laser

Abstract

The application discloses a laser, and belongs to the technical field of photoelectricity. The laser comprises a bottom plate, a frame, a plurality of light-emitting components, a cover plate and a light-transmitting sealing layer. The frame is surrounded on the bottom plate and forms a containing space. The plurality of light-emitting components are located in the containing space and fixed on the bottom plate. The cover plate has an opening. The upper part of the frame is sealingly fixed with the outer edge region of the cover plate. The light-transmitting sealing layer is sealingly fixed with the inner edge region of the cover plate and covers the opening of the cover plate. The plurality of light-emitting components are in communication with an external power supply structure through a plurality of conductive pins. The plurality of conductive pins are symmetrically distributed on both sides of the frame. A plurality of turn-up holes are distributed on both sides of the middle part of the frame. Each conductive pin passes through a turn-up hole and is fixed with the frame. The application is used for light emission.

Description

[0001] This application is a divisional application of Chinese invention application 202110693475.3 (2021-06-22), entitled "Laser". Technical Field

[0002] This application relates to the field of optoelectronic technology, and in particular to a laser. Background Technology

[0003] With the development of optoelectronic technology, lasers are being widely used.

[0004] Figure 1 This is a structural diagram of a laser provided by related technologies. For example... Figure 1 As shown, the laser 00 includes a base plate 001, an annular frame 002, multiple light-emitting components 003, a cover plate 004, a light-transmitting sealing layer 005, and multiple conductive pins 006. The frame 002 and the light-emitting components 003 are both fixed to the base plate 001, and the frame 002 surrounds the multiple light-emitting components 003. The cover plate 004 is an annular sheet metal component; the outer edge of the cover plate 004 is welded to the surface of the frame 002 away from the base plate 001, and the edge of the light-transmitting sealing layer 005 is fixed to the inner edge of the cover plate 004. Figure 1 The frame 002 shown has multiple sidewalls of uniform thickness, with multiple openings on two opposite sidewalls. Each conductive pin 006 passes through one opening and is fixed to the frame 002. The light-emitting chip in the light-emitting assembly 003 is connected to an external power supply via conductive pins 106, and then emits laser light when excited by the external power supply. This laser light passes through the light-transmitting sealing layer 005 and is emitted, thus realizing the light emission of the laser 00.

[0005] However, in related technologies, if the reliability of the conductive pins of the light-emitting component is to be improved, the conductive pins need to have sufficient contact area with the openings of the frame, thereby increasing the wall thickness of the frame. However, the frame and the base plate are usually connected by welding. If the frame is thick, the base plate will bear greater stress during the welding process, which will easily cause deformation, resulting in poor flatness of the surface on which the light-emitting assembly is mounted, and ultimately affecting the light output effect of the laser.

[0006] A technical solution is needed that can both reduce the assembly difficulty of lasers and ensure the laser output effect. Summary of the Invention

[0007] This application provides a laser that reduces the difficulty of laser assembly while ensuring the laser's light output performance. The laser employs the following technical solution:

[0008] A laser includes: a base plate, a frame, multiple light-emitting components, a cover plate, and a light-transmitting sealing layer;

[0009] The frame surrounds the base plate and forms an accommodating space, and the plurality of light-emitting components are all located within the accommodating space and fixed on the base plate;

[0010] The frame is in the shape of a thin plate, and the upper part of the frame is folded outward to form a first folded edge, which is fixed to the outer edge area of ​​the cover plate;

[0011] The light-transmitting sealing layer is fixed to the inner edge area of ​​the cover plate and covers the opening of the cover plate;

[0012] The lower part of the frame is folded inward or outward to form a second folded edge, which is fixedly connected to the base plate.

[0013] The beneficial effects of the technical solution provided in this application include at least the following:

[0014] In the laser provided in this application, because the frame is thin-plate shaped, it is fixedly connected to the base plate via the lower second folded edge. This allows the relatively thin frame to more easily absorb the internal stress generated during the welding process when welded to the base plate, converting it into some mechanical stress and causing slight deformation. This reduces the internal stress borne by the base plate and lowers the probability of deformation, thereby ensuring the light output effect. Furthermore, the frame, serving as the side wall between the upper cover and the base plate, is fixed to the outer edge of the cover plate via the upper first folded edge. This provides support for the upper cover and the light-transmitting sealing layer, and together with the base plate, forms a sealed space to accommodate multiple light-emitting components. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a laser provided by related technologies;

[0017] Figure 2 This is an exploded structural diagram of a laser provided in an embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the structure of a laser provided in an embodiment of this application;

[0019] Figure 4 This is an exploded structural diagram of a base assembly provided in an embodiment of this application;

[0020] Figure 5This is an exploded structural diagram of a top cover assembly provided in an embodiment of this application;

[0021] Figure 6 This is a schematic diagram of another laser provided in the embodiments of this application. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0023] With the development of optoelectronic technology, lasers are being used more and more widely. For example, lasers can be used as a light source in laser projection or laser television. The following embodiments of this application provide a laser that can improve the sealing of openings on the frame of the laser, thereby improving the manufacturing effect and quality of the laser.

