Wafer grinding pad and its manufacturing mold and manufacturing method

Abstract

The invention relates to the semiconductor field and discloses a wafer grinding pad and a manufacturing mold and a manufacturing method thereof. The wafer grinding pad manufacturing mold comprises: a mold base cover is installed on the mold cover, a mold cavity is formed between the mold base and the mold cover, and the first mold core to the seventh mold core are installed in the mold cavity; the first mold core is arranged between the mold base upper wall and the periphery of the mold cover lower wall; the second mold core is arranged between the first mold core upper wall and the mold cover lower wall; the third mold core is arranged between the mold base upper wall, the first mold core upper wall, the first mold core side wall and the fourth mold core lower wall; the fourth mold core is arranged between the mold cover lower wall, the second mold core side wall, the third mold core upper wall, the third mold core side wall, the fifth mold core lower wall and the sixth mold core side wall; the fifth mold core is arranged between the mold cover lower wall, the fourth mold core upper wall and the sixth mold core upper wall; the sixth mold core is arranged between the mold cover lower wall, the fourth mold core side wall, the fifth mold core side wall, the fifth mold core lower wall, the seventh mold core side wall and the mold base upper wall; the seventh mold core is arranged in a recessed portion at the center of the mold base.

Description

Technical Field

[0001] The invention relates to the field of semiconductors, and in particular to a wafer grinding pad and a manufacturing mold and a manufacturing method thereof. Background Art

[0002] During the integrated circuit manufacturing process, in order to ensure better circuit conduction, the wafer needs to have a high flatness and no scratches or impurity contamination on the surface. Therefore, after the wafer is cut, its surface usually needs to be chemically mechanically polished. Chemical mechanical polishing requires chemical mechanical polishing equipment, and grinding pads are an essential and commonly used consumable accessory for chemical mechanical polishing equipment.

[0003] Wafer grinding pads, also known as CMP (Chemical Mechanical Polishing) polishing pads, are one of the key consumables used for wafer surface flattening in the semiconductor manufacturing process. The CMP polishing process is an important means to achieve global or local flatness of the wafer surface, which is crucial for subsequent process steps such as lithography. CMP polishing pads are usually made of high-density polyurethane materials with precise hardness, pore size, compressibility and groove patterns, which have a significant impact on the efficiency and uniformity of the polishing process. The surface design and material properties of the polishing pad need to work in conjunction with the polishing liquid in the CMP process to achieve the best polishing effect.

[0004] The production of wafer polishing pads uses specific molds and processes to mold prepolymers into wafer polishing pads with specific thickness and size. However, the structure of wafer polishing pads is complex, production is difficult, production time is long, and efficiency is low. In particular, the molding process of the product and the surface treatment process of the product. The molding process of the product uses a specific silicone material, which is placed in the mold and vulcanized to obtain the overall substrate of the product. The existing wafer polishing pad is to cool the mold after the product is formed (after cooling, the product will shrink and become smaller and easier to open), and use a pry bar or the like to pry the product and the mold core from the upper mold cavity by lever principle, and then use a pry bar or the like to pry the core rods one by one to remove the product by lever principle, and then reheat the mold after returning it to its original position, and continue production after the mold temperature reaches the required temperature. However, the structure of the wafer polishing pad is complex: one side is a 10-inch circular plane, and the other side is divided into 5~12 areas with several small bumps on the surface. The wafer polishing pad and the cavity after mold molding are originally in a vacuum state, and due to the large adsorption tension of the plane, when the product is formed, the product and the core rod will be bonded to the upper mold at the same time and cannot be removed. Such operation is inconvenient, time-consuming, inefficient and costly. Therefore, there is an urgent need for a wafer grinding pad mold and a molding process to improve the above problems. Summary of the invention

[0005] A series of simplified concepts are introduced in the Summary of the Invention, which are all simplifications of the prior art in the field, and will be further described in detail in the Detailed Description of the Invention. The Summary of the Invention of the present invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.

[0006] The technical problem to be solved by the present invention is to provide a wafer grinding pad and a manufacturing mold and a manufacturing method thereof which can reduce the difficulty of production operation, shorten the production cycle and improve the production efficiency.

