Wafer packaging equipment

Abstract

The present application provides a wafer packaging device, which belongs to the field of wafer packaging technology, and specifically includes: a packaging table, a lifting mechanism, a wafer handling robot, and a distance measuring component. A wafer packaging box is placed on the packaging table, and the lifting mechanism drives the packaging table to move in the vertical direction; the distance measuring component is used to measure the height of the surface of the top layer of objects in the wafer packaging box before the wafer handling robot places the wafer in the wafer packaging box each time; each time the wafer handling robot transports the wafer to the top of the wafer packaging box on the packaging table, the lifting mechanism drives the packaging table to move so that the height of the surface of the top layer of objects in the wafer packaging box is at a first preset height, and each time the wafer handling robot places the wafer in the wafer packaging box, the height of the surface of the top layer of objects in the wafer packaging box is at the first preset height. Through the processing scheme of the present application, the risk of fragments in the wafer packaging process can be effectively reduced.

Description

Technical Field

[0001] The present application relates to the field of wafer packaging, and in particular to a wafer packaging device. Background Art

[0002] Existing wafer packaging equipment generally fixes the wafer packaging box on the carrier and completes the packaging operation by extending and lifting the robot arm. In this packaging method, the connection height of each wafer will change with the increase of wafers in the packaging box. For wafers of different thicknesses, the change in connection height will also change accordingly. The motion control and positioning accuracy of the robot itself cannot meet the small changes in the wafer connection height, and there is a risk of fragmentation during the packaging process. Summary of the invention

[0003] In view of this, the present application provides a wafer packaging device, which solves the problems in the prior art and reduces the risk of wafer fragments during the wafer packaging process.

[0004] The wafer packaging equipment provided in this application adopts the following technical solution:

[0005] A wafer packaging device, comprising:

[0006] frame;

[0007] A wafer material box is placed on the rack, and the wafer material box is used to place wafers;

[0008] A packing table, located on one side of the wafer material box, and used for placing the wafer packaging box and positioning and clamping the wafer packaging box;

[0009] A lifting mechanism, used for driving the packing table to move in a vertical direction;

[0010] A wafer handling robot is installed on the rack, and is used to transport wafers from a wafer material box to above a wafer packaging box on a packing table, and place the wafers in the wafer packaging box;

[0011] A distance measuring component, used for measuring the height of the surface of the uppermost object in the wafer packaging box before the wafer handling robot places the wafer in the wafer packaging box each time;

[0012] Among them, each time the wafer handling robot transports the wafer to the top of the wafer packaging box on the packaging table, the lifting mechanism drives the packaging table to move so that the height of the surface of the topmost object in the wafer packaging box is at a first preset height, and each time the wafer handling robot places the wafer in the wafer packaging box, the height of the surface of the topmost object in the wafer packaging box is at the first preset height.

[0013] Optionally, the wafer packaging equipment further includes a processor, the lifting mechanism further includes a grating ruler, the processor receives height data measured by the distance measuring component, the processor calculates the theoretical displacement required to move the uppermost object surface in the wafer packaging box to the first preset height packaging table or the wafer packaging box, and the processor controls the lifting mechanism to drive the packaging table to move according to the calculated theoretical displacement;

[0014] The grating ruler is used to monitor the actual displacement of the packaging table or the wafer packaging box during the movement of the uppermost object surface in the wafer packaging box to the first preset height, and the processor compares the actual displacement with the theoretical displacement.

[0015] Optionally, each time before the wafer handling robot transports the wafer to above the wafer packaging box on the packaging table, the lifting mechanism drives the packaging table and the wafer packaging box to descend to a safe waiting position.

[0016] Optionally, the wafer packaging equipment also includes an electrostatic paper material bin and an electrostatic paper conveying module, the electrostatic paper conveying module includes a transport component and a suction cup component, the output end of the transport component is connected to the suction cup component, the suction cup component is used to adsorb the electrostatic paper, and the transport component is used to drive the suction cup component to move in the horizontal and vertical directions to drive the suction cup component to move between the electrostatic paper material bin and the packaging table.

