Method for manufacturing circuit board and circuit board

Abstract

The present invention provides a method for manufacturing a circuit board and a circuit board. The method comprises: providing a copper material, a circuit board body and a chip; cutting the copper material according to a preset shape to obtain a cut copper block; pre-treating the cut copper block to obtain a pre-treated copper block; gluing the pre-treated copper block to obtain a gluing copper block; pressing the gluing copper block with the circuit board body to obtain a first circuit board; welding the first circuit board according to the chip to obtain a target circuit board. The present invention obtains a target circuit board by cutting and pre-treating the provided copper material, and then gluing the pre-treated copper block and then pressing and welding it with the circuit board body. The copper block can be firmly fixed on the circuit board, thereby improving the bonding force between the copper block and the circuit board body, and also facilitating the heat resistance and heat dissipation of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and also to a method for manufacturing a circuit board and the circuit board. Background Art

[0002] As the size of electronic products becomes smaller and smaller, the size of circuit boards is also constantly shrinking, and the circuit design is becoming more and more intensive. Due to the increase in the power density of components, the heat dissipation of circuit boards is too large, which affects the service life, aging and even failure of components. Based on the development of new generation information technology, energy-saving and new energy vehicles, power equipment and other fields, the solution to the heat dissipation problem is imminent. Directly embedding metal copper blocks on the circuit board and using the copper blocks to dissipate heat for the chip is one of the effective ways to solve the heat dissipation problem. However, the existing manufacturing process has problems such as insufficient bonding between the copper block and the main body of the circuit board, poor heat resistance and heat dissipation, and low product qualification rate, which limits the application and promotion of the technical achievements of circuit boards embedded with copper blocks. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method for manufacturing a circuit board and a circuit board, so as to improve the bonding force and heat dissipation of the copper block and the circuit board body.

[0004] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0005] A first aspect of the present invention provides a method for manufacturing a circuit board, comprising:

[0006] Provide copper materials, circuit board bodies and chips;

[0007] Cutting the copper material according to a preset shape to obtain a cut copper block;

[0008] Pre-treating the cut copper block to obtain a pre-treated copper block;

[0009] Performing a glue-coating treatment on the pretreated copper block to obtain a glue-coated copper block;

[0010] Pressing the glued copper block and the circuit board body to obtain a first circuit board;

[0011] The first circuit board is soldered according to the chip to obtain a target circuit board.

[0012] Optionally, the copper material is cut into a preset shape to obtain a cut copper block, comprising:

[0013] Determining cutting parameters according to the preset shape and the copper material;

[0014] According to the preset shape and the cutting parameters, the copper material is placed in a cutting device for cutting to obtain a cut copper block.

[0015] Optionally, pre-treating the cut copper block to obtain a pre-treated copper block comprises:

[0016] Smoothing the cut copper block to obtain a smooth copper block;

[0017] Cleaning the smooth copper block to obtain a cleaned copper block;

[0018] Performing micro-etching treatment on the cleaned copper block to obtain a micro-etched copper block;

[0019] The micro-etched copper block is organically coated to obtain a pre-treated copper block.

[0020] Optionally, the pretreated copper block is subjected to a glue-coating treatment to obtain a glue-coated copper block, comprising:

[0021] Determining a tape pattern according to the pretreated copper block;

[0022] Cutting the provided adhesive tape according to the adhesive tape pattern to obtain adhesive tape to be laminated;

[0023] According to the first preset laminating parameters, the pretreated copper block and the adhesive tape to be laminated are placed in a laminating machine for laminating to obtain a laminated copper block.

[0024] Optionally, according to a first preset laminating parameter, the pretreated copper block and the adhesive tape to be laminated are placed in a laminating machine for laminating to obtain a laminated copper block, including:

[0025] Determining first preset pressing parameters according to the provided adhesive tape and the pretreated copper block;

[0026] According to the first preset laminating parameters, the pretreated copper block and the adhesive tape to be laminated are placed in a laminating machine for laminating to obtain a laminated copper block.

[0027] Optionally, the copper block after the adhesive bonding is pressed together with the circuit board body to obtain a first circuit board, comprising:

[0028] Laminating the glued copper block on the circuit board body according to a preset position to obtain a laminated copper block and circuit board body;

[0029] According to the second preset pressing parameters, the bonded copper block and the circuit board body are pressed together to obtain a first circuit board.

[0030] Optionally, the laminated copper block and the circuit board body are pressed together according to a second preset pressing parameter to obtain a first circuit board, including:

[0031] According to the second preset pressing parameters, placing the bonded copper block and the circuit board body into a pressing machine for pressing, to obtain a pressed circuit board body;

[0032] The pressed circuit board body is baked according to preset baking parameters to obtain a first circuit board.

