Laser cutting equipment for processing single crystal silicon wafers

Abstract

The present invention relates to the field of cutting technology, and in particular to a laser cutting device for processing single crystal silicon wafers, including a laser cutting device for processing single crystal silicon wafers, comprising a dislocation moving mechanism, the dislocation moving mechanism comprising a pushing component, the pushing component being provided with a pressing workpiece, the pressing workpiece being fixedly connected with a first gradient plate and a second gradient plate, the cutting mechanism comprising a first pressing device and a cutting device, the intermittent moving mechanism comprising a first connecting plate and a second connecting plate, the ratchet track comprising an O-type fixing belt, the O-type fixing belt being connected with ratchets, the ratchets being distributed along the track of the O-type fixing belt, and the ratchets being provided with inverted trapezoidal grooves, and the dislocation distribution of the first gradient plate and the second gradient plate being arranged to improve the flatness and accuracy of the vertical surface of the single crystal silicon column cut by the laser cutter on the cutting device, the automatic forward movement and collection of the single crystal silicon wafers being completed by the intermittent moving mechanism being arranged, and the cutting of the single crystal silicon wafers being completed by the cutting device.

Description

Technical Field

[0001] The invention relates to the field of cutting technology, and in particular to laser cutting equipment for processing single crystal silicon slices. Background Art

[0002] With the rapid development of the semiconductor industry, the processing technology of single crystal silicon wafers has become one of the key factors to promote the progress of the industry. Among them, laser cutting technology has gradually emerged in the field of single crystal silicon wafer processing with its advantages of high precision, high efficiency and non-contact processing. This article will introduce an invention of laser cutting equipment for single crystal silicon wafer processing, explore its technical principles, development history and its important significance to the industry. Laser cutting technology uses a high-energy density laser beam to irradiate the surface of a single crystal silicon wafer after focusing, so that the material is quickly heated locally and reaches the melting point or vaporization point, thereby realizing non-contact cutting. This cutting method not only avoids the mechanical stress and damage caused by traditional mechanical cutting, but also greatly improves the cutting accuracy and efficiency. The laser cutting equipment for single crystal silicon wafer processing provided by the present invention improves the structure on the basis of the existing technology to prevent the cutting displacement of the single crystal silicon wafer during cutting, and can collect the cut single crystal silicon wafer, while reducing the time required for cutting. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a laser cutting device for processing single crystal silicon wafers.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: a laser cutting device for processing single crystal silicon wafers, comprising a dislocation moving mechanism, a cutting mechanism is arranged in the middle of the dislocation moving mechanism, an intermittent moving mechanism is arranged below the cutting mechanism, the dislocation moving mechanism comprises a pushing assembly, a pressing workpiece is arranged in the pushing assembly, the pressing workpiece comprises a T-shaped plate, the T-shaped plate is a panel in a "T" shape, a first gradient plate and a second gradient plate are fixedly connected to the T-shaped plate;

[0005] The cutting mechanism includes a first pressing device, which is arranged below the first gradient plate, the first gradient plate is in contact with the top of the first pressing device, a second pressing device is arranged on one side of the first pressing device, and the bottom end of the second pressing device is fixedly connected to the cutting device;

[0006] The offset moving mechanism includes a collection box, which is a rectangular shell without a cover. An intermittent moving mechanism is arranged inside the collection box. The intermittent moving mechanism includes a ratchet track. The two ends of the upper side of the ratchet track are respectively fixedly connected with a first connecting plate, and the lower side of the ratchet track is respectively fixedly connected with a second connecting plate. The first connecting plate and the second connecting plate are fixedly connected to the collection box. The ratchet track includes an O-type fixing belt, and the O-type fixing belt is an annular shell. Ratchets are connected to the O-type fixing belt, and the ratchets are distributed along the track of the O-type fixing belt. The ratchets are provided with inverted trapezoidal grooves.

[0007] As a preferred technical solution of the present invention, the dislocation moving mechanism also includes a placing table, the upper end of the placing table is connected to a concave plate, a groove is arranged in the middle of the concave plate, a through plate is fixedly connected to the middle position of the placing table, two centrally symmetrical circular holes are provided on the through plate, two mirror-symmetrical circular holes are provided on the edge of the through plate, the through plate and the concave plate are fixedly connected to the top panel of the placing table through a connecting column, the connecting column passes through two mirror-symmetrical circular holes on the edge of the through plate, the pushing assembly is arranged at the top of the placing table and the middle position of the concave plate, the bottom end of the placing table is fixedly connected to the collecting box, the collecting box is positioned below the placing table, and the other side of the collecting box is fixedly connected to the fixing table.