[0024] Figure 2 This is an exploded structural diagram of a laser provided in an embodiment of this application. Figure 3 This is a schematic diagram of the structure of a laser provided in an embodiment of this application. Figure 3 It can be Figure 2 The diagram shows a schematic of the cross-section a-a' of the laser. Please refer to... Figure 2 and Figure 3 The laser 10 may include a base plate 101, a frame 102, multiple light-emitting components 103, a cover plate 104, and a light-transmitting sealing layer 105. The base plate 101 is typically made of a metal with good thermal conductivity. The frame 102 surrounds the base plate 101 and forms an accommodating space. The multiple light-emitting components 103 are located within this accommodating space and are fixedly attached to the base plate 101. In this embodiment, the frame 102 is a thin plate, corresponding to the sidewall portion of the accommodating space. The upper part of the frame 102 is folded outward to form a first folded edge, which is then sealed and fixed to the outer edge region of the cover plate 104. The light-transmitting sealing layer 105 is sealed and fixed to the inner edge region of the cover plate 104 and covers the opening of the cover plate 104.

[0025] Additionally, the lower part of the frame 102 is folded inward or outward to form a second folded edge, which is fixedly connected to the base plate 101 by welding.

[0026] And, in the embodiments of this application, such as Figure 2 As shown, it also includes multiple conductive pins 106 extending outwards along the outer side of the frame. It should be noted that... Figure 2The light-emitting component 103 is not shown in the diagram. The light-emitting component 103 can be multiple light-emitting chips arranged in rows or columns, or multiple light-emitting chips and corresponding reflective prism components. The upper surface of the base plate 101 is the inner surface, providing a mounting surface for the multiple light-emitting components, and the lower surface is the outer surface, used for heat conduction in contact with the heat dissipation structure. The light-emitting chips can be connected in series and connected to an external power supply structure via conductive pins 106. The conductive pins 106 can be symmetrically distributed on both sides of the frame 102.

[0027] The frame 102 will be described below with reference to the attached diagram:

[0028] In this embodiment, the frame 102 can be square-ring shaped. In one specific implementation, the frame 102 can also be circular-ring shaped, with pentagonal edges, or other ring shapes, all used to enclose the base plate 101 to form a concave space. This embodiment does not limit the specific shape.

[0029] In this embodiment, the frame 102 is a sheet metal part, in the form of a thin plate. And, as... Figure 3 As shown, the frame 102 may include a second folded edge 1021, a frame middle portion 1022, and a first folded edge 1023 connected sequentially along a direction away from the base plate 101 (such as the y-direction). Both the second folded edge 1021 and the first folded edge 1023 are bent relative to the frame middle portion 1022.

[0030] Furthermore, multiple flanged holes K are distributed on opposite sides of the middle of the frame 102 to allow multiple conductive pins 106 to extend. Figure 3 As shown, the flanged hole K on the frame 102 can protrude outwards from the frame 102, that is, outwards from the ring of the annular frame 102. This avoids occupying space on the inner side of the frame 102, ensuring sufficient space for the light-emitting component 103. In one specific embodiment, the flanged hole K can also protrude inwards from the frame 102; this embodiment does not illustrate this situation. Figure 3 As shown, the flange hole K can be located on the middle part 1022 of the frame.

[0031] In one specific implementation, the annular surfaces of both the second folded edge 1021 and the first folded edge 1023 can be parallel to the surface of the base plate 101 near the frame 102. The second folded edge 1021 can be fixed to the base plate 101, such as by fixing the surface of the second folded edge 1021 near the base plate 101 to the base plate 101. The outer edge region of the cover plate 104 is fixed to the first folded edge 1023, such as by fixing it to the surface of the first folded edge 1023 away from the base plate 101.

[0032] For example, such as Figure 3As shown, the second folded edge 1021 bends inward relative to the center of the frame 1022, and the first folded edge 1023 bends outward relative to the center of the frame 1022. In one specific embodiment, the second folded edge 1021 may also bend outward relative to the center of the frame 1022; the first folded edge 1023 may also bend inward relative to the center of the frame 1022. This application does not limit the specific embodiment.

