Adsorption control system and control method

Abstract

The present invention discloses an adsorption control system and control method, including an adsorption platform, a blower assembly, a pressure sensor assembly and a control module; the adsorption platform has an adsorption chamber, a suction hole connected to the adsorption chamber and an extraction hole connected to the adsorption chamber; the blower assembly is connected to the extraction hole; the pressure sensor assembly is used to detect the pressure feedback value in the adsorption chamber; the control module is electrically connected to the blower assembly and the pressure sensor assembly, and the control module is preset with a pressure reference value of the adsorption chamber, and the control module controls the rotation speed of the blower assembly according to the comparison result between the pressure reference value and the pressure feedback value. The control system in this technical solution integrates detection, feedback, control and execution. By using this technical solution, the adsorption force of the adsorption platform can be adjusted to a certain extent according to the use requirements, solving the technical problems in the prior art that the exposure accuracy of the PCB board is affected by too small an adsorption force and the PCB board is marked by too large an adsorption force.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB boards, and in particular to an adsorption control system and a control method. Background Art

[0002] In the process of PCB (Printed Circuit Board, Chinese name is printed circuit board, also known as printed circuit board) board processing and manufacturing, circuit exposure of PCB board is a very important link. No matter what type of equipment is used to expose the circuit of PCB board, flattening the PCB board and firmly adsorbing it on the work surface is the prerequisite for ensuring exposure accuracy.

[0003] With the diversification of market demand, PCB board design is becoming more and more complex, and the specifications and models of PCB boards are also increasing. For example, different thicknesses of PCB boards require different adsorption forces. When the thickness of the PCB board is large, if the adsorption force is small, the adsorption platform cannot stably adsorb the PCB board and affect the exposure accuracy; when the thickness of the PCB board is small, especially when exposing a thin dry film or wet film, if the adsorption force is large, it is easy to form marks on the surface of the PCB board and affect the quality of the PCB board. Summary of the invention

[0004] Based on this, the present invention provides an adsorption control system and a control method to solve the technical problems in the prior art that the exposure accuracy of the PCB board is affected by too small an adsorption force and that the PCB board is marked by too large an adsorption force, breaking through the technical bottleneck of the existing equipment and greatly expanding the application scope of the equipment.

[0005] In a first aspect, the present invention provides an adsorption control system, comprising:

[0006] An adsorption platform, comprising an adsorption cavity, a suction hole communicating with the adsorption cavity, and an extraction hole communicating with the adsorption cavity;

[0007] a blower assembly, the blower assembly being in communication with the suction hole;

[0008] A pressure sensor assembly, the pressure sensor assembly is used to detect a pressure feedback value in the adsorption chamber;

[0009] A control module, wherein the control module is electrically connected to the blower assembly and the pressure sensor assembly, and a pressure reference value of the adsorption chamber is preset in the control module, and the control module controls the rotation speed of the blower assembly according to a comparison result between the pressure reference value and the pressure feedback value.

[0010] In an embodiment of the control system, the adsorption platform comprises a lower panel having the suction hole and an upper panel for covering the lower panel to form the adsorption chamber, and the upper panel is provided with the suction hole;

[0011] The upper panel has a middle area and an edge area surrounding the middle area, and a spacing distance between two adjacent suction holes in the edge area is smaller than a spacing distance between two adjacent suction holes in the middle area.

[0012] In an embodiment of the control system, the middle axis of the extraction hole does not coincide with the central axis of the suction hole.

[0013] In an embodiment of a control system, the adsorption chamber is divided into a plurality of sub-chambers arranged in sequence along its long axis direction; the pressure sensor assembly includes a plurality of pressure sensors, and the plurality of pressure sensors correspond one-to-one to the plurality of sub-chambers.

[0014] In an embodiment of the control system, the sub-chamber is connected to at least two of the pumping holes, and the two pumping holes are arranged at two ends of the sub-chamber along the short axis direction of the adsorption platform;

[0015] Alternatively, the sub-cavity is connected to at least one of the pumping holes, and the two pumping holes respectively connected to two adjacent sub-cavities are arranged at both ends of the short axis of the adsorption platform.

[0016] In an embodiment of the control system, the blower assembly includes a blower and a solenoid valve connected between the blower and the adsorption platform.

