Integrated pin cutting and board washing device and processing technology for secondary processing of circuit boards in single-sided DIP plug-in process

Abstract

The present invention relates to the technical field of circuit board processing, and specifically to an integrated pin-cutting and board-washing device for secondary processing of circuit boards in a single-sided DIP insertion process and a processing process thereof, comprising: a frame structure, on which two symmetrical groups of clamping plates are arranged; a deflection bracket, connected to the rotating shaft of the clamping plate; a power piece, installed on the frame structure and connected to a deflection head arranged on the deflection bracket, one end of the deflection head is sealingly and slidingly fitted with an arc plate connected to the power piece, and two groups of connecting ports are arranged on the arc plate, and the deflection head can be respectively connected to the two connecting ports; a retaining component, connecting the deflection bracket and the clamping plate, and the retaining component can keep the deflection bracket and the clamping plate in an inclined state; a triggering component, connecting the deflection bracket and the power piece, and the triggering component cooperates with the retaining component, so that when the deflection head moves to the end of the stroke, the deflection bracket and the clamping plate are tilted in the opposite direction, and the deflection head is switched between the two connecting ports, thereby improving the board washing efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, in particular to an integrated pin cutting and board washing device for secondary processing of a circuit board in a single-sided DIP insertion process and a processing technology thereof. Background Art

[0002] DIP is a traditional electronic assembly method, which is widely used in the field of electronic product manufacturing. It is characterized by high reliability and low manufacturing cost.

[0003] The DIP process mainly involves plug-in, wave soldering, component pin cutting and board washing processes. After the component pin cutting is completed, the circuit board needs to be washed. When the traditional board washing device is washing the board, the circuit board is in a flat state, and the fluidity of the cleaning liquid on the circuit board is poor. In order to complete the board washing and drying processes, the existing board washing device is generally equipped with an independent board washing mechanism and a drying mechanism. The two mechanisms operate independently, resulting in low integration of the entire device, high control difficulty, and difficulty in operation for technicians. Summary of the invention

[0004] The purpose of the present invention is to provide an integrated circuit board cutting and washing device for secondary processing of a single-sided DIP insertion process and a processing technology thereof, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] The integrated pin cutting and board washing device for secondary processing of circuit boards in the single-sided DIP insertion process includes:

[0007] A frame structure, wherein two sets of symmetrical clamping plates are arranged on the frame structure, and a plurality of No. 1 nozzles are arranged equidistantly on the inner side of the clamping plates;

[0008] A deflection bracket, arranged on the frame structure and connected to the rotating shaft of the clamping plate, wherein the clamping plate and the deflection bracket are parallel to the side edges along the length direction thereof;

[0009] A power member is mounted on the frame structure and connected to a deflection head arranged on the deflection bracket, one end of the deflection head is sealingly and slidingly fitted with an arc plate connected to the power member, and two groups of connection ports are arranged on the arc plate, and the deflection head can be respectively connected to the two connection ports;

[0010] A holding assembly, connected to the deflection bracket and the clamping plate, wherein the holding assembly can keep the deflection bracket and the clamping plate in an inclined state;

[0011] A trigger assembly is connected to the deflection bracket and the power part. The trigger assembly cooperates with the retaining assembly to enable the deflection bracket and the clamping plate to tilt in the opposite direction when the deflection head moves to the end of the stroke, and to switch the deflection head between the two connection ports.

[0012] As a further solution of the present invention: the clamping plates are rotatably mounted on the frame structure, and rubber strips are provided on opposite sides of the two sets of clamping plates;

[0013] The interior of the clamping plate and its rotating shaft is a hollow structure, and the No. 1 nozzle is connected to the interior of the clamping plate;

[0014] The rotating shaft of the clamping plate is provided with a plurality of through holes at equal intervals in a circumference, and a connector is rotatably mounted on the rotating shaft of the clamping plate in a sealing manner. When the fluid enters the connector, it can enter the interior of the clamping plate through the through holes.

[0015] As a further solution of the present invention: the power member comprises a linear drive module mounted on the frame structure, the linear drive module is connected to a transverse rod, a telescopic sleeve is slidably sleeved on the transverse rod, and the telescopic sleeve is connected to the arc plate;

[0016] The deflection bracket is provided with a guide rod, on which a sliding sleeve plate rotatably connected to the deflection head and the telescopic sleeve is slidably mounted, and the rotation axis of the deflection head is colinear with the rotation axis of the telescopic sleeve.