[0033] Optionally, performing welding processing on the first circuit board according to the chip to obtain a target circuit board includes:

[0034] According to the cut copper block, determining the hollowing position of the copper block;

[0035] Fixing the chip on the first circuit board according to the hollowed-out position of the copper block to obtain a first circuit board with the chip fixed thereon;

[0036] The first circuit board with the chip fixed thereon is subjected to welding processing to obtain a target circuit board.

[0037] Optionally, the method for manufacturing the circuit board further includes:

[0038] Obtaining preset appearance inspection qualified conditions and preset electrical continuity inspection qualified conditions;

[0039] Performing appearance inspection and electrical connectivity inspection on the target circuit board to obtain inspection results;

[0040] Determining a preset inspection pass condition according to the preset appearance inspection pass condition and the preset electrical connectivity inspection pass condition;

[0041] If the detection result meets the preset detection qualification condition, the target circuit board corresponding to the detection result is a qualified target circuit board.

[0042] A second aspect of the present invention provides a circuit board, which is manufactured using the circuit board manufacturing method as described in any of the above items, wherein the circuit board comprises: a copper block, a circuit board body and a chip, wherein the copper block and the chip are both arranged on the circuit board body, and the chip is located in the hollow part of the copper block.

[0043] The above solution of the present invention includes at least the following beneficial effects:

[0044] The above scheme of the present invention obtains a cut copper block by cutting the provided copper material, and then pre-treats the copper block, and then performs adhesive treatment on the pre-treated copper block, and then presses and welds it with the circuit board body to obtain a target circuit board. The adhesive tape has good bonding strength, and the copper block can be firmly fixed on the circuit board, thereby improving the bonding strength between the copper block and the circuit board body. The copper block is directly embedded in the circuit board and fits the chip, so as to achieve the purpose of rapid heat dissipation, which is beneficial to improving the service life and efficiency of the chip, and the product qualification rate is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 is a schematic flow chart of a method for manufacturing a circuit board in an embodiment of the present invention;

[0046] Figure 2 It is a schematic diagram of the structure of a circuit board in an embodiment of the present invention.

[0047] Description of the reference numerals: 1-copper block, 2-circuit board body, 3-chip, 11-hollowing. DETAILED DESCRIPTION

[0048] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0049] like Figure 1 As shown, an embodiment of the present invention provides a method for manufacturing a circuit board, comprising the following steps:

[0050] Step 101, providing copper material, a circuit board body and a chip;

[0051] Step 102, cutting the copper material into a preset shape to obtain a cut copper block;

[0052] Step 103, pre-treating the cut copper block to obtain a pre-treated copper block;

[0053] Step 104, performing a glue-coating process on the pretreated copper block to obtain a glue-coated copper block;

[0054] Step 105, pressing the glued copper block and the circuit board body to obtain a first circuit board;

[0055] Step 106: soldering the first circuit board according to the chip to obtain a target circuit board.

[0056] The method for manufacturing a circuit board proposed in an embodiment of the present invention cuts the provided copper material to obtain a cut copper block, then pretreats the copper block, and then performs adhesive treatment on the pretreated copper block, and then presses and welds it with the circuit board body to obtain a target circuit board. The adhesive tape has good bonding strength, and the copper block can be firmly fixed on the circuit board, thereby improving the bonding strength between the copper block and the circuit board body. The copper block is directly embedded on the circuit board and fits with the chip, so as to achieve the purpose of rapid heat dissipation, which is beneficial to improving the service life and efficiency of the chip, and the product qualification rate is high.

[0057] In an optional embodiment of the present invention, the copper material provided in step 101 needs to meet the conditions of high purity, good electrical conductivity and high thermal conductivity. The material of the copper material is pure copper or copper alloy. High-purity copper material has better electrical conductivity and thermal conductivity, which helps to improve heat dissipation efficiency. The circuit board body can be epoxy resin, aluminum substrate, ceramic substrate, etc., or an aluminum substrate or ceramic substrate with better thermal conductivity. The provided chip can be selected according to user needs or circuit board function requirements.

