A method for manufacturing a liquid cooling heat sink and a liquid cooling heat sink

Abstract

The present invention provides a method for manufacturing a liquid-cooled heat sink and a liquid-cooled heat sink, the method for manufacturing the liquid-cooled heat sink comprising: step S1, obtaining a substrate, the substrate comprising a first surface and a second surface opposite to the first surface, the first surface forming an installation area, the installation area being used to install a chip, and the second surface being provided with uniformly distributed pin fins; step S2, dividing the installation area into a plurality of micro units, and dividing the chip into a plurality of heating units, the micro units corresponding to the heating units, the micro units comprising a first unit and a second unit, the heating unit corresponding to the first unit generating a higher heat than the heating unit corresponding to the second unit, deleting and / or merging the pin fins corresponding to the second unit. The method for manufacturing the liquid-cooled heat sink of the present invention can concentrate on dissipating heat in the high-heating area of ​​the chip, has high heat dissipation efficiency, and is low in cost.

Description

Technical Field

[0001] The present invention relates to the field of chips, and in particular to a method for manufacturing a liquid cooling heat sink and the liquid cooling heat sink. Background Art

[0002] According to needs, some chips are now larger and generate higher heat. If the heat dissipation is not good, the chip will cause abnormal operation.

[0003] Existing heat sinks dissipate heat for chips, which may result in uneven heat dissipation. In order to meet the heat dissipation requirements of the chips, the heat dissipation capacity will be increased, such as lowering the temperature of the coolant, increasing the flow rate of the coolant, using materials with higher thermal conductivity, etc., which will lead to increased costs. Summary of the invention

[0004] In view of the above problems in the prior art, an object of the present invention is to provide a method for manufacturing a liquid cooling heat sink and a liquid cooling heat sink, which can concentrate the heat dissipation on the high heat generation area of ​​the chip, have high heat dissipation efficiency and low cost.

[0005] In order to solve the above problems, the present invention provides a method for manufacturing a liquid cooling heat sink, and the method comprises:

[0006] Step S1, obtaining a substrate, the substrate comprising a first surface and a second surface opposite to the first surface, the first surface being formed with a mounting area, the mounting area being used to mount a chip, and the second surface being provided with uniformly distributed pin fins;

[0007] Step S2, dividing the installation area into multiple micro units, and dividing the chip into multiple heat-generating units, the micro units correspond to the heat-generating units, the micro units include a first unit and a second unit, the heat generated by the heat-generating unit corresponding to the first unit is higher than the heat generated by the heat-generating unit corresponding to the second unit, and deleting and / or merging the pin fins corresponding to the second unit.

[0008] Furthermore, the manufacturing method further comprises:

[0009] Step S3, deleting and / or merging the pin-fins corresponding to the non-installation area of ​​the first surface of the substrate.

[0010] Further, deleting the pin fins includes reducing the number and / or height of the pin fins.

[0011] Furthermore, the pin fins are integrally formed with the substrate, and the number of the pin fins is reduced by cutting, pulling, twisting or breaking the pin fins, and / or the height of the pin fins is reduced by cutting or breaking the tops of the pin fins.

[0012] Furthermore, the pin fins are detachably connected to the second surface of the substrate, and the number of the pin fins can be reduced by detaching the pin fins.

[0013] The manner in which the pin fin is detachably connected to the second surface of the substrate includes any one of the following:

[0014] 1) The pin fin is threadedly connected to the base plate;

[0015] 2) The pin fins and the substrate are interference fit;

[0016] 3) The pin fins are engaged with the substrate.

[0017] Furthermore, each of the pin fins comprises at least two detachable fin sections, and the height of the pin fin is reduced by detaching the fin sections.

[0018] Wherein, different wing segments are threadedly connected or snap-connected to form the pin wing.

[0019] Furthermore, the pin fins include a first pin fin group and a second pin fin group, the first pin fin group is integrally formed with the base plate, and the second pin fin group is detachably connected to the base plate.

[0020] The number of the pin fins is reduced by disassembling the pin fins in the second pin fin group.

[0021] Furthermore, the adjacent pin fins are squeezed to merge the pin fins.

[0022] Furthermore, between step S1 and step S2, the following steps are further included:

[0023] Step S4, obtaining a shell, wherein the top and the periphery of the shell are closed and the bottom is open, and the shell can surround at least two adjacent pin wings,

[0024] The shell surrounds at least two of the pin fins, thereby merging the pin fins.

