Method for manufacturing light emitting device and light emitting device

Abstract

The present invention provides a method for manufacturing a light-emitting device and the light-emitting device, wherein the method for manufacturing the light-emitting device comprises: providing a substrate; providing an LED chip, cutting the LED chip into a plurality of LED chips to be polished; mounting the plurality of LED chips to be polished on the substrate, and polishing the surface of the LED chips to be polished with a grinding fluid to form a polished LED chip; and packaging the plurality of polished LED chips to form a light-emitting device. The present invention polishes the cut UV LED chip to improve the luminous efficiency of the UV LED chip and reduce the packaging cost.

Description

Technical Field

[0001] The present invention relates to the technical field of UV LED, and in particular to a manufacturing method of a light-emitting device and the light-emitting device. Background Art

[0002] UV LEDs based on III-nitride materials have broad application prospects in sterilization, polymer curing, biochemical detection, non-line-of-sight communications, and special lighting. Compared with traditional UV light source mercury lamps, they have many well-known advantages such as environmental protection, compactness, low power consumption, and low voltage, and have received more and more attention in recent years.

[0003] At present, UV LED chips adopt flip-chip structure or vertical structure, and deep ultraviolet light is emitted from one side of the substrate surface, so as to improve light extraction efficiency (LEE: Light Extraction Efficiency) and improve external quantum efficiency (EQE: External Quantum Efficiency). Generally, laser cutting or grinding wheel cutting is used to cut UV LED chips into multiple pieces.

[0004] However, the cutting method in the prior art, using laser cutting, will produce a large number of continuous laser burns on the UV LED chip, and using grinding wheel cutting will result in a rough and dark cut section, which is not conducive to the emission of light from the side of the UV LED chip, thereby affecting the luminous effect of the UV LED chip. Summary of the invention

[0005] The embodiment of the present invention provides a method for manufacturing a light-emitting device and the light-emitting device, wherein the cut UV LED chip is polished to improve the light-emitting efficiency of the UV LED chip and reduce the packaging cost.

[0006] A first aspect of the present invention provides a method for manufacturing a light emitting device, comprising:

[0007] providing a substrate;

[0008] Providing an LED chip, and cutting the LED chip into a plurality of LED chips to be polished;

[0009] Mounting a plurality of LED chips to be polished on a substrate, and polishing the surfaces of the LED chips to be polished using a grinding fluid to form polished LED chips;

[0010] A plurality of polished LED chips are packaged to form a light emitting device.

[0011] Through the above arrangement, specifically, through this method, a plurality of cut LED chips to be polished are fixed by a substrate, and then polished by a grinding fluid. On the one hand, the fixing strength of the LED chips to be polished during the polishing process is ensured to avoid being washed away by the grinding fluid, thereby damaging the LED chips; on the other hand, the grinding fluid is used to remove the burnt or cut residues formed on the surface of the LED chips to be polished after laser or grinding wheel cutting of the LED chips, so that the surface is flattened, which solves the problem of light blocking and light absorption by the side wall after the chip is cut, and improves the luminous efficiency of the LED chips.

[0012] In an optional embodiment, a plurality of LED chips to be polished are mounted on a substrate, and the surfaces of the LED chips to be polished are polished using a grinding fluid, specifically comprising:

[0013] Soldering the welding surfaces of a plurality of LED chips to be polished on the substrate at intervals;

[0014] The polishing surface of the LED chip to be polished is polished by using a grinding fluid, wherein there are multiple polishing surfaces.

[0015] In an optional embodiment, the polishing surface includes a top wall and a side wall of the LED chip to be polished.

[0016] In an optional implementation, welding the welding surfaces of a plurality of LED chips to be polished at intervals on a substrate specifically includes:

[0017] The welding surface of the LED chip to be polished is welded to the first conductive layer on the substrate.

[0018] In an optional implementation, polishing the polishing surface of the LED chip to be polished by using a grinding fluid specifically includes:

[0019] A plurality of LED chips to be polished and the substrate which have been welded on the substrate are placed in the cavity, and a grinding fluid is injected into the cavity so that the grinding fluid passes through the polishing surface.

[0020] In an optional embodiment, an LED chip is provided, and the LED chip is cut into a plurality of LED chips to be polished, specifically comprising:

[0021] Cutting is performed along a direction perpendicular to the welding surface of the LED chip to form a plurality of LED chips to be polished, and the welding surfaces of the plurality of LED chips to be polished are spliced ​​together to form the welding surface of the LED chip.

[0022] In an optional implementation, before the welding surfaces of a plurality of LED chips to be polished are welded on a substrate at intervals, the method specifically includes:

[0023] The welding surfaces of a plurality of qualified LED chips to be polished are welded on the substrate at intervals.

[0024] In an optional implementation, after a plurality of LED chips to be polished are mounted on a substrate, the method specifically includes:

[0025] Cutting the substrate to form a bonded body of the substrate and the polished LED chip;

[0026] The bonded body is packaged.

