Self-feeding wafer cutting device

Abstract

The present invention relates to the field of wafer slitting technology, and in particular to a self-feeding wafer slitting device. It comprises a base, an external loading device is arranged on the outside of the base, a bracket is fixedly connected to the upper side of the base, a rotating disk is rotatably connected to the upper side of the base, a first motor is fixedly connected inside the base, two second motors are fixedly connected to the bracket, the output shaft of the second motor is fixedly connected to a disc cutting knife rotatably connected to the bracket, a first sliding disk evenly distributed circumferentially is slidably connected to the upper side of the rotating disk, and an electric turntable is rotatably connected to the upper side of the first sliding disk. The present invention arranges a plurality of second sliding disks, and drives the plurality of second sliding disks to rotate synchronously through the rotating disk, so that the steps of horizontal slitting, longitudinal slitting, loading and unloading of the wafer are carried out synchronously, thereby improving the automatic feeding rate during wafer loading and the efficiency of wafer slitting.

Description

Technical Field

[0001] The invention relates to the technical field of wafer slitting, and in particular to a self-feeding wafer slitting device. Background Art

[0002] The wafer slitting device is a device used to divide silicon wafers into small pieces. The shape of the wafer is generally disc-shaped. During the wafer slitting process, the wafer is first loaded by automatic feeding, and a wafer is placed on the workbench. Then, the disc-shaped wafer is cut into several small pieces through the complex movement of the cutting tool. The complex movement includes several horizontal cuts and several vertical cuts. Each small piece is then inspected, and qualified small pieces are selected and collected. This makes the single cutting time of a single wafer longer, affecting the feed speed of the loading equipment and the wafer slitting rate. Summary of the invention

[0003] In order to overcome the disadvantage that a single wafer is cut for a long time at a time, which affects the feeding speed of the loading equipment and the wafer slitting rate, the present invention provides a self-feeding wafer slitting device.

[0004] The technical solution of the present invention is: a self-feeding wafer slitting device, comprising a base, an external loading device is arranged on the outside of the base, a bracket is fixedly connected to the upper side of the base, a rotating disk is rotatably connected to the upper side of the base, a first motor is fixedly connected in the base, an output shaft of the first motor is fixedly connected to the rotating disk, two second motors are fixedly connected to the bracket, the output shaft of the second motor is fixedly connected to a disc cutting knife rotatably connected to the bracket, a first sliding disk uniformly distributed circumferentially is slidably connected to the upper side of the rotating disk, an electric turntable is rotatably connected to the upper side of the first sliding disk, the electric turntable is slidably connected to an electromagnetic slider through an electromagnetic slide rail, a second sliding disk is fixedly connected to the electromagnetic slider, an electrically-controlled telescopic rod is fixedly connected to the rotating disk, the telescopic end of the electrically-controlled telescopic rod is fixedly connected to the adjacent first sliding disk, and the circumferentially uniformly distributed first sliding disks are transmitted together through a transmission member.

[0005] More preferably, a connecting pipe is fixedly connected to the bracket, a connecting shell is rotatably connected to the connecting pipe and connected to the connecting shell, two cleaning pipes are fixedly connected to the connecting shell and connected to the connecting shell, the cleaning pipe passes through the bracket, a water outlet is provided on the cleaning pipe, the water outlet of the cleaning pipe faces the lower side of the adjacent disc cutting knife, a rotating ring connected to an external water pump is rotatably connected to the connecting pipe, a circular through hole is provided on one side of the connecting pipe close to the rotating ring, a reducing through hole is provided on the rotating ring, and the circular through hole is connected and cooperated with the reducing through hole.

[0006] More preferably, the inner diameter of the cleaning pipe near the position of the electrically-controlled telescopic rod is larger than the inner diameter of the cleaning pipe far from the position of the electrically-controlled telescopic rod.

[0007] More preferably, a gear is fixedly connected to the rotating ring, a sliding block is slidably connected to the bracket, the sliding block is fixedly connected to a rack meshing with the gear through a connecting rod, an elastic telescopic rod is fixedly connected to the side of the second sliding disk close to the rack, and the telescopic end of the elastic telescopic rod is fixedly connected to a wedge block that is extruded and matched with the rack.

[0008] More preferably, the friction resistance between the sliding block and the bracket is smaller than the friction resistance when the wedge block squeezes the rack and generates relative displacement.

