Device and method for detecting X-axis, Y-axis and Z-axis positioning accuracy and repeated positioning of full-automatic microscopic imager

Abstract

The invention discloses an XYZ-axis positioning precision and repeated positioning detection device and method for a full-automatic microscopic imager, and relates to the technical field of instrument detection, and the device comprises an XYZ precision testing instrument, a clamp, an objective table, imaging equipment and a controller. A plurality of imaging display elements are arranged on the XYZ precision testing instrument, the XYZ precision testing instrument is clamped on the clamp, the clamp is horizontally arranged on the objective table, the imaging equipment performs XYZ-axis movement relative to the objective table, the imaging equipment is in signal connection with the controller, and the controller is in signal connection with the XYZ precision testing instrument. The imaging device collects position data of the imaging display elements, and the controller receives the position data of the multiple imaging display elements and detects repeated positioning accuracy. The method is simple to operate, real-time and efficient, and reports can be output; and the positioning precision and the repeated positioning precision of the X axis, the Y axis and the Z axis of the full-automatic microscopic imager can be detected and evaluated without maintenance or professional skills.

Description

Technical Field

[0001] The present invention relates to the technical field of instrument detection, and more particularly to a device and method for detecting the positioning accuracy and repeated positioning of an XYZ axis of a fully automatic microscopic imaging device. Background Art

[0002] At present, the fully automatic microscopic imaging instruments in the existing technology can perform microscopic imaging of a single specimen of a large area or a single pair of different specimens arranged on the stage, thanks to its large-stroke stage. The core of the stage is the XYZ three-axis automatic control. How to detect the positioning accuracy and repeatability of the XYZ axis and evaluate its performance has become an indispensable part of the overall performance of this type of instrument. Whether it is the factory test of the instrument or the performance test and calibration of the instrument after a period of use, the positioning accuracy and repeatability of the XYZ axis need to be tested and evaluated.

[0003] The existing methods for detecting the positioning accuracy and repeatability of the XYZ axes are basically applicable to professional instruments, such as laser interferometers, laser rangefinders, coordinate measuring machines, etc. The equipment is expensive, complicated to operate, requires professional knowledge for calibration and measurement, and has high requirements for the environment (such as temperature, vibration control, etc.), and is complex to maintain. Generally, only professional testing organizations and measurement institutes have professional equipment.

[0004] Therefore, how to provide a fully automatic microscope imager XYZ axis positioning accuracy and repeatability detection device and method, which is simple to operate, real-time and efficient, and does not require maintenance or professional skills to detect and evaluate the positioning accuracy and repeatability of the XYZ axis of the fully automatic microscope imager is a problem that technical personnel in this field urgently need to solve. Summary of the invention

[0005] In view of this, the present invention provides a device and method for detecting the XYZ-axis positioning accuracy and repeatability of a fully automatic microscope imager. The device and method do not require other complex instruments or professional skills, but only simple tools to automatically perform detection and evaluation procedures, and test and evaluate the XYZ-axis positioning accuracy and repeatability of the fully automatic microscope imager.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a fully automatic microscope imager XYZ axis positioning accuracy and repeat positioning detection device, comprising: an XYZ accuracy testing instrument, a fixture, a stage, an imaging device and a controller; a plurality of imaging display elements are arranged on the XYZ accuracy testing instrument, the XYZ accuracy testing instrument is clamped on the fixture, the fixture is horizontally arranged on the stage, the imaging device moves the XYZ axis relative to the stage, the imaging device is connected to the controller signal, the imaging device collects the position data of the imaging display element, and the controller receives the position data of the plurality of imaging display elements and detects the repeat positioning accuracy.

[0007] Preferably, the XYZ precision testing apparatus is a rectangular parallelepiped structure, and the length and width of the rectangular parallelepiped are the same as the length and width of the SBS orifice plate.

