Automatic cleaning equipment for GaAs wafer processing

Abstract

The present invention discloses an automatic cleaning device for gallium arsenide wafer processing, comprising a base, a chassis and a processing box, wherein the chassis is fixed directly above the base, the processing box is installed directly above the chassis, and both ends of the middle of the processing box are provided with a bonding transmission mechanism. The present invention enables the wafer body to move progressively in an "∞" contour trajectory between two bonding transmission mechanisms, and in the process, the second cylinder, the fourth drive motor and the brush cotton wheel cooperate to respectively perform chemical washing and drying operations on the wafer body at the two bonding transmission mechanisms, the wafer body rotates while rotating, and the flushing mechanism enables the wafer body to flush away the chemical liquid on both sides when swinging, thereby improving the cleaning effect of the wafer body, and realizing automatic flipping at the flipping mechanism, and a wafer body with clean and dry both sides can be obtained after a single cycle, the processing efficiency is significantly improved, and the cleaning effect of the wafer body is improved, and the degree of automation is high, and the labor intensity is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to automatic cleaning equipment for gallium arsenide wafer processing. Background Art

[0002] Wafer grinding and polishing is an ultra-precision surface processing technology for achieving global flatness in integrated circuit manufacturing. This method usually applies a polishing liquid containing abrasive particles and chemical components to a rotating polishing pad, and at the same time uses a carrier head to press the wafer against the polishing pad and drive the wafer and the polishing pad to rotate in the same direction, so that the surface to be polished of the wafer is polished under the chemical action generated by the chemical components of the polishing liquid and the mechanical action generated by the abrasive particles contained in the polishing liquid.

[0003] During the grinding and polishing process, the wafer surface will absorb abrasive particles, polishing debris, organic matter and other pollutants. If they are not removed in time, a large number of defects will be generated in the subsequent process. Therefore, a post-processing process is required to clean and dry the polished wafer to provide a smooth and clean wafer surface. The function of post-polishing cleaning is to remove particles and various chemicals on the wafer surface, and avoid corrosion and damage to the wafer surface and internal structure during the cleaning process. It can be divided into wet cleaning and dry cleaning. The commonly used wet cleaning is to clean the wafer in a solution environment, such as cleaning agent immersion, mechanical scrubbing, wet chemical cleaning, etc.

[0004] When using a cleaning tool to scrub the wafer, contaminants will adhere to and accumulate on the cleaning tool. If not handled, these contaminants may cause secondary contamination to the wafer, reducing cleaning efficiency and cleanliness. In the prior art, when using equipment to clean wafers, they are usually rinsed directly and then dried using a spin dryer. This method will have drug residues and poor cleaning effect; or a brush plate is used to scrub the surface of the wafer. After cleaning one side, it needs to be taken out, turned over, and put back in to clean the other side, resulting in low efficiency and failure to meet production needs.

[0005] Therefore, it is necessary to invent an automatic cleaning device for gallium arsenide wafer processing to solve the above problems. Summary of the invention

[0006] The object of the present invention is to provide an automatic cleaning device for gallium arsenide wafer processing to solve the above-mentioned deficiencies mentioned in the background technology.

[0007] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: automatic cleaning equipment for gallium arsenide wafer processing, comprising a base, a chassis and a processing box, the chassis is fixed directly above the base, the processing box is installed directly above the chassis, both ends of the middle part of the processing box are provided with a bonding transmission mechanism for placing the wafer body and performing transmission processing, a flushing mechanism is provided between the two bonding transmission mechanisms for flushing away the residual cleaning liquid on the surface of the wafer body, and a flipping mechanism is provided on the sides of the two bonding transmission mechanisms for flipping the wafer body, and manipulators are also provided on both sides of the processing box, and a material discharge mechanism is provided on one side of the manipulator, and the two bonding transmission mechanisms, the two flipping mechanisms, the two manipulators and the two material discharge mechanisms are all centrally symmetrically distributed about the axis of the flushing mechanism;

[0008] The bonding transmission mechanism includes a rotating wheel, which is movably mounted on a base fixed to the top wall of the chassis, a driving spindle is fixedly connected to the bottom axis of the rotating wheel, and the driving spindle is rotatably connected to the base through a sealed bearing and extends to the inside of the chassis, a driving auxiliary shaft is rotatably connected to the inner bottom wall of the chassis, a first driving motor is fixedly installed inside the chassis, and the output shaft of the first driving motor is transmission-connected to one of the driving spindles, the bottom ends of the other driving spindle and the driving auxiliary shaft are fixedly connected to mutually meshing first flat gears, the output shaft of the first driving motor drives the auxiliary shaft through a belt drive, seven U-shaped grooves distributed in a ring array are provided on the outer side of the rotating wheel, and a bonding portion is provided in the U-shaped groove for bonding and placing the wafer body;

[0009] The flushing mechanism includes a flushing table, two first adsorption parts symmetrically distributed about the axis are provided on both sides of the top of the flushing table, which are used to adsorb the wafer body, a semi-circular disc is fixedly connected at the bottom center of the flushing table, the combined structure of the flushing table and the semi-circular disc is suspended in the air through a support frame, and the support frame is hinged to the center of the semi-circular disc, an outer ring tooth is provided on the outer arc surface of the semi-circular disc, two limit sleeves symmetrically distributed about the axis of the flushing table are fixed on the top wall of the chassis, and a first sliding rod is slidably connected in the two limit sleeves, a worm member meshing with the outer ring tooth is provided in the middle part of the outer side of the first sliding rod, a limit rail is provided on the inner top wall of the chassis, and the limit A first rack is slidably connected inside the rail, a driven shaft is penetrated through the top wall of the chassis and is rotatably connected through a sealed bearing, a second flat gear and a worm gear are fixedly connected at the bottom and top ends of the driven shaft respectively, the second flat gear and the worm gear are meshed with the first rack and the worm gear respectively, a circular long rail with a slotted hole is fixedly connected to the middle part of the bottom end of the first rack by screws, a fifth drive motor is fixedly connected to the top wall inside the chassis and located directly above the auxiliary drive shaft, the output shaft of the fifth drive motor is drivingly connected to a pick plate, and an adjusting shaft block is inserted at one end of the pick plate away from the auxiliary drive shaft, and the adjusting shaft block is slidably connected to the slotted hole of the circular long rail;