[0017] As a further solution of the present invention: the interior of the deflection head is a hollow structure, and a second nozzle is provided at one end of the deflection head, and a conducting port is provided at the other end, and the conducting port is adapted to the two groups of the connecting ports;

[0018] The deflection head is connected to the connection head via a catheter.

[0019] As a further solution of the present invention: the rotating shaft of the clamping plate is connected to the rotating shaft of the deflection bracket via a No. 1 connecting belt;

[0020] The holding assembly comprises a connecting rod connected to the frame structure, the connecting rod is formed with a convex ring, the convex ring is sleeved with a collar, the collar is connected to an elastic telescopic rod arranged on the frame structure, and the collar is connected to the convex ring through a chimeric structure;

[0021] The connecting rod is connected to the rotating shaft of the clamping plate through a second connecting belt.

[0022] As a further solution of the present invention: the connecting rod comprises a rotating shaft and a telescopic shaft which are coaxially and rotatably mounted on the frame structure, the rotating shaft and the telescopic shaft are slidably fitted together, and the interior of the rotating shaft is a hollow structure;

[0023] A limiting block is arranged inside the rotating shaft, a limiting groove is arranged on the telescopic shaft, and the limiting block is slidably matched with the limiting groove.

[0024] As a further solution of the present invention: the interlocking structure comprises two grooves arranged on the convex ring, and a protrusion is formed between the two grooves;

[0025] The convex shaft arranged in the collar can be switched between the two grooves via a protrusion.

[0026] As a further solution of the present invention: the trigger assembly includes an abutment wheel rotatably connected to the telescopic sleeve and two sets of trigger members arranged on the frame structure, and an inclined surface is formed on the trigger member;

[0027] The trigger assembly further comprises a side support member symmetrically arranged on the frame structure, wherein the side support member cooperates with the deflection head to drive the deflection head to deflect.

[0028] The process of processing a circuit board using the integrated pin cutting and board washing device for secondary processing of the circuit board of the single-sided DIP insertion process includes the following steps:

[0029] Step 1: Place the circuit board with the pins cut between two sets of clamping plates. The clamping plates can clamp the circuit board and keep it in an inclined state.

[0030] Step 2: Control the power part to drive the deflection head to move along the length direction of the deflection bracket. At this time, the deflection head and the No. 1 nozzle can spray the cleaning liquid toward the circuit board;

[0031] Step 3: When the deflection head moves to the end of the stroke, the trigger assembly cooperates with the holding assembly to make the clamping plate and the deflection bracket tilt in the opposite direction, and then deflect the deflection head to make the deflection head conduct with another connection port;

[0032] Step 4: The reverse action of the power part drives the deflection head to move in the reverse direction. At this time, dry air is sprayed onto the circuit board through the deflection head and the No. 1 nozzle to dry the cleaning liquid on the circuit board;

[0033] Step 5: Remove the circuit board and complete the board cleaning.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] First, after the circuit board is clamped, it can seal its side, thereby preventing the cleaning liquid from entering the other side of the circuit board from the side of the circuit board during the board washing process, causing liquid stains on the other side of the circuit board, affecting subsequent use. Secondly, the inclination direction of the No. 2 nozzle is toward the movement direction of the deflection head, and the deflection head moves downward from the upper end of the circuit board, which can make the cleaning liquid flow more smoothly on the circuit board, thereby preventing the cleaning liquid from accumulating on the circuit board, causing the subsequent drying cost to increase. The cleaning liquid can be sprayed not only from the No. 2 nozzle, but also from the No. 1 nozzle on both sides of the circuit board. Therefore, when the circuit board is washed, the cleaning liquid can flush the circuit board from multiple angles, thereby improving the cleaning effect. At the same time, since the sides of the clamping plate and the deflection bracket along their length direction are in a parallel state, the cleaning liquid sprayed from the No. 2 nozzle can act on the circuit board with the same impact force, thereby making the degree of cleaning the circuit board more consistent, further improving the cleaning effect.