[0009] More preferably, a cleaning disk is fixedly connected to and communicated with the rotating ring, and the cleaning disk is used to rinse the surface of the second sliding disk.

[0010] More preferably, an arc-shaped disk is fixedly connected to the bracket, a cotton cloth for absorbing water is arranged on the lower side of the arc-shaped disk, and the upper surface of the second sliding disk is parallel to the lower surface of the arc-shaped disk.

[0011] More preferably, it further includes a fixed plate that is evenly distributed in the circumference, the fixed plate is slidably connected in the adjacent second sliding disk, an elastic member is fixed between the fixed plate and the adjacent second sliding disk, the upper side of the fixed plate is fixed with fixed blocks that are evenly distributed in the circumference and pass through the adjacent second sliding disk, a sliding resistor electrically connected to the electromagnetic slider is fixed to the second sliding disk, and a sliding piece of the sliding resistor is fixed to the fixed plate.

[0012] More preferably, a trigger rod is slidably connected in a limited position in the second sliding plate, an upper side of the trigger rod is provided with an inclined surface, and a lower side of the fixing plate is provided with an inclined surface that is pressed and matched with the inclined surface adjacent to the trigger rod.

[0013] More preferably, the fixing plate has different thicknesses at different locations but the same weight, so as to maintain the balance of the fixing plate.

[0014] The beneficial effects achieved by the present invention using the above structure are as follows: 1. The present invention provides a plurality of second sliding disks, and drives the plurality of second sliding disks to rotate synchronously through the rotating disk, so that the steps of horizontal slitting, vertical slitting, loading and unloading of the wafer are performed synchronously, thereby improving the automatic feeding rate during wafer loading and the efficiency of wafer slitting;

[0015] 2. Adjust the flow area of ​​the circular through hole and the variable diameter through hole according to the size required for wafer cutting, so that the required cutting size of the wafer is proportional to the cleaning force, to prevent the cleaning force from being too strong when the wafer is cut small, which will cause the wafer to be driven by the water flow to move significantly, thereby affecting the quality of wafer cutting;

[0016] 3. The wafer debris remaining on the second sliding plate is adaptively flushed by the cleaning plate to avoid excessive wafer debris and insufficient cleaning force, resulting in residual wafer debris on the second sliding plate, which causes uneven placement of subsequent wafers and affects subsequent slitting;

[0017] 4. The moving speed of the electromagnetic slider is adjusted by the sliding rheostat to prevent the wafer from being too thick and the cutting speed from being too fast, causing the wafer to be compressed and broken during the cutting process. At the same time, the cutting speed is increased when the wafer is too thin, thereby improving the efficiency of wafer cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0019] Figure 2 It is a three-dimensional structural cross-sectional view of the base of the present invention;

[0020] Figure 3 It is a three-dimensional structural cross-sectional view of the rotating disk of the present invention;

[0021] Figure 4 It is a three-dimensional structural cross-sectional view of the bracket of the present invention;

[0022] Figure 5 It is a schematic diagram of the three-dimensional structure of the electric turntable of the present invention;

[0023] Figure 6 It is a schematic diagram of the three-dimensional structure of the connecting pipeline of the present invention;

[0024] Figure 7 It is a three-dimensional structural cross-sectional view of the connecting pipe of the present invention;

[0025] Figure 8 It is an exploded view of the three-dimensional structure of the connecting pipe and the rotating ring of the present invention;

[0026] Fig. 9 It is a schematic diagram of the three-dimensional structure of the wedge block of the present invention;

[0027] Fig.10 It is an exploded view of the three-dimensional structure of the rack and the wedge block of the present invention;

[0028] Fig.11 It is a schematic diagram of the three-dimensional structure of the rack and the wedge block of the present invention;

[0029] Fig.12 It is a three-dimensional structural cross-sectional view of the cleaning disc of the present invention;

[0030] Fig.13 It is a schematic diagram of the three-dimensional structure of the fixing plate of the present invention;

[0031] Fig.14 It is an exploded view of the three-dimensional structure of the first sliding disk and the second sliding disk of the present invention.

