A packaged diode aging test fixture

Abstract

The present invention relates to the technical field related to packaged diode aging test, and discloses a packaged diode aging test fixture. The present invention cools the air in an aging test box by setting a semiconductor refrigeration sheet, and when a rotating clamping block rotates to a horizontal position, air on both sides of the semiconductor clamping plate communicates with each other, and at the same time, a heat insulation baffle at a heat dissipation port is moved to above a hot surface heat exchanger to prevent heat from entering the aging test box, so that the semiconductor refrigeration sheet can actively cool the packaged semiconductors clamped on both sides of the rotating clamping block. Compared with traditional convection heat dissipation and conduction heat dissipation, the heat dissipation efficiency is higher, and it is not affected by the external temperature, and the applicability is wider. At the same time, it can also improve a variety of different test conditions to achieve multiple uses of one device.

Description

Technical Field

[0001] The invention relates to the technical field related to packaged diode aging test, and in particular to a packaged diode aging test fixture. Background Art

[0002] Packaged diode aging test is a common test method used to evaluate the reliability and life of diodes. In this test, the diode is placed under certain temperature and current conditions for a long time to simulate the aging and failure process in actual use.

[0003] Since the aging test of packaged diodes is usually carried out in batches, in order to save space, a large number of packaged diodes are densely arranged in the fixture, which generates a lot of heat when the power is turned on for the test. The accumulation of heat will cause damage to the test device. At the same time, traditional packaged diode aging test equipment is difficult to provide different test temperatures to test the aging of packaged diodes at different temperatures. Therefore, when conducting extreme working condition tests, it can only be carried out in a constant temperature box, which makes the test operation complicated and the cost increased. At the same time, when conducting hot and cold alternating working condition tests, traditional semiconductor aging tests need to switch from heating to cooling or from cooling to heating when switching between hot and cold environments. Therefore, it takes a lot of buffer time to reach the test temperature, affecting the test efficiency. Summary of the invention

[0004] The object of the present invention is to provide a packaged diode aging test fixture to solve the problems of poor heat dissipation and difficulty in active temperature control in the conventional packaged diode aging test fixture mentioned in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a packaged diode aging test fixture, including an aging test box, a semiconductor clamping plate is arranged above the aging test box, the semiconductor clamping plate is used to separate the cold and hot areas to improve different working conditions, one side of the semiconductor clamping plate is movably connected to a cold surface sealing cover through a hinge, and the other side of the semiconductor clamping plate is movably connected to a hot surface sealing cover through a hinge, the cold surface sealing cover and the hot surface sealing cover are used for sealing and heat insulation to provide a constant temperature space, and four groups of devices for making low temperature and high temperature are vertically installed below the semiconductor clamping plate. A semiconductor refrigeration plate, a cold surface heat exchanger is arranged on one side of the semiconductor refrigeration plate, and a hot surface heat exchanger is arranged on the other side of the semiconductor refrigeration plate, the cold surface heat exchanger and the hot surface heat exchanger are used to strengthen the heat exchange between the cold and hot surfaces of the semiconductor refrigeration plate and the air, and improve the efficiency of heating or cooling. The semiconductor clamping plate is densely provided with test unit slots, and a rotating clamping block is arranged in the test unit slot. A semiconductor clamping mechanism for clamping the packaged semiconductor is arranged on the rotating clamping block, and the semiconductor clamping mechanism is driven by a clamping drive mechanism to perform a clamping action.

[0006] Furthermore, the cold surfaces of the semiconductor refrigeration plates are closely attached to the cold surface heat exchangers, and the hot surfaces of the semiconductor refrigeration plates are closely attached to the hot surface heat exchangers. The cold surface heat exchangers and the hot surface heat exchangers are both made of die-cast aluminum.

