heat dissipating device

Abstract

A heat dissipation device includes a main fixed base plate, a main heat pipe assembly, a lower heat dissipation fin assembly, and an upper heat dissipation module. The main heat pipe assembly is fixed to the main fixed base plate, and the lower heat dissipation fin assembly is also fixed to the main fixed base plate. The main heat pipe assembly passes through the lower heat dissipation fin assembly and protrudes from above the lower heat dissipation fin assembly. The upper heat dissipation module is detachably installed above the lower heat dissipation fin assembly and contacts the main heat pipe assembly to improve heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to a heat dissipation device. More particularly, it relates to a heat dissipation device having a detachable upper heat dissipation module. Background Technology

[0002] With the advancement of technology, electronic products have become increasingly widespread, gradually changing the lifestyles and work patterns of many people. As computer computing power continues to increase, temperature control of electronic components such as central processing units (CPUs) is becoming increasingly important.

[0003] Electronic components such as central processing units (CPUs) generate heat during operation and require proper cooling to achieve optimal performance. To maintain these components at ideal operating temperatures, liquid cooling or air cooling is commonly used.

[0004] Furthermore, as the number of CPU cores continues to increase, and memory capacity becomes larger and faster, the heat generated by the CPU also increases. Consequently, the size and performance of the required cooling systems also need to increase. Therefore, the surface area of ​​the heatsinks needed for computer devices is gradually increasing.

[0005] Generally speaking, increasing the storage capacity of a computer can effectively improve its overall performance. Therefore, when a computer experiences lag or crashes, users often need to upgrade or replace the storage.

[0006] Computer memory is usually installed next to the central processing unit (CPU). Therefore, heat sinks that are too large will affect the replacement of memory, while heat sinks that are too small will affect the CPU's heat dissipation efficiency.

[0007] Therefore, improving the heat dissipation efficiency of the central processing unit (CPU) and making it easier for users to replace computer memory will help reduce the CPU's operating temperature and improve the overall computer's efficiency. Summary of the Invention

[0008] This summary is intended to provide a simplified overview of the present disclosure to enable the reader to gain a basic understanding of it. It is not a complete summary of the present disclosure and is not intended to identify key / critical elements of the embodiments of the invention or to define the scope of the invention.

[0009] One objective of this invention is to provide a heat dissipation device that can improve the heat dissipation efficiency of the heat dissipation device, thereby improving the overall heat dissipation efficiency of the computer device.

[0010] To achieve the above objectives, a heat dissipation device according to one embodiment of the present disclosure includes a main fixed base plate, a main heat pipe assembly, a lower heat dissipation fin assembly, and an upper heat dissipation module. The main heat pipe assembly is fixed to the main fixed base plate, and the lower heat dissipation fin assembly is also fixed to the main fixed base plate. The main heat pipe assembly passes through the lower heat dissipation fin assembly and protrudes from above the lower heat dissipation fin assembly. The upper heat dissipation module is detachably installed above the lower heat dissipation fin assembly and contacts the main heat pipe assembly.

[0011] In some embodiments, the upper heat dissipation module includes an upper main heat dissipation fin group and at least one first auxiliary heat dissipation fin group, disposed on the side of the upper main heat dissipation fin group.

[0012] In some embodiments, the first auxiliary heat dissipation fin group includes a first auxiliary heat dissipation fin group and a second auxiliary heat dissipation fin group, which are located on both sides of the upper main heat dissipation fin group, and the thickness of the upper main heat dissipation fin group is less than or equal to the thickness of the first auxiliary heat dissipation fin group and the thickness of the second auxiliary heat dissipation fin group.

[0013] In some embodiments, the upper heat dissipation module further includes an upper heat pipe assembly that passes through the first auxiliary heat dissipation fin assembly, the upper main heat dissipation fin assembly, and the second auxiliary heat dissipation fin assembly.

[0014] In some embodiments, the upper heat dissipation module further includes an upper fixing substrate for fixing the upper heat pipe assembly, wherein the upper fixing substrate includes a plurality of openings.

[0015] In some embodiments, the upper heat pipe assembly includes a plurality of upper heat pipes, and each upper heat pipe includes a first portion, a second portion and a third portion, wherein the second portion of the upper heat pipe is distributed at equal intervals on the upper fixed substrate and exposed through an opening.

[0016] In some embodiments, the upper heat dissipation module further includes an upper heat conduction block and a thermal pad. The upper heat conduction block directly contacts the upper heat pipe through an opening, while the thermal pad is disposed between the upper heat conduction block and the main heat pipe assembly to transfer heat from the main heat pipe assembly to the upper heat conduction block.

