Manufacturing method of liquid cooling plate for energy storage
Through diffusion welding and liquid filling molding technology, the high cost and weld problems of brazing methods in liquid-cooled plate manufacturing are solved, and high-quality and environmentally friendly liquid-cooled plate production is achieved, which is suitable for energy storage applications of a variety of materials.
Patent Information
- Application Number
- CN202411203788.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2024-12-06
- Estimated Expiration
- 2044-08-30
AI Technical Summary
In the existing manufacturing process of liquid-cooled plates for energy storage, the brazing method is costly, the weld sealing and corrosion resistance are poor, and there are risks of chemicals to the environment and workers' health.
Using diffusion welding and liquid filling molding technology, the overall structure is formed by coating solder resist at the cooling channel of the liquid cooling plate and diffusion welding in an argon or vacuum environment, and then a cooling channel is formed in the liquid filling molding machine. And seal the liquid filling port and nozzle through argon arc welding or brazing to ensure welding quality and sealing.
It improves the welding quality and corrosion resistance of liquid-cooled plates, reduces the risks of chemicals to the environment and workers' health, is suitable for large-scale production, and is suitable for processing of a variety of materials.
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Figure CN119092904A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field related to liquid cooling plate processing, and in particular to a method for manufacturing a liquid cooling plate for energy storage. Background Art
[0002] Liquid cooling technology is becoming the mainstream technology in the energy storage field due to its efficient heat dissipation performance and low energy consumption. It is mainly used in liquid-cooled containerized energy storage systems and lithium battery energy storage systems. Compared with traditional air cooling technology, liquid cooling technology performs better in terms of heat dissipation efficiency, temperature uniformity and energy consumption. It can effectively control the temperature of the battery system, improve battery reliability and reduce energy consumption, thereby extending battery life and increasing system stability and reliability.
[0003] After massive searches, it was found that the Chinese patent announcement number is CN115295928B, which discloses a composite liquid cooling plate for heat dissipation of a battery system and a preparation method thereof, wherein the composite liquid cooling plate includes: a liquid cooling plate body and a carbon coating arranged on the liquid cooling plate body; the material of the liquid cooling plate body is metal aluminum, and the raw material of the carbon coating is a graphene-carbon nanotube composite material; the liquid cooling plate body includes a lower cold plate, an upper cold plate, and a liquid inlet nozzle and a liquid outlet nozzle arranged on the lower cold plate, the upper cold plate is arranged above the lower cold plate, and the carbon coating is arranged on the upper top surface of the upper cold plate; a groove is arranged on the lower cold plate, and the bottom surface and two side surfaces of the groove form a flow channel with the lower bottom surface of the upper cold plate, and the flow channel is filled with coolant, and the liquid inlet nozzle, the flow channel and the liquid outlet nozzle are connected in sequence to form a loop. The present invention can quickly dissipate heat for the battery system by arranging a carbon coating on the liquid cooling plate body, which plays a good role in the performance and safety of the battery system.
[0004] In summary, the main process for existing liquid cooling plates for energy storage is brazing. The cooling channel is manufactured using profile extrusion and sheet metal stamping processes, and the cover plate and cooling channel plate are welded into an integral structure by brazing. The main disadvantages of liquid cooling plates manufactured by brazing are high cost, poor sealing and corrosion resistance of brazing welds, and the brazing material is easy to react with certain cooling media, which has certain limitations in application scenarios; and the chemicals used in the brazing process pose certain risks to the environment and workers' health.
[0005] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a manufacturing method for a liquid cooling plate for energy storage, so as to make it more valuable for industrial use. Summary of the invention
[0006] In order to solve any of the above technical problems, an object of the present invention is to provide a method for manufacturing a liquid cooling plate for energy storage.