[0007] In order to solve the above technical problems, the present invention provides a wafer polishing pad manufacturing mold, comprising: a mold base, a first mold core, a second mold core, a third mold core, a fourth mold core, a fifth mold core, a sixth mold core, a seventh mold core and a mold cover;

[0008] The mold base cover is mounted on the mold cover, a mold cavity is formed between the mold base and the mold cover, a first mold core, a second mold core, a third mold core, a fourth mold core, a fifth mold core, a sixth mold core and a seventh mold core are mounted in the mold cavity, and the mold cavity is divided into a plurality of gaps connected to each other, and the gaps are used to inject manufacturing materials of the wafer grinding pad;

[0009] The first mold core, the second mold core, the third mold core, the fourth mold core, the fifth mold core, the sixth mold core and the seventh mold core are all formed into an annular body;

[0010] The first mold core is arranged between the upper wall of the mold base and the periphery of the lower wall of the mold cover;

[0011] The second mold core is arranged between the upper wall of the first mold core and the lower wall of the mold cover;

[0012] The third mold core is arranged between the upper wall of the mold base, the upper wall of the first mold core, the side wall of the first mold core and the lower wall of the fourth mold core, and there is a gap between the third mold core and the upper wall of the first mold core, the side wall of the first mold core and the lower wall of the fourth mold core;

[0013] The fourth mold core is arranged between the lower wall of the mold cover, the side wall of the second mold core, the upper wall of the third mold core, the side wall of the third mold core, the lower wall of the fifth mold core and the side wall of the sixth mold core, and there is a gap between the fourth mold core and the lower wall of the mold cover, the side wall of the second mold core, and the lower wall of the fifth mold core;

[0014] The fifth mold core is arranged between the lower wall of the mold cover, the upper wall of the fourth mold core and the upper wall of the sixth mold core, a gap is formed between the fifth mold core and the lower wall of the mold cover and the upper wall of the fourth mold core, and a gap is formed between the fifth mold core and a portion of the upper wall adjacent to the sixth mold core;

[0015] The sixth mold core is arranged between the lower wall of the mold cover, the inner side wall of the fourth mold core, the side wall of the fifth mold core, the lower wall of the fifth mold core, the side wall of the seventh mold core and the upper wall of the mold base, and there is a gap between the sixth mold core and the lower wall of the mold cover, the side wall of the fifth mold core, a part of the lower wall adjacent to the fifth mold core, the side wall of the seventh mold core and a part of the upper wall adjacent to the mold base;

[0016] The seventh mold core is arranged in a concave portion at the center of the mold base, and is located between the upper wall of the mold base, the lower wall of the mold cover and the side wall of the sixth mold core, and there is a gap between the seventh mold core and the lower wall of the mold cover and the side wall of the sixth mold core;

[0017] The gaps are interconnected to form a cavity, and the cavity is used to inject materials to form a wafer grinding pad.

[0018] Preferably, the wafer polishing pad manufacturing mold is further improved, the mold base has a concave portion formed at its center, and a first step structure, a second step structure and a third step structure are sequentially formed around the concave portion from inside to outside, which are used to carry each mold core;

[0019] A first annular groove is formed at the top of the first step structure.

[0020] Preferably, the wafer polishing pad manufacturing mold is further improved, wherein the first mold core is covered on the third step structure at the periphery of the mold base, and a fourth step structure and a fifth step structure are sequentially formed toward the center direction of the mold base;

[0021] A second annular groove is formed on the fifth step structure.

[0022] Preferably, the wafer polishing pad manufacturing mold is further improved, wherein the second mold core has a rectangular cross section and is covered on the fourth step structure;

[0023] The mold cover has a ring-shaped cover portion formed on the edge of its lower wall, and the cover portion is mounted on the top of the first mold core and the second mold core.

[0024] Preferably, the wafer polishing pad manufacturing mold is further improved, and the third mold core has an L-shaped cross section, the top surface of the L-shaped short side is covered on the second step structure, the side surface of the L-shaped short side is adjacent to the fifth step structure, the long side of the L-shaped is covered on the fifth step structure and there is a gap between the fifth step structure, and the side surface of the L-shaped long side is adjacent to the fifth step structure and there is a gap between the fifth step structure and the second mold core;

[0025] A third annular groove is formed on the top of the L-shaped long side of the third mold core.

[0026] Preferably, the wafer grinding pad manufacturing mold is further improved, the fourth mold core, the side wall of the first vertical part is adjacent to the side wall of the second mold core with a gap, the inner side wall of the first vertical part is adjacent to the fifth mold core with a gap, the top wall of the first vertical part is adjacent to the mold cover with a gap, the top wall of the horizontal part is adjacent to the fifth mold core with a gap, the bottom wall of the horizontal part is adjacent to the third mold core with a gap, and the second vertical part is in contact with the mold base, the fifth mold core and the sixth mold core;

[0027] A fourth annular groove is formed on the top of the fourth horizontal portion of the mold core.