[0007] Furthermore, semiconductor clamping mechanisms are provided on both sides of the rotating clamping block, and the semiconductor clamping mechanisms include a fixed clamping block, a group of movable clamping blocks are provided on each side of the fixed clamping block, and metal contacts for connecting electricity are provided on the inner sides of the fixed clamping block and the movable clamping block.

[0008] Furthermore, the eight groups of rotating clamping blocks in each horizontal row on the semiconductor clamping plate are movably connected through an electrically connected rotating shaft, one end of the electrically connected rotating shaft is fixedly connected to a first gear through a keyway, the first gear is meshed with a second gear, a servo motor is fixedly installed on one side of the semiconductor clamping plate, and the second gear is fixedly installed on the output end of the servo motor through a keyway.

[0009] Furthermore, the clamping drive mechanism includes a driving gear, which is sleeved on the electrically connected rotating shaft, and two groups of transmission gears are meshed in sequence on the upper and lower sides of the driving gear, and a group of bidirectional screw rods are movably installed on the upper and lower sides of the rotating clamping block, and a driven gear is fixedly connected in the middle of the bidirectional screw rod, and the transmission gear and the driven gear are meshed with each other, and screw nuts are provided at both ends of the bidirectional screw rod, and a limiting groove is provided on the outer wall of the rotating clamping block, and the screw nut passes through the limiting groove and is fixedly connected to the movable clamping block.

[0010] Furthermore, a spring ball pin parallel to the power-connected rotating shaft is provided on one side of the rotating clamping block, a ball groove engaged with the spring ball pin is provided on the inner wall of the test unit groove, and a threaded plug is provided on the inner side of the spring ball pin.

[0011] Furthermore, five groups of servo motors are provided, and the five groups of servo motors are all located on the same side of the semiconductor clamping plate, and the servo motors and the cold surface heat exchanger are located on the same side, and are all on the cold surface of the semiconductor refrigeration plate.

[0012] Furthermore, the first gear is located in a gear groove on the semiconductor mounting plate, the diameter of the first gear is smaller than the thickness of the semiconductor mounting plate, and the gear groove is sealed on the hot surface side close to the semiconductor cooling plate.

[0013] Furthermore, the aging test box has a heat dissipation port on one side of the hot surface heat exchanger, a heat insulation baffle is provided at the heat dissipation port, a spring buckle is provided on the heat insulation baffle, and first slots are provided on the upper and lower sides of the heat dissipation port.

[0014] Furthermore, the size of the heat insulation barrier strip is consistent with the slot opening where the hot surface heat exchanger is located, and a second slot is provided at the slot opening where the hot surface heat exchanger is located.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The present invention cools the air in the aging test box by setting a semiconductor refrigeration sheet. When the rotating clamping block rotates to a horizontal position, the air on both sides of the semiconductor clamping plate communicates with each other. At the same time, the heat insulation baffle at the heat dissipation port is moved to above the hot surface heat exchanger to prevent heat from entering the aging test box. Therefore, the semiconductor refrigeration sheet can actively cool the packaged semiconductors clamped on both sides of the rotating clamping block. Compared with traditional convection heat dissipation and conduction heat dissipation, the heat dissipation efficiency is higher, it is not affected by the external temperature, and has a wider applicability.

[0017] In addition, when extreme temperature tests are required on semiconductors, the thermal insulation strip above the hot surface heat exchanger can be moved to the heat dissipation port, and the rotating clamping block can be rotated to a vertical state to seal the test unit slot, so that the two sides of the semiconductor clamping plate are not connected to each other. This allows one side of the semiconductor clamping plate to heat up and the other side to cool down, thereby facilitating testing under different temperature conditions.

[0018] The orientation of the semiconductor can also be adjusted by rotating the rotating clamping block to realize aging testing of the semiconductor in a hot and cold alternating environment, achieving multiple uses of one device and saving test costs. In addition, in this solution, the semiconductor does not have to wait for the test temperature to change from high temperature to low temperature or from low temperature to high temperature during the hot and cold alternating conversion, which greatly improves the test efficiency.

