Silicon wafer automatic chamfering and cleaning integrated equipment

Abstract

The present application relates to the field of silicon processing technology, and in particular to an integrated device for automatic chamfering and cleaning of silicon wafers, comprising: a transfer mechanism, a detection mechanism, a chamfering mechanism and a cleaning mechanism arranged along the circumference of the transfer mechanism, the chamfering mechanism being adjacent to the detection mechanism; the cleaning mechanism being adjacent to the chamfering mechanism; a loading mechanism, comprising a first loading unit having a first receiving part and a second receiving part and a second loading unit having a third receiving part, the second receiving part being used to obtain the processed silicon wafers and transport them to the first interaction point, at the first interaction point, the first receiving part receives the silicon wafers on the receiving part, and after the receiving part transfers the obtained silicon wafers to the first receiving part, it simultaneously receives the silicon wafers on the second receiving part; the third receiving part receives the silicon wafers on the first receiving part and transports them to the mechanism paired with the first loading unit. The structure of the integrated device is simplified, the silicon wafer transportation path is shortened, the silicon wafer transportation speed is improved, the idleness of the mechanism is effectively avoided, and the overall processing speed of the silicon wafer is improved.

Description

Technical Field

[0001] The present application relates to the field of silicon processing technology, and in particular to an integrated device for automatic chamfering and cleaning of silicon wafers. Background Art

[0002] As a good conductive material, silicon wafers can be widely used in semiconductor, solar cell and other technical fields. The later processing of silicon wafers generally includes chamfering, cleaning, drying and other steps. Among them, the edges of the wafers formed by cutting are generally sharp, so the sharp edges of the silicon wafers need to be processed and trimmed into arcs through chamfering.

[0003] There is a kind of fully automatic silicon wafer chamfering processing equipment currently on the market, which improves the processing efficiency of silicon wafers by using a transfer mechanism to cooperate with multiple chamfering equipment mechanisms. However, multiple chamfering equipment are arranged on a bracket along a straight line, and the transfer mechanism can slide along the bracket and provide silicon wafers to multiple chamfering equipment one by one. The disadvantage of this equipment is that the transfer mechanism continuously moves back and forth on the bracket to transport silicon wafers. Along the length direction of the bracket, the silicon wafer transportation path of the transfer mechanism becomes longer and longer, resulting in a slower speed of the transfer mechanism to transport silicon wafers, which may cause some chamfering equipment to be idle, greatly affecting the overall processing efficiency of silicon wafers; and the fully automatic silicon wafer chamfering processing equipment does not have a cleaning function, and cannot realize the integrated processing of silicon wafer chamfering and cleaning.

[0004] There is also a silicon wafer chamfering processing equipment, which includes multiple mechanisms for processing silicon wafers. A transfer mechanism for transferring silicon wafers is allocated between every two adjacent mechanisms to improve the transfer efficiency of silicon wafers. However, such an arrangement results in a complex structure of the overall silicon wafer chamfering processing equipment, a high production line purchase cost, and a large site area. In addition, when each mechanism is processing the silicon wafer, the transfer mechanism is idle, wasting resources. Summary of the invention

[0005] Based on this, it is necessary to provide a silicon wafer automatic chamfering process that simplifies the process, optimizes the silicon wafer transfer process, and improves the coordination of each process step, so that the silicon wafer processing efficiency is increased exponentially.

[0006] The technical solutions provided by this application are as follows:

[0007] An integrated device for automatic chamfering and cleaning of silicon wafers, the integrated device comprising:

[0008] A detection mechanism, used for detecting and positioning the silicon wafer;

[0009] A chamfering mechanism, used for chamfering the silicon wafer after the detection and positioning has been completed, and the chamfering mechanism is arranged adjacent to the detection mechanism;

[0010] A cleaning mechanism, used for cleaning the chamfered silicon wafer, the cleaning mechanism being arranged adjacent to the chamfering mechanism; a transfer mechanism, used for transporting the silicon wafer, the transfer mechanism having a receiving portion for receiving the silicon wafer; wherein the detection mechanism, the chamfering mechanism and the cleaning mechanism are arranged along the circumference of the transfer mechanism;

[0011] A feeding mechanism, at least one of the detection mechanism, the chamfering mechanism and the cleaning mechanism is equipped with the feeding mechanism;

[0012] Among them, the loading mechanism includes a first loading unit and a second loading unit, the first loading unit has a first receiving part and a second receiving part, the second receiving part is used to obtain the silicon wafers that have been processed in the corresponding paired mechanism and transfer them to the first interaction point, at the first interaction point, the first receiving part is used to receive the silicon wafers on the receiving part, after the receiving part transfers the obtained silicon wafers to the first receiving part, it also receives the silicon wafers on the second receiving part; the second loading unit has at least one third receiving part for receiving silicon wafers, the third receiving part interacts with the first receiving part at the second interaction point to receive the silicon wafers on the first receiving part and transfer them to the mechanism paired with the first loading unit.

[0013] In one embodiment, the detection mechanism, the chamfering mechanism, and the cleaning mechanism are centered on the transfer mechanism and are evenly distributed along the circumference of the transfer mechanism.

[0014] In one embodiment, the number of the chamfering mechanisms is two, and the detection mechanism and the transfer mechanism are located between the two chamfering mechanisms.

[0015] In one of the embodiments, the detection mechanism, the chamfering mechanism, and the cleaning mechanism are all provided with a receiving tray for receiving silicon wafers, and along the height direction of the first loading unit, the projection of the second interaction point coincides with the receiving tray at the matching mechanism.

[0016] In one embodiment, the first loading unit includes a first support and a first arm, one end of the first arm is connected to the first support and can move relative to the first support, and the other end is provided with the first material receiving part and the second material receiving part; the second loading unit includes a second support and a second arm, one end of the second arm is connected to the first support and can move relative to the first support, and the other end is provided with the third material receiving part.

[0017] In one embodiment, the first support and the second support are configured to be separate.

[0018] In one embodiment, the first support and the second support are integrally formed.

[0019] In one embodiment, along the height direction of the first loading unit, the first material receiving portion is located directly above the second material receiving portion, so that after the receiving portion intersects with the first material receiving portion, it moves linearly downward along the height direction of the first loading unit to interact with the second material receiving portion.