[0028] Preferably, the wafer polishing pad manufacturing mold is further improved, the fifth mold core is formed as an annular body, which is located between the mold cover, the fourth mold core and the sixth mold core, and its horizontal part is respectively adjacent to the mold cover, the horizontal part of the fourth mold core and the seventh step structure of the sixth mold core with a gap, and its convex part is inserted between the fourth mold core and the sixth mold core and forms a contact;

[0029] Preferably, the wafer polishing pad manufacturing mold is further improved, the sixth mold core, its bottom wall cover is installed on the first step structure and the second step structure of the mold base, its top wall is adjacent to the mold cover and a gap is formed, the sixth step structure of the top wall is adjacent to the horizontal part of the fifth mold core to form a gap, and the seventh step structure of the top wall is in contact with the convex part of the fifth mold core;

[0030] A fifth annular groove is formed on the sixth step structure of the sixth mold core.

[0031] Preferably, the wafer grinding pad manufacturing mold is further improved, and the seventh mold core is inserted in the recess, and a portion of its top wall and side wall are in contact with the recess, and another portion of its side wall is formed as an inclined wall adjacent to the sixth mold core and formed with a gap, and its top wall is adjacent to the mold cover and formed with a gap.

[0032] Preferably, the wafer grinding pad manufacturing mold is further improved, and at least the second mold core is formed as a split splicing structure.

[0033] In order to solve the above technical problems, the present invention provides a method for manufacturing a wafer grinding pad. When executing production, the wafer grinding pad manufacturing mold described in any one of the above items is adopted, and the method comprises the following steps:

[0034] S1, sequentially installing the first mold core, the third mold core, the fourth mold core, the fifth mold core, the sixth mold core, the seventh mold core and the second mold core on the mold base;

[0035] S2, injecting material into the cavity, and die-casting the cover mold to form a wafer polishing pad;

[0036] S3, opening the mold cover to disassemble the second mold core;

[0037] S4, the first mold core is opened upward, and the third mold core, the fourth mold core, the fifth mold core, the sixth mold core and the seventh mold core are separated together with the wafer grinding pad, and then the third mold core, the fourth mold core, the fifth mold core, the sixth mold core and the seventh mold core are disassembled one by one in sequence to obtain the wafer grinding pad;

[0038] S5, return to step S1 to cycle production.

[0039] In order to solve the above technical problems, the present invention provides a wafer grinding pad, which is made by using any one of the wafer grinding pad manufacturing molds described above.

[0040] It should be noted that the wafer polishing pad provided by the present invention is limited to being made by the mold provided by the present invention, that is, a wafer polishing pad formed by a gap formed by the first mold core, the second mold core, the third mold core, the fourth mold core, the fifth mold core, the sixth mold core and the seventh mold core, the mold base and the mold cover.

[0041] The wafer grinding pad production mold cannot be easily opened mainly because the product has a large surface, the product and the mold cavity are in a vacuum state during molding, and the tension and adsorption force between the product and the mold are large, which causes the problem that the mold cannot be opened.

[0042] The present invention designs the mold as a split structure assembled from multiple mold cores. When the mold cores are assembled together, the gaps designed between them are interconnected to form a cavity. The cavity is used to inject material to form a wafer grinding pad. The structural design of the present invention can at least achieve the following technical effects.

[0043] 1. After the wafer polishing pad product is formed, open the mold cover, the wafer polishing pad product and the mold core can be automatically separated from the mold cover, and the mold can be pried open with a pry bar without cooling. The operation is simple and convenient, with high safety and efficiency.

[0044] 2. The ejection fixture can eject the wafer polishing pad product and the mold core without manual removal of the wafer polishing pad product and the mold core. The operation is simple and convenient, with high safety and efficiency.

[0045] 3. After the wafer polishing pad is removed, production can continue, with high speed and efficiency.

[0046] 4. When optimizing the local structure of the wafer polishing pad (for example, adding a ring-shaped convex portion, partially increasing the thickness of the wafer polishing pad, etc.), a certain mold core can be modified without the need to remake the entire mold, which can save design and production costs.

[0047] Correspondingly, the size of the gap between the mold core and the adjacent components can be controlled by changing the size of the mold core (such as thickness), thereby achieving adjustment of the wafer grinding pad.

[0048] 5. The mold core can be made into a split splicing structure as needed, which is convenient for disassembly and assembly, and also conducive to local modification / repair / replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The drawings of the present invention are intended to illustrate the general characteristics of the methods, structures and / or materials used in specific exemplary embodiments of the present invention, and to supplement the description in the specification. However, the drawings of the present invention are schematic diagrams not drawn to scale, and thus may not accurately reflect the precise structure or performance characteristics of any given embodiment, and the drawings of the present invention should not be interpreted as limiting or restricting the range of values ​​or properties covered by the exemplary embodiments of the present invention. The present invention is further described in detail below in conjunction with the drawings and specific embodiments.