[0019] Moreover, the cooperation between the semiconductor clamping mechanism and the clamping drive mechanism makes it easy for the clamp to clamp a large number of semiconductors synchronously. After the semiconductor is placed between the fixed clamping block and the movable clamping block, the servo motor drives the powered rotating shaft to rotate, which can drive the movable clamping block mechanism to clamp the semiconductor through gear transmission and screw transmission. Then, the powered rotating shaft continues to rotate to disengage the spring ball pin from the ball groove, and the rotating clamping block can be freely rotated to adjust the direction of the semiconductor. When the semiconductor needs to be removed, the servo motor can release all the semiconductors synchronously, which is simple to operate.

[0020] The duration of semiconductor aging test can last from several hours to several months, or even more than one year. In this scheme, the servo motor can periodically drive the rotary clamping block to rotate. Every time the rotary clamping block rotates 90 degrees, the spring ball pin will experience a process of entering and leaving the ball slot, that is, the ball slot is used to re-preload the resistance of the spring ball pin, thereby utilizing the rotation of the rotary clamping block to achieve continuous supplementation of the clamping preload force, avoiding the clamping force change caused by thermal expansion and contraction caused by artificially simulated hot and cold alternations or natural morning and dusk seasons in long process tests, resulting in poor contact of the semiconductor, power outages, and even semiconductor falling off. The threaded plug can also be used to adjust the resistance of the ball slot to the spring ball pin, that is, the size of the clamping preload force can be adjusted to adapt to the clamping needs of different semiconductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the hot surface structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the cold noodle structure of the present invention;

[0023] Figure 3 This is a schematic diagram of the heat insulation barrier structure of the present invention;

[0024] Figure 4 This is a schematic diagram of the transmission structure of the rotary clamping block of the present invention;

[0025] Figure 5 For the present invention Figure 4 The enlarged structural diagram at A in the middle;

[0026] Figure 6 This is a schematic cross-sectional view of the rotary clamping block of the present invention;

[0027] Figure 7 This is a schematic diagram of the heat dissipation port structure of the present invention;

[0028] Figure 8 It is a schematic diagram of the distribution structure of the cold surface heat exchanger and the hot surface heat exchanger of the present invention;

[0029] Fig. 9 It is a schematic diagram of the structure of the clamping drive mechanism of the present invention;

[0030] Fig.10 It is a schematic diagram of the cross-sectional structure of the test unit tank of the present invention.

[0031] Numbers in the figure: 1, aging test box; 2, semiconductor clamping plate; 3, cold surface sealing cover; 4, hot surface sealing cover; 5, semiconductor cooling plate; 6, cold surface heat exchanger; 7, hot surface heat exchanger; 8, test unit slot; 9, rotating clamping block; 10, semiconductor clamping mechanism; 1001, fixed clamping block; 1002, movable clamping block; 1003, metal contact sheet; 11, clamping drive mechanism; 1101, driving gear; 1102, transmission Gear; 1103, bidirectional lead screw; 1104, driven gear; 1105, lead screw nut; 1106, limit slot; 1107, spring ball pin; 1108, ball slot; 1109, threaded plug; 12, electric rotating shaft; 13, first gear; 14, second gear; 15, servo motor; 16, gear slot; 17, heat dissipation port; 18, heat insulation baffle; 19, spring buckle; 20, first slot; 21, second slot. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In order to further understand the content of the present invention, the present invention is described in detail in conjunction with the accompanying drawings.