[0010] The turning mechanism includes a first cylinder, which is fixedly connected to the top wall of the chassis, the output end of the first cylinder is transmission-connected to the second driving motor, and the output shaft of the second driving motor is transmission-connected to the storage seat, two parallel storage grooves are penetrated on both sides of the storage seat, and the middle parts of the two storage grooves are penetrated and rotatably connected to the third flat gear at the penetration mouth, the top wall of the storage seat is fixedly connected to the third driving motor, and the output shaft of the third driving motor is transmission-connected to the third flat gear, the two storage grooves are respectively provided with a first adjusting rod and a second adjusting rod that slide out to both sides, the first adjusting rod and the second adjusting rod are both provided with a second rack on one side adjacent to each other, and the two second racks are respectively meshed with the two sides of the third flat gear, the outer ends of the first adjusting rod and the second adjusting rod are hinged with an arc-shaped clamp, and the hinge between the arc-shaped clamp and the first adjusting rod or the second adjusting rod is preset with an elastic buffer value by a torsion spring, the upper and lower ends of the inner side surface of the arc-shaped clamp are both provided with bevel cutters, and a clamping groove is formed between the four bevel cutters on a group of arc-shaped clamps;

[0011] Four second cylinders are fixedly connected to the top wall of the processing box, the output end of the second cylinder is transmission-connected to the fourth drive motor, and the output shaft of the fourth drive motor is transmission-connected to the grinding brush cotton wheel, the four second cylinders are divided into two groups corresponding to the two bonding transmission mechanisms, and the two groups of second cylinders are centrally symmetrically distributed about the axis of the flushing mechanism, the grinding brush cotton wheels corresponding to the two groups of second cylinders respectively wash and dry the wafer body, and the two second cylinders in each group are distributed on both sides of the rotating wheel.

[0012] As a preferred solution of the present invention, the fitting part includes a turntable, and a collar is sleeved on the outside of the turntable, and blocks are installed at both ends of the U-shaped groove by screws for installing the limit collar, and the turntable is rotatably connected to the rotating wheel through the collar, and a wax-free adsorption pad is placed on the top of the turntable;

[0013] An arc expansion opening is provided at the bottom of the rotating wheel and on the outside of the U-shaped groove, and a fourth flat gear is fixedly connected to the bottom of the turntable and at the position corresponding to the arc expansion opening. An inner gear ring coaxially distributed with the driving main shaft is fixedly installed on the outside of the top of the base, and multiple fourth flat gears distributed in a ring array are all meshed with the inner gear ring.

[0014] As a preferred solution of the present invention, two hydraulic cylinders are arranged inside the chassis, the output ends of the two hydraulic cylinders penetrate into the processing box, and the output ends of the two hydraulic cylinders respectively drive two manipulators to lift;

[0015] The end of the robot is provided with a second adsorption portion for adsorbing the wafer body and transferring it by using the movement of the robot.

[0016] As a preferred embodiment of the present invention, the first adsorption part and the second adsorption part both include an air pump and an adsorption plate, and a plurality of adsorption plates with flush upper surfaces are installed on the top of the air pump, and vents are provided inside the adsorption plates, and the vents penetrate the top walls of the adsorption plates, and the port of the air pump is connected to one side of the vents;

[0017] A gap is reserved between the adsorption plate on the first adsorption part and the flushing table;

[0018] A curved sliding block is arranged on one side of the supporting frame close to the semicircular disk, semi-circular grooves are arranged on both sides of the semicircular disk, and the curved sliding blocks on both sides are respectively slidably connected in the two semi-circular grooves.

[0019] As a preferred embodiment of the present invention, a medicine supply pipe is passed through the top wall of the treatment box, and the input end of the medicine supply pipe is used to pump medicine liquid for transportation and dripping, and the output end of the medicine supply pipe is extended through a liquid separation pipe to the top of two brush cotton wheels for medicine washing operations.

[0020] As a preferred solution of the present invention, the flushing mechanism further includes a water supply pipe, the number of which is set to two, and the two water supply pipes are symmetrically distributed on both sides of the flushing station;

[0021] The output end of the water supply pipe is equipped with an atomizing nozzle, and the input end of the water supply pipe is pressurized by pumping clean water to flush the two sides of the wafer body.

[0022] As a preferred embodiment of the present invention, the discharge mechanism includes a wafer storage box and a placement pallet, and the wafer storage box is clamped on the top of the placement pallet, and the four corners of the bottom of the placement pallet are fixedly connected with second slide bars, the second slide bars penetrate the top wall of the chassis and are slidably connected to the through holes, and the bottom ends of the four second slide bars are jointly fixedly installed with a bracket, the bottom wall of the chassis is fixedly connected with a first electric push rod, and the output end of the first electric push rod is transmission-connected to the bracket.

[0023] As a preferred solution of the present invention, two parallel partitions are provided inside the processing box to separate the laminating transmission mechanism and the robot, and a through groove is provided on the surface of the partition to allow the robot to pass normally;

[0024] The partition side and both ends of the through slot are fixedly connected with plug-in slots, and a transparent baffle is slidably connected between the two opposite plug-in slots. The top of the partition side wall is fixedly connected with a second electric push rod, and the output end of the second electric push rod is transmission-connected to the transparent baffle.

[0025] As a preferred solution of the present invention, a switch door plate is provided on the outside of the processing box at positions corresponding to the robot and the material discharge mechanism, and a visible glass window is provided at one side of the switch door plate.

[0026] As a preferred solution of the present invention, a drainage trough is provided inside the processing box body for collecting and discharging the cleaning liquid and water.