[0017] In some embodiments, the main heat pipe assembly includes multiple main heat pipes, each main heat pipe including a first part, a second part, and a third part. The first part is fixed to the main fixed substrate, the second part is a rising section to transfer the heat absorbed by the first part upward to the third part, and the third part is exposed to the lower heat dissipation fin assembly and contacts the upper heat dissipation module.

[0018] In some embodiments, the plurality of main heat pipes include a first main heat pipe and a second main heat pipe, wherein a first portion of the second main heat pipe is fixed to one side of the first portion of the first main heat pipe and forms a U-shape.

[0019] In some embodiments, the plurality of main heat pipes further include a third main heat pipe, wherein a first portion of the third main heat pipe is disposed within a U-shaped structure formed by a first portion of the second main heat pipe.

[0020] In some embodiments, the heat dissipation device further includes a main heat conduction block, which is fixed below the main fixing substrate and contacts the main heat pipe assembly through an opening in the main fixing substrate.

[0021] In some embodiments, the heat dissipation device further includes a plurality of fixed crossbars disposed on the lower heat dissipation fin assembly and located within the main heat pipe assembly, for fixing the upper heat dissipation module.

[0022] Therefore, the aforementioned heat dissipation device can effectively increase the heat dissipation area of ​​the heat sink fins, facilitate the installation of memory by users, and improve the heat dissipation efficiency of the central processing unit and memory, thereby improving the overall performance of the computer device. Attached Figure Description

[0023] To make the above and other objects, features, advantages and embodiments of this disclosure more apparent and understandable, the accompanying drawings are described below:

[0024] Figure 1 This is a perspective view of a heat dissipation device according to an embodiment of the present invention.

[0025] Figure 2 yes Figure 1 A three-dimensional schematic diagram of the heat dissipation device in its separated state.

[0026] Figure 3 yes Figure 1 An exploded view of the main heat dissipation module of the heat dissipation device.

[0027] Figure 4 yes Figure 1 An exploded view of the upper heat dissipation module of the heat dissipation device.

[0028] Figure 5 yes Figure 3 A three-dimensional schematic diagram of the main heat pipe assembly of the main heat dissipation module from another angle.

[0029] Explanation of reference numerals in the attached figures:

[0030] 100: Heat dissipation device

[0031] 101: First height difference

[0032] 102: Second elevation difference

[0033] 103: Fixing screws

[0034] 110: Main fixed base plate

[0035] 120: Main heat pipe assembly

[0036] 130: Lower heat dissipation fin assembly

[0037] 132: Bottom of the lower heat dissipation fin assembly

[0038] 140: Upper heat dissipation module

[0039] 142: Upper main heat dissipation fin assembly

[0040] 143: Opening

[0041] 144: First auxiliary heat dissipation fin assembly

[0042] 145: Bottom of the first auxiliary heat dissipation fin assembly

[0043] 146: Second auxiliary heat dissipation fin assembly

[0044] 147: Bottom of the second auxiliary heat dissipation fin assembly

[0045] 148: Upper heat pipe assembly

[0046] 149: Upper layer fixed substrate

[0047] 160: Fixing screw

[0048] 180: First Accommodation Space

[0049] 190: Second Accommodation Space

[0050] 312: Support base plate

[0051] 314: Side panel

[0052] 316: Groove

[0053] 317: Groove

[0054] 318: Opening

[0055] 320: Main heat conduction block

[0056] 330: First main heat pipe

[0057] 332: Part One

[0058] 334: Part Two

[0059] 336: Part Three

[0060] 340: Second main heat pipe

[0061] 342: Part One

[0062] 344: Part Two

[0063] 346: Part Three

[0064] 350: Third main heat pipe

[0065] 352: Part One

[0066] 354: Part Two

[0067] 356: Part Three

[0068] 360: Fourth main heat pipe

[0069] 362: Part One

[0070] 364: Part Two

[0071] 366: Part Three

[0072] 370: Fifth main heat pipe

[0073] 372: Part One

[0074] 374: Part Two

[0075] 376: Part Three

[0076] 380: Fixed crossbar

[0077] 382: Fixing hole

[0078] 410: First upper heat pipe

[0079] 412: Part One

[0080] 414: Part Two

[0081] 416: Part Three

[0082] 420: Second upper heat pipe

[0083] 422: Part One

[0084] 424: Part Two

[0085] 426: Part Three

[0086] 430: Third upper heat pipe

[0087] 432: Part One

[0088] 434: Part Two

[0089] 436: Part Three

[0090] 440: Fourth upper heat pipe

[0091] 442: Part One

[0092] 444: Part Two

[0093] 446: Part Three

[0094] 450: Fifth upper heat pipe

[0095] 452: Part One

[0096] 454: Part Two

[0097] 456: Part Three

[0098] 460: Upper heat conduction block

[0099] 470: Thermal pad

[0100] 482: Groove

[0101] 484: Opening

[0102] 486: Groove

[0103] 488: Perforation Detailed Implementation

[0104] The following detailed description provides examples and accompanying drawings. However, the provided examples are not intended to limit the scope of this disclosure, and the description of the structure's operation is not intended to limit the order of its execution. Any structure resulting from the recombination of elements, producing an apparatus with equivalent technical effects, falls within the scope of this disclosure. Furthermore, the accompanying drawings are for illustrative purposes only and are not drawn to their original dimensions. For ease of understanding, the same or similar elements will be designated with the same symbols in the following description.

[0105] Furthermore, the terms used throughout this specification and claims, unless otherwise specified, generally have their ordinary meaning in the context of this art, the content of this disclosure, and the specific content thereof. Certain terms used to describe this disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing this disclosure.

[0106] In the embodiments and claims, unless otherwise specified in the text, "a" and "the" may refer to one or more. The numbers used in the steps are only for illustrative purposes and are not intended to limit the order or implementation method.

[0107] Secondly, the terms “contains,” “includes,” “has,” “contains,” etc., used in this article are all open-ended terms, meaning that they include but are not limited to.

[0108] Figure 1 This is a three-dimensional schematic diagram of the publicly disclosed heat dissipation device. Figure 2This is a three-dimensional schematic diagram of the heat dissipation device in its separated state. Figure 3 This is an exploded view of the main heat dissipation module of the heat dissipation device. Figure 4 This is an exploded view of the upper heat dissipation module of the heat dissipation device, and Figure 5 This is a three-dimensional schematic diagram of the main heat pipe assembly of the main heat dissipation module from another angle.

[0109] First refer to Figure 1 as well as Figure 2 As shown in the figure, the heat dissipation device 100 includes a main fixing base plate 110, a main heat pipe assembly 120, a lower heat dissipation fin assembly 130, and an upper heat dissipation module 140. The main heat pipe assembly 120 is fixed to the main fixing base plate 110, and the lower heat dissipation fin assembly 130 is also fixed to the main fixing base plate 110. The main heat pipe assembly 120 passes through the lower heat dissipation fin assembly 130 and protrudes above the lower heat dissipation fin assembly 130. The upper heat dissipation module 140 is detachably installed above the lower heat dissipation fin assembly 130 and contacts the main heat pipe assembly 120.

[0110] In some embodiments, the upper heat dissipation module 140 includes an upper main heat dissipation fin group 142 and at least one auxiliary heat dissipation fin group, such as a first auxiliary heat dissipation fin group 144 and a second auxiliary heat dissipation fin group 146, which are disposed on two sides of the upper main heat dissipation fin group 142, and the thickness of the upper main heat dissipation fin group 142 is less than or equal to the thickness of the first auxiliary heat dissipation fin group 144 and the thickness of the second auxiliary heat dissipation fin group 146.

[0111] In some embodiments, the height of the bottom of at least one auxiliary heat dissipation fin group is higher than the height of the bottom 132 of the lower heat dissipation fin group 130 by approximately a height difference, so as to form an accommodating space below the bottom of the auxiliary heat dissipation fin group. For example, the height of the bottom 145 of the first auxiliary heat dissipation fin group 144 is higher than the height of the bottom 132 of the lower heat dissipation fin group 130 by approximately a first height difference 101, so as to form a first accommodating space 180 below the bottom 145 of the first auxiliary heat dissipation fin group. Similarly, the height of the bottom 147 of the second auxiliary heat dissipation fin group 146 is also higher than the height of the bottom 132 of the lower heat dissipation fin group 130 by approximately a second height difference 102, so as to form a second accommodating space 190 below the bottom 147 of the second auxiliary heat dissipation fin group. The height of the bottom 145 of the first auxiliary heat dissipation fin group and the height of the bottom 147 of the second auxiliary heat dissipation fin group can be the same or different, and neither of them departs from the concept and protection scope of the present invention.