[0058] In an optional embodiment of the present invention, step 102 includes:

[0059] Step 1021, determining cutting parameters according to the preset shape and the copper material;

[0060] Specifically, when CNC cutting equipment (such as CNC machine tools) is used to cut copper blocks of a desired size and shape from copper materials, the cutting parameters will vary depending on the material, thickness, cutting quality requirements of the copper materials, and the cutting technology used (such as plasma cutting, flame cutting, laser cutting, etc.). If CNC plasma cutting equipment is used, and the copper material is pure copper or copper alloy with a thickness of 10mm, the cutting parameters include: cutting speed, set to 2000 mm per minute (this speed needs to be adjusted according to the specific machine model and material thickness, and there may be slight differences in actual processing); plasma gas, usually air or nitrogen is used as plasma gas, and the gas flow and pressure may need to be adjusted according to the cutting effect; the distance from the cutting torch to the copper material (cutting nozzle height), 4 to 10 mm, depending on the cutting machine model and nozzle design, to ensure that the arc is stable and the cutting efficiency is maximized; arc voltage, set according to the plasma power supply and cutting thickness, generally adjusted between 120V and 160V; cutting current, the cutting current will be automatically adjusted according to the cutting thickness and material type to ensure cutting quality and speed; in addition, some auxiliary parameters are also included, such as the cooling system, to ensure that the cooling system works normally during cutting to prevent the cutting torch from overheating; dust removal system, turn on the dust removal system to keep the cutting area clean and reduce the impact of smoke on the equipment and operating environment. During specific cutting, the cutting path can be designed according to preset shapes (including geometric shapes such as rectangles, squares, circles, etc., as well as hollow positions, etc.) using computer-aided design and computer-aided manufacturing software, and converted into G code (numerical control programming language) or NC code (code that can be recognized by digital information control mechanical controllers) that can be recognized by CNC cutting machines.

[0061] Step 1022: according to the preset shape and the cutting parameters, the copper material is placed in a cutting device for cutting to obtain a cut copper block.

[0062] Specifically, the cutting equipment can be a CNC machine tool or a CNC plasma cutting equipment. Before cutting, perform program simulation to check whether the cutting path and cutting parameters are correct. Upload the program to the CNC cutting machine and start the equipment for cutting.

[0063] In an optional embodiment of the present invention, step 103 includes:

[0064] Step 1031, smoothing the cut copper block to obtain a smooth copper block;

[0065] Specifically, there may be burrs on the copper block after cutting, so the copper block needs to be smoothed to remove the burrs on the surface and increase the smoothness of the copper block surface to avoid damage to the circuit board or chip caused by the burrs, which is beneficial to improve the product qualification rate.

[0066] Step 1032, cleaning the smooth copper block to obtain a cleaned copper block;

[0067] Specifically, the smooth copper block can be cleaned thoroughly with a degreasing agent to remove oil stains and impurities from its surface, then pickled to remove residues after micro-etching, and then the surface of the copper block can be cleaned thoroughly with pure water.

[0068] Step 1033, performing micro-etching on the cleaned copper block to obtain a micro-etched copper block;

[0069] Specifically, the oxidation on the copper block is eliminated by the micro-etching process, and a rough copper surface is formed on the surface of the copper block, which is convenient for the attachment of OSP (organic protective film), improves the bonding force between the copper block and the organic protective film solution, and is conducive to improving production efficiency. In order to obtain a smooth and uniform film thickness, it is very important to maintain the stability of the micro-etching speed. In this embodiment, the micro-etching speed is in the range of 1.0 to 1.5 microns per minute.

[0070] Step 1034, performing organic coating on the micro-etched copper block to obtain a pre-treated copper block.

[0071] Specifically, an organic protective film solution is evenly coated on the surface of the copper block, or the micro-etched copper block is immersed in an organic protective film solution. The organic matter in the organic protective film solution is adsorbed on the copper surface to form a protective film to prevent oxidation and improve welding performance. Thereafter, excess organic protective film solution on the copper block is washed off and allowed to dry naturally or in an oven.

[0072] In an optional embodiment of the present invention, step 104 includes:

[0073] Step 1041, determining a tape pattern according to the pretreated copper block;

[0074] Specifically, since the pretreated copper block has holes or hollows, the adhesive tape pattern needs to be determined according to the specific shape of the copper block, so as to facilitate subsequent cutting of the adhesive tape to obtain suitable adhesive tape to be bonded, ensuring that the adhesive tape to be bonded and the copper block can be fully bonded.

[0075] Step 1042, cutting the provided adhesive tape according to the adhesive tape pattern to obtain adhesive tape to be laminated;

[0076] Specifically, the adhesive tape can protect the surface of the copper block from being damaged, and at the same time prevent dust, fingerprints and other pollutants from entering the copper block. The adhesive tape can play a positioning role, and its strong viscosity can maintain the position of the copper block and avoid interruption of the production process due to the displacement of the copper block. Therefore, the use of adhesive tape can reduce manufacturing costs and improve production efficiency. The adhesive tape provided can be polyimide (PI) tape, polyester (PET) tape, etc. These materials not only have good adhesion and temperature resistance, but also have certain insulation properties and chemical resistance, which can meet various requirements in the copper block production process. Before cutting, the provided adhesive tape needs to be cleaned and kept clean, free of dust, oil and other impurities to ensure good adhesion between the adhesive tape to be bonded and the copper block obtained after cutting.