[0027] In the above technical solution, the technical effects and advantages provided by the present invention are:

[0028] 1. The wafer bodies are transferred one by one on the two bonding transmission mechanisms through the cooperation of two manipulators and the second adsorption part at the end, and the wafer bodies are moved progressively in the contour track of "∞" between the two bonding transmission mechanisms in cooperation with the intermediate temporary storage of the flushing mechanism. In the process, the second cylinder, the fourth drive motor and the brushing cotton wheel are used to respectively wash and dry the wafer bodies at the two bonding transmission mechanisms. The wafer bodies rotate while rotating, and the flushing mechanism enables the wafer bodies to flush away the liquid on both sides when swinging, thereby improving the cleaning effect of the wafer bodies. Automatic flipping is realized at the flipping mechanism, and the wafer bodies with clean and dry both sides can be obtained after a single cycle, which significantly improves the processing efficiency and the cleaning effect of the wafer bodies. The degree of automation is high and the labor intensity is reduced;

[0029] 2. By setting seven easy-to-install bonding parts on a bonding transmission mechanism, seven wafer bodies can be placed at the same time. The range of a single movement of the bonding transmission mechanism is one-seventh to one and one-seventh of a circle, so that the wafer body can just move forward one station to ensure the uniformity of wafer body cleaning. The self-rotation of the wafer body is opposite to the rotation of the bonding transmission mechanism, which increases the friction with the brush cotton wheel and is also conducive to achieving precise control, making it easier for the robot to dock and transfer the wafer body. The output end of the first electric push rod rises gradually, so that the wafer body transferred by the robot can accurately dock with the correct placement position every time, realizing the automatic docking, removal or loading of the wafer body;

[0030] 3. The wafer body is flipped by setting a flipping mechanism, and the arc clamp structure is optimized. When two arc clamps are used to clamp the wafer body, they are brought close to each other, and the wafer body is tilted and clamped in the clamping slot by a bevel cutter. The torsion spring at the hinged structure position provides elastic buffering to avoid clamping the wafer body and improve safety. Then the wafer body is flipped 180°, and the wafer body can be easily removed from it without damaging the wax-free adsorption pad, ensuring the product processing quality and extending the service life of the device.

[0031] 4. By optimizing and transforming the flushing mechanism, the flushing table cooperates with the wafer body adsorbed by the first adsorption part to swing back and forth during flushing, and the transmission mechanism of the flushing mechanism and the bonding transmission mechanism are arranged inside the chassis. A waterproof structure is arranged between the transmission mechanism and the processing box. During brushing and flushing, the manipulator retracts from the through groove, and the output end of the second electric push rod pushes the transparent baffle to close the through groove to avoid liquid splashing. The cleaning water and the liquid medicine are gathered and discharged from the drain trough to avoid liquid accumulation inside the processing box, thereby improving the safety of electrical components in the chassis, reducing the failure rate of the equipment, and extending the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0033] Figure 1 It is a three-dimensional diagram of the overall structure of the present invention;

[0034] Figure 2 A first-view stereoscopic diagram of the overall structure of the present invention (without the upper cover);

[0035] Figure 3 A second perspective stereogram of the overall structure of the present invention (without the upper cover);

[0036] Figure 4 A third perspective view of the overall structure of the present invention (without the upper cover);

[0037] Figure 5 It is a top view of the overall structure of the present invention (without the upper cover);

[0038] Figure 6 A first-view stereoscopic view of the chassis and the top connection structure of the present invention;

[0039] Figure 7 A second perspective view of the chassis and the mounting structure thereon of the present invention;

[0040] Figure 8 A third perspective view of the chassis of the present invention and the mounting structure thereon;

[0041] Fig. 9 A top view of the chassis of the present invention and the mounting structure thereon;

[0042] Fig.10 A bottom view of the chassis of the present invention and the mounting structure thereon;

[0043] Fig.11It is a first-angle stereoscopic diagram of the coordination relationship among the laminating transmission mechanism, the flushing mechanism and the flipping mechanism of the present invention;

[0044] Fig.12 It is a second perspective stereogram of the cooperation relationship between the laminating transmission mechanism, the flushing mechanism and the flipping mechanism of the present invention;

[0045] Fig.13 It is a third-angle stereoscopic diagram of the cooperation relationship between the laminating transmission mechanism, the flushing mechanism and the flipping mechanism of the present invention;

[0046] Fig.14 It is a first-angle stereoscopic view of the driving matching structure of the laminating transmission mechanism and the flushing mechanism of the present invention;

[0047] Fig.15 A second perspective view of the driving matching structure of the laminating transmission mechanism and the flushing mechanism of the present invention;

[0048] Fig.16 A first-view stereoscopic diagram of the swing mechanism of the flushing station of the present invention;

[0049] Fig.17 A second perspective view of the swing mechanism of the flushing station of the present invention;

[0050] Fig.18 It is a first-view stereoscopic diagram of the laminating transmission mechanism (part) of the present invention;

[0051] Fig.19 For the present invention Fig.18 An exploded view of the structure shown;

[0052] Fig. 20 A second perspective view of the laminating transmission mechanism (partial) of the present invention;

[0053] Fig.21 For the present invention Fig. 20 An exploded view of the structure shown;

[0054] Fig. 22 It is a three-dimensional diagram of the overall structure of the turning mechanism of the present invention;

[0055] Fig.23 It is a schematic diagram of the partial cross-section structure of the turnover mechanism of the present invention.

[0056] Description of reference numerals:

[0057] Base-1; chassis-2; processing box-3; laminating transmission mechanism-4; flushing mechanism-5; flipping mechanism-6; manipulator-7; unloading mechanism-8; base-9; second cylinder-10; fourth driving motor-11; brushing cotton wheel-12; hydraulic cylinder-13; first adsorption part-14; second adsorption part-15; air pump-16; adsorption plate-17; drug supply pipe-18; liquid dispensing pipe-19; water supply pipe-20; atomizing nozzle-21;

[0058] Partition-301; through slot-302; plug-in slot-303; transparent baffle-304; second electric push rod-305; switch door plate-306; visual glass window-307;

[0059] Rotating wheel 401; driving main shaft 402; driving auxiliary shaft 403; first driving motor 404; first flat gear 405; belt 406; fitting part 407; U-shaped groove 408; fifth driving motor 409;

[0060] Scouring table 501; semi-circular groove 502; semi-circular disc 503; supporting frame 504; outer ring gear 505; limiting sleeve 506; first sliding rod 507; worm member 508; limiting rail 509; first rack 510; driven shaft 511; second flat gear 512; worm wheel 513; circular long rail 514; lifting plate 515; adjusting shaft block 516;