[0027] In an optional embodiment, packaging the junction body specifically includes:

[0028] The first dam and the first lens on the substrate cover the bonded body to encapsulate the bonded body.

[0029] In an optional embodiment, packaging the junction body specifically includes:

[0030] The packaging substrate, the second dam and the second lens of the packaging component are used to enclose a receiving space for receiving the bonding body so as to package the bonding body. The third conductive layer of the packaging component is electrically connected to the conductive layer of the bonding body.

[0031] In addition, a second aspect of the present invention provides a light-emitting device, using the manufacturing method of the light-emitting device as described above, comprising a substrate and a polished LED chip, wherein a first conductive layer and a second conductive layer electrically connected to each other are provided on the substrate, the polished LED chip is soldered on the first conductive layer, and the second conductive layer is configured to be electrically connected to an external circuit;

[0032] A first dam and a first lens are arranged on the substrate, and the first dam and the first lens cover the substrate.

[0033] In addition, the third aspect of the present invention provides a light-emitting device, using the manufacturing method of the light-emitting device as described above, comprising a substrate and a polished LED chip, wherein a first conductive layer and a second conductive layer electrically connected to each other are provided on the substrate, the polished LED chip is soldered on the first conductive layer, and the second conductive layer is configured to be electrically connected to an external circuit;

[0034] It also includes a packaging component, which includes a packaging substrate, a second dam, a second lens and a third conductive layer. The packaging substrate is located on a side of the substrate away from the polished LED chip, the second dam is arranged on the packaging substrate, the second lens cover is arranged on the second dam, and the third conductive layer is electrically connected to the second conductive layer.

[0035] The manufacturing method of the light-emitting device provided by the present invention comprises: providing a substrate; providing an LED chip, cutting the LED chip into a plurality of LED chips to be polished; mounting the plurality of LED chips to be polished on the substrate, and polishing the surface of the LED chips to be polished with a grinding fluid to form a polished LED chip; and packaging the plurality of polished LED chips to form a light-emitting device. Through this method, the plurality of cut LED chips to be polished are fixed with a substrate, and then polished with a grinding fluid. On the one hand, the fixing strength of the LED chips to be polished during the polishing process is ensured to avoid being washed away by the grinding fluid, thereby damaging the LED chips; on the other hand, the grinding fluid is used to remove the burnt or cut residues formed on the surface of the LED chips to be polished after laser or grinding wheel cutting, so that the surface is flattened, which solves the problem of light blocking and light absorption by the side wall after the chip is cut, and improves the luminous efficiency of the LED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0037] Figure 1 A schematic diagram of a process for manufacturing a first light-emitting device provided in an embodiment of the present application;

[0038] Figure 2 A schematic diagram of a process for manufacturing a second light-emitting device provided in an embodiment of the present application;

[0039] Figure 3 A schematic diagram of a process for manufacturing a third light-emitting device provided in an embodiment of the present application;

[0040] Figure 4 A first structural schematic diagram of a light emitting device provided in an embodiment of the present application;

[0041] Figure 5 A second structural schematic diagram of a light emitting device provided in an embodiment of the present application;

[0042] Figure 6 A third structural schematic diagram of a light emitting device provided in an embodiment of the present application;

[0043] Figure 7 A fourth structural schematic diagram of a light emitting device provided in an embodiment of the present application;

[0044] Figure 8A schematic diagram of a first structure of a substrate in a light-emitting device provided in an embodiment of the present application;

[0045] Fig. 9 A second structural schematic diagram of a substrate in a light-emitting device provided in an embodiment of the present application;

[0046] Fig.10 A top view of a first type of light emitting device provided in an embodiment of the present application in which a polished LED chip is mounted on a substrate;

[0047] Fig.11 A side view of a first type of light emitting device provided in an embodiment of the present application in which a polished LED chip is mounted on a substrate;

[0048] Fig.12 A top view of a second type of light emitting device provided in an embodiment of the present application in which a polished LED chip is mounted on a substrate;

[0049] Fig.13 A side view of a second type of light emitting device provided in an embodiment of the present application in which a polished LED chip is mounted on a substrate;

[0050] Fig.14 A schematic diagram of a first structure of another light emitting device provided in an embodiment of the present application;

[0051] Fig.15 A second structural schematic diagram of another light-emitting device provided in an embodiment of the present application.

[0052] Description of reference numerals:

[0053] 100, 200-light emitting device;

[0054] 110-Substrate;

[0055] 111- a first conductive layer;

[0056] 112- a second conductive layer;

[0057] 113-First enclosure dam;

[0058] 114- first lens;

[0059] 115-conductive via;

[0060] 120-Polishing LED chips;

[0061] 210- packaging components;

[0062] 211- packaging substrate;

[0063] 212-Second enclosure dam;

[0064] 213- second lens;

[0065] 214 - third conductive layer. DETAILED DESCRIPTION

[0066] It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention. Those skilled in the art may make adjustments to them as needed to adapt to specific application scenarios.