[0032] The meanings of the reference numerals in the figure are as follows: 1: base, 101: bracket, 102: rotating disk, 103: first motor, 104: second motor, 105: disc cutting knife, 106: first sliding disk, 1061: electromagnetic slider, 1062: electric turntable, 107: second sliding disk, 108: electric control telescopic rod, 2: connecting pipe, 201: connecting shell, 2011: cleaning pipe, 202: rotating ring, 203: circular through hole, 204: variable diameter through hole, 4: gear, 401: sliding block, 402: rack, 403: elastic telescopic rod, 404: wedge block, 6: cleaning disk, 7: arc disk, 8: fixed plate, 801: fixed block, 802: sliding rheostat, 9: trigger rod. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below.

[0034] Since the existing cutting tool movement is more complicated and each small piece needs to be inspected after cutting, qualified small pieces need to be selected and collected, which makes the single wafer cutting time longer, affecting the feed speed of the loading equipment and the wafer cutting rate.

[0035] Embodiment 1: A self-feeding wafer slitting device, see Figure 1-Figure 5, including a base 1, an external feeding device is arranged on the outside of the base 1, a control panel is installed on the base 1, a bracket 101 is fixedly connected to the upper side of the base 1, a rotating disk 102 is rotatably connected to the upper side of the base 1, a first motor 103 electrically connected to the control panel is fixedly connected inside the base 1, an output shaft of the first motor 103 is fixedly connected to the rotating disk 102, two second motors 104 are fixedly connected to the bracket 101, an angle between the two second motors 104 is 90°, with the axis of the rotating disk 102 as the center of the circle, the angle is considered with the connecting line of the two second motors 104 to the axis of the rotating disk 102 as the radius, a disc cutting knife 105 rotatably connected to the output shaft of the second motor 104 is fixedly connected, and four circumferentially evenly distributed discs are slidably connected to the upper side of the rotating disk 102. A first sliding disk 106 is rotatably connected to an electric turntable 1062 electrically connected to the control panel on the upper side of the first sliding disk 106. The electric turntable 1062 is slidably connected to an electromagnetic slider 1061 electrically connected to the control panel through an electromagnetic slide rail. A second sliding disk 107 is fixedly connected to the electromagnetic slider 1061. The electromagnetic slider 1061 is used to drive the adjacent second sliding disk 107 to move horizontally. The first sliding disk 106 and the adjacent second sliding disk 107 are used to drive the wafers thereon to move horizontally and vertically, respectively. An electric control telescopic rod 108 electrically connected to the control panel is fixedly connected to the rotating disk 102. The telescopic end of the electric control telescopic rod 108 is fixedly connected to the adjacent first sliding disk 106. The four first sliding disks 106 evenly distributed in the circumferential direction are transmitted together through a transmission member. Figure 5 The transmission member shown in the figure is composed of four racks and one gear, the racks and the gears are meshed with each other, the racks are fixedly connected to the adjacent first sliding disk 106, the gears rotate in the rotating disk 102, and one of the racks is fixedly connected to the electric telescopic rod 108. When the electric telescopic rod 108 drives a rack to move a short distance, the rack adjacent to the electric telescopic rod 108 drives the gear to rotate, and the gear drives the other racks to rotate synchronously, and the adjacent first sliding disk 106 of the rack moves.

[0036] See also Figure 4 and Figure 6-Figure 8 A connecting pipe 2 is fixedly connected to the bracket 101, and a connecting shell 201 is rotatably connected and connected to the connecting pipe 2. The connecting shell 201 is fixedly connected and connected to two cleaning pipes 2011. The cleaning pipe 2011 passes through the bracket 101. A water outlet is arranged at a position of the cleaning pipe 2011 near the adjacent disc cutting knife 105. The water outlet of the cleaning pipe 2011 faces the lower side of the adjacent disc cutting knife 105, and is used to clean the cutting part of the wafer to reduce the accumulation of debris at the cutting part of the wafer. A rotating ring 202 connected to an external water pump is rotatably connected to the connecting pipe 2. A circular through hole 203 is arranged on the lower side of the connecting pipe 2, and a reducing through hole 204 is arranged on the rotating ring 202. Figure 8From the top view, the width of the variable diameter through hole 204 gradually increases in the counterclockwise direction, and the circular through hole 203 is connected and coordinated with the variable diameter through hole 204. During the clockwise rotation of the rotating ring 202, the flow area of ​​the circular through hole 203 and the variable diameter through hole 204 gradually increases. The inner diameter of the cleaning pipe 2011 on the front side is larger than the inner diameter of the cleaning pipe 2011 on the left side. Since the wafers on the front side need to be cut into wafer strips, and the wafer strips on the left side need to be cut into small pieces, if the cleaning force on the left side is too large, the small pieces on the left side that have been cut will be driven by the cleaning water and move, which will affect the cutting of other positions of the wafer and the collection of small wafer pieces.

