A wafer glass carrier thickness measurement and classification device

Abstract

This invention relates to the field of wafer glass wafer inspection technology, and discloses a wafer glass wafer thickness measurement and classification device, including a base. A mounting plate is fixedly installed on the left outer wall of the base, and a robotic arm is fixedly installed on the top of the mounting plate. The robotic arm drives a cylinder to move, which in turn drives a suction cup holder to move, moving the suction cup to the glass wafer. The suction cup grips and releases the glass wafer, realizing basic loading and unloading operations. Multiple suction cups are set to grip multiple glass wafers simultaneously, realizing simultaneous thickness measurement of multiple glass wafers. Three receiving bins are set to receive glass wafers that are smaller than the thickness requirement, glass wafers that exceed the thickness requirement, and glass wafers that meet the thickness requirement. An electric turntable drives the receiving bins to rotate, realizing the receiving and classification operation. The classification work does not require a robotic arm, reducing the workload of the robotic arm.

Description

Technical Field

[0001] The invention relates to the technical field of wafer glass carrier detection, and in particular to a wafer glass carrier thickness measurement and classification device. Background Art

[0002] Wafer glass carriers are transparent glass plates used to support and protect wafers in the semiconductor manufacturing process so that they can be used in the wafer processing process. Wafer carriers play a vital role in the semiconductor manufacturing process. Accurate measurement of their thickness can provide key feedback information to help engineers optimize each step of the manufacturing process, thereby improving overall production efficiency and the reliability of the final product. Therefore, when producing wafer glass carriers, it is necessary to measure the thickness of the finished product to ensure that the wafer glass carrier meets the factory requirements. The common thickness measurement technology is to use a manipulator with a thickness gauge to perform batch testing on wafer glass carriers. The test efficiency is high, because the manipulator needs to undertake the action of loading and unloading and classification, and the functional integration of the manipulator is required to be high. Therefore, when setting up a wafer glass carrier inspection line, in order to reduce the purchase cost of the manipulator, it is often not used that a manipulator simultaneously operates multiple wafer glass carriers (which will further improve the function and cost of the manipulator). This results in a long time for the thickness measurement of large quantities of wafer glass carriers. Summary of the invention

[0003] The object of the present invention is to provide a wafer glass carrier thickness measurement and classification device to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer glass carrier thickness measurement and classification device, comprising a base, a mounting plate is fixedly installed on the left outer wall of the base, a manipulator is fixedly installed on the top of the mounting plate, a cylinder is fixedly installed on the movable end of the manipulator, a suction cup frame is fixedly installed on the extended end of the cylinder, a suction cup is installed on the suction cup frame, and seven suction cups are provided, a mounting frame is fixedly installed on the top of the base, a thickness gauge is fixedly installed on the mounting frame, and the thickness gauge is provided with seven detection heads, and a classification mechanism is provided in the base;

[0005] The sorting mechanism comprises an electric turntable, a through slot, and a guide slide plate, wherein the electric turntable is fixedly installed inside the base, the through slot is opened at the top of the base, and the guide slide plate is fixedly installed on the left inner wall of the base, and a material receiving bin is fixedly arranged on the top of the electric turntable, and three material receiving bins are arranged, and a circular array is distributed on the electric turntable. The inner diameter of the through slot is larger than the outer diameter of the material receiving bin, and a lifting bin is slidably arranged inside the material receiving bin, and the outer wall of the lifting bin is rotatably connected with a pushing rod through a bearing, and the pushing rod movably penetrates the outer wall of the material receiving bin, and the interior of the lifting bin is rotatably connected with a rotating plate through a pin shaft, and a lifting plate is fixedly installed on the bottom inner wall of the material receiving bin, and the top end of the lifting plate movably penetrates the bottom of the lifting bin, and the outer wall of the material receiving bin is provided with a material receiving bin, and the material receiving bin is communicated with the material receiving bin, the middle of the guide slide plate is high and the two ends are low, and the upper surface of the guide slide plate is smooth, and the guide slide plate is located at the center of the left inner wall of the base.