[0036] By setting up the trigger component and the retaining component, when the deflection head moves to the end of the stroke, the deflection bracket, the clamping plate and the deflection head can perform a reverse deflection action, wherein when the deflection head deflects, it can switch conduction with the two connecting ports, so that the No. 1 nozzle and the No. 2 nozzle can spray cleaning fluid or compressed air, and when the deflection bracket and the clamping plate are reversely deflected, they can cooperate with the deflection head, so that when the deflection head moves in the opposite direction, the No. 2 nozzle can maintain the movement direction of the deflection head, so that the deflection head moves obliquely downward along the upper end of the circuit board, so that in the process of cleaning and drying the circuit board, the cleaning liquid can move obliquely downward along the circuit board, thereby improving the fluidity of the cleaning liquid to ensure the cleaning and drying effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 The present invention is a structural schematic diagram of an embodiment of an integrated pin cutting and board washing device for secondary processing of circuit boards in a single-sided DIP insertion process.

[0038] Figure 2 A schematic structural diagram from another angle of an embodiment of an integrated pin cutting and board washing device for secondary processing of circuit boards in a single-sided DIP insertion process.

[0039] Figure 3 A schematic diagram of the structure of a deflection bracket, a clamping plate and a component connection state maintained in an embodiment of an integrated pin cutting and board washing device for secondary processing of a circuit board in a single-sided DIP insertion process.

[0040] Figure 4 An exploded view of the structure of the clamping plate and the connector in one embodiment of an integrated pin cutting and board washing device for secondary processing of circuit boards in a single-sided DIP insertion process.

[0041] Figure 5An exploded view of the structure of the retaining components in one embodiment of an integrated pin cutting and board washing device for secondary processing of a circuit board in a single-sided DIP insertion process.

[0042] Figure 6 The present invention is a structural schematic diagram of a trigger component in an embodiment of an integrated pin cutting and board washing device for secondary processing of a circuit board in a single-sided DIP insertion process.

[0043] Figure 7 The present invention is a schematic structural diagram of the side support and the deflection head in one embodiment of an integrated pin cutting and board washing device for secondary processing of a circuit board in a single-sided DIP insertion process.

[0044] Figure 8 An exploded view of the structure of the deflection head and the curved plate in one embodiment of an integrated pin cutting and board washing device for secondary processing of circuit boards in a single-sided DIP insertion process.

[0045] Fig. 9 The present invention is a schematic structural diagram of the power components in one embodiment of an integrated pin cutting and board washing device for secondary processing of circuit boards in a single-sided DIP insertion process.

[0046] In the figure: 1, base; 2, collection box; 3, support plate; 4, clamping plate; 401, rubber strip; 402, nozzle No. 1; 403, through hole; 5, connector; 6, connecting belt No. 1; 7, deflection bracket; 8, guide rod; 9, support beam; 10, linear drive module; 11, traverse rod; 12, telescopic sleeve; 13, sliding sleeve; 14, deflection head; 1401, nozzle No. 2; 1402, conduction port; 15, arc Plate; 1501, connection port; 16, abutment wheel; 17, trigger member; 1701, inclined surface; 18, conduit; 19, side support member; 20, No. 2 connecting belt; 21, rotating shaft; 2101, limit block; 22, convex ring; 2201, groove; 2202, protrusion; 23, collar; 2301, convex shaft; 24, telescopic shaft; 2401, limit groove; 25, elastic telescopic rod; 26, slider; 27, spring. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

[0049] See also Figure 1 to Figure 9 In the embodiment of the present invention, the integrated shearing and washing device for secondary processing of the circuit board of the single-sided DIP insertion process includes: a frame structure, a deflection bracket 7, a power part, a holding component and a trigger component, so that when the deflection head 14 moves to the end of the stroke, the deflection bracket 7, the clamping plate 4 and the deflection head 14 can perform a reverse deflection action, wherein, when the deflection head 14 deflects, it can switch to conduction with the two connection ports 1501, so that the first nozzle 402 and the second nozzle 1401 spray cleaning liquid or compressed air, and when the deflection bracket 7 and the clamping plate 4 reversely deflect, they can cooperate with the deflection head 14, so that when the deflection head 14 moves in the reverse direction, the second nozzle 1401 can maintain the movement direction of the deflection head 14, so that the deflection head 14 moves obliquely downward along the upper end of the circuit board, so that in the process of cleaning and drying the circuit board, the cleaning liquid can move obliquely downward along the circuit board, thereby improving the fluidity of the cleaning liquid to ensure the cleaning and drying effects. The specific details are as follows:

[0050] The frame structure is provided with two symmetrical groups of clamping plates 4, and the inner side of the clamping plates 4 is formed with a plurality of No. 1 nozzles 402 arranged equidistantly. Specifically, the frame structure includes a base 1, two groups of support plates 3 arranged on the base 1, and support beams 9 connected to the support plates 3. Furthermore, two groups of collection boxes 2 are symmetrically arranged on the base 1.