[0061] The first cylinder 601; the second drive motor 602; the storage seat 603; the storage slot 604; the third flat gear 605; the third drive motor 606; the first adjustment rod 607; the second adjustment rod 608; the second rack 609; the arc clamp 610; the bevel cutter 611;

[0062] Wafer storage box-801; placement card plate-802; second slide bar-803; bracket-804; first electric push rod-805;

[0063] Turntable part-4071; collar part-4072; stopper-4073; wax-free adsorption pad-4074; fourth flat gear-4075; inner gear ring-4076. DETAILED DESCRIPTION

[0064] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0065] The present invention provides Figure 1-23The automatic cleaning equipment for gallium arsenide wafer processing shown includes a base 1, a chassis 2 and a processing box 3, the chassis 2 is fixed directly above the base 1, the processing box 3 is installed directly above the chassis 2, and both ends of the middle part of the processing box 3 are provided with a bonding transmission mechanism 4 for placing the wafer body and performing transmission processing, a flushing mechanism 5 is provided between the two bonding transmission mechanisms 4, and is used to flush away the residual cleaning liquid on the surface of the wafer body, and flipping mechanisms 6 are provided on the sides of the two bonding transmission mechanisms 4, and are used to flip the wafer body, and manipulators 7 are also provided on both sides of the processing box 3, and the manipulators 7 are automatically controlled by a program to achieve precise operation, and a material discharge mechanism 8 is provided on one side of the manipulator 7, and the two bonding transmission mechanisms 4, the two flipping mechanisms 6, the two manipulators 7 and the two material discharge mechanisms 8 are all centrally symmetrically distributed about the axis of the flushing mechanism 5;

[0066] As a specific implementation structure of the bonding transmission mechanism 4 in the present invention:

[0067] The bonding transmission mechanism 4 includes a rotating wheel 401, which is movably mounted on a base 9 fixed to the top wall of the chassis 2. A driving spindle 402 is fixedly connected to the axis center of the bottom of the rotating wheel 401. The driving spindle 402 is rotatably connected to the base 9 through a sealed bearing and extends to the inside of the chassis 2. A driving auxiliary shaft 403 is rotatably connected to the inner bottom wall of the chassis 2. A first driving motor 404 is fixedly installed inside the chassis 2. The output shaft of the first driving motor 404 is transmission-connected to one of the driving spindles 402. The bottom ends of the other driving spindle 402 and the driving auxiliary shaft 403 are both fixedly connected to mutually meshing first flat gears 405. The output shaft of the first driving motor 404 drives the driving auxiliary shaft 403 through a belt 406. Seven U-shaped grooves 408 distributed in a ring array are provided on the outer side of the rotating wheel 401. A bonding portion 407 is provided in the U-shaped groove 408 for bonding and placing the wafer body.

[0068] When the wafer body on the bonding transmission mechanism 4 is transmitted, the first driving motor 404 is started, and the output shaft of the first driving motor 404 drives one of the driving main shafts 402, and the driving main shaft 402 drives the rotating wheel 401 on its top to rotate clockwise, and drives the driving auxiliary shaft 403 through the belt 406, and the driving auxiliary shaft 403 and the first flat gear 405 at the bottom of the other driving main shaft 402 are meshed with each other, so that the other rotating wheel 401 rotates counterclockwise, and the wafer body is placed on the bonding part 407 in turn, and the transfer of the robot 7 and the temporary storage of the flushing mechanism 5 are coordinated to make the wafer body move in an "∞" contour trajectory;

[0069] As a specific implementation structure of the laminating portion 407 in the present invention:

[0070] The fitting part 407 includes a turntable 4071, a collar 4072 is sleeved on the outer side of the turntable 4071, and blocks 4073 are installed at both ends of the U-shaped groove 408 by screws for installing the ring of the limit sleeve 506. The turntable 4071 is rotatably connected to the rotating wheel 401 through the collar 4072, and a wax-free adsorption pad 4074 is placed on the top of the turntable 4071; it is easy to install and disassemble for maintenance;

[0071] An arc expansion opening is provided at the bottom of the rotating wheel 401 and outside the U-shaped groove 408, a fourth flat gear 4075 is fixedly connected to the bottom of the rotating disc 4071 and at the position corresponding to the arc expansion opening, an inner gear ring 4076 coaxially distributed with the driving main shaft 402 is fixedly installed on the outer side of the top of the base 9, and a plurality of fourth flat gears 4075 distributed in an annular array are all meshed with the inner gear ring 4076;

[0072] When the rotating wheel 401 rotates, the fourth flat gear 4075 located in each U-shaped groove 408 is combined with the inner gear ring 4076, so that the wafer body will also rotate during the rotation movement, thereby improving the cleaning effect;

[0073] As a specific implementation structure of the flushing mechanism 5 in the present invention:

[0074] The flushing mechanism 5 includes a flushing table 501, and two first adsorption parts 14 are axially symmetrically distributed on both sides of the top of the flushing table 501, which are used to adsorb the wafer body. A semi-circular disk 503 is fixedly connected at the bottom center of the flushing table 501. The combined structure of the flushing table 501 and the semi-circular disk 503 is suspended in the air through a support frame 504, and the support frame 504 is hinged to the center of the semi-circular disk 503. An outer ring tooth 505 is provided on the outer arc surface of the semi-circular disk 503. Two limiting sleeves 506 symmetrically distributed about the flushing table 501 are fixed on the top wall of the chassis 2. A first sliding rod 507 is slidably connected in the two limiting sleeves 506. A worm member 508 meshing with the outer ring tooth 505 is provided in the middle of the outer side of the first sliding rod 507. A limiting rail 509 is provided on the inner top wall of the chassis 2. 9 is slidably connected with a first rack 510 inside, a driven shaft 511 passes through the top wall of the chassis 2 and is rotatably connected through a sealed bearing, the bottom and top ends of the driven shaft 511 are respectively fixedly connected with a second flat gear 512 and a worm gear 513, the second flat gear 512 and the worm gear 513 are respectively meshed with the first rack 510 and the worm member 508 one by one, a circular long rail 514 with a slotted hole is fixedly connected to the middle of the bottom end of the first rack 510 by screws, a fifth drive motor 409 is fixedly connected to the inner top wall of the chassis 2 and located just above the auxiliary drive shaft 403, the output shaft of the fifth drive motor 409 is drivingly connected with a pick plate 515, an end of the pick plate 515 away from the auxiliary drive shaft 403 is plugged with an adjusting shaft block 516, and the adjusting shaft block 516 is slidably connected to the slot of the circular long rail 514;

