Flexible paper-cut structure film sensor and manufacturing method thereof

Abstract

The invention discloses a flexible paper-cut structure film sensor and a manufacturing method thereof, the flexible paper-cut structure film sensor comprises a PI main body structure, a resistance strain layer, conductive pins and a packaging layer, the PI main body structure is formed by cutting a PI film by ultraviolet laser, the resistance strain layer is generated by inducing the PI main body structure by the ultraviolet laser, and the conductive pins are electrically connected with the PI main body structure. The conductive pins are copper wires connected to two ends of the resistance strain layer, the packaging layer is a packaging structure in which PDMS is smeared to the resistance strain layer and the conductive pins for protection, the flexible paper-cut structure thin film sensor is prepared, the traditional Chinese paper-cut technology is utilized, the shape transformation is ingeniously realized, and the flexible paper-cut structure thin film sensor is portable, high in toughness and high in reliability. The flexible paper-cut structure thin film sensor can be used for clamping ultra-soft, overweight and ultra-thin objects in a multifunctional mode through a single gripper.

Description

Technical Field

[0001] The invention relates to the field of flexible paper-cut sensing, and in particular to a flexible paper-cut structure thin film sensor and a manufacturing method thereof. Background Art

[0002] Over the past few decades, designing shape-programmable materials from two-dimensional sheets to three-dimensional shapes has attracted widespread and growing interest due to the new material properties conferred by their geometry. Programmable shape transformations at various scales have been achieved in different materials and structures using folding, bending, and other techniques. These shape-programmable materials have a wide range of applications in programmable machines and robotic grasping.

[0003] Current robotic grippers cannot effectively complete demanding tasks. A single robotic gripper is still challenging to handle ultra-soft, ultra-thin, and ultra-heavy objects. An ideal robotic prosthesis requires a soft robotic gripper with similar capabilities to human hands in terms of dexterity, precision, and load-bearing capacity. Accordingly, the present invention proposes a flexible paper-kirigami structure thin film sensor and a method for manufacturing the same. Summary of the invention

[0004] In order to overcome the defects in the above-mentioned prior art, the present invention provides a flexible paper-cut structure thin film sensor and a manufacturing method thereof, which cleverly realizes the transformation of shape, can use a single gripper to achieve multi-functional clamping of ultra-soft, ultra-heavy, and ultra-thin objects, is portable and has high toughness, and uses laser induction to generate a resistive strain layer on the paper-cut structure film to achieve the change of resistance when clamping objects, and the size of the clamped object can be judged by analyzing the relative change of resistance.

[0005] Technical Solution

[0006] A flexible paper-kirigami structure thin film sensor comprises a PI main structure, a resistive strain layer, a conductive pin and a packaging layer, wherein the PI main structure is formed by cutting a PI film by an ultraviolet laser, the resistive strain layer is generated by inducing the PI main structure by an ultraviolet laser, the conductive pin is a copper wire connected to both ends of the resistive strain layer, and the packaging layer is a packaging structure in which PDMS is applied to the resistive strain layer and the conductive pin for protection.

[0007] A method for manufacturing a flexible paper-kirigami structure thin film sensor comprises the following steps:

[0008] (1) Take a piece of PI film and cut it into a specific shape according to a preset C4D pattern using a UV laser cutting machine. The laser processing parameters are speed 800 mm / s, current 1A, frequency 50 KHz, Q pulse width 2us, and obtain the main structure of the paper-cut structure PI;

[0009] (2) keeping the position of the cut PI main structure unchanged, changing the ultraviolet laser parameters, and performing laser induction to prepare graphene on a partial area at a speed of 50 mm / s, a current of 1 A, a frequency of 180 kHz, a Q pulse width of 5 us, and an induced spacing of 0.02 mm, so that it has conductivity and obtains a resistive strain layer;

[0010] (3) A copper wire of a certain length is fixed to both ends of the resistive strain layer using silver paste, and then the modulated PDMS is applied to the resistive strain layer and the connection between the resistive strain layer and the conductive pin, and heated and cured on a heating table at 100 degrees Celsius. After curing, a flexible paper-cut structure thin film sensor with an encapsulation protective layer is obtained.

[0011] Furthermore, the larger the size of the clamped object, the greater the rate of change of the resistance value of the corresponding flexible paper-cut structure thin film sensor.

[0012] Furthermore, the flexible paper-kirigami structure thin film sensor is pulled at both ends by external stress to achieve a transition from 2D to 3D.

[0013] Furthermore, under the tensile effect of external stress on the left and right ends of the flexible paper-cut structure thin film sensor, the upper and lower ends of the flexible paper-cut structure thin film sensor gradually bend. As the external stress increases, the other two ends approach each other and gradually close. By gradually closing the two ends, it can clamp objects of different sizes, several times its own weight, ultra-thin paper, and liquids with large surface tension.