[0007] To achieve the above object, the present invention adopts the following technical solution:
[0008] A method for manufacturing a liquid cooling plate for energy storage, the liquid cooling plate comprising a cover plate and a cooling plate from top to bottom, an inlet nozzle and an outlet nozzle are respectively installed on both sides of a diagonal line on the cover plate, a cooling channel is opened on the cooling plate, and the inlet nozzle and the outlet nozzle are respectively connected to the inlet and outlet holes of the cooling channel;
[0009] The manufacturing method of the liquid cooling plate comprises the following steps in sequence:
[0010] Step S1, blank preparation:
[0011] Cutting the rolled cover plates and cooling plates;
[0012] Step S2: surface pretreatment:
[0013] Remove burrs or splashes from the edge cover plate and cooling plate after cutting, and then remove the oxide layer on the surface of the cover plate and cooling plate;
[0014] Step S3, solder mask processing:
[0015] Apply solder resist to the second solder resist area at the cooling channel of the cooling plate and the first solder resist area of the cover plate directly above the second solder resist area;
[0016] Step S4: diffusion welding:
[0017] The cover plate and the cooling plate are buckled together to form a liquid cooling plate blank, and solder resist is evenly applied on the upper and lower surfaces of the liquid cooling plate blank and the reserved liquid filling port of the liquid cooling plate blank, and then the liquid cooling plate blank is placed in a diffusion welding device for diffusion welding;
[0018] Step S5, liquid filling and molding:
[0019] The liquid-cooling plate blank is clamped and positioned by using a liquid-filling molding machine and a liquid-expansion tooling. A liquid-filling interface is provided on the liquid-filling molding machine or the hydraulic tooling. Liquid is filled into the liquid-cooling plate blank through the liquid-filling port reserved for the liquid-cooling plate blank to form the cooling channel and fit the mold forming surface.
[0020] Step S6: shape processing:
[0021] Remove the excess of the liquid cooling plate blank and remove the edge burrs;
[0022] Step S7, making inlet and outlet holes:
[0023] The cooling inlet and outlet holes are made by drilling and milling on the flat side of the liquid cooling plate blank, and the burrs are removed and the excess debris is cleaned;
[0024] Step S8, cleaning and drying:
[0025] Clean the inner and outer surfaces of the parts with degreaser water and dry them;
[0026] Step S9, sealing the liquid filling port:
[0027] The reserved filling port of the liquid cooling plate blank is sealed by welding;
[0028] Step S10, welding the inlet and outlet nozzles:
[0029] The inlet nozzle and the outlet nozzle connected to the radiator are respectively welded to the inlet and outlet holes of the liquid cooling plate blank.
[0030] As a further improvement of the present invention, the method further comprises step S11, leak detection: connecting the inlet nozzle and the outlet nozzle, and detecting the reliability of the welds at various locations of the liquid cooling plate in a hydraulic or airtight manner.
[0031] As a further improvement of the present invention, it also includes step S12, surface post-treatment: the surface of the liquid cooling plate is subjected to sandblasting treatment, requiring the surface state to be uniform, and the surface of the energy storage cell is subjected to insulation treatment.
[0032] As a further improvement of the present invention, in step S1 and step S6, laser cutting or punching is adopted.
[0033] As a further improvement of the present invention, in step S2, the oxide layer on the surface of the cover plate and the cooling plate is removed by acid washing or alkali washing or a combination of the two.
[0034] As a further improvement of the present invention, in step S3, the solder resist is applied by using a template or a glue-coated pattern, and the solder resist includes but is not limited to boron nitride and graphite.
[0035] As a further improvement of the present invention, the diffusion welding processing conditions in step S4 are as follows: welding temperature: 530-1100°C; welding pressure: 4-20 MPa; welding time: 240-480 min; welding environment: argon protection or vacuum greater than 6×10 - 2 Pa.
[0036] As a further improvement of the present invention, the molding pressure in step S5 is 30-150 MPa.
[0037] As a further improvement of the present invention, the mold in step S5 includes a mold upper plate and a mold lower plate from top to bottom, the liquid-cooled plate blank is located between the mold upper plate and the mold lower plate, and filling nozzles compatible with the filling ports reserved for the liquid-cooled plate blank are installed on the left and right sides of the mold lower plate. A mold flushing channel compatible with the above-mentioned cooling channel is opened on the mold lower plate directly below the cooling channel on the cooling plate, and the cooling channel fits the mold flushing channel during molding.