[0033] In one specific implementation, the frame 102 in this application embodiment can be integrally formed. The frame 102 can be made of Kovar material and is a sheet metal part. The thickness of the frame 102 at various locations can be the same or approximately the same. For example, the thickness of the second fold 1021, the middle part 1022, and the first fold 1023 of the frame 102 can be approximately the same. For example, the thickness of the frame 102 can be in the range of 0.1 mm to 1 mm. This thickness can ensure that the frame has high mechanical strength and meets the stamping requirements. For example, the thickness of the frame 102 is 0.4 mm. In one specific implementation, the frame 102 can be formed by a stamping process. For example, a ring-shaped plate structure can be stamped to bend, recess, bulge, or flange at appropriate locations in the plate structure to obtain the frame provided in this application embodiment. If the second folded edge in the annular plate structure is bent inward and the first folded edge is bent outward, and the opening in the middle of the frame is flanged, the frame provided in the embodiment of this application can be obtained.

[0034] In one specific implementation, the frame 102 in this embodiment can be fixed to the base plate 101 by brazing. For example, an annular solder can be placed between the second folded edge 1021 of the frame 102 and the base plate 101, and then the solder is heated to melt it, thereby fixing the frame 102 to the base plate 101. For example, the base plate 101 can be made of copper, such as oxygen-free copper. Copper has a high thermal conductivity, which ensures that the heat generated by the light-emitting components mounted on the base plate during operation can be quickly conducted through the casing and dissipated quickly, avoiding heat accumulation that could damage the light-emitting components. The frame 102 can be made of Kovar materials, such as iron-nickel-cobalt alloys or other alloys.

[0035] It should be noted that the coefficients of thermal expansion of the base plate and the frame differ significantly. In related technologies, the base plate is prone to wrinkling under the influence of large amounts of heat during brazing, resulting in poor flatness of the surface on which the light-emitting components are mounted, thus affecting the placement of the light-emitting components. However, in this embodiment, the frame is a sheet metal part with a thinner thickness. Thus, the thermal stress generated during brazing can be converted into mechanical deformation of the frame. For example, the frame can undergo slight deformation under the action of thermal stress to release the thermal stress, avoiding wrinkling or deformation of the base plate under thermal stress and ensuring the flatness of the base plate. Since precision optical components are mounted on the base plate, changes in flatness can easily lead to a deterioration in light output, such as the light beam emitted by the light-emitting chip failing to properly align and collimate or receive light from other optical components.

[0036] And, such as Figure 2 As shown, the outer edge region Q1 of the cover plate 104 is fixed to the surface of the frame 102 away from the base plate 101. The light-transmitting sealing layer 104 is fixed to the inner edge region Q2 of the cover plate 104 and covers the opening of the cover plate 104. The side wall of the frame 102 has multiple flanged holes K, and each conductive pin 106 passes through a flanged hole K and is fixed to the frame 102. The extension direction of the conductive pin 106 is consistent with the depth direction of the corresponding flanged hole K. In one specific embodiment, this extension direction can be parallel to the surface of the base plate 101 near the frame 102, which is also the mounting surface of the light-emitting component 103. The laser emitted by the light-emitting component 103 can be emitted from the light-transmitting sealing layer 105, thereby realizing the light emission of the laser.

[0037] In this embodiment, the structure consisting of the base plate 101, the frame 102, and the conductive pins 106 can be referred to as a housing or a base assembly. Figure 4 This is an exploded structural diagram of a base assembly provided in an embodiment of this application. The structure composed of the cover plate 104 and the light-transmitting sealing layer 105 can be referred to as the upper cover assembly. Figure 5 This is an exploded structural diagram of a top cover assembly provided in an embodiment of this application. The tube shell has an opening opposite to the bottom plate 101. The cover plate 104 and the light-transmitting sealing layer 105 can be used to seal the opening, thereby forming a sealed accommodating space where the light-emitting component 103 is located. The better the sealing effect of the accommodating space, the less the light-emitting component 103 will be corroded by external water and oxygen, thereby reducing the risk of damage to the light-emitting component, extending the life of the light-emitting component 103, ensuring the light-emitting effect of the light-emitting component, improving the quality and performance of the laser 10, and extending the lifespan of the laser.

