A high-purity target material physical vapor deposition equipment
By designing a cooling chamber and thermal oil circulation system in physical vapor deposition equipment, the problem of the inability to dissipate heat from sputtered particles in time is solved, and efficient heat dissipation of the substrate and the improvement of coating quality is achieved.
Patent Information
- Application Number
- CN202411408087.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2044-10-10
AI Technical Summary
In existing physical vapor deposition equipment, the heat generated by sputtered particles after contacting the substrate cannot be discharged in time, resulting in damage such as increased local temperature of the substrate, concentrated thermal stress, increased surface roughness and cracks.
A base structure including a cooling chamber and a thermal oil circulation system is designed, and the substrate is intersected by a clamping sleeve and a clamping ring, and the circulation and diffusion of thermal oil is achieved by using a liquid inlet and return pipe. Quickly remove heat from the substrate to improve heat exchange uniformity.
It effectively reduces the local thermal stress concentration problem caused by the heat generated by the impact of high-energy particles on the substrate due to the inability to dissipate heat in time, and improves the heat dissipation efficiency and coating quality of the substrate.
Smart Images

Figure CN118910571B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a physical vapor deposition device, in particular to a physical vapor deposition device applied to the field of metal coating equipment. Background Art
[0002] During the magnetron sputtering coating process, high-energy sputtered particles collide with the target surface at high speed under the action of the electric field, causing the target atoms or molecules to break away and fly to the substrate surface to deposit into a film. However, if the energy and trajectory of these high-energy sputtered particles cannot be effectively controlled during the transmission process, they may cause damage to the substrate.
[0003] Specifically, although the substrate temperature of magnetron sputtering technology is lower than that of other sputtering technologies, high-energy particles will still be converted into thermal energy when impacting the substrate, causing the local temperature of the substrate to rise, which may cause thermal stress concentration, uneven thermal expansion or phase change of the substrate material, and further cause damage to the substrate surface such as increased roughness, cracks, and even local melting.
[0004] In order to avoid affecting the working gas pressure in the vacuum chamber, the existing substrate heat dissipation device generally uses a closed pipe or heat sink installed in the base to exchange heat with the substrate. The heat exchange area is limited and the local accumulated heat on the substrate cannot be quickly removed. Therefore, a better heat dissipation structure is needed to realize the heat extraction of the substrate. Summary of the invention
[0005] In view of the above-mentioned prior art, the technical problem to be solved by the present invention is that the heat generated by the sputtered particles of the existing physical vapor deposition equipment after contacting with the substrate cannot be discharged in time.
[0006] In order to solve the above problems, the present invention provides a physical vapor deposition device, including a vacuum tank, a target material mounting plate installed on the upper part of the vacuum tank, and a magnetron assembly; the lower part of the vacuum tank is provided with a base fixedly connected to the bottom wall thereof, a cooling cavity is opened in the base, the upper part of the cooling cavity is connected with a clamping sleeve, the middle part of the clamping sleeve is provided with a clamping mechanism for clamping a substrate, a liquid inlet pipe arranged opposite to the center of the lower part of the substrate and extending to the bottom of the base is provided in the cooling cavity, a guide plate is fixedly sleeved on the top of the liquid inlet pipe, a flat cavity for heat transfer oil to flow is formed between the guide plate and the substrate, a return pipe extending to the bottom of the base is connected to the bottom of the cooling cavity, and both the return pipe and the liquid inlet pipe are connected to an external heat transfer oil cooling circulation machine;
[0007] The clamping mechanism includes a clamping ring integrally formed with the clamping sleeve, the clamping ring and the substrate have an interference fit, a plurality of circumferentially distributed clamping strips are clamped on the outer end of the clamping ring, a traction rod is fixedly connected to the outer side of the clamping strip, a groove plate installed in the base is slidably clamped on the outer end of the traction rod, a gear ring is fixedly connected to the inner side of the groove plate, the gear ring is meshed with a driving gear connected to the first motor, the first motor drives the groove plate to rotate through the driving gear and the gear ring, and the traction rod is driven to move radially when the groove plate rotates, and the traction rod opens the clamping ring through the clamping strips.