[0008] Preferably, the imaging display element is a cross-shaped mark, a C-shaped ruler or a standard circle, and the center point of the cross-shaped mark, the scale of the ruler or the center point of the standard circle serves as the positioning point.

[0009] Preferably, the controller receives position data of multiple imaging display elements and detects repeated positioning accuracy, including: determining a position to be tested, moving any two axes of the XYZ axes to the position to be tested, performing full-range automatic focusing on the imaging display element at the position to be tested, finding the focus of the imaging display element on the imaging device, locating the positions of any two axes according to the position of the XYZ precision testing device, and correcting the ROI area center of the imaging display element; repeating the test n times;

[0010] Calculate the center position of the ROI area of ​​the imaging display element, obtain the relative deviation of each test according to the Pythagorean theorem, and use the Bessel formula to calculate the final relative deviation and coefficient of variation;

[0011] The reference values ​​of standard deviation and coefficient of variation are preset by the automated detection software as the test standard. If the coefficient of variation is greater than the test standard, the repeatability accuracy does not meet the standard, and the automated detection software will prompt and provide a graphic report.

[0012] Preferably, the imaging device is a fully automatic microscopic imager.

[0013] Preferably, a method for detecting the XYZ axis positioning accuracy and repeatability of a fully automatic microscopic imaging instrument comprises:

[0014] Determine the location to be tested;

[0015] Move any two axes of the XYZ axes to the position to be tested, perform full-range automatic focusing on the imaging display element at the position to be tested, and find the focus of the imaging display element on the imaging device;

[0016] The positions of any two axes are located according to the position of the XYZ precision testing device, and the center of the ROI area of ​​the imaging display element is corrected;

[0017] Repeat the test n times. The i-th test is to move one of the two axes from the test position A0 to the random position A, and then move back to the test position A0. The center position of the ROI area of ​​the imaging display element is calculated as P. i (X i ,Y i ,Z i ), its XYZ axis data is (X i ,Y i ,Z i ) ; According to the Pythagorean theorem, the relative deviation of each test is obtained;

[0018] The final relative deviation and coefficient of variation were calculated using the Bessel formula;

[0019] The reference values ​​of standard deviation and coefficient of variation are preset in the automated testing software as the test standard;

[0020] If the coefficient of variation is greater than the test standard, the repeatability accuracy does not meet the standard, and the automated detection software will prompt and provide a graphic report.

[0021] Preferably, the ROI area center of the imaging display element is corrected, including:

[0022] Determine the center position of the ROI area of ​​the imaging display element;

[0023] Use the OpenCV open source visual library to convert each image into a grayscale image;

[0024] Perform edge detection on grayscale images;

[0025] Perform Hough transform on the edge binary image and calculate the center position of the ROI area;

[0026] The calculated center position is a pixel coordinate, which is converted to length units based on the number of microns per pixel.

[0027] Preferably, the corrected XYZ axis data A0 is used as the positioning position; the center position of the ROI area of ​​the imaging display element at the current position is calculated to be P0 (X0, Y0, Z0), and its XYZ axis data is (X0, Y0, Z0); and a suitable random position A is selected according to requirements.

[0028] Preferably, the random position A is configured as a unidirectional test or a multidirectional test. The unidirectional test is performed on the random position A at one side of the position to be tested A0, and the multidirectional test is performed on the random position A at both sides of the position to be tested A0.

[0029] Preferably, the final relative deviation and coefficient of variation are calculated using the Bessel formula, including:

[0030] The relative deviation S is expressed as:

[0031]

[0032] The coefficient of variation CV is expressed as:

[0033]

[0034] Among them, D i represents the relative deviation of the i-th test; Represents the average of the relative deviations of n tests.

