Anti-shake module

Abstract

The present application discloses an anti-shake module, which comprises a circuit board, a motor, a lens assembly, and an IC driver chip. The circuit board is provided with an image sensor; the motor is fixed on the circuit board; the lens assembly is installed in the motor; when working, light is incident on the image sensor of the circuit board through the lens assembly. When the device shakes, the lens assembly deviates, and the IC driver chip controls the motor to drive the lens assembly to move in a direction perpendicular to the optical axis of the lens assembly and in a direction parallel to the optical axis of the lens assembly, so as to realize the movement of the lens assembly in the X, Y and AF directions and reset the lens assembly. Since the drive of the motor is controlled only by the IC driver chip, the movement of the lens assembly in the X, Y and AF directions can be realized, and the control speed and control effect of the motor can be significantly improved, so that the anti-shake effect of the OIS anti-shake module is significantly improved, and at the same time, the production cost of the OIS anti-shake module is effectively reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of anti-shake devices for photographing electronic devices, and in particular, relates to an anti-shake module with an optical anti-shake module. Background Art

[0002] Electronic device modules with auto focus (AF: Auto Focus) functions are widely used in general digital electronic devices, mobile electronic devices such as mobile phones or tablets. In recent years, such electronic devices are not limited to auto focus (AF) functions, and electronic device modules with anti-shake devices have been launched one after another. Anti-shake devices are mainly divided into electronic compensation stabilizers (EIS: Electronic Image Stabilizer) and optical image stabilizers (OIS: Optical imagestabilization).

[0003] The existing OIS anti-shake module is mainly composed of components such as a motor, a control board, a motor, a lens assembly, and a driver IC. The control board is connected to the power module of the electronic device, the motor is fixed on the control board, the lens assembly is installed in the motor, and the control board is provided with an OIS driver IC module. The motor is provided with an AF driver IC module. When the electronic device shakes, the OIS driver IC module controls the motor to move so that the motor drives the lens assembly to move in the X and Y directions perpendicular to the optical axis of the lens assembly. At the same time, the AF driver IC module and the OIS driver IC module control the motor to move so that the motor drives the lens assembly to move in the Z direction parallel to the optical axis, so as to adjust the position of the lens assembly and finally realize the anti-shake function of the OIS anti-shake module.

[0004] However, since the OIS driver IC module and the AF driver IC module are respectively arranged on the control board and the motor, and are controlled by two different currents, it is difficult to keep the response speed of the OIS driver IC module and the AF driver IC module consistent, and therefore it is difficult to achieve effective coordination of the motor's control of the lens assembly in the X and Y directions of the OIS and the Z direction of the AF, resulting in a poor anti-shake effect of the OIS anti-shake module, which cannot meet the user's usage requirements. In addition, the arrangement of the OIS driver IC module and the AF driver IC module will increase the production cost of the OIS anti-shake module, and since the OIS driver IC module is arranged on the control board, the existing OIS anti-shake module is easily damaged when assembling the motor, resulting in an increase in the use cost of the electronic equipment. Summary of the invention

[0005] The present application aims to at least to some extent solve the technical problem that the existing anti-shake module has poor anti-shake effect. To this end, the present application provides an anti-shake module.

[0006] An anti-shake module provided in an embodiment of the present application includes a circuit board, on which an image sensor is arranged;

[0007] a motor, wherein the motor is fixed on the circuit board;

[0008] a lens assembly, the lens assembly being installed in the motor and located above the image sensor;

[0009] An IC driver chip, the IC driver chip comprising an OIS register and an AF memory, the OIS register being provided with position information of the optical center of the lens assembly in the X and Y directions before the camera shakes, and the AF memory being provided with position information of the optical center of the lens assembly in the Z direction before the camera shakes;

[0010] An anti-shake unit is electrically connected to the OIS register and the AF memory, and is used to obtain position information of the optical center of the lens assembly in the X, Y and Z directions after the camera shakes, and to control the action of the motor so that the motor drives the lens assembly to move in a direction perpendicular to the optical axis of the lens assembly and / or in a direction parallel to the optical axis of the lens assembly, so that the optical center of the lens assembly moves to the position of the optical center of the lens assembly before the camera shakes.