[0051] The clamping plates 4 are rotatably mounted on the support plate 3, and rubber strips 401 are provided on opposite sides of the two sets of clamping plates 4;

[0052] In the initial state, the clamping plate 4 is in an inclined state. At this time, when the circuit board is clamped between the two clamping plates 4, the circuit board can abut against the rubber strip 401 on the side of the clamping plate 4, thereby sealing the side of the circuit board to prevent the cleaning liquid from entering the other side of the circuit board from the side of the circuit board during the board washing process, causing liquid stains on the other side of the circuit board, affecting subsequent use.

[0053] The interior of the clamping plate 4 and its rotating shaft is a hollow structure, and the first nozzle 402 is connected to the interior of the clamping plate 4;

[0054] The rotating shaft of the clamping plate 4 is provided with a plurality of through holes 403 at equal intervals on the circumference, and a connector 5 is installed on the rotating shaft of the clamping plate 4 in a sealed and rotatable manner. When the fluid enters the connector 5, it can enter the interior of the clamping plate 4 through the through holes 403. The deflection head 14 is connected to the connector 5 via a conduit 18.

[0055] The deflection bracket 7 is arranged on the support plate 3 and connected to the rotating shaft of the clamping plate 4, and the side edges of the clamping plate 4 and the deflection bracket 7 along the length direction thereof are parallel;

[0056] The power member is mounted on the support beam 9 and connected to the deflection head 14 provided on the deflection bracket 7. One end of the deflection head 14 is sealed and slidably fitted with the arc plate 15 connected to the power member. The arc plate 15 is provided with two groups of connection ports 1501. The deflection head 14 can be connected to the two connection ports 1501 respectively.

[0057] Furthermore, the interior of the deflection head 14 is a hollow structure, and a second nozzle 1401 is provided at one end of the deflection head 14, and a conducting port 1402 is provided at the other end, and the conducting port 1402 is adapted to the two groups of connecting ports 1501;

[0058] In the initial state, the deflection head 14 is in a tilted state, and the deflection head 14 is located at the upper end of the deflection bracket 7. Specifically, the deflection head 14 has one end of the No. 2 nozzle 1401 deflected toward its movement direction, so that when the power part drives the deflection head 14 to move during cleaning, the deflection head 14 can move from top to bottom along the tilt direction of the circuit board. At this time, the cleaning liquid can be sprayed toward the movement direction of the deflection head 14, and evenly contact the circuit board along the tilt direction of the circuit board, and then flow into one of the collection boxes 2, that is, the tilted setting of the circuit board can make the cleaning liquid flow more smoothly, thereby preventing the cleaning liquid from accumulating on the circuit board, resulting in an increase in subsequent drying costs.

[0059] The power member comprises a linear drive module 10 mounted on the frame structure, the linear drive module 10 is connected to a transverse rod 11, a telescopic sleeve 12 is slidably sleeved on the transverse rod 11, and the telescopic sleeve 12 is connected to the arc plate 15;

[0060] The deflection bracket 7 is provided with a guide rod 8 , and a sliding sleeve plate 13 rotatably connected to the deflection head 14 and the telescopic sleeve 12 is slidably mounted on the guide rod 8 .

[0061] Among them, since the deflection head 14 is connected to the connecting head 5 through the conduit 18, when the cleaning liquid enters the deflection head 14, it can also enter the clamping plate 4 through the conduit 18 and be sprayed out by the No. 1 nozzle 402. That is, when cleaning the circuit board, the cleaning liquid can not only be sprayed out by the No. 2 nozzle 1401, but also can be sprayed out from the No. 1 nozzle 402 on both sides of the circuit board. Therefore, when washing the circuit board, the cleaning liquid can flush the circuit board from multiple angles to improve the cleaning effect.

