A direct injection circulation flushing device for stripping metal film from wafer surface

Abstract

The invention discloses a direct-spray circulation flushing device for stripping a metal film on a wafer surface, and relates to the technical field of flushing, comprising: a chassis, a rotating door is rotatably mounted on the inner wall of the chassis, a controller is fixedly mounted on the surface of the chassis, an observation window is rotatably mounted on the surface of the chassis, and a filter partition is arranged on the inner wall of the chassis; a pretreatment device, the pretreatment device is arranged inside the chassis, the pretreatment device comprises a flushing nozzle, a water circulation device, a driving device, a hollow box, a placement rack, a rotating rod, a rotating plate, a trapezoidal block, a brush, a sliding rod and a sealing plate, the sliding rod moves toward the placement rack and contacts the trapezoidal block, and the trapezoidal block squeezes the sliding rod to move upward, the flushing nozzle is fixedly mounted on the inner wall of the chassis, and a water circulation device is fixedly mounted on the bottom of the inner wall of the chassis, so that the etching liquid inside the hollow box drips onto the surface of the metal film, thereby loosening it for easy flushing.

Description

Technical Field

[0001] The invention relates to the technical field of flushing, and in particular to a direct-spray circulation flushing device for stripping a metal film on a wafer surface. Background Art

[0002] The direct injection circulation flushing device is a device used to process the surface of wafers in semiconductor manufacturing and related processes, and is mainly used to strip or clean the metal film on the surface of the wafer.

[0003] The patent with the patent announcement number CN220514864U relates to a direct spray circulation flushing device for stripping metal film, including a box, a direct spray nozzle, and a liquid medicine circulation pump; the box is used to carry the direct spray nozzle and place the wafer of the metal film to be stripped at a position opposite to the direct spray nozzle; the direct spray nozzle is movably arranged in a mounting hole on one side of the box, and is used for direct spray flushing of the wafer of the metal film to be stripped placed at a relative position of the box; the liquid medicine circulation pump is arranged outside the box, and the input side is connected to one side of the lower part of the box, and the output side is connected to the direct spray nozzle, and is used for circulating liquid medicine. The patent uses the liquid medicine circulation pump to extract the liquid medicine at the bottom of the box and transport it to the direct spray nozzle. The direct spray nozzle is manually rotated to perform all-round direct spray flushing on the wafer of the metal film to be stripped until the metal film is completely stripped, and then the stripped wafer is removed and replaced with a new wafer of the metal film to be stripped, thereby improving the efficiency of stripping the metal film.

[0004] In the above patent, the liquid medicine at the bottom of the box is extracted by a liquid medicine circulation pump and transported to the direct injection nozzle. The direct injection nozzle is manually rotated to perform all-round direct injection flushing on the wafer with the metal film to be peeled off until the metal film is completely peeled off. After that, the peeled wafer is removed and replaced with a new wafer with the metal film to be peeled off, thereby improving the efficiency of peeling the metal film. However, it is difficult to completely remove the metal film by direct flushing, which may easily cause a small amount of metal film to remain on the wafer, affecting subsequent processing. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a direct injection circulating flushing device for stripping a metal film on a wafer surface, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a direct injection circulation flushing device for stripping metal film on the surface of wafer, comprising: a chassis, a rotating door is rotatably installed on the inner wall of the chassis, a controller is fixedly installed on the surface of the chassis, an observation window is rotatably installed on the surface of the chassis, and a filter baffle is provided on the inner wall of the chassis; a pretreatment device, the pretreatment device is arranged inside the chassis, the pretreatment device includes a flushing nozzle, a water circulation device, a driving device, a hollow box, a placement rack, a rotating rod, a rotating plate, a trapezoidal block, a brush, a sliding rod and a sealing plate, when the sliding rod moves toward the placement rack, it will contact the trapezoidal block, the trapezoidal block will squeeze the sliding rod to move upward, the sliding rod moving upward will drive the sealing plate to move upward, and the sealing plate will be sealed. The upward movement of the sealing plate will open the liquid outlet, the flushing nozzle is fixedly mounted on the inner wall of the chassis, and a water circulation device is fixedly mounted on the bottom of the inner wall of the chassis. The flushing nozzle and the water circulation device are connected by a water pipe, the driving device is fixedly mounted on the top of the filter baffle, the hollow box is fixedly mounted on the output end of the driving device, the placement rack is fixedly mounted on the top of the filter baffle, the rotating rod is rotatably mounted on the top of the filter baffle, the rotating plate is fixedly mounted on the top of the rotating rod, the brush is fixedly mounted on the bottom of the hollow box, the sliding rod slides through the bottom of the hollow box, the sealing plate is fixedly mounted on the top of the sliding rod, and a liquid outlet hole is opened at the bottom of the hollow box. The movement of the hollow box toward the placement rack will drive the brush to move toward the placement rack.