[0077] When cutting, you can choose laser cutting or die cutting. Taking laser cutting as an example, the cutting process includes: cleaning the surface of the tape and removing impurities that may affect the cutting quality. Determine the tape pattern according to the pretreated copper block to ensure that the tape and the copper block can fit completely, and import the determined tape pattern into the control software of the laser cutting machine. After that, you need to set various parameters of the laser cutting machine, including laser power, cutting speed, focus position, gas type and air pressure, etc. The settings of these parameters need to be adjusted according to the material, thickness and required cutting quality of the tape. Place the tape to be cut on the workbench of the laser cutting machine and fix it to ensure that it will not move during the cutting process. Start the laser cutting machine, and the laser beam cuts the tape according to the determined tape pattern. During the cutting process, the laser beam will quickly heat and melt the tape material to form a cutting line. Auxiliary gases (such as nitrogen, oxygen, etc.) are sprayed into the cutting area to help remove the melted material and improve the cutting speed and quality. After cutting is completed, remove the cut tape from the workbench and check the cutting quality, including edge flatness, dimensional accuracy, etc. If necessary, perform further processing such as deburring, cleaning, etc.

[0078] Step 1043, according to the first preset pressing parameters, the pretreated copper block and the adhesive tape to be laminated are placed in a laminating machine for lamination to obtain a laminated copper block.

[0079] In an optional embodiment of the present invention, step 1043 includes:

[0080] Step 10431, determining a first preset pressing parameter according to the provided adhesive tape and the pretreated copper block;

[0081] Specifically, the first preset pressing parameters include temperature, pressure and time.

[0082] The temperature includes a heating section, a constant temperature section, and a cooling section. Heating section: Set an appropriate heating rate according to the melting temperature of the adhesive tape and the thermal conductivity of the copper block. For example, if the melting temperature of the adhesive tape is around 100°C, the heating rate can be set to 2 to 4°C / min to gradually increase the temperature to close to the melting temperature. Constant temperature section: After the adhesive tape reaches the melting temperature, maintain a constant temperature for a period of time (such as 5 to 10 minutes) to ensure that the adhesive tape is fully melted and flows evenly to fill the gap between the copper block and the adhesive tape. The constant temperature is usually slightly higher than the melting temperature of the adhesive tape, but should not be too high to avoid damaging the material. Cooling section: After the lamination is completed, set a cooling program to gradually reduce the temperature to room temperature. The cooling rate should be moderate to avoid product deformation caused by internal stress caused by rapid cooling.

[0083] Pressure includes initial pressure, main pressure and holding pressure. Initial pressure: At the beginning of the heating stage, apply a small pressure (such as 10 to 20PSI) to make the copper block and the adhesive tape initially contact and expel some air. Main pressure: When the adhesive tape reaches a molten state, increase the pressure to the main pressure value (such as 100 to 300PSI). The specific value depends on the viscosity of the adhesive tape, the hardness of the copper block and the required pressing strength. The main pressure should last for a period of time (such as a few minutes) to ensure that the adhesive tape is fully cured and tightly bonded to the copper block. Holding pressure: In the cooling stage, maintain a certain pressure (such as 50% to 70% of the main pressure value) to prevent shrinkage or bubbles caused by temperature reduction.

[0084] The time includes heating time, constant temperature time and total pressing time. Heating time: Calculate the time required for heating according to the set heating rate and the required constant temperature. The formula is: , where t is the time required for heating, The constant temperature required is the temperature that is expected to be achieved and maintained during the lamination process. It is usually determined based on the melting characteristics of the adhesive tape. is the room temperature, the initial temperature of the laminating machine or the environment, usually set to room temperature, R is the set heating rate, which is the rate at which the temperature increases over time, in degrees Celsius per minute (°C / min). , room temperature , the set heating rate is R = 4°C / min, then according to the formula It can be calculated that the time required for heating is t=23.75 minutes. Constant temperature time: According to the melting characteristics and lamination requirements of the adhesive tape, the constant temperature time is set to ensure that the adhesive tape is fully melted and solidified. Total lamination time: The sum of the heating time, constant temperature time and cooling time is the total lamination time. The length of the total lamination time depends on the material and product requirements of the specific adhesive tape.