[0038] In the laser provided in this application embodiment, because the frame is plate-shaped, it is fixedly connected to the base plate via the lower second folded edge. This allows the relatively thin frame to absorb the internal stress generated during welding, converting it into some mechanical stress and causing slight deformation. This reduces the internal stress on the base plate and lowers the probability of deformation, thus ensuring the light output effect. Furthermore, the frame, serving as the side wall between the top cover and the base plate, is fixed to the outer edge of the cover plate via the upper first folded edge. This provides support for the top cover and the light-transmitting sealing layer, and together with the base plate, forms a sealed space to accommodate multiple light-emitting components.

[0039] It should be noted that flanging refers to a forming method in which a straight edge is raised and erected along a certain curve on the edge of a flat or curved portion of a blank (i.e., an unfinished structure). For example, in this embodiment, a hole may be drilled in the frame 102 first, and then flanging may be performed on the edge of the resulting hole, such as flanging the edge of the hole along the direction perpendicular to the sidewall of the frame 102 (e.g.,...). Figure 3 The frame 102 is stretched in the x direction to obtain a flanged hole K. The flanged hole K can be cylindrical, protruding from the side wall of the frame 102, and the depth of the flanged hole K is greater than the depth of the initially formed opening on the frame 102.

[0040] The conductive pin 106 passes through the flanged hole K and is fixed to the frame 102. The area on the frame 102 where the conductive pin 106 is fixed is the sidewall of the flanged hole K. Since the flanged hole K is deeper than the original opening, the area of ​​the sidewall of the flanged hole K is larger, and the fixing area between the conductive pin 106 and the frame 102 is larger. Even if the contact between a certain position on the sidewall of the flanged hole K and the conductive pin 106 is not tight enough, as long as other positions corresponding to that position in the depth direction of the flanged hole K are in tight contact with the conductive pin 106, the sealing of the flanged hole K can be guaranteed. Therefore, the sealing effect of the flanged hole is good, resulting in better airtightness of the laser's accommodating space, and better laser fabrication effect and quality. For example, in this embodiment, the airtightness level of the laser's accommodating space is <5*10⁻⁶. -9 Pa cubic meters per second (Pa*m3 / s).

[0041] In the laser provided in this application embodiment, the opening on the frame for setting the conductive pins is a flanged hole. Since the flanged hole can be cylindrical and protrude relative to the frame, its sidewall area is relatively large; and since the conductive pins pass through the flanged hole and are fixed to the frame, the area within the frame where the conductive pins are fixed is the sidewall of the flanged hole. Therefore, the contact area between the conductive pins and the frame is large, which improves the sealing effect of the conductive pins on the flanged hole, enhances the sealing performance of the openings on the frame, and improves the fabrication perfection of the laser.

[0042] Please continue to refer to this. Figure 2 and Figure 3 In this embodiment, the laser 10 may further include multiple annular sealing insulators 107, which are used to fix the conductive pin 106 and the flanged hole K. Each conductive pin 106 may be fitted with an annular sealing insulator 107 before passing through the flanged hole K. When the conductive pin 106 is located in the flanged hole K, the annular sealing insulator 107 is located between the conductive pin 106 and the sidewall of the flanged hole K. In one specific implementation, the annular sealing insulator in this embodiment is tubular, and its length before melting may be greater than a length threshold. For example, the length of the annular sealing insulator may be equal to the depth of the flanged hole, or it may be slightly less than or slightly greater than the depth of the flanged hole.

[0043] It should be noted that after the conductive pin 106, fitted with the annular sealing insulator 107, is inserted into the flanged hole K, the annular sealing insulator 107 can be heated, for example, to 800-900 degrees Celsius, to melt it and fill the gap between the conductive pin 106 and the sidewall of the flanged hole K. The molten annular sealing insulator 107 can act as a sealing adhesive to bond the conductive pin 106 to the sidewall of the flanged hole K, thereby fixing the conductive pin 106 to the frame 102. The annular sealing insulator 107 is then cooled and solidified. In one specific embodiment, the material of the annular sealing insulator 107 may include glass. It should be noted that glass and Kovar materials have good adhesion at high temperatures. In this embodiment, Kovar material is used to prepare the frame, and glass is used to prepare the annular sealing insulator. Thus, after the annular sealing insulator melts, it can fuse well with the flanged hole, ensuring a good seal for the flanged hole.

[0044] The light-emitting component 103 will be described below with reference to the accompanying drawings:

[0045] The laser provided in this application embodiment can be a multi-chip laser diode (MCL) type laser. The multiple light-emitting components in the laser can include multiple rows and columns of light-emitting chips arranged in an array. In one specific embodiment, the laser can be a monochromatic laser, where all the light-emitting chips emit laser light of the same color. Alternatively, the laser can also be a multi-color laser, comprising multiple types of light-emitting chips, each type emitting a different color of laser light, with different types of light-emitting chips emitting different colors of laser light.