[0112] The first accommodating space 180 and the second accommodating space 190 can be used to install memory located on both sides of the main mounting base 110. When it is necessary to install or remove the memory, the upper heat dissipation module 140 can be removed from above the lower heat dissipation fin assembly 130, so as not to affect the installation and removal of the memory. Users can easily replace the memory for upgrades without removing the entire heat dissipation device 100 from above the central processing unit, effectively increasing the convenience of memory upgrades.

[0113] The memory may be a Double Data Rate Synchronous Dynamic Random Access Memory (DDR SDRAM) to improve the data transfer rate, such as a DDR4 SDRAM or a DDR5 SDRAM, but the present invention is not limited thereto.

[0114] See also Figure 3 As shown in the figure, the heat dissipation device 100 also includes a main heat conduction block 320 and multiple fixing crossbars 380. The main fixing base plate 110, the main heat pipe assembly 120, the lower heat dissipation fin assembly 130, the main heat conduction block 320, and the fixing crossbars 380 constitute the main heat dissipation module 300. The main heat dissipation module 300 uses fixing screws 160 to fix the heat dissipation device 100 above a heat source, for example, fixing the main fixing base plate 110 to a circuit board, and ensuring that the main heat conduction block 320 below the main fixing base plate 110 contacts the central processing unit on the circuit board.

[0115] In some embodiments, thermal paste is applied between the main heat conduction block 320 and the central processing unit to increase heat dissipation efficiency.

[0116] In some embodiments, the main fixing substrate 110 includes a supporting base plate 312 and two side plates 314, which are respectively formed on both sides of the supporting base plate 312 to guide heat dissipation airflow. In addition, the supporting base plate 312 includes a plurality of grooves 316 formed on the upper part of the supporting base plate 312, a groove 317 formed on the lower part of the supporting base plate 312, and a plurality of openings 318 to expose the heat pipes of the main heat pipe assembly 120, thereby directly contacting the main heat conduction block 320.

[0117] The main heat conduction block 320 is fixed in the groove 317 below the main fixing base plate 110 and directly contacts the main heat pipe assembly 120 through the opening 318 of the main fixing base plate 110. The heat pipes of the main heat pipe assembly 120 are fixed in the groove 316 above the support base plate 312.

[0118] In some embodiments, the opening 318 connects the groove 316 and the groove 317 and is located between the groove 316 and the groove 317.

[0119] In some embodiments, the fixing crossbar 380 is disposed on the lower heat dissipation fin assembly 130 and located between the heat pipes of the main heat pipe assembly 120, so as to detachably fix the upper heat dissipation module 140 on the main heat dissipation module 300.

[0120] In some embodiments, the fixed crossbar 380 includes a plurality of fixing holes 382, ​​so as to fix the upper heat dissipation module 140 to the fixed crossbar 380 using fixing screws 103.

[0121] In some embodiments, the main heat pipe assembly 120 includes a plurality of main heat pipes, such as a first main heat pipe 330, a second main heat pipe 340, a third main heat pipe 350, a fourth main heat pipe 360, and a fifth main heat pipe 370. Each main heat pipe includes a first portion, a second portion, and a third portion.

[0122] Generally, the first part of the main heat pipe passes through the groove 316 and is exposed in the opening 318, used to absorb the heat generated by the central processing unit in the main fixed substrate 110 and the main heat conduction block 320. The second part is the rising section, which transfers the heat absorbed by the main heat pipe upward to the upper part of the lower heat dissipation fin assembly 130. The third part of the main heat pipe is exposed in the lower heat dissipation fin assembly 130 so that the third part of the main heat pipe can directly contact the upper heat dissipation module 140. The heat can then be removed simultaneously from the lower heat dissipation fin assembly 130 and the upper heat dissipation module 140 using devices such as fans.

[0123] In some embodiments, and simultaneously refer to Figure 3 and Figure 5 The first portion 332 of the first main heat pipe 330 passes through the middle of the main fixing substrate 110, while the first portions 342 of the second main heat pipe 340 and the first portions 352 of the third main heat pipe 350 are fixed to both sides of the first portion 332 of the first main heat pipe 330 and form a U-shape wrapped around the groove 316 of the main fixing substrate 110. In addition, the first portion 362 of the fourth main heat pipe 360 ​​is disposed in the U-shaped structure formed by the first portion 342 of the second main heat pipe 340, and the first portion 372 of the fifth main heat pipe 370 is disposed in the U-shaped structure formed by the first portion 352 of the third main heat pipe 350.