[0007] According to the above technical solution, the sealing plate is arranged above the liquid outlet, a No. 1 torsion spring is arranged between the rotating rod and the filter baffle, and the rotating rod is driven to reset by the No. 1 torsion spring, the trapezoidal block is arranged under the sliding rod, and anti-slip rubber is arranged on the top of the rotating plate to prevent it from being unable to rotate when clamped by the clamping device.

[0008] According to the above technical solution, it also includes a clamping device and a rotating device, wherein the clamping device includes an L-shaped rod, a rotating wheel, a slide plate, an elastic telescopic plate, an arc plate and a roller, and the L-shaped rod is driven to move in the direction close to the placement rack by moving the hollow box in the direction close to the placement rack, and the movement of the L-shaped rod in the direction close to the placement rack will drive the rotating wheel to move in the direction close to the placement rack, the L-shaped rod is fixedly mounted on the surface of the hollow box, the rotating wheel is rotatably mounted on the bottom of the L-shaped rod, the slide plate is slidably mounted on the top of the placement rack, the elastic telescopic plate is fixedly mounted on the surface of the slide plate, the arc plate is fixedly mounted on the free end of the elastic telescopic plate, and the roller is rotatably mounted on the inner wall of the arc plate.

[0009] According to the above technical solution, a fixing plate is fixedly installed on the surface of the L-shaped rod, and a protrusion is fixedly installed on the top of the sliding plate. When the L-shaped rod moves toward the placement rack, the fixing plate will move toward the placement rack, and when the fixing plate moves toward the placement rack, it will contact the protrusion.

[0010] According to the above technical solution, a slope is arranged at one end of the slide plate close to the driving device, the fixing plate is arranged above the protrusion, and a No. 1 spring is arranged between the slide plate and the placement frame, and the slide plate is driven to reset by the No. 1 spring.

[0011] According to the above technical solution, the rotating device includes a connecting plate and an L-shaped plate. The connecting plate is driven to move toward the rotating plate by the movement of the sliding plate toward the rotating plate. The movement of the connecting plate toward the rotating plate will drive the L-shaped plate to move toward the rotating plate. The connecting plate is fixedly installed at the bottom of the sliding plate. The L-shaped plate is fixedly installed at the bottom of the connecting plate. A tooth groove is provided on the surface of the L-shaped plate. A tooth block is provided on the surface of the rotating rod. The tooth groove and the tooth block surface are meshed.

[0012] According to the above technical solution, a short plate is fixedly installed at the bottom of the L-shaped plate, a rotating plate is rotatably installed at the bottom of the short plate, a limiting block is fixedly installed on the surface of the short plate, a rotating shaft is rotatably installed on the inner wall of the filter baffle, and an L-shaped long plate is fixedly installed on the top of the rotating shaft. The movement of the short plate toward the direction close to the rotating rod will drive the rotating plate to move toward the direction close to the rotating rod. The movement of the rotating plate toward the direction close to the rotating rod will contact the L-shaped long plate. The downward rotation of the L-shaped long plate will dredge the filter baffle.

[0013] According to the above technical solution, a No. 2 torsion spring is arranged between the short plate and the rotating plate, and the rotating plate is driven to reset by the No. 2 torsion spring. The limit block is in contact with the surface of the rotating plate. A No. 3 torsion spring is arranged between the filter baffle and the rotating shaft, and the rotating shaft is driven to reset by the No. 3 torsion spring.

[0014] The present invention provides a direct injection circulation flushing device for stripping a metal film on a wafer surface. It has the following beneficial effects:

[0015] (1) The invention uses a flushing nozzle to flush the metal film on the surface of the wafer to clean the metal film and prevent it from affecting the subsequent coating. At the same time, the etching liquid inside the hollow box drips onto the surface of the metal film, thereby loosening it and facilitating flushing. At the same time, the movement of the hollow box toward the placement rack will drive the brush to move toward the placement rack. The brush will smooth the etching liquid dripped on the metal film, making the etching liquid more evenly distributed and improving the effect of stripping the metal film.