[0067] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0068] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0069] It should be understood that, although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this article, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determination". Furthermore, as used herein, the singular forms "one", "an" and "the" are intended to also include plural forms, unless there is an opposite indication in the context.

[0070] It should be further understood that the terms “comprises” and “includes” indicate the existence of features, steps, operations, elements, components, species, and / or groups, but do not exclude the existence, occurrence, or addition of one or more other features, steps, operations, elements, components, species, and / or groups.

[0071] The terms "or", "and / or", "including at least one of the following", etc. used in this application may be interpreted as inclusive, or mean any one or any combination. For example, "including at least one of the following: A, B, C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C", and for another example, "A, B or C" or "A, B and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

[0072] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0073] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication of the inner cavities of two components or the interaction relationship between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0074] It should be noted that in the description of the present invention, the terms "first", "second", and "third" are only used to facilitate the description of different chambers, and cannot be understood as indicating or implying a sequential relationship, relative importance, or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features.

[0075] In the prior art, UV LED chips are generally cut into multiple pieces by laser cutting or grinding wheel cutting. However, in the prior art, laser cutting will produce a large number of continuous laser burns on the UV LED chip, and grinding wheel cutting will produce a rough and dark cut surface, which is not conducive to the emission of light from the side of the UV LED chip, thereby affecting the luminous effect of the UV LED chip.

[0076] In order to overcome the defects in the prior art, the present invention provides a method for manufacturing a light-emitting device and a light-emitting device. A substrate is used to fix a plurality of cut LED chips to be polished, and then a grinding fluid is used to polish the chips. On the one hand, the fixing strength of the LED chips to be polished during the polishing process is ensured to avoid being washed away by the grinding fluid and thus damaging the LED chips. On the other hand, the grinding fluid is used to remove the burnt or cut residues formed on the surface of the LED chips to be polished after laser or grinding wheel cutting, so that the surface is flattened, which solves the problem of light blocking and light absorption by the side wall after the chip is cut, and improves the luminous efficiency of the LED chips.

[0077] The content of the present invention will be described in detail below in conjunction with the accompanying drawings so that those skilled in the art can understand the content of the present invention more clearly and in detail.

[0078] Embodiment 1

[0079] Figure 1 A schematic diagram of a process for manufacturing a first light emitting device provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, the embodiment of the present application provides a method for manufacturing a light-emitting device, comprising:

[0080] S101: providing a substrate.

[0081] Specifically, the substrate material may be glass, silicon, sapphire, ceramic, metal, or a combination thereof. Specifically, regarding the material of the substrate, the embodiments of the present application do not impose any additional restrictions.

[0082] In addition, the length of the substrate can be designed according to actual needs, and the embodiments of the present application do not impose too many restrictions on this.

[0083] S102: providing an LED chip, and cutting the LED chip into a plurality of LED chips to be polished.

[0084] Specifically, the LED chip to be polished is formed by cutting the LED chip by laser or grinding wheel. Of course, cutting can be performed in other ways to obtain the LED chip to be polished.

[0085] In addition, the thickness of the LED chip to be polished can be adjusted accordingly according to actual conditions, and the embodiments of the present application do not impose too many restrictions thereon.

[0086] It should be noted that the LED chip can be a UV LED chip or other LED chips, and the embodiments of the present application do not limit this. Of course, for the convenience of explanation, the LED chip provided in the embodiments of the present application can be a UV LED chip, wherein the use of the UV LED chip, that is, the use of the ultraviolet light emitted by the UV LED chip for sterilization can improve the sterilization effect.

[0087] S103: mounting a plurality of LED chips to be polished on a substrate, and polishing the surfaces of the LED chips to be polished with a grinding fluid to form polished LED chips.

[0088] Specifically, multiple LED chips to be polished are installed on the substrate in an orderly manner by welding or other fixing methods, and are located on the same side of the substrate. After the installation is completed, the LED chips to be polished are polished multiple times with a grinding fluid until the surface of the LED chips to be polished is smooth, and finally a polished LED chip is formed. At this time, the polished LED chip has a better luminous effect due to its smooth surface.

[0089] It should be noted that the surface of the LED chip to be polished can be polished by abrasive fluid polishing, magnetorheological polishing, abrasive water jet polishing, magnetic jet polishing, etc. Specifically, the embodiments of the present application are not too restrictive.

[0090] In addition, for the sake of convenience, the present application embodiment takes polishing with a grinding fluid as an example. It should be noted that the grinding fluid includes liquid and abrasives, wherein the abrasives are in direct contact with the surface of the LED chip to be polished, so as to help the surface of the LED chip to be polished be polished more evenly and achieve a better polishing effect.

[0091] In addition, the grinding material may be abrasive grains. The present application embodiment is not too restrictive here, as long as the burnt material or residual cutting material on the surface of the LED chip to be polished can be ground without damaging the LED chip to be polished.