[0124] In addition, the second portion 334 of the first main heat pipe 330, the second portion 344 of the second main heat pipe 340, the second portion 354 of the third main heat pipe 350, the second portion 364 of the fourth main heat pipe 360, and the second portion 374 of the fifth main heat pipe 370 all extend upward by a predetermined distance to approach the upper surface of the lower heat dissipation fin assembly 130.

[0125] In some embodiments, the third portion 346 of the second main heat pipe 340 and the third portion 356 of the third main heat pipe 350 are located on both sides of the third portion 336 of the first main heat pipe 330, while the third portion 366 of the fourth main heat pipe 360 ​​and the third portion 376 of the fifth main heat pipe 370 are located outside the third portion 336 of the first main heat pipe 330, the third portion 346 of the second main heat pipe 340, and the third portion 356 of the third main heat pipe 350.

[0126] Through the third portion 336 of the first main heat pipe 330, the third portion 346 of the second main heat pipe 340, the third portion 356 of the third main heat pipe 350, the third portion 366 of the fourth main heat pipe 360, and the third portion 376 of the fifth main heat pipe 370, heat can be further transferred to the upper heat dissipation module 140 so that the heat can be removed from the lower heat dissipation fin assembly 130 and the upper heat dissipation module 140 by means of a fan or other device.

[0127] See also Figure 4 As shown in the figure, the upper heat dissipation module 140 includes an upper main heat dissipation fin assembly 142, a first auxiliary heat dissipation fin assembly 144, a second auxiliary heat dissipation fin assembly 146, an upper heat pipe assembly 148, an upper fixing substrate 149, and an upper heat conduction block 460. The upper heat pipe assembly 148 passes through the first auxiliary heat dissipation fin assembly 144, the upper main heat dissipation fin assembly 142, and the second auxiliary heat dissipation fin assembly 146. The upper fixing substrate 149 is used to fix the upper heat pipe assembly 148 and the upper main heat dissipation fin assembly 142, and the upper fixing substrate 149 includes multiple grooves 482, multiple openings 484, and grooves 486. The grooves 482 are formed on the upper fixing substrate 149 so that the upper heat pipe assembly 148 passes through them and is exposed in the openings 484 to directly contact the upper heat conduction block 460 below. The groove 486 is formed below the upper fixed substrate 149 to accommodate the upper heat conduction block 460.

[0128] In some embodiments, opening 484 connects recess 482 and recess 486 and is located between recess 482 and recess 486.

[0129] In some embodiments, the upper main heat dissipation fin assembly 142 utilizes an opening 143 to allow a fixing screw 103 to pass through the upper main heat dissipation fin assembly 142, and the upper fixing substrate 149 also includes a plurality of through holes 488 to allow the fixing screw 103 to pass through the upper fixing substrate 149 and fix the upper fixing substrate 149 in the fixing hole 382 of the fixing crossbar 380 on the main heat dissipation module 300, thereby fixing the upper heat dissipation module 140 onto the main heat dissipation module 300.

[0130] In some embodiments, the upper heat pipe assembly 148 includes a plurality of upper heat pipes, such as a first upper heat pipe 410, a second upper heat pipe 420, a third upper heat pipe 430, a fourth upper heat pipe 440, and a fifth upper heat pipe 450. Each upper heat pipe includes a first portion, a second portion, and a third portion. In some embodiments, the first portion, the second portion, and the third portion of the upper heat pipe are all horizontally arranged.

[0131] In some embodiments, the second portion 414 of the first upper heat pipe 410, the second portion 424 of the second upper heat pipe 420, the second portion 434 of the third upper heat pipe 430, the second portion 444 of the fourth upper heat pipe 440, and the second portion 454 of the fifth upper heat pipe 450 are distributed at equal intervals on the upper fixed substrate 149 and exposed through the opening 484 to directly contact the upper heat conduction block 460.

[0132] In some embodiments, the first portion 412 of the first upper heat pipe 410, the first portion 422 of the second upper heat pipe 420, and the first portion 432 of the third upper heat pipe 430 are arranged side by side, while the third portions 416 of the first upper heat pipe 410, the third portion 426 of the second upper heat pipe 420, and the third portion 436 of the third upper heat pipe 430 are arranged side by side. Furthermore, the first portion 442, the second portion 444, and the third portion 446 of the fourth upper heat pipe 440 are arranged in a straight line and located outside the second upper heat pipe 420, and the first portion 452, the second portion 454, and the third portion 456 of the fifth upper heat pipe 450 are also arranged in a straight line and located outside the third upper heat pipe 430.