[0025] Another aspect of the present invention provides a liquid-cooled heat sink, which is manufactured by the above-mentioned method for manufacturing a liquid-cooled heat sink.

[0026] Due to the above technical solution, the present invention has the following beneficial effects:

[0027] According to the manufacturing method of the liquid-cooled heat sink of the present invention, a mounting area for chip mounting is formed on the first surface of the substrate, and pin fins evenly distributed are arranged on the second surface of the substrate, dividing the mounting area into a plurality of micro units corresponding to the chip heating units, the micro units including a first unit corresponding to the heating units with high heat generation and a second unit corresponding to the heating units with low heat generation, deleting and / or merging the pin fins corresponding to the second unit, thereby reducing the total surface area of ​​the pin fins corresponding to the second unit, reducing the heat dissipation of the pin fins corresponding to the second unit, and improving the heat dissipation of the pin fins corresponding to the first unit, concentrating the cooling of the coolant on the first unit of the mounting area of ​​the substrate, making full use of the cooling capacity of the coolant, ensuring the normal operation of the chip, avoiding uniform heat dissipation of the first unit and the second unit, and in order to meet the heat dissipation of the first unit and improve the overall heat dissipation capacity of the liquid-cooled heat sink, which leads to increased costs, and the pin fins are evenly distributed on the chip in advance to meet the needs of batch operations, and the heat dissipation requirements of different chips can be met by deleting and / or merging the pin fins of the second unit, thereby reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the embodiments or prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 is a flow chart of a method for manufacturing a liquid cooling heat sink according to an embodiment of the present invention;

[0030] Figure 2 is a structural diagram of a substrate according to an embodiment of the present invention;

[0031] Figure 3 is a schematic diagram of a micro unit according to an embodiment of the present invention;

[0032] Figure 4 is a schematic diagram of reducing the number of pin fins according to an embodiment of the present invention;

[0033] Figure 5 is a schematic diagram of a detachable pin fin and a base plate according to an embodiment of the present invention;

[0034] Figure 6 is a schematic diagram of reducing the height of the pin fin according to one embodiment of the present invention;

[0035] Figure 7 is a schematic diagram of detachable connection of wing segments according to one embodiment of the present invention;

[0036] Figure 8is a schematic diagram of merging pin fins into parallel fins according to an embodiment of the present invention;

[0037] Fig. 9 is a schematic diagram of a shell surrounding a pin fin according to an embodiment of the present invention;

[0038] Fig.10 is a schematic diagram of deleting the pin-fin height in the non-installation area of ​​a substrate according to an embodiment of the present invention;

[0039] Fig.11 Schematic diagram of a shell surrounding pin fins in a non-installation area of ​​a substrate according to an embodiment of the present invention.

[0040] 100, substrate; 200, pin fin; 210, fin segment; 220, parallel fin; 300, mounting area; 310, micro unit; 400, housing. DETAILED DESCRIPTION

[0041] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0043] Next, a method for manufacturing a liquid cooling heat sink according to an embodiment of the present invention is described.

[0044] like Figures 1 to 11 As shown, the manufacturing method of the liquid cooling heat sink of the embodiment of the present invention includes:

[0045] Step S1, obtaining a substrate 100, the substrate 100 includes a first surface and a second surface opposite to the first surface, the first surface is formed with a mounting area 300, the mounting area 300 is used to mount a chip, and the second surface is provided with uniformly distributed pin fins 200.

[0046] The coolant flows through the substrate 100 and contacts the pin fins 200 on the substrate 100 , and cools the mounting area 300 of the substrate 100 through the pin fins 200 . The mounting area 300 cools the chip, thereby preventing the chip temperature from being too high and affecting the chip operation.

[0047] Step S2, divide the installation area 300 into multiple micro units 310, and divide the chip into multiple heating units, the micro unit 310 corresponds to the heating unit, the micro unit 310 includes a first unit and a second unit, the heating unit corresponding to the first unit has a higher heating value than the heating unit corresponding to the second unit, delete and / or merge the pin fins 200 corresponding to the second unit.

[0048] like Figure 3 As shown, the mounting area 300 is divided into a plurality of micro units 310, and the micro unit 310 includes a first unit corresponding to a heating unit with a high heat generation and a second unit corresponding to a heating unit with a low heat generation. The heating units of a chip can be understood as the various heating areas of the chip, that is, they are related to the distribution of the core heating components of the chip. The pin fins 200 corresponding to the second unit are deleted and / or merged, thereby reducing the total surface area of ​​the pin fins 200 corresponding to the second unit, reducing the heat dissipation of the pin fins 200 corresponding to the second unit, and improving the heat dissipation of the pin fins 200 corresponding to the first unit.