[0046] like Figure 3As shown, the light-emitting component 103 may include a light-emitting chip 1031, a heat sink 1032, and a reflecting prism 1033. The heat sink 1032 can be fixed to the base plate 101, the light-emitting chip 1031 is fixed to the heat sink 1032, and the reflecting prism 1033 is located on the light-emitting side of the light-emitting chip 1031. The light-emitting chip 1031 can emit laser light towards the reflecting prism 1033, and the reflecting prism 1033 can radiate the incident laser light away from the base plate 101 in a direction (such as the y-direction). The laser light can pass through the light-transmitting sealing layer 104 and then emit light, thereby realizing the light emission of the laser 10. The heat sink 1032 is used to assist in heat dissipation when the light-emitting chip 1031 emits light. The light-emitting chip 1031 generates a lot of heat when emitting light, and this heat can be transferred to the base plate 101 through the heat sink 1032 and then dissipated to the outside, avoiding heat accumulation that could damage the light-emitting chip 1031. The heat can also be conducted to the frame 102 through the base plate 101. At this time, the effect of the heat on the frame 102 is the same as the effect of the heat generated by brazing on the frame 102. The frame 102 can also undergo a certain deformation under the action of the heat to absorb thermal stress and assist in the dissipation of heat emitted by the light-emitting chip.

[0047] In one specific implementation, the conductive pins 106 fixed on both sides of the frame 102, located outside the frame 102, can be connected to the positive and negative terminals of an external power supply, respectively. The portion of the conductive pins 106 extending into the frame 102 can be electrically connected to the electrodes of the light-emitting chip 1031 in the light-emitting component 103, so as to transmit external current to the light-emitting chip 1031, thereby exciting the light-emitting chip 1031 to emit laser light of the corresponding color. In this embodiment, after assembling the base plate 101, the frame 102, and the conductive pins 106, that is, after obtaining the base assembly, the light-emitting component 103 is then mounted on the base plate 101. Afterwards, wire bonding is performed on the conductive pins 106 and the light-emitting chip 1031 in the light-emitting component 103, so that the electrodes of the light-emitting chip 1031 are connected to the corresponding conductive pins 106.

[0048] The upper cover assembly is described below with reference to the attached diagram:

[0049] Please continue to refer to this. Figures 3 to 5 The annular cover plate 104 in the upper cover assembly includes an outer edge region Q1 and an inner edge region Q2. In one embodiment, the inner edge region Q2 may be recessed relative to the outer edge region Q1 toward the base plate 101. In another embodiment, both the outer edge region Q1 and the inner edge region Q2 can be annular plate structures with flat upper and lower surfaces to facilitate the fixation of the cover plate 104 to the frame 102 and the light-transmitting sealing layer 105. The plane containing the outer edge region Q1 and the plane containing the inner edge region Q2 may be parallel.

[0050] In one specific implementation, the outer edge region Q1 and the inner edge region Q2 may have at least one fold B. For example... Figure 3 As shown, the pleated portion B can protrude relative to the inner edge region Q2 in a direction away from the base plate 101. In one specific embodiment, the pleated portion can also be recessed relative to the inner edge region towards the base plate. This embodiment uses the example of only one pleated portion B between the inner edge region Q2 and the outer edge region Q1. In one specific embodiment, the inner edge region Q2 and the outer edge region Q1 can also have multiple pleated portions, which can be arranged sequentially along the extension direction from the inner edge region Q2 to the outer edge region Q1.

[0051] When the cover plate has multiple pleats, the cross-section of these pleats can be wave-shaped, and the cross-section can be perpendicular to the annular surface of the cover plate 104. This wave-shaped section can have two, three, or even more wave cycles. Each pleat can correspond to half a cycle of the wave; for example, a raised portion and a recessed portion in one cycle of the wave can each serve as two pleats. When the cover plate has multiple pleats, some pleats can protrude away from the base plate relative to their inner edge region, while some pleats can be recessed relative to their inner edge region towards the base plate. For example, the inner edge region can be flush with any plane between the crest and trough of the wave. In one specific embodiment, pleats that protrude relative to the inner edge region and pleats that are recessed relative to the inner edge region can be arranged alternately. Alternatively, each pleat can protrude relative to its inner edge region, such that the inner edge region is flush with or higher than the crest of the wave. Alternatively, each fold can be recessed relative to its inner edge region. For example, the inner edge region can be flush with or lower than the trough of the waveform; this application does not limit the specific embodiment. This application uses an arc-shaped fold as an example. In one specific implementation, the fold can also be tooth-shaped, such as pointed or square teeth. In another specific implementation, a portion corresponding to one cycle of the waveform can be considered as a fold, such as the portion between adjacent peaks or troughs.