[0008] In the above-mentioned physical vapor deposition equipment, the immersion cooling of the substrate is achieved by means of a base provided with a cooling cavity and a clamping sleeve provided with a clamping ring.
[0009] As a further improvement of the present application, a negative pressure suction claw which adsorbs onto the lower end surface of the substrate is provided above the guide plate, the negative pressure suction claw is connected to a rotating mechanism which drives it to rotate, and the clamping ring is a sliding sealing ring made of elastic rubber material.
[0010] As a further improvement of the present application, the cooling cavity is a columnar cavity structure, and the base is located above the cooling cavity and is provided with an installation cavity for installing the clamping sleeve. The installation cavity is an open columnar cavity, and the inner diameter of the installation cavity is larger than the inner diameter of the cooling cavity. The lower end of the clamping sleeve is fixedly connected to the opening edge of the upper end of the cooling cavity, and the upper end of the clamping sleeve is fixedly connected to the opening edge of the upper end of the installation cavity.
[0011] As a further improvement of the present application, the clamping sleeve has a hollow hourglass-shaped structure, an annular groove is provided on the inner wall of the clamping ring, and the substrate is nested in the annular groove and has an interference fit with the clamping ring.
[0012] As a further improvement of the present application, the clamping strip is an arc-shaped strip structure and the inner end is provided with protrusions which are relatively distributed up and down, and the clamping ring is provided with an arc-shaped clamping groove for the protrusion to be inserted.
[0013] As a further improvement of the present application, an arc-shaped slide groove is provided on the inner wall of the trough plate, a sliding column nested in the arc-shaped slide groove is provided at the end of the traction rod, and an equipment cavity for accommodating the trough plate is provided on the base. The equipment cavity is an annular cavity, and the traction rod passes through the inner shell wall of the equipment cavity and extends into the installation cavity.
[0014] As a further improvement of the present application, the negative pressure suction claw includes a plurality of claw rods equidistantly distributed in a circle, the claw rods are provided with negative pressure holes equidistantly distributed linearly, an upper suction pipe extending to the bottom of the liquid inlet pipe is fixedly connected below the negative pressure suction claw, the upper suction pipe is a hollow tube and its inner cavity is connected to the negative pressure hole, the lower end of the upper suction pipe is connected to the lower suction pipe through a rotating joint, and the lower suction pipe is connected to a negative pressure pump.
[0015] As a further improvement of the present application, the rotating mechanism includes a second motor, and the output shaft of the second motor is connected to the upper suction pipe for transmission through a transmission gear set.
[0016] In summary, the present invention performs interference clamping on the substrate by means of a clamping sleeve arranged on the base and a clamping ring installed in the clamping sleeve, so that the cavity of the clamping sleeve located below the substrate and the cooling cavity in the base form a closed cavity, and then utilizes the liquid inlet pipe and the return pipe to realize the filling and circulation of the heat transfer oil, so that the heat transfer oil and the lower part of the substrate are fully infiltrated and contacted, thereby overcoming the problem of insufficient contact between the traditional air-cooling and liquid-cooling heat dissipation devices and the substrate, and fully absorbing the heat generated by the collision of the sputtered particles of the target material and the substrate. Under the action of the guide plate, the heat transfer oil is quickly and evenly diffused in the flat cavity between the guide plate and the substrate, so as to quickly take away the heat of the substrate and improve the uniformity of heat exchange, thereby reducing the problem of local thermal stress concentration on the substrate caused by the inability to dissipate the heat generated by the impact of high-energy particles in time. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 A schematic diagram of the three-dimensional structure of this application;
[0018] Figure 2 This is a schematic diagram of the transverse cross-sectional structure of the present application;
[0019] Figure 3 for Figure 2 A schematic diagram of the enlarged structure at A in the middle;
[0020] Figure 4 It is a schematic diagram of the exploded assembly of the clamping mechanism in this application;
[0021] Figure 5 It is a schematic diagram of the exploded assembly of the clamping sleeve in this application;
[0022] Figure 6 This is a schematic diagram of the assembly of the base and the clamping sleeve in this application;
[0023] Figure 7 is a schematic diagram of the flow of heat transfer oil;
[0024] Figure 8 This is a schematic diagram of the assembly of the negative pressure suction claw in this application;
[0025] Fig. 9 It is a schematic diagram of the three-dimensional structure of the negative pressure suction claw in this application;
[0026] Fig.10 This is a schematic diagram of the state in which the negative pressure suction claw drives the substrate to rotate in this application.