[0133] In some embodiments, the upper heat dissipation module 140 further includes a thermal pad 470 disposed between the upper heat conduction block 460 and the main heat pipe assembly 120 to transfer heat from the main heat pipe assembly 120 to the upper heat conduction block 460.

[0134] In some embodiments, the thermal pad 470 is a thermal pad formed of thermal paste, but the present invention is not limited thereto.

[0135] In summary, the heat dissipation device disclosed in this invention can effectively increase the heat dissipation area of ​​the heat dissipation fins, facilitate the installation of memory by users, improve the heat dissipation efficiency of the central processing unit and memory, and thus improve the overall performance of the computer device.

[0136] Although this disclosure has been described above with reference to embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make various changes and modifications without departing from the concept and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the claims.

Claims

1. A heat dissipation device, characterized in that, Include: One main fixing substrate; A main heat pipe assembly is fixed to the main fixed base plate; A lower heat dissipation fin assembly is fixed to the main fixed base plate, and the main heat pipe assembly passes through the lower heat dissipation fin assembly and is exposed above the lower heat dissipation fin assembly. An upper-layer heat dissipation module is detachably mounted above the lower-layer heat dissipation fin assembly and contacts the main heat pipe assembly. The upper-layer heat dissipation module includes an upper-layer heat pipe assembly and an upper-layer fixing substrate, wherein the upper-layer fixing substrate is used to fix the upper-layer heat pipe assembly. Multiple fixing crossbars are disposed on the lower heat dissipation fin assembly and located between the main heat pipe assembly to fix the upper heat dissipation module. Each fixing crossbar includes fixing holes, and the upper fixing substrate includes multiple through holes to allow fixing screws to pass through the upper fixing substrate and fix the upper fixing substrate to the fixing holes of the fixing crossbars.

2. The heat dissipation device as described in claim 1, wherein, The upper heat dissipation module further includes: One upper main heatsink fin assembly; and At least one first auxiliary heat dissipation fin group is disposed on the side of the upper main heat dissipation fin group.

3. The heat dissipation device as described in claim 2, wherein, The first auxiliary heat dissipation fin assembly includes: A first auxiliary heat dissipation fin group and a second auxiliary heat dissipation fin group are respectively located on both sides of the upper main heat dissipation fin group, and the thickness of the upper main heat dissipation fin group is less than or equal to the thickness of the first auxiliary heat dissipation fin group and the thickness of the second auxiliary heat dissipation fin group.

4. The heat dissipation device as described in claim 3, wherein, The upper heat pipe assembly is installed within the first auxiliary heat dissipation fin assembly, the upper main heat dissipation fin assembly, and the second auxiliary heat dissipation fin assembly.

5. The heat dissipation device as described in claim 4, wherein, The upper fixed substrate includes multiple openings.

6. The heat dissipation device as described in claim 5, wherein, The upper heat pipe assembly includes: Multiple upper heat pipes, and each of the multiple upper heat pipes includes a first part, a second part and a third part, wherein the second parts of the multiple upper heat pipes are equally spaced on the upper fixed substrate and exposed through the multiple openings.

7. The heat dissipation device as described in claim 6, wherein, The upper heat dissipation module further includes: An upper heat conduction block, through the plurality of openings, directly contacts the plurality of upper heat pipes; and A thermal pad is disposed between the upper heat conduction block and the main heat pipe assembly to transfer heat from the main heat pipe assembly to the upper heat conduction block.

8. The heat dissipation device as claimed in claim 1, wherein, The main heat pipe assembly includes: Multiple main heat pipes are provided, and each of the main heat pipes includes a first part, a second part and a third part. The first part is fixed to the main fixed substrate, the second part is a rising section to transfer the heat absorbed by the first part upward to the third part, and the third part is exposed to the lower heat dissipation fin assembly and contacts the upper heat dissipation module.

9. The heat dissipation device as claimed in claim 8, wherein, The plurality of main heat pipes include: One main heat pipe; and A second main heat pipe, wherein the first portion of the second main heat pipe is fixed to one side of the first portion of the first main heat pipe and forms a U-shape.

10. The heat dissipation device as claimed in claim 9, wherein, The plurality of main heat pipes also include: A third main heat pipe, wherein the first portion of the third main heat pipe is disposed within the U-shaped structure formed by the first portion of the second main heat pipe.

11. The heat dissipation device as claimed in claim 1, further comprising: A main heat conduction block is fixed below the main fixing base plate and contacts the main heat pipe assembly through an opening in the main fixing base plate.

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