[0085] Step 10432: according to the first preset pressing parameters, put the pretreated copper block and the adhesive tape to be laminated into a laminating machine for lamination to obtain a laminated copper block.

[0086] Specifically, the first preset pressing parameters are input into the controller of the pressing machine, and the pressing machine is controlled to press the adhesive tape to be laminated onto the pretreated copper block according to the first preset pressing parameters to form a laminated copper block.

[0087] In an optional embodiment of the present invention, step 105 includes:

[0088] Step 1051, laminating the glued copper block on the circuit board body according to a preset position to obtain a laminated copper block and circuit board body;

[0089] Specifically, the copper block is precisely placed at a preset position on the circuit board body, and the preset position can be obtained according to the design structure diagram of the circuit board. The copper block is bonded to the circuit board body using adhesive tape (such as prepreg) on ​​the copper block. During the bonding process, it is necessary to ensure that the adhesive tape is evenly covered between the copper block and the circuit board body to avoid bubbles or gaps. Before lamination, the circuit board body and the copper block can be surface treated, such as cleaning, oxidation treatment, etc., to enhance their adhesion to the adhesive tape.

[0090] Step 1052: Press the bonded copper block and the circuit board body according to the second preset pressing parameters to obtain a first circuit board.

[0091] Specifically, the bonded circuit board is placed in a press machine, and the pressing operation is performed according to preset pressing parameters (including heating rate, constant temperature, holding time, pressure, etc.) to improve the bonding force of the copper block circuit board body. The pressing parameters in this embodiment may include: heating rate, which is usually controlled between 2 and 4°C / min, depending on the melting characteristics of the adhesive tape and the performance of the press machine; constant temperature, which is set according to the melting temperature of the adhesive tape, generally between 120 and 180°C, and the constant temperature is the key to the adhesive tape fully melting and bonding the copper block and the circuit board body; holding time, which is kept at a constant temperature for a period of time to ensure that the adhesive tape is fully melted and firmly bonded, and the length of the holding time depends on factors such as the melting characteristics of the adhesive tape, the performance of the press machine, and the thickness of the circuit board body; pressure, which is set according to the thickness and material of the circuit board body and the copper block and the viscosity of the adhesive tape, and the pressure needs to be sufficient to exhaust the interlayer gas and volatiles, and ensure that the adhesive tape can evenly fill the interlayer gap. When the main body of the circuit board is composed of multi-layer boards, the pressure during lamination will be relatively large. During the lamination process, the temperature and pressure need to be precisely controlled to ensure that the adhesive tape can fully melt and firmly bond the copper block to the main body of the circuit board. After the lamination is completed, let the circuit board cool naturally in the laminator or cool to room temperature according to the set cooling program, and then take it out of the laminator. After that, the quality inspection of the laminated circuit board can be carried out, including appearance inspection, dimensional measurement, electrical performance test, etc. Ensure that the circuit board meets the design requirements and quality standards, check whether the bonding between the copper block and the main body of the circuit board is firm, and whether there are defects such as bubbles and voids.

[0092] In an optional embodiment of the present invention, step 1052 includes:

[0093] Step 10521, according to the second preset pressing parameters, placing the bonded copper block and the circuit board body into a pressing machine for pressing, to obtain a pressed circuit board body;

[0094] Specifically, the second preset pressing parameters may include heating rate, constant temperature, insulation time, pressure, etc. The pressing machine presses the copper block and the circuit board body according to the second preset pressing parameters to fix the copper block on the circuit board body.

[0095] Step 10522, baking the pressed circuit board body according to preset baking parameters to obtain a first circuit board.

[0096] Specifically, according to the characteristics of the organic protective film and the adhesive tape, preset baking parameters such as appropriate baking temperature, time and temperature rise curve are set. The pressed circuit board is placed in a baking oven and baked according to the preset baking parameters to completely solidify the organic protective film and the adhesive tape, which is beneficial to improve the bonding strength between the copper block and the circuit board body, and improve the product qualification rate and reliability.

[0097] In an optional embodiment of the present invention, step 106 includes:

[0098] Step 1061, determining the hollowing position of the copper block according to the cut copper block;

[0099] Specifically, the cut copper block has a plurality of holes or hollow places, which are determined as hollow places to facilitate the subsequent embedding of chips. The hollow places on the copper block provide a larger heat dissipation area for the copper block, which is conducive to improving the heat dissipation performance of the copper block.

[0100] Step 1062, fixing the chip on the first circuit board according to the hollowed-out position of the copper block to obtain a first circuit board with the chip fixed thereon;

[0101] Specifically, place the chip in the hole or hollow of the copper block, ensure that the pins of the chip are aligned with the edge of the hollow area, and use tools such as clamps or vacuum pens to position and fix it. The copper block can be used to dissipate heat and position the chip, which is beneficial to improving the heat dissipation performance and safety of the circuit board.