[0016] (2) In the present invention, the movement of the elastic telescopic plate toward the rotating plate drives the arc plate toward the rotating plate, and the movement of the arc plate toward the rotating plate drives the roller toward the rotating plate. The wafer is clamped by the roller to prevent the wafer from being pushed to move during flushing or brushing, thereby causing the wafer to move away from the flushing range of the flushing nozzle and reducing the efficiency of stripping the metal film. At the same time, the contact between the fixed plate and the bump generates slight vibration, which can weaken the bonding between the metal film and the wafer to a certain extent, thereby improving the effect of stripping the metal film.

[0017] (3) In the present invention, the L-shaped plate moves toward the rotating plate to drive the rotating rod to rotate, and the rotating rod rotates to drive the rotating plate to rotate. The clamped position is adjusted by rotating the rotating plate to prevent the metal film from being attached to the clamped part, which would cause the flushing nozzle to fail to flush and affect the stripping effect. At the same time, the downward rotation of the L-shaped long plate would clear the filter partitions to prevent the metal film from being stuck between the filter partitions and affecting the drainage effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is a schematic diagram of the overall cross-sectional structure of the present invention;

[0020] Figure 3 It is a schematic diagram of the structure of the pretreatment device of the present invention;

[0021] Figure 4 This is a schematic diagram of the cross-sectional structure of the hollow frame of the present invention;

[0022] Figure 5 It is a schematic diagram of the structure of the clamping device of the present invention;

[0023] Figure 6 It is a schematic diagram of the cross-sectional structure of the chassis of the present invention;

[0024] Figure 7 For the present invention Figure 6 A schematic diagram of the enlarged structure of part A.

[0025] In the figure: 1, chassis; 2, revolving door; 3, controller; 4, observation window; 5, flushing nozzle; 6, water circulation device; 7, driving device; 8, hollow box; 9, placement rack; 10, rotating rod; 11, rotating plate; 12, trapezoidal block; 13, brush; 14, sliding rod; 15, sealing plate; 161, L-shaped rod; 162, rotating wheel; 163, sliding plate; 164, elastic telescopic plate; 165, arc plate; 166, roller; 167, fixed plate; 168, protrusion; 171, connecting plate; 172, L-shaped plate; 173, short plate; 174, rotating plate; 175, limit block; 176, rotating shaft; 177, L-shaped long plate. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figure 1-Figure 7 One embodiment of the present invention is: a direct injection circulation flushing device for stripping a metal film on a wafer surface, comprising: a chassis 1, a rotating door 2 is rotatably installed on the inner wall of the chassis 1, a controller 3 is fixedly installed on the surface of the chassis 1, an observation window 4 is rotatably installed on the surface of the chassis 1, and a filter partition is arranged on the inner wall of the chassis 1; a pretreatment device, the pretreatment device is arranged inside the chassis 1, the pretreatment device comprises a flushing nozzle 5, a water circulation device 6, a driving device 7, a hollow box 8, a placement rack 9, a rotating rod 10, a rotating plate 11, a trapezoidal block 12, a brush 13, a sliding rod 14 and a sealing plate 15, so that the etching liquid inside the hollow box 8 drips onto the surface of the metal film, thereby making it loose for easy flushing, and the flushing nozzle 5 is fixedly installed on the chassis The inner wall of the box 1, the water circulation device 6 is fixedly installed at the bottom of the inner wall of the box 1, the flushing nozzle 5 is connected to the water circulation device 6 through a water pipe, the driving device 7 is fixedly installed on the top of the filter partition, the hollow box 8 is fixedly installed at the output end of the driving device 7, the placement rack 9 is fixedly installed on the top of the filter partition, the rotating rod 10 is rotatably installed on the top of the filter partition, the rotating plate 11 is fixedly installed on the top of the rotating rod 10, the brush 13 is fixedly installed on the bottom of the hollow box 8, the sliding rod 14 slides through the bottom of the hollow box 8, the sealing plate 15 is fixedly installed on the top of the sliding rod 14, and a liquid outlet is opened at the bottom of the hollow box 8. The etching liquid dripping on the metal film will be smoothed by the brush 13, so that the etching liquid is distributed more evenly, thereby improving the effect of stripping the metal film.