[0020] In one embodiment, the first loading unit has an initial state and a transfer state. In the initial state, along the height direction of the first loading unit, the projections of the first material receiving portion and the second material receiving portion coincide with the first interaction point.

[0021] In one of the embodiments, along the height direction of the second loading unit, the projection of the third material receiving portion coincides with the second interaction point.

[0022] Compared with the prior art, the integrated equipment for automatic chamfering and cleaning of silicon wafers provided in the present application provides and transports silicon wafers for the detection mechanism, chamfering mechanism and cleaning mechanism through the cooperation of the transfer mechanism with the detection mechanism, chamfering mechanism and cleaning mechanism, so that the integrated equipment integrates multiple functions such as automatic loading and unloading, positioning detection, chamfering and cleaning, and is fully functional; wherein the detection mechanism, chamfering mechanism and cleaning mechanism are arranged circumferentially along the transfer mechanism, and such arrangement balances the path distances from the transfer mechanism to the detection mechanism, chamfering mechanism and cleaning mechanism, so that the path distances are equal or have a small difference, thereby shortening the time for the transfer mechanism to transport silicon wafers, improving the transportation efficiency of silicon wafers, and being able to replenish silicon wafers for each mechanism in time or transfer processed silicon wafers, making full use of the processing efficiency of each mechanism, avoiding as much as possible the idleness of the detection mechanism, chamfering mechanism, cleaning mechanism and transfer mechanism, thereby improving the processing rate of silicon wafers as a whole; and such arrangement, the detection mechanism, chamfering mechanism and cleaning mechanism share a transfer mechanism, which simplifies the structure of the integrated equipment, reduces costs, and reduces the occupied site area. In addition, through the cooperation between the transfer mechanism and the loading mechanism, the path length of a single transfer of the transfer mechanism is further shortened, and while the transfer mechanism transfers the silicon wafer to the first loading unit, it can also take over the processed silicon wafer and transfer it, thus reducing the number of transfers by the transfer mechanism and effectively saving the movement time of the transfer mechanism, so that the transfer mechanism has more sufficient time to timely transfer silicon wafers to the detection mechanism, chamfering mechanism and cleaning mechanism, thereby improving the overall efficiency of silicon wafer processing; and after the first loading unit and the second loading unit complete the interaction, the first loading unit moves to the paired mechanism to obtain the processed silicon wafer and transfers it to the first interaction station for the next interaction, shortening the single movement time and path length of the first loading unit, so that the transfer mechanism, the first loading unit and the second loading unit can operate simultaneously to shorten the transfer time of the silicon wafer, greatly improving the transfer efficiency of the silicon wafer and avoiding the existence of idle mechanisms. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 An automatic chamfering process for silicon wafers is provided in one embodiment of the present application.

[0025] Figure 2 A top view of an integrated device for automatic chamfering and cleaning of silicon wafers provided in one embodiment of the present application.

[0026] Figure 3 for Figure 2 Front view of the integrated equipment for automatic chamfering and cleaning of silicon wafers.

[0027] Figure 4 for Figure 2 Schematic diagram of the front side view of the integrated equipment for automatic chamfering and cleaning of silicon wafers.

[0028] Figure 5 for Figure 2 Schematic diagram of the back side view of the integrated equipment for automatic chamfering and cleaning of silicon wafers.

[0029] Figure 6 A schematic diagram of a chamfering mechanism provided in an embodiment of the present application.

[0030] Figure 7 for Figure 6 Schematic side view of the chamfering mechanism in FIG.

[0031] Figure 8 for Figure 6 Schematic diagram of the top view of the chamfering mechanism.

[0032] Fig. 9 A schematic diagram of the structure of a first feeding mechanism and a second feeding mechanism provided in one embodiment of the present application.

[0033] Fig.10 A schematic diagram of the structure of a cleaning mechanism provided in one embodiment of the present application.

[0034] Fig.11 The silicon wafer processed in one embodiment of the present application.

[0035] Reference numerals: 100, integrated equipment for automatic chamfering and cleaning of silicon wafers; 10, storage box; 20, detection mechanism; 21, visual detection module; 22, first rotating suction cup; 30, chamfering mechanism; 30a, first chamfering mechanism; 30b, second chamfering mechanism; 31, second rotating suction cup; 32, precise positioning detection module; 33, chamfering module; 40, cleaning mechanism; 41, third rotating suction cup; 42, cleaning module; 50, transfer mechanism; 51 , receiving part; 60, feeding mechanism; 61, first feeding unit; 611, first receiving part; 612, second receiving part; 613, first support; 614, first hanging arm; 62, second feeding unit; 621, third receiving part; 622, second support; 623, second hanging arm; 63, interaction area; A1, first interaction point; A2, second interaction point; 200, silicon wafer; 201, positioning edge; 202, sharp point; 203, circumference. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0037] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0040] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0041] like Figures 2 to 11As shown, an embodiment of the present application is an integrated device 100 for automatic chamfering and cleaning of silicon wafers, the integrated device comprising a detection mechanism 20, a chamfering mechanism 30, a cleaning mechanism 40, a transfer mechanism 50 and a feeding mechanism 60; the detection mechanism 20 is used to detect and position the silicon wafer 200 to determine and adjust the position of the positioning edge 201 of the silicon wafer 200, and the detection mechanism 20 is displaced around the transfer mechanism 50; the chamfering mechanism 30 is used to chamfer the silicon wafer 200 that has completed the detection and positioning, and the chamfering mechanism 30 is located on the periphery of the transfer mechanism 50 and is connected to the detection mechanism 2 0 is arranged adjacent to each other; the cleaning mechanism 40 is used to clean the chamfered silicon wafer 200, and the cleaning mechanism 40 is located on the peripheral side of the transfer mechanism 50 and is arranged adjacent to the chamfering mechanism 30; the transfer mechanism 50 is used to transport the silicon wafer 200, and the transfer mechanism has a receiving portion 51 for receiving the silicon wafer 200, wherein it is worth noting that the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40 are arranged along the circumference of the transfer mechanism 50, so that the path lengths from the transfer mechanism 50 to the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40 are basically the same. In addition, in the present application, at least one of the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40 is equipped with a loading mechanism 60, wherein the loading mechanism 60 includes a first loading unit 61 and a second loading unit 62, the first loading unit 61 has a first receiving portion 611 and a second receiving portion 612, the second receiving portion 612 is used to obtain the silicon wafer 200 that has been processed in the corresponding paired mechanism and transfer it to the first interaction point A1, at the first interaction point A1, the first receiving portion 61 1 is used to receive the silicon wafer 200 on the receiving part 51. After the receiving part 51 transfers the obtained silicon wafer 200 to the first receiving part 611, it simultaneously receives the silicon wafer 200 on the second receiving part 612; the second loading unit 62 has at least one third receiving part 621 for receiving the silicon wafer 200. The third receiving part 621 interacts with the first receiving part 611 at the second interaction point A2 to receive the silicon wafer 200 on the first receiving part 611 and transfer it to the mechanism paired with the first loading unit 61.