[0062] Furthermore, the sides of the clamping plate 4 and the deflection bracket 7 along their length directions are in a parallel state, so that when the linear drive module 10 drives the transverse rod 11 to move, the sliding sleeve 13 can be driven by the telescopic sleeve 12 to move along the length direction of the guide rod 8. At this time, the telescopic sleeve 12 can slide relative to the transverse rod 11, thereby ensuring that when the linear drive module 10 moves, the deflection head 14 can follow the movement. At the same time, when the deflection head 14 moves along the length direction of the guide rod 8, the distance between the No. 2 nozzle 1401 and the circuit board can be kept constant, so that when the circuit board is cleaned, the cleaning liquid sprayed by the No. 2 nozzle 1401 can act on the circuit board with the same impact force, so that the degree of cleaning of the circuit board is more consistent, further improving the cleaning effect.

[0063] Based on the above arrangement, firstly, after the circuit board is clamped, its side can be sealed, thereby preventing the cleaning liquid from entering the other side of the circuit board from the side of the circuit board during the board washing process, causing liquid stains on the other side of the circuit board, affecting subsequent use. Secondly, the inclination direction of the No. 2 nozzle 1401 is toward the movement direction of the deflection head 14, and the deflection head 14 moves downward from the upper end of the circuit board, which can make the cleaning liquid flow more smoothly on the circuit board, thereby preventing the cleaning liquid from accumulating on the circuit board, causing an increase in subsequent drying costs. Moreover, the cleaning liquid can be sprayed not only from the No. 2 nozzle 1401, but also from the No. 1 nozzle 402 on both sides of the circuit board. Therefore, when the circuit board is washed, the cleaning liquid can be flushed from multiple angles to improve the cleaning effect. At the same time, since the sides of the clamping plate 4 and the deflection bracket 7 along their length direction are in a parallel state, the cleaning liquid sprayed from the No. 2 nozzle 1401 can act on the circuit board with the same impact force, thereby making the degree of cleaning the circuit board more consistent, further improving the cleaning effect.

[0064] See also Figure 3 , Figure 5 , the rotation axis of the deflection head 14 is collinear with the rotation axis of the telescopic sleeve 12, and the central axis of the arc plate 15 is collinear with the rotation axis of the deflection head 14, and a damping sleeve (not shown in the figure) is provided at the rotation axis of the deflection head 14;

[0065] The holding assembly connects the deflection bracket 7 and the clamping plate 4, and the rotating shaft of the clamping plate 4 is connected to the rotating shaft of the deflection bracket 7 through a No. 1 connecting belt 6. The holding assembly can keep the deflection bracket 7 and the clamping plate 4 in an inclined state, wherein the diameter specifications of the two transmission wheels connected to the No. 1 connecting belt 6 are exactly the same, and the two transmission wheels are respectively connected to the rotating shafts of the deflection bracket 7 and the clamping plate 4, so that the deflection bracket 7 and the clamping plate 4 can be kept in a parallel state even when rotating;

[0066] The holding assembly includes a connecting rod connected to the frame structure, a convex ring 22 is formed on the connecting rod, a collar 23 is sleeved on the convex ring 22, the collar 23 is connected to an elastic telescopic rod 25 provided on the frame structure, and the collar 23 is connected to the convex ring 22 through a chimeric structure, the chimeric structure includes two grooves 2201 provided on the convex ring 22, and a protrusion 2202 is formed between the two grooves 2201;

[0067] The convex shaft 2301 disposed in the collar 23 can be switched between the two grooves 2201 via the protrusion 2202;

[0068] The connecting rod is connected to the rotating shaft of the clamping plate 4 through a second connecting belt 20. The connecting rod includes a rotating shaft 21 and a telescopic shaft 24 which are coaxially and rotatably mounted on the frame structure. The rotating shaft 21 and the telescopic shaft 24 are slidably fitted, and the interior of the rotating shaft 21 is a hollow structure.

[0069] A limiting block 2101 is disposed inside the rotating shaft 21 , and a limiting slot 2401 is disposed on the telescopic shaft 24 . The limiting block 2101 is slidably matched with the limiting slot 2401 .