[0092] In addition, the grinding material may include a variety of abrasive particles, and the materials and shapes of the abrasive particles may be the same or different, and the embodiments of the present application do not limit this.

[0093] In some embodiments, the liquid is a dispersion medium for the abrasive grains. For example, as the liquid of the polishing fluid, a liquid that does not damage the LED chip to be polished can be used. On the other hand, the abrasive grains are granular or powdery materials that function as abrasives. As long as the abrasive grains can be dispersed in the liquid, any type of abrasive grains can be used.

[0094] In addition, it should be noted that the surface of the LED chip to be polished includes all surfaces except the welding surface of the LED chip to be polished, that is, all surfaces exposed outside the substrate are polished and ground to make them smooth.

[0095] S104: Packaging a plurality of polished LED chips to form a light-emitting device.

[0096] It is understandable that the multiple polished LED chips formed after polishing are packaged, wherein the packaging method is not too limited in the embodiments of the present application, as long as the multiple polished LED chips can be packaged to form a light-emitting device.

[0097] Through this method, a plurality of cut LED chips to be polished are fixed by a substrate, and then polished by a grinding fluid. On the one hand, the fixing strength of the LED chips to be polished during the polishing process is ensured to avoid being washed away by the grinding fluid and thus damaging the LED chips. On the other hand, the grinding fluid is used to remove the burnt or cut residues formed on the surface of the LED chips to be polished after laser or grinding wheel cutting, so that the surface is flattened, which solves the problem of light blocking and light absorption by the side wall after the LED chips are cut, and improves the luminous efficiency of the LED chips.

[0098] The specific process of mounting a plurality of LED chips to be polished on a substrate is as follows: Figure 2 A schematic diagram of a process for manufacturing a second light-emitting device provided in an embodiment of the present application is shown in FIG. Figure 2 As shown, in an optional embodiment, a plurality of LED chips to be polished are mounted on a substrate, and the surfaces of the LED chips to be polished are polished using a grinding fluid, specifically comprising:

[0099] S201: welding the welding surfaces of a plurality of LED chips to be polished on a substrate at intervals.

[0100] It is understandable that the LED chip to be polished has multiple surfaces, one of which is a welding surface for welding on the substrate to play a fixing role.

[0101] In addition, the interval design facilitates the grinding fluid to grind and polish multiple surfaces of the LED chip to be polished, so as to improve the efficiency of grinding and polishing, and further improve the luminous efficiency of the LED chip.

[0102] It should be noted that the distance between the multiple LED chips to be polished can be adjusted according to the actual situation, and the embodiment of the present application does not impose too many restrictions on this.

[0103] S202: polishing the polishing surface of the LED chip to be polished using a grinding fluid, wherein there are multiple polishing surfaces.

[0104] It can be understood that in order to improve the luminous efficiency of the LED chip, the number of polishing surfaces can be increased. That is, by using a grinding fluid to polish the surface of the LED chip to be polished, not only one of the surfaces is polished, but multiple surfaces are polished at the same time, wherein multiple surfaces are polishing surfaces.

[0105] In an optional embodiment, the polishing surface includes a top wall and a side wall of the LED chip to be polished.

[0106] It can be understood that there are multiple polishing surfaces, which may include a top wall and multiple side walls. Generally, the bottom wall of the LED chip to be polished can be used as a welding surface, the top wall can be used as a light-emitting surface, and multiple side walls are surrounded between the welding surface and the light-emitting surface. Of course, the side wall can also be a light-emitting surface, and the light-emitting surface in this case can include the top wall and side walls of the LED chip to be polished, so as to improve the light-emitting efficiency of the LED chip.

[0107] In an optional implementation, welding the welding surfaces of a plurality of LED chips to be polished at intervals on a substrate specifically includes:

[0108] The welding surface of the LED chip to be polished is welded to the first conductive layer on the substrate.

[0109] It is understandable that in order to facilitate electrical conduction between the LED chip to be polished and the substrate, welding can be performed with the first conductive layer on the substrate. In some embodiments, the first conductive layer can be made of metal materials such as aluminum and copper as long as it can conduct electricity.

[0110] In addition, the first conductive layer can appropriately distribute heat generated by various devices of the LED chip to be polished operated by the current in the wire, and prevent the LED chip to be polished from being damaged due to heat release.

[0111] In some embodiments, the LED chips to be polished can be bonded one by one to the first conductive layer of the substrate by eutectic bonding, solder paste bonding, ultrasonic bonding, laser bonding, diffusion bonding, or other appropriate bonding.

[0112] Among them, in an optional implementation manner, polishing the polishing surface of the LED chip to be polished by using a grinding fluid specifically includes:

[0113] A plurality of LED chips to be polished and the substrate which have been welded on the substrate are placed in the cavity, and a grinding fluid is injected into the cavity so that the grinding fluid passes through the polishing surface.