[0017] In an embodiment of the control system, the blower assembly further comprises a pressure relief valve connected between the blower and the adsorption platform.

[0018] In an embodiment of the control system, the control module includes a controller, a control panel electrically connected to an input end of the controller, and a frequency converter connected between an output end of the controller and the blower.

[0019] The second aspect provides a control method of the control system according to the first aspect, comprising:

[0020] Inputting a preset pressure reference value into a control module;

[0021] The pressure sensor assembly detects a pressure feedback value of the adsorption chamber and transmits the pressure feedback value to the control module;

[0022] The control module compares the pressure feedback value with the pressure reference value, and adjusts the rotation speed of the blower assembly according to the comparison result.

[0023] In an embodiment of the control method, adjusting the rotation speed of the blower assembly according to the comparison result is specifically:

[0024] When the pressure feedback value is greater than the upper threshold of the pressure reference value, increasing the rotation speed of the blower assembly;

[0025] When the pressure feedback value is less than a lower threshold value of the pressure reference value, reducing the rotation speed of the blower assembly;

[0026] When the pressure feedback value is greater than a lower threshold value of the pressure reference value and less than an upper threshold value of the pressure reference value, the rotation speed of the blower assembly is kept unchanged.

[0027] The embodiments of the present invention have the following beneficial effects:

[0028] In the present invention, the adsorption platform, the blower assembly, the pressure sensor assembly and the control module form a closed-loop system, and the pressure reference value of the adsorption chamber set in advance is input into the control module. When the pressure feedback value of the adsorption chamber detected by the pressure sensor assembly is greater than the pressure reference value, it means that the adsorption force of the adsorption chamber on the PCB board is too small to maintain the stable placement of the PCB board. The control module automatically outputs a signal instruction to control the blower to increase the speed, so as to achieve the purpose of increasing the adsorption force by reducing the pressure in the adsorption chamber; when the pressure feedback value is less than the pressure reference value, it means that the adsorption force of the adsorption chamber is too large, and the control module automatically outputs a signal instruction to control the blower to reduce the speed, so as to achieve the purpose of reducing the adsorption force by increasing the pressure in the adsorption chamber. The control system in the technical scheme integrates detection, feedback, control and execution. The adsorption force of the adsorption platform can be adjusted to a certain extent according to the use requirements by using the technical scheme, which solves the technical problems in the prior art that the exposure accuracy of the PCB board is affected by the too small adsorption force and the imprint is formed on the PCB board due to the too large adsorption force, breaks through the technical bottleneck of the existing equipment, and greatly expands the application scope of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] in:

[0031] Figure 1 It shows a structural block diagram of an adsorption control system provided according to an embodiment of the present invention;

[0032] Figure 2A schematic structural diagram of the lower panel of the adsorption platform is shown;

[0033] Figure 3 A schematic structural diagram of the upper panel of the adsorption platform is shown;

[0034] Figure 4 A schematic diagram of a flow chart of a control method provided according to an embodiment of the present invention is shown;

[0035] Figure 5 Another schematic flow chart of a control method provided according to an embodiment of the present invention is shown.

[0036] Description of main component symbols:

[0037] 10. Adsorption platform; 11a. Adsorption chamber; 11a1. Sub-chamber; 11b. Suction hole; 11c. Extraction hole; 11d. Detection hole; 11. Lower panel; 12. Upper panel; 121. Middle area; 122. Edge area; 20. Blower assembly; 21. Blower; 22. Solenoid valve; 23. Pressure relief valve; 30. Pressure sensor assembly; 40. Control module; 41. Controller; 42. Control panel; 43. Frequency converter. DETAILED DESCRIPTION

[0038] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many other different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0039] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0041] The embodiments of the present invention are described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0042] See also Figure 1-Figure 3The present invention provides an adsorption control system, which includes an adsorption platform 10, a blower assembly 20, a pressure sensor assembly 30 and a control module 40; the adsorption platform 10 has an adsorption chamber 11a, a suction hole 11b connected to the adsorption chamber 11a and an extraction hole 11c connected to the adsorption chamber 11a; the blower assembly 20 is connected to the extraction hole 11c; the pressure sensor assembly 30 is used to detect the pressure feedback value in the adsorption chamber 11a; the control module 40 is electrically connected to the blower assembly 20 and the pressure sensor assembly 30, and the control module 40 is preset with a pressure reference value of the adsorption chamber 11a, and the control module 40 controls the rotation speed of the blower assembly 20 according to the comparison result between the pressure reference value and the pressure feedback value.