[0037] See also Figure 6-Figure 11 , a gear 4 is fixedly connected to the rotating ring 202, a sliding block 401 is slidably connected to the bracket 101, and the sliding block 401 is fixedly connected to a rack 402 meshing with the gear 4 through a connecting rod, and an elastic telescopic rod 403 is fixedly connected to the second sliding plate 107 near the rack 402, and a wedge-shaped portion is provided on the right side of the rack 402, and a wedge-shaped block 404 that is pressed and matched with the wedge-shaped portion of the rack 402 is fixedly connected to the telescopic end of the elastic telescopic rod 403. When a wedge block 404 is located on the right side of the wedge-shaped portion of the rack 402, the plane side of the wedge block 404 is in contact with the plane side of the wedge-shaped portion of the rack 402, and when the wedge block 404 is located on the left side of the wedge-shaped portion of the rack 402 (in the wafer cutting process, when the second sliding plate 107 is in contact with the rack 402, the wedge block 404 is in contact with the wedge-shaped portion of the rack 402. When the disk 107 drives the wafer forward for cutting, the second sliding disk 107 drives the adjacent wedge block 404 to move forward through the adjacent elastic telescopic rod 403, so that the wedge block 404 and the rack 402 lose their limit, and the wedge block 404 can move to the left side of the rack 402). If the wedge block 404 moves to the right, it moves along the inclined surface of the wedge-shaped portion of the rack 402. The friction resistance between the sliding block 401 and the bracket 101 is less than the friction resistance when the wedge block 404 squeezes the rack 402 and generates relative displacement, so that after the sliding block 401 is located at the extreme position, relative movement will occur when the wedge block 404 squeezes the rack 402, so that the rack 402 is squeezed by the adjacent wedge block 404 and moves to reset.

[0038] See also Figure 3 , Figure 4 and Fig.12A cleaning disk 6 is fixedly connected and connected to the rotating ring 202. The cleaning disk 6 is used to rinse the surface of the second sliding disk 107 and automatically adjust the rinsing force. The smaller the wafer is cut, the more water is discharged by the cleaning disk 6. During the wafer cutting process, the operator injects water into the rotating ring 202 through an external water pump. A part of the water flows into the connecting pipe 2 through the connecting point between the circular through hole 203 and the variable diameter through hole 204, and the other part of the water flows into the cleaning disk 6. The smaller the size of the wafer cutting, the smaller the flow area of ​​the circular through hole 203 and the variable diameter through hole 204, so that more water flows into the cleaning disk 6. An arc disk 7 is fixedly connected to the bracket 101. Cotton cloth for absorbing water is arranged on the lower side of the arc disk 7. The upper surface of the second sliding disk 107 is parallel to the lower surface of the arc disk 7, which is used to wipe the water stains on the upper surface of the second sliding disk 107.

[0039] When the operator needs to use the present device to cut the wafer, the operator first uses the external loading device to adsorb the wafer onto the second sliding plate 107 on the front side (the loading and adsorption devices are existing structures and are not shown in the figure), and then the operator turns on the second motor 104 on the front side and the electromagnetic slider 1061 on the front side through the control panel. The second motor 104 on the front side drives the adjacent disc cutting knife 105 to rotate, and the electromagnetic slider 1061 drives the wafer to move backward through the second sliding plate 107, and the disc cutting knife 105 cuts the wafer in the front and back directions. When the electromagnetic slider 1061 moves backward to the limit position, the disc cutting knife 105 loses contact with the wafer, and then the operator controls the telescopic end of the electric-controlled telescopic rod 108 to extend a short distance through the control panel (the extension length of the telescopic end of the electric-controlled telescopic rod 108 is the same as the length of the chip after the wafer is cut). Figure 5 For example, every time the telescopic end of the electric telescopic rod 108 moves a small distance, the disc cutting knife 105 is aligned with the next cutting position of the wafer, and the operator adjusts the amount of movement of the telescopic end of the electric telescopic rod 108 according to the required width of the wafer strip). The telescopic end of the electric telescopic rod 108 drives the adjacent second sliding plate 107 to move to the left through the adjacent first sliding plate 106 and the adjacent electric turntable 1062. After the second sliding plate 107 drives the wafer thereon to move a distance to the left (the length of the moving distance is the length required after the wafer is cut), the electromagnetic slider 1061 drives the wafer forward through the second sliding plate 107, and the disc cutting knife 105 contacts the wafer again and cuts it. The above steps are repeated until the telescopic end of the electric telescopic rod 108 is extended to the limit position, and the wafer is cut into a plurality of wafer strips.

