Chip resistor manufacturing device and method

Abstract

The invention discloses a chip resistor manufacturing device and a method thereof. The chip resistor manufacturing device is composed of a sliding track, a mounting mechanism, an opening and closing mechanism and a vibration mechanism. The chip resistor manufacturing device can automatically open or close a cover plate through the cooperation between the opening and closing component and the control component, so as to facilitate the loading and unloading of the chip resistor body, improve the automation degree of the chip resistor body manufacturing process, reduce the intervention of manual operation, avoid the need to open the cover plate, which is troublesome and reduces the production efficiency. The mounting mechanism is coordinated with the vibration mechanism, so that the electroplating drum can vibrate when unloading.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic processing, and specifically relates to a chip resistor manufacturing device and a method thereof. Background Art

[0002] Chip resistors, also known as chip fixed resistors, are made by mixing metal powder and glass glaze powder and printing them on a substrate using screen printing. They have the advantages of moisture resistance, high temperature resistance, and small temperature coefficient. They can greatly save circuit space costs and make the design more refined. Ordinary small-sized chip resistors can be widely used in various electrical appliances, personal data storage, mobile phones and other communication products due to their small size, light weight, suitability for reflow soldering, easy mounting, matching with automatic mounting equipment, and low assembly cost. They can also promote the further miniaturization of this type of electronic products.

[0003] Chip resistors are usually composed of: ceramic substrate, back electrode, surface electrode, resistor body, primary glass, secondary glass, terminal electrode, middle electrode, and external electrode. The production process is roughly as follows: placing ceramic substrate → back conductor printing and drying → positive conductor printing and drying → sintering → resistor layer printing and drying → sintering → primary protective layer printing and drying → sintering → laser trimming → secondary protective layer printing and drying → sintering → resistance code printing and drying → sintering → strip folding → vacuum sputtering → drying → granular folding → Ni, Sn electroplating → drying → magnetic screening → resistance test screening → taping, etc.

[0004] In the manufacturing process of chip components, after the terminal electrodes are formed, it is generally necessary to form a nickel layer and a tin layer on the terminal electrodes by roller plating, but the opening and closing of the roller is usually done manually by opening and closing the cover on the roller, which makes the unloading of chip resistors more troublesome, reduces the degree of automation in the manufacturing process of chip resistors, and affects production efficiency. In addition, when unloading chip resistors, since there is plating liquid remaining on the surface of the chip resistors after electroplating, the residues adhere to the inner wall of the electroplating roller, causing part of the chip resistors to adhere to the electroplating roller, resulting in incomplete unloading of the chip resistors. Summary of the invention

[0005] The purpose of the present invention is to: through the cooperation between the opening and closing components and the control components, the cover plate can be automatically opened or closed to facilitate the loading and unloading of the chip resistor body, improve the degree of automation of the chip resistor body manufacturing process, reduce manual intervention, and avoid the need to open the cover plate, which is troublesome and reduces production efficiency. Through the cooperation of the mounting mechanism and the vibration mechanism, the electroplating drum can vibrate during unloading to avoid residual plating liquid on the surface of the chip resistor body after electroplating. The residue produces adhesion with the inner wall of the electroplating drum, causing part of the chip resistor body to adhere to the electroplating drum, resulting in incomplete unloading of the chip resistor body.

[0006] The technical solution adopted by the present invention is as follows: A chip resistor, comprising: a chip resistor body, the chip resistor body comprising a ceramic substrate, two back electrodes, two front electrodes, a resistance layer, a protective layer, two side electrodes, a nickel layer and a tin layer, each of the back electrodes is fixedly arranged at the top of the outer wall of the ceramic substrate near the two side edges, each of the front electrodes is fixedly arranged at the bottom of the outer wall of the ceramic substrate near the two side edges, the resistance layer is fixedly arranged between the two back electrodes, the back electrode is fixedly arranged at the top of the outer wall of the resistance layer, each of the side electrodes is fixedly arranged on both sides of the outer wall of the ceramic substrate, the nickel layer is wrapped between the back electrode, the front electrode and the side electrode, and the tin layer is wrapped on the outer wall of the nickel layer.

[0007] Wherein, the thickness of the tin layer is 6-15 μm.

[0008] A chip resistor manufacturing device, comprising:

[0009] A sliding track with a mobile rack;

[0010] The mounting mechanism is arranged on the mobile frame, and the mounting mechanism includes a mounting frame, two groups of mounting components, an electroplating drum, a rotating shaft and a driving component. The mounting frame is slidably embedded on both sides of the inner wall of the mobile frame, each group of the mounting components is arranged on the mounting frame, the electroplating drum is sleeved on the outer wall of the rotating shaft, the rotating shaft is arranged between the two groups of mounting components, the driving component is arranged on the mounting frame, and the chip resistor body is installed inside the electroplating drum;

[0011] An opening and closing mechanism is arranged on the electroplating drum, the opening and closing mechanism comprises a cover plate, two groups of opening and closing components and a control component, the cover plate is arranged on the opening and closing components, each group of the opening and closing components is arranged on the electroplating drum, and the control component is arranged on the mounting frame; and

[0012] The vibration mechanism is arranged on the sliding track. The vibration mechanism comprises a vibration component and two limiting grooves. The vibration component is arranged on the sliding track, and each of the limiting grooves is arranged on the vibration component.

[0013] Among them, each group of the installation components includes a support frame, a movable groove and a movable block. The support frame is fixedly set on the top of the inner wall of the installation frame, the movable groove is opened on one side of the outer wall of the support frame, the movable block is slidably embedded in the inner wall of the movable groove, and the rotating shaft is rotatably embedded between the two movable blocks.