[0050] Figure 1 It is a schematic diagram of the cross-sectional structure of the mold of the present invention.

[0051] Figure 2 It is a schematic cross-sectional view of the wafer polishing pad of the present invention.

[0052] Description of reference numerals:

[0053] Mold base 1;

[0054] recess 1.1;

[0055] First step structure 1.2;

[0056] Second step structure 1.3;

[0057] The third step structure 1.4;

[0058] First annular groove 1.5;

[0059] The first mold core 2;

[0060] Fourth step structure 2.1;

[0061] Fifth step structure 2.2;

[0062] Second annular groove 2.3;

[0063] The second mold core 3;

[0064] Mould cover 4;

[0065] cover 4.1;

[0066] The third mold core 5;

[0067] The third annular groove 5.1;

[0068] The fourth mold core 6;

[0069] Fourth annular groove 6.1;

[0070] The fifth mold core 7;

[0071] The sixth mold core 8;

[0072] Sixth step structure 8.1;

[0073] The seventh step structure is 8.2;

[0074] fifth annular groove 8.3;

[0075] The seventh mold core 9;

[0076] A first annular protrusion 10 of the wafer grinding pad;

[0077] A second annular protrusion 11 of the wafer grinding pad;

[0078] A third annular protrusion 12 of the wafer polishing pad;

[0079] A fourth annular protrusion 13 of the wafer polishing pad;

[0080] The fifth annular protrusion 14 of the wafer polishing pad. DETAILED DESCRIPTION

[0081] The following is an explanation of the embodiments of the present invention by specific specific embodiments, and those skilled in the art can fully understand other advantages and technical effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through different specific embodiments, and the details in this specification can also be applied based on different viewpoints, and various modifications or changes can be made without deviating from the general design concept of the invention. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. The following exemplary embodiments of the present invention can be implemented in a variety of different forms and should not be interpreted as being limited to the specific embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present invention thorough and complete, and to fully convey the technical solutions of these exemplary specific embodiments to those skilled in the art. It should be understood that when an element is referred to as "connected" or "coupled" to another element, the element can be directly connected or coupled to another element, or there can be an intermediate element. The difference is that when an element is referred to as "directly connected" or "directly coupled" to another element, there is no intermediate element. In all figures, the same reference numerals always represent the same element. As used herein, the term "and / or" includes any combination and all combinations of one or more related listed items. Other words used to describe the relationship between elements or layers should be interpreted in a like fashion (eg, “between” versus “directly between,” “adjacent” versus “directly adjacent,” “on” versus “directly on,” etc.).

[0082] First embodiment, reference Figure 1 As shown, the present invention provides a wafer polishing pad manufacturing mold, which is described below with the side close to the geometric center of the mold as the inner side and the side away from the geometric center of the mold as the outer side, including: a mold base 1, a first mold core 2, a second mold core 3, a third mold core 5, a fourth mold core 6, a fifth mold core 7, a sixth mold core 8, a seventh mold core 9 and a mold cover 4;

[0083] The mold base 1 is covered on the mold cover 4, a mold cavity is formed between the mold base 1 and the mold cover 4, a first mold core 2, a second mold core 3, a third mold core 5, a fourth mold core 6, a fifth mold core 7, a sixth mold core 8 and a seventh mold core 9 are installed in the mold cavity, and the mold cavity is divided into a plurality of gaps connected to each other, and the gaps are used to inject the manufacturing material of the wafer grinding pad;

[0084] The first mold core 2, the second mold core 3, the third mold core 5, the fourth mold core 6, the fifth mold core 7, the sixth mold core 8 and the seventh mold core 9 are all formed into an annular body;

[0085] The first mold core 2 is arranged between the upper wall of the mold base 1 and the periphery of the lower wall of the mold cover 4;

[0086] The second mold core 3 is arranged between the upper wall of the first mold core 2 and the lower wall of the mold cover 4;

[0087] The third mold core 5 is arranged between the upper wall of the mold base 1, the upper wall of the first mold core 2, the inner wall of the first mold core 2 and the lower wall of the fourth mold core 6, and there is a gap between the third mold core 5 and the upper wall of the first mold core 2, the inner wall of the first mold core 2 and the lower wall of the fourth mold core 6;