[0042] It can be understood that the integrated automatic chamfering and cleaning equipment 100 for silicon wafers provided in the present application cooperates with the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40 through the transfer mechanism 50 to provide and transport silicon wafers 200 for the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40, so that the integrated equipment integrates multiple functions such as automatic loading and unloading, positioning detection, chamfering and cleaning, and is fully functional; wherein the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40 are arranged circumferentially along the transfer mechanism 50, and such arrangement balances the path distance from the transfer mechanism 50 to the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40, so that the path distance The detection mechanism 20, the chamfering mechanism 30, the cleaning mechanism 40 and the transfer mechanism 50 are equal or have a small difference, thereby shortening the time for the transfer mechanism 50 to transport the silicon wafer 200, improving the transportation efficiency of the silicon wafer 200, and being able to timely replenish the silicon wafer 200 for each mechanism or transfer the processed silicon wafer 200, making full use of the processing efficiency of each mechanism, and avoiding the idleness of the detection mechanism 20, the chamfering mechanism 30, the cleaning mechanism 40 and the transfer mechanism 50 as much as possible, thereby improving the processing rate of the silicon wafer 200 as a whole; and with such an arrangement, the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40 share a transfer mechanism 50, which simplifies the structure of the integrated equipment, reduces costs, and also reduces the occupied site area. In addition, through the cooperation between the transfer mechanism and the loading mechanism 60, the path length of a single transfer of the transfer mechanism 50 is shortened, and while the transfer mechanism 50 transfers the silicon wafer 200 to the first loading unit 61, it can also take over the processed silicon wafer 200 and transfer it, thereby reducing the number of transfers of the transfer mechanism 50 and effectively saving the movement time of the transfer mechanism 50, so that the transfer mechanism 50 has more sufficient time to timely transfer the silicon wafer 200 to the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40, thereby improving the overall efficiency of the silicon wafer 200 processing; and after the first loading unit 61 and the second loading unit complete the interaction, the first loading unit 61 moves to the paired mechanism to obtain the processed silicon wafer 200 and transfers it to the first interaction station A1 for the next interaction cycle, reducing the single movement time of the first loading unit 61, so that the transfer mechanism, the first loading unit 61 and the second loading unit 62 can operate simultaneously to shorten the transportation time of the silicon wafer 200 and avoid the existence of idle mechanisms.

[0043] like Figures 2 to 5As shown, the integrated automation equipment also includes a storage box 10, which is used to store unprocessed silicon wafers 200 and silicon wafers 200 that have been cleaned and dried. The storage box 10 is arranged at the detection mechanism 20, so that the transfer mechanism 50 can take out the undetected silicon wafers 200 from the storage box 10 and transfer them to the detection mechanism 20 for positioning detection. After the transfer mechanism 50 transfers the cleaned silicon wafers 200 to the storage box 10, it can directly obtain the unprocessed silicon wafers 200 from the storage box 10 and transfer them to the detection mechanism 20, and cycle the next round of processing. In this way, the movement path of the transfer mechanism 50 is small, saving the time of transferring the silicon wafers 200.

[0044] In this embodiment, the silicon wafer 200 is placed in the storage box 10 in an original manner. It can be understood that after a silicon wafer 200 is taken out from a storage position of the storage box 10 for processing, the processed silicon wafer 200 is returned to the storage position where the silicon wafer 200 was before processing, so as to avoid confusion in the placement of the silicon wafers 200.

[0045] In one embodiment, if Figures 2 to 5 As shown, the detection mechanism 20, chamfering mechanism 30 and cleaning mechanism 40 of the integrated equipment 100 for automatic chamfering and cleaning of silicon wafers are centered on the transfer mechanism 50 and distributed along the circumference of the transfer mechanism 50, so that the path length of the transfer mechanism 50 for transporting the silicon wafer 200 to the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40 is consistent, thereby improving the transportation efficiency, and the layout is reasonable, reducing the space occupancy rate, and reducing the requirements for the production site. In addition, the transfer mechanism 50 can rotate around a base point to transport the silicon wafer 200, and the transportation action performed by the transfer mechanism 50 is simplified.

[0046] More preferably, the detection mechanism 20, the chamfering mechanism 30, and the cleaning mechanism 40 are evenly distributed around the transfer mechanism 50 with the transfer mechanism 50 as the center. In this way, the transfer mechanism 50 only needs to rotate a fixed angle each time it transfers the silicon wafer 200, and there is no need to adjust the angle of each rotation of the transfer mechanism according to the specific position of the detection mechanism 20, the chamfering mechanism 30, and the cleaning mechanism 40, thereby reducing the difficulty of adjustment. For example, when the number of the detection mechanism 20, the chamfering mechanism 30, and the cleaning mechanism 40 is set to one, the transfer mechanism 50 can interact with the detection mechanism 20, the chamfering mechanism 30, and the cleaning mechanism 40 respectively every time it rotates 120°.

[0047] In one embodiment, a plurality of chamfering mechanisms 30 are provided, and the detection mechanism 20, the cleaning mechanism 40 and the plurality of chamfering mechanisms 30 are arranged around the transfer mechanism 50. Since the time taken for chamfering is longer than the time taken for positioning detection, cleaning and drying, if a plurality of chamfering mechanisms 30 are provided, multi-threaded chamfering operations can be realized, and the detection mechanism 20 and the cleaning mechanism 40 are reasonably arranged to cooperate with the plurality of chamfering mechanisms 30 to perform operations, so that the processing efficiency of the silicon wafer 200 is doubled.