[0017] Optionally, the ranging assembly includes multiple ranging sensors, and the multiple ranging sensors are located on the same plane. The ranging sensors are located above the packaging table, and the multiple ranging sensors are used to detect the flatness and height of the upper surface of the top layer of electrostatic paper in the wafer packaging box, wherein the height of the upper surface of the top layer of electrostatic paper in the wafer packaging box is used as the height of the surface of the topmost object in the wafer packaging box, and the suction cup assembly is provided with a hollow area for the ranging sensor signal to pass through, and when the ranging sensor detects the height of the upper surface of the electrostatic paper in the wafer packaging box, the ranging sensor is located at a second preset height.

[0018] Optionally, the suction cup assembly includes a mounting frame and a plurality of suction cups, the plurality of suction cups are mounted on the mounting frame, the ranging sensor is mounted on the mounting frame, and the mounting frame is provided with a hollow area for the ranging sensor signal to pass through, wherein after the suction cup assembly places the electrostatic paper and moves to the second preset height position, the height of the upper surface of the topmost layer of electrostatic paper in the wafer packaging box is detected.

[0019] Optionally, a plurality of the distance measuring sensors are fixedly installed above the packaging table relative to the frame, and the distance measuring sensors are located above the suction cup assembly.

[0020] Optionally, the transport assembly includes a horizontal motion mechanism and a vertical motion mechanism, the vertical motion mechanism is installed on the output end of the horizontal motion mechanism, and the suction cup assembly is installed on the output end of the vertical motion mechanism.

[0021] Optionally, the wafer packaging equipment also includes an electrostatic paper monitoring component, which is used to detect the height of the uppermost layer of electrostatic paper in the electrostatic paper bin and to determine the height of the electrostatic paper absorbed by the suction cup component.

[0022] Optionally, the electrostatic paper monitoring component includes a vertical motion mechanism and a laser sensor, wherein the laser sensor is installed on the output end of the vertical motion mechanism. Each time the electrostatic paper is sucked, the vertical motion mechanism drives the laser sensor to move from bottom to top. The laser sensor is used to emit a laser toward the side of the electrostatic paper and receive reflected light. The laser sensor determines whether there is electrostatic paper at the current height based on the received reflected light, and determines the height of the top layer of electrostatic paper in the electrostatic paper bin.

[0023] In summary, this application includes the following beneficial technical effects:

[0024] Each time the wafer handling robot places a wafer into a wafer packaging box, the height of the uppermost object surface in the wafer packaging box is the same, and the wafer handling robot is located at the same height, eliminating cumulative errors, improving the accuracy and reliability of wafer packaging, and effectively avoiding the risk of debris during the packaging process, while reducing the requirements for the positioning accuracy of the wafer handling robot.

[0025] The electrostatic paper monitoring component scans the electrostatic paper silo from bottom to top to determine the height of the top layer of electrostatic paper in the silo, which is used to determine the height of the electrostatic paper absorbed by the suction cup component, and prompts that the electrostatic paper needs to be replenished when the number of electrostatic papers is less than a certain number. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 This is a schematic diagram of the overall structure of the wafer packaging equipment of this application;

[0028] Figure 2 This is a schematic diagram of the overall structure of the wafer packaging equipment of this application from another perspective;

[0029] Figure 3 This is a schematic diagram of the structure of the distance measuring component and the suction cup component of this application;

[0030] Figure 4 This is a schematic diagram of the structure of the electrostatic paper monitoring component of this application.

[0031] Explanation of the reference numerals: 1. Rack; 2. Wafer material box; 3. Packing table; 4. Wafer packaging box; 5. Lifting mechanism; 6. Wafer handling robot; 7. Distance measuring component; 71. Distance measuring sensor; 8. Grating ruler; 9. Electrostatic paper material bin; 10. Transport component; 101. Horizontal motion mechanism; 102. Vertical motion mechanism; 11. Suction cup assembly; 111. Mounting frame; 112. Suction cup; 12. Electrostatic paper monitoring component; 121. Vertical motion mechanism; 122. Laser sensor; 13. Calibrator. DETAILED DESCRIPTION

[0032] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0033] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0034] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0035] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The illustrations only show the components related to the present application rather than being drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0036] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0037] An embodiment of the present application provides a wafer packaging device.