[0027] Description of the numbers in the figure:
[0028] 1. Vacuum tank; 2. Target mounting plate; 3. Magnetron assembly; 4. Base; 401. Cooling chamber; 402. Mounting chamber; 403. Equipment chamber; 5. Clamping sleeve; 6. Clamping ring; 7. Substrate; 8. Card bar; 9. Traction rod; 901. Sliding column; 10. Groove plate; 1001. Arc slide groove; 11. Gear ring; 12. Driving gear; 13. First motor; 14. Liquid inlet pipe; 15. Guide plate; 16. Reflux pipe; 17. Negative pressure suction claw; 1701. Claw rod; 1702. Negative pressure hole; 18. Upper suction pipe; 19. Transmission gear set; 20. Second motor; 21. Lower suction pipe; 22. Negative pressure pump. DETAILED DESCRIPTION
[0029] The following describes two implementation modes of the present application in detail with reference to the accompanying drawings.
[0030] The first implementation method:
[0031] Figure 1-7 A physical vapor deposition device is shown, comprising a vacuum tank 1, a target mounting plate 2 mounted on the upper part of the vacuum tank 1, and a magnetron assembly 3; a base 4 fixedly connected to the bottom wall of the vacuum tank 1 is provided at the lower part of the vacuum tank 1, a cooling cavity 401 is provided in the base 4, a clamping sleeve 5 is connected to the upper part of the cooling cavity 401, a clamping mechanism for clamping a substrate 7 is provided in the middle part of the clamping sleeve 5, a liquid inlet pipe 14 arranged opposite to the lower center of the substrate 7 and extending to the bottom of the base 4 is provided in the cooling cavity 401, a guide plate 15 is fixedly sleeved on the top of the liquid inlet pipe 14, a flat cavity for heat transfer oil to flow is formed between the guide plate 15 and the substrate 7, a return pipe 16 extending to the bottom of the base 4 is connected to the bottom of the cooling cavity 401, and the return pipe 16 and the liquid inlet pipe 14 are both connected to an external heat transfer oil cooling circulation machine;
[0032] The clamping mechanism includes a clamping ring 6 integrally formed with the clamping sleeve 5, the clamping ring 6 and the substrate 7 have an interference fit, and the outer end of the clamping ring 6 is clamped with a plurality of clamping strips 8 distributed in a circle, and a traction rod 9 is fixedly connected to the outer side of the clamping strip 8, and the outer end of the traction rod 9 is slidably clamped with a groove plate 10 installed in the base 4, and a gear ring 11 is fixedly connected to the inner side of the groove plate 10, and the gear ring 11 is meshed with a driving gear 12 connected to the first motor 13. The first motor 13 drives the groove plate 10 to rotate through the driving gear 12 and the gear ring 11, and when the groove plate 10 rotates, it drives the traction rod 9 to move radially, and the traction rod 9 opens the clamping ring 6 through the clamping strip 8.
[0033] Specifically, when coating the substrate 7, please refer to Figure 3 and Figure 7 , including the following steps:
[0034] Step 1: install the substrate 7, start the first motor 13, open the clamping ring 6 in the middle of the clamping sleeve 5, put the substrate 7 into the clamping sleeve 5, and then start the first motor 13 again, so that the clamping ring 6 returns to the initial position and has an interference fit with the substrate 7 to clamp the substrate 7;
[0035] Step 2: during the coating process, the external heat transfer oil cooling circulation machine is started, and the external heat transfer oil cooling circulation machine injects the heat transfer oil into the cooling cavity 401 through the liquid inlet pipe 14 and fills the cavity of the clamping sleeve 5 below the substrate 7, so that the heat transfer oil is soaked in the lower part of the substrate 7;
[0036] Step three, during the coating process, the external heat transfer oil cooling circulation machine maintains the heat transfer oil circulation mode, so that the heat transfer oil is sprayed out from the upper end opening of the liquid inlet pipe 14 and then evenly diffuses and flows in the flat cavity between the guide plate 15 and the substrate 7, and then returns to the external heat transfer oil cooling circulation machine through the reflux pipe 16.