[0008] As a preferred technical solution of the present invention, the pushing component also includes a pushing motor, the pushing motor is connected to a pushing column, the first gradient plate is close to one end of the pushing motor, the horizontal plane length of the first gradient plate is greater than the horizontal plane length of the second gradient plate, the first gradient plate and the second gradient plate are staggered, the second gradient plate is away from one end of the pushing motor, the pushing column passes through the left end of the pushing bottom plate, and the pushing column is movably connected to the fixed top plate after passing through the pushing bottom plate.

[0009] As a preferred technical solution of the present invention, the fixed top plate includes a push groove, a square plate is opened on one side of the push groove, and the push column reciprocates in the push groove through the square plate.

[0010] As a preferred technical solution of the present invention, the first pressing device includes a first pressing roller, the first pressing roller is connected to a first fixing member, the bottom of the first fixing member is fixedly connected to a first spring, the first spring is sleeved with a first pressing column, the other end of the first spring is fixedly connected to the inner wall of the mirror-symmetrical circular hole opened in the through-plate, the bottom of the first pressing column is fixedly connected to a first connecting member, the bottom of the first connecting member is fixedly connected to a resisting plate, and the resisting plate is a panel that is thick on the top and thin on the bottom;

[0011] The second pressing device includes a second pressing roller, a second fixing member is connected to the second pressing roller, a second spring is fixedly connected to the bottom of the second fixing member, a second pressing column is sleeved in the second spring, the other end of the second spring is fixedly connected to the inner wall of the mirror-symmetrical circular hole opened in the through plate, the bottom of the second pressing column is fixedly connected to the second connecting member, one side of the second connecting member is fixedly connected to the L-shaped plate, and the L-shaped plate is fixedly connected to the sliding column;

[0012] The cutting device includes a driving motor, a rotating kit is fixedly connected to the bottom of the driving motor, the rotating kit is sleeved in a sleeve column, both ends of the sleeve column are fixedly connected to fixed bent plates, the bottom of the fixed bent plate is sleeved on a swing column, the swing column is fixedly connected to a swing component, a sliding piece is sleeved on the swing component, the sliding piece is formed by a ring and a cylinder fixedly connected, the sliding piece is movably sleeved on the rotating kit, the swing component is fixedly connected to the swing column, a sliding cylinder is fixedly connected to the bottom of the swing column, and a laser cutter is connected to the bottom of the sliding cylinder.

[0013] As a preferred technical solution of the present invention, the rotating kit includes a rotating cylinder, the bottom of the rotating cylinder is fixedly connected to a rotating chassis, and the rotating chassis is fixedly connected to the cylinder on the sliding member;

[0014] The swing assembly comprises a swing ring and a swing sleeve rod, the swing sleeve rod is sleeved on the swing ring, the sliding member is sleeved on the swing sleeve rod, a circular hole is opened below the swing ring, and the swing column is sleeved in the circular hole of the swing ring.

[0015] As a preferred technical solution of the present invention, the intermittent movement mechanism also includes a pushing device, on which an arch-shaped fixing piece is provided, a rotating arm is connected to the arch-shaped fixing piece, a pushing arm is movably sleeved below the rotating arm, and a ratchet tooth is fixedly connected to the rear end of the pushing arm.

[0016] As a preferred technical solution of the present invention, the rotating arm includes a rotating handle, which is formed by a cylinder and a short handle fixedly connected, and a rotating finger is fixedly connected below the rotating handle.

[0017] Compared with the prior art, the present invention can achieve the following beneficial effects:

[0018] This type of laser cutting equipment for processing single crystal silicon wafers sets the shape of the first gradient plate and the second gradient plate as a trapezoidal block with a height difference by setting the offset distribution of the first gradient plate and the second gradient plate, so that when the pushing motor is pushing, a time difference is generated between the first gradient plate pressing down on the first pressing device and the second gradient plate pressing down on the second pressing device, so that the first pressing device moves downward first, so as to achieve the effect that the first pressing device meets the single crystal silicon column first. When the first pressing device meets the single crystal silicon column first, it will meet a side surface moving forward on the ratchet track, so that the single crystal silicon column to be cut is aligned with the abutment plate, thereby improving the flatness and accuracy of the vertical surface of the single crystal silicon column cut by the laser cutter on the cutting device, and preventing misaligned cutting. The laser cutting equipment for processing single crystal silicon wafers is provided with a pushing device, and the shape of the ratchet teeth on the pushing device is set to match the ratchet teeth on the ratchet track, so as to ensure that the ratchet teeth can contact the ratchet teeth and push the ratchet track to move forward. The ratchet track is set to be ratchet-shaped, and the pushing arm is movably connected with the rotating finger. When the rotating finger is making a circular motion around the cylinder on the rotating arm, the pushing arm drives the ratchet teeth to make intermittent forward propulsion motion due to the position limitation of the ratchet teeth on the ratchet track, so as to provide sufficient dwell time for the laser cutter to cut the single crystal silicon wafer and the cutting device to move down again. The laser cutting equipment for processing single crystal silicon wafers is provided with an inverted trapezoidal groove on the ratchet teeth, and a single crystal silicon column is placed on the inverted trapezoidal groove. When the ratchet teeth are moving, the single crystal silicon column placed on the inverted trapezoidal groove can also move forward with the ratchet teeth. At the same time, the design of the inverted trapezoidal groove ensures that the single crystal silicon column does not shake in the inverted trapezoidal groove, thereby helping to improve the accuracy of cutting the single crystal silicon column into slices and preventing it from being cut crooked. The laser cutting equipment for processing single crystal silicon wafers is provided with a sliding part sleeved on a swing sleeve rod, driving the sliding part to reciprocate on the swing sleeve rod, and connecting the cylindrical end of the sliding part to the rotating sleeve, so that the swing column performs a swinging motion, thereby driving the sliding cylinder fixedly connected to the swing column to perform a swinging motion, and the laser cutter connected to the sliding cylinder performs a swinging motion, and the swinging cutting of the laser cutter makes the cutting surface of the single crystal silicon wafer smoother. The laser cutting equipment for processing single crystal silicon wafers is provided with a collection box, and when the single crystal silicon column is cut into single crystal silicon wafers, it will follow the advancement of the ratchet into the curved edge of the ratchet, and the curved section of the ratchet cooperates with gravity to separate the single crystal silicon wafer from the intermittent moving mechanism and fall into the collection box, completing the collection of the single crystal silicon wafers. This type of laser cutting equipment for processing single crystal silicon wafers drives the single crystal silicon column forward through a ratchet track, and then cooperates with the movement of the downward pressure workpiece on the push assembly. When the single crystal silicon column moves forward to meet the first gradient plate, the laser cutter cuts it. The continuous forward movement of the ratchet track reduces the waiting time for cutting and improves the cutting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1It is a schematic diagram of the front structure of the present invention as a whole;

[0020] Figure 2 It is a schematic diagram of the overall side structure of the present invention;

[0021] Figure 3 It is a structural schematic diagram of the dislocation movement mechanism of the present invention;

[0022] Figure 4 It is a bottom view structural schematic diagram of the driving assembly of the present invention;

[0023] Figure 5 It is a schematic diagram of the top view of the structure of the push assembly of the present invention;

[0024] Figure 6 It is a schematic diagram of the exploded structure of the driving assembly of the present invention;

[0025] Figure 7 It is a schematic structural diagram of the cutting mechanism of the present invention;

[0026] Figure 8 It is a structural schematic diagram of the first pressing device of the present invention;

[0027] Fig. 9 It is a front structural schematic diagram of the second pressing device of the present invention;

[0028] Fig.10 It is a schematic diagram of the side structure of the second pressing device of the present invention;

[0029] Fig.11 It is a front structural schematic diagram of the cutting device of the present invention;

[0030] Fig.12 It is a schematic diagram of the side structure of the cutting device of the present invention;

[0031] Fig.13 It is a schematic diagram of the exploded structure of the cutting device of the present invention;

[0032] Fig.14 It is a schematic diagram of the position structure of the dislocation moving mechanism and the intermittent moving mechanism of the present invention;

[0033] Fig.15 It is a structural schematic diagram of the intermittent moving mechanism of the present invention;

[0034] Fig.16 It is a schematic diagram of the structure of the ratchet track of the present invention;

[0035] Fig.17 It is an enlarged structural schematic diagram of the ratchet track of the present invention;

[0036] Fig.18 It is a structural schematic diagram of the pushing device of the present invention;

[0037] Fig.19 It is a schematic diagram of the exploded structure of the propulsion device of the present invention;

[0038] Fig. 20 It is a schematic diagram of the action of the pushing component of the present invention.