[0038] like Figure 1 and Figure 2 As shown, a wafer packaging device includes:

[0039] Rack 1.

[0040] The wafer box 2 is placed on the rack 1, and is used to place a plurality of stacked wafers. The wafer box 2 can be placed directly on the rack 1, or the wafer box 2 can be temporarily fixed on the rack 1 by a fixing device.

[0041] The packing table 3 is located on one side of the wafer box 2. The packing table 3 is used to place the wafer packaging box 4 and position and clamp the wafer packaging box 4. A positioning structure and a clamping structure are provided on the packing table 3. The positioning structure is used to position the wafer packaging box 4 on the packing table 3. The clamping structure clamps the wafer packaging box 4 on the packing table 3. The positioning structure and the clamping structure are prior arts and are not described in detail herein.

[0042] The lifting mechanism 5 is used to drive the packing table 3 to move in the vertical direction. The lifting mechanism 5 is provided with a displacement sensor to judge the displacement of the output end of the lifting mechanism 5 so as to move the packing table 3 according to the preset instruction distance. The lifting mechanism 5 with displacement detection is a prior art and will not be described in detail here.

[0043] The wafer handling robot 6 is installed on the frame 1, and is used to transport the wafer from the wafer material box 2 to the top of the wafer packaging box 4 on the packaging table 3, and place the wafer in the wafer packaging box 4. The wafer handling robot 6 is an existing mature technology and will not be described in detail here.

[0044] The distance measuring component 7 is used to measure the height of the uppermost surface of the object in the wafer packaging box 4 before the wafer transport robot 6 places the wafer in the wafer packaging box 4 each time.

[0045] Each time the wafer handling robot 6 transports the wafer to the top of the wafer packaging box 4 on the packaging table 3, the lifting mechanism 5 drives the packaging table 3 to move so that the height of the uppermost surface of the object in the wafer packaging box 4 is at the first preset height, and each time the wafer handling robot 6 places the wafer in the wafer packaging box 4, the height of the uppermost surface of the object in the wafer packaging box 4 is at the first preset height. This allows the wafer handling robot 6 to be at the same height each time it places the wafer in the wafer packaging box 4, eliminating cumulative errors, improving the accuracy and reliability of packaging, and effectively avoiding the risk of debris during packaging, while reducing the requirements for the positioning accuracy of the wafer handling robot 6.

[0046] like Figure 2 As shown, the wafer packaging equipment also includes a processor, and the lifting mechanism 5 also includes a grating ruler 8. The processor receives the height data measured by the distance measuring component 7. The processor calculates the theoretical displacement required to move the packaging table 3 or the wafer packaging box 4 to move the uppermost object surface in the wafer packaging box 4 to the first preset height according to the received height data. The processor controls the lifting mechanism 5 to drive the packaging table 3 to move according to the calculated theoretical displacement. The grating ruler 8 is used to monitor the actual displacement of the packaging table 3 or the wafer packaging box 4 during the movement of the uppermost object surface in the wafer packaging box 4 to the first preset height. The processor receives the actual displacement and compares the actual displacement with the theoretical displacement. If the actual displacement is inconsistent with the theoretical displacement, the lifting mechanism 5 is controlled to drive the packaging table 3 to continue moving until the actual displacement is equal to the theoretical displacement. The design of the grating ruler 8 provides closed-loop control for the vertical movement of the packaging table 3, which can ensure that the actual position reached by the wafer packaging box 4 is consistent with the calculated coordinates when the wafer is packaged.

[0047] In the embodiment of the present application, the processor controls the lifting and lowering displacement of the lifting mechanism 5 and the movement and grasping of the wafer by the wafer handling robot 6. The specific control method is the existing technology and is not described in detail in the embodiment of the present application.