[0075] When the flushing table 501 is in a horizontal state, the wafer body is placed on the flushing mechanism 5, and the fifth driving motor 409 is started. The output shaft of the fifth driving motor 409 drives the pick plate 515 to drive the adjusting shaft block 516 to rotate, and the adjusting shaft block 516 slides inside the slot, thereby pulling the circular long rail 514 and the first rack 510 to slide back and forth inside the limit rail 509, and the first rack 510 meshes with the second flat gear 512 and rotates repeatedly, and the driven shaft 511 and the worm wheel 513 rotate repeatedly and mesh with the worm member 508, and the worm member 508 and the first sliding rods 507 on both sides thereof slide back and forth in the limit sleeve 506, and the outer ring gear 505 swings back and forth on the support frame 504, thereby improving the cleaning effect of the wafer body;

[0076] As a specific implementation structure of the flip mechanism 6 in the present invention:

[0077] The flip mechanism 6 includes a first cylinder 601, which is fixedly connected to the top wall of the chassis 2. The output end of the first cylinder 601 is transmission-connected to the second drive motor 602. The output shaft of the second drive motor 602 is transmission-connected to the storage seat 603. Two parallel storage grooves 604 are penetrated on both sides of the storage seat 603. The middle of the two storage grooves 604 is penetrated and rotatably connected to the third flat gear 605 at the penetration mouth. The top wall of the storage seat 603 is fixedly connected to the third drive motor 606. The output shaft of the third drive motor 606 is transmission-connected to the third flat gear 605. The two storage grooves 604 are respectively provided with a third gear that slides out to both sides. An adjusting rod 607 and a second adjusting rod 608, a second rack 609 is provided on one side adjacent to the first adjusting rod 607 and the second adjusting rod 608, the two second racks 609 are respectively meshed on both sides of the third flat gear 605, an arc-shaped clamp 610 is hingedly connected to the outer ends of the first adjusting rod 607 and the second adjusting rod 608, a torsion spring is used to preset an elastic buffer value at the hinge between the arc-shaped clamp 610 and the first adjusting rod 607 or the second adjusting rod 608, a bevel cutter 611 is provided at the upper and lower ends of the inner side surface of the arc-shaped clamp 610, and a material clamping groove is formed between the four bevel cutters 611 on a group of arc-shaped clamps 610;

[0078] Four second cylinders 10 are fixedly connected to the top wall of the processing box 3, and the output end of the second cylinder 10 is transmission-connected to the fourth drive motor 11, and the output shaft of the fourth drive motor 11 is transmission-connected to the grinding brush cotton wheel 12. The four second cylinders 10 are divided into two groups corresponding to the two laminating transmission mechanisms 4, and the two groups of second cylinders 10 are centrally symmetrically distributed about the axis of the flushing mechanism 5. The grinding brush cotton wheels 12 corresponding to the two groups of second cylinders 10 respectively wash and dry the wafer body, and the two second cylinders 10 of each group are distributed on both sides of the rotating wheel 401;

[0079] The connecting ends of the first cylinder 601 and the second cylinder 10 are both provided with a pneumatic mechanism for providing kinetic energy to the first cylinder 601 and the second cylinder 10;

[0080] After the processing on one side of the wafer body is completed, the flipping mechanism 6 is used to flip it, and the output end of the first cylinder 601 is retracted to make the arc clamp 610 fit the wax-free adsorption pad 4074, and the third drive motor 606 is started so that its output shaft drives the third flat gear 605. The first adjustment rod 607 and the second adjustment rod 608 are meshed with the third flat gear 605 through the second rack 609, so that the first adjustment rod 607 and the second adjustment rod 608 bring the two arc clamps 610 close to each other, and the bevel cutter 611 is convenient for tilting the wafer body and clamping it in the clamping slot. The hinge and torsion spring of this structure can avoid clamping the wafer body and improve safety. When flipping, the output end of the first cylinder 601 extends upward to push the clamping structure, and then the second drive motor 602 is controlled to start, and the output shaft of the second drive motor 602 rotates 180° to complete the flipping of the wafer body, and then place it back on the wax-free adsorption pad 4074.

[0081] Further, in the above technical solution, two hydraulic cylinders 13 are provided inside the chassis 2, and a hydraulic mechanism is provided at the connecting end of the hydraulic cylinder 13 for providing kinetic energy to the hydraulic cylinder 13. The output ends of the two hydraulic cylinders 13 penetrate into the processing box 3, and the output ends of the two hydraulic cylinders 13 respectively drive the two manipulators 7 to lift;

[0082] A second adsorption portion 15 is provided at the end of the robot 7 for adsorbing the wafer body and transferring it by utilizing the movement of the robot 7 .

[0083] As a specific implementation structure of the first adsorption part 14 and the second adsorption part 15 in the present invention:

[0084] The first adsorption part 14 and the second adsorption part 15 both include an air pump 16 and an adsorption plate 17. A plurality of adsorption plates 17 with flush upper surfaces are installed on the top of the air pump 16. Ventilation holes are provided inside the adsorption plates 17. The vents penetrate the top walls of the adsorption plates 17. The ports of the air pump 16 are connected to one side of the vents. A gap is reserved between the adsorption plates 17 on the first adsorption part 14 and the flushing station 501.

[0085] By controlling the air pump 16 to suck and blow air, a vacuum suction cup can be formed on the adsorption plate 17, which can firmly adsorb the wafer body, and through the gap, both sides of the wafer body can be washed clean when the wafer body swings, and it is easy to release the adsorption state after cleaning;

[0086] An arc-shaped slider is provided on one side of the support frame 504 close to the semi-circular disk 503, and semi-circular grooves 502 are provided on both sides of the semi-circular disk 503. The arc-shaped sliders on both sides are respectively slidably connected in the two semi-circular grooves 502, and the arc-shaped sliders slide in matching with the semi-circular grooves 502 to improve the stability of the flushing table 501 during movement, thereby improving the safety of the wafer body.

