Cylindrical grinding machine for semiconductor single crystal silicon processing

Abstract

A cylindrical grinder for semiconductor single crystal silicon processing belongs to the technical field of semiconductor processing. In order to solve the problems that the existing replacement of grinding tools will affect work efficiency, damage is easily caused when fixed, and the fixation is not firm; the present invention uses a fine grinding mechanism, a clamping mechanism and a moving mechanism, one end of the moving mechanism is connected to the fine grinding mechanism, and the other end of the moving mechanism is connected to the clamping mechanism; the present invention realizes that when one group of milling cutters is located at the farthest opposite side of the processing unit, it starts to work, and the rest are in a stagnant state, so that different tools can be replaced at any time, and work efficiency is improved. When the drive shaft rotates, the telescopic tube will always be in an extended state, thereby preventing the product to be processed from loosening during the processing process.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing, in particular to an external cylindrical grinder used for processing semiconductor single crystal silicon. Background Art

[0002] Semiconductor refers to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential type of semiconductor material application. During the processing of semiconductor single crystal silicon, its surface needs to be polished, making cylindrical grinders indispensable.

[0003] During the use of the current cylindrical grinder, it is necessary to constantly replace the grinding tools to make the grinding results more refined and improve the surface quality of semiconductor monocrystalline silicon. At this time, during the operation, the constant replacement of grinding tools will affect the work efficiency, thereby delaying the construction period. Secondly, during the grinding process, the semiconductor monocrystalline silicon needs to be fixed, and currently, it is easy to be damaged during the fixation, and the fixation is not firm, which affects the quality of the finished product of the semiconductor monocrystalline silicon and is not conducive to production.

[0004] Therefore, we proposed a cylindrical grinding machine for semiconductor single crystal silicon processing. Summary of the invention

[0005] The purpose of the present invention is to provide an external cylindrical grinder for semiconductor single crystal silicon processing, which solves the problem that the current external cylindrical grinder in the background technology needs to continuously replace the grinding tools during use, so that the grinding result is more refined and the surface quality of the semiconductor single crystal silicon can be improved. At this time, during the operation, the continuous replacement of the grinding tools will affect the work efficiency and thus delay the construction period. Secondly, during the grinding process, the semiconductor single crystal silicon needs to be fixed, and currently, it is easy to be damaged during the fixation, which affects the quality of the finished product of the semiconductor single crystal silicon and is not conducive to production.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a cylindrical grinder for semiconductor single crystal silicon processing, comprising a processing table, a table plate arranged at the upper end of the processing table, and a fine grinding mechanism arranged at the upper end of the table plate, a clamping mechanism is also arranged at the upper end of the table plate, and moving mechanisms are arranged on both sides of the fine grinding mechanism and the clamping mechanism, a receiving mechanism is arranged inside the processing table, a clamping plate is arranged at the lower end of the table plate, a T-shaped groove is opened on the upper surface of the table plate, and the table plate is movably connected with the fine grinding mechanism and the clamping mechanism through the T-shaped groove;

[0007] The fine grinding mechanism includes a fine grinding box arranged on the upper surface of the table plate, a vertical groove arranged on one side of the fine grinding box, a vertical block arranged inside the vertical groove, and a processing unit arranged on the outer surface of the vertical block. A conversion fine grinding component is arranged on one side of the fine grinding box, and the conversion fine grinding component includes a conversion cylinder arranged on the outer surface of the fine grinding box, a conversion groove is arranged inside the conversion cylinder, an accommodation component is arranged inside the conversion groove, a milling cutter is arranged at one end of the accommodation component, four groups of milling cutters are arranged, and the fineness of the four groups of milling cutters is different. One side of the conversion cylinder is connected to a motor arranged inside the fine grinding box.

[0008] Furthermore, the placement assembly includes a placement cylinder arranged inside the conversion groove, a telescopic push rod arranged at one end of the placement cylinder, a rotating seat arranged at the other end of the placement cylinder, and a mounting sleeve arranged on one side of the rotating seat, the outer surface of the mounting sleeve is connected to the milling cutter, and a detection unit is arranged on the outer surface of the placement cylinder. The detection unit is arranged in four groups, and the four groups of detection units are respectively provided with detection modules A, detection modules B, detection modules C and detection modules D. The detection modules A, detection modules B, detection modules C and detection modules D are respectively arranged on four groups of milling cutters with different fineness.