[0070] In order to facilitate the clamping of the circuit board, a slide groove is provided on the base 1, and a slider 26 is slidably installed in the slide groove. The slider 26 is connected to one group of the support plates 3, and a spring 27 is provided between the slider 26 and the slide groove. At the same time, one end of the rotating shaft of the deflection bracket 7 and one end of the support beam 9 are slidably connected to the above-mentioned support plate 3, so that when the support plate 3 is pulled, the two groups of clamping plates 4 can move away from each other. At this time, the deflection bracket 7 and the support beam 9 still have good stability. After the circuit board is installed in place, the support plate 3 is released, and the circuit board can be clamped by utilizing the elastic force provided by the spring 27.

[0071] In the initial state, under the action of the elastic telescopic rod 25, the convex shaft 2301 is maintained in one of the grooves 2201. At this time, under the action of the No. 2 connecting belt 20, the deflection bracket 7 and the clamping plate 4 have a tendency to maintain a predetermined tilt angle, thereby improving the stability of the deflection bracket 7 and the clamping plate 4 in the tilted state, so that when the cleaning liquid and compressed air are sprayed on the circuit board, the circuit board can still be in a relatively stable tilted state.

[0072] See also Figure 1 , Figure 6~Figure 8 The trigger assembly is connected to the deflection bracket 7 and the telescopic sleeve 12. The trigger assembly cooperates with the holding assembly to enable the deflection bracket 7 and the clamping plate 4 to tilt in the opposite direction when the deflection head 14 moves to the end of the stroke, and enables the deflection head 14 to switch between the two connection ports 1501. The trigger assembly includes an abutment wheel 16 rotatably connected to the telescopic sleeve 12 and two groups of trigger members 17 arranged on the frame structure, and an inclined surface 1701 is formed on the trigger member 17;

[0073] The trigger assembly further includes a side support member 19 symmetrically disposed on the frame structure. The side support member 19 cooperates with the deflection head 14 to drive the deflection head 14 to deflect.

[0074] The two groups of connection ports 1501 on the arc plate 15 are respectively connected to an external cleaning liquid pumping device and an external compressed air pumping device, and an arc-shaped sealing plate is provided at one end of the deflection head 14 facing the arc plate 15. The fixed sealing plate can seal the other connection port 1501 when the conducting port 1402 is connected to one of the connection ports 1501.

[0075] In the initial state, the deflection head 14 is in an inclined state. At this time, the conducting port 1402 on the deflection head 14 is connected to the connecting port 1501 for introducing the cleaning liquid, and the connecting port 1501 for introducing the compressed air is blocked. At this time, when the linear drive module 10 is in action, it can drive the deflection head 14 to move along the length direction of the guide rod 8, so as to clean the circuit board, and in the process of the movement of the deflection head 14, the telescopic sleeve 12 will drive the abutment wheel 16 to move downward. When the deflection head 14 moves to the end of the stroke, the abutment wheel 16 will abut the inclined surface 1701 on the trigger member 17, and under the guidance of the inclined surface 1701, the abutment wheel 16 can move upward, thereby driving the deflection bracket 7 to reverse. At this time, the rotating shaft of the deflection bracket 7 can drive the connecting shaft to rotate, so that the convex ring 22 can move relative to the sleeve ring 23. In this process, the convex shaft 2301 in the sleeve ring 23 can move from one of the grooves 2201 toward the protrusion 2202, and make The elastic member built in the elastic telescopic rod 25 is compressed, and as the deflection head 14 continues to move, the deflection bracket 7 will further deflect until the convex shaft 2301 moves over the protruding portion 2202, and the elastic telescopic rod 25 can release the elastic potential energy to make the convex shaft 2301 move toward the other groove 2201. At this time, the connecting shaft actively drives the deflection bracket 7 to deflect, thereby realizing the reverse inclination of the deflection bracket 7 and the clamping plate 4. After that, the deflection head 14 will continue to move, and when it abuts against the side branch When the support member 19 is supported, the side support member 19 pushes the deflection head 14 to deflect, and the conducting port 1402 on the deflection head 14 is switched from the original connection port 1501 to another connection port 1501, so that the connection port 1501 for introducing the cleaning liquid is blocked, and the connection port 1501 for introducing compressed air is conducted. At this time, the compressed air can enter the deflection head 14 and be sprayed onto the circuit board by the No. 1 nozzle 402 and the No. 2 nozzle 1401, thereby drying the cleaning liquid remaining on the circuit board.