[0048] The wafer packaging equipment also includes an electrostatic paper bin 9 and an electrostatic paper conveying module, the electrostatic paper conveying module includes a transport component 10 and a suction cup component 11, the output end of the transport component 10 is connected to the suction cup component 11, the suction cup component 11 is used to adsorb electrostatic paper, the transport component 10 is used to drive the suction cup component 11 to move in the horizontal direction and the vertical direction, so as to drive the suction cup component 11 to move between the electrostatic paper bin 9 and the packaging table 3, the transport component 10 drives the suction cup component 11 on the electrostatic paper bin 9 to approach or move away from the electrostatic paper bin 9 in the vertical direction, and then grabs the electrostatic paper and moves away from the electrostatic paper bin 9, the transport component 10 drives the suction cup component 11 above the wafer packaging box 4 to approach or move away from the wafer packaging box 4 in the vertical direction, and then puts the electrostatic paper into the wafer packaging box 4 at a suitable position. The process of the electrostatic paper conveying module conveying the electrostatic paper is as follows: the transport component 10 drives the suction cup component 11 to rise above the electrostatic paper material bin 9, then moves to above the electrostatic paper material bin 9, lowers the suction cup component 11 to contact the electrostatic paper, raises the suction cup component 11 above the electrostatic paper material bin 9, moves the suction cup component 11 to above the wafer packaging box 4, lowers the suction cup component 11 to the target position and then releases the electrostatic paper.

[0049] like Figure 3 As shown, the distance measuring component 7 includes a plurality of distance measuring sensors 71, and the plurality of distance measuring sensors 71 are located on the same plane. The distance measuring sensors 71 are located above the packing table 3. The plurality of distance measuring sensors 71 are used to detect the flatness and height of the upper surface of the uppermost layer of electrostatic paper in the wafer packaging box 4, wherein the height of the upper surface of the uppermost layer of electrostatic paper in the wafer packaging box 4 is used as the height of the uppermost layer of the surface of the object in the wafer packaging box 4. The sucker assembly 11 is provided with a hollow area for the distance measuring sensor 71 signal to pass through. When the distance measuring sensor 71 detects the height of the upper surface of the electrostatic paper in the wafer packaging box 4, the distance measuring sensor 71 is located at a second preset height. The distance measuring sensor 71 measures the distance between the distance measuring sensor 71 and the uppermost layer of electrostatic paper in the wafer packaging box 4 at the second preset height position, so that the height of the uppermost layer of electrostatic paper in the current wafer packaging box 4 can be obtained. When the distance between the plurality of distance measuring sensors 71 and the electrostatic paper is less than the preset range, it means that the electrostatic paper is flat. If the distance difference detected by the plurality of distance measuring sensors 71 is large, it means that the electrostatic paper is not flat. The method for calculating the height of the upper surface of the top electrostatic paper in the wafer packaging box 4 may be that the distance measuring component 7 includes a processing unit, and the detection data of each distance measuring sensor 71 is calculated to obtain the upper surface of the top electrostatic paper in the wafer packaging box 4, or each distance measuring sensor 71 sends the detection data to the processor, and the processor calculates to obtain the upper surface of the top electrostatic paper in the wafer packaging box 4.

[0050] For the design of the position of the distance measuring sensor 71: Figure 3As shown, in one embodiment, the suction cup assembly 11 includes a mounting frame 111 and a plurality of suction cups 112, and the plurality of suction cups 112 are mounted on the mounting frame 111, and the distance sensor 71 is mounted on the mounting frame 111, and the mounting frame 111 is provided with the hollow area for the distance sensor 71 signal to pass through, wherein, after the suction cup assembly 11 places the electrostatic paper and moves to the second preset height position, the height of the upper surface of the uppermost layer of electrostatic paper in the wafer packaging box 4 is detected. In another embodiment, a plurality of the distance sensors 71 are fixedly mounted above the packaging table 3 relative to the frame 1, and the distance sensors 71 are located above the suction cup assembly 11. Three or more distance sensors 71 of the present application are provided.