[0114] It can be understood that in order to improve the efficiency of polishing, the grinding fluid can be injected into the cavity so that the grinding fluid fills the gaps between the multiple LED chips to be polished. Under the action of pressure and flow rate, the abrasive particles flush and polish the multiple polishing surfaces of the LED chips to be polished. The polishing result is controlled to be just right by controlling appropriate pressure, flow rate, flow direction, time and other factors until the multiple polishing surfaces of the LED chips to be polished are smooth.

[0115] In some embodiments, the cavity may have an injection port and an exhaust port, wherein the injection port and the exhaust port may be multiple respectively, and the grinding fluid is injected into the cavity through the multiple injection ports until the multiple polishing surfaces of the LED chips to be polished are smooth, and the grinding fluid is discharged through the multiple exhaust ports.

[0116] Exemplarily, the injection port and the discharge port may be located on the same side of the substrate, that is, consistent with the extension direction of the substrate.

[0117] Of course, in order to improve the polishing effect, an angle is formed between the extension direction of some injection ports and the extension direction of the substrate, and the specific angle can be adjusted according to actual conditions.

[0118] Optionally, the extension direction of some injection ports is perpendicular to the extension direction of the substrate. Such an angle design can improve the polishing efficiency and effect of the grinding fluid, making the multiple polishing surfaces of the LED chip to be polished quickly, smooth and flat, and further improving the luminous efficiency of the LED chip.

[0119] In an optional embodiment, an LED chip is provided, and the LED chip is cut into a plurality of LED chips to be polished, specifically comprising:

[0120] Cutting is performed along a direction perpendicular to the welding surface of the LED chip to form a plurality of LED chips to be polished, and the welding surfaces of the plurality of LED chips to be polished are spliced ​​together to form the welding surface of the LED chip.

[0121] It is understandable that the LED chip has a welding surface. In order to improve the welding strength and cutting stability, generally, it can be cut along the direction perpendicular to the welding surface of the LED chip to form multiple LED chips to be polished of the same size. That is to say, the welding surface of the LED chip to be polished is part of the welding surface of the LED chip, which can reduce damage to the LED chip.

[0122] In an optional implementation, before the welding surfaces of a plurality of LED chips to be polished are welded on a substrate at intervals, the method specifically includes:

[0123] The welding surfaces of a plurality of qualified LED chips to be polished are welded on the substrate at intervals.

[0124] Specifically, the LED chips to be polished can be pre-tested for chip acceptance, and then each LED chip to be polished can be classified and marked according to its optoelectronic characteristics, such as forward voltage, peak wavelength, optical power, etc.; appropriate LED chips to be polished can be grabbed and bonded to the substrate according to the optoelectronic parameter requirements.

[0125] This is because the yield of the LED chips to be polished is usually low. There is usually a certain proportion of LED chips to be polished in the wafer whose photoelectric characteristics do not meet the production or use requirements, or even defective chips. If processed without differentiation, the quality of the LED chips to be polished transferred and bonded to the substrate will be uneven. Pre-sorting the LED chips to be polished can avoid a huge waste of substrates.

[0126] Figure 3 A schematic diagram of a process for manufacturing a third light-emitting device provided in an embodiment of the present application is shown in FIG. Figure 3 As shown, in an optional embodiment, after a plurality of LED chips to be polished are mounted on a substrate, the following steps are specifically included:

[0127] S301: Cutting the substrate to form a bonded body of the substrate and the polished LED chip.

[0128] It is understood that the substrate is cut according to the cutting path preset on the substrate, and the cutting means and method are not limited. At this time, each substrate is combined with one or more polished LED chips, and the substrate and the one or more polished LED chips are electrically connected. Except for the joint between the two, the exposed surface is smooth to form a joint body.

[0129] In addition, it is not difficult to understand that such a design can directly cut the substrate to avoid removing the polished LED chip from the substrate, thereby reducing damage to the polished LED chip.

[0130] S302: Packaging the bonded body.

[0131] It is understandable that the packaging method can be packaged using a conventional structure or other methods. No matter which packaging method is used, it can ensure that the chip in the packaged light-emitting device is a polished LED chip, and its polished surface is a smooth surface, which can increase the luminous efficiency and improve the luminous efficiency of the light-emitting device.

[0132] In an optional embodiment, packaging the junction body specifically includes:

[0133] The first dam and the first lens on the substrate cover the bonded body to encapsulate the bonded body.

[0134] It is understandable that in order to reduce costs, the structure of the substrate can be directly used for packaging. Specifically, the first dam, the first lens and the substrate provided on the substrate form a receiving space for receiving the bonding body.

[0135] Of course, another packaging method may be used. Specifically, in an optional implementation, the assembly is packaged, which specifically includes:

[0136] The packaging substrate, the second dam and the second lens of the packaging component are used to enclose a receiving space for receiving the bonding body so as to package the bonding body. The third conductive layer of the packaging component is electrically connected to the conductive layer of the bonding body.