[0040] After the wafer is cut into a plurality of wafer strips, the operator turns on the first motor 103 through the control panel, and the output shaft of the first motor 103 drives the rotating disk 102 to rotate 90° clockwise (where the rotation direction is Figure 1The top view of the rotating disk 102 is used as a reference), the rotating disk 102 drives the parts thereon to rotate, so that the second sliding disk 107 on the front side drives the wafer thereon to rotate to the left side, and the second sliding disk 107 on the right side rotates to the front side. The operator uses an external loading device to adsorb the next wafer on the second sliding disk 107 that rotates to the front side. The operator controls the telescopic end of the electric telescopic rod 108 to retract and reset through the control panel. The telescopic end of the electric telescopic rod 108 drives the adjacent first sliding disk 106 to move. When the front first sliding disk 106 moves to the right, the above steps are repeated to cut the second placed wafer.

[0041] During the process of cutting the second wafer, the wafer strip on the second sliding disk 107 on the left is rotated to be aligned with the disc cutting knife 105 on the left. The control panel controls the electric turntable 1062 on the left to rotate 90°. The electric turntable 1062 on the left drives the adjacent second sliding disk 107 to rotate through the adjacent electromagnetic slider 1061. The operator turns on the second motor 104 on the left through the control panel. The second motor 104 on the left drives the adjacent disc cutting knife 105 to rotate. At this time, the telescopic end of the electric control telescopic rod 108 drives the adjacent first sliding disk 106 to move. Figure 5 With the movement of the above-mentioned transmission parts, when the electrically-controlled telescopic rod 108 drives the adjacent first sliding plates 106 to move, the first sliding plates 106 evenly distributed circumferentially are transmitted and moved synchronously through the transmission parts, and the first sliding plate 106 on the left side moves in the front-to-back direction and the second sliding plate 107 on the left side moves in the left-to-right direction, so that the wafer strips are cut into smaller rectangular blocks. The above steps are repeated in this way, and the next wafer can be directly loaded and cut without detecting and removing the previous wafer, thereby improving the feeding speed of the external loading equipment and the efficiency of wafer cutting.

[0042] During the process of the telescopic end of the electric telescopic rod 108 extending the first section, Figure 5 As shown, the telescopic end of the electric telescopic rod 108 drives the adjacent electric turntable 1062 to move through the first sliding plate 106 on the front side, and the electric turntable 1062 drives the adjacent second sliding plate 107 to move to the left through the adjacent electromagnetic slider 1061. Figure 6 and Figure 9-11Taking the second sliding plate 107 in the figure as an example, the second sliding plate 107 on the front side drives the adjacent elastic telescopic rod 403 to move to the left, the telescopic end of the front elastic telescopic rod 403 drives the adjacent wedge block 404 to move to the left and squeezes the rack 402 to move, the rack 402 drives the gear 4 to rotate, and the gear 4 drives the rotating ring 202 to rotate, so that the flow area of ​​the circular through hole 203 and the variable diameter through hole 204 is gradually increased. The longer the distance that the telescopic end of the electric control telescopic rod 108 is extended for the first time, the larger the flow area of ​​the circular through hole 203 and the variable diameter through hole 204. During the wafer cutting process, the operator uses an external water pump to pump water. It is injected into the rotating ring 202, and part of the water flows into the connecting pipe 2 through the connecting point of the circular through hole 203 and the variable diameter through hole 204, and the other part of the water flows into the cleaning plate 6. The smaller the size of the wafer cutting, the smaller the flow area of ​​the circular through hole 203 and the variable diameter through hole 204, so that more water flows into the cleaning plate 6 and less water flows into the connecting pipe 2. The water flow entering the two cleaning pipes 2011 through the connecting shell 201 is also reduced synchronously, preventing the cleaning force from being too strong when the wafer cutting is small, thereby causing the wafer to be driven by the water flow to move significantly, thereby affecting the quality of wafer cutting.