[0039] Among them: 1. Dislocation moving mechanism; 11. Placement table; 12. Collection box; 13. Fixed table; 14. Through plate; 15. Concave plate; 16. Connecting column; 17. Pushing assembly; 171. Pushing motor; 172. Pushing column; 173. Pushing bottom plate; 174. Fixed top plate; 1741. Square plate; 1742. Pushing groove; 175. Pressing workpiece; 1751. First gradient plate; 1752. Second gradient plate; 1753. T-shaped plate; 2. Cutting mechanism; 21. First pressing device; 211. First pressing roller; 212. First fixing member; 213. First spring; 214. First pressing column; 215. First connecting member; 216. Butt plate; 22. Second pressing device; 221. Second pressing roller; 222. Second fixing member; 223. Second spring; 224. Second pressing roller; 225. Second pressing roller; 226. Second fixing member; 227. Second fixing member; 228. Second fixing member; 229. Second fixing member; 230. Second fixing member; 231. Second fixing member; 232. Second fixing member; 233. Second fixing member; 234. Second fixing member; 235. Second fixing member; 236. Second fixing member; 237. Second fixing member; 238. Second fixing member; 239. Second fixing member; 240. Second fixing member; 241. Second fixing member; 242. Second fixing member; 243. Second fixing member; 244. Second fixing member; 245. Second fixing member; 246. Second fixing member; 247. Second fixing member; 248. Second fixing member; 249. Second fixing member; 250. Second fixing member; 251 1. a pressure column; 225, a second connecting member; 226, an L-shaped plate; 227, a sliding column; 23, a cutting device; 231, a driving motor; 232, a rotating kit; 2321, a rotating cylinder; 2322, a rotating chassis; 233, a sleeve column; 234, a fixed bent plate; 235, a swing assembly; 2351, a swing ring; 2352, a swing sleeve rod; 236, a sliding member; 237, a swing column; 238, a sliding cylinder; 239, a laser cutter; 3, an intermittent moving mechanism; 31, a pushing device; 311, an arch-shaped fixing member; 312, a rotating arm; 3121, a rotating handle; 3122, a rotating finger; 313, a pushing arm; 314, a ratchet tooth; 32, a ratchet track; 321, a ratchet; 322, an inverted trapezoidal groove; 323, an O-type fixing belt; 33, a first connecting plate; 34, a second connecting plate. DETAILED DESCRIPTION

[0040] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work all belong to the protection scope of the present invention. The experimental methods in the following embodiments, unless otherwise specified, are conventional methods, and the materials, reagents, etc. used in the following embodiments, unless otherwise specified, can all be obtained from commercial channels.

[0041] Embodiment: Figure 1-Figure 20As shown, a laser cutting device for processing a single crystal silicon wafer comprises a dislocation moving mechanism 1, a cutting mechanism 2 is arranged in the middle position of the dislocation moving mechanism 1, an intermittent moving mechanism 3 is arranged below the cutting mechanism 2, the dislocation moving mechanism 1 comprises a pushing component 17, a pressing workpiece 175 is arranged in the pushing component 17, the pressing workpiece 175 comprises a T-shaped plate 1753, the T-shaped plate 1753 is a panel in a "T" shape, and a first gradient plate 1751 and a second gradient plate 1752 are fixedly connected to the T-shaped plate 1753;

[0042] The cutting mechanism 2 includes a first pressing device 21, which is arranged below the first gradient plate 1751, the first gradient plate 1751 is in contact with the top of the first pressing device 21, a second pressing device 22 is arranged on one side of the first pressing device 21, and a cutting device 23 is fixedly connected to the bottom end of the second pressing device 22;

[0043] The dislocation moving mechanism 1 includes a collecting box 12, which is a rectangular shell without a cover. An intermittent moving mechanism 3 is arranged inside the collecting box 12, and the intermittent moving mechanism 3 includes a ratchet track 32. The two ends of the upper side of the ratchet track 32 are respectively fixedly connected with a first connecting plate 33, and the lower side of the ratchet track 32 is respectively fixedly connected with a second connecting plate 34. The first connecting plate 33 and the second connecting plate 34 are fixedly connected to the collecting box 12. The ratchet track 32 includes an O-type fixing belt 323, and the O-type fixing belt 323 is an annular shell. The O-type fixing belt 323 is connected with a ratchet 321, and the ratchet 321 is distributed along the track of the O-type fixing belt 323. The ratchet 321 is provided with an inverted trapezoidal groove 322.

[0044] The dislocation moving mechanism 1 also includes a placing table 11, the upper end of the placing table 11 is connected to a concave plate 15, the middle of the concave plate 15 is provided with a groove, the middle position of the placing table 11 is fixedly connected to a through plate 14, the through plate 14 is provided with two centrally symmetrical circular holes, the edge of the through plate 14 is provided with two mirror-symmetrical circular holes, the through plate 14 and the concave plate 15 are fixedly connected to the top panel of the placing table 11 through a connecting column 16, the connecting column 16 penetrates the two mirror-symmetrical circular holes on the edge of the through plate 14, the pushing assembly 17 is provided between the top of the placing table 11 and the middle position of the concave plate 15, the bottom end of the placing table 11 is fixedly connected to the collecting box 12, the collecting box 12 is located below the placing table 11, and the other side of the collecting box 12 is fixedly connected to the fixing table 13.