[0014] In which, the driving component includes a bidirectional threaded rod, a first forward and reverse motor, a first gear, a second gear, two movable frames, two rotating sleeves, a large gear, a small gear and a rotating motor, both ends of the bidirectional threaded rod are rotatably embedded in the inner wall of the mounting frame, the first forward and reverse motor is installed on the top of the outer wall of the mounting frame by bolts, the first gear is fixedly sleeved on the output end of the first forward and reverse motor, the second gear is fixedly sleeved on the outer wall of the bidirectional threaded rod, and the second gear is meshed with the first gear, each of the movable frames is threadedly connected to the outer wall of the bidirectional threaded rod, and each movable frame slides through the top of the outer wall of the mounting frame, each of the rotating sleeves is rotatably embedded in one side of the outer wall of the movable frame, the large gear is fixedly sleeved on the outer wall of one of the rotating sleeves, the rotating motor is installed on one side of the outer wall of one of the movable frames by bolts, the small gear is fixedly sleeved on the output end of the rotating motor, and each of the rotating sleeves is movably sleeved on both ends of the rotating shaft.

[0015] Wherein, each group of opening and closing components includes a mounting part, a rotating shaft, a first connecting rod, a second connecting rod, a guide block, a guide frame, a fixed frame and a first threaded rod, the mounting part is fixedly arranged on one side of the outer wall of the electroplating drum, the rotating shaft is rotatably embedded in one side of the outer wall of the mounting part, and the rotating shaft is fixedly arranged on one side of the outer wall of the cover plate, the top end of the first connecting rod is fixedly sleeved on the outer wall of the rotating shaft, the first connecting rod and the second connecting rod are connected by a rotating shaft, the bottom end of the second connecting rod is installed on one side of the outer wall of the guide block through the rotating shaft, the guide frame is fixedly arranged on one side of the outer wall of the electroplating drum, the guide block is slidably embedded in the inner wall of the guide frame, and the guide block is threadedly connected to the first threaded rod, the fixed frame is fixedly arranged on one side of the outer wall of the electroplating drum, and the first threaded rod is rotatably embedded in the inner wall of the fixed frame.

[0016] Wherein, the control component includes a telescopic cylinder, a connecting frame, two connecting shafts, two hexagonal frames, two blocks, two transmission wheels and a second forward and reverse motor. The telescopic cylinder is installed on the top of the inner wall of the mounting frame, and the connecting frame is fixedly arranged on the output end of the telescopic cylinder. Each of the connecting shafts is rotatably embedded in the top of the outer wall of the connecting frame near the edges on both sides, each of the hexagonal frames is fixedly arranged on the bottom of the outer wall of the connecting shaft, each of the blocks is fixedly arranged on the top of the outer wall of the first threaded rod, and each of the blocks is slidably embedded in the inner wall of the hexagonal frames, each of the transmission wheels is fixedly sleeved on the outer wall of the connecting shaft, and each of the transmission wheels is transmitted to each other by a transmission belt. The second forward and reverse motor is installed on the top of the outer wall of the connecting frame by bolts, and one of the connecting shafts is fixedly arranged on the output end of the second forward and reverse motor.

[0017] Wherein, both ends of the connecting frame slide through one side of the outer wall of the supporting frame and the movable frame in sequence, an intercepting rod is fixedly provided on one side of the outer wall of the connecting frame, and a limiting rod is fixedly provided on the outer wall of one of the rotating sleeves.

[0018] Wherein, the vibration component includes two placing frames, a T-shaped rod, two slide grooves, a plurality of first springs, a rotating motor, two movable shafts, a cam, a third connecting rod, a plurality of second springs and two positioning rods, each of the placing frames is fixedly arranged on both sides of the outer wall of the sliding track, the T-shaped rod is slidably embedded between the two slide grooves, and the T-shaped rod and the third connecting rod are connected by a rotating shaft, each of the slide grooves is opened on one side of the outer wall of the placing frame, each of the first springs is fixedly arranged between the T-shaped rod and the slide groove, the rotating motor is installed on one side of the outer wall of one of the placing frames by bolts, each of the movable shafts is rotatably embedded on one side of the outer wall of the placing frame near the top edge, one of the movable shafts is fixedly arranged at the output end of the rotating motor, the cam is fixedly arranged between the two movable shafts, the top end of the third connecting rod is movably sleeved on the outer wall of the cam, each of the second springs is fixedly arranged between the movable groove and the movable block, each of the positioning rods is fixedly arranged on one side of the outer wall of the T-shaped rod, each of the limiting grooves is opened on one side of the outer wall of the positioning rod, and both ends of the rotating shaft are clamped on the inner wall of the limiting groove.