[0043] After the front wedge block 404 moves to the left and presses the rack 402 to move, the second sliding plate 107 drives the wafer on it to move forward for cutting, and the front wedge block 404 loses contact with the rack 402 (as shown in FIG. Figure 9-11 For example, the front wedge block 404 first squeezes the rack 402, and then the front wedge block 404 is driven forward by the adjacent second sliding plate 107 through the adjacent elastic telescopic rod 403, so that the front wedge block 404 loses contact with the rack 402, and then the front wedge block 404 continues to move to the left and will not come into contact with the rack 402), then the disc cutter 105 cuts off the first wafer strip and loses contact with the wafer, and then the telescopic end of the electric-controlled telescopic rod 108 extends out of the second section, and the telescopic end of the electric-controlled telescopic rod 108 passes through the adjacent first sliding plate 10 6. The adjacent electric turntable 1062, the adjacent electromagnetic slider 1061 and the adjacent second sliding plate 107 drive the wafer to move to the left, and then the second sliding plate 107 on the front side drives the wafer thereon to move backward for cutting, and the front wedge block 404 moves to the left side of the plane of the wedge-shaped portion of the rack 402. The elastic telescopic rod 403 can ensure that the front wedge block 404 can pass through the wedge-shaped portion of the rack 402 when it moves to any position. As the second sliding plate 107 on the front side drives the wafer thereon to move to the left, the front wedge block 404 gradually moves away from the inclined surface on the rack 402.

[0044] After the second sliding plate 107 on the front side drives the wafer strip cut thereon to rotate to the left side, and the telescopic end of the electric-controlled telescopic rod 108 drives the adjacent first sliding plate 106 to move and reset, the wedge block 404 on the front side gradually approaches the inclined surface side of the rack 402. After the wedge block 404 on the front side contacts the inclined surface of the rack 402, the wedge block 404 on the front side continues to move and squeeze the inclined surface of the rack 402. Since the friction resistance between the sliding block 401 and the bracket 101 is less than the friction resistance when the wedge block 404 squeezes the rack 402 and generates relative displacement, the wedge block 404 on the front side first passes The rack 402 drives the sliding block 401 to move and reset, and the rack 402 drives the rotating ring 202 to reset through the gear 4. When the sliding block 401 moves to the extreme position, the wedge block 404 on the front side continues to squeeze the rack 402 to make the telescopic end of the adjacent elastic telescopic rod 403 shrink, and the wedge block 404 on the front side gradually moves and passes through the rack 402 until the wedge block 404 on the front side and the rack 402 are reset. At this time, the wafer on the left side is cut into small pieces, so that during the cutting process, the cleaning force of the wafer is maintained according to the size of the wafer to prevent the wafer from moving due to insufficient or excessive cleaning force.

[0045] When the wafer on the left side is cut, the operator controls the output shaft of the first motor 103 to rotate again through the control panel. The output shaft of the first motor 103 drives the rotating disk 102 to rotate 90° clockwise again, so that the cut wafer on the left side is driven to the rear side. The operator repeats the above steps and places the third wafer on the second sliding disk 107 on the front side. During the repeated cutting of the third wafer, the operator performs quality inspection on the cut wafers on the second sliding disk 107 on the rear side through external unloading equipment, and then removes and collects the cut wafers on the second sliding disk 107 on the rear side.

[0046] After the wafer on the second sliding plate 107 on the rear side is taken off, the operator controls the output shaft of the first motor 103 to rotate again through the control panel, and the output shaft of the first motor 103 drives the rotating plate 102 to rotate 90° clockwise again, and the rotating plate 102 drives the parts thereon to rotate. In the process that the second sliding plate 107 on the rear side rotates to the right, the water flow in the cleaning plate 6 is discharged and flushes the surface of the adjacent second sliding plate 107, and flushes the cut debris. It can be seen from the above content that the smaller the wafer is cut, the more cutting debris the wafer produces, and the smaller the wafer is cut, the less water flow is discharged from the two cleaning pipes 2011, which will cause more water to be discharged from the cleaning plate 6, and the wafer debris will be adaptively flushed to avoid too much wafer debris and insufficient cleaning force, resulting in residual wafer debris on the second sliding plate 107, thereby causing subsequent wafers to be unevenly placed, thereby affecting subsequent cutting.