[0052] In one embodiment, the outer edge region Q1 of the cover plate 104 may have a bending structure connecting the outer edge region Q1 and the pleated portion B. Stress generated in the outer edge region Q1 can be transmitted to the pleated portion B through this bending structure. The bending structure can also deform along the bending direction under stress to absorb some of the stress, further reducing the stress transmitted to the middle portion of the cover plate. In one embodiment, if the location where the pleated portion connects to the inner edge region of the cover plate is convex or concave relative to the inner edge region, a bending structure may also be present between the inner edge region and the pleated portion. In one embodiment, the bend of the bending structure may have a chamfer or rounded corner to avoid excessive stress concentration at the bend, which could damage the bending structure.

[0053] In one specific implementation, the cover plate 104 can be a sheet metal part, and the thickness of the cover plate 104 is the same or approximately the same at all locations. The cover plate 104 can be formed by a stamping process, such as stamping a ring-shaped plate structure, causing appropriate locations in the plate structure to be bent, recessed, or protruded, to obtain the cover plate provided in this embodiment. The material of the cover plate 104 can include Kovar material, such as the cover plate 104 being made of the same material as the frame 102.

[0054] The light-transmitting sealing layer 105 in the top cover assembly can be a plate-like structure, comprising two parallel and large surfaces and a plurality of smaller side surfaces connecting the two surfaces. In one embodiment, the material of the light-transmitting sealing layer 105 may include glass, or it may be made of other light-transmitting and reliable materials, such as resin. In one embodiment, at least one of the surfaces of the light-transmitting sealing layer near the base plate and away from the base plate may be fitted with a brightness enhancement film to improve the output brightness of the laser. The light-transmitting sealing layer 105 may cover the opening of the cover plate 104 and be fixed to the cover plate 104. The top cover assembly may also include an annular sealing material 108, through which the light-transmitting sealing layer 105 and the annular cover plate 104 can be fixed. The sealing material 108 may include low-temperature glass solder. In one embodiment, the sealing material may also include glass melt adhesive, epoxy sealant, or other sealant.

[0055] In one specific implementation, the edge region of the light-transmitting sealing layer 105 can be made to contact the inner edge region Q2 of the cover plate 104, and the sealing material 108 can be made to cover the side surface of the light-transmitting sealing layer 105 to ensure reliable adhesion of the light-transmitting sealing layer 105 and reliable sealing of the laser housing space by the light-transmitting sealing layer 105. For example, the light-transmitting sealing layer 105 and the sealing material 108 can be placed on the cover plate 104, with the light-transmitting sealing layer 105 covering the opening of the cover plate 104 and the sealing material 108 surrounding the light-transmitting sealing layer 105. Then, the sealing material 108 is heated to melt and fill the gap between the light-transmitting sealing layer 105 and the cover plate 104, thereby fixing the light-transmitting sealing layer 105 and the cover plate 104.

[0056] In one specific implementation, the light-transmitting sealing layer 105 and the cover plate 104 can be fixed together using sealing material 108 to obtain the upper cover assembly. Then, the upper cover assembly is fixed to the casing, for example, by using parallel sealing welding technology to fix the cover plate 104 to the frame 102. For example, the upper cover assembly can be placed on the side of the frame 102 away from the bottom plate, with the outer edge region Q1 of the cover plate 104 overlapping the first folded edge 1023 of the frame 102. Next, the outer edge region is heated using a sealing welding device, causing the contact area between the outer edge region and the first folded edge 1023 to melt, thereby welding the outer edge region and the first folded edge 1023 together. In this embodiment, the cover plate 104 and the frame 102 can be made of the same material. In this way, when the cover plate 104 and the frame 102 are parallelly sealed, the heated areas of the cover plate 104 and the frame 102 can be directly melted into one piece without interaction. The fixing effect of the cover plate 104 and the frame 102 is good, and the sealing effect of the laser housing space is good.

