Method for manufacturing display panel, display panel and display device

Abstract

The present application discloses a method for preparing a display panel, a display panel and a display device, and relates to the field of display technology. The display panel includes a substrate, a light-emitting device, a blocking member, an organic packaging layer, and a first inorganic packaging layer. The light-emitting device is arranged on the substrate to form a display area, and the organic packaging layer is arranged above the light-emitting device and covers the display area; the blocking member is arranged around a non-display area of ​​the substrate, and the first inorganic packaging layer is arranged above the organic packaging layer and the blocking member; and it also includes a first photosensitive adhesive packaging layer, which is arranged between the organic packaging layer and the first inorganic packaging layer and corresponds to the non-display area. The present application improves the packaging sealing performance through the above design.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a display panel, a display panel, and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) refers to an organic semiconductor device that emits light through carrier injection and recombination when organic semiconductor materials and luminescent materials are driven by an electric field. OLED has the characteristic of self-luminescence. The basic structure of OLED is to make a layer of organic luminescent material tens of nanometers thick on indium tin oxide (ITO) glass as a luminescent layer, and there is a metal electrode with a low work function above the luminescent layer.

[0003] Because the organic materials of OLED are very sensitive to substances such as water vapor and oxygen, the traditional method is to effectively encapsulate OLED devices by interlayering organic and inorganic encapsulation layers to prevent the devices from contacting with water and oxygen, thereby reducing the aging rate of the devices and extending the service life of the devices.

[0004] During long-term use of traditional packaging methods, the inorganic packaging layer is prone to warping and gaps at the edge of the non-display area, which often leads to a decrease in the sealing performance between the interlayers. The organic packaging layer itself is a hydrophilic material, and water and oxygen can easily invade through the gaps. Summary of the invention

[0005] The purpose of the present application is to provide a method for preparing a display panel, a display panel and a display device with improved packaging sealing performance.

[0006] The present application discloses a display panel, including a substrate, a light-emitting device, a blocking member, an organic encapsulation layer, a first inorganic encapsulation layer and a first photosensitive adhesive encapsulation layer, wherein the light-emitting device is arranged on the substrate to form a display area, and the organic encapsulation layer is arranged above the light-emitting device and covers the display area; the blocking member is arranged around a non-display area of ​​the substrate, and the first inorganic encapsulation layer is arranged above the organic encapsulation layer and the blocking member, wherein the first photosensitive adhesive encapsulation layer is arranged between the organic encapsulation layer and the first inorganic encapsulation layer, and is arranged corresponding to the non-display area.

[0007] Optionally, an orthographic projection of the first photosensitive adhesive encapsulation layer on the substrate covers the blocking member, and the first photosensitive adhesive encapsulation layer extends to an edge of the non-display area along a side away from the display area.

[0008] Optionally, the display panel also includes a second inorganic encapsulation layer and a second photosensitive adhesive encapsulation layer, the second inorganic encapsulation layer is arranged above the second inorganic encapsulation layer, the second photosensitive adhesive encapsulation layer is arranged between the first inorganic encapsulation layer and the second inorganic encapsulation layer, and is arranged corresponding to the non-display area.

[0009] Optionally, the thickness of the first photosensitive adhesive encapsulation layer and the second photosensitive adhesive encapsulation layer are both 2um to 5um.

[0010] Optionally, the blocking member includes a first blocking member and a second blocking member, the first blocking member and the second blocking member are spaced apart and a recess is formed between adjacent members, the first photosensitive adhesive encapsulation layer includes a first encapsulation portion, a second encapsulation portion, a third encapsulation portion and a fourth encapsulation portion which are sequentially connected, the first encapsulation portion is arranged above the first blocking member, the second encapsulation portion is arranged in the recess, the third encapsulation portion is arranged above the second blocking member, and the fourth encapsulation portion is arranged on a side of the non-display area away from the display area to form an edge encapsulation portion; wherein the thickness of the second encapsulation portion and the fourth encapsulation portion is greater than the thickness of the first encapsulation portion and the third encapsulation portion.

[0011] Optionally, the thickness of the first photosensitive adhesive encapsulation layer is less than the thickness of the second photosensitive adhesive encapsulation layer.