[0011] In some embodiments, the anti-shake unit includes a signal receiver and a displacement sensor. The signal receiver is arranged in the IC driver chip and is electrically connected to the OIS register and the AF memory, so as to retrieve the position information of the optical center of the lens assembly in the X, Y and Z directions before the camera shakes. The displacement sensor is arranged on the motor and is electrically connected to the signal receiver, so as to transmit the position information of the optical center of the lens assembly in the X, Y and Z directions after the camera shakes to the signal receiver. The signal receiver controls the action of the motor according to the position offset of the optical center of the lens assembly after the camera shakes, so as to drive the lens assembly to move in a direction perpendicular to the optical axis of the lens assembly and / or in a direction parallel to the optical axis of the lens assembly, so as to move the optical center of the lens assembly to the position of the optical center of the lens assembly before the camera shakes.

[0012] In some embodiments, the motor comprises:

[0013] A housing; the housing is fixed on the circuit board;

[0014] A fixing frame, the fixing frame is fixed in the shell, three hard-soft boards are fixed on the side of the fixing frame, driving coils are arranged on the three hard-soft boards, the displacement sensor is arranged on one of the hard-soft boards, and the displacement sensor is electrically connected to the IC driving chip;

[0015] A driving frame, wherein the driving frame is slidably connected to the fixed frame, an X-direction magnet, a Y-direction magnet and a Z-direction magnet are fixed on the side of the driving frame, and the X-direction magnet, the Y-direction magnet and the Z-direction magnet are respectively located on one side of the three driving coils; and the lens assembly is fixed on the driving frame.

[0016] In some embodiments, the IC driver chip is disposed on the hard-flex board located on one side of the Z-direction magnet.

[0017] In some embodiments, a positioning protrusion is provided on the side of the lens assembly, a positioning installation groove adapted to the positioning protrusion is provided on the driving frame, and the positioning protrusion is located inside the positioning installation groove.

[0018] In some embodiments, the anti-shake module further includes:

[0019] A support frame, the support frame is located below the lens assembly, and the bottom surface of the support frame is fixed on the circuit board;

[0020] A filter is fixed on the support frame and is located between the lens assembly and the image sensor.

[0021] In some embodiments, a supporting edge is disposed on the bottom surface of the supporting frame, the supporting frame is fixed to the circuit board via the supporting edge, and a reinforcing rib is disposed between the supporting edge and the supporting frame.

[0022] In some embodiments, a plurality of anti-scratch protrusions are disposed on the top surface of the support frame, and each of the anti-scratch protrusions is located on a peripheral side of the filter.

[0023] In some embodiments, installation gaps are provided between the anti-scratch protrusions.

[0024] In some embodiments, a filter mounting groove is provided on the top surface of the support frame, the filter is fixed on the filter mounting groove, a receiving groove is recessed on the side wall of the filter mounting groove, and the receiving groove is located on one side of the mounting notch.

[0025] In some embodiments, an air escape hole penetrating the support frame is disposed on the top surface of the support frame.

[0026] The embodiments of the present application have at least the following beneficial effects:

[0027] The circuit board of the anti-shake module is provided with an image sensor, and the motor is fixed on the circuit board; the lens assembly is installed inside the motor and located above the image sensor. When taking pictures, light is projected onto the image sensor of the circuit board through the lens assembly; when the electronic device shakes, the lens assembly deviates, and the IC driver chip controls the motor action according to the offset of the lens assembly in the X, Y and AF directions to drive the lens assembly to move in a direction perpendicular to the optical axis of the lens assembly and / or parallel to the optical axis of the lens assembly, so as to realize the movement of the lens assembly in the X, Y and AF directions, reset the lens assembly, and finally eliminate the influence of the shaking of the electronic device on the shooting work. Since the driving of the motor is only controlled by the IC driver chip, the control of the IC driver chip can be realized by a current acting on the IC driver chip, so that the motor can be moved in the X, Y and AF directions. The effective coordination of the Y direction and the Z direction of AF to control the lens assembly significantly improves the control speed and control effect of the motor, thereby significantly improving the anti-shake effect of the anti-shake module. At the same time, during the production work, the anti-shake module only needs to produce one IC driver chip, which can effectively reduce the production cost of the anti-shake module compared to the existing production of two modules, the OIS driver chip and the AF driver chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 A schematic diagram of the three-dimensional structure of the anti-shake module in an embodiment of the present application is shown;

[0030] Figure 2 A front view of the anti-shake module in an embodiment of the present application is shown;

[0031] Figure 3 Shows Figure 2 Sectional view along AA direction;

[0032] Figure 4 A schematic diagram of the three-dimensional structure of the anti-shake module hiding the lens and the lens in the embodiment of the present application is shown;

[0033] Figure 5 A schematic diagram of the three-dimensional structure of a support frame and an optical filter of an anti-shake module in an embodiment of the present application is shown;

[0034] Figure 6 A schematic diagram of the three-dimensional structure of a support frame of an anti-shake module in an embodiment of the present application is shown;

[0035] Figure 7 Another three-dimensional structural schematic diagram of the support frame of the anti-shake module in the embodiment of the present application is shown.