[0087] Furthermore, in the above technical solution, a medicine supply pipe 18 is passed through the top wall of the processing box 3, and the input end of the medicine supply pipe 18 is used to transport and drip medicine by pumping in medicine liquid, and the output end of the medicine supply pipe 18 is extended through the liquid separation pipe 19 to the top of two brush cotton wheels 12 for medicine washing operation.

[0088] Furthermore, in the above technical solution, the flushing mechanism 5 further includes a water supply pipe 20, the number of which is set to two, and the two water supply pipes 20 are symmetrically distributed on both sides of the flushing station 501;

[0089] The output end of the water supply pipe 20 is equipped with an atomizing nozzle 21, and the input end of the water supply pipe 20 is pressurized by pumping clean water to flush the two sides of the wafer body.

[0090] As a specific implementation structure of the discharge mechanism 8 in the present invention:

[0091] The unloading mechanism 8 includes a wafer storage box 801 and a placement card plate 802. The wafer storage box 801 is clamped on the top of the placement card plate 802. The four corners of the bottom of the placement card plate 802 are fixedly connected with second slide bars 803. The second slide bars 803 penetrate the top wall of the chassis and are slidably connected to the through holes. The bottom ends of the four second slide bars 803 are commonly fixedly installed with a bracket 804. The bottom wall of the chassis 2 is fixedly connected with a first electric push rod 805. The output end of the first electric push rod 805 is transmission-connected with the bracket 804.

[0092] The first electric push rod 805 is automatically controlled by a program so that the output end of the first electric push rod 805 rises gradually, that is, the distance of each rise is the placement position of a wafer body, so that the docking, removal or loading of the wafer body can be stably achieved.

[0093] Further, in the above technical solution, two parallel partitions 301 are provided inside the processing box 3 to separate the laminating transmission mechanism 4 and the robot 7, and a through groove 302 is provided on the surface of the partition 301 to allow the robot 7 to pass normally;

[0094] Insertion slots 303 are fixedly connected to the sides of the partition 301 and at both ends of the through slot 302. A transparent baffle 304 is slidably connected between the two opposite insertion slots 303. A second electric push rod 305 is fixedly connected to the top of the side wall of the partition 301. The output end of the second electric push rod 305 is transmission-connected to the transparent baffle 304.

[0095] During brushing and rinsing, the manipulator 7 is retracted from the through slot 302, and the output end of the second electric push rod 305 pushes the transparent baffle 304 to close the through slot 302 to prevent liquid from splashing.

[0096] Furthermore, in the above technical solution, a switch door panel 306 is provided on the outside of the processing box 3 at the position corresponding to the robot 7 and the discharge mechanism 8, which is convenient for installing and debugging the internal structure after opening, and can also replace the wafer storage box 801. A visible glass window 307 is provided on one side of the switch door panel 306 to observe the internal processing conditions.

[0097] Furthermore, in the above technical solution, a drainage trough is provided inside the processing box 3 for collecting and discharging cleaning liquid and water, thereby avoiding liquid accumulation inside the processing box 3 and preventing the liquid from entering the chassis 2 and affecting the components.

[0098] When the automatic cleaning device provided by the present invention is working:

[0099] Open the switch door 306 at the input end of the equipment, and insert the wafer storage box 801 loaded with the wafer body to be cleaned into the placement card plate 802. Then, use the robot 7 and the second adsorption part 15 installed thereon to cooperate to transfer the wafer bodies one by one, adsorb the wafer body and then pass it through the through groove 302 to reach the top of the nearest bonding part 407. Then, the output end of the hydraulic cylinder 13 drives the robot 7 to move downward, and stably places the carried wafer body at the center position of the corresponding wax-free adsorption pad 4074. At the same time as the above steps, another The manipulator 7 absorbs and takes out the wafer body closest to it and places it in the wafer storage box 801 on the other side. Then, the manipulator 7 places the wafer body on the flushing mechanism 5 at the vacant position that has just appeared. The control manipulator 7 and the second adsorption part 15 at the input end transfer the wafer body located on the same side of the laminating transmission mechanism 4 and behind to the flushing mechanism 5. After the operation is completed, the two manipulators 7 retract from the through slot 302 and control the output end of the second electric push rod 305 to push the transparent baffle 304 to close the through slot 302.

[0100] The four second cylinders 10 are controlled to start, and the output end thereof drives the fourth drive motor 11 downward until the lower surface of the brushing cotton wheel 12 is attached to the upper surface of the wafer body. At this time, the fourth drive motor 11 is started, and its output shaft drives the brushing cotton wheel 12. The four second cylinders 10 correspond to the two bonding transmission mechanisms 4 to respectively wash and dry the wafer body. When working, the wafer body on the bonding transmission mechanism 4 is transmitted at the same time. The first drive motor 404 is started, and the output shaft of the first drive motor 404 drives one of the drive spindles 402. The drive spindle 402 drives the rotating wheel 401 on its top to rotate clockwise, and the belt 406 is used to rotate the rotating wheel 401 on the top of the driving spindle 402. The auxiliary drive shaft 403 is driven, and the first flat gear 405 at the bottom end of the auxiliary drive shaft 403 and the other driving main shaft 402 are meshed with each other, so that the other rotating wheel 401 rotates counterclockwise, and the wafer body is placed on the bonding part 407 in sequence, and the transfer of the robot 7 and the temporary storage of the flushing mechanism 5 are coordinated to make the wafer body move in an "∞" contour trajectory, and the range of a single movement is one-seventh to one and one-seventh of a circle. When the rotating wheel 401 rotates, the fourth flat gear 4075 located in each U-shaped groove 408 is combined with the inner gear ring 4076, so that the wafer body will also rotate during the turnover movement, thereby improving the cleaning effect;

[0101] During the above cleaning operation, the flushing mechanism 5 works, the fifth driving motor 409 is started, the output shaft of the fifth driving motor 409 drives the pick plate 515, drives the adjusting shaft block 516 to rotate, the adjusting shaft block 516 slides inside the slot, thereby pulling the circular long rail 514 and the first rack 510 to slide back and forth inside the limit rail 509, the first rack 510 meshes with the second flat gear 512 and rotates repeatedly, the driven shaft 511 and the worm wheel 513 rotate repeatedly and mesh with the worm member 508, the worm member 508 and the first sliding rods 507 on both sides thereof slide back and forth in the limit sleeve 506, the outer ring gear 505 swings back and forth on the support frame 504, thereby improving the cleaning effect of the wafer body;