[0038] As a further improvement of the present invention, in step S9, argon arc welding or brazing is used to seal the reserved liquid filling port of the liquid cooling plate blank; in step S9, argon arc welding, laser welding or brazing is used to weld the inlet nozzle and the outlet nozzle.
[0039] By means of the above scheme, the present invention has at least the following advantages:
[0040] The present invention can ensure that the welding quality of the liquid cooling plate for energy storage is reliable and the corrosion resistance is good, and is applicable to large-scale and batch production.
[0041] The production process of the present invention is relatively environmentally friendly and can greatly reduce the risks of chemicals to the environment and workers' health during the welding process.
[0042] The present invention can be applied to the processing and use of liquid cooling plates including but not limited to aluminum and aluminum alloys, stainless steel, copper and copper alloys, titanium and titanium alloys, etc.
[0043] The present invention is also applicable to the interface form of the coolant in the side-opening structure.
[0044] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.
[0046] Figure 1 It is a schematic flow chart of a method for manufacturing a liquid cooling plate for energy storage according to the present invention;
[0047] Figure 2 is a schematic structural diagram of the front side of the liquid cooling plate of the present invention;
[0048] Figure 3 It is a structural schematic diagram of the back side of the liquid cooling plate of the present invention;
[0049] Figure 4 yes Figure 2 Cross-sectional view of the liquid cooling plate;
[0050] Figure 5 It is a schematic diagram of the solder resist treatment of the cover plate in step 3 of the present invention;
[0051] Figure 6 It is a schematic diagram of the solder resist treatment of the cooling plate in step 3 of the present invention;
[0052] Figure 7 is a schematic diagram of the liquid-forming mold before processing in step 5 of the present invention;
[0053] Figure 8 It is a schematic diagram of the liquid punching molding die during processing in step 5 of the present invention.
[0054] The meanings of the various reference numerals in the figures are as follows.
[0055] Cover plate 1, inlet nozzle 2, outlet nozzle 3, cooling plate 4, cooling channel 5, first solder resist area 6, second solder resist area 7, mold upper plate 8, mold lower plate 9, mold flushing channel 10, and liquid filling nozzle 11. DETAILED DESCRIPTION
[0056] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0057] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.
[0058] Example
[0059] like Figures 1 to 8 As shown,
[0060] A method for manufacturing a liquid cooling plate for energy storage, the liquid cooling plate comprising a cover plate 1 and a cooling plate 4 from top to bottom, an inlet nozzle 2 and an outlet nozzle 3 are respectively installed on both sides of a diagonal line on the cover plate 1, a cooling channel 5 is opened on the cooling plate 4, and the inlet nozzle 2 and the outlet nozzle 3 are respectively connected to the inlet and outlet holes of the cooling channel 5;
[0061] The manufacturing method of the liquid cooling plate comprises the following steps in sequence:
[0062] Step S1, blank preparation:
[0063] Cutting the rolled cover plate 1 and cooling plate 4;
[0064] Step S2: surface pretreatment:
[0065] Remove burrs or splashes from the edge cover plate 1 and cooling plate 4 after cutting, and then remove the oxide layer on the surface of the cover plate 1 and cooling plate 4;
[0066] Step S3, solder mask processing:
[0067] Solder resist is applied to the second solder resist area 7 at the cooling channel 5 of the cooling plate 4 and the first solder resist area 6 of the cover plate 1 directly above the second solder resist area 7;
[0068] Step S4: diffusion welding:
[0069] The cover plate 1 and the cooling plate 4 are buckled together to form a liquid cooling plate blank, and solder resist is evenly applied on the upper and lower surfaces of the liquid cooling plate blank and the reserved liquid filling port of the liquid cooling plate blank, and then the liquid cooling plate blank is placed in a diffusion welding device for diffusion welding;