[0137] It is understandable that in order to improve the stability of the package, the assembly can be packaged using a packaging component.

[0138] Specifically, the bonding body is basically welded or installed on the packaging substrate in other ways, the second dam is arranged on the packaging substrate, and the second lens cover is arranged on the second dam, wherein, in order to ensure electrical conduction between the bonding body and the packaging component, the conductive layer of the bonding body can be electrically connected to the third conductive layer of the packaging component.

[0139] The manufacturing method of the light-emitting device provided in the embodiment of the present application includes: providing a substrate; providing an LED chip, cutting the LED chip into a plurality of LED chips to be polished; mounting the plurality of LED chips to be polished on the substrate, and polishing the surface of the LED chips to be polished with a grinding fluid to form a polished LED chip; and packaging the plurality of polished LED chips to form a light-emitting device. Through this method, the plurality of cut LED chips to be polished are fixed with a substrate, and then polished with a grinding fluid. On the one hand, the fixing strength of the LED chips to be polished during the polishing process is ensured to avoid being washed away by the grinding fluid, thereby damaging the LED chips; on the other hand, the grinding fluid is used to remove the burnt or cut residues formed on the surface of the LED chips to be polished after laser or grinding wheel cutting, so that the surface is flattened, which solves the problem of light blocking and light absorption by the side wall after the chip is cut, and improves the luminous efficiency of the LED chip.

[0140] Embodiment 2

[0141] also, Figure 4 A first structural schematic diagram of a light emitting device provided in an embodiment of the present application is shown in FIG. Figure 5 A second structural schematic diagram of a light emitting device provided in an embodiment of the present application is shown in FIG. Figure 6 A third structural schematic diagram of a light emitting device provided in an embodiment of the present application is shown in FIG. Figure 7 This is a fourth structural schematic diagram of a light emitting device provided in an embodiment of the present application. Figures 4 to 7 As shown, an embodiment of the present application provides a light-emitting device 100, which adopts the manufacturing method of the light-emitting device as described above, including a substrate 110 and a polished LED chip 120, the substrate 110 is provided with a first conductive layer 111 and a second conductive layer 112 which are electrically connected to each other, the polished LED chip 120 is welded on the first conductive layer 111, and the second conductive layer 112 is configured to be electrically connected to an external circuit.

[0142] It can be understood that the substrate 110 is used to fix and polish the LED chip 120 . In order to improve the conductivity, a first conductive layer 111 and a second conductive layer 112 may be provided on the substrate 110 .

[0143] Figure 8 A schematic diagram of a first structure of a substrate in a light-emitting device provided in an embodiment of the present application, such as Figure 8 As shown, it should be noted that the first conductive layer 111 and the second conductive layer 112 can be arranged on the same side of the substrate 110, or on two opposite sides of the substrate 110. Specifically, the embodiments of the present application are not overly restricted and can be adjusted accordingly according to actual conditions as long as the two are electrically connected to each other.

[0144] Fig. 9 A second structural schematic diagram of a substrate in a light-emitting device provided in an embodiment of the present application, such as Figure 8 As shown, when the first conductive layer 111 and the second conductive layer 112 are disposed on opposite sides of the substrate 110 , the conductive through-holes 115 ensure electrical connection between the first conductive layer 111 and the second conductive layer 112 .

[0145] In some embodiments, the first conductive layer 111 and the second conductive layer 112 may be made of metal materials such as aluminum, copper, etc., as long as they can conduct electricity.

[0146] In addition, it should be noted that, since the polished LED chip 120 is polished by a grinding fluid, its multiple polished surfaces are smooth surfaces, thereby improving the luminous efficiency of the LED chip.

[0147] Fig.10 A top view of a first type of light emitting device provided in an embodiment of the present application in which a polished LED chip is mounted on a substrate, Fig.11 A side view of a first type of light emitting device provided in an embodiment of the present application in which a polished LED chip is mounted on a substrate, Fig.12 A second top view of a light emitting device provided in an embodiment of the present application in which a polished LED chip is mounted on a substrate, Fig.13 A side view of a second type of light-emitting device provided in an embodiment of the present application in which a polished LED chip is mounted on a substrate.

[0148] like Figures 4 to 13 As shown, a first dam 113 and a first lens 114 are provided on the substrate 110 , and the first dam 113 and the first lens 114 cover the substrate 110 .

[0149] In some embodiments, the first dam 113 may be fixedly or detachably disposed on the substrate 110 .

[0150] Optionally, the detachable connection here includes but is not limited to snap-on connection, screw connection, threaded fastener connection, etc.

[0151] In some embodiments, the bottom surface of the first lens 114 may be fixedly or detachably disposed on the first dam 113. Optionally, the detachable connection here includes but is not limited to a snap connection, a screw connection, a threaded fastener connection, and the like.

[0152] Exemplarily, the connection method between the bottom surface of the first lens 114 and the first dam 113 may include but is not limited to glue bonding, metal welding, laser welding, ultrasonic welding and many other methods.