[0014] Furthermore, under the action of external force, the resistance of the resistive strain layer changes during the strain process of the flexible paper-cut structure thin film sensor. By analyzing the relative change of resistance, the size of the clamped object can be identified.

[0015] Furthermore, the PI main structure 1, through the deformation process from 2D to 3D, is similar to a gripper and can grasp ultra-thin, ultra-fine objects that are much larger than their own weight and liquids with high surface tension.

[0016] Furthermore, the strain process of the PI main structure 1 is a regular gripping trajectory, which can achieve high-precision gripping.

[0017] Beneficial Effects

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The flexible paper-cut structure thin film sensor uses traditional Chinese paper-cut technology to cleverly achieve shape transformation. It is portable and has high toughness.

[0020] 2. A single gripper can be used to achieve multifunctional gripping of ultra-soft, ultra-heavy, and ultra-thin objects.

[0021] 3. Laser-induced resistance strain layer is generated on the paper-cut structure film to realize the change of resistance when clamping objects, and the size of the clamped object is determined by analyzing the relative change of resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of a flexible paper-cut structure thin film sensor according to Example 1 of the present invention.

[0023] Figure 2 This is the C4D design pattern of the PI main structure made by an ultraviolet laser cutting machine in Example 1 of the present invention.

[0024] Figure 3 This is the C4D design pattern of the resistive strain layer made by using an ultraviolet laser cutting machine in Example 1 of the present invention.

[0025] Figure 4 It is a schematic diagram of manufacturing a resistive strain layer on a PI main structure using an ultraviolet laser cutting machine in Example 1 of the present invention.

[0026] Figure 5 This is a graph of the resistance change rate of the flexible paper-kirigami structure thin film sensor in Example 1 of the present invention under different strain degrees.

[0027] Figure 6 This is a test diagram of the cyclic stability of the flexible paper-kirigami structure thin film sensor under different strain degrees in Example 1 of the present invention.

[0028] Figure 7 This is a test graph of the cyclic stability of the flexible paper-kirigami structure thin film sensor under 8% strain in Example 1 of the present invention.

[0029] Figure 8 This is an experimental data chart of the electrical signal changes when the flexible paper-cut structure film sensor in Example 1 of the present invention clamps a rubber ball multiple times.

[0030] Fig. 9 This is a test diagram of the cyclic stability of the flexible paper-kirigami structure thin film sensor under different strain degrees in Example 2 of the present invention.

[0031] Fig.10 This is the C4D design pattern of the PI main structure made by using an ultraviolet laser cutting machine in Example 3 of the present invention.

[0032] Reference numerals

[0033] PI main structure 1, resistive strain layer 2, conductive pins 3, packaging layer 4. DETAILED DESCRIPTION

[0034] In order to better illustrate the content of the present invention, the following is a detailed description with reference to the accompanying drawings and implementation examples:

[0035] Example 1

[0036] like Figure 1-8 As shown, the present invention discloses a flexible paper-cut structure thin film sensor, comprising a PI main structure 1, a resistance strain layer 2, a conductive pin 3 and a packaging layer 4 ( Figure 1 ), the PI main structure 1 is a PI film cut by ultraviolet laser, the resistive strain layer 2 is produced by ultraviolet laser induction of the PI main structure 1, the conductive pin 3 is a copper wire connected to the two ends of the resistive strain layer 2, and the packaging layer 4 is a packaging structure in which PDMS is applied to the resistive strain layer 2 and the conductive pin 3 for protection.

[0037] A method for manufacturing a flexible paper-kirigami structure thin film sensor comprises the following steps:

[0038] (1) Take a piece of PI film and cut it using a UV laser cutting machine according to the preset C4D pattern ( Figure 2 ) for cutting, the laser processing parameters are speed 800mm / s, current 1A, frequency 50KHz, Q pulse width 2us, and the paper-cut structure PI main structure 1 is obtained;

[0039] (2) Keeping the position of the cut PI main structure 1 unchanged, changing the ultraviolet laser parameters, laser S-shaped induction was performed on a part of the area at a speed of 50 mm / s, a current of 1 A, a frequency of 180 kHz, a Q pulse width of 5 us, and an induced spacing of 0.02 mm to prepare conductive graphene, and the induced line spacing was 0.5 mm to obtain a resistive strain layer 2 ( Figure 3-4 );

[0040] (3) A copper wire of a certain length is fixed to both ends of the resistive strain layer 2 using silver paste, and then the modulated PDMS is applied to the resistive strain layer 2 and the connection between the resistive strain layer 2 and the conductive pin 3, and heated and cured on a heating table at 100 degrees Celsius to prepare a flexible paper-cut structure thin film sensor.