[0102] After the processing of one side of the wafer body is completed, the flipping mechanism 6 is used to flip it, and the output end of the first cylinder 601 is retracted to make the arc clamp 610 fit the wax-free adsorption pad 4074, and the third drive motor 606 is started to make its output shaft drive the third flat gear 605, and the first adjustment rod 607 and the second adjustment rod 608 are meshed with the third flat gear 605 through the second rack 609, so that the first adjustment rod 607 and the second adjustment rod 608 bring the two arc clamps 610 close to each other, and the bevel cutter 611 is convenient for tilting the wafer body and clamping it in the clamping slot. The articulation of this structure and the torsion spring cooperate to avoid clamping the wafer body and improve safety; when flipping, the output end of the first cylinder 601 extends upward to push the clamping structure, and then the second drive motor 602 is controlled to start, and the output shaft of the second drive motor 602 rotates 180° to complete the flipping of the wafer body, and then put it back on the wax-free adsorption pad 4074;

[0103] Then, the wafer body is continuously transferred by using the robot 7 and the second adsorption part 15 installed thereon, and the output end of the first electric push rod 805 gradually rises until the wafer body is docked, taken out or loaded.

[0104] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An automatic cleaning device for gallium arsenide wafer processing, comprising a base (1), a chassis (2) and a processing box (3), wherein the chassis (2) is fixed directly above the base (1), and the processing box (3) is installed directly above the chassis (2), and is characterized in that: Both ends of the middle of the processing box (3) are provided with a bonding transmission mechanism (4) for placing the wafer body and performing transmission processing. A flushing mechanism (5) is provided between the two bonding transmission mechanisms (4) for flushing away residual cleaning liquid on the surface of the wafer body. Turning mechanisms (6) are provided on the sides of the two bonding transmission mechanisms (4) for turning over the wafer body. Robots (7) are also provided on both sides of the processing box (3). A material discharge mechanism (8) is provided on one side of the robot (7). The two bonding transmission mechanisms (4), the two flipping mechanisms (6), the two robots (7) and the two material discharge mechanisms (8) are all centrally symmetrically distributed about the axis of the flushing mechanism (5). The laminating transmission mechanism (4) comprises a rotating wheel (401) movably mounted on a base (9) fixed to the top wall of the chassis (2); a driving main shaft (402) is fixedly connected to the bottom axis of the rotating wheel (401); the driving main shaft (402) is rotatably connected to the base (9) via a sealed bearing and extends into the interior of the chassis (2); a driving auxiliary shaft (403) is rotatably connected to the bottom wall inside the chassis (2); a first driving motor (404) is fixedly mounted inside the chassis (2); and the first driving motor ( The output shaft (404) is connected to one of the driving main shafts (402) in a transmission manner, and the bottom ends of the other driving main shaft (402) and the driving auxiliary shaft (403) are fixedly connected with first flat gears (405) that mesh with each other. The output shaft of the first driving motor (404) drives the driving auxiliary shaft (403) through a belt (406). The outer side of the rotating wheel (401) is provided with seven U-shaped grooves (408) distributed in a ring array, and the U-shaped groove (408) is provided with a fitting portion (407) for fitting and placing the wafer body; The flushing mechanism (5) comprises a flushing platform (501), two first adsorption parts (14) are arranged on both sides of the top of the flushing platform (501) and are axially symmetrically distributed, and are used to adsorb the wafer body. A semi-circular disk (503) is fixedly connected to the center of the bottom of the flushing platform (501), and the combined structure of the flushing platform (501) and the semi-circular disk (503) is suspended in the air through a support frame (504), and the support frame (504) is hinged to the center of the semi-circular disk (503). An outer ring tooth (505) is provided on the outer arc surface of the semicircular disk (503), two limit sleeves (506) are fixed on the top wall of the chassis (2) and are symmetrically distributed about the flushing platform (501), and a first slide bar (507) is slidably connected in the two limit sleeves (506), and a worm member (508) meshing with the outer ring tooth (505) is provided in the middle of the outer side of the first slide bar (507), and a limit rail (509) is provided on the inner top wall of the chassis (2), and the limit rail (509) is internally slidably connected with a first rack (510), and a driven shaft (511) passes through the top wall of the chassis (2) and is rotatably connected via a sealed bearing. The bottom end and top end of the driven shaft (511) are respectively fixedly connected with a second flat gear (512) and a worm gear (513), and the second flat gear (512) and the worm gear (513) are respectively meshed with the first rack (510) and the worm member (508) in a one-to-one correspondence. The middle part of the bottom end of the first rack (510) is connected to the driven shaft (511) via a sealed bearing. A circular long rail (514) with a slotted hole is fixedly connected by screws, a fifth drive motor (409) is fixedly connected to the inner top wall of the chassis (2) and located directly above the auxiliary drive shaft (403), the output shaft of the fifth drive motor (409) is connected to a lifting plate (515) in a transmission manner, and an adjustment shaft block (516) is inserted at one end of the lifting plate (515) away from the auxiliary drive shaft (403), and the adjustment shaft block (516) is slidably connected to the inside of the slotted hole of the circular long rail (514); The flip mechanism (6) comprises a first cylinder (601) fixedly connected to the top wall of the chassis (2); the output end of the first cylinder (601) is drivingly connected to the second drive motor (602), and the output shaft of the second drive motor (602) is drivingly connected to the storage seat (603); two parallel storage grooves (604) are penetrated on both sides of the storage seat (603), and a third flat gear (605) is penetrated in the middle of the two storage grooves (604) and is rotatably connected at the penetration mouth; the top wall of the storage seat (603) is fixedly connected to the third drive motor (606), and the output shaft of the third drive motor (606) is drivingly connected to the third flat gear (605), and the two storage grooves (604) are respectively provided with a gear that slides out to both sides. A first adjusting rod (607) and a second adjusting rod (608), a second rack (609) is provided on one side adjacent to the first adjusting rod (607) and the second adjusting rod (608), and the two second racks (609) are respectively meshed on two sides of the third flat gear (605), an arc-shaped clamp (610) is hingedly connected to the outer ends of the first adjusting rod (607) and the second adjusting rod (608), and a preset elastic buffer value is set by a torsion spring at the hinge between the arc-shaped clamp (610) and the first adjusting rod (607) or the second adjusting rod (608), and a bevel cutter (611) is provided at both upper and lower ends of the inner side surface of the arc-shaped clamp (610), and a clamping groove is formed between four bevel cutters (611) on a group of arc-shaped clamps (610); Four second cylinders (10) are fixedly connected to the top wall of the processing box (3); the output end of the second cylinder (10) is transmission-connected to a fourth drive motor (11), and the output shaft of the fourth drive motor (11) is transmission-connected to a brushing cotton wheel (12); the four second cylinders (10) are divided into two groups corresponding to the two bonding transmission mechanisms (4), and the two groups of second cylinders (10) are centrally symmetrically distributed about the axis of the flushing mechanism (5); the brushing cotton wheels (12) corresponding to the two groups of second cylinders (10) respectively perform chemical washing and drying on the wafer body, and the two second cylinders (10) of each group are distributed on both sides of the rotating wheel (401).