[0028] The sealing plate 15 is arranged above the liquid outlet, and a No. 1 torsion spring is arranged between the rotating rod 10 and the filter partition, and the rotating rod 10 is driven to reset by the No. 1 torsion spring. The trapezoidal block 12 is arranged below the sliding rod 14, and an anti-slip rubber is arranged on the top of the rotating plate 11 to prevent it from being unable to rotate when clamped by the clamping device.

[0029] See also Figure 1-Figure 4 When the present embodiment is working, the metal film on the surface of the wafer is rinsed by the rinsing nozzle 5 to clean the metal film to prevent it from affecting the subsequent coating. At the same time, before rinsing, the driving device 7 is started, and the driving device 7 will drive the hollow box 8 to move in the direction close to the placement rack 9. The movement of the hollow box 8 in the direction close to the placement rack 9 will drive the sliding rod 14 to move in the direction close to the placement rack 9. The sliding rod 14 moves in the direction close to the placement rack 9 and contacts the trapezoidal block 12. The trapezoidal block 12 squeezes the sliding rod 14 to move upward. The upward movement of the sliding rod 14 drives the sealing plate 15 to move upward. The upward movement of the sealing plate 15 opens the liquid outlet, so that the etching liquid inside the hollow box 8 drips onto the surface of the metal film, thereby loosening it and facilitating rinsing. At the same time, the movement of the hollow box 8 in the direction close to the placement rack 9 will drive the brush 13 to move in the direction close to the placement rack 9. The brush 13 will smooth the etching liquid dripped on the metal film, so that the etching liquid is more evenly distributed, thereby improving the effect of stripping the metal film.

[0030] See also Figure 1-Figure 7 On the basis of the above embodiment, another embodiment of the present invention further includes a clamping device and a rotating device, the clamping device includes an L-shaped rod 161, a rotating wheel 162, a slide 163, an elastic telescopic plate 164, an arc plate 165 and a roller 166, the L-shaped rod 161 is fixedly mounted on the surface of the hollow box 8, the rotating wheel 162 is rotatably mounted on the bottom of the L-shaped rod 161, the slide 163 is slidably mounted on the top of the placement rack 9, the elastic telescopic plate 164 is fixedly mounted on the surface of the slide 163, the arc plate 165 is fixedly mounted on the free end of the elastic telescopic plate 164, and the roller 166 is rotatably mounted on the inner wall of the arc plate 165, the wafer is clamped by the roller 166 to prevent the wafer from being pushed to move when the washing or brush 13 is smoothed, causing the wafer to be away from the washing range of the washing nozzle 5.

[0031] A fixing plate 167 is fixedly installed on the surface of the L-shaped rod 161, and a protrusion 168 is fixedly installed on the top of the slide plate 163. The contact between the fixing plate 167 and the protrusion 168 generates slight vibration, which can weaken the bonding between the metal film and the wafer to a certain extent and improve the effect of peeling off the metal film.

[0032] An inclined surface is arranged at one end of the slide plate 163 close to the driving device 7, a fixing plate 167 is arranged above the protrusion 168, and a No. 1 spring is arranged between the slide plate 163 and the placement frame 9, and the slide plate 163 is driven to reset by the No. 1 spring.

[0033] See also Figure 3-Figure 7 The rotating device includes a connecting plate 171 and an L-shaped plate 172. The connecting plate 171 is fixedly installed at the bottom of the slide plate 163, and the L-shaped plate 172 is fixedly installed at the bottom of the connecting plate 171. A tooth groove is opened on the surface of the L-shaped plate 172, and a tooth block is arranged on the surface of the rotating rod 10. The tooth groove and the tooth block surface are meshed. The clamped position is adjusted by rotating the rotating plate 11 to prevent part of the metal film from being attached to the clamped part, which makes the flushing nozzle 5 unable to be flushed and affects the stripping effect.