[0012] The present application also discloses a method for preparing a display panel, which is used to prepare the display panel as described above, comprising the steps of:

[0013] forming a light emitting device on the substrate corresponding to the display area;

[0014] forming a blocking member at a position of the edge of the substrate corresponding to the non-display area;

[0015] inkjet printing an organic encapsulation material above the light emitting device and within the blocking member to form an organic encapsulation layer;

[0016] Forming a first photosensitive adhesive encapsulation layer at a position corresponding to the non-display area above the organic encapsulation layer and the blocking member;

[0017] forming a first inorganic encapsulation layer on the first photosensitive adhesive encapsulation layer;

[0018] Forming a second photosensitive adhesive encapsulation layer above the first inorganic encapsulation layer at a position corresponding to the non-display area;

[0019] A second inorganic encapsulation layer is formed on the second photosensitive adhesive encapsulation layer to obtain a display panel with encapsulation completed.

[0020] Optionally, the step of inkjet printing an organic encapsulation material above the light-emitting device and inside the blocking member to form an organic encapsulation layer comprises the following steps:

[0021] forming a third inorganic encapsulation layer above the light emitting device and the blocking member;

[0022] An organic encapsulation material is inkjet printed in the blocking member above the third inorganic encapsulation layer to form an organic encapsulation layer.

[0023] Optionally, the step of forming a first photosensitive adhesive encapsulation layer at a position corresponding to the non-display area above the organic encapsulation layer and the blocking member comprises the following steps:

[0024] Applying a photosensitive adhesive material on the organic encapsulation layer and the blocking member at positions corresponding to the non-display area;

[0025] Irradiating the photosensitive adhesive material with ultraviolet light to cure it to form a first photosensitive adhesive encapsulation layer;

[0026] The step of forming a second photosensitive adhesive encapsulation layer above the first inorganic encapsulation layer at a position corresponding to the non-display area comprises the steps of:

[0027] Coating a photosensitive adhesive material on the first inorganic encapsulation layer at a position corresponding to the non-display area;

[0028] The photosensitive adhesive material is irradiated with ultraviolet light to cure and form a second photosensitive adhesive encapsulation layer.

[0029] The present application also discloses a display device, comprising the display panel as described above.

[0030] Compared with the prior art, in which only an organic encapsulation layer and an inorganic encapsulation layer are used to encapsulate OLED devices in a sandwich manner, and the inorganic encapsulation layer is prone to warping at the edge of the non-display area, affecting the encapsulation sealing performance, the display panel of the present application also includes a first photosensitive adhesive encapsulation layer, and the first photosensitive adhesive encapsulation layer is arranged between the organic encapsulation layer and the first inorganic encapsulation layer, and is arranged corresponding to the non-display area. In this way, the first photosensitive adhesive encapsulation layer can increase the adhesion between the first inorganic encapsulation layer and the organic encapsulation layer, prevent the first inorganic encapsulation layer from warping, and fill the gap between the organic encapsulation layer and the first inorganic encapsulation layer, so as to better prevent external water and oxygen from entering through the gap and being absorbed by the hydrophilic organic encapsulation layer to affect the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0032] Figure 1 is a schematic diagram of the block structure of a display device provided in an embodiment of the present application;

[0033] Figure 2 is a schematic diagram of a cross-sectional structure of a display panel provided in an embodiment of the present application;

[0034] Figure 3 yes Figure 2 A schematic diagram of the local enlarged structure of the middle A area;

[0035] Figure 4 is a schematic flow chart of the steps of a method for preparing a display panel provided in an embodiment of the present application;

[0036] Figure 5 yes Figure 4 A schematic flow chart of further steps of step S4;

[0037] Figure 6 yes Figure 4 A schematic flow chart of further steps of step S6;

[0038] Figure 7 yes Figure 4 Schematic diagram of the further steps of step S3 in FIG.

[0039] Among them, 10, display device; 100, display panel; 110, substrate; 120, light-emitting device; 130, blocking member; 131, first blocking member; 132, second blocking member; 140, organic encapsulation layer; 150, first inorganic encapsulation layer; 160, first photosensitive adhesive encapsulation layer; 161, first encapsulation part; 162, second encapsulation part; 163, third encapsulation part; 164, fourth encapsulation part; 170, second photosensitive adhesive encapsulation layer; 180, recessed part; 190, second inorganic encapsulation layer; 200, third inorganic encapsulation layer; 300, third photosensitive adhesive encapsulation layer; 400, fourth inorganic encapsulation layer. DETAILED DESCRIPTION

[0040] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0041] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" means two or more. In addition, the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. indicating orientation or positional relationships are described based on the orientation or relative positional relationships shown in the accompanying drawings, and are only for the convenience of describing the simplified description of the present application, rather than indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0042] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0043] First embodiment:

[0044] Figure 1 is a block diagram of a display device provided in the first embodiment of the present application. Figure 2 is a schematic diagram of a cross-sectional structure of a display panel provided in the first embodiment of the present application, such as Figure 1-Figure 2 As shown, the present application discloses a display device 10, including a display panel 100, wherein the display panel 100 includes a substrate 110, a light-emitting device 120, a blocking member 130, an organic encapsulation layer 140, a first inorganic encapsulation layer 150 and a first photosensitive adhesive encapsulation layer, wherein the light-emitting device 120 is arranged on the substrate 110 to form a display area, and the organic encapsulation layer 140 is arranged above the light-emitting device 120 and covers the display area; the blocking member 130 is arranged around a non-display area corresponding to the substrate 110, and the first inorganic encapsulation layer 150 is arranged above the organic encapsulation layer and the blocking member 130, wherein the first photosensitive adhesive encapsulation layer is arranged between the organic encapsulation layer 140 and the first inorganic encapsulation layer 150, and is arranged corresponding to the non-display area.

[0045] Compared with the prior art, in which only the organic encapsulation layer 140 and the inorganic encapsulation layer are used to encapsulate the OLED device in a sandwich manner, and the inorganic encapsulation layer is prone to warping at the edge of the non-display area, affecting the encapsulation sealing performance, the display panel 100 of the present application also includes a first photosensitive adhesive encapsulation layer, which is arranged between the organic encapsulation layer 140 and the first inorganic encapsulation layer 150, and is arranged corresponding to the non-display area; in this way, the first photosensitive adhesive encapsulation layer can increase the adhesion between the first inorganic encapsulation layer 150 and the organic encapsulation layer 140, prevent the first inorganic encapsulation layer 150 from warping, and fill the gap between the organic encapsulation layer 140 and the first inorganic encapsulation layer 150, so as to better prevent external water and oxygen from entering through the gap and being absorbed by the hydrophilic organic encapsulation layer 140 to affect the light-emitting device 120.

[0046] The photosensitive adhesive material is an adhesive with high adhesive properties. Therefore, the present application uses the photosensitive adhesive as the encapsulation material. After coating on the first inorganic encapsulation layer 150 and then performing light treatment, a reliable adhesive layer can be formed. The photosensitive adhesive material has extremely high barrier properties and can effectively prevent the penetration of moisture and oxygen, protecting the material from environmental factors. This encapsulation material can maintain stable performance in various harsh environments, such as high temperature, high humidity, high pressure and other environments.

[0047] The orthographic projection of the first photosensitive adhesive encapsulation layer on the substrate 110 covers the blocking member 130, and the first photosensitive adhesive encapsulation layer extends to the edge of the non-display area along a side away from the display area. Figure 2 As shown, the side of the first photosensitive adhesive encapsulation layer close to the display area is the left side, and the side away from the display area is the right side, that is, the left side of the first photosensitive adhesive encapsulation layer is partially adhered to the organic encapsulation layer 140, and the edge of the right side is flush with the edge of the first inorganic encapsulation layer 150. The encapsulation forms a larger sealed area, so that a stronger adhesion is formed between the organic encapsulation layer 140 and the first inorganic encapsulation layer 150 around the edge of the entire non-display area, so as to avoid the problem that the edge of the first inorganic encapsulation layer 150 is easily lifted and a gap is generated. Among them, Figure 2 The direction of the arrow in the figure indicates the direction of the width of the first photosensitive adhesive encapsulation layer. The width of the first photosensitive adhesive encapsulation layer is 0.5um-3㎜, and can be coated in one coating process by a coating machine, saving time. Of course, the width of the first photosensitive adhesive encapsulation layer can also be designed according to the specific size of the display panel 100, which is not limited here.