[0035] It can be known from the above technical scheme that, compared with the prior art, the present invention discloses a device and method for detecting XYZ-axis positioning accuracy and repeat positioning of a fully automatic microscope imager, comprising: an XYZ accuracy testing apparatus, a fixture, a stage, an imaging device and a controller; a plurality of imaging display elements are arranged on the XYZ accuracy testing apparatus, the XYZ accuracy testing apparatus is clamped on the fixture, the fixture is horizontally arranged on the stage, the imaging device moves the XYZ axis relative to the stage, the imaging device is connected to the controller signal, the imaging device collects the position data of the imaging display element, the controller receives the position data of the plurality of imaging display elements and detects the repeat positioning accuracy.

[0036] The present invention has the following beneficial effects:

[0037] 1. No special instruments are required. The XYZ axis positioning accuracy and repeatability of the fully automatic microscopic imager can be tested and evaluated by using the fully automatic microscopic imager itself and simple instruments.

[0038] 2. Simple operation, automatic execution of procedures, high efficiency;

[0039] 3. Unmanned operation, no human error;

[0040] 4. The report can be exported to make the test reasonable and well-founded;

[0041] 5. Wide applicability. Any fully automatic microscopic imaging instrument with automatic XYZ axis can be realized by this instrument.

[0042] 6. Low cost and can be promoted on a large scale. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0044] Figure 1 Schematic diagram of an XYZ precision testing apparatus provided in an embodiment of the present invention.

[0045] FIG. 2( a ) is a schematic diagram of a microscopic image of a crosshair captured by a fully automatic microscopic imaging device provided in an embodiment of the present invention.

[0046] FIG2( b ) is a schematic diagram of a microscopic image of a C-shaped ruler taken by the fully automatic microscopic imaging device provided in an embodiment of the present invention.

[0047] FIG. 2( c ) is a schematic diagram of a microscopic image of a standard circle taken by the fully automatic microscopic imaging device provided in an embodiment of the present invention.

[0048] FIG3( a ) is a diagram showing the first imaging effect of fixing the YZ axis of the fully automatic microscopic imaging instrument provided by an embodiment of the present invention, and only moving the X axis and returning to the point set by the instrument.

[0049] FIG3( b ) is a diagram showing the second imaging effect of fixing the YZ axis of the fully automatic microscopic imaging instrument provided by an embodiment of the present invention, and only moving the X axis and returning to the point set by the instrument.

[0050] FIG3( c ) is a displacement diagram of fixing the YZ axis of the fully automatic microscopic imaging instrument provided by an embodiment of the present invention, and only moving the X axis and returning to the point set by the instrument.

[0051] FIG4( a ) is a diagram showing the first imaging effect of fixing the XZ axis of the fully automatic microscopic imaging instrument provided by an embodiment of the present invention, and only moving the Y axis and returning to the point set by the instrument.

[0052] FIG4( b ) is a diagram showing the second imaging effect of fixing the XZ axis of the fully automatic microscopic imaging device provided by an embodiment of the present invention, and only moving the Y axis and returning to the point set by the instrument.

[0053] FIG4( c ) is a schematic diagram of the displacement of fixing the XZ axis of the fully automatic microscopic imaging instrument provided by an embodiment of the present invention, and only moving the Y axis and returning to the point set by the instrument.

[0054] FIG5( a ) is a diagram showing the first imaging effect of fixing the Z axis of the fully automatic microscopic imaging instrument provided by an embodiment of the present invention, moving the XY axis and returning to the point set by the instrument.

[0055] FIG5( b ) is a diagram showing the second imaging effect of fixing the Z axis of the fully automatic microscopic imaging instrument provided by an embodiment of the present invention, moving the XY axis and returning to the point set by the instrument.

[0056] FIG5( c ) is a schematic diagram of the displacement of fixing the Z axis of the fully automatic microscopic imaging instrument provided by an embodiment of the present invention, moving the XY axis and returning to the point set by the instrument.

[0057] FIG6( a ) is a diagram showing the first imaging effect of an embodiment of the present invention in which no axis is fixed, the XYZ axes are moved and returned to the point set by the instrument.

[0058] FIG6( b ) is a diagram showing the second imaging effect of an embodiment of the present invention in which no axis is fixed, the XYZ axes are moved and returned to the point set by the instrument.