[0102] Step 1063, performing welding processing on the first circuit board with the chip fixed thereon to obtain a target circuit board.

[0103] Specifically, use welding materials (such as solder, conductive glue, etc.) to weld the chip to the circuit board body at the hollowed-out part of the copper block. For chips with more pins, you can use a pin welding machine for automatic welding. During the welding process, pay attention to controlling the welding temperature and time to avoid damage to the chip.

[0104] In an optional embodiment of the present invention, the method further comprises:

[0105] Step 107, obtaining preset appearance inspection qualified conditions and preset electrical connectivity inspection qualified conditions;

[0106] Specifically, the preset appearance inspection qualified conditions include that the circuit board surface is smooth, flat, without obvious deformation or damage, without scratches, cracks, oxidation and other surface defects, and the chip pin welding quality and chip position accuracy meet the preset welding requirements. The preset electrical connectivity inspection qualified conditions include that the chip and circuit board can be connected and work normally after welding. The preset appearance inspection qualified conditions and the preset electrical connectivity inspection qualified conditions can be determined according to user requirements or according to the functions to be achieved by the circuit board.

[0107] Step 108, performing appearance inspection and electrical connectivity inspection on the target circuit board to obtain inspection results;

[0108] Specifically, the appearance inspection mainly detects whether the surface of the target circuit board is smooth, flat, without obvious deformation or damage, whether there are scratches, cracks, oxidation and other surface defects, which will affect the performance and service life of the circuit board. At the same time, it can also detect the chip's pin welding quality, chip position accuracy, etc., to ensure that the connection between the chip and the circuit board is firm and reliable. Electrical connectivity detection is to check whether the chip's connection method, position is correct, whether there is damage, etc., to ensure that the chip can be connected and work normally after welding to the circuit board. Measuring tools such as multimeters and oscilloscopes can be used for detection. The test results can include relevant data on the surface of the target circuit board detected by appearance, such as whether the surface is smooth, flat, without obvious deformation or damage, whether there are scratches, cracks, oxidation and other surface defects, and can also include the chip's pin welding quality, chip position accuracy, etc.; the test results can also include relevant data on the target circuit board detected by electrical connectivity, such as whether the chip's connection method, position is correct, whether there is damage, etc.

[0109] Step 109, determining a preset inspection qualified condition according to the preset appearance inspection qualified condition and the preset electrical connectivity inspection qualified condition;

[0110] Specifically, the preset inspection qualified conditions include preset appearance inspection qualified conditions and preset electrical connectivity inspection qualified conditions, which are used to subsequently determine a qualified target circuit board based on the inspection results and the preset inspection qualified conditions.

[0111] Step 1010: If the detection result meets the preset detection qualification condition, the target circuit board corresponding to the detection result is a qualified target circuit board.

[0112] Specifically, if the appearance test in the test result meets the preset appearance test qualification condition, and the electrical connectivity test in the test result meets the preset electrical connectivity test qualification condition, then the corresponding target circuit board is a qualified target circuit board. For unqualified target circuit boards, repair processing can be performed until they become qualified target circuit boards.

[0113] A specific embodiment of the method for manufacturing a circuit board proposed in an embodiment of the present invention is:

[0114] Step 111, providing materials.

[0115] According to user needs, we provide copper materials and circuit board bodies of corresponding materials, and provide chips of corresponding types, models and quantities.

[0116] Step 112, cutting the copper material.

[0117] The cutting parameters are determined according to the thickness and material of the copper material, as well as the cutting technology used by the CNC cutting equipment. Taking the copper material with a thickness of 10 mm and the CNC plasma cutting equipment as an example, the cutting parameters include a cutting speed of 2000 mm per minute, plasma gas of air or nitrogen, a cutting nozzle height of 4 to 10 mm, an arc voltage of 120V to 160V, a cutting current of 8A to 10A, and a cutting path. Among them, the cutting path needs to be set according to the preset shape and converted into a G code or NC code that can be recognized by the CNC cutting machine. The above cutting parameters are input into the controller of the CNC plasma cutting equipment, so that the CNC plasma cutting equipment cuts the copper material according to the cutting parameters to obtain the cut copper block.

[0118] Step 113, pre-treating the copper block.

[0119] The copper block is pre-treated by deburring, cleaning, micro-etching, and coating with an organic protective film solution to improve the performance of the copper block itself.

[0120] Step 114, applying glue.