[0070] Step S5, liquid filling and molding:
[0071] The liquid-cooling plate blank is clamped and positioned by using a liquid-filling molding machine and a liquid-expansion tooling, and a liquid-filling interface is provided on the liquid-filling molding machine or the hydraulic tooling, and liquid is filled into the liquid-cooling plate blank through the liquid-filling port reserved for the liquid-cooling plate blank to form the cooling channel 5 and fit the mold forming surface;
[0072] Step S6: shape processing:
[0073] Remove the excess of the liquid cooling plate blank and remove the edge burrs;
[0074] Step S7, making inlet and outlet holes:
[0075] The cooling inlet and outlet holes are made by drilling and milling on the flat side of the liquid cooling plate blank, and the burrs are removed and the excess debris is cleaned;
[0076] Step S8, cleaning and drying:
[0077] Clean the inner and outer surfaces of the parts with degreaser water and dry them;
[0078] Step S9, sealing the liquid filling port:
[0079] The reserved filling port of the liquid cooling plate blank is sealed by welding;
[0080] Step S10, welding the inlet and outlet nozzles:
[0081] The inlet nozzle 2 and the outlet nozzle 3 connected to the radiator are respectively welded to the inlet and outlet holes of the liquid cooling plate blank.
[0082] Preferably, the method further comprises step S11, leak detection: connecting the inlet nozzle 2 and the outlet nozzle 3, and detecting the reliability of the welds at various locations of the liquid cooling plate in a hydraulic or airtight manner.
[0083] Preferably, the method further includes step S12, surface post-treatment: the surface of the liquid cooling plate is subjected to sandblasting treatment, requiring the surface state to be uniform, and the surface of the energy storage cell is subjected to insulation treatment.
[0084] Preferably, in step S1 and step S6, laser cutting or punching is used.
[0085] Preferably, in step S2, the oxide layer on the surface of the cover plate 1 and the cooling plate 4 is removed by acid washing or alkali washing or a combination of the two.
[0086] Preferably, in step S3, the solder resist is applied by using a template or a glue-coated pattern, and the solder resist includes but is not limited to boron nitride and graphite.
[0087] Preferably, the diffusion welding processing conditions in step S4 are as follows: welding temperature: 530-1100°C; welding pressure: 4-20 MPa; welding time: 240-480 min; welding environment: argon protection or vacuum greater than 6×10 -2 Pa.
[0088] Preferably, the molding pressure in step S5 is 30-150 MPa.
[0089] Preferably, the mold in step S5 includes a mold upper plate 8 and a mold lower plate 9 from top to bottom, the liquid-cooled plate blank is located between the mold upper plate 8 and the mold lower plate 9, and liquid filling nozzles 11 adapted to the liquid filling ports reserved for the liquid-cooled plate blank are installed on the left and right sides of the mold lower plate 9. A mold flushing channel 10 adapted to the above-mentioned cooling channel 5 is opened on the mold lower plate 9 directly below the cooling channel 5 on the cooling plate 4, and the cooling channel 5 fits the mold flushing channel 10 during molding.
[0090] Preferably, in step S9, argon arc welding or brazing is used to seal the reserved liquid filling port of the liquid-cooling plate blank; in step S9, argon arc welding, laser welding or brazing is used to weld the inlet nozzle 2 and the outlet nozzle 3.
[0091] The first embodiment of the present invention:
[0092] The liquid cooling plate has an internal hollow structure and is divided into a cover plate 1 and a cooling plate 4. Figure 2 and Figure 3As shown. The cover plate 1 and the cooling plate 4 are both flat blanks before processing, and are made by punching or laser cutting. The corresponding hollow parts inside are brushed or printed with solder resist and other materials, and then buckled based on the shape, and formed into a whole by diffusion welding. Then, along the reserved liquid filling port, the internal hollow part is liquid expanded by the liquid filling molding process, and finally the shape excess is removed by punching or laser cutting, and then the inlet nozzle 2 and the outlet nozzle 3 are welded and leak detection is performed.