[0006] Furthermore, the suction cup frame includes an outer frame, which is fixedly connected to the extended end of the cylinder, and a diverter pipe is fixedly installed on the inner wall of the outer frame. The suction cup is connected to the diverter pipe, and an exhaust pipe is provided on the outer wall of the diverter pipe, and a connecting head is provided at the top of the exhaust pipe.

[0007] Furthermore, an exhaust valve is provided on the outer wall of the suction cup, and the exhaust valve is an electric valve.

[0008] Furthermore, an inclined guide plate is fixedly installed on the bottom inner wall of the material receiving bin, one end of the inclined guide plate facing the material receiving bin is higher than the other end thereof, and a smooth end is provided on the end of the inclined guide plate facing the material receiving bin.

[0009] Furthermore, a hair dryer head is fixedly mounted on the top of the mounting frame, the bottom end of the hair dryer head passes through the top of the mounting frame, and an air inlet pipe is arranged on the outer wall of the hair dryer head.

[0010] Furthermore, a limiting ring is provided on the outer wall fixing sleeve of the push rod, and the outer wall of the limiting ring contacts the outer wall of the material receiving bin.

[0011] Furthermore, a connecting plate is fixedly installed on the outer wall of the material receiving bin. There are three connecting plates on the material receiving bin, one of which is fixedly connected to the top of the electric turntable by bolts, and positioning rods are inserted into the inner walls of the other two connecting plates, and the bottom ends of the positioning rods are fixedly connected to the top of the electric turntable.

[0012] Furthermore, a placement bin is fixedly installed on the front of the mounting frame, an electric telescopic rod 2 is fixedly installed on the bottom inner wall of the placement bin, a lifting plate is fixedly installed on the extended end of the electric telescopic rod 2, a placement box is placed on the top of the lifting plate, and a plurality of placement boxes are provided and stacked on the lifting plate.

[0013] Furthermore, grooves are provided on the top and bottom of the placement box, and magnets are fixedly mounted on the inner walls of the grooves, and the magnetic poles of all the magnets are in the same direction.

[0014] Furthermore, an electric telescopic rod 1 is fixedly installed on the left outer wall of the base, and a push plate is fixedly installed on the extended end of the electric telescopic rod 1. The push plate extends into the placement bin and contacts the topmost placement box.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The cylinder is driven by the manipulator to move, and then the suction cup frame is driven to move, and the suction cup is moved to the glass slide. The glass slide is grabbed and released by the suction cup to realize basic loading and unloading operations. Multiple suction cups are set to grab multiple glass slides at the same time to realize simultaneous thickness measurement of multiple glass slides. Three receiving bins are set to receive glass slides with thickness less than the required thickness, glass slides with thickness exceeding the required thickness, and glass slides that meet the required thickness. The receiving bin is driven by the electric turntable to rotate to realize the operation of receiving and sorting materials. There is no need for the manipulator to perform sorting work, which reduces the work demand on the manipulator;

[0017] 2. A lifting bin is arranged in the receiving bin. When receiving the material, the lifting bin is lifted to take out the glass slide released by the suction cup. The guide slide guides the push rod, so that when the receiving bin rotates to the leftmost side, the guide slide lifts the push rod, so that the push rod drives the lifting bin to move up and extend out of the receiving bin, thereby reducing the free fall distance of the glass slide, and realizing the safe receiving of the glass slide. After the receiving bin rotates to the other positions, the guide slide no longer lifts the push rod, so that the lifting bin falls. As the lifting bin falls, the lifting plate contacts the rotating plate, so that the rotating plate rotates, and the glass slide on the rotating plate slides into the receiving bin, thereby realizing the receiving and dividing operations.