[0019] A method for manufacturing a chip resistor comprises the following steps:

[0020] Step 1: Automatically open the cover: Start the rotating motor to drive the small gear to rotate, drive the large gear to drive one of the rotating sleeves to rotate on the movable frame, because each rotating sleeve is connected to the rotating shaft, with the rotation of the rotating sleeve, the rotating shaft can be driven to drive the electroplating drum to rotate between the two support frames, and at the same time, the telescopic cylinder drives the connecting frame to move downward a certain distance, driving the interception rod downward, when the limit rod contacts the interception rod, turn off the rotating motor, so that the discharge port of the electroplating drum is upward, and then the telescopic cylinder drives the connecting frame downward again, so that the hexagonal frame on the connecting shaft is sleeved on the card block, start the second forward and reverse motor, and cooperate with the transmission wheel and the transmission belt pulley to make the two connecting shafts rotate synchronously on the connecting frame, so as to drive the first threaded rod to rotate on the fixed frame, so that the guide block slides in the guide frame, and cooperates with the first connecting rod and the second connecting rod to drive the rotating shaft to rotate on the mounting member, so that the cover on the electroplating drum can be automatically opened, so as to improve the degree of automation of the manufacturing process of the chip resistor body, reduce the intervention of manual operation, and thus improve production efficiency;

[0021] Step 2: Complete the unloading of the chip resistor body: After the cover is opened, start the telescopic cylinder to move the interception rod upward to its original position, and then drive the electroplating drum to rotate in the previous rotation direction, so that the discharge port of the electroplating drum is downward, so as to dump the chip resistor body after electroplating, and complete the unloading of the chip resistor body;

[0022] Step 3: Drive the electroplating drum to vibrate: the moving rack moves on the sliding track and approaches the placement rack so that the two ends of the rotating shaft are stuck in the limit groove, and then the first forward and reverse motor is started to drive the first gear to rotate, and the second gear is driven to drive the movable rack to move away from each other, so that the rotating sleeve is separated from the two ends of the rotating shaft, and then the rotating motor is started, and the movable shaft is started to drive the cam to rotate between the two placement racks. Cooperate with the third connecting rod to drive the T-shaped rod to slide in the slide groove. At the same time, the movable block moves in the movable groove. Cooperate with the first spring and the second spring to make the electroplating drum vibrate when unloading, so as to avoid residual plating liquid on the surface of the chip resistor body after electroplating. The residue will produce adhesion with the inner wall of the electroplating drum, causing part of the chip resistor body to adhere to the electroplating drum, which will cause incomplete unloading of the chip resistor body and reduce production efficiency.

[0023] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0024] (1) In the present invention, the cover can be automatically opened or closed by cooperating between the opening and closing components and the control components, so as to facilitate the loading and unloading of the chip resistor body, improve the degree of automation in the manufacturing process of the chip resistor body, reduce manual intervention, and avoid the need to open the cover, which is more troublesome and reduces production efficiency.

[0025] (2) In the present invention, the mounting mechanism cooperates with the vibration mechanism to enable the electroplating drum to vibrate during unloading, so as to prevent the electroplating liquid from remaining on the surface of the chip resistor body after the electroplating is completed. The residue will produce adhesion with the inner wall of the electroplating drum, causing part of the chip resistor body to adhere to the electroplating drum, resulting in incomplete unloading of the chip resistor body. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a first perspective stereogram of the present invention;

[0027] Figure 2 It is a second viewing angle stereogram of the present invention;

[0028] Figure 3 It is a partial structural schematic diagram of the present invention;

[0029] Figure 4 It is a partial structural schematic diagram of the installation mechanism of the present invention;

[0030] Figure 5 It is a partial structural schematic diagram of the vibration mechanism of the present invention;

[0031] Figure 6 It is a partial structural schematic diagram of the opening and closing mechanism of the present invention;

[0032] Figure 7 It is a structural schematic diagram of the cam of the present invention;

[0033] Figure 8 It is a schematic structural diagram of the first threaded rod of the present invention;

[0034] Fig. 9 For the present invention Figure 1 The enlarged schematic diagram of point A in the middle;

[0035] Fig.10 For the present invention Figure 6 Enlarged schematic diagram of point B in the middle

[0036] Fig.11 It is a schematic structural diagram of the chip resistor body of the present invention.

[0037] Markings in the figure: 1. Chip resistor body; 101. Ceramic substrate; 102. Back electrode; 103. Front electrode; 104. Resistance layer; 105. Protective layer; 106. Side electrode; 107. Nickel layer; 108. Tin layer; 2. Sliding track; 3. Moving frame; 4. Mounting mechanism; 401. Mounting frame; 402. Plating roller; 403. Rotating shaft; 404. Support frame; 405. Movable groove; 406. Movable block; 407. Bidirectional threaded rod; 408. First forward and reverse motor; 409. First gear; 410. Second gear; 411. Movable frame; 412. Rotating sleeve; 413. Large gear; 414. Small gear; 415. Rotating motor; 5. Opening and closing mechanism; 501 , cover plate; 502, mounting piece; 503, rotating shaft; 504, first connecting rod; 505, second connecting rod; 506, guide block; 507, guide frame; 508, fixing frame; 509, first threaded rod; 510, telescopic cylinder; 511, connecting frame; 512, connecting shaft; 513, hexagonal frame; 514, clamping block; 515, transmission wheel; 516, second forward and reverse motor; 6, vibration mechanism; 601, limiting groove; 602, placing frame; 603, T-shaped rod; 604, sliding groove; 605, first spring; 606, rotating motor; 607, movable shaft; 608, cam; 609, third connecting rod; 610, second spring; 611, positioning rod; 7, intercepting rod; 8, limiting rod. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0039] Embodiment 1, refer to Figure 1-11A chip resistor comprises: a chip resistor body 1, the chip resistor body 1 comprises a ceramic substrate 101, two back electrodes 102, two front electrodes 103, a resistance layer 104, a protective layer 105, two side electrodes 106, a nickel layer 107 and a tin layer 108, each back electrode 102 is fixedly arranged at the top of the outer wall of the ceramic substrate 101 near the two side edges, each front electrode 103 is fixedly arranged at the bottom of the outer wall of the ceramic substrate 101 near the two side edges, the resistance layer 104 is fixedly arranged between the two back electrodes 102, the back electrode 102 is fixedly arranged at the top of the outer wall of the resistance layer 104, each side electrode 106 is fixedly arranged on both sides of the outer wall of the ceramic substrate 101, the nickel layer 107 is wrapped between the back electrode 102, the front electrode 103 and the side electrode 106, and the tin layer 108 is wrapped around the outer wall of the nickel layer 107.