[0121] First, determine the adhesive tape pattern according to the shape of the copper block, the hollowing out on the copper block and other data, then cut the provided adhesive tape into adhesive tape to be bonded that can be completely bonded to the copper block according to the adhesive tape pattern, and then put the copper block and the adhesive tape to be bonded into a laminating machine for laminating according to first preset laminating parameters such as temperature, pressure and time to obtain the copper block after laminating.

[0122] Step 115, pressing the copper block and the circuit board together.

[0123] According to the design structure diagram of the circuit board, the preset position of the copper block on the circuit board body is obtained, and then the glued copper block is pressed with the circuit board body according to the second preset pressing parameters such as heating rate, constant temperature, insulation time, pressure, etc., so that the copper block is fixed on the circuit board body.

[0124] Step 116, soldering the chip.

[0125] The chip is fixed on a circuit board with a copper block, and the chip is located at the hollow position (or hole) of the copper block, and then the chip is soldered to the circuit board using soldering materials to obtain a target circuit board.

[0126] The method for manufacturing a circuit board proposed in the embodiment of the present invention can not only improve the bonding strength between the copper block, the chip and the circuit board, but also utilize the high thermal conductivity of copper to enable heat to be transferred out faster. The structure of arranging the chip in the hollow part of the copper block further increases the heat dissipation area, thereby improving the heat dissipation efficiency, and can improve the heat dissipation and safety of the circuit board.

[0127] like Figure 2As shown, an embodiment of the present invention provides a circuit board, which is manufactured by the method for manufacturing a circuit board as described in any one of the above embodiments, wherein the circuit board comprises:

[0128] A copper block 1 , a circuit board body 2 and a chip 3 , wherein the copper block 1 and the chip 3 are both arranged on the circuit board body 2 , and the chip 3 is located at the hollow 11 of the copper block 1 .

[0129] The copper block is embedded in the circuit board body and fits with the chip, which can achieve the purpose of rapid heat dissipation, which is beneficial to improving the service life and output efficiency of the chip. The adhesive tape has good bonding strength and a high product qualification rate. The circuit board is applied to small-volume electronic products, such as new energy vehicles and power equipment, and can improve the integration density of components of electronic products. In the case of high-density integrated components, the heat dissipation efficiency of the components integrated by the circuit board of the present invention is greatly improved.

[0130] In a specific electronic product, a circuit board body 2 is connected to multiple components such as a processor, memory, display screen, and camera to ensure the normal operation of various functions of the electronic product. However, when the electronic product is running, each component will generate high heat. In order to dissipate this heat to the surrounding environment in a timely and effective manner and reduce the heat or temperature of each component and the electronic product itself, a copper block 3 can be set at different positions of the circuit board body 2, and a chip 3 that provides a connection interface for the processor, memory, display screen, and camera is set in the hollow part or around the copper block, so that the heat generated by the chip 3 can be dissipated to the surrounding environment through the copper block.

[0131] The heat dissipation generated by chip 3 refers to the heat dissipated by chip 3 to the environment during operation. The thermal resistance of copper block 1 refers to the heat dissipation capacity of copper block 1 under unit temperature difference. The smaller the thermal resistance, the better the thermal conductivity or heat dissipation. The heat dissipation Q of the chip can be calculated by It is calculated as follows: where Q is the heat dissipation generated by the chip; is the junction temperature of the chip (the actual operating temperature of the chip), which can be obtained from the chip manual; is the ambient temperature, which can be measured by a temperature sensor; It is the thermal resistance from the inside of the chip to the ambient air (also called the total thermal resistance), which includes the effects of chip packaging, copper block heat dissipation, and air flow on heat dissipation.

[0132] The efficiency of the copper block in dissipating the heat from the chip is Calculated, where W is the heat dissipation efficiency of the copper block; R is the thermal resistance of the copper block; It is the difference between the surface temperature of the chip during operation (measured directly by the temperature sensor) and the ambient temperature (measured directly by the temperature sensor) (if the heat generated by the chip during operation causes the surface temperature of the chip itself to rise to 80°C, and the ambient temperature is 25°C, then the temperature difference between the chip and the ambient environment is That is 80℃-25℃=55℃); Q is the heat generated by the chip.

[0133] The copper block has a very high thermal conductivity, so its thermal resistance is relatively low. Under the same heat transfer conditions, the copper block can more effectively transfer heat from the high temperature area to the low temperature area, thereby achieving a better heat dissipation effect. Therefore, a copper block is set on the main body of the circuit board, and the chip is set in the hollow part of the copper block, the heat dissipation area is increased, and the copper block surrounding the chip can efficiently dissipate the heat of the chip, thereby improving the heat dissipation function of the circuit board.