[0041] Furthermore, under the action of external force, the resistance of the resistive strain layer changes during the strain process of the flexible paper-cut structure thin film sensor. By analyzing the relative change of resistance, the size of the clamped object can be identified.

[0042] Furthermore, the PI main structure 1, through the deformation process from 2D to 3D, is similar to a gripper and can grasp ultra-thin, ultra-fine objects that are much larger than their own weight and liquids with high surface tension.

[0043] Furthermore, the strain process of the PI main structure 1 is a regular gripping trajectory, which can achieve high-precision gripping.

[0044] like Figure 5As shown in the figure, under the action of external force, the flexible paper-cut structure film sensor undergoes tensile strain, and the resistance signal output of the flexible paper-cut structure film sensor is measured using Keithley 2400. It can be observed in the figure that within the tensile range of 0-16%, the change in the strain degree of the flexible paper-cut structure film sensor corresponds to the change in the resistance of the flexible paper-cut structure film sensor. The greater the strain degree, the greater the corresponding change in resistance value. Then, by analyzing the relative change in resistance, the size of the clamped object can be identified.

[0045] like Figure 6 As shown, the flexible paper-cut structure thin film sensor was tested for repeatability in different strain ranges on a universal testing machine. The experimental results show that the sensor has good signal stability in different strain ranges, and the fixed tensile strain range is 8%; Figure 7 The results show that the sensor has good cycle stability.

[0046] Furthermore, the prepared flexible paper-cut structure thin film sensor was used as a flexible gripper. During the grasping process, the PI main structure 1 went through a deformation process from 2D to 3D, and the sensor accurately grasped a rubber ball weighing 50g. Figure 8 It further demonstrated the obvious electrical signal changes of the flexible paper-cut structure film sensor when clamping a small ball, and had good test stability. Given that the PI main structure is made of PI material and the cutting structure gives the sensor good structural stability, the sensor clamped 3 steel balls with a total weight of 230g. The mass of the sensor was 0.4g, so the sensor could grab objects weighing more than 575 times its own weight. In addition, the sensor can also clamp liquids with high surface tension, such as mercury, which provides a good application prospect for robots to replace humans in the clamping and processing of mercury.

[0047] Example 2

[0048] like Fig. 9 As shown, the present invention discloses a flexible paper-kirigami structure thin film sensor, including a PI main structure 1, a resistive strain layer 2, a conductive pin 3 and a packaging layer 4, wherein the PI main structure 1 is a PI film cut into a specific shape by an ultraviolet laser, the resistive strain layer 2 is generated by the ultraviolet laser induction of part of the PI main structure 1, the conductive pin 3 is a copper wire connected at both ends of the resistive strain layer 2, and the packaging layer 4 is a packaging layer in which PDMS is applied to the ends of the resistive strain layer 2 and the conductive pin 3 for protection.

[0049] A method for manufacturing a flexible paper-kirigami structure thin film sensor comprises the following steps:

[0050] (1) Take a piece of PI film and cut it using a UV laser cutting machine according to the preset C4D pattern ( Figure 2) to cut into a specific shape, the laser processing parameters are speed 800mm / s, current 1A, frequency 50KHz, Q pulse width 2us, and the paper-cut structure PI main structure 1 is obtained;

[0051] (2) keeping the position of the cut PI main structure 1 unchanged, changing the ultraviolet laser parameters, performing S-shaped laser induction on a part of the area at a speed of 50 mm / s, a current of 1 A, a frequency of 180 kHz, a Q pulse width of 5 us, and an induced spacing of 0.02 mm to prepare conductive graphene (the induced line spacing is 1 mm), and obtaining a resistive strain layer 2;

[0052] (3) A copper wire of a certain length is fixed to both ends of the resistive strain layer 2 using silver paste, and then the modulated PDMS is applied to the connection between the resistive strain layer 2 and the conductive pin 3, and heated and cured on a heating table at 100 degrees Celsius to prepare a flexible paper-cut structure thin film sensor.

[0053] like Fig. 9 As shown, the flexible paper-kirigami structure thin film sensor was subjected to repeatability tests in different strain ranges on a universal testing machine. The experimental results show that the sensor prepared in Example 2 has good signal stability in different strain ranges, but the resistance signal change rate is only half of that in Example 1, which is related to the induced line spacing and induced area of ​​the resistance strain layer.