[0009] Furthermore, a processing module is provided inside the processing unit, one side of the processing module is signal-connected to a horizontal height setting module, one side of the horizontal height setting module is connected to a height calculation module, one side of the height calculation module is provided with a difference calculation module, and one side of the difference calculation module is provided with a judgment module. The lowest height value of the milling cutter in the conversion slot is set by the horizontal height setting module, and the height calculation module can calculate the vertical distances between the processing unit and the detection module A, detection module B, detection module C and detection module D respectively, and the height difference is calculated by the difference calculation module at the same time. Finally, the judgment module is used to make a judgment, and the judgment result is fed back to the telescopic push rod through the processing module.

[0010] Furthermore, the clamping mechanism includes a clamping box arranged on the upper end of the table, a rotating assembly arranged on one side of the clamping box, a clamping piece arranged on the other side of the clamping box, and an air collecting hood arranged on the outer surface of the clamping box. A connecting hose is arranged on the outer surface of the air collecting hood, and the connecting hose is connected to the clamping piece. The rotating assembly includes a driving motor arranged on the outer surface of the clamping box, a driving shaft arranged at one end of the driving motor, and a fan blade arranged on the outer surface of the driving shaft. The driving shaft is arranged through the interior of the clamping box, and one end of the driving shaft is connected to the clamping piece.

[0011] Furthermore, the clamping member includes a connecting flange arranged on the outer surface of the clamping box body, a connecting disk arranged on one side of the connecting flange, and a driving cylinder arranged on one side of the connecting disk, a locking assembly is arranged at one end of the driving cylinder, one end of the driving cylinder is connected to the driving cylinder through the connecting flange and the connecting disk, and the driving cylinder and the conversion cylinder are arranged in the same horizontal plane.

[0012] Furthermore, the locking assembly includes a side plate arranged on one side of the driving cylinder, a side groove opened on the outer surface of the side plate, and a vertical block arranged inside the side groove. The vertical blocks are provided in two groups, one group of vertical blocks is provided with a compression spring on one side, and the other group of vertical blocks is provided with a telescopic tube on one side. Locking air cushions are provided on the outer surfaces of the vertical blocks of the two groups, and the air collecting hood is connected to the telescopic tube through a connecting hose.

[0013] Furthermore, the moving mechanism includes a center rod and an electric push rod arranged above the table plate, and side rods A and side rods B are respectively arranged at both ends of the center rod, side rod A is connected to the clamping box, side rod B is connected to the fine grinding box, sleeve A is arranged on the outer surface of side rod A, sleeve B is arranged on the outer surface of side rod B, sleeve B is arranged on the outer surface of sleeve B, one end of the center rod is connected to sleeve A, and the other end of the center rod is connected to the through hole, and the two ends of the electric push rod are respectively connected to sleeve A and sleeve B.

[0014] Furthermore, a notch is provided on the upper surface of the processing table, a receiving mechanism is arranged inside the notch, an external tube is provided on one side of the processing table, an inflatable bag is provided on the outer surface of the external tube, the external tube is connected to the inflatable bag, and the external tube is connected to an external air source.

[0015] Furthermore, the connecting mechanism includes a connecting vertical pipe arranged inside the slot and an insert block arranged inside the connecting vertical pipe, a socket is arranged inside the insert block, a magnetic plate and a connecting spring are arranged inside the socket, two groups of magnetic plates are arranged, and both groups of magnetic plates are connected to the inner wall of the socket through connecting springs.