[0043] The PCB board is placed on a table with a suction hole 11b on the adsorption platform 10, and the blower assembly 20 is connected to the adsorption chamber 11a through the suction hole 11c to evacuate the adsorption chamber 11a, so that the pressure in the adsorption chamber 11a is lower than the external atmospheric pressure, thereby adsorbing the PCB board on the adsorption platform 10 through the suction hole 11b.

[0044] In the present invention, the adsorption platform 10, the blower assembly 20, the pressure sensor assembly 30 and the control module 40 form a closed-loop system, and a preset pressure reference value of the adsorption chamber 11a is input into the control module 40. When the pressure feedback value of the adsorption chamber 11a detected by the pressure sensor assembly 30 is greater than the pressure reference value, it means that the adsorption force of the adsorption chamber 11a on the PCB board is too small to maintain the stable placement of the PCB board. The control module 40 automatically outputs a signal instruction to control the blower 21 to increase the rotation speed, so as to achieve the purpose of increasing the adsorption force by reducing the pressure in the adsorption chamber 11a; when the pressure feedback value is less than the pressure reference value, it means that the adsorption force of the adsorption chamber 11a is too large, and the control module 40 automatically outputs a signal instruction to control the blower 21 to reduce the rotation speed, so as to achieve the purpose of reducing the adsorption force by increasing the pressure in the adsorption chamber 11a. The control system in the present technical solution integrates detection, feedback, control and execution. The present technical solution can be used to adjust the adsorption force of the adsorption platform 10 to a certain extent according to the use requirements, thereby solving the technical problems in the prior art that the exposure accuracy of the PCB board is affected by too small an adsorption force and that the PCB board is marked by too large an adsorption force, thereby breaking through the technical bottleneck of the existing equipment and greatly expanding the application scope of the equipment.

[0045] When exposing a dry film or a wet film, the pressure reference value is re-entered, and the rotation speed of the blower assembly 20 is adjusted based on the pressure reference value to adjust the adsorption force. This can avoid the problem of adsorption marks on the surface of the dry film or the wet film due to the large adsorption force during the exposure process, thereby causing certain quality defects.

[0046] See also Figure 2 and Figure 3In one embodiment, the adsorption platform 10 includes a lower panel 11 and an upper panel 12. The upper panel 12 covers the lower panel 11 to form an adsorption chamber 11a. A suction hole 11b is opened on the upper panel 12, that is, the PCB board is placed on the upper panel 12; an extraction hole 11c is opened on the lower panel 11, that is, the extraction hole 11c and the suction hole 11b are respectively arranged on the upper and lower sides of the adsorption platform 10.

[0047] In some specific embodiments, a detection hole 11d communicating with the adsorption chamber 11a may be opened on the lower panel 11, and the detection hole 11d is used to connect with the pressure sensor assembly 30 to detect the pressure in the adsorption chamber 11a.

[0048] When the drill hole of the PCB board coincides with the suction hole 11b, the adsorption force of the adsorption chamber 11a on the PCB board will be reduced. Therefore, the density of the suction holes 11b distributed on the upper panel 12 can be increased, that is, the spacing distance between two adjacent suction holes 11b can be reduced, and the number of suction holes 11b that can be used to adsorb the PCB board is increased, thereby improving the adsorption force of the adsorption platform 10 on the PCB board, preventing the adsorption platform 10 from being unable to firmly adsorb the PCB board due to leakage of the suction holes 11b, thereby affecting the exposure accuracy of the PCB board.

[0049] In some specific embodiments, the suction holes 11 b are arranged in a matrix structure so that the adsorption force of the adsorption cavity 11 a acts evenly on the PCB board.

[0050] In one embodiment, the upper panel 12 has a middle area 121 and an edge area 122 surrounding the middle area 121, and the spacing distance between two adjacent suction holes 11b in the edge area 122 is smaller than the spacing distance between two adjacent suction holes 11b in the middle area 121. When the PCB board has a warped edge during transportation, handling or storage, the adsorption force of the adsorption platform 10 on the PCB board will decrease. To address this, the density of the suction holes 11b distributed in the edge area 122 is greater than the density of the suction holes 11b distributed in the middle area, thereby increasing the adsorption force of the adsorption chamber 11a on the edge of the PCB, and the adsorption force of the adsorption chamber 11a on the edge of the PCB board is greater than the adsorption force on the middle of the PCB board, thereby preventing the PCB board from being stably adsorbed on the adsorption platform 10 due to the warped edge.