[0051] The transport assembly 10 includes a horizontal motion mechanism 101 and a vertical motion mechanism 102, wherein the vertical motion mechanism 102 is mounted on the output end of the horizontal motion mechanism 101, and the suction cup assembly 11 is mounted on the output end of the vertical motion mechanism 102. The horizontal motion mechanism 101 and the vertical motion mechanism 102 are both provided with displacement sensors to obtain the displacement of the suction cup assembly 11 in the horizontal and vertical directions, so as to control the position of the suction cup assembly 11 when sucking and putting down the electrostatic paper. Each time before placing a wafer, the surface height of the top layer of objects in the wafer packaging box 4 is the same, and after placing the wafer, the surface height of the top layer of objects in the wafer packaging box 4 is increased by the thickness of a wafer. The transport assembly 10 drives the suction cup assembly 11 to move above the wafer packaging box 4 and lower the electrostatic paper. During the process of placing the electrostatic paper, the height of the suction cup assembly 11 when releasing the electrostatic paper is not less than the first height plus the wafer thickness, and the electrostatic paper can be released at a preset fixed height.

[0052] like Figure 1 and Figure 4 As shown, the wafer packaging equipment also includes an electrostatic paper monitoring component 12, which is used to detect the height of the uppermost layer of electrostatic paper in the electrostatic paper bin 9 and to determine the height of the electrostatic paper absorbed by the suction cup component 11.

[0053] The electrostatic paper monitoring component 12 includes a vertical motion mechanism 121 and a laser sensor 122. The laser sensor 122 is installed on the output end of the vertical motion mechanism 121. Each time the electrostatic paper is sucked, the vertical motion mechanism 121 drives the laser sensor 122 to move from bottom to top. The laser sensor 122 is used to emit a laser toward the side of the electrostatic paper and receive reflected light. The laser sensor 122 determines whether there is electrostatic paper at the current height based on the received reflected light, and determines the height of the uppermost layer of electrostatic paper in the electrostatic paper bin 9. It is used to determine the height of the next electrostatic paper suction, and prompts that the electrostatic paper needs to be replenished when the number of electrostatic papers is less than a certain number. Specifically, the laser sensor 122 determines whether there is electrostatic paper at the current height based on the time when the reflected light is received. The vertical motion mechanism 121 is equipped with a displacement sensor to monitor the implementation height of the laser sensor 122.

[0054] The wafer packaging equipment of the present application also includes a calibrator 13. Before the wafer handling robot 6 transports the wafer from the wafer box 2 to the packaging table 3, it first transports the wafer to the calibrator 13 to calibrate the wafer. After the calibration is completed, the wafer is transferred to the packaging table 3 for packaging. The calibrator 13 is an existing mature technology, and the specific structure is not repeated in the embodiments of the present application. In one embodiment, each time before the wafer handling robot 6 transports the wafer to the top of the wafer packaging box 4 on the packaging table 3, the lifting mechanism 5 drives the packaging table 3 and the wafer packaging box 4 to descend to a safe waiting position. The highest point of the wafer packaging box 4 on the safe waiting position is lower than the height of the calibrator 13. When the wafer handling robot 6 transports the wafer from the calibrator to the packaging table 3, the wafer handling robot 6 does not need to perform lifting actions, thereby improving transportation efficiency. For the measurement of the top layer of electrostatic paper in the wafer packaging box 4, the height of the top layer of the surface of the object in the wafer packaging box 4 at the safe waiting position can be measured, or the height of the top layer of the surface of the object in the wafer packaging box 4 can be measured after the electrostatic paper is placed and before the paper safety waiting position is moved. In the embodiment of the present application, the lifting mechanism 5, the electrostatic paper bin 9 and the electrostatic paper conveying module are installed on the frame 1. The lifting mechanism 5 and the vertical motion mechanism 121 adopt a single-axis displacement platform, and the transport component 10 adopts a double-axis displacement platform; the single-axis displacement platform and the double-axis displacement platform are both equipment of the prior art.