[0134] It should be noted that the chip on the circuit board body can not only include the chip located in the hollow part, but also the chip can be installed at other positions of the circuit board body, or multiple copper blocks can be installed at different positions and different layers on the circuit board body, and the selection can be made according to the needs.

[0135] The circuit board of the embodiment of the present invention has the advantages of good heat dissipation and high safety in use.

[0136] It should be noted that, in the above-mentioned embodiments, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include one..." do not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the implementation of the above-mentioned embodiments is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0137] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for manufacturing a circuit board, It is characterized in that include: Provide copper materials, circuit board bodies and chips; Cutting the copper material according to a preset shape to obtain a cut copper block; Pre-treating the cut copper block to obtain a pre-treated copper block; Performing a glue-coating treatment on the pretreated copper block to obtain a glue-coated copper block; Pressing the glued copper block and the circuit board body to obtain a first circuit board; Performing welding processing on the first circuit board according to the chip to obtain a target circuit board; The process of pre-treating the cut copper block to obtain the pre-treated copper block comprises: Pre-treating the cut copper block to obtain a pre-treated copper block comprises: Smoothing the cut copper block to obtain a smooth copper block; Cleaning the smooth copper block to obtain a cleaned copper block; Performing micro-etching treatment on the cleaned copper block to obtain a micro-etched copper block; Performing organic coating on the micro-etched copper block to obtain a pre-treated copper block; The process of subjecting the pretreated copper block to a glue-coated copper block to obtain a glue-coated copper block comprises: Determining a tape pattern according to the pretreated copper block; Cutting the provided adhesive tape according to the adhesive tape pattern to obtain adhesive tape to be laminated; According to the first preset laminating parameters, the pretreated copper block and the adhesive tape to be laminated are placed in a laminating machine for laminating to obtain a laminated copper block; The copper block after the adhesive bonding is pressed together with the circuit board body to obtain a first circuit board, comprising: Laminating the glued copper block on the circuit board body according to a preset position to obtain a laminated copper block and circuit board body; According to the second preset pressing parameters, the bonded copper block and the circuit board body are pressed together to obtain a first circuit board; The first circuit board is subjected to welding processing according to the chip to obtain a target circuit board, including: According to the cut copper block, determining the hollowing position of the copper block; Fixing the chip on the first circuit board according to the hollowed-out position of the copper block to obtain a first circuit board with the chip fixed thereon; The first circuit board with the chip fixed thereon is subjected to welding processing to obtain a target circuit board.

2. The method for manufacturing a circuit board according to claim 1, It is characterized in that The copper material is cut into a preset shape to obtain a cut copper block, comprising: Determining cutting parameters according to the preset shape and the copper material; According to the preset shape and the cutting parameters, the copper material is placed in a cutting device for cutting to obtain a cut copper block.

3. The method for manufacturing a circuit board according to claim 1, It is characterized in that According to the first preset laminating parameters, the pretreated copper block and the adhesive tape to be laminated are placed in a laminating machine for laminating to obtain a laminated copper block, including: Determining first preset pressing parameters according to the provided adhesive tape and the pretreated copper block; According to the first preset laminating parameters, the pretreated copper block and the adhesive tape to be laminated are placed in a laminating machine for laminating to obtain a laminated copper block.

4. The method for manufacturing a circuit board according to claim 1, It is characterized in that According to the second preset pressing parameters, the bonded copper block and the circuit board body are pressed together to obtain a first circuit board, including: According to the second preset pressing parameters, placing the bonded copper block and the circuit board body into a pressing machine for pressing, to obtain a pressed circuit board body; The pressed circuit board body is baked according to preset baking parameters to obtain a first circuit board.

5. The method for manufacturing a circuit board according to claim 1, It is characterized in that Also includes: Obtaining preset appearance inspection qualified conditions and preset electrical continuity inspection qualified conditions; Performing appearance inspection and electrical connectivity inspection on the target circuit board to obtain inspection results; Determining a preset inspection pass condition according to the preset appearance inspection pass condition and the preset electrical connectivity inspection pass condition; If the detection result meets the preset detection qualification condition, the target circuit board corresponding to the detection result is a qualified target circuit board.

6. A circuit board, It is characterized in that The circuit board is manufactured by the method for manufacturing a circuit board according to any one of claims 1 to 5, wherein the circuit board comprises: A copper block (1), a circuit board body (2) and a chip (3), wherein the copper block (1) and the chip (3) are both arranged on the circuit board body (2), and the chip (3) is located at a hollow (11) of the copper block (1).

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