[0018] 3. An inclined guide plate is provided so that the glass slides that slide from the rotating plate to the receiving bin can slide along the inclined guide plate to the other side of the receiving bin, thereby preventing the glass slides from piling up and causing the glass slides on the rotating plate to be unable to slide down. A smooth end is provided so that the glass slides will not be stuck when sliding from the rotating plate to the inclined guide plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention;

[0020] Figure 2 It is a structural schematic diagram of the base and the classification mechanism of the present invention;

[0021] Figure 3 It is a structural schematic diagram of the front view of the electric turntable of the present invention;

[0022] Figure 4 It is a structural schematic diagram of a cross-sectional view of a receiving bin of the present invention;

[0023] Figure 5 It is a structural schematic diagram of the manipulator, suction cup frame and suction cup of the present invention;

[0024] Figure 6 It is a structural schematic diagram of the placement box and the electric telescopic rod 2 of the present invention;

[0025] Figure 7 It is a structural schematic diagram of the guide slide plate of the present invention;

[0026] Figure 8 It is a structural schematic diagram of the placement box of the present invention.

[0027] In the figure: 1. base; 2. mounting plate; 3. mounting frame; 4. thickness gauge; 5. manipulator; 6. classification mechanism; 601. electric turntable; 602. through slot; 603. receiving bin; 604. lifting bin; 605. push rod; 606. receiving bin; 607. rotating plate; 608. lifting plate; 609. guide slide; 7. cylinder; 8. suction cup frame; 801. outer frame; 802. shunt pipe; 803. exhaust pipe; 9. suction cup; 901. exhaust valve; 10. limit ring; 11. connecting plate; 12. positioning rod; 13. inclined guide plate; 14. hair dryer; 15. placement bin; 16. electric telescopic rod 1; 17. electric telescopic rod 2; 18. lifting plate; 19. placement box; 20. push plate; 21. magnet. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0029] See also Figure 1-Figure 8 The present invention provides a technical solution: a wafer glass carrier thickness measurement and classification device, comprising a base 1, a mounting plate 2 is fixedly installed on the left outer wall of the base 1, a manipulator 5 is fixedly installed on the top of the mounting plate 2, a cylinder 7 is fixedly installed on the movable end of the manipulator 5, a suction cup frame 8 is fixedly installed on the extended end of the cylinder 7, a suction cup 9 is installed on the suction cup frame 8, and seven suction cups 9 are provided, a mounting frame 3 is fixedly installed on the top of the base 1, a thickness gauge 4 is fixedly installed on the mounting frame 3, and the thickness gauge 4 is provided with seven detection heads, and a classification mechanism 6 is provided in the base 1;

[0030] The classification mechanism 6 includes an electric turntable 601, a through slot 602, and a guide slide 609. The electric turntable 601 is fixedly installed inside the base 1. The through slot 602 is opened at the top of the base 1. The guide slide 609 is fixedly installed on the left inner wall of the base 1. A material receiving bin 603 is fixedly arranged on the top of the electric turntable 601. There are three material receiving bins 603, and a circular array is distributed on the electric turntable 601. The inner diameter of the through slot 602 is larger than the outer diameter of the material receiving bin 603. A lifting bin 604 is slidably arranged inside the material receiving bin 603. The outer wall of the lifting bin 604 is rotatably connected to a push rod 605 through a bearing. The push rod 605 movably penetrates the material receiving bin The outer wall of the receiving bin 603 and the interior of the lifting bin 604 are rotatably connected with a rotating plate 607 through a pin shaft, a lifting plate 608 is fixedly installed on the bottom inner wall of the receiving bin 603, and the top of the lifting plate 608 movably passes through the bottom of the lifting bin 604, and a receiving bin 606 is arranged on the outer wall of the receiving bin 603, and the receiving bin 606 is connected with the receiving bin 603, the middle of the guide slide 609 is high and the two ends are low, and the upper surface of the guide slide 609 is smooth, and the guide slide 609 is located at the center of the inner wall on the left side of the base 1, and the cylinder 7 is driven to move by the manipulator 5, and then the suction cup frame 8 is driven to move, and the suction cup 9 is moved to the glass slide, and the glass slide is grabbed and The glass slides are released to realize basic loading and unloading operations, and multiple suction cups 9 are provided for grabbing multiple glass slides at the same time to realize simultaneous thickness measurement of multiple glass slides. Three receiving bins 603 are provided to receive glass slides less than the required thickness, glass slides exceeding the required thickness, and glass slides meeting the required thickness. The receiving bins 603 are driven to rotate by the electric turntable 601 to realize the operation of receiving and classifying materials. There is no need for the robot 5 to perform the classification work, which reduces the work demand for the robot 5. A lifting bin 604 is provided in the receiving bin 603 to lift up and take out the glass slides released by the suction cups 9 when receiving materials, and use the guide slide 609 The pushing rod 605 is guided so that when the receiving bin 603 rotates to the leftmost position, the guiding slide plate 609 lifts the pushing rod 605, so that the pushing rod 605 drives the lifting bin 604 to move upward and extend out of the receiving bin 603, thereby reducing the distance of the free fall of the glass slide, and realizing the safe receiving of the glass slide. After the receiving bin 603 rotates to the other positions, the guiding slide plate 609 no longer lifts the pushing rod 605, so that the lifting bin 604 falls. As the lifting bin 604 falls, the lifting plate 608 contacts the rotating plate 607, so that the rotating plate 607 rotates, and the glass slide on the rotating plate 607 slides into the receiving bin 606, realizing the material receiving and material dividing operations.