[0036] Reference numerals:

[0037] 10—Circuit board 11—Connector 12—Image sensor

[0038] 13—flexible connection plate 14—support plate 20—motor

[0039] 21 - housing 22 - lens 23 - lens

[0040] 24—avoidance groove 25—fixed frame 30—lens assembly

[0041] 31—positioning protrusion 40—IC driver chip 50—driver frame

[0042] 51 - Positioning installation slot 52 - Shadowless adhesive 53 - Magnetic installation slot

[0043] 60—support frame 61—support edge 62—strengthening rib

[0044] 63—Anti-scratch protrusion 64—Installation notch 65—Filter installation slot

[0045] 66—accommodation groove 67—air escape hole 70—optical filter. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0047] In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides various specific examples of processes and materials, but those of ordinary skill in the art may recognize the application of other processes and / or the use of other materials.

[0048] The present application is described below in conjunction with the accompanying drawings and with reference to specific embodiments: The present application provides an anti-shake module, such as Figure 1-3As shown, it includes a circuit board 10, a motor 20, a lens assembly 30, and an IC driver chip 40 (not marked in the figure). The circuit board 10 is provided with an image sensor 12; the motor 20 is fixed on the circuit board 10; the lens assembly 30 is installed in the motor 20 and is located above the image sensor 12; the IC driver chip 40 is used to control the movement of the motor 20 to drive the lens assembly 30 to move along a direction perpendicular to the optical axis of the lens assembly 30 (i.e., the axis whose direction remains unchanged when the light passes through the lens assembly 30) and / or along a direction parallel to the optical axis of the lens assembly 30.

[0049] When taking a photo, light is incident on the image sensor 12 of the circuit board 10 through the lens assembly 30. When the electronic device shakes, the lens assembly 30 is offset, and the IC driver chip controls the action of the motor 20 according to the offset of the lens assembly 30 in the X, Y and AF directions, so as to drive the lens assembly 30 to move in a direction perpendicular to the optical axis of the lens assembly 30 and / or parallel to the optical axis of the lens assembly 30, so as to realize the movement of the lens assembly 30 in the X, Y and AF directions, reset the lens assembly 30, and finally eliminate the influence of the shaking of the electronic device on the shooting work. Since the driving of the motor 20 is only controlled by the IC driver chip, the electric current acting on the IC driver chip can be used to control the motor 20. The IC driver chip can be controlled by the flow, and the effective coordination of the motor 20 in the X and Y directions (directions perpendicular to the optical axis of the lens assembly 30) and the Z direction of the AF (direction parallel to the optical axis of the lens assembly 30) to control the lens assembly 30 can be achieved. The control speed and control effect of the motor 20 are significantly improved, so that the anti-shake effect of the anti-shake module is significantly improved. At the same time, in the production work, only one IC driver chip needs to be produced. Compared with the production work of the existing OISIC driver chip and AFIC driver chip two modules, the production cost of the anti-shake module can be effectively reduced. In this embodiment, further, as Figure 1-2 As shown, a flexible connection board 13 is provided on one side of the circuit board 10, and a connector 11 is provided on the flexible connection board 13. The connector 11 can be connected to a power module of an external electronic device to supply power to the anti-shake module.

[0050] In this example, the IC driver chip 40 is provided with an OIS register and an AF memory. The OIS register is provided with position information of the optical center of the camera shake front lens assembly 30 in the X and Y directions, and the AF memory is provided with position information of the optical center of the camera shake front lens assembly 30 in the Z direction.

[0051] In this example, the anti-shake module also includes an anti-shake unit, which is electrically connected to the OIS register and the AF memory, and is used to control the motor action according to the position information of the optical center of the lens assembly 30 in the X, Y and Z directions after the camera shakes, so as to drive the lens assembly 30 to move in a direction perpendicular to the optical axis of the lens assembly 30 and / or in a direction parallel to the optical axis of the lens assembly 30, so that the optical center of the lens assembly 30 moves to the position of the optical center of the lens assembly 30 before the camera shakes.