[0088] The fourth mold core 6 is arranged between the lower wall of the mold cover 4, the inner wall of the second mold core 3, the upper wall of the third mold core 5, the inner wall of the third mold core 5, the lower wall of the fifth mold core 7 and the outer wall of the sixth mold core 8, and there is a gap between the fourth mold core 6 and the lower wall of the mold cover 4, the inner wall of the second mold core 3, the upper wall of the third mold core 5, and the lower wall of the fifth mold core 7;

[0089] The fifth mold core 7 is arranged between the lower wall of the mold cover 4, the upper wall of the fourth mold core 6 and the upper wall of the sixth mold core 8, and there is a gap between the fifth mold core 7 and the lower wall of the mold cover 4 and the upper wall of the fourth mold core 6, and there is a gap between the fifth mold core 7 and a part of the upper wall adjacent to a part of the sixth mold core 8;

[0090] The sixth mold core 8 is arranged between the lower wall of the mold cover 4, the inner side wall of the fourth mold core 6, the side wall of the fifth mold core 7, the lower wall of the fifth mold core 7, the side wall of the seventh mold core 9 and the upper wall of the mold base 1, and there is a gap between the sixth mold core 8 and the lower wall of the mold cover 4, the side wall of the fifth mold core 7, a part of the lower wall adjacent to a part of the fifth mold core 7, the side wall of the seventh mold core 9 and a part of the upper wall adjacent to a part of the mold base 1;

[0091] The seventh mold core 9 is arranged in the concave portion 1.1 at the center of the mold base 1, and is located between the upper wall of the mold base 1, the lower wall of the mold cover 4 and the inner wall of the sixth mold core 8, and there is a gap between the seventh mold core 9 and the lower wall of the mold cover 4 and the inner wall of the sixth mold core 8;

[0092] The gaps are interconnected to form a cavity, and the cavity is used to inject materials to form a wafer grinding pad.

[0093] It should be noted that the main improvement of the present invention is to improve the defects of the prior art by designing multiple combined mold cores, and further, at least one mold core can be designed as a split structure, thereby further optimizing and improving the defects of the prior art. That is to say, as long as the first mold core, the second mold core, the third mold core, the fourth mold core, the fifth mold core, the sixth mold core and the seventh mold core of the present invention can be formed into an annular body (regardless of whether they are in a split combination form), the first mold core, the second mold core, the third mold core, the fourth mold core, the fifth mold core, the sixth mold core and the seventh mold core, together with the mold base and the mold cover, form a gap to provide the cavity required for forming the wafer grinding pad, and it is not necessary to limit the specific structure or combination form of the first mold core, the second mold core, the third mold core, the fourth mold core, the fifth mold core, the sixth mold core and the seventh mold core.

[0094] Continue to refer Figure 1 As shown, the present invention provides a preferred solution for each mold core, and the preferred solution is to provide a better solution, which should not be understood as a limitation on the specific structure of each mold core. Accordingly, the same function / purpose as the preferred solution described below can also be achieved through a more complex mold core combination or mold core shape combination, but the technology is more complex and the implementation effect is poorer than that of the solution provided. Furthermore, in this embodiment, it is clearly stated that only the position where the gap is formed has a gap, and it is not clearly stated that the position where the gap is formed is in contact with each other by default.

[0095] Preferably, the mold base 1 has a concave portion 1.1 formed at its center, and a first step structure 1.2, a second step structure 1.3 and a third step structure 1.4 are sequentially formed around the concave portion 1.1 from inside to outside, which are used to carry each mold core;

[0096] The first annular groove 1.5 is formed on the top of the first stepped structure 1.2.

[0097] Preferably, the first mold core 2 is covered on the third step structure 1.4 on the periphery of the mold base 1, and has a fourth step structure 2.1 and a fifth step structure 2.2 formed in sequence toward the center direction of the mold base 1;

[0098] The second annular groove 2 . 3 is formed on the fifth step structure 2 . 2 , close to the third mold core 5 .

[0099] Preferably, the second mold core 3 has a rectangular cross section, and is covered on the fourth step structure 2.1, and its inner side wall slightly protrudes from the inner side wall of the upper part of the fifth step structure 2.2 and also slightly protrudes from the cover 4.1;

[0100] The mold cover 4 has a lower wall edge formed with an annular cover portion 4.1, and the cover portion 4.1 is mounted on the top of the first mold core 2 and the second mold core 3.

[0101] Preferably, the third mold core 5 has an L-shaped cross section, the top surface of the L-shaped short side of the third mold core 5 is covered on the second step structure 1.3, the side surface of the L-shaped short side of the third mold core 5 is adjacent to the fifth step structure 2.2, the L-shaped long side of the third mold core 5 is covered on the fifth step structure 2.2 and there is a gap between the fifth step structure 2.2, and the side surface of the L-shaped long side is adjacent to the fifth step structure 2.2 and the second mold core 3 and there is a gap;

[0102] The third annular groove 5 . 1 is formed at the top of the L-shaped long side of the third mold core 5 , close to the fourth mold core 6 .