[0037] Compared with the traditional physical vapor deposition equipment, the present invention performs interference clamping on the substrate 7 by means of a clamping sleeve 5 arranged on the base 4 and a clamping ring 6 installed in the clamping sleeve 5, so that the cavity of the clamping sleeve 5 located below the substrate 7 and the cooling cavity 401 in the base 4 form a closed cavity, and then the filling and circulation of the heat transfer oil are realized by means of the liquid inlet pipe 14 and the return pipe 16, so that the heat transfer oil and the lower part of the substrate 7 are fully infiltrated and contacted, thereby overcoming the problem of insufficient contact between the traditional air-cooling and liquid-cooling heat dissipation devices and the substrate 7, fully absorbing the heat generated by the collision between the sputtered particles of the target material and the substrate 7, and under the action of the guide plate 15, the heat transfer oil is quickly and evenly diffused in the flat cavity between the guide plate 15 and the substrate 7, quickly taking away the heat of the substrate 7 and improving the uniformity of heat exchange, thereby reducing the problem of local thermal stress concentration on the substrate 7 caused by the inability to dissipate the heat generated by the impact of high-energy particles in time.
[0038] See also Figure 6 The cooling cavity 401 is a columnar cavity structure. The base 4 is located above the cooling cavity 401 and is provided with an installation cavity 402 for installing the clamping sleeve 5. The installation cavity 402 is an open columnar cavity. The inner diameter of the installation cavity 402 is larger than the inner diameter of the cooling cavity 401. The lower end of the clamping sleeve 5 is fixedly connected to the edge of the upper opening of the cooling cavity 401, and the upper end of the clamping sleeve 5 is fixedly connected to the edge of the upper opening of the installation cavity 402.
[0039] Specifically, the cooling cavity 401 is communicated with the inner cavity of the clamping sleeve 5 and the clamping sleeve 5 is fixedly installed.
[0040] See also Figure 3 and Figure 5 The clamping sleeve 5 is in a hollow hourglass-shaped structure, and an annular groove is provided on the inner wall of the clamping ring 6. The substrate 7 is nested in the annular groove and has an interference fit with the clamping ring 6.
[0041] Specifically, the sputtered particles are more likely to pass through the hollow hourglass cavity on the upper part of the clamping sleeve 5 and contact the substrate 7, thereby improving the stability of the clamping of the substrate 7 and improving the sealing effect of the clamping ring 6 on the cavity below the substrate 7.
[0042] See also Figure 5 The clamping strip 8 is an arc-shaped strip structure and has protrusions relatively distributed up and down at the inner end, and the clamping ring 6 is provided with an arc-shaped clamping groove for the protrusion to be inserted.
[0043] Specifically, the stability of the clamping connection between the clamping strip 8 and the clamping ring 6 is improved, thereby improving the stability of the opening and traction.
[0044] See also Figure 4 An arc-shaped slide groove 1001 is provided on the inner wall of the trough plate 10, and a sliding column 901 nested in the arc-shaped slide groove 1001 is provided at the end of the traction rod 9. The base 4 is provided with an equipment cavity 403 for accommodating the trough plate 10. The equipment cavity 403 is an annular cavity. The traction rod 9 passes through the inner shell wall of the equipment cavity 403 and extends into the installation cavity 402.
[0045] Specifically, when the groove plate 10 rotates, the sliding column 901 slides in the arc-shaped sliding groove 1001, thereby driving the traction rod 9 to move radially, realizing the opening and contraction of the clamping circle 6, and the clamping sleeve 5 wraps the clamping strip 8 and the traction rod 9 on its outside for protection.