[0048] In this embodiment, if Figure 2 As shown, two chamfering mechanisms 30 are provided, and the detection mechanism 20 and the cleaning mechanism 40 are located between the two chamfering mechanisms 30. It can be understood that the detection mechanism 20, the cleaning mechanism 40 and one of the chamfering mechanisms 30 constitute a silicon wafer 200 processing production line. Two chamfering mechanisms 30 are provided, and the two chamfering mechanisms 30 share one detection mechanism 20 and one cleaning mechanism 40, forming two silicon wafer 200 processing production lines, so that the silicon wafer 200 processing efficiency is doubled, and the layout between the mechanisms is compact, reducing the occupied area. Of course, in other embodiments, the number of chamfering mechanisms 30 is not limited to the above. For example, 3 or 4 chamfering mechanisms 30 are provided, and the positions of the multiple chamfering mechanisms 30 are not limited to the above or shown in the figure. Specifically, when 4 chamfering mechanisms 30 are provided, the four chamfering mechanisms 30 are centered on the cleaning mechanism 40 or the detection mechanism 20 and are evenly arranged along the circumference of the center, wherein two chamfering mechanisms 30, one detection mechanism 20, one transfer mechanism 50 and one cleaning mechanism 40 constitute a production unit, so that two production units share one cleaning mechanism 40 or one detection mechanism 20. The premise of such a setting is that the efficiency of the cleaning mechanism 40 or the detection mechanism 20 is high enough, so that two production units sharing one cleaning mechanism 40 or the detection mechanism 20 can fully utilize the processing speed of the mechanism, avoid idleness of the mechanism, and help improve production efficiency.

[0049] In one embodiment, the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40 are all provided with a receiving disk for receiving the silicon wafer 200. In one embodiment, the receiving disk is a rotating suction cup, specifically, the detection mechanism 20 is provided with a first rotating suction cup 22, the chamfering mechanism 30 is provided with a second rotating suction cup 31, and the cleaning mechanism 40 is provided with a third rotating suction cup 41, the silicon wafer 200 is fixed by the third rotating suction cup 41, and the rotating suction cup can rotate to adjust the position of the positioning edge 201 of the silicon wafer 200. Of course, in other embodiments, other structures can also be provided on the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40 for receiving and fixing the silicon wafer 200.

[0050] Further, such as Figure 4 as well as Fig.11As shown, the detection mechanism 20 includes a visual detection module 21 and a first rotating suction cup 22, wherein the silicon wafer 200 is taken out of the storage box 10 by the transfer mechanism 50 and transferred to the first rotating suction cup 22, and the first rotating suction cup 22 absorbs and receives the silicon wafer 200; the visual detection module 21 detects the thickness of the silicon wafer 200, the position of the positioning edge 201 and other parameters by visual means and calculates the angle value that the silicon wafer 200 needs to rotate, and the first rotating suction cup 22 rotates a preset angle according to the angle value that needs to be rotated, so as to adjust the position of the positioning edge 201 of the silicon wafer 200. Among them, the visual means refers to the visual detection module 21 taking a photo of the silicon wafer 200, and after processing the photo and calibrating the positioning edge 201, the position parameters of the positioning edge 201 of the silicon wafer 200 are obtained.

[0051] Specifically, in one embodiment, Fig.11 As shown, the location edge 201 of the silicon wafer 200 and the circumference 203 of the silicon wafer 200 are connected to form a sharp point 202. When the silicon wafer 200 is loaded onto the first rotating chuck 22, Fig.11 The positioning edge 201 shown is located directly below the center of the silicon wafer as the ideal angle for silicon wafer loading. When adjusting, the position of the sharp point 202 needs to be used as a reference point to adjust the angle of the silicon wafer. Therefore, the positions of the positioning edge 201 and the sharp point 202 need to be detected on the first rotating chuck 22, and the angle of the rotating silicon wafer sharp point 202 needs to be adjusted so that the positioning edge 201 is located at the ideal loading angle. The detection mechanism 20 first detects and obtains data such as the thickness, center of the circle, positioning edge 201, and the positions of the sharp points 202 at both ends of the positioning edge 201 of the detection silicon wafer, and calculates the loading angle and the angle θ of the positioning edge 201 required to rotate according to the detected data, so as to guide the silicon wafer 200 to rotate the preset angle so that the silicon wafer 200 is in the best loading position.

[0052] like Figures 6 to 8 as well as Fig.11 As shown, the chamfering mechanism 30 includes a precision positioning detection module 32, a chamfering module 33 and a second rotating suction cup 31, wherein the second rotating suction cup 31 is used to receive and fix the silicon wafer 200 to prevent the silicon wafer 200 from moving relative to the second rotating suction cup 31 during the chamfering process; the precision positioning detection module 32 detects basic parameters such as the center, contour and positioning edge 201 position parameters of the silicon wafer 200, and calculates the position parameters and chamfering route data that the chamfering module 33 itself needs to adjust based on the basic parameters; the chamfering module 33 adjusts its own position based on the position parameters so that the positioning edge 201 of the silicon wafer 200 corresponds to the chamfering module 33; then the chamfering module 33 chamfers the silicon wafer 200 according to the chamfering route.

[0053] Since the position of the positioning edge 201 of the silicon wafer 200 changes during the transportation process, the positioning deviation occurs. If the chamfering mechanism 30 directly determines the chamfering path according to the position data of the positioning edge 201 detected by the detection mechanism 20, the chamfering accuracy will be reduced. Therefore, in this embodiment, the position of the positioning edge 201 of the silicon wafer 200 is re-determined by the secondary positioning detection of the precision positioning detection module 32, so as to adjust the position and chamfering route of the chamfering module 33 and improve the accuracy of the chamfering process. In this embodiment, the chamfering module 33 adjusts its relative position with the silicon wafer 200 by adjusting its own position. In other embodiments, the relative position of the chamfering module 33 and the silicon wafer 200 can also be adjusted by adjusting the position of the silicon wafer 200, for example, the second rotating suction cup 31 drives the silicon wafer 200 to rotate by an angle θ and adjusts the relative position of the silicon wafer 200 and the chamfering module 33 by translation.