[0040] In this embodiment: the back electrode 102 on the ceramic substrate 101 is used as a pad for connecting to the PCB board, the front electrode 103 is used as an internal electrode to connect to the resistor, the protective layer 105 has two layers to protect the printed resistor layer 104, and the back electrode 102 and the front electrode 103 are connected through the side electrode 106. The nickel plated layer 107 is used to protect the electrode end from corrosion, and the tin plated layer 108 is used to increase the solderability.

[0041] Specifically, the thickness of the tin layer 108 is 6-15 μm.

[0042] In this embodiment, the thickness of the tin layer 108 is prevented from being too thick or too thin, thereby affecting the stability of the resistor.

[0043] A chip resistor manufacturing device, comprising:

[0044] A sliding track 2 is provided with a moving frame 3;

[0045] The mounting mechanism 4 is arranged on the mobile frame 3. The mounting mechanism 4 includes a mounting frame 401, two groups of mounting components, an electroplating drum 402, a rotating shaft 403 and a driving component. The mounting frame 401 is slidably embedded on both sides of the inner wall of the mobile frame 3. Each group of mounting components is arranged on the mounting frame 401. The electroplating drum 402 is sleeved on the outer wall of the rotating shaft 403. The rotating shaft 403 is arranged between the two groups of mounting components. The driving component is arranged on the mounting frame 401. The chip resistor body 1 is installed inside the electroplating drum 402.

[0046] The opening and closing mechanism 5 is arranged on the electroplating drum 402. The opening and closing mechanism 5 comprises a cover plate 501, two groups of opening and closing components and a control component. The cover plate 501 is arranged on the opening and closing components. Each group of opening and closing components is arranged on the electroplating drum 402. The control component is arranged on the mounting frame 401; and

[0047] The vibration mechanism 6 is arranged on the sliding track 2. The vibration mechanism 6 includes a vibration component and two limiting grooves 601. The vibration component is arranged on the sliding track 2, and each limiting groove 601 is arranged on the vibration component.

[0048] In this embodiment: the movable rack 3 can slide on the sliding track 2 according to the electroplating needs, and a driving device that can lift the mounting rack 401 is provided between the mounting rack 401 and the movable rack 3, so that the electroplating roller 402 can enter different solution pools in turn to realize the electroplating of the chip resistor. The above operation belongs to the prior art and is not explained here. The two sets of mounting components on the mounting rack 401 are used to realize the installation and placement of the electroplating roller 402 and the rotating shaft 403. The driving component is used to drive the electroplating roller 402 to rotate. The cover plate 501 can be automatically opened or closed by cooperating between the opening and closing component and the control component, so as to facilitate the loading and unloading of the chip resistor body 1, thereby improving the chip resistor. The degree of automation in the manufacturing process of the resistor body 1 reduces the intervention of manual operation to avoid the need to open the cover 501, which is more troublesome and reduces production efficiency. The vibration mechanism 6 can make the electroplating drum 402 vibrate when unloading materials to avoid residual plating liquid on the surface of the chip resistor body 1 after electroplating. The residue will produce adhesion with the inner wall of the electroplating drum 402, causing part of the chip resistor body 1 to adhere to the electroplating drum 402, resulting in incomplete unloading of the chip resistor body 1, reducing production efficiency. The electroplating drum 402 is connected to the vibration component through the clamping between the limit groove 601 and the rotating shaft 403, so that the electroplating drum 402 can vibrate slightly when unloading materials.

[0049] Specifically, each set of mounting components includes a support frame 404, a movable groove 405 and a movable block 406. The support frame 404 is fixedly arranged on the top of the inner wall of the mounting frame 401, the movable groove 405 is opened on one side of the outer wall of the support frame 404, the movable block 406 is slidably embedded in the inner wall of the movable groove 405, and the rotating shaft 403 is rotatably embedded between the two movable blocks 406.

[0050] In this embodiment: the movable block 406 and the movable groove 405 are slidably matched to enable the electroplating drum 402 to move up and down, thereby preventing part of the chip resistor body 1 from being attached to the electroplating drum 402 .

[0051] Specifically, the driving components include a bidirectional threaded rod 407, a first forward and reverse motor 408, a first gear 409, a second gear 410, two movable frames 411, two rotating sleeves 412, a large gear 413, a small gear 414 and a rotating motor 415. Both ends of the bidirectional threaded rod 407 are rotatably embedded in the inner wall of the mounting frame 401. The first forward and reverse motor 408 is installed on the top of the outer wall of the mounting frame 401 by bolts. The first gear 409 is fixedly sleeved on the output end of the first forward and reverse motor 408. The second gear 410 is fixedly sleeved on the outer wall of the bidirectional threaded rod 407, and the second gear 410 is fixedly sleeved on the outer wall of the bidirectional threaded rod 407. Meshing with the first gear 409, each movable frame 411 is threadedly connected to the outer wall of the bidirectional threaded rod 407, and each movable frame 411 slides through the top of the outer wall of the mounting frame 401, each rotating sleeve 412 is rotatably embedded in one side of the outer wall of the movable frame 411, the large gear 413 is fixedly sleeved on the outer wall of one of the rotating sleeves 412, the rotating motor 415 is installed on one side of the outer wall of one of the movable frames 411 by bolts, the small gear 414 is fixedly sleeved on the output end of the rotating motor 415, and each rotating sleeve 412 is movably sleeved on both ends of the rotating shaft 403.