[0057] During parallel sealing welding of the cover plate 104 and the frame 102, both the frame 102 and the cover plate 104 will expand due to heat, resulting in significant thermal stress. Under this thermal stress, the pleats in the cover plate 104 are essentially compressed by the inner edge region Q2 and the outer edge region Q1. At this time, each pleat can act like a compressed spring, undergoing contraction deformation. These pleats can absorb a significant amount of stress, providing a certain buffering effect, thus reducing the stress transmitted to the light-transmitting sealing layer 105. Even if the cover plate 104 expands towards the light-transmitting sealing layer 105 due to heat, the pleats can contract to some extent under the force generated by heat. Therefore, the overall expansion of the cover plate 104 towards the light-transmitting sealing layer 105 is small, resulting in less compression of the light-transmitting sealing layer 105 and reducing the risk of the light-transmitting sealing layer 105 cracking under the action of parallel sealing welding.

[0058] Furthermore, since the folds can absorb more stress, the limit of damage to the cover plate 104 under stress can be increased, greatly enhancing the adaptability of the cover plate 104 and the light-transmitting sealing layer 105 to higher parallel sealing temperatures. This reduces the requirements for laser fabrication conditions and the environmental conditions for laser use, thus expanding the laser's applicability. After the parallel sealing is completed and the cover plate 104 is no longer heated, the temperatures of the frame 102 and the cover plate 104 can drop, allowing the folds to return to their original shape (i.e., the shape when not compressed by the inner edge region Q2 and the outer edge region Q1, equivalent to the free height of a compression spring). Because the presence of the folds results in a larger unfolded area for the cover plate 104, the heat generated during the fixing of the cover plate 104 and the frame 102 can be largely absorbed and dissipated by the folds. This reduces the heat transferred to the light-transmitting sealing layer 105, decreases the deformation of the light-transmitting sealing layer 105 due to thermal expansion, reduces the risk of the light-transmitting sealing layer 105 cracking or detaching from the cover plate 104, and improves the reliability of the laser.

[0059] In one specific implementation Figure 6 This is a schematic diagram of another laser structure provided in an embodiment of this application. For example... Figure 6 As shown, in Figure 3 Based on this, the laser 10 may further include a collimating lens group 109, which may be located on the side of the upper cover assembly away from the base plate 101. For example, the edge of the collimating lens group 109 may be fixed to the outer edge of the cover plate 104. The collimating lens group 109 is used to collimate the laser emitted by the light-emitting components before it is emitted. It should be noted that collimating the light is also the same as converging the light, so that the divergence angle of the light is reduced and it is closer to parallel light. The collimating lens group 109 may include multiple collimating lenses, which may correspond one-to-one with the multiple light-emitting components 103 in the laser. The laser emitted by each light-emitting component 103 can be directed to the corresponding collimating lens and then collimated by the collimating lens before it is emitted.

[0060] In this embodiment, after assembling the base assembly and the top cover assembly, the collimating lens assembly 109 can be suspended on the side of the cover plate 104 away from the base plate 101 to adjust the collimating lens's collimation effect on the laser emitted by the light-emitting component. After adjusting and determining the position of the collimating lens assembly 109, if it is determined that the position of the collimating lens assembly can ensure that the light emitted by each light-emitting component 103 can pass through the corresponding collimating lens, an adhesive can be applied to the outer edge of the cover plate 104, and then the collimating lens assembly 109 can be fixed to the cover plate 104 by the adhesive. Since the position of the collimating lens assembly 109 can be adjusted, even if the heat generated during brazing or parallel sealing causes slight deformation of the frame 102, the position adjustment of the collimating lens assembly 109 can compensate for the influence of the deformation of the frame 102 on the laser emission of the light-emitting component 103, thereby ensuring the normal light emission of the laser 10.

[0061] The collimating lens assembly 109 can be integrally formed with multiple collimating lenses. For example, the side of the collimating lens assembly 109 away from the base plate 101 can have multiple convex arc surfaces curved towards the side away from the base plate 101. Each convex arc surface can serve as a collimating lens, thus the collimating lens assembly can be considered to include multiple collimating lenses. The collimating lens can be a plano-convex lens, having one convex arc surface and one flat surface. The convex arc surface and the flat surface can be two opposing surfaces. The flat surface can be parallel to the surface of the base plate 101 and positioned close to the base plate 101. Each convex arc surface in the collimating lens assembly 109 can be a convex arc surface within a collimating lens.