[0045] The pushing assembly 17 also includes a pushing motor 171, which is connected to a pushing column 172. The first gradient plate 1751 is close to one end of the pushing motor 171, the horizontal length of the first gradient plate 1751 is greater than the horizontal length of the second gradient plate 1752, the first gradient plate 1751 and the second gradient plate 1752 are staggered, and the second gradient plate 1752 is away from one end of the pushing motor 171. The pushing column 172 passes through the left end of the pushing bottom plate 173, and the pushing column 172 passes through the pushing bottom plate 173 and is movably connected to the fixed top plate 174.

[0046] The fixed top plate 174 includes a pushing groove 1742 . A square plate 1741 is opened on one side of the pushing groove 1742 . The pushing column 172 reciprocates in the pushing groove 1742 through the square plate 1741 .

[0047] The first pressing device 21 comprises a first pressing roller 211, the first pressing roller 211 is connected with a first fixing member 212, the bottom of the first fixing member 212 is fixedly connected with a first spring 213, the first spring 213 is sleeved with a first pressing column 214, the other end of the first spring 213 is fixedly connected to the inner wall of the mirror-symmetrical circular hole opened in the through plate 14, the bottom of the first pressing column 214 is fixedly connected with a first connecting member 215, the bottom of the first connecting member 215 is fixedly connected with a resisting plate 216, and the resisting plate 216 is a panel with a thick upper part and a thin lower part;

[0048] The second pressing device 22 includes a second pressing roller 221, the second pressing roller 221 is connected to a second fixing member 222, the bottom of the second fixing member 222 is fixedly connected to a second spring 223, a second pressing column 224 is sleeved in the second spring 223, the other end of the second spring 223 is fixedly connected to the inner wall of the mirror-symmetrical circular hole opened in the through plate 14, the bottom of the second pressing column 224 is fixedly connected to a second connecting member 225, one side of the second connecting member 225 is fixedly connected to an L-shaped plate 226, and the L-shaped plate 226 is fixedly connected to a sliding column 227;

[0049] The cutting device 23 includes a driving motor 231, a rotating kit 232 is fixedly connected to the bottom of the driving motor 231, the rotating kit 232 is sleeved in a sleeve column 233, both ends of the sleeve column 233 are fixedly connected to a fixed bent plate 234, the bottom of the fixed bent plate 234 is sleeved on a swing column 237, a swing component 235 is fixedly connected to the swing column 237, a sliding member 236 is sleeved on the swing component 235, the sliding member 236 is formed by a ring and a cylinder fixedly connected, the sliding member 236 is movably sleeved on the rotating kit 232, the swing component 235 is fixedly connected to the swing column 237, a sliding cylinder 238 is fixedly connected to the bottom of the swing column 237, and a laser cutter 239 is connected to the bottom of the sliding cylinder 238.

[0050] The rotating kit 232 includes a rotating cylinder 2321, the bottom of the rotating cylinder 2321 is fixedly connected to a rotating chassis 2322, and the rotating chassis 2322 is fixedly connected to the cylinder on the sliding member 236;

[0051] The swing assembly 235 includes a swing ring 2351 and a swing sleeve rod 2352. The swing sleeve rod 2352 is sleeved on the swing ring 2351. The sliding member 236 is sleeved on the swing sleeve rod 2352. A circular hole is opened at the bottom of the swing ring 2351. The swing column 237 is sleeved in the circular hole of the swing ring 2351.

[0052] The intermittent moving mechanism 3 also includes a pushing device 31, on which an arch-shaped fixing part 311 is provided. A rotating arm 312 is connected to the arch-shaped fixing part 311. A pushing arm 313 is movably sleeved below the rotating arm 312, and a ratchet tooth 314 is fixedly connected to the rear end of the pushing arm 313.

[0053] The rotating arm 312 includes a rotating handle 3121 , which is formed by a cylinder and a short handle fixedly connected, and a rotating finger 3122 is fixedly connected below the rotating handle 3121 .

[0054] Working principle:

[0055] In the first step, the operator first places the single crystal silicon column to be cut on the ratchet track 32. The inverted trapezoidal groove 322 on the ratchet track 32 can stably place the single crystal silicon column on the ratchet 321 without shaking. The rotating arm 312 passes through the arch-shaped fixing piece 311. The tail of the rotating arm 312 is connected to a motor. The motor connected to the rotating arm 312 is turned on, and the motor drives the rotating arm 312 to rotate. A rotating finger 3122 is provided on the rotating arm 312. The tail of the rotating finger 3122 is movably sleeved on one end of the pushing arm 313. When the rotating arm 312 rotates, the rotating finger 3122 also rotates, driving the rotation of the pushing arm 313 movably sleeved therewith. Since the pushing arm 313 is sleeved on the tail of the rotating finger 3122, when the rotating finger 3122 moves around the center of the cylinder above the rotating handle 3121 When the circular motion occurs, the shape of the ratchet tooth 314 is matched with the ratchet tooth 321, and the ratchet tooth 314 meshes with the ratchet tooth 321. The ratchet tooth 314 fixedly connected to the pushing arm 313 makes a forward linear motion along with the movement of the pushing arm 313. When the rotating finger 3122 rotates to the highest point, the bottom of the ratchet tooth 314 just contacts the gap between the ratchet teeth 321. At this time, the rotating finger 3122 rotates from the highest point to the lowest point, driving the ratchet tooth 314 stuck with the bottom of the ratchet tooth 321 to move forward. When the rotating finger 3122 rotates from the lowest point to the highest point again, the ratchet tooth 314 will move backward, so that the engagement between the ratchet tooth 314 and the rotating arm 312 is released, and the ratchet 321 stops moving forward without the push of the ratchet tooth 314, that is, the ratchet track 32 makes intermittent linear forward motion under the drive of the pushing device 31.

[0056] In the second step, when the ratchet track 32 in the first step stops moving forward, the pushing motor 171 is turned on, and the pushing motor 171 drives the pushing column 172 to slide in the pushing groove 1742 through the square plate 1741. When the pushing column 172 is pushed into the pushing groove 1742, the pushing bottom plate 173 fixedly connected to the pushing column 172 moves along with the pushing column 172 in the direction of pushing into the pushing groove 1742. The bottom of the pushing bottom plate 173 is fixedly connected to a T-shaped plate 1753, and both ends of the T-shaped plate 1753 are fixedly connected to the first gradient plate 1751 and the second gradient plate 1752. The first gradient plate 1751 is fixedly connected to the second gradient plate 1752. Both 751 and 1852 are trapezoidal panels with a gradient drop in height. The first gradient plate 1751 is on the rear side of the T-shaped plate 1753. Therefore, when the bottom plate 173 is pushed toward the inside of the fixed top plate 174, the pressing workpiece 175 fixedly connected to the bottom plate 173 moves forward along with the bottom plate 173 toward the fixed top plate 174. By setting the first gradient plate 1751 on the rear side of the T-shaped plate 1753, that is, close to one end of the pushing motor 171, and setting one side of the first gradient plate 1751 to slide down in a stepped manner, the pressing workpiece 175 is pushed forward. When the first gradient plate 1751 is pressed, the first gradient plate 1751 first contacts the first pressing roller 211 on the first pressing device 21. When the first gradient plate 1751 continues to advance, the side surface of the first gradient plate 1751 continues to squeeze the first pressing roller 211, generating a downward pressure on the first pressing roller 211. The first pressing device 21 begins to move downward, and the abutment plate 216 on the first pressing device 21 moves downward with the first pressing device 21 until it contacts one side edge of the single crystal silicon column placed on the inverted trapezoidal groove 322. At this time, the pressing workpiece 175 continues to advance forward. By setting the rear half of the first gradient plate 1751 to be straight, the pressing workpiece 175 is pressed downward. , when the first gradient plate 1751 continues to advance, the first pressing device 21 no longer moves downward, and the second gradient plate 1752 on the pressing workpiece 175 begins to contact the second pressing device 22, and the second pressing roller 221 on the second pressing device 22 contacts the second gradient plate 1752. Similarly, the second pressing roller 221 begins to descend under the downward pressure, driving the entire second pressing device 22 to move downward, and the L-shaped plate 226 on the second pressing device 22 also moves downward. When the straight end of the second gradient plate 1752 meets the second pressing roller 221, the second pressing roller 221 stops moving downward. The movement state is as shown in the attached figure. Fig. 20 As shown, at this time, the cutting device 23 connected to the L-shaped plate 226 through the sliding column 227 just contacts the single crystal silicon column.