[0016] Furthermore, an engaging rod is provided at the lower end of the engaging plate, and a magnetic insert is provided on the lower bottom surface of the engaging rod. The magnetic insert is engaged with the jack, and the magnetic insert has the same magnetic properties as the magnetic attraction plate. The upper surface of the plug block is magnetically connected to the lower bottom surface of the engaging plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The cylindrical grinder for semiconductor single crystal silicon processing proposed by the present invention has a fine grinding box body on the upper surface of the table, a vertical groove is provided on one side of the fine grinding box body, a vertical block is provided inside the vertical groove, a processing unit is provided on the outer surface of the vertical block, a conversion fine grinding assembly is provided on one side of the fine grinding box body, wherein a conversion cylinder is provided on the outer surface of the fine grinding box body, a conversion groove is provided inside the conversion cylinder, a placement assembly is provided inside the conversion groove, a milling cutter is provided at one end of the placement assembly, four groups of milling cutters are provided, the fineness of the four groups of milling cutters are different, one side of the conversion cylinder is connected to the fine grinding box body, and the conversion groove is provided inside the conversion cylinder. The motor inside the body is connected, wherein a placement cylinder is arranged inside the conversion slot, a telescopic push rod is arranged at one end of the placement cylinder, a rotating seat is arranged at the other end of the placement cylinder, a mounting sleeve is arranged on one side of the rotating seat, the outer surface of the mounting sleeve is connected to the milling cutter, a detection unit is arranged on the outer surface of the placement cylinder, and four groups of detection units are arranged inside, and detection modules A, detection module B, detection module C and detection module D are respectively arranged on four groups of milling cutters with different fineness. A processing module is provided inside the processing unit, one side of the processing module is signal-connected with a horizontal height setting module, one side of the horizontal height setting module is connected with a height calculation module, one side of the height calculation module is provided with a difference calculation module, and one side of the difference calculation module is provided with a judgment module. The lowest height value of the milling cutter in the conversion slot is set by the horizontal height setting module, and the vertical distance between the processing unit and the detection module A, the detection module B, the detection module C and the detection module D respectively can be calculated by the height calculation module. At the same time, the height difference is calculated by the difference calculation module, and finally the judgment module is used to make a judgment. The judgment result is fed back to the telescopic push rod through the processing module. If the vertical distance between the detection module A and the processing unit is the largest, the placement cylinder of the detection module A is installed, and the telescopic push rod on one side thereof responds to extend the corresponding placement cylinder out of the conversion slot, so that the corresponding milling cutter can grind the product to be processed, and the other three groups of milling cutters remain in a tightened state. By analogy, it can be achieved that when one group of milling cutters is located at the farthest opposite side of the processing unit, it starts working, and the others are in a stagnant state, so that different tools can be replaced at any time to improve work efficiency.

[0019] 2. The cylindrical grinder for semiconductor single crystal silicon processing proposed by the present invention has a clamping box body at the upper end of the table, a rotating assembly is arranged on one side of the clamping box body, a clamping piece is arranged on the other side of the clamping box body, an air collecting hood is arranged on the outer surface of the clamping box body, a connecting hose is arranged on the outer surface of the air collecting hood, the connecting hose is connected to the clamping piece, a driving motor is arranged on the outer surface of the clamping box body, a driving shaft is arranged at one end of the driving motor, a fan blade is arranged on the outer surface of the driving shaft, the driving shaft is arranged through the inside of the clamping box body, one end of the driving shaft is connected to the clamping piece, a connecting flange is arranged on the outer surface of the clamping box body, a connecting disk is arranged on one side of the connecting flange, a driving cylinder is arranged on one side of the connecting disk, a locking assembly is arranged on one end of the driving cylinder, one end of the driving shaft is connected to the driving cylinder through the connecting flange and the connecting disk, and the driving cylinder and the conversion cylinder are arranged in the same horizontal plane. A side plate is provided on one side of the driving cylinder, a side groove is provided on the outer surface of the side plate, a vertical block is provided inside the side groove, and two groups of vertical blocks are provided. One side of the vertical block of one group is provided with an extrusion spring, and one side of the vertical block of the other group is provided with a telescopic tube. Locking air cushions are provided on the outer surfaces of the vertical blocks of the two groups. The air collecting hood is connected with the telescopic tube through a connecting hose. When the driving shaft drives the driving cylinder to rotate, the fan blades will also rotate accordingly. The airflow generated by the fan blades will enter the air collecting hood and finally enter the telescopic tube, so that the telescopic tube is in an extended state, so that the locking air cushion of one group plays a fixed limiting role for the product to be processed, and when the driving shaft rotates, the telescopic tube will always be in an extended state, thereby preventing the product to be processed from loosening during the processing, improving the fixing quality, and preventing processing accidents. The locking air cushion has less damage to the product to be processed.