[0034] A short plate 173 is fixedly installed at the bottom of the L-shaped plate 172, and a rotating plate 174 is rotatably installed at the bottom of the short plate 173. A limiting block 175 is fixedly installed on the surface of the short plate 173. A rotating shaft 176 is rotatably installed on the inner wall of the filter baffle, and an L-shaped long plate 177 is fixedly installed on the top of the rotating shaft 176 to prevent the metal film from being stuck between the filter baffles and affecting the drainage effect. At the same time, when the short plate 173 drives the rotating plate 174 to reset, the rotating plate 174 will rotate upward when it contacts the L-shaped long plate 177, and will not form an obstacle, thereby increasing the service life of the equipment.

[0035] A No. 2 torsion spring is arranged between the short plate 173 and the rotating plate 174, and the rotating plate 174 is reset by the No. 2 torsion spring. The limit block 175 is in contact with the surface of the rotating plate 174. A No. 3 torsion spring is arranged between the filter baffle and the rotating shaft 176, and the rotating shaft 176 is reset by the No. 3 torsion spring.

[0036] See also Figure 5-Figure 7 When the present embodiment is working, the hollow box 8 moves toward the direction close to the placement rack 9, driving the L-shaped rod 161 to move toward the direction close to the placement rack 9. The L-shaped rod 161 moves toward the direction close to the placement rack 9, driving the rotating wheel 162 to move toward the direction close to the placement rack 9. The rotating wheel 162 moves toward the direction close to the placement rack 9 and contacts the inclined surface of the slide plate 163. The rotating wheel 162 pushes the slide plate 163 to move toward the direction close to the rotating plate 11. The slide plate 163 moves toward the direction close to the rotating plate 11, driving the elastic retractable plate 164 to move toward the direction close to the rotating plate 11. The elastic retractable plate 164 moves toward the direction close to the rotating plate 11, driving the arc plate 165 to move toward the direction close to the rotating plate 11. The movement of plate 165 toward the rotating plate 11 will drive roller 166 to move toward the rotating plate 11. The wafer is clamped by roller 166 to prevent the wafer from being pushed to move when being rinsed or smoothed by brush 13, causing the wafer to move away from the rinse range of rinse nozzle 5, resulting in reduced efficiency in stripping the metal film. At the same time, when L-shaped rod 161 moves toward the placement rack 9, it will drive fixed plate 167 to move toward the placement rack 9. When fixed plate 167 moves toward the placement rack 9, it will contact bump 168. The contact between fixed plate 167 and bump 168 will generate slight vibration, which can weaken the combination of metal film and wafer to a certain extent, thereby improving the effect of stripping the metal film.