[0046] Second implementation method:
[0047] Figure 2 , Figure 8-10 A physical vapor deposition device is shown. Based on the first embodiment, a negative pressure suction claw 17 adsorbed to the lower end surface of the substrate 7 is provided above the guide plate 15. The negative pressure suction claw 17 is connected to a rotating mechanism driving it to rotate. The clamping ring 6 is a sliding sealing ring and is made of elastic rubber material.
[0048] Specifically, when performing magnetron sputtering coating, the negative pressure suction claw 17 performs negative pressure adsorption on the substrate 7, and the rotating mechanism drives the substrate 7 to rotate in a circle through the negative pressure suction claw 17. The rotating substrate 7 can make the sputtered particles impact the substrate 7 from different angles and positions, thereby reducing the accumulation or missing of particles in local areas, significantly improving the distribution uniformity of the sputtered particles on the surface of the substrate 7, and improving the coating molding quality, so that the collision position distribution of the sputtered particles and the substrate 7 is more even, and the generated collision heat is more evenly distributed, so that the heat distribution at each position of the entire substrate 7 is more even, reducing the problem of excessive internal stress caused by uneven heat distribution, and at the same time facilitating the coolant to quickly remove heat; the clamping ring 6 made of elastic rubber material has good clamping and sealing effects, and at the same time, allows the substrate 7 to undergo local deformation after being heated, which has a better protection effect on the substrate 7.
[0049] See also Figure 8 and Fig. 9 The negative pressure suction claw 17 includes a plurality of claw rods 1701 equidistantly distributed around a circle, and the claw rods 1701 are provided with negative pressure holes 1702 equidistantly distributed linearly. An upper suction pipe 18 extending to the bottom of the liquid inlet pipe 14 is fixedly connected below the negative pressure suction claw 17. The upper suction pipe 18 is a hollow tube and its inner cavity is connected to the negative pressure hole 1702. The lower end of the upper suction pipe 18 is connected to a lower suction pipe 21 through a rotating joint, and the lower suction pipe 21 is connected to a negative pressure pump 22.
[0050] Specifically, the upper suction pipe 18, the lower suction pipe 21 and the negative pressure pump 22 cooperate to realize the negative pressure adsorption and fixation of the substrate 7 by the negative pressure suction claw 17. At the same time, the claw rods 1701 distributed equidistantly around the circumference realize uniform guidance of the heat transfer oil, accelerate the centrifugal diffusion of the heat transfer oil, and improve the heat exchange efficiency between the heat transfer oil and the substrate 7.
[0051] See also Figure 8 The rotating mechanism includes a second motor 20 , and the output shaft of the second motor 20 is connected to the upper suction pipe 18 through a transmission gear set 19 for transmission.
[0052] Specifically, the second motor 20 realizes the rotation of the negative pressure suction claw 17 through the transmission gear set 19 and the upper suction pipe 18. In addition, after the coating is completed, the thermal oil in the cooling chamber 401 is sucked out by the external thermal oil cooling circulation machine. At the same time, the second motor 20 is started to make the substrate 7 rotate at a high speed, so that the thermal oil adhered to the lower end surface of the substrate 7 is quickly separated from the substrate 7 under the action of centrifugal force, and there is no need to separately clean the thermal oil adhered to the lower end surface of the substrate 7 in the subsequent process, which saves processes and reduces the waste of thermal oil.
[0053] In view of current practical needs, the above-mentioned implementation mode adopted in this application is not limited to the scope of protection. Various changes made within the knowledge scope of technical personnel in this field without departing from the concept of this application still fall within the scope of protection of the present invention.