[0020] 3. The cylindrical grinder for semiconductor single crystal silicon processing proposed by the present invention has a notch on the upper surface of the processing table, a receiving mechanism is arranged inside the notch, an external pipe is arranged on one side of the processing table, an inflatable bag is arranged on the outer surface of the external pipe, the external pipe is connected with the inflatable bag, the external pipe is connected with an external gas source, a receiving vertical pipe is arranged inside the notch, an insert block is arranged inside the receiving vertical pipe, a socket is arranged inside the insert block, a magnetic suction plate and a connecting spring are arranged inside the socket, two groups of magnetic suction plates are arranged, and the two groups of magnetic suction plates are connected to the inner wall of the socket through the connecting spring Secondly, an engaging rod is provided at the lower end of the engaging plate, and a magnetic insert is provided on the lower bottom surface of the engaging rod. The magnetic insert is engaged with the socket, and the magnetic insert has the same magnetic property as the magnetic suction plate. The upper surface of the plug block is magnetically connected to the lower bottom surface of the engaging plate. When the table is installed, the engaging rod will be inserted into the socket. At the same time, a repulsive force will be generated between the magnetic insert and the magnetic suction plate, so that the two groups of magnetic suction plates are forced to open. At the same time, the external pipe is connected to the external air pump, and the air pump is used to extract the gas inside the socket, so that the engaging rod will be more fixed in the socket, thereby improving the overall stability of the table during work. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of the cylindrical grinding machine used for semiconductor single crystal silicon processing according to the present invention;

[0022] Figure 2 It is a schematic diagram of the connection structure between the processing table and the table plate of the cylindrical grinder used for semiconductor single crystal silicon processing of the present invention;

[0023] Figure 3 This is a schematic diagram of the structure of the moving mechanism of the cylindrical grinder used for semiconductor single crystal silicon processing of the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of the clamping mechanism of the cylindrical grinder used for semiconductor single crystal silicon processing of the present invention;

[0025] Figure 5 This is a schematic diagram of the structure of the rotating assembly of the cylindrical grinder used for semiconductor single crystal silicon processing of the present invention;

[0026] Figure 6 This is a schematic diagram of the structure of the cylindrical grinder clamping member used for semiconductor single crystal silicon processing according to the present invention;

[0027] Figure 7 This is a schematic diagram of the structure of a locking assembly of a cylindrical grinder for semiconductor single crystal silicon processing according to the present invention;

[0028] Figure 8 This is a schematic diagram of the structure of the fine grinding mechanism of the cylindrical grinder used for semiconductor single crystal silicon processing of the present invention;

[0029] Fig. 9 It is a schematic diagram of the structure of the conversion fine grinding assembly of the cylindrical grinder used for semiconductor single crystal silicon processing of the present invention;

[0030] Fig.10 This is a schematic diagram of the structure of the placement assembly of the cylindrical grinder for semiconductor single crystal silicon processing of the present invention;

[0031] Fig.11 It is a schematic diagram of the connection structure between the clamping plate and the corresponding vertical pipe of the cylindrical grinder used for semiconductor single crystal silicon processing of the present invention;

[0032] Fig.12 This is a schematic diagram of the internal structure of the insert block of the cylindrical grinder used for semiconductor single crystal silicon processing of the present invention;

[0033] Fig.13 The present invention is a flowchart of the working procedures of the processing unit and the detection unit of the cylindrical grinder for semiconductor single crystal silicon processing.

[0034] In the figure: 1, processing table; 11, notch; 12, external pipe; 13, inflatable bag; 2, table; 21, T-slot; 3, fine grinding mechanism; 31, fine grinding box; 32, vertical slot; 33, vertical block; 34, processing unit; 341, processing module; 342, level setting module; 343, height calculation module; 344, difference calculation module; 345, judgment module; 35, conversion fine grinding assembly; 351, conversion cylinder; 352, conversion slot; 353, placement assembly; 3531, placement cylinder; 3532, telescopic push rod; 3533, rotating seat; 3534, installation sleeve; 354, milling cutter; 355, detection unit; 3551, detection module A; 3552, detection module B; 3553, detection module C; 3554, detection module D; 4, clamping mechanism; 41, Clamping box; 42, rotating assembly; 421, driving motor; 422, driving shaft; 423, fan blade; 43, clamping member; 431, connecting flange; 432, connecting plate; 433, driving cylinder; 434, locking assembly; 4341, side plate; 4342, side groove; 4343, vertical block; 4344, extrusion spring; 4345, telescopic tube; 4346, locking air cushion; 44, collection Air hood; 45, connecting hose; 5, moving mechanism; 51, center rod; 52, electric push rod; 53, side rod A; 531, sleeve A; 54, side rod B; 541, sleeve B; 542, perforation; 6, connecting mechanism; 61, connecting vertical pipe; 62, plug block; 621, socket; 622, magnetic plate; 623, connecting spring; 7, snap plate; 71, interlocking rod; 72, magnetic insert. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] In order to solve the technical problem of how to replace different tools at any time, such as Figure 1-3 , 8-10 and Fig.13 As shown, the following preferred technical solutions are provided:

[0037] The cylindrical grinding machine for semiconductor single crystal silicon processing comprises a processing table 1, a table plate 2 arranged at the upper end of the processing table 1, and a fine grinding mechanism 3 arranged at the upper end of the table plate 2. A clamping mechanism 4 is also arranged at the upper end of the table plate 2. Both sides of the fine grinding mechanism 3 and the clamping mechanism 4 are provided with a moving mechanism 5. A receiving mechanism 6 is arranged inside the processing table 1. A clamping plate 7 is arranged at the lower end of the table plate 2. A T-slot 21 is opened on the upper surface of the table plate 2. The table plate 2 is movably connected with the fine grinding mechanism 3 and the clamping mechanism 4 through the T-slot 21. The fine grinding mechanism 3 comprises a fine grinding box body 31 arranged on the upper surface of the table plate 2, and a vertical plate 7 is arranged on one side of the fine grinding box body 31. A groove 32, a vertical block 33 arranged inside the vertical groove 32, and a processing unit 34 arranged on the outer surface of the vertical block 33, a conversion fine grinding component 35 is arranged on one side of the fine grinding box 31, and the conversion fine grinding component 35 includes a conversion cylinder 351 arranged on the outer surface of the fine grinding box 31, a conversion groove 352 is arranged inside the conversion cylinder 351, and a placement component 353 is arranged inside the conversion groove 352. A milling cutter 354 is arranged at one end of the placement component 353. The milling cutter 354 is arranged in four groups, and the fineness of the four groups of milling cutters 354 is different. One side of the conversion cylinder 351 is connected to the motor arranged inside the fine grinding box 31.

[0038] The placement assembly 353 includes a placement cylinder 3531 arranged inside the conversion slot 352, a telescopic push rod 3532 arranged at one end of the placement cylinder 3531, a rotating seat 3533 arranged at the other end of the placement cylinder 3531, and a mounting sleeve 3534 arranged on one side of the rotating seat 3533. The outer surface of the mounting sleeve 3534 is connected to the milling cutter 354. A detection unit 355 is arranged on the outer surface of the placement cylinder 3531. The detection unit 355 is arranged in four groups. The four groups of detection units 355 are respectively provided with detection modules A3551, detection modules B3552, detection modules C3553 and detection modules D3554. The detection modules A3551, detection modules B3552, detection modules C3553 and detection modules D3554 are respectively arranged on four groups of milling cutters 354 with different fineness.

[0039] The processing unit 34 is internally provided with a processing module 341, one side of the processing module 341 is signal-connected to a horizontal height setting module 342, one side of the horizontal height setting module 342 is connected to a height calculation module 343, one side of the height calculation module 343 is provided with a difference calculation module 344, and one side of the difference calculation module 344 is provided with a determination module 345.

[0040] The moving mechanism 5 includes a center rod 51 and an electric push rod 52 arranged above the table 2. Side rods A53 and side rods B54 are respectively arranged at both ends of the center rod 51. The side rod A53 is connected to the clamping box 41, and the side rod B54 is connected to the fine grinding box 31. A sleeve A531 is arranged on the outer surface of the side rod A53, and a sleeve B541 is arranged on the outer surface of the side rod B54. A through hole 542 is arranged on the outer surface of the sleeve B541. One end of the center rod 51 is connected to the sleeve A531, and the other end of the center rod 51 is connected to the through hole 542. The two ends of the electric push rod 52 are respectively connected to the sleeve A531 and the sleeve B541.