[0057] The third step, after the second step is completed, the motor on 27 is turned on, 27 starts to work, and the thickness of the single crystal silicon column cut is determined by adjusting the displacement of the cutting device 23 on 27. After the adjustment, the driving motor 231 on the cutting device 23 is turned on, and the driving motor 231 drives the rotating cylinder 2321 to start rotating. The rotating cylinder 2321 is fixedly connected to the rotating chassis 2322, and the rotating chassis 2322 rotates with the rotation of the rotating cylinder 2321. The rotating chassis 2322 is movably connected to the cylinder on the sliding member 236, and the cylinder on the sliding member 236 rotates in a circle with the rotation of the rotating chassis 2322. A cylindrical ring is fixedly connected below the cylinder on the sliding member 236, and the cylindrical ring is sleeved on the swing sleeve rod 2352. The sliding member 236 is fixedly connected to the bottom of the cylinder. The cylindrical ring on the movable part 236 performs reciprocating linear motion on the swing sleeve 2352 along with the circular motion of the cylinder on the sliding part 236. The two ends of the swing sleeve 2352 are fixedly connected to the swing ring 2351, and the swing of the swing sleeve 2352 drives the swing of the swing ring 2351. The swing ring 2351 is fixedly connected to the swing column 237, and the swing of the swing ring 2351 drives the swing column 237 to swing. A laser cutter 239 is fixedly connected to the swing column 237, and the laser cutter 239 swings along with the swing column 237. The swing column 237 is fixedly connected to the sliding cylinder 238, and the sliding cylinder 238 is fixedly connected to the laser cutter 239, so that the laser emitted by the laser cutter 239 performs swing cutting on the single crystal silicon column.

[0058] Step 4: After the third step is completed, the single crystal silicon column is cut. At this time, the pushing motor 171 on the pushing assembly 17 starts to push backward, and the second gradient plate 1752 and the first gradient plate 1751 are also pushed back under the drive of the pushing motor 171. The first pressing device 21 and the second pressing device 22 that the first gradient plate 1751 and the second gradient plate 1752 contact start to move upward. When the first pressing device 21 moves upward, the abutment plate 216 connected to the lower side of the first pressing device 21 is separated from the cut single crystal silicon column sheet. After the second pressing device 22 moves upward, the laser cutter 239 stops continuously cutting the single crystal silicon column. The first pressing device 21 and the second pressing device 22 are moved upward. During the upward movement of the pressing device 22, the rotating finger 3122 is rotating from the lowest point to the highest point, so the ratchet tooth 314 does not push the ratchet 321. When the rotating finger 3122 starts to rotate from the highest point to the lowest point, the pushing motor 171 also starts to move forward synchronously, that is, the first pressing device 21 and the second pressing device 22 start another round of descent. When the rotating finger 3122 rotates to the lowest point, the ratchet tooth 314 has just pushed the ratchet 321 forward. At the same time, the first pressing device 21 descends to contact the new cut surface of the single crystal silicon column after moving forward, waiting for the second pressing device 22 to move down for another cutting.

[0059] In the fifth step, the single crystal silicon wafer cut by the laser cutter 239 moves forward along the ratchet 321. When it moves to the arc on the O-shaped fixing belt 323, it will slide from the edge and fall into the collection box 12 for collection until the single crystal silicon column is cut and collected.

[0060] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A laser cutting device for processing single crystal silicon wafers, comprising a dislocation moving mechanism (1), a cutting mechanism (2) being arranged in the middle of the dislocation moving mechanism (1), and an intermittent moving mechanism (3) being arranged below the cutting mechanism (2), characterized in that: The dislocation movement mechanism (1) comprises a pushing component (17), wherein the pushing component (17) is provided with a pressing workpiece (175), wherein the pressing workpiece (175) comprises a T-shaped plate (1753), wherein the T-shaped plate (1753) is a panel in a "T" shape, and wherein a first gradient plate (1751) and a second gradient plate (1752) are fixedly connected to the T-shaped plate (1753); The cutting mechanism (2) comprises a first pressing device (21), the first pressing device (21) being arranged below the first gradient plate (1751), the first gradient plate (1751) being in contact with the top end of the first pressing device (21), a second pressing device (22) being arranged on one side of the first pressing device (21), and a cutting device (23) being fixedly connected to the bottom end of the second pressing device (22); The dislocation movement mechanism (1) comprises a collection box (12), the collection box (12) is a rectangular shell without a cover, an intermittent movement mechanism (3) is arranged inside the collection box (12), the intermittent movement mechanism (3) comprises a ratchet track (32), the two ends of the upper side of the ratchet track (32) are respectively fixedly connected to a first connection plate (33), the lower side of the ratchet track (32) is respectively fixedly connected to a second connection plate (34), the first connection plate (33) and the second connection plate (34) are fixedly connected to the collection box (12), the ratchet track (32) comprises an O-shaped fixing belt (323), the O-shaped fixing belt (323) is an annular shell, the O-shaped fixing belt (323) is connected to a ratchet (321), the ratchet (321) is distributed along the track of the O-shaped fixing belt (323), and the ratchet (321) is provided with an inverted trapezoidal groove (322); The dislocation moving mechanism (1) also includes a placement table (11), the upper end of the placement table (11) is connected to a concave plate (15), the middle of the concave plate (15) is provided with a groove, the middle position of the placement table (11) is fixedly connected to a through plate (14), the through plate (14) is provided with two centrally symmetrical circular holes, the edge of the through plate (14) is provided with two mirror-symmetrical circular holes, the through plate (14) and the concave plate (15) are fixedly connected to the top panel of the placement table (11) through a connecting column (16), the connecting column (16) penetrates the two mirror-symmetrical circular holes on the edge of the through plate (14), the pushing component (17) is provided at the top of the placement table (11) and the middle position of the concave plate (15), the bottom end of the placement table (11) is fixedly connected to the collection box (12), the collection box (12) is located below the placement table (11), and the other side of the collection box (12) is fixedly connected to the fixed table (13); The pushing assembly (17) further comprises a pushing motor (171), the pushing motor (171) being connected to a pushing column (172), the first gradient plate (1751) being close to one end of the pushing motor (171), the horizontal plane length of the first gradient plate (1751) being greater than the horizontal plane length of the second gradient plate (1752), the first gradient plate (1751) and the second gradient plate (1752) being staggered, the second gradient plate (1752) being far away from one end of the pushing motor (171), the pushing column (172) penetrating the left end of the pushing bottom plate (173), and the pushing column (172) being movably connected to the fixed top plate (174) after penetrating the pushing bottom plate (173); The fixed top plate (174) comprises a pushing groove (1742), a square plate (1741) is provided on one side of the pushing groove (1742), and the pushing column (172) reciprocates in the pushing groove (1742) via the square plate (1741); The intermittent movement mechanism (3) further comprises a pushing device (31), the pushing device (31) being provided with an arch-shaped fixing member (311), the arch-shaped fixing member (311) being connected to a rotating arm (312), a pushing arm (313) being movably sleeved below the rotating arm (312), and a ratchet tooth (314) being fixedly connected to the rear end of the pushing arm (313).