[0054] In this embodiment, the precise positioning detection module 32 uses visual means for detection. Specifically, the precise positioning detection module 32 includes four cameras. According to the principle of determining the center of a circle by three points on a circle, three cameras calibrate at least three points on the wafer, and obtain the coordinates of the three points to fit the coordinates of the center of the silicon wafer 200 and the radius of the silicon wafer 200. Another camera calibrates the positioning edge 201 of the silicon wafer 200 and the sharp point 202 where the positioning edge 201 connects with the circumference 203 of the silicon wafer 200, and measures the length of the positioning edge 201, thereby determining the center of the silicon wafer 200, the outer contour and the position of the positioning edge 201. In other embodiments, other methods can also be used to determine the basic parameters of the silicon wafer 200, which are not limited here.

[0055] like Fig.10 As shown, in this embodiment, the cleaning mechanism 40 includes a third rotating suction cup 41 and a cleaning module 42. The cleaning module 42 is arranged opposite to the third rotating suction cup 41. The cleaning module 42 can spray cleaning liquid to clean the silicon wafer 200 on the third rotating suction cup 41. The third rotating suction cup 41 drives the cleaned silicon wafer 200 to rotate to dry the silicon wafer 200.

[0056] like Figure 1 As shown, in this embodiment, the transfer mechanism 50 adopts a robotic arm with multiple degrees of freedom, and the receiving part 51 adopts a clamp, which is arranged at the end of the robotic arm for grabbing the silicon wafer 200. Of course, in other embodiments, the specific structure of the transfer mechanism 50 is not limited to the above description.

[0057] In one embodiment, see Fig. 9 and Fig.10, the first receiving portion 611 and the second receiving portion 612 are located on the same straight line, and the first receiving portion 611 is located above the second receiving portion 612. In this way, after the receiving portion 51 of the transfer mechanism 50 moves to the top of the first receiving portion 611 and transfers the silicon wafer 200 it carries to the first receiving portion 611, it can directly move down to the second receiving portion 612 and receive the silicon wafer 200 that has been processed from the matching mechanism on the second receiving portion 612, further shortening the movement path of the receiving portion 51 and improving the efficiency of the handover. Among them, the mechanism paired with the first loading unit 61 refers to a mechanism equipped with the first loading unit 61, for example, if the chamfering mechanism 30 is equipped with a first loading unit 61, the matching mechanism of the first loading unit 61 is the chamfering mechanism 30.

[0058] Among them, Fig. 9 and Fig.10 As shown, the first receiving portion 611 and the second receiving portion 612 use suction cups, which can absorb and receive the silicon wafer 200. In other embodiments, the first receiving portion 611 and the second receiving portion 612 can also use other structures to receive the silicon wafer 200, such as clamps.

[0059] The second loading unit 62 is as follows Figures 2 to 5 As shown, since the chamfering mechanism 30 and the cleaning mechanism 40 take a long time to chamfer and clean the silicon wafer 200, the chamfering mechanism 30 and the cleaning mechanism 40 are both equipped with a first loading unit 61 and a second loading unit 62. At the chamfering mechanism, the transfer mechanism interacts with the first loading unit 61 at the chamfering mechanism. When handing over the silicon wafer 200 that has been inspected, the transfer mechanism can also receive the silicon wafer 200 that has been chamfered and transfer the silicon wafer to the cleaning mechanism 40, without waiting for the silicon wafer 200 to be chamfered at the chamfering mechanism 30. Similarly, when the transfer mechanism 50 transfers the silicon wafer 200 that has been chamfered to the cleaning mechanism 40, it can also carry the silicon wafer 200 that has been cleaned and transfer it to the storage box 10 without waiting. When the transfer mechanism 50 transfers the silicon wafer 200 after handing over the silicon wafer 200 with the first loading unit 61, the interaction between the first loading unit 61 and the second loading unit 62 is performed simultaneously, saving the time for transferring the silicon wafer 200.

[0060] like Figure 8 and Fig.10As shown, the first loading unit 61 includes a first support 613 and a first suspension arm 614. One end of the first suspension arm 614 is connected to the first support 613 and can move relative to the first support 613, and the other end is provided with a first receiving portion 611 and a second receiving portion 612; when the first suspension arm 614 moves relative to the first support 613, it drives the first receiving portion 611 and the second receiving portion 612 to move to the corresponding interaction point and receive the silicon wafer 200. Of course, in other embodiments, the specific structure of the first loading unit 61 is not limited to the above, for example, the first receiving portion 611 and the second receiving portion 612 can be set on a multi-degree-of-freedom robot, and the movement of the robot arm drives the first receiving portion 611 and the second receiving portion 612 to receive the silicon wafer 200. The second loading unit 62 includes a second support 622 and a second suspension arm 623. One end of the second suspension arm 623 is connected to the second support 622 and can move relative to the second support 622, and the other end is provided with a third receiving portion 621. In other embodiments, the specific structure of the second loading unit 62 is not limited to that described above or shown in the figures.

[0061] like Fig. 9 As shown, in one embodiment, the first support 613 and the second support 622 are set as an integrated structure. In other words, the first loading unit 61 and the second loading unit 62 share a support, so that the first suspension arm 614 and the second suspension arm 623 are integrated through the same support, simplifying the structure, reducing costs, and facilitating the integrated installation of the first loading unit 61 and the second loading unit 62 on the matching mechanism; in other embodiments, such as Fig.10 As shown, the first support 613 and the second support 622 can also be set as a split structure, so that the first loading unit 61 and the second loading unit 62 can move independently and the relative positions of the two can be adjusted. In this way, the positions of the first loading unit 61 and the second loading unit 62 can be adjusted separately according to site requirements.

[0062] like Figure 2 As shown, along the height direction of the first loading unit 61, the projection of the second interaction point A2 overlaps with the receiving tray at the matching mechanism. After the second loading unit 62 obtains the silicon wafer 200 at the second interaction point A2, the third material receiving part 621 directly moves downward to make the third material receiving part 621 correspond to the receiving tray, and the silicon wafer 200 on the third material receiving part 621 is placed in the receiving tray to complete the transportation of the silicon wafer 200. In this way, the distance between the third material receiving part 621 and the receiving tray at the matching mechanism is shortened, and the path length of the silicon wafer 200 transportation is shortened. The third material receiving part 621 directly moves downward to connect the silicon wafer with the corresponding receiving tray. The second loading unit 62 has a small movement amplitude, which is beneficial to reducing the movement error of the second loading unit 62, so that the silicon wafer 200 is accurately placed on the corresponding receiving tray, avoiding large errors in the placement position of the silicon wafer 200.