[0049] Moreover, compared to the pre-existing liquid-cooled heat sink in which the second unit is not provided with pin fins 200, the present application has a higher universality. Usually, there are differences in chips of different customers or different models of the same customer, and different molds need to be opened according to the differences, thereby forming different distributions of pin fins 200 to meet the needs of different chips, which is relatively cost-effective. The liquid-cooled heat sink of the present application evenly distributes the pin fins 200 on the chip in advance to meet the needs of batch operations. By deleting and / or merging the pin fins 200 of the second unit, the heat dissipation needs of different chips can be met, which can reduce costs.

[0050] In the above method for manufacturing a chip heat sink, a mounting area 300 for chip mounting is formed on the first surface of the substrate 100, and pin fins 200 are evenly distributed on the second surface of the substrate 100. The mounting area 300 is divided into a plurality of micro units 310 corresponding to the chip heating units. The micro unit 310 includes a first unit corresponding to a heating unit with a high heat generation and a second unit corresponding to a heating unit with a low heat generation. The pin fins 200 corresponding to the second unit are deleted and / or merged, thereby reducing the total surface area of ​​the pin fins 200 corresponding to the second unit, and reducing the heat dissipation of the pin fins 200 corresponding to the second unit. Heat is improved, and the heat dissipation of the pin fins 200 corresponding to the first unit is improved. The cooling of the coolant is concentrated on the first unit of the installation area 300 of the substrate 100, and the cooling capacity of the coolant is fully utilized to ensure the normal operation of the chip. It is avoided that the first unit and the second unit are uniformly cooled. In order to meet the heat dissipation of the first unit, the overall heat dissipation capacity of the liquid-cooled heat sink is improved, which leads to an increase in cost. Moreover, the pin fins 200 are evenly distributed on the chip in advance to meet the needs of batch operations. By deleting and / or merging the pin fins 200 of the second unit, the heat dissipation needs of different chips can be met, which can reduce costs.

[0051] In some embodiments of the present invention, the method for manufacturing a liquid-cooled heat sink further includes step S3 of deleting and / or merging the pin fins 200 corresponding to the non-installation area of ​​the first surface of the substrate 100 .

[0052] Usually, the sizes of chips vary, and the installation positions of different chips on the substrate 100 may also vary (the positions of the installation area 300 on the substrate 100 are different). Directly setting the pin fins 200 on the substrate 100 according to the size and position of the chip will require the production of multiple liquid cooling heat sinks, which is costly and has low operating efficiency.

[0053] The present application evenly distributes the pin fins 200 on the substrate 100, and can pre-evenly distribute the pin fins 200 on the maximum installation area 300 of the substrate 100 (the installation area 300 corresponding to the largest possible chip) to meet the needs of batch operations. According to the position of the chip and the size of the chip, the pin fins 200 corresponding to the non-installation area of ​​the first surface of the substrate 100 are deleted and / or merged, the heat dissipation area of ​​the pin fins 200 corresponding to the non-installation area is reduced, the cooling of the pin fins 200 corresponding to the non-installation area by the coolant is reduced, and the cooling of the pin fins 200 corresponding to the installation area 300 is increased, thereby meeting the heat dissipation requirements of chips of different sizes and / or chips with different installation positions, allowing the coolant to concentrate on dissipating the heat in the installation area 300, reducing the heat dissipation of the coolant to the non-installation area, and improving the heat dissipation efficiency of the coolant to the chip, avoiding blindly increasing the overall heat dissipation of the liquid-cooled heat sink, which results in higher costs.

[0054] In some embodiments of the present invention, reducing the pin fins 200 includes reducing the number and / or height of the pin fins 200 .

[0055] By reducing the number and / or height of the pin fins 200 , the total surface area of ​​the pin fins 200 corresponding to the second unit can be effectively reduced, and the total surface area of ​​the pin fins 200 corresponding to the non-installation area can be effectively reduced.

[0056] like Figure 4 As shown, the pin fins 200 corresponding to the second unit and the non-installation area are deleted.

[0057] like Figure 6 As shown, the height of the pin fin 200 corresponding to the second unit is deleted.

[0058] like Fig.10 As shown, the height of the pin fin 200 corresponding to the deleted non-installation area.