[0093] 1. Preparation of cover plate and cooling plate blanks
[0094] The rolled sheet is cut by laser or punched out, leaving a certain process margin for the shape.
[0095] 2. Surface pretreatment
[0096] Remove burrs or spatters on the edges of blanks cut by punching or laser cutting, and then remove the oxide layer on the surface of the sheet by pickling, alkali washing, etc.
[0097] 3. Solder mask treatment
[0098] By means of template or glue engraving, solder resist is applied to the area of the cover plate and the cooling plate corresponding to the cooling channel. The solder resist materials include boron nitride, graphite, etc. The solder resist is shown in the figure below. Figure 5 and 6 .
[0099] 4. Diffusion welding
[0100] The cover plate and the cooling plate are buckled together to form a liquid cooling plate blank, and solder resist is evenly applied on the upper and lower surfaces to prevent adhesion to the tooling and parts during welding. Multiple layers can be placed in one furnace. Then the liquid cooling plate blank is loaded into the diffusion welding equipment, in the center of the main cylinder or pressure head of the equipment, and the monitoring thermocouple is placed in the center of the part or tooling to start welding. Different parameters are set according to different materials, and diffusion welding is completed at a certain temperature, pressure, time, environment (vacuum or inert gas protection), etc.
[0101] The following are some commonly used welding parameters for materials:
[0102] 1) 3 series aluminum alloy (taking 3003 as an example), welding temperature: 580~600℃; welding pressure: 6~10MPa; welding time: 360~480min; welding environment: argon protection or vacuum degree greater than 6×10-2Pa.
[0103] 2) 5 series aluminum alloy (taking 5A06 as an example), welding temperature: 560℃; welding pressure: 4~6MPa; welding time: 240~360min; welding environment: argon protection or vacuum degree greater than 6×10-2Pa.
[0104] 3) 6 series aluminum alloy (taking 6061 as an example), welding temperature: 530~550℃; welding pressure: 4~6MPa; welding time: 240~360min; welding environment: argon protection or vacuum degree greater than 6×10-2Pa.
[0105] 4) 304 stainless steel, welding temperature: 1040 ~ 1060 ℃; welding pressure: 15 ~ 20MPa; welding time: 240 ~ 360min; welding environment: argon protection or vacuum greater than 6 × 10-2Pa.
[0106] 5) 316 stainless steel, welding temperature: 1080 ~ 1100 ℃; welding pressure: 15 ~ 20MPa; welding time: 240 ~ 360min; welding environment: argon protection or vacuum greater than 6 × 10-2Pa.
[0107] 6) Red copper, welding temperature: 940~960℃; welding pressure: 4~6MPa; welding time: 240~360min; welding environment: argon protection or vacuum degree greater than 6×10-2Pa.
[0108] 7) Titanium alloy (taking TA1 as an example), welding temperature: 880~900℃; welding pressure: 4~6MPa; welding time: 240~360min; welding environment: argon protection or vacuum degree greater than 6×10-2Pa.
[0109] 5. Liquid filling molding
[0110] The liquid-cooling plate blank is clamped and positioned using a liquid-filling molding machine and a liquid-expansion tooling. The liquid-filling molding machine or tooling is equipped with a liquid-filling interface. Liquid is filled into the liquid-cooling plate blank through the reserved liquid-filling port (weld resist treatment is performed here before welding) to form the cooling channel and fit the mold surface. The pressure is generally 30 to 150 MPa (the pressure depends on the material and plate thickness). The liquid-filling pressure matches the pressure of the liquid-filling molding machine, that is, the internal pressure of the liquid-cooling plate should be less than the pressure applied by the pressure platform of the liquid-filling molding machine. See the liquid-filling mold. Figure 7 and 8 .
[0111] The following are some common material filling molding parameters:
[0112] 1) 3 series aluminum alloy (taking 3003 as an example), the sheet thickness is 1mm, the forming pressure is 40-100Mpa, and the forming time is 2-5min.