[0041] Specifically, the minimum height value of the milling cutter 354 in the conversion slot 352 is set by the horizontal height setting module 342, and the vertical distances between the processing unit 34 and the detection module A3551, the detection module B3552, the detection module C3553 and the detection module D3554 can be calculated by the height calculation module 343. At the same time, the height difference is calculated by the difference calculation module 344, and finally the judgment module 345 is used to make a judgment. The judgment result is fed back to the telescopic push rod 3532 through the processing module 341. If the detection module A3551 When the vertical distance between the processing unit 34 is the largest, the placement cylinder 3531 of the detection module A3551 is installed, and the telescopic push rod 3532 on one side responds to extend the corresponding placement cylinder 3531 out of the conversion slot 352, so that the corresponding milling cutter 354 can grind the product to be processed, and the other three groups of milling cutters 354 remain in a tightened state, and so on. When one group of milling cutters 354 is located at the farthest opposite side of the processing unit 34, it starts working, and the others are in a stagnant state, so that different tools can be replaced at any time to improve work efficiency.

[0042] In order to solve the technical problem of how to prevent the products to be processed from loosening during the processing, such as Figure 4-7 As shown, the following preferred technical solutions are provided:

[0043] The clamping mechanism 4 includes a clamping box 41 arranged at the upper end of the table 2, a rotating assembly 42 arranged on one side of the clamping box 41, a clamping piece 43 arranged on the other side of the clamping box 41, and an air collecting hood 44 arranged on the outer surface of the clamping box 41. A connecting hose 45 is arranged on the outer surface of the air collecting hood 44, and the connecting hose 45 is connected to the clamping piece 43. The rotating assembly 42 includes a driving motor 421 arranged on the outer surface of the clamping box 41, a driving shaft 422 arranged at one end of the driving motor 421, and a fan blade 423 arranged on the outer surface of the driving shaft 422. The driving shaft 422 passes through the interior of the clamping box 41, and one end of the driving shaft 422 is connected to the clamping piece 43.

[0044] The clamping member 43 includes a connecting flange 431 arranged on the outer surface of the clamping box 41, a connecting disk 432 arranged on one side of the connecting flange 431, and a driving cylinder 433 arranged on one side of the connecting disk 432. A locking assembly 434 is arranged at one end of the driving cylinder 433. One end of the driving shaft 422 passes through the connecting flange 431 and the connecting disk 432 and is connected to the driving cylinder 433. The driving cylinder 433 and the conversion cylinder 351 are arranged in the same horizontal plane.

[0045] The locking assembly 434 includes a side plate 4341 arranged on one side of the driving cylinder 433, a side groove 4342 opened on the outer surface of the side plate 4341, and a vertical block 4343 arranged inside the side groove 4342. The vertical blocks 4343 are provided in two groups, one group of vertical blocks 4343 is provided with a compression spring 4344 on one side, and the other group of vertical blocks 4343 is provided with a telescopic tube 4345 on one side. Locking air cushions 4346 are provided on the outer surfaces of the two groups of vertical blocks 4343, and the air collecting hood 44 is connected to the telescopic tube 4345 through a connecting hose 45.

[0046] Specifically, when the driving shaft 422 drives the driving cylinder 433 to rotate, the fan blade 423 will also rotate accordingly. The airflow generated by the fan blade 423 will enter the air collecting hood 44, and finally enter the telescopic tube 4345, so that the telescopic tube 4345 is in an extended state, so that a group of locking air cushions 4346 in it can play a fixed limiting role for the product to be processed, and when the driving shaft 422 rotates, the telescopic tube 4345 will always be in an extended state, thereby preventing the product to be processed from loosening during the processing, improving the fixing quality, and preventing processing accidents.

[0047] In order to solve the technical problem of how to improve the overall working stability of the table 2, such as Figure 2 , Fig.11 and Fig.12 As shown, the following preferred technical solutions are provided:

[0048] A notch 11 is provided on the upper surface of the processing table 1, and the receiving mechanism 6 is arranged inside the notch 11. An external tube 12 is provided on one side of the processing table 1, and an inflatable bag 13 is provided on the outer surface of the external tube 12. The external tube 12 is connected to the inflatable bag 13, and the external tube 12 is connected to an external air source.

[0049] The connecting mechanism 6 includes a connecting vertical pipe 61 arranged inside the slot 11 and an insert block 62 arranged inside the connecting vertical pipe 61, a socket 621 is arranged inside the insert block 62, a magnetic plate 622 and a connecting spring 623 are arranged inside the socket 621, two groups of magnetic plates 622 are arranged, and the two groups of magnetic plates 622 are connected to the inner wall of the socket 621 through the connecting spring 623.