[0063] like Figure 8 and 9 As shown, in this embodiment, the first loading unit 61 has an initial state and a transfer state. The initial state refers to the state when the first loading unit 61 has not started to transfer the silicon wafer, and the transfer state refers to the state when the first loading unit 61 moves and transfers the silicon wafer. In the initial state, along the height direction of the first support 613, the projection of the first material receiving part 611 and the second material receiving part 612 coincides with the first interaction point A1. It can be understood that the first material receiving part 611 and the second material receiving part 612 themselves or their projections coincide with the first interaction point A1. Such a setting is conducive to reducing the movement amplitude of the first suspension arm 614, avoiding the first material receiving part 611 and the second material receiving part 612 from generating movement errors, so that the first material receiving part 611 and the second material receiving part 612 can be accurately docked with the receiving part 51. Of course, such a setting is also conducive to shortening the path of the first material receiving part 611 and the second material receiving part 612 moving to the first interaction point A1, thereby shortening the movement time and improving the transfer efficiency of the first loading unit 61.

[0064] Please continue reading Figure 8 and Fig. 9 In the initial state, the first suspension arm 614 and the second suspension arm 623 are arranged perpendicular to each other and rotate toward each other to form an interaction area 63, and the second interaction point A2 is located in the interaction area 63. It can be understood that along the height direction of the first support 613, when the first suspension arm 614 and the second suspension arm 623 rotate toward each other, the overlapping part of the projection of the area passed by the first material receiving portion 611 and the third material receiving portion 621 is the interaction area 63, and the first material receiving portion 611 and the third material receiving portion 621 can contact and connect the silicon wafer 200 in the interaction area 63. Figure 8 As shown, the dotted circles in the figure respectively represent the trajectories of the first material receiving portion 611 and the third material receiving portion 71 when the first suspension arm 614 and the second suspension arm 623 rotate, and the interaction area includes the point where the two circular trajectories intersect. In this way, the first suspension arm 614 and the second suspension arm 623 can reach the second interaction point A2 by rotating a certain angle at one end away from the support, and the path length of the first suspension arm 614 and the second suspension arm 623 rotating towards each other to reach the second interaction point A2 is short, thereby shortening the time for transporting the silicon wafer 200, and the angle of rotation of the first suspension arm 614 and the second suspension arm 623 is equal to or less than 90°, which is easy to adjust and has a small range of motion.

[0065] like Fig.10As shown, in another embodiment, the projection of the third material receiving portion 621 coincides with the second interaction point A2 along the height direction of the second support 622. In this way, the second suspension arm 623 can interact with the first loading unit 61 by moving up and down along the second support 622 without rotating. In this way, there is no need to set a rotating assembly to drive the second suspension arm 623 to rotate, which simplifies the structure of the second loading unit 62 and the movement path of the second loading unit 62, avoiding motion errors. Moreover, in the present embodiment, along the height direction of the second support 622, the projection of the second interaction point A2 overlaps with the receiving tray at the chamfering mechanism 30, so that after the third material receiving part 621 receives the silicon wafer 200, the second lifting arm 623 directly moves downward along the second support 622, so that the third material receiving part 621 places the silicon wafer 200 in the receiving tray, further shortening the path length of the silicon wafer 200 transportation, increasing the speed of the silicon wafer 200 transportation, and increasing the movement accuracy of the second lifting arm 623, so that the third material receiving part 621 can accurately place the silicon wafer on the corresponding receiving tray, avoiding large position deviation of the silicon wafer.

[0066] The present application also provides a silicon wafer 200 automatic chamfering process. The above-mentioned integrated equipment performs integrated chamfering and cleaning processing on the silicon wafer 200 based on the process, which greatly improves the processing efficiency. The specific steps of the integrated equipment for processing based on the process are as follows:

[0067] S1: The transfer mechanism 50 takes out the silicon wafer 200 to be processed from the storage box 10 and transfers it to the first rotating suction cup 22 of the detection mechanism 20. The detection mechanism 20 performs positioning detection on the silicon wafer 200 to achieve preliminary positioning detection of the silicon wafer 200, and adjusts the rotation of the first rotating suction cup 22 according to the data obtained from the positioning detection to adjust the position of the positioning edge 201 of the silicon wafer 200;

[0068] S2: The transfer mechanism 50 transfers the inspected silicon wafer 200 to the first interaction point A1 corresponding to the chamfering mechanism 30;

[0069] S3: the first loading unit 61 corresponding to the chamfering mechanism 30 moves to the first interaction point A1 corresponding to the chamfering mechanism 30, and the first receiving portion 611 receives the silicon wafer 200 that has been inspected on the transfer mechanism 50;

[0070] S4: The first loading unit 61 and the second loading unit 62 of the chamfering mechanism 30 both move to the second interaction point A2 of the chamfering mechanism 30, and the third receiving portion 621 receives the silicon wafer 200 that has been pressed and tested on the first receiving portion 611, and transfers the obtained silicon wafer 200 to the second rotating suction cup 31 of the chamfering mechanism 30.

[0071] S5: The chamfering mechanism 30 performs chamfering on the silicon wafer on the second rotating chuck 31;

[0072] S6: When the chamfering mechanism 30 completes the chamfering process, the second rotating suction cup 31 of the chamfering mechanism 30 has the silicon wafer 200 that has completed the chamfering process, and the first loading unit 61 of the corresponding chamfering mechanism 30 uses the second receiving portion 612 to obtain the silicon wafer 200 that has completed the chamfering process according to the chamfering completion signal and transfers the obtained silicon wafer 200 to the first interaction point A1 of the corresponding chamfering mechanism 30. At this time, the receiving portion 51 of the transfer mechanism 50 arrives at the first interaction point A1 and performs the step of "secondary transfer" with the first loading unit 61;

[0073] S7: At the first interaction point A1 corresponding to the chamfering mechanism 30, the first receiving portion 611 receives the silicon wafer 200 to be chamfered transferred by the receiving portion 51; and after the receiving portion 51 interacts with the first receiving portion 611, the receiving portion 51 receives the silicon wafer 200 that has been chamfered at the second receiving portion 612;