[0047] After the cleaning disk 6 has finished flushing the adjacent second sliding disk 107, along with the rotation of the rotating disk 102, the second sliding disk 107 on the rear side gradually rotates to the lower side of the arc disk 7, and the second sliding disk 107 on the rear side contacts the cotton cloth on the lower side of the arc disk 7. The cotton cloth on the lower side of the arc disk 7 absorbs moisture on the wafer, and the above steps are repeated continuously, so that the steps of horizontal slitting, vertical slitting, detection and unloading of the wafer can be carried out simultaneously, thereby improving the efficiency of wafer slitting.

[0048] When the device is no longer in use, the operator controls the first motor 103, the second motor 104, the electric turntable 1062 of the first sliding disk 106, the electromagnetic slider 1061 and the electric telescopic rod 108 to reset through the control panel, and turns off the external loading device, the external unloading device, the first motor 103, the second motor 104, the electric turntable 1062, the electromagnetic slider 1061 and the electric telescopic rod 108, and then cleans the device for the next use.

[0049] Example 2: Based on Example 1, please refer to Figure 12-14 , further comprising four fixed plates 8 evenly distributed in the circumferential direction, the fixed plates 8 being slidably connected in the adjacent second sliding disks 107, an elastic member being fixedly connected between the fixed plates 8 and the adjacent second sliding disks 107, wherein the elastic member is a tension spring, four fixed blocks 801 evenly distributed in the circumferential direction and passing through the adjacent second sliding disks 107 being fixedly connected to the upper side of the fixed plate 8, a sliding rheostat 802 electrically connected to the electromagnetic slider 1061 being fixedly connected to the second sliding disk 107, when the slider on the sliding rheostat 802 moves downward, its resistance decreases, so that the current of the electromagnetic slider 1061 increases, and conversely, when the slider on the sliding rheostat 802 moves upward, its resistance increases The slider of the sliding rheostat 802 is fixedly connected to the fixed plate 8. The second sliding disk 107 is internally limited and slidably connected with a trigger rod 9. The upper side of the trigger rod 9 is provided with an inclined surface. The position of the trigger rod 9 near the adjacent fixed plate 8 is narrower. The lower side of the fixed plate 8 is provided with an inclined surface that is squeezed and matched with the inclined surface of the adjacent trigger rod 9. The thickness of each part of the fixed plate 8 is different but the weight is the same. Taking the front fixed plate 8 as an example, the left and right parts of the front fixed plate 8 are made of different materials, so that although the thickness of the left and right parts of the fixed plate 8 is different, the weight of the left and right parts of the fixed plate 8 is the same, which is used to maintain the balance of the fixed plate 8.

[0050] When the operator needs to fix the wafer, the operator squeezes the trigger rod 9 on the front side through the external loading equipment, and the trigger rod 9 on the front side moves and squeezes the adjacent fixing plate 8, and the fixing plate 8 drives the four adjacent fixing blocks 801 to move upward, so that the elastic part of the front fixing plate 8 is stretched, and then the operator adsorbs the wafer on the second sliding plate 107 on the front side. Subsequently, when the external loading equipment loses contact with the trigger rod 9 on the front side, the elastic part of the front fixing plate 8 moves downward and squeezes the trigger rod 9 on the front side to move to the left, so that the four fixing blocks 801 are all close to the wafer to fix the wafer, and the fixing plate 8 on the front side drives the slider of the adjacent sliding rheostat 802 to move downward, so that the resistance of the sliding rheostat 802 gradually increases. The gradient becomes smaller, and the amount of current flowing in the front electromagnetic slider 1061 gradually increases, thereby accelerating the moving speed of the electromagnetic slider 1061, and adjusting the cutting time according to the wafer thickness to prevent the wafer from being too thick and the cutting speed from being too fast, causing the wafer to be compressed and broken during the cutting process. At the same time, the cutting speed is increased when the wafer is too thin, thereby improving the efficiency of wafer cutting. When it is necessary to remove the cut wafer pieces, the operator repeats the above steps and squeezes the trigger rod 9 at the unloading place through the external unloading equipment, so that the four fixed blocks 801 lose the limit on the edges of the adjacent wafers, and the elastic part of the fixed plate 8 drives it to reset, and the fixed plate 8 drives the adjacent four fixed blocks 801 to reset, and then the wafer pieces and cutting waste can be removed.

[0051] In summary, the above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention.