[0059] The methods of reducing the number and / or height of the pin fins 200 may include the following four methods:

[0060] Method 1: The pin fins 200 are integrally formed with the substrate 100 , and the number of the pin fins 200 is reduced by cutting, pulling, twisting or breaking the pin fins 200 , and / or the height of the pin fins 200 is reduced by cutting or breaking the tops of the pin fins 200 .

[0061] The number of pin wings 200 can be reduced more conveniently by cutting off the pin wings 200 with a cutting machine, pulling off the pin wings 200 with a clip, clamping the pin wings 200 with a clip and twisting and twisting off the pin wings 200, or clamping the pin wings 200 and bending them to break the pin wings 200.

[0062] The top of the pin fin 200 can be cut off more conveniently by cutting off the top of the pin fin 200 with a cutting machine or by clamping the top of the pin fin 200 and bending it to break the top of the pin fin 200 .

[0063] Method 2: The pin fins 200 are detachably connected to the second surface of the substrate 100 , and the number of the pin fins 200 is reduced by detaching the pin fins 200 .

[0064] Among them, the manner in which the pin fin 200 is detachably connected to the second surface of the substrate 100 includes any one of the following: 1) the pin fin 200 is threadedly connected to the substrate 100; 2) the pin fin 200 and the substrate 100 are interference fit; 3) the pin fin 200 and the substrate 100 are snap-fitted.

[0065] like Figure 5 As shown, the pin fin 200 is inserted into the first clamping plate to achieve the connection between the pin fin 200 and the substrate 100, and the pin fin 200 can be pulled out to achieve the separation (disassembly) of the pin fin 200 and the substrate 100.

[0066] This method can be used to more conveniently reduce the number of pin fins 200, and is conducive to reciprocating adjustment testing (if too many pin fins 200 are removed, the pin fins 200 can be installed again), which is convenient for fine adjustment and reduces scrapping.

[0067] Optionally, the pin fin 200 is threadedly connected to the base plate 100, and the pin fin 200 is disassembled by rotating the pin fin 200, the pin fin 200 is interference-fitted with the base plate 100, and the pin fin 200 is disassembled by pulling out the pin fin 200, and the pin fin 200 is engaged with the base plate 100, and the pin fin 200 is disassembled by pulling out the pin fin 200. It should be noted that the above are only optional examples, and any detachable connection between the pin fin 200 and the base plate 100 should be understood to be within the scope of the present invention.

[0068] Method three: each pin fin 200 includes at least two detachable fin sections 210 , and the height of the pin fin 200 is reduced by disassembling the fin sections 210 .

[0069] Among them, different wing segments 210 are threadedly connected or snap-fitted to form a pin wing 200 .

[0070] like Figure 7 As shown, the needle fin 200 is divided into three detachable fin sections 210, by which the height of the needle fin 200 can be reduced more conveniently.

[0071] Optionally, different wing segments 210 are threadedly connected, and rotating some wing segments 210 can reduce the height of the pin wing 200, and different wing segments 210 are snap-connected, and pulling out some wing segments 210 can reduce the height of the pin wing 200. It should be noted that the above are only optional examples, and any detachable connection of different wing segments 210 should be understood to be within the scope of the present invention.

[0072] Method four, the pin fins 200 include a first pin fin 200 group and a second pin fin 200 group, the first pin fin 200 group is integrally formed with the base plate 100, and the second pin fin 200 group is detachably connected to the base plate 100, and the number of pin fins 200 is reduced by disassembling the pin fins 200 in the second pin fin 200 group.

[0073] For multiple chips with small changes in size and position, the substrate 100 and the first pin-fin 200 group can be integrally formed at the overlapping installation position of the multiple chips, and the substrate 100 and the first pin-fin 200 group can be detachably connected at the non-overlapping installation position of the multiple chips. Then, according to the current installation position of the chip on the substrate 100 and the size of the chip, the pin fins 200 in the second pin fin 200 group can be removed, thereby reducing the workload of assembling the pin fins 200 of the liquid-cooled heat sink and the substrate 100, and facilitating the disassembly of the pin fins 200.

[0074] In some embodiments of the present invention, adjacent pin fins 200 are squeezed to merge the pin fins 200 .

[0075] like Figure 8 As shown, part of the pin fins 200 corresponding to the second unit are extruded, so that the pin fins 200 can be easily merged to form a combined fin 220, the surface area of ​​which is smaller than the surface area of ​​the original unmerged pin fins 200, thereby reducing the total surface area of ​​the pin fins 200 corresponding to the second unit.