[0051] In one embodiment, the middle axis of the extraction hole 11c does not coincide with the central axis of the suction hole 11b. Therefore, the extraction hole 11c is not directly opposite to any suction hole 11b, so that when the suction hole 11b is connected to the drilled hole of the PCB board, the pressure loss of the adsorption chamber 11a can be reduced.

[0052] In one embodiment, the adsorption chamber 11a is divided into a plurality of sub-chambers 11a1 arranged in sequence along its long axis direction; the pressure sensor assembly 30 includes a plurality of pressure sensors, and the plurality of pressure sensors correspond to the plurality of sub-chambers 11a1 one by one.

[0053] It should be noted that the sub-cavities 11a1 are independent of each other and are not connected to each other. Therefore, the working number of the sub-cavities 11a1 can be selected according to the size of the PCB board, that is, the PCB board can be adsorbed by one sub-cavity 11a1, or by two or more sub-cavities 11a1. This prevents the leakage phenomenon due to the PCB board being too small, or the phenomenon that the PCB board cannot be adsorbed stably due to the PCB board being too large, so as to adapt to PCB boards of various sizes and specifications.

[0054] In one embodiment, the sub-cavity 11a1 is connected to at least two extraction holes 11c, which are arranged at both ends of the sub-cavity 11a1 along the short axis direction of the adsorption platform 10. On the one hand, it is convenient to connect the pipeline to the extraction holes 11c, and on the other hand, it can ensure that the force on both sides of the adsorption platform 10 is balanced.

[0055] Or, the sub-cavity is connected to at least one of the pumping holes, and the two pumping holes 11c respectively connected to the two adjacent sub-cavities 11a1 are arranged at both ends of the short axis of the adsorption platform 10. On the one hand, it is convenient to connect the pipeline to the pumping hole 11c, and on the other hand, it can ensure that the force on both sides of the adsorption platform 10 is balanced.

[0056] In some specific embodiments, the plurality of sub-cavities 11a1 are specifically a first sub-cavity, a second sub-cavity and a third sub-cavity, wherein the volume of the first sub-cavity is greater than the volumes of the second sub-cavity and the third sub-cavity, that is, the adsorption area of ​​the first sub-cavity is the largest, and the first sub-cavity is connected to at least two extraction holes 11c, which are arranged at both ends of the first sub-cavity 11a1 along the short axis direction of the adsorption platform 10; the second sub-cavity and the third sub-cavity are both connected to at least one extraction hole 11c, and the two extraction holes 11c respectively connected to the second sub-cavity and the third sub-cavity are arranged at both ends of the short axis of the adsorption platform 10.

[0057] It should be noted that the specific number and volume settings of the sub-cavities 11a1 include but are not limited to these. The number and volume settings of the sub-cavities 11a1 can be set according to actual needs, and the extraction holes 11c can be adaptively distributed based on the volume of the sub-cavities 11a1.

[0058] In some specific embodiments, each sub-cavity 11a1 is connected to a detection hole 11d, and the detection hole 11d is located at an end of the sub-cavity 11a1 away from the extraction hole 11c, that is, the detection hole 11d and the extraction hole 11c are alternately arranged at different ends of the sub-cavity 11a1, further ensuring the force balance of the adsorption platform 10.

[0059] Combination Figure 1The blower assembly 20 includes a blower 21 and a solenoid valve 22 connected between the blower 21 and the adsorption platform 10. The blower 21 controls the vacuuming of several sub-cavities 11a1 through the solenoid valve 22, such as vacuuming a certain sub-cavity 11a1 alone, or vacuuming multiple sub-cavities 11a1 at the same time. Specifically, the blower 21 is connected to each sub-cavity 11a1 through a branch pipe, and the solenoid valve 22 is used to control the opening and closing of each branch pipe.