[0031] The suction cup frame 8 includes an outer frame 801, which is fixedly connected to the extended end of the cylinder 7. A shunt pipe 802 is fixedly installed on the inner wall of the outer frame 801. The suction cup 9 is connected to the shunt pipe 802. An exhaust pipe 803 is connected to the outer wall of the shunt pipe 802. A connector is provided on the top of the exhaust pipe 803. A device for vacuuming (exhaust fan, etc.) is connected to the exhaust pipe 803 through the connector, and the shunt pipe 802 is then evacuated, so that the suction cup 9 is evacuated and the glass slide is sucked and grasped.

[0032] The outer wall of the suction cup 9 is connected to an exhaust valve 901, which is an electric valve. When the glass slide needs to be released, the exhaust valve 901 only needs to be opened to allow outside air to enter the suction cup 9, thereby realizing the control operation of a single suction cup 9.

[0033] An inclined guide plate 13 is fixedly installed on the bottom inner wall of the material receiving bin 606, and one end of the inclined guide plate 13 facing the material receiving bin 603 is higher than the other end thereof. A smooth end is provided at the end of the inclined guide plate 13 facing the material receiving bin 603. The inclined guide plate 13 is provided so that the glass slides that slide from the rotating plate 607 to the material receiving bin 606 can slide along the inclined guide plate 13 to the other side of the material receiving bin 606, so as to avoid the glass slides from piling up and causing the glass slides on the rotating plate 607 to be unable to slide down. The smooth end is provided so that the glass slides will not be stuck when sliding from the rotating plate 607 to the inclined guide plate 13.

[0034] A blow head 14 is fixedly installed on the top of the mounting frame 3, the bottom end of the blow head 14 passes through the top of the mounting frame 3, and an air inlet pipe is arranged on the outer wall of the blow head 14. The blow head 14 is arranged to blow air to the glass slide to prevent dust on the glass slide from affecting the thickness measurement data;

[0035] The outer wall of the push rod 605 is fixedly sleeved with a limit ring 10, and the outer wall of the limit ring 10 contacts the outer wall of the receiving bin 603. The limit ring 10 is provided to limit the push rod 605, and then to limit the lifting bin 604, so as to prevent the lifting bin 604 from being separated from the receiving bin 603, and to make the lifting bin 604 only slide up and down relative to the receiving bin 603;

[0036] A connecting plate 11 is fixedly installed on the outer wall of the material receiving bin 606. There are three connecting plates 11 on the material receiving bin 606, one of which is fixedly connected to the top of the electric turntable 601 by bolts, and positioning rods 12 are inserted into the inner walls of the other two connecting plates 11, and the bottom ends of the positioning rods 12 are fixedly connected to the top of the electric turntable 601;