[0153] Of course, in other embodiments, the first lens 114 may be directly fixed or detachably disposed on the substrate 110 .

[0154] It is not difficult to see that the first lens 114 covers the substrate 110 so that the polished LED chip 120 on the substrate 110 can emit ultraviolet light. The ultraviolet light can pass through the first lens 114 to irradiate and destroy and change the DNA (deoxyribonucleic acid) structure of the microorganisms, causing the bacteria to die immediately or unable to reproduce offspring, thereby achieving the purpose of sterilization.

[0155] For example, the first lens 114 can be made of quartz glass, which not only allows the light of the polished LED chip 120 to pass through, but also helps to protect the polished LED chip 120 and prevent the polished LED chip 120 from being damaged by the outside world. The structure is strong and has good pressure resistance and safety.

[0156] Exemplarily, the material of the first dam 113 may be metal, or non-metallic inorganic material, engineering plastic, etc.

[0157] In other embodiments, the first lens 114 may be hemispherical. Since the hemispherical first lens 114 can adjust the angle of the ultraviolet light emitted by the polished LED chip 120 and converge the ultraviolet light, it can improve the light extraction efficiency and enhance the light output efficiency of the polished LED chip 120.

[0158] Of course, the first lens 114 may be a structure of other shapes, and the embodiment of the present application is not too limited here.

[0159] The light-emitting device provided in the embodiment of the present application adopts the manufacturing method of the light-emitting device as described above, and includes a substrate and a polished LED chip, wherein a first conductive layer and a second conductive layer electrically connected to each other are provided on the substrate, the polished LED chip is welded on the first conductive layer, and the second conductive layer is configured to be electrically connected to an external circuit; a first dam and a first lens are provided on the substrate, and the first dam and the first lens cover the substrate. Since the surface of the polished LED chip is polished, its surface is flattened, which improves the luminous efficiency of the polished LED chip, thereby improving the luminous efficiency of the light-emitting device.

[0160] Embodiment 3

[0161] also, Fig.14 A first structural schematic diagram of another light emitting device provided in an embodiment of the present application, Fig.15 A second structural schematic diagram of another light emitting device provided in an embodiment of the present application is shown in FIG. Figures 8 to 15 As shown, the embodiment of the present application also provides a light-emitting device 200, which adopts the manufacturing method of the light-emitting device as described above, including a substrate 110 and a polished LED chip 120, the substrate 110 is provided with a first conductive layer 111 and a second conductive layer 112 which are electrically connected to each other, the polished LED chip 120 is welded on the first conductive layer 111, and the second conductive layer 112 is configured to be electrically connected to an external circuit.

[0162] The details have been explained above, so I will not go into details here.

[0163] The light-emitting device 200 also includes a packaging component 210, which includes a packaging substrate 211, a second dam 212, a second lens 213 and a third conductive layer 214. The packaging substrate 211 is located on a side of the substrate 110 that is away from the polished LED chip 120. The second dam 212 is arranged on the packaging substrate 211, the second lens 213 is covered on the second dam 212, and the third conductive layer 214 is electrically connected to the second conductive layer 112.

[0164] In some embodiments, the second dam 212 may be fixedly or detachably disposed on the packaging substrate 211 .

[0165] Optionally, the detachable connection here includes but is not limited to snap-on connection, screw connection, threaded fastener connection, etc.

[0166] In some embodiments, the bottom surface of the second lens 213 may be fixedly or detachably disposed on the second dam 212. Optionally, the detachable connection here includes but is not limited to a snap connection, a screw connection, a threaded fastener connection, and the like.

[0167] Exemplarily, the connection method between the bottom surface of the second lens 213 and the second dam 212 may include but is not limited to glue bonding, metal welding, laser welding, ultrasonic welding and many other methods.

[0168] In addition, the structures or materials of the second dam 212 and the first dam 113 may be the same or different, and the embodiments of the present application do not limit this.

[0169] Of course, the material of the second dam 212 can be metal, or non-metallic inorganic material, engineering plastic, etc. It can be the same ceramic material as the package substrate 211, formed by co-temperature sintering; it can also be a metal material, formed by electroplating, chemical plating, etc.; it can also be other non-metallic materials, bonded together by bonding materials.

[0170] Accordingly, the structure or material of the second lens 213 and the first lens 114 can be the same or different, and the embodiments of the present application do not restrict this. Of course, the second lens 213 can be made of quartz glass material, which not only allows the light of the polished LED chip 120 to pass through, but also helps to protect the polished LED chip 120 and prevent the polished LED chip 120 from being damaged by the outside world. The structure is strong and has good pressure resistance and safety.

[0171] In addition, the third conductive layer 214 is electrically connected to the second conductive layer 112 to ensure electrical conduction between the package component 210 and the substrate 110 .