[0034] See also Figure 1 , Figure 2 and Figure 8 A packaged diode aging test fixture comprises an aging test box 1, a semiconductor mounting plate 2 is arranged above the aging test box 1, a cold surface sealing cover 3 is movably connected to one side of the semiconductor mounting plate 2 through a hinge, and a hot surface sealing cover 4 is movably connected to the other side of the semiconductor mounting plate 2 through a hinge. The cold surface sealing cover 3 and the hot surface sealing cover 4 are rotated through hinges and fastened to both sides of the semiconductor mounting plate 2 through buckles to achieve sealing of the aging test box 1. Four groups of semiconductor refrigeration plates 5 are vertically installed below the semiconductor mounting plate 2. The model of the semiconductor refrigeration plate 5 is TEC1-12710. A cold surface heat exchanger 6 is arranged on one side of the semiconductor refrigeration plate 5, and a hot surface heat exchanger 7 is arranged on the other side of the semiconductor refrigeration plate 5. The cold surface heat exchanger 6 and the hot surface heat exchanger 7 are both made of die-cast aluminum, which can effectively conduct heat. The cold surfaces of the semiconductor refrigeration plates 5 are tightly attached to the cold surface heat exchanger 6, and the hot surfaces of the semiconductor refrigeration plates 5 are tightly attached to the hot surface heat exchanger 7, so that the heat of the cold surface heat exchanger 6 is transferred to the hot surface heat exchanger 7, thereby realizing cooling on one side of the cold surface heat exchanger 6 and heating on one side of the hot surface heat exchanger 7.

[0035] See also Figure 1-Figure 10The semiconductor clamping plate 2 is densely provided with test unit slots 8, and a rotating clamping block 9 is arranged in the test unit slot 8. A semiconductor clamping mechanism 10 is arranged on the rotating clamping block 9. Semiconductor clamping mechanisms 10 are arranged on both sides of the rotating clamping block 9. The semiconductor clamping mechanism 10 includes a fixed clamping block 1001, and a group of movable clamping blocks 1002 are arranged on both sides of the fixed clamping block 1001. Metal contacts 1003 for power connection are arranged on the inner sides of the fixed clamping block 1001 and the movable clamping block 1002, so that each rotating clamping block 9 can clamp two packaged semiconductors on both sides for testing. The two packaged semiconductors are redundant specimens to prevent one of the semiconductors from failing. The clamping drive mechanism 11 includes a driving gear 1101, which is sleeved on the electrically connected rotating shaft 12. Two groups of transmission gears 1102 are meshed in sequence on the upper and lower sides of the driving gear 1101. A group of bidirectional screw rods 1103 are movably installed on the upper and lower sides of the rotating clamping block 9. A driven gear 1104 is fixedly connected in the middle of the bidirectional screw rod 1103. The transmission gear 1102 and the driven gear 1104 are meshed with each other. Screw nuts 1105 are provided at both ends of the bidirectional screw rod 1103. A limiting groove 1106 is provided on the outer wall of the rotating clamping block 9. The screw nut 1105 passes through the limiting groove 1106 and is fixedly connected to the movable clamping block 1002.At the same time, a spring ball pin 1107 parallel to the power-connected rotating shaft 12 is provided on one side of the rotating clamping block 9, and a ball groove 1108 engaged with the spring ball pin 1107 is provided on the inner wall of the test unit slot 8. When the servo motor 15 rotates, the second gear 14 can be driven to rotate, and the second gear 14 drives the first gear 13 to rotate through meshing, and the first gear 13 drives the power-connected rotating shaft 12 to rotate. Since the spring ball pin 1107 is engaged in the ball groove 1108, the rotating clamping block 9 cannot rotate, so that the power-connected rotating shaft 12 is rotated. The shaft 12 drives the two-way screw 1103 to rotate by driving the meshing transmission of the driving gear 1101, the two sets of transmission gears 1102 and the driven gear 1104, and then drives the movable clamping block 1002 to move through the cooperation of the two-way screw 1103 and the screw nut 1105. Since the threads at both ends of the two-way screw 1103 face in opposite directions, the two sets of movable clamping blocks 1002 will move towards each other to clamp the semiconductor, and then the movable clamping block 1002 can no longer move, and the driving gear 1101, the two sets of transmission gears 1102 and the driven gear 1104 are meshed. The gear 1102 and the driven gear 1104 can no longer rotate, so the electrically connected rotating shaft 12 will directly apply a rotational torque to the rotating clamping block 9 as a whole. When the rotational torque is greater than the resistance of the ball groove 1108 to the spring ball pin 1107, the spring ball pin 1107 will break away from the ball groove 1108, thereby driving the rotating clamping block 9 to rotate as a whole. At the same time, a threaded plug 1109 is provided on the inner side of the spring ball pin 1107. When the threaded plug 1109 rotates, it can move left and right through the threaded fit, thereby The spring pressure on the spring ball pin 1107 is adjusted. When the spring pressure on the spring ball pin 1107 increases, the resistance of the ball slot 1108 to the spring ball pin 1107 increases. When the spring pressure on the spring ball pin 1107 decreases, the resistance of the ball slot 1108 to the spring ball pin 1107 decreases. The resistance of the ball slot 1108 to the spring ball pin 1107 determines the clamping pre-tightening force of the movable clamping block 1002 and the fixed clamping block 1101, so as to clamp different semiconductors. When the semiconductor needs to be released, the servo motor 15 can reverse and utilize the resistance of the ball slot 1108 to the spring ball pin 1107, and move the movable clamping block 1002 to both sides through the opposite transmission steps to release the semiconductor.