[0052] In some embodiments, the anti-shake unit includes a signal receiver and a displacement sensor. The signal receiver is arranged in an IC driver chip and is electrically connected to the OIS register and the AF memory, so as to retrieve the position information of the optical center of the lens assembly 30 in the X, Y and Z directions before the camera shakes. The displacement sensor is arranged on the motor and is electrically connected to the signal receiver, so as to transmit the position information of the optical center of the lens assembly 30 in the X, Y and Z directions after the camera shakes to the signal receiver. The signal receiver controls the motor action according to the position offset of the optical center of the lens assembly 30 after the camera shakes, so as to drive the lens assembly 30 to move in a direction perpendicular to the optical axis of the lens assembly 30 and / or in a direction parallel to the optical axis of the lens assembly 30, so that the optical center of the lens assembly 30 moves to the position of the optical center of the lens assembly 30 before the camera shakes.

[0053] Specifically, the displacement sensor senses the X, Y and Z position information of the optical center of the lens assembly 30 after the camera shakes, and transmits the X, Y and Z position information of the optical center of the lens assembly 30 after the camera shakes to the signal receiver. The signal receiver retrieves the X and Y position information of the optical center of the lens assembly 30 from the OIS register, and retrieves the Z position information of the lens assembly 30 from the OIS register, and obtains the offset of the lens assembly 30 in the X, Y and Z directions through the X, Y and Z position information of the optical center of the lens assembly 30 after the shake. The signal receiver controls the action of the motor 20 according to the offset of the lens assembly 30 in the X, Y and Z directions, and finally drives the drive frame and the lens assembly 30 to move in the X, Y and Z directions, so that the optical center of the lens assembly moves to the position of the optical center of the lens assembly before the camera shakes, and finally realizes the anti-shake function of the anti-shake module.

[0054] In some embodiments, Figure 3 As shown, the motor 20 includes:

[0055] A housing 21, wherein the housing 21 is fixed on the circuit board 10;

[0056] A fixing frame (not marked in the figure), the fixing frame is fixed in the housing 21, and three rigid-flexible boards (RFPC) are fixed on the side of the fixing frame, and driving coils are arranged on the three rigid-flexible boards, and a displacement sensor (not marked in the figure) is arranged on one of the rigid-flexible boards, and the displacement sensor is electrically connected to the IC driving chip;

[0057] The driving frame is slidably connected to the fixed frame, and an X-direction magnet, a Y-direction magnet and a Z-direction magnet are fixed on the side of the driving frame. The X-direction magnet, the Y-direction magnet and the Z-direction magnet are respectively located on one side of the three driving coils; the lens assembly 30 is fixed on the driving frame.

[0058] Specifically, after the lens assembly 30 is installed on the driving frame, the optical center of the lens assembly 30 (i.e., the point where the direction of the light passing through the lens assembly 30 remains unchanged) is used as the reference point, and the position information of the reference point in the X, Y and Z directions is recorded into the IC driving chip 40. When the device shakes, the displacement sensor obtains the offset of the lens assembly 30 in the X, Y and Z directions through the position information of the reference point, and transmits the offset to the IC driving chip 40. The IC driving chip 40 controls the magnetic induction intensity of the driving coil by controlling the current acting on the three driving coils, which can change the magnetic force of the three driving coils acting on the X-direction magnet, the Y-direction magnet and the Z-direction magnet, and finally drives the driving frame and the lens assembly 30 to move in the X, Y and Z directions, and moves the optical center position of the lens assembly 30 to the reference point, so as to adjust the position of the lens assembly 30, and finally realize the anti-shake function of the anti-shake module.

[0059] In this embodiment, further, the lens assembly 30 is inserted into the driving frame 50 .

[0060] In this embodiment, further, Figure 3 As shown, the lens assembly 30 and the driving frame 50 are connected and fixed by a shadowless adhesive 52 .

[0061] In this embodiment, further, three magnet installation slots 53 are provided on the driving frame, and the X-direction magnet, the Y-direction magnet and the Z-direction magnet are fixed in the three magnet installation slots 53 respectively.