[0076] Through the above-mentioned arrangement, when the deflection head 14 moves to the end of the stroke, the deflection bracket 7, the clamping plate 4 and the deflection head 14 can perform a reverse deflection action, wherein when the deflection head 14 deflects, it can switch conduction with the two connecting ports 1501, so that the No. 1 nozzle 402 and the No. 2 nozzle 1401 can spray cleaning liquid or compressed air, and when the deflection bracket 7 and the clamping plate 4 are reversely deflected, they can cooperate with the deflection head 14, so that when the deflection head 14 moves in the reverse direction, the No. 2 nozzle 1401 can maintain the movement direction of the deflection head 14, so that the deflection head 14 moves obliquely downward along the upper end of the circuit board, so that in the process of cleaning and drying the circuit board, the cleaning liquid can move obliquely downward along the circuit board, thereby improving the fluidity of the cleaning liquid to ensure the cleaning and drying effects.

[0077] The process of processing a circuit board using the integrated pin cutting and board washing device for secondary processing of the circuit board of the single-sided DIP insertion process includes the following steps:

[0078] Step 1: Place the circuit board with the pins cut between two sets of clamping plates 4. The clamping plates 4 can clamp the circuit board and keep it in an inclined state.

[0079] Step 2: Control the power part to move, drive the deflection head 14 to move along the length direction of the deflection bracket 7, at this time, the deflection head 14 and the first nozzle 402 can both spray the cleaning liquid toward the circuit board;

[0080] Step 3: When the deflection head 14 moves to the end of the stroke, the trigger assembly cooperates with the holding assembly to make the clamping plate 4 and the deflection bracket 7 tilt in the opposite direction, and then deflect the deflection head 14 to connect the deflection head 14 with the other connection port 1501;

[0081] Step 4: The power part moves in the reverse direction to drive the deflection head 14 to move in the reverse direction. At this time, dry air is sprayed onto the circuit board through the deflection head 14 and the first nozzle 402 to dry the cleaning liquid on the circuit board;

[0082] Step 5: Remove the circuit board and complete the board cleaning.

[0083] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0084] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An integrated circuit board cutting and washing device for secondary processing of single-sided DIP plug-in process, characterized in that: include: A frame structure, wherein two groups of symmetrical clamping plates (4) are arranged on the frame structure, and a plurality of No. 1 nozzles (402) are arranged equidistantly on the inner sides of the clamping plates (4); A deflection bracket (7) is arranged on the frame structure and connected to the rotating shaft of the clamping plate (4), wherein the clamping plate (4) and the deflection bracket (7) are parallel to the sides along their length direction; A power member is mounted on the frame structure and connected to a deflection head (14) provided on the deflection bracket (7); one end of the deflection head (14) is sealingly and slidably fitted with an arc plate (15) connected to the power member; two groups of connection ports (1501) are provided on the arc plate (15); and the deflection head (14) can be respectively connected to the two connection ports (1501); a retaining assembly, connected to the deflection bracket (7) and the clamping plate (4), the retaining assembly being capable of maintaining the deflection bracket (7) and the clamping plate (4) in an inclined state; a trigger assembly connected to the deflection bracket (7) and the power member, the trigger assembly cooperating with the retaining assembly to enable the deflection bracket (7) and the clamping plate (4) to tilt in opposite directions when the deflection head (14) moves to the end of the stroke, and to enable the deflection head (14) to switch between the two connection ports (1501); The power member comprises a linear drive module (10) mounted on the frame structure, the linear drive module (10) being connected to a transverse rod (11), a telescopic sleeve (12) being slidably sleeved on the transverse rod (11), and the telescopic sleeve (12) being connected to the arc-shaped plate (15); The deflection bracket (7) is provided with a guide rod (8), and a sliding sleeve plate (13) rotatably connected to the deflection head (14) and the telescopic sleeve (12) is slidably mounted on the guide rod (8), and the rotation axis of the deflection head (14) and the rotation axis of the telescopic sleeve (12) are colinear; the trigger assembly comprises an abutment wheel (16) rotatably connected to the telescopic sleeve (12) and two groups of trigger members (17) provided on the frame structure, and an inclined surface (1701) is formed on the trigger member (17); The trigger assembly further comprises a side support member (19) symmetrically arranged on the frame structure, wherein the side support member (19) cooperates with the deflection head (14) and can drive the deflection head (14) to deflect.

