area, and the color resist layer includes red resist (Red Resist, RR), green resist (Green Resist, GR) and blue resist (Blue Resist, BR).

[0097] S22: using a second photomask to expose and develop the planar layer located in the non-display area, so as to form a plurality of evenly distributed second grooves on the planar layer.

[0098] In this embodiment, the second mask may be any one of a normal mask, a half tone mask or a gray tone mask, and this application does not limit this.

[0099] Among them, the normal mask is a fully transparent exposure part, the half tone mask is a partially transparent light-transmitting part, and the gray tone mask is a micro-slit made below the resolution of the exposure machine, and the micro-slit part blocks a part of the light source to achieve a half-exposure effect. All three types of masks can form grooves on the flat layer.

[0100] In this embodiment, the second grooves are evenly distributed around the display area.

[0101] S23: filling the second groove with a heat dissipation material to form a second heat dissipation layer.

[0102] In this embodiment, the heat dissipation material includes a high thermal conductivity insulating organic silicon material or a graphene material.

[0103] Wherein, the phase change temperature of the heat dissipation material is 50-70°C.

[0104] It can be understood that when the ambient temperature of the display area reaches 50-60°C, the liquid crystal begins to polarize. At this time, the temperature of the color film substrate itself will reach 70-80°C or even higher. Therefore, the heat dissipation material is required to undergo a phase change from solid to liquid before the liquid crystal reaches the clearing point (70-100°C), and when the temperature is higher, it changes from liquid to gas to absorb more heat. Therefore, a heat dissipation material with a phase change temperature of 50-70°C is required.

[0105] In this embodiment, the organic silicon material or graphene material is filled into the second groove by dripping. In other embodiments, a coating method can also be selected, which is not limited in this application.

[0106] In this embodiment, after the second heat dissipation layer is formed, an indium tin oxide layer is formed on the second heat dissipation layer and the planarization layer, and a spacer is formed on the indium tin oxide layer in the display area.

[0107] Different from the prior art, this embodiment can effectively reduce the temperature of the color filter substrate by setting a second heat dissipation layer in the non-display area of ​​the color filter substrate and utilizing the phase change of the second heat dissipation layer to absorb heat, thereby reducing the risk of panel liquid crystal polarization and improving product quality.

[0108] Correspondingly, the present application provides a method for preparing a display panel.

[0109] See also Figure 7 , Figure 7 FIG. 1 is a flow chart of an embodiment of a method for manufacturing a display panel of the present application. Figure 7 As shown, in this embodiment, the method includes:

[0110] S31: Obtain the above-mentioned array substrate and the above-mentioned color filter substrate.

[0111] In this embodiment, non-display areas of the array substrate and the color filter substrate are both provided with a heat dissipation layer surrounding the display area.

[0112] S32: injecting liquid crystal onto the array substrate or the color filter substrate, and assembling the array substrate and the color filter substrate to form a display panel.

[0113] In this embodiment, alignment films are coated on both the array substrate and the color filter substrate to form a first alignment film and a second alignment film, and then liquid crystal is injected on the array substrate or the color filter substrate, and the array substrate and the color filter substrate are assembled to form a display panel.

[0114] It can be understood that by providing a heat dissipation layer on the non-display area around the display area of ​​the array substrate and the color film substrate, the temperature of the display panel can be effectively reduced, thereby reducing the risk of panel liquid crystal polarization and improving product quality.

[0115] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An array substrate, the array substrate is divided into a display area and a non-display area, the array substrate comprises a first insulating layer, the first insulating layer is located in the display area and the non-display area, characterized in that: The array substrate also includes a first heat dissipation layer, which is arranged in the first insulating layer in the non-display area and in the metal routing area of ​​the array substrate; wherein the first heat dissipation layer is arranged around the display area; the phase change temperature of the first heat dissipation layer is 50-70°C, and the first heat dissipation layer includes an organic silicon material; the first heat dissipation layer includes a plurality of first heat dissipation blocks, which are arranged at intervals and dispersed in the non-display area; wherein the shape of the first heat dissipation block includes a circle; the first heat dissipation layer is used to prevent polarization of the liquid crystal layer.

2. A color film substrate, the color film substrate is divided into a display area and a non-display area, the color film substrate comprises a flat layer, the flat layer is located in the display area and the non-display area, characterized in that: The color film substrate also includes a second heat dissipation layer, which is arranged in the flat layer of the non-display area; wherein the second heat dissipation layer is arranged around the display area and is arranged in the metal routing area of ​​the color film substrate; the phase change temperature of the second heat dissipation layer is 50-70°C, and the second heat dissipation layer includes silicone material; the second heat dissipation layer includes a plurality of second heat dissipation blocks, which are arranged at intervals and dispersed in the non-display area; wherein the shape of the second heat dissipation block includes a circle; the second heat dissipation layer is used to prevent polarization of the liquid crystal layer.

3. A method for preparing an array substrate, characterized in that: include: Obtaining a first substrate, and sequentially forming a gate insulating layer, a first metal layer, and a first insulating layer on a non-display area of ​​the first substrate; Using a first photomask to expose and develop the first insulating layer located in the non-display area, so as to form a plurality of evenly distributed first grooves on the first insulating layer; wherein the first grooves are evenly distributed around the display area; Fill the first groove with heat dissipation material to form a first heat dissipation layer; the phase change temperature of the heat dissipation material is 50-70°C, and the heat dissipation material includes silicone material; the first heat dissipation layer includes a plurality of first heat dissipation blocks, and the plurality of first heat dissipation blocks are arranged at intervals and dispersed in the non-display area; wherein the shape of the first heat dissipation block includes a circle; the first heat dissipation layer is used to prevent polarization of the liquid crystal layer.

4. A method for preparing a color film substrate, characterized in that: include: Obtaining a second substrate, and sequentially forming a black matrix and a planarization layer on a non-display area of ​​the second substrate; Using a second photomask to expose and develop the flat layer located in the non-display area, so as to form a plurality of evenly distributed second grooves on the flat layer; wherein the second grooves are evenly distributed around the display area; Fill the second groove with heat dissipation material to form a second heat dissipation layer; the phase change temperature of the heat dissipation material is 50-70°C, and the heat dissipation material includes silicone material; the second heat dissipation layer includes a plurality of second heat dissipation blocks, and the plurality of second heat dissipation blocks are arranged at intervals and dispersed in the non-display area; wherein the shape of the second heat dissipation block includes a circle; the second heat dissipation layer is used to prevent polarization of the liquid crystal layer.

5. A method for preparing a display panel, characterized in that: include: Obtain the array substrate as claimed in claim 1 and the color filter substrate as claimed in claim 2; Liquid crystal is injected onto the array substrate or the color filter substrate, and the array substrate and the color filter substrate are assembled to form the display panel.

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