2. The automatic cleaning equipment for gallium arsenide wafer processing according to claim 1, characterized in that: The fitting portion (407) includes a turntable member (4071), and a collar member (4072) is sleeved on the outer side of the turntable member (4071), and blocks (4073) are installed at both ends of the U-shaped groove (408) by screws for installing the ring member of the limiting sleeve (506), and the turntable member (4071) is rotatably connected to the rotating wheel (401) through the collar member (4072), and a wax-free adsorption pad (4074) is placed on the top of the turntable member (4071); An arc expansion opening is provided at the bottom of the rotating wheel (401) and located outside the U-shaped groove (408); a fourth flat gear (4075) is fixedly connected to the bottom of the rotating disk (4071) and at a position corresponding to the arc expansion opening; an inner gear ring (4076) coaxially distributed with the driving main shaft (402) is fixedly installed on the outer side of the top of the base (9); and a plurality of fourth flat gears (4075) distributed in a ring array are all meshed with the inner gear ring (4076).

3. The automatic cleaning equipment for gallium arsenide wafer processing according to claim 1, characterized in that: Two hydraulic cylinders (13) are arranged inside the chassis (2), and the output ends of the two hydraulic cylinders (13) penetrate into the processing box (3), and the output ends of the two hydraulic cylinders (13) respectively drive two manipulators (7) to lift and lower; The end of the robot (7) is provided with a second adsorption portion (15) for adsorbing the wafer body and transferring it by using the movement of the robot (7).

4. The automatic cleaning equipment for gallium arsenide wafer processing according to claim 3 is characterized in that: The first adsorption part (14) and the second adsorption part (15) both comprise an air pump (16) and an adsorption plate (17), and a plurality of adsorption plates (17) with flush upper surfaces are installed on the top of the air pump (16), and ventilation holes are provided inside the adsorption plates (17), and the ventilation holes penetrate the top walls of the adsorption plates (17), and the port of the air pump (16) is communicated with one side of the ventilation holes; A gap is reserved between the adsorption plate (17) located on the first adsorption part (14) and the flushing table (501); A curved sliding block is provided on one side of the support frame (504) close to the semicircular disk (503), and semi-circular grooves (502) are provided on both sides of the semicircular disk (503), and the curved sliding blocks on both sides are slidably connected in the two semi-circular grooves (502) respectively.

5. The automatic cleaning equipment for gallium arsenide wafer processing according to claim 1, characterized in that: A medicine supply pipe (18) is passed through the top wall of the treatment box (3), and the input end of the medicine supply pipe (18) is used to pump medicine liquid for delivery and dripping, and the output end of the medicine supply pipe (18) is extended through a liquid separation pipe (19) to the top of two brush cotton wheels (12) for medicine washing.

6. The automatic cleaning equipment for gallium arsenide wafer processing according to claim 1, characterized in that: The flushing mechanism (5) further comprises a water supply pipe (20), the number of the water supply pipes (20) being set to two, and the two water supply pipes (20) being symmetrically distributed on both sides of the flushing platform (501); The output end of the water supply pipe (20) is equipped with an atomizing nozzle (21), and the input end of the water supply pipe (20) is pressurized by pumping clean water to flush the two sides of the wafer body.

7. The automatic cleaning equipment for gallium arsenide wafer processing according to claim 1, characterized in that: The discharge mechanism (8) comprises a wafer storage box (801) and a placement card plate (802), and the wafer storage box (801) is clamped on the top of the placement card plate (802), and the four corners of the bottom of the placement card plate (802) are fixedly connected with second slide bars (803), the second slide bars (803) penetrate the top wall of the chassis and are slidably connected to the through holes, and the bottom ends of the four second slide bars (803) are fixedly installed with a bracket (804), the bottom wall of the chassis (2) is fixedly connected with a first electric push rod (805), and the output end of the first electric push rod (805) is transmission-connected with the bracket (804).

8. The automatic cleaning equipment for gallium arsenide wafer processing according to claim 1, characterized in that: Two parallel partitions (301) are provided inside the processing box (3) for separating the laminating and conveying mechanism (4) and the robot (7); a through groove (302) is provided on the surface of the partition (301) for the normal passage of the robot (7); The side surfaces of the partition (301) and at both ends of the through groove (302) are fixedly connected with plug-in grooves (303), and a transparent baffle (304) is slidably connected between the two opposite plug-in grooves (303). The top of the side wall of the partition (301) is fixedly connected with a second electric push rod (305), and the output end of the second electric push rod (305) is transmission-connected to the transparent baffle (304).

9. The automatic cleaning equipment for gallium arsenide wafer processing according to claim 1, characterized in that: A switch door plate (306) is provided at a position on the outside of the processing box (3) corresponding to the robot (7) and the material discharging mechanism (8), and a visible glass window (307) is provided at a position on one side of the switch door plate (306).

10. The automatic cleaning equipment for gallium arsenide wafer processing according to claim 1, characterized in that: The processing box (3) is provided with a drainage trough inside for collecting and discharging the cleaning liquid and water.

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