[0074] S8: The first loading unit 61 of the paired cleaning mechanism 40 moves to the first interaction point A1 of the corresponding cleaning mechanism 40, and the receiving portion 51 transfers the chamfered silicon wafer 200 from the chamfering mechanism 30 to the first interaction point A1 of the corresponding cleaning mechanism 40 to be connected with the first receiving portion 611;

[0075] S9: the second loading unit 62 of the paired cleaning mechanism 40 moves to the second interaction point A2 of the corresponding cleaning mechanism 40, and interacts with the first receiving portion 611 of the first loading unit 61 to receive the chamfered silicon wafer 200;

[0076] S10: The second loading unit 62 corresponding to the cleaning mechanism 40 transfers the obtained chamfered silicon wafer 200 to the third rotating suction cup 41 of the cleaning mechanism 40;

[0077] S11: The cleaning mechanism 40 cleans and spin-dries the silicon wafer 200 on the third rotating chuck 41;

[0078] S12: The first loading unit 61 of the corresponding cleaning mechanism 40 obtains the cleaned silicon wafer 200 on the third rotating suction cup 41 of the cleaning mechanism 40 by using the second receiving portion 612 according to the cleaning completion signal, and transfers the silicon wafer 200 to the first interaction point A1 of the corresponding cleaning mechanism 40; at this time, the receiving portion 51 arrives at the first interaction point A1 of the corresponding cleaning mechanism 40 and performs the step of "three transfers" with the first loading unit 61;

[0079] S13: At the first interaction point A1 corresponding to the cleaning mechanism 40, the first receiving portion 611 receives the chamfered (uncleaned) silicon wafer 200 transferred by the receiving portion 51, and after the transfer mechanism 50 interacts with the first receiving portion 611, the receiving portion 51 receives the cleaned silicon wafer 200 on the second receiving portion 612.

[0080] S14 : The receiving portion 51 of the transfer mechanism 50 receives the silicon wafer 200 at the second receiving portion 612 at the first interaction point A1 corresponding to the cleaning mechanism 40 , and transfers the obtained silicon wafer 200 into the storage box 10 .

[0081] In one embodiment, step “S1” specifically includes the following steps:

[0082] S101: photographing the silicon wafer 200, and calibrating the positioning edge 201 of the silicon wafer 200 based on the photographed photo to obtain the angular position information of the positioning edge 201;

[0083] S102: Calculating the angle that the positioning edge 201 should be adjusted according to the angular position information of the positioning edge 201;

[0084] S103: Rotate the first rotating suction cup 22 in the detection mechanism 20 according to the angle to be adjusted, thereby adjusting the position of the positioning edge 201 of the silicon wafer 200.

[0085] In one embodiment, step "S5" specifically includes the following steps:

[0086] S501: the precise positioning detection module 32 detects and obtains basic parameters of the silicon wafer 200 located on the second rotating chuck 31 in the chamfering mechanism 30; wherein the basic parameters include circle center position parameters, contour parameters, and positioning edge 201 position parameters;

[0087] S502: Calculate and obtain chamfering route parameters of the chamfering module 33 and position parameters that need to be adjusted according to basic parameters;

[0088] S503: adjusting the position of the chamfering module 33 according to the position parameter so that the positioning edge 201 to be chamfered corresponds to the chamfering module 33;

[0089] S504: The chamfering module 33 chamfers the silicon wafer 200 to be chamfered according to the chamfering route parameters.

[0090] When a plurality of chamfering mechanisms 30 are provided, the transfer mechanism 50 transfers the silicon wafer 200 to the inspection mechanism 20 , the chamfering mechanism 30 and the cleaning mechanism 40 in a timely manner according to the processing speed of each mechanism.

[0091] Specifically, Figure 1 As shown, for example, two chamfering mechanisms 30 are provided, namely a first chamfering mechanism 30a and a second chamfering mechanism 30b. The specific steps of processing the silicon wafer 200 are described in detail below:

[0092] First, repeat steps "S1", "S2", "S3" and "S4" to provide the first chamfering mechanism 30a and the second chamfering mechanism 30b with the silicon wafer 200 that has been inspected and perform chamfering processing: the transfer mechanism 50 repeatedly obtains the silicon wafer 200 from the storage box 10 and transfers it to the inspection mechanism 20. After receiving the inspection completion signal, the transfer mechanism 50 transfers the silicon wafer 200 that has completed the inspection and positioning to the first interaction point A1 corresponding to the first chamfering mechanism 30a. The first loading unit 61' at the first chamfering mechanism 30a moves to the first interaction point A1 and receives the transfer mechanism through the first receiving portion 611. 50, the first loading unit 61 carries the silicon wafer 200 that has been tested and moves to the second interaction point A2. At this time, the second loading unit 62 corresponding to the chamfering mechanism 30 moves to the second interaction point A2 and connects with the first loading unit 61 to receive the silicon wafer 200 that has been tested and transfer it to the first chamfering mechanism 30a. The first chamfering mechanism 30a performs precise positioning detection and chamfering processing on the silicon wafer 200. After completing step "S2", the transfer mechanism 50 repeats step "S2" to transfer the silicon wafer 200 to the second chamfering mechanism 30b. The transfer steps are the same as described above and will not be repeated here.

[0093] Repeat steps "S2", "S3" and "S4" again to provide the first chamfering mechanism 30a with the silicon wafer 200 that has been inspected, and then perform steps "S6" and "S7". The transfer mechanism 50 transfers the silicon wafer 200 that has been inspected to the first receiving portion 611, and receives the silicon wafer 200 that has been chamfered on the second receiving portion 612;

[0094] Then, steps “ S8 ”, “ S9 ” and “ S10 ” are performed to transfer the silicon wafer 200 chamfered by the first chamfering mechanism 30 a to the cleaning mechanism 40 ;

[0095] Repeat steps "S2" and "S3" again to provide the second chamfering mechanism 30b with the silicon wafer 200 that has been inspected, and then perform steps "S6" and "S7", the transfer mechanism 50 transfers the silicon wafer 200 that has been inspected to the first receiving portion 611 of the first loading unit 61 of the second chamfering mechanism 30b, and receives the silicon wafer 200 that has been chamfered on the second receiving portion 612;

[0096] Then, steps "S8", "S9", "S12", "S13" and "S14" are executed to feed the cleaning mechanism 40 and transfer the cleaned silicon wafers 200 on the cleaning mechanism 40 to the storage box 10: specifically, the transfer mechanism 50 transfers the silicon wafers 200 chamfered by the second chamfering mechanism 30b to the first interaction point A1 of the corresponding cleaning mechanism 40. At the same time, the second receiving portion 612 of the first loading unit 61 of the paired cleaning mechanism 40 obtains the cleaned and dried silicon wafers 200 at the cleaning mechanism 40 and moves them to the second interaction point A2 of the corresponding cleaning mechanism 40. The transfer mechanism 50 transfers the uncleaned silicon wafers 200 to the first receiving portion 611, receives the cleaned silicon wafers 200 on the second receiving portion 612 and transfers them to the storage box 10; and the second loading unit 62 of the paired cleaning mechanism 40 is connected with the first loading unit 61, receives the uncleaned silicon wafers 200 and transfers them to the cleaning mechanism 40 for cleaning and drying.