[0048] like Figure 3 As shown, combined Figure 2In order to further enhance the encapsulation effect of the display panel 100, the display panel 100 further includes a second inorganic encapsulation layer 190 and a second photosensitive adhesive encapsulation layer 170, wherein the second inorganic encapsulation layer 190 is disposed above the second inorganic encapsulation layer 190, and the second photosensitive adhesive encapsulation layer 170 is disposed between the first inorganic encapsulation layer 150 and the second inorganic encapsulation layer 190, and is disposed corresponding to the non-display area; in this way, a multi-layer sandwich encapsulation structure is formed above the display panel 100, and there are two layers of inorganic encapsulation layers above the organic encapsulation layer 140. If only one layer of inorganic encapsulation layer is disposed above the organic encapsulation layer 140, In order to ensure the encapsulation effect, the deposition thickness of a single-layer inorganic encapsulation layer will be relatively thick. If the thickness is too large, the inorganic encapsulation layer is more likely to warp at the edge after a long period of use. Therefore, two layers of inorganic encapsulation layers are stacked, and a second photosensitive adhesive encapsulation layer 170 is added between the two layers of inorganic encapsulation layers in the non-display area. The thickness of the two layers of inorganic encapsulation layers can be relatively reduced, and the second photosensitive adhesive encapsulation layer 170 is used for bonding. While ensuring the encapsulation effect between the organic encapsulation layer 140, it can also prevent the problem of warping of the inorganic encapsulation layer at the edge, thereby further ensuring the overall encapsulation effect.

[0049] Since the first photosensitive adhesive encapsulation layer is located near the substrate 110, the first inorganic encapsulation layer 150, the second photosensitive adhesive encapsulation layer 170 and the second inorganic encapsulation layer 190 above can form a certain gravity on the first photosensitive adhesive encapsulation layer. Therefore, the thickness of the first photosensitive adhesive encapsulation layer can be set to be smaller than the thickness of the second photosensitive adhesive encapsulation layer 170, so that the adhesion of the first photosensitive adhesive encapsulation layer is strong enough. Among them, the thickness of the first photosensitive adhesive encapsulation layer is 2um to 3um, and the thickness of the second photosensitive adhesive encapsulation layer 170 is 3um to 5um. Of course, it is also possible to set the thickness of the first photosensitive adhesive encapsulation layer to be consistent with the thickness of the second photosensitive adhesive encapsulation layer 170.

[0050] like Figure 3 As shown, the blocking member 130 includes a first blocking member 131 and a second blocking member 132, the first blocking member 131 and the second blocking member are spaced apart, and a recessed portion 180 is formed between adjacent ones, the orthographic projections of the first photosensitive adhesive encapsulation layer and the second photosensitive adhesive encapsulation layer 170 on the substrate 110 both cover the first blocking member 131 and the second blocking member 132, and the first photosensitive adhesive encapsulation layer and the second photosensitive adhesive encapsulation layer 170 both extend along a side away from the display area to the edge of the non-display area; the two blocking members 130 extend the path of water and oxygen intrusion to further reduce the influence of water and oxygen on the internal light-emitting device 120, and then the two layers of photosensitive adhesive encapsulation layers cooperate to ensure the encapsulation effect at the edge of the non-display area.

[0051] The first photosensitive adhesive encapsulation layer and the second photosensitive adhesive encapsulation layer both include a first encapsulation part, a second encapsulation part 162, a third encapsulation part 163 and a fourth encapsulation part 164 connected in sequence, the first encapsulation part is arranged above the first blocking member 131, the second encapsulation part 162 is arranged in the recessed part 180, the third encapsulation part 163 is arranged above the second blocking member 132, and the fourth encapsulation part 164 is arranged on the side of the non-display area away from the display area to form an edge encapsulation part; wherein the thickness of the second encapsulation part 162 and the fourth encapsulation part 164 is greater than the thickness of the first encapsulation part and the third encapsulation part 163. In this way, the second encapsulation part 162 with relatively thick thickness through the first photosensitive adhesive encapsulation layer and the second photosensitive adhesive encapsulation layer 170 can fill the recessed part 180, so that the encapsulation surface of the display panel 100 is relatively flat, and combined with the dotted box shown in Figure 3, the edge encapsulation part is located on the side of the non-display area away from the display area and close to the outside world. The edge encapsulation part located at the edge can form a strong adhesion between the first inorganic encapsulation layer 150 and the second inorganic encapsulation layer 190 at the edge position, ensuring that the edges of the first inorganic encapsulation layer 150 and the second inorganic encapsulation layer 190 are not prone to warping.

[0052] Of course, a third photosensitive adhesive encapsulation layer 300 and a fourth inorganic encapsulation layer 400 may be sequentially arranged above the second inorganic encapsulation layer 190, so that the non-display area of ​​the display panel 100 forms a sandwich encapsulation structure of multiple photosensitive adhesive encapsulation layers and multiple inorganic encapsulation layers, further ensuring the encapsulation sealing of the display panel 100. In addition, other encapsulation structures are arranged at the edge of the non-display area away from the display area to isolate external water and oxygen in the vertical direction, and cooperate with the sandwich encapsulation structure of the non-display area to form a more complete encapsulation structure. The edge encapsulation is not the focus of the invention of this application and will not be elaborated here.