[0062] In this embodiment, further, Figure 1-3 As shown, the anti-shake module also includes a lens 22 and a lens 23. The shell 21 is fixed to the circuit board 10 through the support plate 14. The lens 22 is fixed to the top surface of the shell 21. The upper end of the lens assembly 30 extends to the interior of the lens 22. The lens 23 is fixed to the end surface of the lens 22 and is located above the lens assembly 30.

[0063] In some embodiments, the IC driver chip is disposed on a rigid-flexible board located on one side of the magnet in the Z direction.

[0064] Specifically, through this arrangement, while realizing the current control of the three driving coils by the IC driving chip, it is possible to effectively prevent the motor 20 from touching the IC driving chip 40 and causing damage to the IC driving chip 40 when installing the motor 20 .

[0065] In some embodiments, Figure 3 As shown, an escape groove 24 is provided at one end of the housing 21 fixed on the circuit board 10 , and the IC driving chip 40 is disposed on the circuit board 10 and located in the escape groove 24 .

[0066] Specifically, by setting the IC driver chip 40 on the circuit board 10, the installation of the IC driver chip 40 and the electrical connection between the IC driver chip 40 and the circuit board 10 can be facilitated. The setting of the avoidance groove 24 can reduce the contact area between the motor 20 and the circuit board 10, and effectively avoid damage to electronic components including the IC driver chip 40 on the circuit board 10 during the installation of the motor 20. The IC driver chip 40 is set in the avoidance groove 24 and can be protected by the groove wall of the avoidance groove 24, thereby effectively improving the service life of the IC driver chip 40.

[0067] In some embodiments, Figure 4 As shown, a positioning protrusion 31 is provided on the side of the lens assembly 30, and a positioning installation groove 51 adapted to the positioning protrusion 31 is provided on the drive frame 50, and the positioning protrusion 31 is located inside the positioning installation groove 51.

[0068] Specifically, when installing the lens assembly 30, the positioning protrusion 31 falls into the positioning installation groove 51, which can facilitate the installation of the lens assembly 30 on the one hand, and provide a reference for the installation of the lens assembly 30 on the other hand, preventing the position of the lens assembly 30 from being offset during installation, resulting in a deterioration in the shooting effect of the electronic device.

[0069] In some embodiments, Figure 3 and 5 As shown, the anti-shake module also includes:

[0070] A support frame 60, the support frame 60 is located below the lens assembly 30, and the bottom surface of the support frame 60 is fixed on the circuit board 10;

[0071] The filter 70 is fixed on the support frame 60 and is located between the lens assembly 30 and the image sensor 12 .

[0072] Specifically, the support frame 60 is glued to the surface of the circuit board 10 , and the support frame 60 can facilitate the fixing and installation of the filter 70 . When taking pictures, the image is first filtered by the filter 70 and then emitted into the image sensor 12 .

[0073] In some embodiments, Figure 3 and 7 As shown, a supporting edge 61 is disposed on the bottom surface of the supporting frame 60 , and the supporting frame 60 is fixed on the circuit board 10 via the supporting edge 61 . A reinforcing rib 62 is disposed between the supporting edge 61 and the supporting frame 60 .

[0074] Specifically, the setting of the support edge 61 can reduce the contact area between the support frame 60 and the circuit board 10 while ensuring the stable installation of the support frame 60, thereby avoiding damage to electronic components such as the image sensor 12 and the IC driver chip 40 on the circuit board 10 when installing the support frame 60, and protecting the image sensor 12 at the same time. The reinforcing rib 62 can stabilize the connection between the support edge 61 and the support frame 60, and protect the support edge 61.

[0075] In some embodiments, Figure 3 and 5 As shown in Figure 6, a plurality of anti-scratch protrusions 63 are provided on the top surface of the support frame 60, and each anti-scratch protrusion 63 is located around the filter 70. Specifically, the anti-scratch protrusion 63 can protect the filter 70 and prevent the filter 70 from being scratched, thereby affecting the working performance of the filter 70.

[0076] In some embodiments, mounting notches 64 are provided between the anti-scratch protrusions 63 .

[0077] Specifically, when installing the filter 70 , glue must be applied to the support frame 60 first, and then the filter 70 is taken and glued to the support frame 60 by glue. The setting of the installation notch 64 can facilitate the installation of the filter 70 .

[0078] In some embodiments, Figure 5-6 As shown, a filter installation groove 65 is provided on the top surface of the support frame 60, and the filter 70 is fixed on the filter installation groove 65. A receiving groove 66 is concavely provided on the side wall of the filter installation groove 65, and the receiving groove 66 is located on one side of the installation notch 64. Specifically, the receiving groove 66 can be used to accommodate fingers or clamping tools during installation, which facilitates the installation of the filter 70.