[0113] 2) 5 series aluminum alloy (taking 5A06 as an example), the plate thickness is 1mm, the forming pressure is 40-100Mpa, and the forming time is 2-5min.
[0114] 3) 6 series aluminum alloy (taking 6061 as an example), the sheet thickness is 1mm, the forming pressure is 40-100Mpa, and the forming time is 2-5min.
[0115] 4) 304 stainless steel, plate thickness is 1mm, forming pressure is 60~120Mpa, and forming time is 3~5min.
[0116] 5) 316 stainless steel, plate thickness is 1mm, forming pressure is 80~150Mpa, and forming time is 3~5min.
[0117] 6) Red copper, the plate thickness is 1mm, the forming pressure is 60-80Mpa, and the forming time is 3-5min.
[0118] 7) Titanium alloy (taking TA1 as an example), the plate thickness is 1mm, the forming pressure is 80-150Mpa, and the forming time is 5-10min.
[0119] 6. Shape processing
[0120] Use cutting methods such as punching die or laser cutting to remove the excess of the blank shape and remove impurities such as edge burrs.
[0121] 7. Make inlet and outlet holes
[0122] The cooling inlet and outlet are made by drilling and milling on the flat side of the liquid cooling plate, and burrs are removed and excess materials are cleaned.
[0123] 8. Cleaning and drying
[0124] Connect the cleaning equipment, clean the inner and outer surfaces of the parts with degreaser water, and dry them.
[0125] 9. Seal the filling port
[0126] The liquid filling port is sealed by argon arc welding, brazing, etc.
[0127] 10. Welding inlet and outlet nozzles
[0128] The inlet and outlet nozzles connected to the radiator are welded to the inlet and outlet holes of the liquid cooling plate, which can be done by argon arc welding, laser welding, brazing, etc.
[0129] 11. Leak detection
[0130] Connect the inlet and outlet nozzles at the inlet and outlet holes, and use hydraulic or airtight methods to detect the reliability of the welds at various locations on the liquid cooling plate.
[0131] 12. Surface treatment
[0132] The surface of the liquid cooling plate is sandblasted or otherwise treated, the surface condition is required to be uniform, and the surface of the energy storage cell is insulated.
[0133] The present invention can ensure that the welding quality of the liquid cooling plate for energy storage is reliable and the corrosion resistance is good, and is applicable to large-scale and batch production.
[0134] The production process of the present invention is relatively environmentally friendly and can greatly reduce the risks of chemicals to the environment and workers' health during the welding process.
[0135] The present invention can be applied to the processing and use of liquid cooling plates including but not limited to aluminum and aluminum alloys, stainless steel, copper and copper alloys, titanium and titanium alloys, etc.
[0136] The present invention is also applicable to the interface form of the coolant in the side-opening structure.
[0137] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.
[0138] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0139] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.
Claims
1. A method for manufacturing a liquid cooling plate for energy storage, the liquid cooling plate comprising, from top to bottom, a cover plate (1) and a cooling plate (4), an inlet nozzle (2) and an outlet nozzle (3) are respectively installed on both sides of a diagonal line on the cover plate (1), a cooling channel (5) is opened on the cooling plate (4), and the inlet nozzle (2) and the outlet nozzle (3) are respectively connected to the inlet and outlet holes of the cooling channel (5); Features: The manufacturing method of the liquid cooling plate comprises the following steps in sequence: Step S1, blank preparation: Cutting the rolled cover plate (1) and cooling plate (4) into blanks; Step S2: surface pretreatment: Removing burrs or spatters from the edge cover plate (1) and the cooling plate (4) after cutting, and then removing the oxide layer on the surface of the cover plate (1) and the cooling plate (4); Step S3, solder mask processing: Coating a solder resist on a second solder resist area (7) at a cooling channel (5) of the cooling plate (4) and a first solder resist area (6) of the cover plate (1) directly above the second solder resist area (7); Step S4: diffusion welding: The cover plate (1) and the cooling plate (4) are buckled together to form a liquid cooling plate blank, solder resist is evenly applied on the upper and lower surfaces of the liquid cooling plate blank and the reserved liquid filling port of the liquid cooling plate blank, and