[0053] Figure 4 is a schematic flow chart of the steps of the method for preparing a display panel provided in an embodiment of the present application, such as Figure 4 As shown, this embodiment also discloses a method for preparing a display panel, comprising the steps of:

[0054] S1: forming a light-emitting device on a substrate corresponding to a display area;

[0055] S2: forming a blocking member at a position on the edge of the substrate corresponding to the non-display area;

[0056] S3: inkjet printing an organic encapsulation material above the light-emitting device and inside the blocking member to form an organic encapsulation layer;

[0057] S4: forming a first photosensitive adhesive encapsulation layer at a position corresponding to the non-display area above the organic encapsulation layer and the blocking member;

[0058] S5: forming a first inorganic encapsulation layer on the first photosensitive adhesive encapsulation layer;

[0059] S6: forming a second photosensitive adhesive encapsulation layer above the first inorganic encapsulation layer at a position corresponding to the non-display area;

[0060] S7: forming a second inorganic encapsulation layer on the second photosensitive adhesive encapsulation layer to obtain an encapsulated display panel.

[0061] Figure 5 yes Figure 4 A further step flow diagram of step S4 in FIG. Figure 5 As shown, the step of forming a first photosensitive adhesive encapsulation layer at a position corresponding to the non-display area above the organic encapsulation layer and the blocking member comprises the steps of:

[0062] S41: coating a photosensitive adhesive material at a position corresponding to the non-display area above the organic encapsulation layer and the blocking member;

[0063] S42: irradiating the photosensitive adhesive material with ultraviolet light to cure it to form a first photosensitive adhesive encapsulation layer;

[0064] Figure 6 yes Figure 4 A further step flow diagram of step S6 in FIG. Figure 6 As shown, the step of forming a second photosensitive adhesive encapsulation layer above the first inorganic encapsulation layer at a position corresponding to the non-display area includes the steps of:

[0065] S61: coating a photosensitive adhesive material on a position corresponding to a non-display area above the first inorganic encapsulation layer;

[0066] S61: irradiating the photosensitive adhesive material with ultraviolet light to cure it to form a second photosensitive adhesive encapsulation layer.

[0067] Of course, other light with a wavelength of 300nm to 500nm may be used to perform a photocuring reaction on the photosensitive adhesive packaging material, or other methods that can cure the photosensitive adhesive packaging material may also be used.

[0068] In addition, since the organic encapsulation layer 140 itself is a hydrophilic material and is easy to absorb water and oxygen, a third inorganic encapsulation layer 200 may be firstly provided between the organic encapsulation layer and the light-emitting device to isolate the contact between the organic encapsulation layer and the light-emitting device, so that the light-emitting device is sealed when the organic encapsulation material is printed by inkjet printing. Figure 7 yes Figure 4 A further step flow diagram of step S3 in FIG. Figure 7As shown, the step of inkjet printing the organic encapsulation material above the light emitting device and inside the blocking member to form an organic encapsulation layer comprises the following steps:

[0069] S8: forming a third inorganic encapsulation layer above the light emitting device and the blocking member;

[0070] S9: inkjet printing an organic encapsulation material above the third inorganic encapsulation layer and within the blocking member to form an organic encapsulation layer.

[0071] Of course, if the display area of ​​the display panel 100 also needs to be partially covered with a photosensitive adhesive encapsulation layer, the portion of the display area covered by the first photosensitive adhesive encapsulation layer 160 and the second photosensitive adhesive encapsulation layer 170 can be set to be thinner than the non-display area to ensure the display effect.

[0072] It should be noted that the limitations on the various steps involved in this solution, without affecting the implementation of the specific solution, are not deemed to limit the order of the steps. The steps written in front can be executed first, or later, or even simultaneously. As long as this solution can be implemented, it should be deemed to fall within the scope of protection of this application.

[0073] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0074] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A display panel, comprising a substrate, a light-emitting device, a blocking member, an organic encapsulation layer, and a first inorganic encapsulation layer, wherein the light-emitting device is arranged on the substrate to form a display area, and the organic encapsulation layer is arranged above the light-emitting device and covers the display area; the blocking member is arranged around a non-display area of ​​the substrate, and the first inorganic encapsulation layer is arranged above the organic encapsulation layer and the blocking member; characterized in that: It also includes a first photosensitive adhesive encapsulation layer, which is disposed between the organic encapsulation layer and the first inorganic encapsulation layer and corresponds to the non-display area; The orthographic projection of the first photosensitive adhesive encapsulation layer on the substrate covers the orthographic projection of the blocking member on the substrate, and the first photosensitive adhesive encapsulation layer extends to an edge of the non-display area along a side away from the display area.