[0050] A locking rod 71 is provided at the lower end of the locking plate 7, and a magnetic locking plate 72 is provided on the lower bottom surface of the locking rod 71. The magnetic locking plate 72 is locked and connected with the plug hole 621, and the magnetic locking plate 72 and the magnetic attraction plate 622 have the same magnetic properties. The upper surface of the plug block 62 is magnetically connected to the lower bottom surface of the locking plate 7.

[0051] Specifically, when the table 2 is installed, the engaging rod 71 will be inserted into the socket 621, and at the same time, a repulsive force will be generated between the magnetic embedded plate 72 and the magnetic attraction plate 622, so that the two groups of magnetic attraction plates 622 are forced to open, and at the same time, the external pipe 12 is connected to the external air pump, and the air pump is used to extract the gas inside the socket 621, so that the engaging rod 71 will be more fixed in the socket 621, thereby improving the overall stability of the table 2 during operation.

[0052] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A cylindrical grinding machine for semiconductor single crystal silicon processing, comprising a processing table (1), a table plate (2) arranged at the upper end of the processing table (1), and a fine grinding mechanism (3) arranged at the upper end of the table plate (2), characterized in that: A clamping mechanism (4) is also provided at the upper end of the table (2), moving mechanisms (5) are provided on both sides of the fine grinding mechanism (3) and the clamping mechanism (4), a receiving mechanism (6) is provided inside the processing table (1), a clamping plate (7) is provided at the lower end of the table (2), a T-shaped groove (21) is provided on the upper surface of the table (2), and the table (2) is movably connected to the fine grinding mechanism (3) and the clamping mechanism (4) through the T-shaped groove (21); The fine grinding mechanism (3) comprises a fine grinding box (31) arranged on the upper surface of the table (2), a vertical groove (32) arranged on one side of the fine grinding box (31), a vertical block (33) arranged inside the vertical groove (32), and a processing unit (34) arranged on the outer surface of the vertical block (33); a conversion fine grinding component (35) is arranged on one side of the fine grinding box (31); the conversion fine grinding component (35) comprises a conversion cylinder (351) arranged on the outer surface of the fine grinding box (31); a conversion groove (352) is arranged inside the conversion cylinder (351); a placement component (353) is arranged inside the conversion groove (352); a milling cutter (354) is arranged at one end of the placement component (353); four groups of milling cutters (354) are arranged; four groups of placement components are arranged and correspond to the milling cutters one by one; the fineness of the four groups of milling cutters (354) are different; one side of the conversion cylinder (351) is connected to a motor arranged inside the fine grinding box (31); The placement assembly (353) comprises a placement cylinder (3531) arranged inside the conversion slot (352), a telescopic push rod (3532) arranged at one end of the placement cylinder (3531), a rotating seat (3533) arranged at the other end of the placement cylinder (3531), and a mounting sleeve (3534) arranged on one side of the rotating seat (3533); the outer surface of the mounting sleeve (3534) is connected to the milling cutter (354); a detection unit (355) is arranged on the outer surface of the placement cylinder (3531); four groups of the detection units (355) are arranged; detection modules A (3551), detection modules B (3552), detection modules C (3553) and detection modules D (3554) are respectively arranged inside the four groups of detection units (355); the detection modules A (3551), detection modules B (3552), detection modules C (3553) and detection modules D (3554) are respectively arranged on four groups of milling cutters (354) with different fineness; A processing module (341) is provided inside the processing unit (34), one side of the processing module (341) is signal-connected to a horizontal height setting module (342), one side of the horizontal height setting module (342) is connected to a height calculation module (343), one side of the height calculation module (343) is provided with a difference calculation module (344), and one side of the difference calculation module (344) is provided with a determination module (345). The horizontal height setting module (342) is used to set the lowest height value of the milling cutter (354) in the conversion slot (352), and the height calculation module (343) can calculate the vertical distances between the processing unit (34) and the detection module A (3551), the detection module B (3552), the detection module C (3553) and the detection module D (3554), respectively. At the same time, the difference calculation module (344) is used to calculate the height difference, and finally the determination module (345) is used to make a determination, and the determination result is fed back to the telescopic push rod (3532) through the processing module (341).