[0076] In some embodiments of the present invention, step S4 is further included between step S1 and step S2, obtaining a shell 400, the top and surrounding of the shell 400 are closed, and the bottom end thereof is open, and the shell 400 can surround at least two adjacent pin wings 200. The shell 400 surrounds at least two pin wings 200, thereby merging the pin wings 200.

[0077] like Fig. 9 , the pin fin 200 corresponding to the second unit is surrounded by the shell 400. Fig.11 As shown, the pin fin 200 corresponding to the non-installation area is surrounded by a shell 400.

[0078] Multiple shells 400 (which can be understood as hollow cuboids with an open bottom) are used to surround multiple pin fins 200, that is, the shells 400 wrap multiple pin fins 200, and the surface area of ​​the shells 400 is smaller than the total surface area of ​​the pin fins 200 before wrapping, thereby reducing the total surface area of ​​the pin fins 200.

[0079] Moreover, the shell 400 is detachable, which can facilitate reciprocating adjustment of the total surface area of ​​the pin fin 200 (increasing the shell 400 or reducing the shell 400), thereby increasing the adjustment accuracy.

[0080] Next, the liquid cooling heat sink is described.

[0081] The liquid cooling heat sink is manufactured by the manufacturing method of the liquid cooling heat sink, so that the high heat generation area of ​​the chip can be concentratedly cooled to reduce the cost.

[0082] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a liquid cooling heat sink, characterized in that: The production method comprises: Step S1, obtaining a substrate, the substrate comprising a first surface and a second surface opposite to the first surface, the first surface being formed with a mounting area for mounting a chip, and the second surface being provided with uniformly distributed pin fins; Step S2, dividing the mounting area into a plurality of micro units, and dividing the chip into a plurality of heating units, wherein the micro units correspond to the heating units, and the micro units include a first unit and a second unit, wherein the heating value of the heating unit corresponding to the first unit is higher than the heating value of the heating unit corresponding to the second unit, and deleting and / or merging the pin fins corresponding to the second unit, Wherein, between step S1 and step S2, the following is also included: Step S4, obtaining a shell, wherein the top and the periphery of the shell are closed and the bottom is open, and the shell can surround at least two adjacent pin wings, The shell surrounds at least two of the pin fins, thereby merging the pin fins.

2. The method for manufacturing a liquid cooling heat sink according to claim 1, characterized in that: The production method further comprises: Step S3, deleting and / or merging the pin-fins corresponding to the non-installation area of ​​the first surface of the substrate.

3. The method for manufacturing a liquid cooling heat sink according to claim 2, characterized in that: Deleting the pin fins includes reducing the number and / or height of the pin fins.

4. The method for manufacturing a liquid cooling heat sink according to claim 3, characterized in that: The pin fins are integrally formed with the base plate, and the number of the pin fins is reduced by cutting, pulling, twisting or breaking the pin fins, and / or the height of the pin fins is reduced by cutting or breaking the tops of the pin fins.

5. The method for manufacturing a liquid cooling heat sink according to claim 4, characterized in that: The pin fins are detachably connected to the second surface of the substrate, and the number of the pin fins can be reduced by detaching the pin fins. The manner in which the pin fin is detachably connected to the second surface of the substrate includes any one of the following: 1) The pin fin is threadedly connected to the substrate; 2) The pin fins and the substrate are interference fit; 3) The pin fins are engaged with the substrate.

6. The method for manufacturing a liquid cooling heat sink according to claim 3, characterized in that: Each of the pin fins comprises at least two detachable fin sections, and the height of the pin fin can be reduced by detaching the fin sections. Wherein, different wing segments are threadedly connected or snap-connected to form the pin wing.

7. The method for manufacturing a liquid cooling heat sink according to claim 5, characterized in that: The pin fins include a first pin fin group and a second pin fin group, the first pin fin group is integrally formed with the base plate, and the second pin fin group is detachably connected to the base plate. The number of the pin fins is reduced by disassembling the pin fins in the second pin fin group.

8. The method for manufacturing a liquid cooling heat sink according to claim 2, characterized in that: Adjacent pin fins are squeezed to merge the pin fins.

9. A liquid cooling heat sink, characterized in that: The liquid-cooled heat sink is manufactured by the manufacturing method of a liquid-cooled heat sink according to any one of claims 1 to 8.

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