[0055] The wafer packaging setting of the embodiment of the present application defines the origin coordinates in the initial stage, and defines the coordinates of the wafer box 2, the initial position of the packaging platform 3, the initial coordinates of the output end of the wafer handling manipulator 6, the initial position of the suction cup assembly 11, the calibrator 13 and the electrostatic paper bin 9 based on the origin. During the movement of the packaging platform 3 driven by the lifting mechanism 5, the coordinates of the packaging platform 3 and the wafer packaging box 4 can be obtained in real time by combining the displacement sensor of the lifting mechanism 5, the coordinates of the initial position of the packaging platform 3 and the origin coordinates, and then fed back to the processor, and the processor controls the start and stop of the lifting mechanism 5 according to the coordinates of the packaging platform; the wafer handling manipulator 6 combines its own coordinates, the coordinates of the wafer box 2, the calibrator 13 and the packaging platform 3 to realize the transfer of the wafer between the wafer box 2, the calibrator 13 and the packaging platform 3; the electrostatic paper conveying module combines its own coordinates, the coordinates of the electrostatic paper bin 9 and the packaging platform 3 to realize the precise transfer of electrostatic paper. The precise movement of objects is an existing mature technology, and this application is briefly described above, and the specific principles are not repeated.

[0056] The principle of the wafer packaging equipment of the embodiment of the present application is as follows: the wafer packaging box 4 is loaded onto the packaging table 3, the wafer packaging box 4 is positioned and clamped on the packaging table 3, and then the buffer foam and the electrostatic paper are placed in the wafer packaging box 4 in sequence. After the distance measuring component 7 confirms that the electrostatic paper in the box has been laid flat and detects the height of the electrostatic paper, the wafer packaging box 4 is lowered to a safe waiting position, and the wafer handling robot 6 transfers the calibrated wafer to the wafer handover position above the packaging table 3. The processor determines the height of the electrostatic paper, the preset waiting position coordinates of the wafer packaging box 4 and the first preset The height of the wafer packaging box 4 is calculated by the height, the wafer packaging box 4 rises, the wafer handling robot 6 hands over the wafer, and the packaging of this wafer is completed; then the robot continues to move to the wafer material box 2 to take out a wafer, and the electrostatic paper transmission module continues to move to the electrostatic paper material bin 9 to absorb the electrostatic paper and put it into the wafer packaging box 4. After the distance measuring component 7 confirms that the electrostatic paper in the wafer packaging box 4 has been laid flat and detects the height of the electrostatic paper, the wafer packaging box 4 drops to a safe waiting position; and so on, after packaging a specified number of wafers, finally place the cushioning foam on it and close the lid to complete the packaging. Among them, the cushioning foam can be placed in the wafer packaging box 4 manually, or it can be sucked and placed by the suction cup component 11.

[0057] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A wafer packaging device, characterized in that: include: Rack (1); A wafer material box (2) is placed on the rack (1), and the wafer material box (2) is used to place wafers; A packing table (3) is located on one side of the wafer material box (2), and the packing table (3) is used to place the wafer packaging box (4) and position and clamp the wafer packaging box (4); A lifting mechanism (5) is used to drive the packing table (3) to move in a vertical direction; A wafer handling robot (6) is installed on the frame (1), and is used to transport wafers from the wafer material box (2) to above the wafer packaging box (4) on the packaging table (3), and to place the wafers in the wafer packaging box (4); A distance measuring component (7) is used to measure the height of the surface of the uppermost object in the wafer packaging box (4) before the wafer handling robot (6) places the wafer in the wafer packaging box (4) each time; Each time the wafer handling robot (6) transports the wafer to the top of the wafer packaging box (4) on the packaging table (3), the lifting mechanism (5) drives the packaging table (3) to move so that the height of the surface of the uppermost layer of objects in the wafer packaging box (4) is at a first preset height, and each time the wafer handling robot (6) places the wafer in the wafer packaging box (4), the height of the surface of the uppermost layer of objects in the wafer packaging box (4) is at the first preset height; The wafer packaging equipment also includes an electrostatic paper material bin (9) and an electrostatic paper conveying module, wherein the electrostatic paper conveying module includes a transport component (10) and a suction cup component (11), wherein the output end of the transport component (10) is connected to the suction cup component (11), wherein the suction cup component (11) is used to absorb the electrostatic paper, and wherein the transport component (10) is used to drive the suction cup component (11) to move in a horizontal direction and a vertical direction, so as to drive the suction cup component (11) to move between the electrostatic paper material bin (9) and the packaging table (3); The distance measuring component (7) comprises a plurality of distance measuring sensors (71), the plurality of distance measuring sensors (71) being located on the same plane, the plurality of distance measuring sensors (71) being located above the packaging table (3), the plurality of distance measuring sensors (71) being used to detect the flatness and height of the upper surface of the uppermost layer of electrostatic paper in the wafer packaging box (4), wherein the height of the upper surface of the uppermost layer of electrostatic paper in the wafer packaging box (4) is used as the height of the uppermost layer of the surface of the object in the wafer packaging box (4), the suction cup component (11) being provided with a hollow area for the distance measuring sensor (71) signal to pass through, and when the distance measuring sensor (71) detects the height of the upper surface of the electrostatic paper in the wafer packaging box (4), the distance measuring sensor (71) is located at a second preset height.