[0103] Preferably, the fourth mold core 6 is approximately in a horizontal Z shape, the outer side wall of the first vertical portion is adjacent to the side wall of the second mold core 3 with a gap, the inner side wall of the first vertical portion is adjacent to the fifth mold core 7 with a gap, the top wall of the first vertical portion is adjacent to the mold cover 4 with a gap, the top wall of the horizontal portion is adjacent to the fifth mold core 7 with a gap, the bottom wall of the horizontal portion is adjacent to the third mold core 5 with a gap, and the second vertical portion is in contact with the mold base 1, the fifth mold core 7 and the sixth mold core 8;

[0104] The fourth annular groove 6 . 1 is formed on the top of the horizontal portion of the fourth mold core 6 .

[0105] Preferably, the fifth mold core 7 is formed as an annular body, which is located between the mold cover 4, the fourth mold core 6 and the sixth mold core 8, and its horizontal portion is respectively adjacent to the mold cover 4, the horizontal portion of the fourth mold core 6 and the seventh step structure 8.2 of the sixth mold core 8 with a gap, and its convex portion is inserted between the fourth mold core 6 and the sixth mold core 8 and forms contact;

[0106] Preferably, the sixth mold core 8, whose bottom wall cover is mounted on the first step structure 1.2 and the second step structure 1.3 of the mold base 1, whose top wall is adjacent to the mold cover 4 and a gap is formed, the sixth step structure 8.1 of the top wall of the sixth mold core 8 is adjacent to the horizontal part of the fifth mold core 7 to form a gap, and the seventh step structure 8.2 of the top wall of the sixth mold core 8 is in contact with the convex part of the fifth mold core 7;

[0107] The fifth annular groove 8 . 3 is formed on the sixth step structure 8 . 1 of the sixth mold core 8 , close to the convex portion of the fifth mold core 7 .

[0108] Preferably, the seventh mold core 9 is inserted into the recess 1.1, with a portion of its top wall and side wall in contact with the recess 1.1, another portion of its side wall formed as an inclined wall adjacent to the sixth mold core 8 and forming a gap, and its top wall adjacent to the mold cover 4 and forming a gap.

[0109] In the above embodiment, at least the second mold core 3 is formed into a split splicing structure, for example, the second mold core 3 is equally divided into 2 to 5 sub-mold cores that can be split or spliced.

[0110] In a second embodiment, the present invention provides a method for manufacturing a wafer polishing pad. When executing production, the wafer polishing pad manufacturing mold described in the first embodiment is used, and the method includes the following steps:

[0111] S1, sequentially install the first mold core 2, the third mold core 5, the fourth mold core 6, the fifth mold core 7, the sixth mold core 8 and the seventh mold core 9, and the second mold core 3 on the mold base 1;

[0112] S2, injecting material, rubber or silicone into the cavity, and covering the mold cover 4 to form a wafer grinding pad by die casting;

[0113] S3, open the mold cover 4 and disassemble the second mold core 3;

[0114] Further explanation, when the mold cover 4 is opened after molding, the mold cover 4 will lift the wafer polishing pad and each mold core at the same time due to vacuum and tension adsorption. At this time, the second mold core 3 is fixed on the first mold core 2 and the second mold core 3 will press the wafer polishing pad, so the wafer polishing pad and each mold core will be fixed on the first mold core 2. The mold cores will be removed one by one later to solve the problem that the wafer polishing pad and the mold core will be adhered to the mold cover 4 at the same time and cannot be removed;

[0115] S4, the first mold core 2 is opened upward, and the third mold core 5, the fourth mold core 6, the fifth mold core 7, the sixth mold core 8 and the seventh mold core 9 are separated from the wafer grinding pad, and then the third mold core 5, the fourth mold core 6, the fifth mold core 7, the sixth mold core 8 and the seventh mold core 9 are disassembled one by one in sequence to obtain the wafer grinding pad;

[0116] S5, return to step S1 to cycle production.

[0117] In addition, it should also be understood that, although the terms "first", "second", etc. may be used here to describe different elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of exemplary embodiments of the present invention, the first element, component, region, layer or part discussed below may also be referred to as the second element, component, region, layer or part.