[0172] The light-emitting device provided in the embodiment of the present application adopts the manufacturing method of the light-emitting device as described above, including a substrate and a polished LED chip, the substrate is provided with a first conductive layer and a second conductive layer electrically connected to each other, the polished LED chip is soldered on the first conductive layer, and the second conductive layer is configured to be electrically connected to an external circuit; and also includes a packaging component, the packaging component includes a packaging substrate, a second dam, a second lens, and a third conductive layer, the packaging substrate is located on a side of the substrate away from the polished LED chip, the second dam is arranged on the packaging substrate, the second lens cover is arranged on the second dam, and the third conductive layer is electrically connected to the second conductive layer. Since the surface of the polished LED chip is polished, its surface is flattened, which improves the luminous efficiency of the polished LED chip, thereby improving the luminous efficiency of the light-emitting device.

[0173] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a light emitting device, characterized in that: include: providing a substrate; Providing an LED chip, and cutting the LED chip into a plurality of LED chips to be polished; Mounting a plurality of the LED chips to be polished on the substrate, and polishing the surfaces of the LED chips to be polished using a grinding fluid to form polished LED chips; Packaging a plurality of polished LED chips to form the light emitting device; The step of mounting the plurality of LED chips to be polished on the substrate and polishing the surfaces of the LED chips to be polished using a grinding fluid specifically includes: Soldering the welding surfaces of the plurality of LED chips to be polished on the substrate at intervals; Polishing the polishing surface of the LED chip to be polished by using a grinding fluid, wherein the polishing surface includes the side wall of the LED chip to be polished; The polishing of the polishing surface of the LED chip to be polished by using a grinding fluid specifically includes: The plurality of LED chips to be polished that have been welded on the substrate and the substrate are placed into a cavity, and a grinding fluid is injected into the cavity so that the grinding fluid passes through the polishing surface; the cavity has a plurality of injection ports for injecting the grinding fluid, and an extension direction of some of the plurality of injection ports has an angle with an extension direction of the substrate.

2. The method for manufacturing a light emitting device according to claim 1, characterized in that: The polishing surface also includes the top wall of the LED chip to be polished.

3. The method for manufacturing a light emitting device according to claim 2, characterized in that: The step of welding the welding surfaces of the plurality of LED chips to be polished at intervals on the substrate specifically comprises: The welding surface of the LED chip to be polished is welded to the first conductive layer on the substrate.

4. The method for manufacturing a light emitting device according to claim 3, characterized in that: The providing of an LED chip and cutting the LED chip into a plurality of LED chips to be polished specifically comprises: Cutting is performed along a direction perpendicular to the welding surface of the LED chip to form a plurality of LED chips to be polished, and the welding surfaces of the plurality of LED chips to be polished are spliced ​​together to form the welding surface of the LED chip.

5. The method for manufacturing a light emitting device according to claim 4, characterized in that: Before the welding surfaces of the plurality of LED chips to be polished are welded on the substrate at intervals, the method specifically comprises: The welding surfaces of a plurality of qualified LED chips to be polished are welded on the substrate at intervals.

6. The method for manufacturing a light emitting device according to any one of claims 1 to 5, characterized in that: After the plurality of LED chips to be polished are mounted on the substrate, the method specifically comprises: Cutting the substrate to form a joint body of the substrate and the polished LED chip; The bonded body is packaged.

7. The method for manufacturing a light emitting device according to claim 6, characterized in that: The packaging of the bonded body specifically includes: The first dam and the first lens on the substrate cover the bonded body to encapsulate the bonded body.

8. The method for manufacturing a light emitting device according to claim 7, characterized in that: The packaging of the bonded body specifically includes: The packaging substrate, the second dam and the second lens of the packaging component are used to enclose a receiving space for receiving the bonding body so as to package the bonding body. The third conductive layer of the packaging component is electrically connected to the conductive layer of the bonding body.

9. A light-emitting device, using the method for manufacturing a light-emitting device according to any one of claims 1 to 8, characterized in that: It comprises a substrate and a polished LED chip, wherein a first conductive layer and a second conductive layer electrically connected to each other are provided on the substrate, the polished LED chip is welded on the first conductive layer, and the second conductive layer is configured to be electrically connected to an external circuit; A first dam and a first lens are provided on the substrate, and the first dam and the first lens cover the substrate.

10. A light-emitting device, using the method for manufacturing a light-emitting device according to any one of claims 1 to 8, characterized in that: It comprises a substrate and a polished LED chip, wherein a first conductive layer and a second conductive layer electrically connected to each other are provided on the substrate, the polished LED chip is welded on the first conductive layer, and the second conductive layer is configured to be electrically connected to an external circuit; It also includes a packaging component, which includes a packaging substrate, a second dam, a second lens and a third conductive layer. The packaging substrate is located on a side of the substrate away from the polished LED chip. The second dam is arranged on the packaging substrate, the second lens cover is arranged on the second dam, and the third conductive layer is electrically connected to the second conductive layer.

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