[0036] The eight groups of rotating clamping blocks 9 in each horizontal row on the semiconductor clamping plate 2 are fixedly connected by the power-connected rotating shaft 12, and the eight groups of rotating clamping blocks 9 in each horizontal row have the same angle. The power-connected rotating shaft 12 is fixedly connected to the first gear 13 at one end through a keyway, and the first gear 13 is meshed with the second gear 14. A servo motor 15 is fixedly installed on one side of the semiconductor clamping plate 2, and the second gear 14 is fixedly installed on the output end of the servo motor 15 through a keyway. Therefore, the servo motor 15 can drive the second gear 14 to rotate, and the second gear 14 drives the first gear 13 to rotate through meshing. The rotation of the first gear 13 drives the rotating clamping block 9 to rotate through the power-connected rotating shaft 12 to adjust the orientation of the semiconductors on both sides of the rotating clamping block 9. The first gear 13 is located in the gear groove 16 on the semiconductor clamping plate 2. The diameter of the first gear 13 is smaller than the thickness of the semiconductor clamping plate 2, so that the gear groove 16 can be sealed on the hot side close to the semiconductor cooling plate 5 to prevent the heat on both sides of the semiconductor clamping plate 2 from being exchanged from the gear groove 16.

[0037] The aging test box 1 is provided with a heat dissipation port 17 on one side of the hot surface heat exchanger 7, and a heat insulation baffle 18 is arranged at the heat dissipation port 17, and a spring buckle 19 is arranged on the heat insulation baffle 18. The first card slot 20 is arranged on the upper and lower sides of the heat dissipation port 17. The heat insulation baffle 18 can be fixed at the heat dissipation port 17 by the cooperation of the spring buckle 19 and the first card slot 20 to prevent heat from being lost to the outside. The size of the heat insulation baffle 18 is consistent with the opening of the card slot where the hot surface heat exchanger 7 is located, and a second card slot 21 is arranged at the opening of the card slot where the hot surface heat exchanger 7 is located. In this way, the heat insulation baffle 18 can be fixed above the hot surface heat exchanger 7 by the cooperation of the spring buckle 19 and the second card slot 21, which not only opens the heat dissipation port 17 for external heat dissipation, but also prevents heat from entering the interior of the aging test box 1 upward. In this way, the conversion between the two test conditions can be achieved. When the thermal insulation baffle 18 is installed at the heat dissipation port 17, the heat generated by the hot surface heat exchanger 7 can be transferred upward to one side of the semiconductor mounting plate 2 to achieve heating, while the cold surface heat exchanger 6 can achieve cooling on the other side of the semiconductor mounting plate 2, thereby achieving two completely different working conditions of one side being cold and the other side being hot on both sides of the semiconductor mounting plate 2. The aging conditions of the semiconductor at low and high temperatures can be tested at the same time, and the semiconductor mounting plate 2 can be controlled to rotate by the servo motor 15, so that the semiconductor can be seamlessly switched between cold and hot environments, and the aging conditions of the semiconductor under alternating cold and hot conditions can be tested. When the heat insulation baffle 18 is installed above the hot surface heat exchanger 7, the heat dissipation port 17 is opened, and the heat is dissipated outwardly. The heat insulation baffle 18 will also block the heat from entering the aging test box 1. At this time, the servo motor 15 controls the semiconductor clamping plate 2 to rotate, so that the semiconductor clamping plate 2 rotates to a horizontal state, thereby releasing the test unit slot 8. Heat can be exchanged on both sides of the semiconductor clamping plate 2 through the test unit slot 8, so that both sides of the semiconductor clamping plate 2 will be in a low temperature state, and all semiconductors can be cooled and dissipated to simulate natural aging at room temperature.