[0097] Then, steps “S1”, “S2”, “S3”, “S6”, “S7”, “S8”, “S9”, “S12”, “S13” and “S14” are repeatedly executed in a cycle to continuously supply materials to, take materials from and transfer the two chamfering mechanisms 30 , respectively, so that the two chamfering mechanisms 30 cooperate with the detection mechanism 20 and the cleaning mechanism 40 to continuously operate, thereby effectively improving the processing efficiency of the silicon wafer 200 .

[0098] Of course, in other embodiments, the number of chamfering mechanisms 30 is not limited to the two mentioned above, and one or more than three may be set. In this case, in the processing technology, it is necessary to adjust the execution steps according to the time required for the detection mechanism 20, the chamfering mechanism 30 and the cleaning mechanism 40, and reasonably provide and transport silicon wafers 200 to each chamfering mechanism 30 to increase the speed of silicon transportation, thereby improving the overall processing efficiency.

[0099] It should be emphasized that there is no necessary sequence in the above steps. For example, step "S2" and step "S6" can be performed simultaneously. In this way, when the receiving portion 51 carries the silicon wafer 200 to the first interaction point A1, the second receiving portion 612 simultaneously carries the silicon wafer 200 that has been chamfered to the first interaction point A1, so that the transfer mechanism 50 and the first loading unit 61 can complete step "S7" at the first interaction point A1, thus further shortening the time for the transfer and handover of the silicon wafer 200, thereby increasing the transfer speed of the silicon wafer 200. For another example, in a cyclic operation, step S12 needs to be performed first, and then steps S3, S7, S4 and S5 can be performed in sequence.

[0100] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. An integrated device for automatic chamfering and cleaning of silicon wafers, characterized in that: The integrated device comprises: A detection mechanism (20) for detecting and positioning the silicon wafer (200); A chamfering mechanism (30) for chamfering a silicon wafer (200) that has completed detection and positioning, the chamfering mechanism (30) being arranged adjacent to the detection mechanism (20); A cleaning mechanism (40) for cleaning the chamfered silicon wafer (200), the cleaning mechanism (40) being arranged adjacent to the chamfering mechanism (30); A transfer mechanism (50) is used to transfer a silicon wafer (200), the transfer mechanism having a receiving portion (51) for receiving the silicon wafer (200); wherein the detection mechanism (20), the chamfering mechanism (30) and the cleaning mechanism (40) are arranged along the circumference of the transfer mechanism (50); a feeding mechanism (60), wherein at least one of the detection mechanism (20), the chamfering mechanism (30) and the cleaning mechanism (40) is equipped with the feeding mechanism (60); The loading mechanism (60) comprises a first loading unit (61) and a second loading unit (62), the first loading unit (61) having a first receiving portion (611) and a second receiving portion (612), the second receiving portion (612) being used to obtain a silicon wafer (200) that has been processed in a corresponding paired mechanism and transport it to a first interaction point (A1), at the first interaction point (A1), the first receiving portion (611) being used to receive the silicon wafer (200) on the receiving portion (51), the receiving portion (51) ) after transferring the obtained silicon wafer (200) to the first receiving portion (611), the silicon wafer (200) on the second receiving portion (612) is simultaneously received; the second loading unit (62) has at least one third receiving portion (621) for receiving the silicon wafer (200), the third receiving portion (621) interacts with the first receiving portion (611) at a second interaction point (A2) to receive the silicon wafer (200) on the first receiving portion (611) and transfer it to a mechanism paired with the first loading unit (61); The detection mechanism (20), the chamfering mechanism (30), and the cleaning mechanism (40) are all provided with a receiving tray for receiving the silicon wafer (200), and along the height direction of the first loading unit (61), the projection of the second interaction point (A2) overlaps with the receiving tray at the matching mechanism; The first loading unit (61) comprises a first support (613) and a first suspension arm (614); one end of the first suspension arm (614) is connected to the first support (613) and can move relative to the first support (613), and the other end is provided with the first material receiving portion (611) and the second material receiving portion (612); the second loading unit (62) comprises a second support (622) and a second suspension arm (623); one end of the second suspension arm (623) is connected to the second support (622) and can move relative to the second support (622), and the other end is provided with the third material receiving portion (621); the first support (613) and the second support (622) are integrally formed; The first loading unit (61) has an initial state and a transfer state. In the initial state, along the height direction of the first support (613), the projections of the first material receiving portion (611) and the second material receiving portion (612) coincide with the first interaction point (A1), and along the height direction of the second support (622), the projection of the third material receiving portion (621) coincides with the second interaction point (A2).

2. The integrated equipment for automatic chamfering and cleaning of silicon wafers according to claim 1, characterized in that: The detection mechanism (20), the chamfering mechanism (30), and the cleaning mechanism (40) are centered on the transfer mechanism (50) and are evenly distributed along the circumference of the transfer mechanism (50).

3. The integrated equipment for automatic chamfering and cleaning of silicon wafers according to claim 2, characterized in that: The number of the chamfering mechanisms (30) provided is two, and the detection mechanism (20) and the transfer mechanism (50) are located between the two chamfering mechanisms (30).

4. The integrated equipment for automatic chamfering and cleaning of silicon wafers according to claim 1, characterized in that: Along the height direction of the first material loading unit (61), the first material receiving portion (611) is located directly above the second material receiving portion (612), so that after the receiving portion (51) intersects with the first material receiving portion (611), it moves linearly downward along the height direction of the first material loading unit (61) to interact with the second material receiving portion (612).

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