[0052] In this embodiment: the first forward and reverse motor 408 drives the first gear 409 to rotate when powered on, and can drive the second gear 410 to drive the bidirectional threaded rod 407 to rotate on the mounting frame 401, thereby driving the two movable frames 411 to move away from each other, so as to facilitate the separation of the rotating sleeve 412 and the rotating shaft 403 to avoid affecting the vibration of the electroplating drum 402. The rotating motor 415 drives the small gear 414 to rotate when powered on, and can drive the large gear 413 to drive the rotating sleeve 412 to rotate, so that the rotating shaft 403 drives the electroplating drum 402 to rotate.

[0053] Specifically, each set of opening and closing components includes a mounting member 502, a rotating shaft 503, a first connecting rod 504, a second connecting rod 505, a guide block 506, a guide frame 507, a fixing frame 508 and a first threaded rod 509. The mounting member 502 is fixedly arranged on one side of the outer wall of the electroplating drum 402, the rotating shaft 503 is rotatably embedded on one side of the outer wall of the mounting member 502, and the rotating shaft 503 is fixedly arranged on one side of the outer wall of the cover plate 501. The top end of the first connecting rod 504 is fixedly sleeved on the outer wall of the rotating shaft 503. A connecting rod 504 is connected to a second connecting rod 505 through a rotating shaft, and the bottom end of the second connecting rod 505 is installed on the outer wall side of the guide block 506 through the rotating shaft. The guide frame 507 is fixedly set on the outer wall side of the electroplating drum 402, and the guide block 506 is slidably embedded in the inner wall of the guide frame 507, and the guide block 506 is threadedly connected to the first threaded rod 509. The fixing frame 508 is fixedly set on the outer wall side of the electroplating drum 402, and the first threaded rod 509 is rotatably embedded in the inner wall of the fixing frame 508.

[0054] In this embodiment: the rotating shaft 503 is fixed as a whole with the cover 501 and can rotate between the two mounting parts 502. By driving the first threaded rod 509 to rotate on the fixed frame 508, the guide block 506 can be moved in the guide frame 507, and cooperate with the second connecting rod 505 and the first connecting rod 504 to drive the rotating shaft 503 to rotate in the mounting part 502, thereby realizing the opening and closing of the cover 501, so as to facilitate the unloading of the chip resistor body 1.

[0055] Specifically, the control components include a telescopic cylinder 510, a connecting frame 511, two connecting shafts 512, two hexagonal frames 513, two clamping blocks 514, two transmission wheels 515 and a second forward and reverse motor 516. The telescopic cylinder 510 is installed on the top of the inner wall of the mounting frame 401, and the connecting frame 511 is fixedly arranged at the output end of the telescopic cylinder 510. Each connecting shaft 512 is rotatably embedded in the top of the outer wall of the connecting frame 511 near the edges on both sides, and each hexagonal frame 513 is fixedly arranged at the bottom of the outer wall of the connecting shaft 512. Each clamping block 514 is fixedly arranged on the top of the outer wall of the first threaded rod 509, and each clamping block 514 is slidably embedded in the inner wall of the hexagonal frames 513. Each transmission wheel 515 is fixedly sleeved on the outer wall of the connecting shaft 512, and each transmission wheel 515 is transmitted to each other through a transmission belt. The second forward and reverse motor 516 is installed on the top of the outer wall of the connecting frame 511 by bolts, and one of the connecting shafts 512 is fixedly arranged at the output end of the second forward and reverse motor 516.

[0056] In this embodiment: the cross-section of the block 514 is hexagonal, and the telescopic cylinder 510 drives the connecting frame 511 to move up and down, so that the two connecting shafts 512 can drive the hexagonal frames 513 to approach the block 514 and engage with the block 514. The second forward and reverse motor 516 drives one of the connecting shafts 512 to rotate when power is turned on, and then the transmission wheel 515 cooperates with the transmission belt to make the two connecting shafts 512 rotate synchronously, which is used to drive the first threaded rod 509.

[0057] Specifically, both ends of the connecting frame 511 slide through the outer wall of the supporting frame 404 and the movable frame 411 in sequence, an intercepting rod 7 is fixedly provided on the outer wall of the connecting frame 511, and a limiting rod 8 is fixedly provided on the outer wall of one of the rotating sleeves 412.

[0058] In this embodiment, as the rotating sleeve 412 rotates, the limiting rod 8 can be driven to move. When the limiting rod 8 contacts the intercepting rod 7, the discharge port of the electroplating drum 402 can be located directly above, and the six-frame frame 513 and the block 514 can be engaged together. The intercepting rod 7 cooperates with the limiting rod 8 to play a limiting role.

[0059] Specifically, the vibration component includes two placement racks 602, a T-shaped rod 603, two slide grooves 604, a plurality of first springs 605, a rotating motor 606, two movable shafts 607, a cam 608, a third connecting rod 609, a plurality of second springs 610 and two positioning rods 611. Each placement rack 602 is fixedly arranged on both sides of the outer wall of the sliding track 2, the T-shaped rod 603 is slidably embedded between the two slide grooves 604, and the T-shaped rod 603 and the third connecting rod 609 are connected by a rotating shaft, each slide groove 604 is opened on one side of the outer wall of the placement rack 602, each first spring 605 is fixedly arranged between the T-shaped rod 603 and the slide groove 604, and the rotating motor 606 is screwed to the rotation axis of the third connecting rod 609. The bolt is installed on one side of the outer wall of one of the placement racks 602, and each movable shaft 607 is rotatably embedded in one side of the outer wall of the placement rack 602 near the top edge. One of the movable shafts 607 is fixedly set at the output end of the rotating motor 606, and the cam 608 is fixedly set between the two movable shafts 607. The top end of the third connecting rod 609 is movably sleeved on the outer wall of the cam 608. Each second spring 610 is fixedly set between the movable groove 405 and the movable block 406. Each positioning rod 611 is fixedly set on one side of the outer wall of the T-shaped rod 603. Each limiting groove 601 is opened on one side of the outer wall of the positioning rod 611, and both ends of the rotating shaft 403 are clamped on the inner wall of the limiting groove 601.