[0038] Specifically, the aging test box 1, the semiconductor clamping plate 2, the cold surface sealing cover 3 and the hot surface sealing cover 4 are all made of microporous foamed phenolic plastic. The microporous foamed phenolic plastic material is a plastic material with a tiny pore structure formed by adding a foaming agent and controlling the foaming process on the basis of phenolic. It retains high strength while also having a good heat insulation effect, and can effectively isolate heat exchange. The rotating clamping block 9 is also made of microporous foamed phenolic plastic material, which can prevent heat from being exchanged through the rotating clamping block 9.

[0039] Specifically, the semiconductor clamping mechanism 10 is powered by a rotating electrical connector at one end of the power-connecting rotating shaft 12 for power connection testing of packaged semiconductors, thereby eliminating the need for flying wires to power the packaged semiconductor machine, and the rotation of the rotating clamping block 9 will not affect the normal testing of the packaged semiconductors.

[0040] Specifically, five groups of servo motors 15 are provided, and the five groups of servo motors 15 can respectively control five rows of rotating clamping blocks 9 to rotate separately, so as to adjust different hot and cold conversion cycles of the material for testing. The five groups of servo motors 15 are all located on the same side of the semiconductor clamping plate 2 and on the same side as the cold surface heat exchanger 6, and are all on the cold surface of the semiconductor refrigeration plate 5, so that the servo motors 15 can be cooled at the same time to prevent overheating of the servo motors 15.