Claims

1. A self-feeding wafer slitting device, comprising a base (1), an external loading device being arranged outside the base (1), a bracket (101) being fixedly connected to the upper side of the base (1), wherein: The device further comprises a rotating disk (102), the rotating disk (102) being rotatably connected to the upper side of the base (1), a first motor (103) being fixedly connected inside the base (1), an output shaft of the first motor (103) being fixedly connected to the rotating disk (102), two second motors (104) being fixedly connected to the bracket (101), the output shaft of the second motor (104) being fixedly connected to a disc cutting knife (105) rotatably connected to the bracket (101), and first sliding disks uniformly distributed in the circumferential direction being slidably connected to the upper side of the rotating disk (102). (106), the upper side of the first sliding disk (106) is rotatably connected to an electric turntable (1062), the electric turntable (1062) is slidably connected to an electromagnetic slider (1061) via an electromagnetic slide rail, the electromagnetic slider (1061) is fixedly connected to a second sliding disk (107), the rotating disk (102) is fixedly connected to an electric control telescopic rod (108), the telescopic end of the electric control telescopic rod (108) is fixedly connected to the adjacent first sliding disk (106), and the first sliding disks (106) uniformly distributed in the circumferential direction are jointly driven by a transmission member; The support (101) is fixedly connected with a communication pipe (2), the communication pipe (2) is rotatably connected and connected with a communication shell (201), the communication shell (201) is fixedly connected and connected with two cleaning pipes (2011), the cleaning pipes (2011) pass through the support (101), the cleaning pipes (2011) are provided with a water outlet, the water outlet of the cleaning pipe (2011) faces the lower side of the adjacent disc cutting knife (105), the communication pipe (2) is rotatably connected with a rotating ring (202) connected with an external water pump, a circular through hole (203) is provided on a side of the communication pipe (2) close to the rotating ring (202), a variable diameter through hole (204) is provided on the rotating ring (202), the circular through hole (203) is communicated and matched with the variable diameter through hole (204); The inner diameter of the cleaning pipe (2011) at a position close to the electrically controlled telescopic rod (108) is greater than the inner diameter of the cleaning pipe (2011) at a position far from the electrically controlled telescopic rod (108); A gear (4) is fixedly connected to the rotating ring (202), a sliding block (401) is slidably connected to the bracket (101), the sliding block (401) is fixedly connected to a rack (402) meshing with the gear (4) via a connecting rod, an elastic telescopic rod (403) is fixedly connected to a side of the second sliding plate (107) close to the rack (402), and a wedge-shaped block (404) extruded and matched with the rack (402) is fixedly connected to the telescopic end of the elastic telescopic rod (403); The friction resistance between the sliding block (401) and the bracket (101) is smaller than the friction resistance when the wedge block (404) squeezes the rack (402) and generates relative displacement. The device also includes a fixed plate (8) evenly distributed in the circumferential direction, the fixed plate (8) is slidably connected to an adjacent second sliding disk (107), an elastic member is fixedly connected between the fixed plate (8) and the adjacent second sliding disk (107), the upper side of the fixed plate (8) is fixedly connected with fixed blocks (801) evenly distributed in the circumferential direction and passing through the adjacent second sliding disk (107), the second sliding disk (107) is fixedly connected with a sliding rheostat (802) electrically connected to the electromagnetic slider (1061), and the sliding sheet of the sliding rheostat (802) is fixedly connected to the fixed plate (8); A trigger rod (9) is slidably connected to the second sliding plate (107) in a limited position, the trigger rod (9) is provided with an inclined surface on its upper side, and the fixing plate (8) is provided with an inclined surface that is pressed and matched with the inclined surface adjacent to the trigger rod (9) on its lower side.

2. A self-feeding wafer slitting device according to claim 1, characterized in that: A cleaning disc (6) is fixedly connected to and communicated with the rotating ring (202), and the cleaning disc (6) is used to flush the surface of the second sliding disc (107).

3. A self-feeding wafer slitting device according to claim 2, characterized in that: An arc-shaped disc (7) is fixedly connected to the bracket (101), a cotton cloth for absorbing water is arranged on the lower side of the arc-shaped disc (7), and the upper surface of the second sliding disc (107) is parallel to the lower surface of the arc-shaped disc (7).

4. A self-feeding wafer slitting device according to claim 1, characterized in that: The thickness of various locations on the fixing plate (8) is different but the weight is the same, so as to maintain the balance of the fixing plate (8).

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