2. The display panel according to claim 1, wherein: The display panel also includes a second inorganic encapsulation layer and a second photosensitive adhesive encapsulation layer, the second inorganic encapsulation layer is arranged above the first inorganic encapsulation layer, the second photosensitive adhesive encapsulation layer is arranged between the first inorganic encapsulation layer and the second inorganic encapsulation layer, and is arranged corresponding to the non-display area.

3. The display panel according to claim 2, wherein: The thickness of the first photosensitive adhesive encapsulation layer and the second photosensitive adhesive encapsulation layer are both 2um to 5um.

4. The display panel according to claim 3, wherein: The blocking member includes a first blocking member and a second blocking member, the first blocking member and the second blocking member are arranged at intervals, and a recess is formed between adjacent members, the orthographic projections of the first photosensitive adhesive encapsulation layer and the second photosensitive adhesive encapsulation layer on the substrate both cover the orthographic projections of the first blocking member and the second blocking member on the substrate, and the first photosensitive adhesive encapsulation layer and the second photosensitive adhesive encapsulation layer both extend along a side away from the display area to an edge of the non-display area; The first photosensitive adhesive encapsulation layer and the second photosensitive adhesive encapsulation layer each include a first encapsulation portion, a second encapsulation portion, a third encapsulation portion and a fourth encapsulation portion connected in sequence, the first encapsulation portion is arranged above the first blocking member, the second encapsulation portion is arranged in the recessed portion, the third encapsulation portion is arranged above the second blocking member, and the fourth encapsulation portion is arranged on a side of the non-display area away from the display area to form an edge encapsulation portion; The thickness of the second packaging part and the edge packaging part is greater than the thickness of the first packaging part and the third packaging part.

5. The display panel according to claim 2, wherein: The thickness of the first photosensitive adhesive encapsulation layer is smaller than the thickness of the second photosensitive adhesive encapsulation layer.

6. The display panel according to claim 2, wherein: The width of the first photosensitive adhesive encapsulation layer is 0.5um-3um.

7. A method for preparing a display panel, used for preparing the display panel according to any one of claims 1 to 6, characterized in that: Includes steps: forming a light emitting device on the substrate corresponding to the display area; forming a blocking member at a position of the edge of the substrate corresponding to the non-display area; inkjet printing an organic encapsulation material above the light emitting device and within the blocking member to form an organic encapsulation layer; Forming a first photosensitive adhesive encapsulation layer at a position corresponding to the non-display area above the organic encapsulation layer and the blocking member; forming a first inorganic encapsulation layer on the first photosensitive adhesive encapsulation layer; Forming a second photosensitive adhesive encapsulation layer above the first inorganic encapsulation layer at a position corresponding to the non-display area; A second inorganic encapsulation layer is formed on the second photosensitive adhesive encapsulation layer to obtain a display panel with encapsulation completed.

8. The method for preparing a display panel according to claim 7, wherein: The step of inkjet printing an organic encapsulation material above the light emitting device and within the blocking member to form an organic encapsulation layer comprises the following steps: forming a third inorganic encapsulation layer above the light emitting device and the blocking member; An organic encapsulation material is inkjet printed in the blocking member above the third inorganic encapsulation layer to form an organic encapsulation layer.

9. The method for preparing a display panel according to claim 7, wherein: The step of forming a first photosensitive adhesive encapsulation layer at a position corresponding to the non-display area above the organic encapsulation layer and the blocking member comprises the steps of: Applying a photosensitive adhesive material on the organic encapsulation layer and the blocking member at positions corresponding to the non-display area; Irradiating the photosensitive adhesive material with ultraviolet light to cure it to form a first photosensitive adhesive encapsulation layer; The step of forming a second photosensitive adhesive encapsulation layer above the first inorganic encapsulation layer at a position corresponding to the non-display area comprises the steps of: Coating a photosensitive adhesive material on the first inorganic encapsulation layer at a position corresponding to the non-display area; The photosensitive adhesive material is irradiated with ultraviolet light to cure and form a second photosensitive adhesive encapsulation layer.

10. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-6.

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