[0037] A placement bin 15 is fixedly installed on the front of the mounting frame 3, and an electric telescopic rod 2 17 is fixedly installed on the bottom inner wall of the placement bin 15. A lifting plate 18 is fixedly installed on the extended end of the electric telescopic rod 2 17. A placement box 19 is placed on the top of the lifting plate 18. There are multiple placement boxes 19, which are stacked on the lifting plate 18. The placement box 19 is used to place the glass slide to be tested. The lifting plate 18 is driven up by the electric telescopic rod 2 17, and the placement box 19 is driven up to push the placement box 19 into the grasping range of the manipulator 5.

[0038] The top and bottom of the placement box 19 are provided with grooves, and magnets 21 are fixedly installed on the inner wall of the groove. The magnetic poles of all magnets 21 are in the same direction, and the magnets 21 attract each other, so that multiple placement boxes 19 can be stably stacked together;

[0039] An electric telescopic rod 16 is fixedly installed on the left outer wall of the base 1, and a push plate 20 is fixedly installed on the extended end of the electric telescopic rod 16. The push plate 20 extends into the placement bin 15, and the push plate 20 contacts the top placement box 19. After the glass slides in the top placement box 19 are taken out, the electric telescopic rod 16 is turned on to drive the push plate 20 to move, and the top placement box 19 is pushed away, so that the lower placement box 19 is exposed, which is convenient for the robot 5 to grab.

[0040] Working principle: When in use, the cylinder 7 is driven by the manipulator 5 to move, and then the suction cup frame 8 is driven to move, and the suction cup frame 8 moves to drive the suction cup 9 to move, grab the glass slide on the placement box 19, and then send the glass slide to the thickness measurement position, turn on the thickness gauge 4 to simultaneously detect the seven glass slides, and after the detection is completed, turn on the electric turntable 601 to drive the receiving bin 603 to rotate, and when the receiving bin 603 rotates to align with the through groove 602, open the corresponding exhaust valve 901, so that the glass slides within the distribution range fall into the lifting bin 604, until the electric turntable 601 rotates one All glass slides are received and divided, and there is no need for the robot 5 to perform the dividing operation. When the receiving bin 603 rotates and approaches the guide slide 609, the guide slide 609 lifts the push rod 605, thereby causing the lifting bin 604 to rise and extend out of the receiving bin 603. When the receiving bin 603 moves away from the guide slide 609, the lifting bin 604 falls, causing the lifting plate 608 to extend into the lifting bin 604 to lift the rotating plate 607, and then the glass slides that fall on the rotating plate 607 slide into the receiving bin 606, without the need to manually take the glass slides out of the lifting bin 604.

[0041] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present invention.

Claims

1. A wafer glass carrier thickness measurement and classification device, comprising a base (1), characterized in that: A mounting plate (2) is fixedly mounted on the left outer wall of the base (1); a manipulator (5) is fixedly mounted on the top of the mounting plate (2); a cylinder (7) is fixedly mounted on the movable end of the manipulator (5); a suction cup frame (8) is fixedly mounted on the extended end of the cylinder (7); a suction cup (9) is mounted on the suction cup frame (8); seven suction cups (9) are provided; a mounting frame (3) is fixedly mounted on the top of the base (1); a thickness gauge (4) is fixedly mounted on the mounting frame (3); the thickness gauge (4) is provided with seven detection heads; and a classification mechanism (6) is provided in the base (1); The classification mechanism (6) comprises an electric turntable (601), a through slot (602), and a guide slide (609); the electric turntable (601) is fixedly mounted inside the base (1); the through slot (602) is provided at the top of the base (1); the guide slide (609) is fixedly mounted on the left inner wall of the base (1); a material receiving bin (603) is fixedly arranged on the top of the electric turntable (601); three material receiving bins (603) are arranged and distributed in a circular array on the electric turntable (601); the inner diameter of the through slot (602) is larger than the outer diameter of the material receiving bin (603); a lifting bin (604) is slidably arranged inside the material receiving bin (603); the outer wall of the lifting bin (604) is through-grooved. A push rod (605) is rotatably connected through a bearing, and the push rod (605) movably penetrates the outer wall of the material receiving bin (603). The interior of the lifting bin (604) is rotatably connected with a rotating plate (607) through a pin shaft. A lifting plate (608) is fixedly installed on the bottom inner wall of the material receiving bin (603), and the top of the lifting plate (608) movably penetrates the bottom of the lifting bin (604). The outer wall of the material receiving bin (603) is provided with a material receiving bin (606), and the material receiving bin (606) is connected to the material receiving bin (603). The middle of the guide slide plate (609) is high and the two ends are low. The upper surface of the guide slide plate (609) is smooth, and the guide slide plate (609) is located at the center of the left inner wall of the base (1).