[0054] Example 3

[0055] like Fig.10 As shown, the present invention discloses a flexible paper-kirigami structure thin film sensor, including a PI main structure 1, a resistive strain layer 2, a conductive pin 3 and a packaging layer 4, wherein the PI main structure 1 is a PI film cut into a specific shape by an ultraviolet laser, the resistive strain layer 2 is produced by the ultraviolet laser induction part of the PI main structure 1, the conductive pin 3 is a copper wire connected at both ends of the resistive strain layer 2, and the packaging layer 4 is a packaging layer in which PDMS is applied to both ends of the resistive strain layer 2 and the conductive pin 3 for protection.

[0056] A method for manufacturing a flexible paper-kirigami structure thin film sensor comprises the following steps:

[0057] (1) Take a piece of PI film and cut it using a UV laser cutting machine according to the preset C4D pattern ( Fig.10 ) to cut into a specific shape, the laser processing parameters are speed 800mm / s, current 1A, frequency 50KHz, Q pulse width 2us, and a paper-cut structure PI main structure 1 with arcs at both ends is obtained;

[0058] (2) keeping the position of the cut PI main structure 1 unchanged, changing the ultraviolet laser parameters, performing S-shaped laser induction on a part of the area at a speed of 50 mm / s, a current of 1 A, a frequency of 180 kHz, a Q pulse width of 5 us, and an induced spacing of 0.02 mm to prepare conductive graphene (the induced line spacing is 0.5 mm), and obtaining a resistive strain layer 2;

[0059] (3) A copper wire of a certain length is fixed to both ends of the resistive strain layer 2 using silver paste, and then the modulated PDMS is applied to the connection between the resistive strain layer 2 and the conductive pin 3, and heated and cured on a heating table at 100 degrees Celsius to prepare a flexible paper-cut structure thin film sensor.

[0060] Fig.10 The resistive strain layer of the sensor shown is consistent with that in Example 1, but the shape of the clamping position in the PI main structure is changed, which can be suitable for clamping objects of different shapes and structures. At the same time, the shape and structure of the PI main structure and the resistive strain layer in the present invention can be personalized designed and quickly laser cut or induced prepared based on C4D according to actual needs.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the technical solutions of the present invention have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A flexible paper-kirigami structure thin film sensor, characterized in that: The invention comprises a PI main structure (1), a resistance strain layer (2), a conductive pin (3) and a packaging layer (4); the PI main structure (1) is formed by cutting a PI film by ultraviolet laser; the resistance strain layer (2) is generated by ultraviolet laser induction of the PI main structure (1); the conductive pin (3) is a copper wire connected to both ends of the resistance strain layer (2); and the packaging layer (4) is a packaging structure in which PDMS is applied to the resistance strain layer (2) and the conductive pin (3) for protection.

2. The flexible paper-kirigami structure thin film sensor according to claim 1, characterized in that: Under the tensile effect of external stress on the left and right ends of the flexible paper-cut structure thin film sensor, the upper and lower ends of the flexible paper-cut structure thin film sensor gradually bend. As the external stress increases, the other two ends approach each other and gradually close. By gradually closing the two ends, it can clamp objects of different sizes, several times its own weight, ultra-thin paper, and liquids with large surface tension.

3. The flexible paper-kirigami structure thin film sensor according to claim 1, characterized in that: The larger the size of the clamped object, the greater the rate of change of the resistance value of the flexible paper-cut structure thin film sensor.

4. The flexible paper-kirigami structure thin film sensor according to claim 2, characterized in that: The strain process of the PI main structure (1) is a regular grasping trajectory, which can achieve high-precision grasping.

5. The flexible paper-kirigami structure thin film sensor according to claim 2, characterized in that: During the strain process of the flexible paper-kirigami structure thin film sensor, the resistance value of the resistive strain layer changes. By analyzing the relative change of resistance, the size of the clamped object can be identified.

6. A method for designing a flexible paper-cut structure thin film sensor, characterized in that: ① Take a piece of PI film and cut it according to the preset C4D pattern using a UV laser cutting machine. The laser processing parameters are speed 800 mm / s, current 1A, frequency 50 KHz, Q pulse width 2us, and obtain the paper-cut structure PI main structure (1); ② Keeping the position of the cut PI main structure (1) unchanged, changing the ultraviolet laser parameters, laser-induced graphene is prepared on a part of the area at a speed of 50 mm / s, a current of 1 A, a frequency of 180 kHz, a Q pulse width of 5 us, and an induced spacing of 0.02 mm, so that the PI main structure (1) has conductivity, thereby obtaining a resistive strain layer (2); ③ A copper wire of a certain length is fixed to both ends of the resistive strain layer (2) using silver paste, and then the modulated PDMS is applied to the resistive strain layer (2) and the connection between the resistive strain layer (2) and the conductive pin (3), and heated and cured on a heating table at 100 degrees Celsius. After curing, a flexible paper-cut structure thin film sensor with an encapsulation protective layer is obtained.

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