[0060] Among them, the blower 21 adopts a modified three-phase single-stage blower 21. The modified three-phase single-stage blower 21 can increase the ventilation volume per unit time while maintaining the original rotation speed and maximum vacuum pressure value. When the adsorption pressure of the adsorption platform 10 drops due to the leakage of the suction hole 11b, it can play a certain compensatory role and reduce the degree of adsorption pressure drop. And the rotation speed of the blower 21 is usually between 1500r / min-3600r / min. Therefore, when the PCB board leaks during the adsorption exposure process on the adsorption platform 10, the blower 21 can play a closed-loop voltage stabilization role in a larger range, expanding the scope of use of the equipment.

[0061] In some specific embodiments, the blower assembly 20 further includes a pressure relief valve 23 connected between the blower 21 and the adsorption platform 10. The pressure relief valve 23 is used to ensure the safe operation of the blower 21. Specifically, when the pressure in the adsorption chamber 11a is less than the set minimum pressure value, the pressure relief valve 23 is opened, and the pressure in the adsorption chamber 11a is increased to prevent the blower 21 from burning.

[0062] Continue to combine Figure 1 In one embodiment, the control module 40 includes a controller 41, a control panel 42 electrically connected to the input end of the controller 41, and a frequency converter 43 connected between the output end of the controller 41 and the blower 21. A preset pressure reference value is input through the control panel 42, and the controller 41 receives the pressure reference value of the control panel 42 and the pressure feedback value detected by the pressure sensor assembly 30, and compares the two; then the frequency converter 43 is controlled according to the comparison result, and then the frequency converter 43 outputs different frequency signals according to the control instruction to adjust the speed of the blower 21. Among them, the input pressure reference value can be changed accordingly according to the thickness of the PCB board, that is, different PCB boards correspond to different pressure reference values.

[0063] Specifically, when the pressure feedback value is greater than the pressure reference value, it indicates that the adsorption force is too small. The controller 41 outputs a control instruction to the frequency converter 43. The frequency converter 43 increases the rotation speed of the blower 21 by increasing the output frequency of the motor, thereby achieving the purpose of reducing the pressure in the adsorption chamber 11a. When the pressure feedback value is less than the pressure reference value, it indicates that the adsorption force is too large. The controller 41 outputs a control instruction to the frequency converter 43. The frequency converter 43 reduces the rotation speed of the blower 21 by reducing the output frequency of the motor, thereby achieving the purpose of increasing the pressure in the adsorption chamber 11a.

[0064] See also Figure 4 The present invention also provides a control method for the above control system, which specifically includes:

[0065] 101. Input a preset pressure reference value into the control module 40;

[0066] 102. The pressure sensor assembly 30 detects a pressure feedback value of the adsorption chamber 11a, and transmits the pressure feedback value to the control module 40;

[0067] 103. The control module 40 compares the pressure feedback value with the pressure reference value, and adjusts the rotation speed of the blower assembly 20 according to the comparison result.

[0068] That is, the control system compares the pressure feedback value detected by the pressure sensor assembly 30 with the preset pressure reference value, and then adjusts the speed of the blower 21 according to the comparison result, thereby adjusting the adsorption force of the adsorption platform 10 on the PCB board. Among them, the input pressure reference value can be changed accordingly according to the thickness of the PCB board, that is, different PCB boards correspond to different pressure reference values;

[0069] See also Figure 5 In one embodiment, the speed of the blower assembly 20 is adjusted according to the comparison result, specifically:

[0070] 201. When the pressure feedback value is greater than the upper threshold of the pressure reference value, increase the rotation speed of the blower assembly 20;

[0071] 202. When the pressure feedback value is less than the lower threshold of the pressure reference value, the rotation speed of the blower assembly 20 is reduced;

[0072] 202. When the pressure feedback value is greater than the lower threshold of the pressure reference value and less than the upper threshold of the pressure reference value, the rotation speed of the blower assembly 20 is kept unchanged.

[0073] Specifically, a preset pressure reference value is input into the control panel 42 , and an upper threshold and a lower threshold of the pressure reference value are defined by the control panel 42 , and the upper threshold is greater than the lower threshold; the control panel 42 then transmits the upper threshold and the lower threshold to the controller 41 .