2. The cylindrical grinding machine for semiconductor single crystal silicon processing according to claim 1, characterized in that: The clamping mechanism (4) comprises a clamping box (41) arranged at the upper end of the table (2), a rotating assembly (42) arranged at one side of the clamping box (41), a clamping member (43) arranged at the other side of the clamping box (41), and an air collecting hood (44) arranged on the outer surface of the clamping box (41); a connecting hose (45) is arranged on the outer surface of the air collecting hood (44); the connecting hose (45) is connected to the clamping member (43); the rotating assembly (42) comprises a driving motor (421) arranged on the outer surface of the clamping box (41), a driving shaft (422) arranged at one end of the driving motor (421), and a fan blade (423) arranged on the outer surface of the driving shaft (422); the driving shaft (422) is arranged to penetrate the interior of the clamping box (41), and one end of the driving shaft (422) is connected to the clamping member (43).

3. The cylindrical grinding machine for semiconductor single crystal silicon processing according to claim 2, characterized in that: The clamping member (43) comprises a connecting flange (431) arranged on the outer surface of the clamping box (41), a connecting disk (432) arranged on one side of the connecting flange (431), and a driving cylinder (433) arranged on one side of the connecting disk (432); a locking assembly (434) is arranged at one end of the driving cylinder (433); one end of the driving shaft (422) passes through the connecting flange (431) and the connecting disk (432) and is connected to the driving cylinder (433); and the driving cylinder (433) and the conversion cylinder (351) are arranged in the same horizontal plane.

4. The cylindrical grinding machine for semiconductor single crystal silicon processing according to claim 3, characterized in that: The locking assembly (434) comprises a side plate (4341) arranged on one side of the driving cylinder (433), a side groove (4342) provided on the outer surface of the side plate (4341), and a vertical block (4343) arranged inside the side groove (4342). The vertical blocks (4343) are provided in two groups, one group of vertical blocks (4343) is provided with a compression spring (4344) on one side, and the other group of vertical blocks (4343) is provided with a telescopic tube (4345) on one side. The outer surfaces of the vertical blocks (4343) of the two groups are both provided with locking air cushions (4346), and the air collecting hood (44) is connected to the telescopic tube (4345) via a connecting hose (45).

5. The cylindrical grinding machine for semiconductor single crystal silicon processing according to claim 4, characterized in that: The moving mechanism (5) comprises a center rod (51) and an electric push rod (52) arranged above the table (2); side rods A (53) and side rods B (54) are respectively arranged at two ends of the center rod (51); the side rod A (53) is connected to the clamping box (41); the side rod B (54) is connected to the fine grinding box (31); a sleeve A (531) is arranged on the outer surface of the side rod A (53); a sleeve B (541) is arranged on the outer surface of the side rod B (54); a through hole (542) is arranged on the outer surface of the sleeve B (541); one end of the center rod (51) is connected to the sleeve A (531); the other end of the center rod (51) is connected to the through hole (542); and the two ends of the electric push rod (52) are respectively connected to the sleeve A (531) and the sleeve B (541).

6. The cylindrical grinding machine for semiconductor single crystal silicon processing according to claim 5, characterized in that: The upper surface of the processing table (1) is provided with a notch (11), the receiving mechanism (6) is arranged inside the notch (11), an external pipe (12) is provided on one side of the processing table (1), an inflatable bag (13) is provided on the outer surface of the external pipe (12), the external pipe (12) is connected to the inflatable bag (13), and the external pipe (12) is connected to an external air source.

7. The cylindrical grinding machine for semiconductor single crystal silicon processing according to claim 6, characterized in that: The connecting mechanism (6) comprises a connecting vertical pipe (61) arranged inside the slot (11) and an insert block (62) arranged inside the connecting vertical pipe (61); a plug hole (621) is arranged inside the insert block (62); a magnetic attraction plate (622) and a connecting spring (623) are arranged inside the plug hole (621); two groups of magnetic attraction plates (622) are provided, and both groups of magnetic attraction plates (622) are connected to the inner wall of the plug hole (621) via the connecting spring (623).

8. The cylindrical grinding machine for semiconductor single crystal silicon processing according to claim 7, characterized in that The lower end of the locking plate (7) is provided with a locking rod (71), and the lower bottom surface of the locking rod (71) is provided with a magnetic insert (72), the magnetic insert (72) is locked and connected with the plug hole (621), and the magnetic insert (72) and the magnetic attraction plate (622) have the same magnetic properties, and the upper surface of the plug block (62) is magnetically connected with the lower bottom surface of the locking plate (7).

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