Claims
1. A physical vapor deposition device, characterized in that: The invention comprises a vacuum tank (1), a target material mounting plate (2) mounted on the upper part of the vacuum tank (1), and a magnetron assembly (3); the lower part of the vacuum tank (1) is provided with a base (4) fixedly connected to the bottom wall thereof, a cooling cavity (401) is provided in the base (4), the upper part of the cooling cavity (401) is connected to a clamping sleeve (5), the middle part of the clamping sleeve (5) is provided with a clamping mechanism for clamping a substrate (7), a liquid inlet pipe (14) is provided in the cooling cavity (401) and is arranged opposite to the lower center of the substrate (7) and extends to the bottom of the base (4), a guide plate (15) is fixedly sleeved on the top of the liquid inlet pipe (14), a flat cavity for heat transfer oil to flow is formed between the guide plate (15) and the substrate (7), the bottom of the cooling cavity (401) is connected to a return pipe (16) extending to the bottom of the base (4), and the return pipe (16) and the liquid inlet pipe (14) are both connected to an external heat transfer oil cooling circulation machine; The clamping mechanism comprises a clamping ring (6) integrally formed with the clamping sleeve (5), the clamping ring (6) and the substrate (7) being interference fit, a plurality of clamping strips (8) distributed in a circumference being clamped at the outer end of the clamping ring (6), a traction rod (9) being fixedly connected to the outer side of the clamping strip (8), a slotted plate (10) mounted in the base (4) being slidably clamped at the outer end of the traction rod (9), a gear ring (11) being fixedly connected to the inner side of the slotted plate (10), the gear ring (11) being meshed with a driving gear (12) connected to a first motor (13), the first motor (13) driving the slotted plate (10) to rotate via the driving gear (12) and the gear ring (11), the slotted plate (10) driving the traction rod (9) to move radially when the slotted plate (10) rotates, and the traction rod (9) opens the clamping ring (6) via the clamping strips (8).
2. A physical vapor deposition device according to claim 1, characterized in that: A negative pressure suction claw (17) is provided above the guide plate (15) and is attracted to the lower end surface of the substrate (7). The negative pressure suction claw (17) is connected to a rotating mechanism for driving the negative pressure suction claw (17) to rotate. The clamping ring (6) is a sliding sealing ring made of elastic rubber material.
3. A physical vapor deposition device according to claim 1, characterized in that: The cooling cavity (401) is a columnar cavity structure. The base (4) is located above the cooling cavity (401) and is provided with an installation cavity (402) for installing the clamping sleeve (5). The installation cavity (402) is an open columnar cavity. The inner diameter of the installation cavity (402) is larger than the inner diameter of the cooling cavity (401). The lower end of the clamping sleeve (5) is fixedly connected to the edge of the upper opening of the cooling cavity (401), and the upper end of the clamping sleeve (5) is fixedly connected to the edge of the upper opening of the installation cavity (402).
4. A physical vapor deposition device according to claim 1, characterized in that: The clamping sleeve (5) is in the form of a hollow hourglass. The inner wall of the clamping ring (6) is provided with an annular groove. The substrate (7) is nested in the annular groove and is interference-fitted with the clamping ring (6).
5. The physical vapor deposition device according to claim 1, characterized in that: The clamping strip (8) is an arc-shaped strip structure and has protrusions arranged relatively upward and downward at the inner end, and the clamping ring (6) is provided with an arc-shaped clamping groove into which the protrusion is inserted.
6. A physical vapor deposition device according to claim 3, characterized in that: The inner wall of the trough plate (10) is provided with an arc-shaped sliding groove (1001), the end of the traction rod (9) is provided with a sliding column (901) nested in the arc-shaped sliding groove (1001), the base (4) is provided with an equipment cavity (403) for accommodating the trough plate (10), the equipment cavity (403) is an annular cavity, and the traction rod (9) passes through the inner shell wall of the equipment cavity (403) and extends into the installation cavity (402).
7. A physical vapor deposition device according to claim 2, characterized in that: The negative pressure suction claw (17) comprises a plurality of claw rods (1701) equidistantly distributed in a circumference, the claw rods (1701) are provided with negative pressure holes (1702) equidistantly distributed in a linear manner, an upper suction pipe (18) extending to the bottom of the liquid inlet pipe (14) is fixedly connected below the negative pressure suction claw (17), the upper suction pipe (18) is a hollow pipe and its inner cavity is connected to the negative pressure hole (1702), the lower end of the upper suction pipe (18) is connected to a lower suction pipe (21) via a rotating joint, and the lower suction pipe (21) is connected to a negative pressure pump (22).
8. A physical vapor deposition device according to claim 7, characterized in that: The rotating mechanism comprises a second motor (20), and an output shaft of the second motor (20) is connected to the upper suction pipe (18) for transmission via a transmission gear set (19).