then the liquid cooling plate blank is placed in a diffusion welding device for diffusion welding; Step S5, liquid filling and molding: A liquid-filling molding machine and a liquid expansion tool are used to clamp and position the liquid-cooled plate blank, and a liquid-filling interface is provided on the liquid-filling molding machine or the hydraulic tool. Liquid is filled into the liquid-cooled plate blank through the liquid-filling port reserved for the liquid-cooled plate blank so that the cooling channel (5) is formed and fits the mold forming surface; Step S6: shape processing: Remove the excess of the liquid cooling plate blank and remove the edge burrs; Step S7, making inlet and outlet holes: The cooling inlet and outlet holes are drilled and milled on the flat side of the liquid cooling plate blank, and the burrs are removed and the excess debris is cleaned; Step S8, cleaning and drying: Clean the inner and outer surfaces of the parts with degreaser water and dry them; Step S9, sealing the liquid filling port: The reserved filling port of the liquid cooling plate blank is sealed by welding; Step S10, welding the inlet and outlet nozzles: An inlet nozzle (2) and an outlet nozzle (3) connected to the radiator are respectively welded to the inlet and outlet holes of the liquid cooling plate blank.
2. A method for manufacturing a liquid cooling plate for energy storage according to claim 1, It is characterized in that The method also includes step S11, leak detection: connecting the inlet nozzle (2) and the outlet nozzle (3), and using a hydraulic or airtight method to detect the reliability of the welds at various locations of the liquid cooling plate.
3. A method for manufacturing a liquid cooling plate for energy storage according to claim 1, It is characterized in that The method also includes step S12, surface post-treatment: the surface of the liquid cooling plate is subjected to sandblasting treatment, the surface state is required to be uniform, and the surface of the energy storage cell is subjected to insulation treatment.
4. A method for manufacturing a liquid cooling plate for energy storage according to claim 1, It is characterized in that In the step S1 and the step S6, laser cutting or punching is adopted.
5. A method for manufacturing a liquid cooling plate for energy storage according to claim 1, It is characterized in that In step S2, the oxide layer on the surface of the cover plate (1) and the cooling plate (4) is removed by acid washing or alkali washing or a combination of the two.
6. A method for manufacturing a liquid cooling plate for energy storage according to claim 1, It is characterized in that In the step S3, the solder resist is applied by using a template or a glue-coated pattern, and the solder resist includes but is not limited to boron nitride and graphite.
7. A method for manufacturing a liquid cooling plate for energy storage according to claim 1, It is characterized in that The diffusion welding processing conditions in step S4 are as follows: welding temperature: 530-1100°C; welding pressure: 4-20 MPa; welding time: 240-480 min; welding environment: argon protection or vacuum greater than 6×10 -2 Pa.
8. A method for manufacturing a liquid cooling plate for energy storage according to claim 1, It is characterized in that The molding pressure in step S5 is 30-150 MPa.
9. A method for manufacturing a liquid cooling plate for energy storage according to claim 1, It is characterized in that The mold in step S5 includes, from top to bottom, a mold upper plate (8) and a mold lower plate (9), the liquid-cooled plate blank is located between the mold upper plate (8) and the mold lower plate (9), and liquid filling nozzles (11) adapted to the liquid filling ports reserved for the liquid-cooled plate blank are installed on both left and right sides of the mold lower plate (9), and a mold flushing channel (10) adapted to the above-mentioned cooling channel (5) is opened on the mold lower plate (9) directly below the cooling channel (5) on the cooling plate (4), and the cooling channel (5) fits the mold flushing channel (10) during molding.
10. A method for manufacturing a liquid cooling plate for energy storage according to claim 1, It is characterized in that In step S9, argon arc welding or brazing is used to seal the reserved liquid filling port of the liquid cooling plate blank; in step S9, argon arc welding, laser welding or brazing is used to weld the inlet nozzle (2) and the outlet nozzle (3).
Citation Information
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