[0074] When the pressure feedback value detected by the pressure sensor assembly 30 is greater than the upper threshold value of the input pressure reference value, it indicates that the adsorption force is too small. The controller 41 outputs a control instruction to the frequency converter 43. The frequency converter 43 increases the rotation speed of the blower assembly 20 by increasing the output frequency of the motor, thereby achieving the purpose of increasing the adsorption force by reducing the pressure in the adsorption chamber 11a; when the pressure feedback value detected by the pressure sensor assembly 30 is less than the lower threshold value of the input pressure reference value, it indicates that the adsorption force is too large. The controller 41 outputs a control instruction to the frequency converter 43. The frequency converter 43 reduces the rotation speed of the blower assembly 20 by reducing the output frequency of the motor, thereby achieving the purpose of reducing the adsorption force by increasing the pressure in the adsorption chamber 11a; when the pressure feedback value detected by the pressure sensor assembly 30 is between the upper threshold value and the lower threshold value of the pressure reference value, it indicates that the pressure state in the adsorption chamber 11a is stable, and the blower 21 maintains the current rotation speed.

[0075] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims. The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. An adsorption control system, characterized in that: include: An adsorption platform, which has an adsorption cavity, a suction hole connected to the adsorption cavity, and an extraction hole connected to the adsorption cavity, the adsorption platform includes a lower panel having the extraction hole and an upper panel used to cover the lower panel to form the adsorption cavity, and the upper panel is provided with the suction hole; The upper panel has a middle area and an edge area surrounding the middle area, and the spacing distance between two adjacent suction holes in the edge area is smaller than the spacing distance between two adjacent suction holes in the middle area; a blower assembly, the blower assembly being in communication with the suction hole; A pressure sensor assembly, the pressure sensor assembly is used to detect a pressure feedback value in the adsorption chamber; A control module, wherein the control module is electrically connected to the blower assembly and the pressure sensor assembly, and a pressure reference value of the adsorption chamber is preset in the control module, and the control module controls the rotation speed of the blower assembly according to a comparison result between the pressure reference value and the pressure feedback value; The adsorption chamber is divided into a plurality of sub-chambers arranged in sequence along its long axis direction, including a first sub-chamber, a second sub-chamber and a third sub-chamber, wherein the volume of the first sub-chamber is larger than the volumes of the second sub-chamber and the third sub-chamber, the first sub-chamber is connected to at least two of the extraction holes, and the two extraction holes are respectively arranged at both ends of the first sub-chamber along the short axis direction of the adsorption platform; the second sub-chamber and the third sub-chamber are both connected to at least one of the extraction holes, and the two extraction holes respectively connected to the second sub-chamber and the third sub-chamber are respectively arranged at both ends of the short axis of the adsorption platform; Each of the sub-cavities is connected to a detection hole, and the detection hole is located at one end of the sub-cavity away from the pumping hole, and the detection hole is used to connect with the pressure sensor assembly.

2. The control system according to claim 1, characterized in that: The middle axis of the extraction hole does not coincide with the central axis of the suction hole.

3. The control system according to claim 1, characterized in that: The pressure sensor assembly includes a plurality of pressure sensors, and the plurality of pressure sensors correspond one-to-one to a plurality of sub-cavities.

4. The control system according to claim 1, characterized in that: The blower assembly comprises a blower and a solenoid valve connected between the blower and the adsorption platform.

5. The control system according to claim 4, characterized in that: The blower assembly also includes a pressure relief valve connected between the blower and the adsorption platform.

6. The control system according to claim 1, characterized in that: The control module includes a controller, a control panel electrically connected to an input end of the controller, and a frequency converter connected between an output end of the controller and the blower.

7. A control method of the control system according to any one of claims 1 to 6, characterized in that: include: Inputting a preset pressure reference value into a control module; The pressure sensor assembly detects a pressure feedback value of the adsorption chamber and transmits the pressure feedback value to the control module; The control module compares the pressure feedback value with the pressure reference value, and adjusts the rotation speed of the blower assembly according to the comparison result.

8. The control method according to claim 7, characterized in that: The adjusting the rotation speed of the blower assembly according to the comparison result is specifically: When the pressure feedback value is greater than the upper threshold of the pressure reference value, increasing the rotation speed of the blower assembly; When the pressure feedback value is less than a lower threshold value of the pressure reference value, reducing the rotation speed of the blower assembly; When the pressure feedback value is greater than a lower threshold value of the pressure reference value and less than an upper threshold value of the pressure reference value, the rotation speed of the blower assembly is kept unchanged.

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