[0118] In the third embodiment, the present invention provides a wafer polishing pad, which is made by using the wafer polishing pad making mold described in the first embodiment, and its cross section is referenced to Figure 2 As shown;

[0119] In order to understand the corresponding relationship between the mold and the wafer polishing pad, further reference Figure 2 As shown, the first annular protrusion 10 of the wafer grinding pad corresponds to the second annular groove 2.3 of the mold, the second annular protrusion 11 of the wafer grinding pad corresponds to the third annular groove 5.1 of the mold, the third annular protrusion 12 of the wafer grinding pad corresponds to the fourth annular groove 6.1 of the mold, the fourth annular protrusion 13 of the wafer grinding pad corresponds to the fifth annular groove 8.3 of the mold, and the fifth annular protrusion 14 of the wafer grinding pad corresponds to the first annular groove 1.5 of the mold.

[0120] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will also be understood that, unless expressly defined herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and not interpreted in an ideal or overly formal sense.

[0121] The present invention has been described in detail above through specific implementation modes and embodiments, but these do not constitute limitations of the present invention. Without departing from the principles of the present invention, those skilled in the art may also make many variations and improvements, which should also be regarded as the protection scope of the present invention.

Claims

1. A wafer polishing pad manufacturing mold, characterized in that: include: A mold base (1), a first mold core (2), a second mold core (3), a third mold core (5), a fourth mold core (6), a fifth mold core (7), a sixth mold core (8), a seventh mold core (9), and a mold cover (4); The mold base (1) is mounted on the mold cover (4), a mold cavity is formed between the mold base (1) and the mold cover (4), a first mold core (2), a second mold core (3), a third mold core (5), a fourth mold core (6), a fifth mold core (7), a sixth mold core (8) and a seventh mold core (9) are mounted in the mold cavity, and the mold cavity is divided into a plurality of gaps connected to each other, wherein the gaps are used to inject manufacturing materials of the wafer grinding pad; A mold base (1) having a concave portion (1.1) formed at the center thereof, and a first step structure (1.2), a second step structure (1.3) and a third step structure (1.4) formed in sequence from the inside to the outside around the concave portion (1.1), which are used to support each mold core; A first annular groove (1.5) formed on the top of the first step structure (1.2); The first mold core (2), the second mold core (3), the third mold core (5), the fourth mold core (6), the fifth mold core (7), the sixth mold core (8) and the seventh mold core (9) are all formed into an annular body; A first mold core (2) is arranged between the upper wall of the mold base (1) and the periphery of the lower wall of the mold cover (4); the first mold core (2) is covered on a third step structure (1.4) on the periphery of the mold base (1), and a fourth step structure (2.1) and a fifth step structure (2.2) are sequentially formed toward the center direction of the mold base (1); a second annular groove (2.3) formed on the fifth step structure (2.2); The second mold core (3) is arranged between the upper wall of the first mold core (2) and the lower wall of the mold cover (4); the second mold core (3) has a rectangular cross section and the cover is mounted on the fourth step structure (2.1); A mold cover (4), the lower wall edge of which is formed with an annular cover portion (4.1), the cover portion (4.1) being mounted on the top of the first mold core (2) and the second mold core (3); The third mold core (5) is arranged between the upper wall of the mold base (1), the upper wall of the first mold core (2), the side wall of the first mold core (2) and the lower wall of the fourth mold core (6), and there is a gap between the third mold core (5) and the upper wall of the first mold core (2), the side wall of the first mold core (2) and the lower wall of the fourth mold core (6); The fourth mold core (6) is arranged between the lower wall of the mold cover (4), the side wall of the second mold core (3), the upper wall of the third mold core (5), the side wall of the third mold core (5), the lower wall of the fifth mold core (7) and the side wall of the sixth mold core (8), and there is a gap between the fourth mold core (6) and the lower wall of the mold cover (4), the side wall of the second mold core (3) and the lower wall of the fifth mold core (7); The fifth mold core (7) is arranged between the lower wall of the mold cover (4), the upper wall of the fourth mold core (6) and the upper wall of the sixth mold core (8); a gap is provided between the fifth mold core (7) and the lower wall of the mold cover (4) and the upper wall of the fourth mold core (6); and a gap is provided between the fifth mold core (7) and a portion of the upper wall adjacent to the sixth mold core (8); The sixth mold core (8) is arranged between the lower wall of the mold cover (4), the side wall of the fourth mold core (6), the side wall of the fifth mold core (7), the lower wall of the fifth mold core (7), the side wall of the seventh mold core (9) and the upper wall of the mold base (1); a gap is formed between the sixth mold core (8) and the lower wall of the mold cover (4), the side wall of the fifth mold core (7), a portion of the lower wall adjacent to the fifth mold core (7), the side wall of the seventh mold core (9) and a portion of the upper wall adjacent to the mold base (1); The seventh mold core (9) is arranged in a recessed portion (1.1) at the center of the mold base (1), and is located between the upper wall of the mold base (1), the lower wall of the mold cover (4) and the side wall of the sixth mold core (8), and there is a gap between the seventh mold core (9) and the lower wall of the mold cover (4) and the side wall of the sixth mold core (8); The gaps are interconnected to form a cavity, and the cavity is used to inject materials to form a wafer grinding pad.