2. The device for measuring and classifying wafer glass carrier thickness according to claim 1, characterized in that: The suction cup frame (8) comprises an outer frame (801), the outer frame (801) is fixedly connected to the extended end of the cylinder (7), a shunt pipe (802) is fixedly installed on the inner wall of the outer frame (801), the suction cup (9) is connected to the shunt pipe (802), an air extraction pipe (803) is arranged on the outer wall of the shunt pipe (802), and a connector is arranged at the top end of the air extraction pipe (803).

3. The device for measuring and classifying wafer glass carrier thickness according to claim 1, characterized in that: The outer wall of the suction cup (9) is connected to an exhaust valve (901), and the exhaust valve (901) is an electric valve.

4. The device for measuring and classifying wafer glass carrier thickness according to claim 1, characterized in that: An inclined guide plate (13) is fixedly mounted on the bottom inner wall of the material receiving bin (606), one end of the inclined guide plate (13) facing the material receiving bin (603) is higher than the other end thereof, and a smooth end is provided on the end of the inclined guide plate (13) facing the material receiving bin (603).

5. The device for measuring and classifying wafer glass carrier thickness according to claim 1, characterized in that: A blow head (14) is fixedly mounted on the top of the mounting frame (3), the bottom end of the blow head (14) passes through the top of the mounting frame (3), and an air inlet pipe is arranged on the outer wall of the blow head (14).

6. The device for measuring and classifying wafer glass carrier thickness according to claim 1, characterized in that: The outer wall of the push rod (605) is fixedly sleeved with a limiting ring (10), and the outer wall of the limiting ring (10) is in contact with the outer wall of the material receiving bin (603).

7. The device for measuring and classifying wafer glass carrier thickness according to claim 1, characterized in that: A connecting plate (11) is fixedly installed on the outer wall of the material receiving bin (606), and there are three connecting plates (11) on the material receiving bin (606), one of which is fixedly connected to the top of the electric turntable (601) by bolts, and positioning rods (12) are inserted into the inner walls of the other two connecting plates (11), and the bottom ends of the positioning rods (12) are fixedly connected to the top of the electric turntable (601).

8. The device for measuring and classifying wafer glass carrier thickness according to claim 1, characterized in that: A placement bin (15) is fixedly mounted on the front of the mounting frame (3); an electric telescopic rod (17) is fixedly mounted on the bottom inner wall of the placement bin (15); a lifting plate (18) is fixedly mounted on the extended end of the electric telescopic rod (17); a placement box (19) is placed on the top of the lifting plate (18); a plurality of placement boxes (19) are provided and are stacked on the lifting plate (18).

9. The device for measuring and classifying wafer glass carrier thickness according to claim 8, characterized in that: The top and bottom of the placement box (19) are both provided with grooves, and magnets (21) are fixedly mounted on the inner walls of the grooves, and the magnetic poles of all the magnets (21) are in the same direction.

10. The device for measuring and classifying wafer glass carrier thickness according to claim 1, characterized in that: An electric telescopic rod (16) is fixedly mounted on the left outer wall of the base (1), and a push plate (20) is fixedly mounted on the extended end of the electric telescopic rod (16). The push plate (20) extends into the placement bin (15), and the push plate (20) contacts the top placement box (19).

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