2. The laser cutting equipment for processing single crystal silicon wafers according to claim 1, characterized in that: The first pressing device (21) comprises a first pressing roller (211), the first pressing roller (211) is connected to a first fixing member (212), the bottom of the first fixing member (212) is fixedly connected to a first spring (213), a first pressing column (214) is sleeved inside the first spring (213), the other end of the first spring (213) is fixedly connected to the inner wall of a mirror-symmetrical circular hole opened in the through plate (14), the bottom of the first pressing column (214) is fixedly connected to a first connecting member (215), the bottom of the first connecting member (215) is fixedly connected to a resisting plate (216), and the resisting plate (216) is a panel which is thick at the top and thin at the bottom; The second pressing device (22) comprises a second pressing roller (221), the second pressing roller (221) is connected to a second fixing member (222), the bottom of the second fixing member (222) is fixedly connected to a second spring (223), a second pressing column (224) is sleeved inside the second spring (223), the other end of the second spring (223) is fixedly connected to the inner wall of a mirror-symmetrical circular hole opened in the through plate (14), the bottom of the second pressing column (224) is fixedly connected to a second connecting member (225), one side of the second connecting member (225) is fixedly connected to an L-shaped plate (226), and a sliding column (227) is fixedly connected to the L-shaped plate (226); The cutting device (23) comprises a driving motor (231), a rotating set (232) being fixedly connected below the driving motor (231), the rotating set (232) being sleeved in a sleeve column (233), both ends of the sleeve column (233) being fixedly connected to a fixed bent plate (234), the bottom of the fixed bent plate (234) being sleeved on a swing column (237), a swing component (235) being fixedly connected to the swing column (237), a sliding member (236) being sleeved on the swing component (235), the sliding member (236) being formed by a ring and a cylinder being fixedly connected, the sliding member (236) being movably sleeved on the rotating set (232), the swing component (235) being fixedly connected to the swing column (237), a sliding cylinder (238) being fixedly connected below the swing column (237), and a laser cutter (239) being connected below the sliding cylinder (238).

3. The laser cutting equipment for processing single crystal silicon wafers according to claim 2, characterized in that: The rotating kit (232) comprises a rotating cylinder (2321), the bottom of the rotating cylinder (2321) is fixedly connected to a rotating chassis (2322), and the rotating chassis (2322) is fixedly connected to the cylinder on the sliding member (236); The swing assembly (235) comprises a swing ring (2351) and a swing sleeve rod (2352); the swing sleeve rod (2352) is sleeved on the swing ring (2351); the sliding member (236) is sleeved on the swing sleeve rod (2352); a circular hole is provided below the swing ring (2351); and the swing column (237) is sleeved in the circular hole of the swing ring (2351).

4. The laser cutting equipment for processing single crystal silicon wafers according to claim 1, characterized in that: The rotating arm (312) comprises a rotating handle (3121), wherein the rotating handle (3121) is formed by a cylinder and a short handle being fixedly connected, and a rotating finger (3122) is fixedly connected below the rotating handle (3121).

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