2. The wafer polishing pad manufacturing mold according to claim 1, characterized in that: The third mold core (5) has an L-shaped cross section, the top surface of the L-shaped short side is mounted on the second step structure (1.3), the side surface of the L-shaped short side is adjacent to the fifth step structure (2.2), the long side of the L-shaped is mounted on the fifth step structure (2.2) and there is a gap between the fifth step structure (2.2), and the side surface of the L-shaped long side is adjacent to the fifth step structure (2.2) and the second mold core (3) and there is a gap; A third annular groove (5.1) is formed at the top of the L-shaped long side of the third mold core (5).

3. The wafer polishing pad manufacturing mold according to claim 1, characterized in that: The fourth mold core (6) has a first vertical portion side wall adjacent to the second mold core (3) side wall with a gap therebetween, a first vertical portion side wall adjacent to the fifth mold core (7) with a gap therebetween, a first vertical portion top wall adjacent to the mold cover (4) with a gap therebetween, a horizontal portion top wall adjacent to the fifth mold core (7) with a gap therebetween, a horizontal portion bottom wall adjacent to the third mold core (5) with a gap therebetween, and a second vertical portion in contact with the mold base (1), the fifth mold core (7) and the sixth mold core (8); A fourth annular groove (6.1) is formed on the top of the horizontal portion of the fourth mold core (6).

4. The wafer polishing pad manufacturing mold according to claim 1, characterized in that: The fifth mold core (7) is formed as an annular body and is located between the mold cover (4), the fourth mold core (6) and the sixth mold core (8). Its horizontal portion is respectively adjacent to the mold cover (4), the horizontal portion of the fourth mold core (6) and the seventh step structure (8.2) of the sixth mold core (8) with a gap therebetween, and its convex portion is inserted between the fourth mold core (6) and the sixth mold core (8) to form contact therewith.

5. The wafer polishing pad manufacturing mold according to claim 1, characterized in that: A sixth mold core (8), whose bottom wall cover is mounted on the first step structure (1.2) and the second step structure (1.3) of the mold base (1), whose top wall is adjacent to the mold cover (4) and a gap is formed therebetween, whose sixth step structure (8.1) of the top wall is adjacent to the horizontal portion of the fifth mold core (7) and a gap is formed therebetween, and whose seventh step structure (8.2) of the top wall is in contact with the convex portion of the fifth mold core (7); A fifth annular groove (8.3) is formed on the sixth step structure (8.1) of the sixth mold core (8).

6. The wafer polishing pad manufacturing mold according to claim 1, characterized in that: The seventh mold core (9) is inserted into the recess (1.1), with a portion of its top wall and side wall in contact with the recess (1.1), another portion of its side wall formed as an inclined wall adjacent to the sixth mold core (8) and forming a gap, and a top wall adjacent to the mold cover (4) and forming a gap.

7. The wafer polishing pad manufacturing mold according to any one of claims 1 to 6, characterized in that: At least the second mold core (3) is formed as a split splicing structure.

8. A method for manufacturing a wafer polishing pad, characterized in that: When executing production, a mold is made using the wafer grinding pad according to any one of claims 1 to 6, comprising the following steps: S1, sequentially installing the first mold core (2), the third mold core (5), the fourth mold core (6), the fifth mold core (7), the sixth mold core (8), the seventh mold core (9) and the second mold core (3) on the mold base (1); S2, injecting material into the cavity, and covering it with a mold cover (4) to form a wafer grinding pad by die casting; S3, opening the mold cover (4) and disassembling the second mold core (3); S4, the first mold core (2) is opened upwards, and the third mold core (5), the fourth mold core (6), the fifth mold core (7), the sixth mold core (8) and the seventh mold core (9) are separated from the wafer grinding pad, and then the third mold core (5), the fourth mold core (6), the fifth mold core (7), the sixth mold core (8) and the seventh mold core (9) are disassembled one by one in sequence to obtain the wafer grinding pad; S5, return to step S1 to cycle production.

9. A wafer polishing pad, characterized in that: The wafer grinding pad is manufactured by using the wafer grinding pad manufacturing mold described in any one of claims 1 to 6.

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