[0037] See also Figure 6-Figure 7The sliding plate 163 moves toward the direction close to the rotating plate 11, driving the connecting plate 171 to move toward the direction close to the rotating plate 11. The connecting plate 171 moves toward the direction close to the rotating plate 11, driving the L-shaped plate 172 to move toward the direction close to the rotating plate 11. The L-shaped plate 172 moves toward the direction close to the rotating plate 11, driving the rotating rod 10 to rotate. The rotation of the rotating rod 10 drives the rotating plate 11 to rotate. The clamped position is adjusted by rotating the rotating plate 11 to prevent part of the metal film from being attached to the clamped part, which causes the flushing nozzle 5 to be unable to flush and affect the stripping effect. At the same time, the movement of the L-shaped plate 172 toward the direction close to the rotating rod 10 drives the short plate 173 to move toward the direction close to the rotating rod 10. The movement of the short plate 173 toward the direction close to the rotating rod 10 will drive the rotating plate 174 to move toward the direction close to the rotating rod 10. The movement of the rotating plate 174 toward the direction close to the rotating rod 10 will contact the L-shaped long plate 177. The rotating plate 174 is limited by the limit block 175. When contacting the L-shaped long plate 177, it will push the L-shaped long plate 177 to rotate downward. The downward rotation of the L-shaped long plate 177 will dredge the filter baffles to prevent the metal film from being stuck between the filter baffles and affecting the drainage effect. At the same time, when the short plate 173 drives the rotating plate 174 to reset, the rotating plate 174 will rotate upward when contacting the L-shaped long plate 177, without forming an obstacle, thereby increasing the service life of the equipment.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A direct injection circulation flushing device for stripping a metal film on a wafer surface, characterized in that: include: A chassis (1), a revolving door (2) being rotatably mounted on the inner wall of the chassis (1), a controller (3) being fixedly mounted on the surface of the chassis (1), an observation window (4) being rotatably mounted on the surface of the chassis (1), and a filter baffle being provided on the inner wall of the chassis (1); A pretreatment device, the pretreatment device is arranged inside the chassis (1), the pretreatment device comprises a flushing nozzle (5), a water circulation device (6), a driving device (7), a hollow box (8), a placement rack (9), a rotating rod (10), a rotating plate (11), a trapezoidal block (12), a brush (13), a sliding rod (14) and a sealing plate (15), the flushing nozzle (5) is fixedly mounted on the inner wall of the chassis (1), the water circulation device (6) is fixedly mounted on the bottom of the inner wall of the chassis (1), and the flushing nozzle (5) and the water circulation device (6) are connected via a water pipe. The driving device (7) is fixedly mounted on the top of the filter baffle, the hollow box (8) is fixedly mounted on the output end of the driving device (7), the placement rack (9) is fixedly mounted on the top of the filter baffle, the rotating rod (10) is rotatably mounted on the top of the filter baffle, the rotating plate (11) is fixedly mounted on the top of the rotating rod (10), the brush (13) is fixedly mounted on the bottom of the hollow box (8), the sliding rod (14) slides through the bottom of the hollow box (8), the sealing plate (15) is fixedly mounted on the top of the sliding rod (14), and a liquid outlet hole is opened at the bottom of the hollow box (8); Wherein, a clamping device for clamping the wafer is arranged on the top of the placement rack (9), and a rotating device is arranged on the bottom of the clamping device; The sealing plate (15) is arranged above the liquid outlet hole, a first torsion spring is arranged between the rotating rod (10) and the filter partition plate, the trapezoidal block (12) is arranged below the sliding rod (14), and a non-slip rubber is arranged on the top of the rotating plate (11); The clamping device comprises an L-shaped rod (161), a rotating wheel (162), a slide plate (163), an elastic telescopic plate (164), an arc-shaped plate (165) and a roller (166); the L-shaped rod (161) is fixedly mounted on the surface of the hollow box (8); the rotating wheel (162) is rotatably mounted on the bottom of the L-shaped rod (161); the slide plate (163) is slidably mounted on the top of the placement rack (9); the elastic telescopic plate (164) is fixedly mounted on the surface of the slide plate (163); the arc-shaped plate (165) is fixedly mounted on the free end of the elastic telescopic plate (164); and the roller (166) is rotatably mounted on the inner wall of the arc-shaped plate (165).

2. A direct injection circulation flushing device for stripping a metal film on a wafer surface according to claim 1, characterized in that: A fixing plate (167) is fixedly mounted on the surface of the L-shaped rod (161), and a protrusion (168) is fixedly mounted on the top of the sliding plate (163).

3. A direct injection circulation flushing device for stripping a metal film on a wafer surface according to claim 2, characterized in that: An inclined surface is provided at one end of the slide plate (163) close to the driving device (7), the fixing plate (167) is arranged above the protrusion (168), and a No. 1 spring is provided between the slide plate (163) and the placement frame (9).

4. A direct injection circulation flushing device for stripping a metal film on a wafer surface according to claim 3, characterized in that: The rotating device comprises a connecting plate (171) and an L-shaped plate (172); the connecting plate (171) is fixedly mounted on the bottom of the slide plate (163); the L-shaped plate (172) is fixedly mounted on the bottom of the connecting plate (171); a tooth groove is provided on the surface of the L-shaped plate (172); a tooth block is provided on the surface of the rotating rod (10); the tooth groove and the tooth block surface are meshed.

5. The direct injection circulation flushing device for stripping a metal film on a wafer surface according to claim 4, characterized in that: A short plate (173) is fixedly mounted on the bottom of the L-shaped plate (172), a rotating plate (174) is rotatably mounted on the bottom of the short plate (173), a limit block (175) is fixedly mounted on the surface of the short plate (173), a rotating shaft (176) is rotatably mounted on the inner wall of the filter partition, and an L-shaped long plate (177) is fixedly mounted on the top of the rotating shaft (176).

6. The direct injection circulation flushing device for stripping a metal film on a wafer surface according to claim 5, characterized in that: A No. 2 torsion spring is provided between the short plate (173) and the rotating plate (174), the limit block (175) is in surface contact with the rotating plate (174), and a No. 3 torsion spring is provided between the filter partition and the rotating shaft (176).

Images