2. The integrated circuit board secondary processing device for cutting and washing circuit boards in the single-sided DIP insertion process according to claim 1 is characterized in that: The clamping plates (4) are rotatably mounted on the frame structure, and rubber strips (401) are provided on opposite sides of the two groups of clamping plates (4); The interior of the clamping plate (4) and its rotating shaft are hollow structures, and the first nozzle (402) is connected to the interior of the clamping plate (4); A plurality of through holes (403) are equidistantly arranged on the rotating shaft of the clamping plate (4), and a connector (5) is rotatably mounted on the rotating shaft of the clamping plate (4) in a sealed manner, so that when the fluid enters the connector (5), it can enter the interior of the clamping plate (4) through the through holes (403).

3. The integrated circuit board secondary processing device for cutting and washing circuit boards in the single-sided DIP insertion process according to claim 2 is characterized in that: The interior of the deflection head (14) is a hollow structure, and a second nozzle (1401) is provided at one end of the deflection head (14), and a conducting port (1402) is provided at the other end, wherein the conducting port (1402) is adapted to the two groups of connecting ports (1501); The deflection head (14) is connected to the connection head (5) via a conduit (18).

4. The integrated circuit board secondary processing device for cutting and washing circuit boards in the single-sided DIP insertion process according to claim 1 is characterized in that: The rotating shaft of the clamping plate (4) is connected to the rotating shaft of the deflection bracket (7) via a first connecting belt (6); The retaining assembly comprises a connecting rod connected to the frame structure, the connecting rod being formed with a convex ring (22), the convex ring (22) being sleeved with a collar (23), the collar (23) being connected to an elastic telescopic rod (25) provided on the frame structure, and the collar (23) being connected to the convex ring (22) via a chimeric structure; The connecting rod is connected to the rotating shaft of the clamping plate (4) via a second connecting belt (20).

5. The integrated circuit board secondary processing device for cutting and washing circuit boards in the single-sided DIP insertion process according to claim 4 is characterized in that: The connecting rod comprises a rotating shaft (21) and a telescopic shaft (24) which are coaxially and rotatably mounted on the frame structure, the rotating shaft (21) and the telescopic shaft (24) are slidably fitted together, and the interior of the rotating shaft (21) is a hollow structure; A limit block (2101) is provided inside the rotating shaft (21), a limit slot (2401) is provided on the telescopic shaft (24), and the limit block (2101) is slidably matched with the limit slot (2401).

6. The integrated circuit board secondary processing device for cutting and washing circuit boards in the single-sided DIP insertion process according to claim 4 is characterized in that: The interlocking structure comprises two grooves (2201) arranged on the convex ring (22), and a protrusion (2202) is formed between the two grooves (2201); The convex shaft (2301) disposed in the collar (23) is capable of switching between the two grooves (2201) via the protrusion (2202).

7. A process for treating a circuit board using the circuit board secondary processing integrated pin cutting and board washing device of the single-sided DIP insertion process as claimed in claim 1, characterized in that: The following steps are involved: Step 1: placing the circuit board with the pins cut between two sets of clamping plates (4), wherein the clamping plates (4) can clamp the circuit board and keep the circuit board in an inclined state; Step 2: Control the power component to move, driving the deflection head (14) to move along the length direction of the deflection bracket (7), at which time the deflection head (14) and the first nozzle (402) can both spray the cleaning liquid toward the circuit board; Step 3: When the deflection head (14) moves to the end of the stroke, the trigger assembly cooperates with the retaining assembly to cause the clamping plate (4) and the deflection bracket (7) to tilt in the opposite direction, and then deflect the deflection head (14) so ​​that the deflection head (14) is connected to another connection port (1501); Step 4: The power member moves in the reverse direction to drive the deflection head (14) to move in the reverse direction. At this time, dry air is sprayed onto the circuit board through the deflection head (14) and the first nozzle (402), thereby drying the cleaning liquid on the circuit board; Step 5: Remove the circuit board and complete the board cleaning.

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