[0060] In this embodiment: the cam 608 is composed of two circular plates and a round rod. The round rod is fixedly arranged between the two circular plates and is located at the edge of the circular plates. The top end of the third connecting rod 609 is movably sleeved on the outer wall of the round rod. When the rotating motor 606 drives the movable shaft 607 to rotate, the round rod will pull the third connecting rod 609 to move. The bottom end of the third connecting rod 609 will drive the T-shaped rod 603 to slide in the two slide grooves 604, and drive the positioning rod 611 to move. Since the rotating shaft 403 is engaged with the limiting groove 601, the movement of the positioning rod 611 will also drive the movable block 406 to slide in the movable groove 405, and cooperate with the first spring 605 and the second spring 610, so that the electric The plating drum 402 vibrates slightly to prevent any plating liquid from remaining on the surface of the chip resistor body 1 after the electroplating is completed. The residue will produce adhesion with the inner wall of the plating drum 402, causing part of the chip resistor body 1 to adhere to the inside of the plating drum 402, resulting in incomplete unloading of the chip resistor body 1 and reduced production efficiency. The power of the first forward and reverse motor 408, the rotating motor 415, the telescopic cylinder 510, the second forward and reverse motor 516, and the rotating motor 606 comes from an external power supply, which should be electrically connected to the external power supply. The internal circuit principle structure is common knowledge among technicians in this field and will not be introduced in detail here. The model can be selected according to actual usage.

[0061] When in use, step 1: automatically open the cover 501: start the rotating motor 415 to drive the small gear 414 to rotate, drive the large gear 413 to drive one of the rotating sleeves 412 to rotate on the movable frame 411, because each rotating sleeve 412 is connected to the rotating shaft 403, with the rotation of the rotating sleeve 412, it can drive the rotating shaft 403 to drive the electroplating drum 402 to rotate between the two supporting frames 404, and at the same time, the telescopic cylinder 510 drives the connecting frame 511 to move downward a certain distance, driving the intercepting rod 7 downward, and when the limit rod 8 contacts the intercepting rod 7, turn off the rotating motor 415, so that the discharge port of the electroplating drum 402 is upward, and then ... then the telescopic cylinder 510 drives the connecting frame 511 to move downward a certain distance, driving the intercepting rod 7 downward, and then the telescopic cylinder 510 drives the connecting frame 511 to move downward a certain distance, driving the intercepting rod 7 downward, and then the telescopic cylinder 510 drives the connecting frame 511 to move downward a certain distance, driving the intercepting rod 7 downward, and then the telescopic cylinder 510 drives the connecting frame 511 to move downward a certain distance, driving the intercepting rod 7 downward, and then the telescopic cylinder 510 drives the connecting frame 511 to move downward a certain distance, driving the intercepting rod 7 11 moves downward, so that the hexagonal frame 513 on the connecting shaft 512 is sleeved on the clamping block 514, and the second forward and reverse motor 516 is started. Through the cooperation of the transmission wheel 515 and the transmission belt pulley, the two connecting shafts 512 are synchronously rotated on the connecting frame 511, thereby driving the first threaded rod 509 to rotate on the fixing frame 508, so that the guide block 506 slides in the guide frame 507, and cooperates with the first connecting rod 504 and the second connecting rod 505 to drive the rotating shaft 503 to rotate on the mounting member 502, so that the cover plate 501 on the electroplating drum 402 can be automatically opened, so as to improve the degree of automation of the manufacturing process of the chip resistor body 1, reduce the intervention of manual operation, and thus improve production efficiency, step two: Complete the unloading of the chip resistor body 1: After the cover 501 is opened, start the telescopic cylinder 510 to move the intercepting rod 7 upward to its original position, and then drive the electroplating drum 402 to rotate along the previous rotation direction, so that the discharge port of the electroplating drum 402 is downward, so as to pour out the chip resistor body 1 after the electroplating is completed, and complete the unloading of the chip resistor body 1. Step 3: Drive the electroplating drum 402 to vibrate: The moving frame 3 moves on the sliding track 2 and approaches the placement frame 602, so that the two ends of the rotating shaft 403 are stuck in the limit groove 601, and then start the first forward and reverse motor 408 to drive the first gear 409 to rotate, and drive the second gear 410 to drive the movable frame 411 to move away from each other, so that the rotating sleeve 412 is disengaged from both ends of the rotating shaft 403, and then the rotating motor 606 is started, and the movable shaft 607 is started to drive the cam 608 to rotate between the two placement racks 602, and cooperate with the third connecting rod 609 to drive the T-shaped rod 603 to slide in the slide groove 604, and at the same time, the movable block 406 moves in the movable groove 405, and cooperates with the first spring 605 and the second spring 610 to make the electroplating drum 402 vibrate during unloading, so as to prevent the electroplating liquid from remaining on the surface of the chip resistor body 1 after the electroplating is completed. The residue will produce adhesion with the inner wall of the electroplating drum 402, resulting in part of the chip resistor body 1 being attached to the electroplating drum 402, which will cause incomplete unloading of the chip resistor body 1 and reduce production efficiency.