[0062] In one specific implementation, during laser assembly, each annular sealing insulator is first fitted onto each conductive pin. Then, the conductive pins with the annular sealing insulators are inserted into the flanged holes of the frame, with the annular sealing insulators positioned within these holes. The frame is then placed on a base plate, and an annular solder (such as silver-copper solder) is placed between the frame and the base plate. The structure of the base plate, frame, and conductive pins is then placed in a high-temperature furnace for sealing and sintering. After sealing, sintering, and curing, the base plate, frame, conductive pins, and solder become a single unit (i.e., the base assembly), achieving an airtight seal at the flanged holes of the frame. Alternatively, a light-transmitting sealing layer can be fixed to the cover plate using a sealing material to obtain the upper cover assembly. The light-emitting components can then be soldered to their corresponding positions on the base plate, and the upper cover assembly is soldered to the surface of the frame away from the base plate using parallel sealing technology. Finally, after aligning the collimating lens group, it is fixed to the side of the upper cover assembly away from the base plate using epoxy adhesive, thus completing the laser assembly. It should be noted that the above assembly process is only an exemplary process provided by the embodiments of this application. The welding process used in each step can be replaced by other processes, and the order of each step can also be adjusted. The embodiments of this application do not limit this.

[0063] In summary, in the laser provided in this application embodiment, the opening on the frame for setting the conductive pins is a flanged hole. Since the flanged hole can be cylindrical and protrude relative to the frame, its sidewall area is relatively large; and since the conductive pins pass through the flanged hole and are fixed to the frame, the area within the frame where the conductive pins are fixed is the sidewall of the flanged hole. Therefore, the contact area between the conductive pins and the frame is large, which improves the sealing effect of the conductive pins on the flanged hole, enhances the sealing performance of the openings on the frame, and improves the fabrication perfection of the laser.

[0064] It should be noted that, in the embodiments of this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "at least one" refers to one or more. The term "multiple" refers to two or more, unless otherwise explicitly defined. "Approximately" means within an acceptable margin of error, meaning that those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error. In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is also understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on other elements, or there may be intermediate layers. Similar reference numerals throughout indicate similar elements.

[0065] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser, characterized in that, The laser includes: a base plate, a frame, multiple light-emitting components, a cover plate, and a light-transmitting sealing layer; The frame surrounds the base plate and forms an accommodating space, and the plurality of light-emitting components are all located within the accommodating space and fixed on the base plate; The cover plate has an opening, the frame is a thin plate made of Kovar material, and the upper part of the frame is folded outward to form a first folded edge, which is fixed to the outer edge area of ​​the cover plate; the light-transmitting sealing layer is sealed and fixed to the inner edge area of ​​the cover plate and covers the opening of the cover plate. The lower part of the frame is folded inward or outward to form a second folded edge, which is fixedly connected to the base plate, which is made of metal. The multiple light-emitting components are connected to an external power supply structure through multiple conductive pins; The plurality of conductive pins are symmetrically distributed on both sides of the frame; a plurality of flanged holes are distributed on both sides of the middle part of the frame, the extension direction of each conductive pin is consistent with the depth direction of the corresponding flanged hole, the extension direction is parallel to the surface of the base plate near the frame, and each conductive pin passes through a flanged hole and is fixed to the frame; The laser also includes multiple annular sealing insulators, one of which is located between a conductive pin and the sidewall of a corresponding flanged hole, and is used as a sealing adhesive to fix the conductive pin and the corresponding flanged hole after melting.

2. The laser according to claim 1, characterized in that, The frame is annular, and the flanged hole protrudes outward from the ring of the frame, or protrudes inward from the ring of the frame.

3. The laser according to claim 1, characterized in that, The flanged hole is cylindrical and protrudes from the side wall of the frame. The depth of the flanged hole is greater than the depth of the initial opening formed on the frame.

4. The laser according to claim 3, characterized in that, The laser satisfies: The annular sealing insulator is made of glass.

5. The laser according to claim 1, characterized in that, The first folded edge is fixed to the outer edge region of the cover plate by parallel sealing weld; and / or, The second folded edge is fixedly connected to the base plate by brazing.

6. The laser according to any one of claims 1-5, characterized in that, The frame satisfies at least one of the following conditions: The frame is a sheet metal part; The frame is formed using a stamping process; The frame is integrally molded; Furthermore, the thickness of the frame ranges from 0.1 mm to 1 mm.

7. The laser according to claim 6, characterized in that, The cover plate has at least one fold between its inner edge region and its outer edge region.

8. The laser according to claim 7, characterized in that, The outer edge region of the cover plate has a bending structure between it and the at least one pleated portion to connect the outer edge region and the at least one pleated portion.

9. The laser according to claim 1, characterized in that, Each light-emitting component includes a light-emitting chip, a heat sink, and a reflective prism; the light-emitting chip is fixed to the base plate by the heat sink; In this laser, multiple light-emitting chips emit laser light of the same color, or... The laser includes multiple types of light-emitting chips, each type of chip is used to emit laser light of a different color, and different types of light-emitting chips emit laser light of different colors.

Images