[0041] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A packaged diode aging test fixture, comprising an aging test box (1), characterized in that: A semiconductor clamping plate (2) is arranged above the aging test box (1). The semiconductor clamping plate (2) is used to separate the cold and hot areas to improve different working conditions. A cold surface sealing cover (3) is movably connected to one side of the semiconductor clamping plate (2) through a hinge. A hot surface sealing cover (4) is movably connected to the other side of the semiconductor clamping plate (2) through a hinge. The cold surface sealing cover (3) and the hot surface sealing cover (4) are used to seal and insulate to provide a constant temperature space. Four groups of semiconductor cooling plates (5) for manufacturing low and high temperatures are vertically installed below the semiconductor clamping plate (2). A cold surface heat exchanger is arranged on one side of the semiconductor cooling plate (5). The semiconductor cooling plate (5) is provided with a hot surface heat exchanger (7) on the other side thereof, the cold surface heat exchanger (6) and the hot surface heat exchanger (7) are used to strengthen the heat exchange between the cold and hot surfaces of the semiconductor cooling plate (5) and the air, thereby improving the efficiency of heating or cooling; the semiconductor clamping plate (2) is densely provided with test unit slots (8); the test unit slots (8) are provided with a rotating clamping block (9); the rotating clamping block (9) is provided with a semiconductor clamping mechanism (10) for clamping the packaged semiconductor; the semiconductor clamping mechanism (10) is driven by a clamping drive mechanism (11) to perform a clamping action; Both sides of the rotating clamping block (9) are provided with semiconductor clamping mechanisms (10), the semiconductor clamping mechanisms (10) comprising a fixed clamping block (1001), a group of movable clamping blocks (1002) are respectively provided on both sides of the fixed clamping block (1001), and metal contacts (1003) for connecting electricity are provided on the inner sides of the fixed clamping block (1001) and the movable clamping block (1002); The eight groups of rotating clamping blocks (9) in each horizontal row on the semiconductor clamping plate (2) are movably connected via an electric rotating shaft (12); one end of the electric rotating shaft (12) is fixedly connected to a first gear (13) via a keyway; the first gear (13) is meshed with a second gear (14); a servo motor (15) is fixedly mounted on one side of the semiconductor clamping plate (2); and the second gear (14) is fixedly mounted on an output end of the servo motor (15) via a keyway; The clamping drive mechanism (11) comprises a driving gear (1101), the driving gear (1101) being sleeved on an electrically connected rotating shaft (12), the driving gear (1101) being meshed with two groups of transmission gears (1102) on the upper and lower sides in sequence, a group of bidirectional screw rods (1103) being movably mounted on the upper and lower sides of the interior of the rotating clamping block (9), a driven gear (1104) being fixedly connected in the middle of the bidirectional screw rod (1103), the transmission gear (1102) and the driven gear (1104) being meshed with each other, screw rod nuts (1105) being arranged at both ends of the bidirectional screw rod (1103), a limiting groove (1106) being provided on the outer wall of the rotating clamping block (9), the screw rod nut (1105) passing through the limiting groove (1106) and being fixedly connected to the movable clamping block (1002); A spring ball pin (1107) parallel to the power-connected rotating shaft (12) is provided on one side of the rotating clamping block (9), a ball groove (1108) engaged with the spring ball pin (1107) is provided on the inner wall of the test unit groove (8), and a threaded plug (1109) is provided on the inner side of the spring ball pin (1107).

2. The packaged diode aging test fixture according to claim 1, characterized in that: The cold surface of the semiconductor refrigeration plate (5) is in close contact with the cold surface heat exchanger (6), and the hot surface of the semiconductor refrigeration plate (5) is in close contact with the hot surface heat exchanger (7). The cold surface heat exchanger (6) and the hot surface heat exchanger (7) are both made of die-cast aluminum.

3. The packaged diode aging test fixture according to claim 1, characterized in that: Five groups of servo motors (15) are provided, and the five groups of servo motors (15) are all located on the same side of the semiconductor clamping plate (2). The servo motors (15) and the cold surface heat exchanger (6) are located on the same side and are all located on the cold surface of the semiconductor cooling plate (5).

4. The packaged diode aging test fixture according to claim 1, characterized in that: The first gear (13) is located in a gear groove (16) on the semiconductor mounting plate (2); the diameter of the first gear (13) is smaller than the thickness of the semiconductor mounting plate (2); and the gear groove (16) is sealed on a hot surface side close to the semiconductor cooling plate (5).

5. The packaged diode aging test fixture according to claim 1, characterized in that: The aging test box (1) is provided with a heat dissipation port (17) on one side of the hot surface heat exchanger (7); a heat insulation baffle (18) is provided at the heat dissipation port (17); a spring buckle (19) is provided on the heat insulation baffle (18); and first clamping grooves (20) are provided on upper and lower sides of the heat dissipation port (17).

6. A packaged diode aging test fixture according to claim 5, characterized in that: The size of the heat insulation baffle (18) is consistent with the slot opening where the hot surface heat exchanger (7) is located, and a second slot (21) is provided at the slot opening where the hot surface heat exchanger (7) is located.

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