2. The wafer packaging equipment according to claim 1, characterized in that: The wafer packaging device further comprises a processor, the lifting mechanism (5) further comprises a grating ruler (8), the processor receives height data measured by the distance measuring component (7), the processor calculates the theoretical displacement required to move the uppermost surface of the object in the wafer packaging box (4) to the packaging platform (3) at the first preset height or the wafer packaging box (4), and the processor controls the lifting mechanism (5) to drive the packaging platform (3) to move according to the calculated theoretical displacement; The grating ruler (8) is used to monitor the actual displacement of the packaging table (3) or the wafer packaging box (4) during the process of the uppermost object surface in the wafer packaging box (4) moving toward the first preset height, and the processor compares the actual displacement with the theoretical displacement.

3. The wafer packaging equipment according to claim 1, characterized in that: Each time before the wafer transport robot (6) transports the wafer to above the wafer packaging box (4) on the packaging table (3), the lifting mechanism (5) drives the packaging table (3) and the wafer packaging box (4) to descend to a safe waiting position.

4. The wafer packaging equipment according to claim 1, characterized in that: The suction cup assembly (11) comprises a mounting frame (111) and a plurality of suction cups (112), wherein the plurality of suction cups (112) are mounted on the mounting frame (111), the distance measuring sensor (71) is mounted on the mounting frame (111), and the mounting frame (111) is provided with a hollow area for the distance measuring sensor (71) signal to pass through, wherein after the suction cup assembly (11) places the electrostatic paper and moves to the second preset height position, the height of the upper surface of the uppermost layer of electrostatic paper in the wafer packaging box (4) is detected.

5. The wafer packaging equipment according to claim 1, characterized in that: A plurality of distance measuring sensors (71) are fixedly mounted above the packaging platform (3) relative to the frame (1), and the distance measuring sensors (71) are located above the suction cup assembly (11).

6. The wafer packaging equipment according to claim 1, characterized in that: The transport assembly (10) comprises a horizontal motion mechanism (101) and a vertical motion mechanism (102); the vertical motion mechanism (102) is mounted on the output end of the horizontal motion mechanism (101); and the suction cup assembly (11) is mounted on the output end of the vertical motion mechanism (102).

7. The wafer packaging equipment according to claim 1, characterized in that: The wafer packaging equipment also includes an electrostatic paper monitoring component (12), which is used to detect the height of the uppermost layer of electrostatic paper in the electrostatic paper bin (9) and to determine the height of the electrostatic paper sucked by the suction cup component (11).

8. The wafer packaging equipment according to claim 7, characterized in that: The electrostatic paper monitoring component (12) comprises a vertical motion mechanism (121) and a laser sensor (122). The laser sensor (122) is mounted on the output end of the vertical motion mechanism (121). Each time the electrostatic paper is sucked, the vertical motion mechanism (121) drives the laser sensor (122) to move from bottom to top. The laser sensor (122) is used to emit a laser toward the side of the electrostatic paper and receive reflected light. The laser sensor (122) determines whether there is electrostatic paper at the current height based on the received reflected light, and determines the height of the uppermost layer of electrostatic paper in the electrostatic paper bin (9).

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