[0062] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip resistor manufacturing device, Features: The chip resistor manufacturing device comprises: A sliding track (2) provided with a moving frame (3); The mounting mechanism (4) is arranged on the movable frame (3), the mounting mechanism (4) comprising a mounting frame (401), two groups of mounting components, an electroplating roller (402), a rotating shaft (403) and a driving component, the mounting frame (401) is slidably embedded on both sides of the inner wall of the movable frame (3), each group of the mounting components is arranged on the mounting frame (401), the electroplating roller (402) is sleeved on the outer wall of the rotating shaft (403), the rotating shaft (403) is arranged between the two groups of mounting components, the driving component is arranged on the mounting frame (401), and the chip resistor body (1) is installed inside the electroplating roller (402); an opening and closing mechanism (5) disposed on the electroplating drum (402), the opening and closing mechanism (5) comprising a cover plate (501), two groups of opening and closing components and a control component, the cover plate (501) being disposed on the opening and closing components, each group of the opening and closing components being disposed on the electroplating drum (402), and the control component being disposed on the mounting frame (401); and A vibration mechanism (6) is arranged on the sliding track (2), the vibration mechanism (6) comprising a vibration component and two limit grooves (601), the vibration component is arranged on the sliding track (2), and each of the limit grooves (601) is arranged on the vibration component; Each set of the mounting components comprises a support frame (404), a movable groove (405) and a movable block (406); the support frame (404) is fixedly arranged on the top of the inner wall of the mounting frame (401); the movable groove (405) is opened on one side of the outer wall of the support frame (404); the movable block (406) is slidably embedded in the inner wall of the movable groove (405); and the rotating shaft (403) is rotatably embedded between the two movable blocks (406); The driving component comprises a bidirectional threaded rod (407), a first forward and reverse motor (408), a first gear (409), a second gear (410), two movable frames (411), two rotating sleeves (412), a large gear (413), a small gear (414) and a rotating motor (415), both ends of the bidirectional threaded rod (407) are rotatably embedded in the inner wall of the mounting frame (401), the first forward and reverse motor (408) is mounted on the top of the outer wall of the mounting frame (401) by bolts, the first gear (409) is fixedly sleeved on the output end of the first forward and reverse motor (408), the second gear (410) is fixedly sleeved on the outer wall of the bidirectional threaded rod (407), and the second gear (410) The movable frames (411) are meshed with the first gear (409), each of the movable frames (411) is threadedly connected to the outer wall of the bidirectional threaded rod (407), and each of the movable frames (411) slides through the top of the outer wall of the mounting frame (401), each of the rotating sleeves (412) is rotatably embedded in one side of the outer wall of the movable frame (411), the large gear (413) is fixedly sleeved on the outer wall of one of the rotating sleeves (412), the rotating motor (415) is installed on one side of the outer wall of one of the movable frames (411) by bolts, the small gear (414) is fixedly sleeved on the output end of the rotating motor (415), and each of the rotating sleeves (412) is movably sleeved on both ends of the rotating shaft (403).

2. A chip resistor manufacturing device as claimed in claim 1, Features: Each group of the opening and closing components comprises a mounting member (502), a rotating shaft (503), a first connecting rod (504), a second connecting rod (505), a guide block (506), a guide frame (507), a fixing frame (508) and a first threaded rod (509), wherein the mounting member (502) is fixedly arranged on one side of the outer wall of the electroplating drum (402), the rotating shaft (503) is rotatably embedded in one side of the outer wall of the mounting member (502), and the rotating shaft (503) is fixedly arranged on one side of the outer wall of the cover plate (501), the top end of the first connecting rod (504) is fixedly sleeved on the outer wall of the rotating shaft (503), and the first threaded rod (509) is fixedly sleeved on the outer wall of the rotating shaft (503). A connecting rod (504) and a second connecting rod (505) are connected via a rotating shaft, and the bottom end of the second connecting rod (505) is mounted on a side of an outer wall of a guide block (506) via a rotating shaft. The guide frame (507) is fixedly arranged on a side of an outer wall of an electroplating drum (402), and the guide block (506) is slidably embedded in an inner wall of the guide frame (507). The guide block (506) and a first threaded rod (509) are threadedly connected, and the fixing frame (508) is fixedly arranged on a side of an outer wall of the electroplating drum (402), and the first threaded rod (509) is rotatably embedded in the inner wall of the fixing frame (508).

3. A chip resistor manufacturing device as claimed in claim 2, Features: The control component comprises a telescopic cylinder (510), a connecting frame (511), two connecting shafts (512), two hexagonal frames (513), two clamping blocks (514), two transmission wheels (515) and a second forward and reverse motor (516); the telescopic cylinder (510) is mounted on the top of the inner wall of the mounting frame (401); the connecting frame (511) is fixedly arranged at the output end of the telescopic cylinder (510); each of the connecting shafts (512) is rotatably embedded in the top of the outer wall of the connecting frame (511) near the edges on both sides; each of the hexagonal frames (513) is fixedly arranged At the bottom of the outer wall of the connecting shaft (512), each of the clamping blocks (514) is fixedly arranged on the top of the outer wall of the first threaded rod (509), and each of the clamping blocks (514) is slidably embedded in the inner wall of the hexagonal frame (513), each of the transmission wheels (515) is fixedly sleeved on the outer wall of the connecting shaft (512), and each of the transmission wheels (515) is connected via a transmission belt, and the second forward and reverse motor (516) is installed on the top of the outer wall of the connecting frame (511) by bolts, and one of the connecting shafts (512) is fixedly arranged on the output end of the second forward and reverse motor (516).