[0079] In some embodiments, Figure 5-7 As shown, an air escape hole 67 penetrating the support frame 60 is provided on the top surface of the support frame 60. Specifically, since the image sensor 12 generates a certain amount of heat when working, the ambient heat of the image sensor 12 increases, affecting the working performance of the image sensor 12. Due to the existence of the air escape hole 67, the hot air generated by the image sensor 12 when working can be effectively discharged from the air escape hole 67, thereby improving the working performance of the image sensor 12.

[0080] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0081] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise" and "counterclockwise" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0082] It should be noted that all directional indications in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0083] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0084] In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0085] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0086] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0087] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An anti-shake module, characterized in that: The anti-shake module comprises: A circuit board, wherein an image sensor is arranged on the circuit board; A motor, the motor is fixed on the circuit board and is controlled only by an IC driver chip; a lens assembly, the lens assembly being installed in the motor and located above the image sensor; An IC driver chip, the IC driver chip comprising an OIS register and an AF memory, the OIS register being provided with position information of the optical center of the lens assembly in the X and Y directions before the camera shakes, and the AF memory being provided with position information of the optical center of the lens assembly in the Z direction before the camera shakes; an anti-shake unit, the anti-shake unit being electrically connected to the OIS register and the AF memory, and the anti-shake unit being used to control the action of the motor according to the position information of the optical center of the lens assembly in the X, Y and Z directions after the camera shakes, so that the motor drives the lens assembly to move in a direction perpendicular to the optical axis of the lens assembly and / or in a direction parallel to the optical axis of the lens assembly, so that the optical center of the lens assembly moves to the position of the optical center of the lens assembly before the camera shakes; The anti-shake unit includes a signal receiver and a displacement sensor. The signal receiver is arranged in the IC driver chip and is electrically connected to the OIS register and the AF memory. The displacement sensor is arranged on the motor and is electrically connected to the signal receiver. The signal receiver controls the motor action according to the position offset of the optical center of the lens assembly after the camera shakes.

2. The anti-shake module according to claim 1, characterized in that: The motor comprises: A housing; the housing is fixed on the circuit board; A fixing frame, the fixing frame is fixed in the shell, three hard-soft boards are fixed on the side of the fixing frame, driving coils are arranged on the three hard-soft boards, the displacement sensor is arranged on one of the hard-soft boards, and the displacement sensor is electrically connected to the IC driving chip; a driving frame, the driving frame is slidably connected to the fixing frame, an X-direction magnet, a Y-direction magnet and a Z-direction magnet are fixed on the side of the driving frame, and the X-direction magnet, the Y-direction magnet and the Z-direction magnet are respectively located on one side of the three driving coils; the lens assembly is fixed on the driving frame.

3. The anti-shake module according to claim 2, characterized in that: The IC driving chip is arranged on the hard-flexible board located on one side of the Z-direction magnet.

4. The anti-shake module according to claim 2, characterized in that: A positioning protrusion is arranged on the side of the lens assembly, and a positioning installation groove adapted to the positioning protrusion is arranged on the driving frame, and the positioning protrusion is located inside the positioning installation groove.

5. The anti-shake module according to any one of claims 1 to 4, characterized in that: The anti-shake module also includes: A support frame, the support frame is located below the lens assembly, and the bottom surface of the support frame is fixed on the circuit board; A filter is fixed on the support frame and is located between the lens assembly and the image sensor.

6. The anti-shake module according to claim 5, characterized in that: The bottom surface of the support frame is provided with a support edge, the support frame is fixed on the circuit board through the support edge, and a reinforcing rib is provided between the support edge and the support frame.

7. The anti-shake module according to claim 5, characterized in that: A plurality of anti-scratch protrusions are arranged on the top surface of the support frame, and each of the anti-scratch protrusions is located on the peripheral side of the filter.

8. The anti-shake module according to claim 7, characterized in that: An installation notch is provided between the anti-scratch protrusions, a filter installation groove is provided on the top surface of the support frame, the filter is fixed on the filter installation groove, a receiving groove is recessed on the side wall of the filter installation groove, and the receiving groove is located on one side of the installation notch.

9. The anti-shake module according to claim 5, characterized in that: An air escape hole penetrating through the support frame is arranged on the top surface of the support frame.

Images