4. A chip resistor manufacturing device as claimed in claim 3, Features: Both ends of the connecting frame (511) slide through one side of the outer wall of the supporting frame (404) and the movable frame (411) in sequence, an intercepting rod (7) is fixedly provided on one side of the outer wall of the connecting frame (511), and a limiting rod (8) is fixedly provided on the outer wall of one of the rotating sleeves (412).

5. A chip resistor manufacturing device as claimed in claim 4, Features: The vibration component comprises two placement racks (602), a T-shaped rod (603), two slide grooves (604), a plurality of first springs (605), a rotating motor (606), two movable shafts (607), a cam (608), a third connecting rod (609), a plurality of second springs (610) and two positioning rods (611). Each of the placement racks (602) is fixedly arranged on both sides of the outer wall of the sliding track (2). The T-shaped rod (603) is slidably embedded between the two slide grooves (604), and the T-shaped rod (603) and the third connecting rod (609) are connected via a rotating shaft. Each of the slide grooves (604) is opened on one side of the outer wall of the placement rack (602). Each of the first springs (605) is fixedly arranged between the T-shaped rod (603) and the slide groove (604). The rotating motor (606) is screwed into the rotation axis of the third connecting rod (609). The bolt is installed on one side of the outer wall of one of the placement racks (602); each of the movable shafts (607) is rotatably embedded in one side of the outer wall of the placement rack (602) near the top edge; one of the movable shafts (607) is fixedly arranged at the output end of the rotating motor (606); the cam (608) is fixedly arranged between the two movable shafts (607); the top end of the third connecting rod (609) is movably sleeved on the outer wall of the cam (608); each of the second springs (610) is fixedly arranged between the movable groove (405) and the movable block (406); each of the positioning rods (611) is fixedly arranged on one side of the outer wall of the T-shaped rod (603); each of the limiting grooves (601) is opened on one side of the outer wall of the positioning rod (611); and both ends of the rotating shaft (403) are clamped on the inner wall of the limiting groove (601).

6. A method for manufacturing a chip resistor, Features: A chip resistor manufacturing device as claimed in claim 5 is used, comprising the following steps: S1: Automatically open the cover plate (501): Start the rotating motor (415) to drive the small gear (414) to rotate, drive the large gear (413) to drive one of the rotating sleeves (412) to rotate on the movable frame (411). Since each rotating sleeve (412) is connected to the rotating shaft (403), as the rotating sleeve (412) rotates, the rotating shaft (403) can be driven to drive the electroplating drum (402) to rotate between the two supporting frames (404). At the same time, the telescopic cylinder (510) drives the connecting frame (511) to move downward a certain distance, driving the intercepting rod (7) downward. When the limit rod (8) contacts the intercepting rod (7), the rotating motor (415) is turned off to make the discharge port of the electroplating drum (402) face upward, and then the telescopic cylinder (510) drives the connecting frame (511) to move downward a certain distance. 511) moves downward, so that the hexagonal frame (513) on the connecting shaft (512) is sleeved on the clamping block (514), and the second forward and reverse motor (516) is started, and the two connecting shafts (512) are synchronously rotated on the connecting frame (511) through the cooperation of the transmission wheel (515) and the transmission belt pulley, thereby driving the first threaded rod (509) to rotate on the fixing frame (508), so that the guide block (506) slides in the guide frame (507), and cooperates with the first connecting rod (504) and the second connecting rod (505) to drive the rotating shaft (503) to rotate on the mounting member (502), so that the cover plate (501) on the electroplating drum (402) can be automatically opened, so as to improve the degree of automation of the manufacturing process of the chip resistor body (1), reduce the intervention of manual operation, and thus improve production efficiency; S2: Completing the unloading of the chip resistor body (1): After the cover plate (501) is opened, the telescopic cylinder (510) is started to move the intercepting rod (7) upward to its original position, and then the electroplating drum (402) is driven to rotate in the previous rotation direction, so that the discharge port of the electroplating drum (402) is downward, so that the chip resistor body (1) after electroplating is dumped out, thereby completing the unloading of the chip resistor body (1); S3: driving the electroplating drum (402) to vibrate: the moving frame (3) moves on the sliding track (2) and approaches the placement frame (602), so that the two ends of the rotating shaft (403) are stuck in the limit groove (601), and then the first forward and reverse motor (408) is started to drive the first gear (409) to rotate, and the second gear (410) is driven to drive the movable frame (411) to move away from each other, so that the rotating sleeve (412) is separated from the two ends of the rotating shaft (403), and then the rotating motor (606) is started, and the movable shaft (607) is started to drive the cam (608) to rotate between the two placement frames (602), and the rotating motor (606) is started. The third connecting rod (609) is engaged to drive the T-shaped rod (603) to slide in the slide groove (604), and at the same time, the movable block (406) moves in the movable groove (405), and cooperates with the first spring (605) and the second spring (610) to make the electroplating drum (402) vibrate when unloading, so as to prevent the electroplating liquid from remaining on the surface of the chip resistor body (1) after the electroplating is completed. The residue will produce adhesion with the inner wall of the electroplating drum (402), causing part of the chip resistor body (1) to adhere to the electroplating drum (402), resulting in incomplete unloading of the chip resistor body (1), thereby reducing production efficiency.

Images