[0059] FIG6( c ) is a schematic diagram of displacement provided by an embodiment of the present invention, in which no axis is fixed, the XYZ axes are moved, and the displacement returns to the point set by the instrument.

[0060] Figure 7 A schematic diagram of a process for calculating the center position of a cross-mark provided in an embodiment of the present invention.

[0061] Figure 8 A flowchart of a single test of fixing the YZ axis and moving the X axis provided in an embodiment of the present invention.

[0062] Fig. 9 A schematic diagram of raw data of X-axis repeatability test results provided in an embodiment of the present invention.

[0063] Fig.10 A schematic diagram of the original data of the Y-axis repeatability positioning accuracy test results provided in an embodiment of the present invention.

[0064] Fig.11 A schematic diagram of raw data of XY axis repeatability test results provided in an embodiment of the present invention.

[0065] Fig.12 A schematic diagram of raw data of XYZ axis repeatability test results provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0066] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0067] The embodiment of the present invention discloses a device and method for detecting the XYZ axis positioning accuracy and repeatability of a fully automatic microscopic imager. The device and method do not require other complex instruments or professional skills, but only simple tools to automatically perform detection and evaluation procedures, and test and evaluate the XYZ axis positioning accuracy and repeatability of the fully automatic microscopic imager.

[0068] Specifically, an embodiment of the present invention discloses an XYZ-axis positioning accuracy and repeatability detection device for a fully automatic microscope imager, comprising: an XYZ accuracy testing apparatus, a fixture, a stage, an imaging device and a controller; a plurality of imaging display elements are arranged on the XYZ accuracy testing apparatus, the XYZ accuracy testing apparatus is clamped on the fixture, the fixture is horizontally arranged on the stage, the imaging device performs XYZ-axis movement relative to the stage, the imaging device is connected to the controller signal, the imaging device collects position data of the imaging display elements, and the controller receives the position data of the plurality of imaging display elements and detects repeatability accuracy.

[0069] Specifically, the XYZ precision testing device is a rectangular parallelepiped structure, and the length and width of the rectangular parallelepiped are the same as the length and width of the SBS orifice plate.

[0070] Specifically, the imaging display element is a cross-mark, a C-shaped ruler or a standard circle, and the center point of the cross-mark, the scale of the ruler or the center of the standard circle is used as the positioning point.

[0071] Specifically, the controller receives position data of multiple imaging display elements and detects repeated positioning accuracy, including: determining a position to be tested, moving any two axes of the XYZ axis to the position to be tested, performing full-range automatic focusing on the imaging display element at the position to be tested, finding the focus of the imaging display element on the imaging device, locating the positions of any two axes according to the position of the XYZ precision testing device, and correcting the ROI area center of the imaging display element; repeating the test n times;

[0072] Calculate the center position of the ROI area of ​​the imaging display element, obtain the relative deviation of each test according to the Pythagorean theorem, and use the Bessel formula to calculate the final relative deviation and coefficient of variation;

[0073] The reference values ​​of standard deviation and coefficient of variation are preset by the automated detection software as the test standard. If the coefficient of variation is greater than the test standard, the repeatability accuracy does not meet the standard, and the automated detection software will prompt and provide a graphic report.

[0074] Specifically, the imaging device is a fully automatic microscopic imager.

[0075] Currently, all the fully automatic microscopic imagers on the market can image SBS standard well plates, so a special instrument can be designed using the SBS well plate fixture of the fully automatic microscopic imager for testing the XYZ axis positioning accuracy and repeatability. If there is no SBS well plate fixture, other fixtures can also be used. As long as the fully automatic microscopic imager can move the XYZ axis, it is applicable. Since the SBS well plate has a wide range of applications, the size design and placement of the SBS well plate fixture are preferred. The SBS standard is an internationally used laboratory spare parts standard. Laboratory spare parts that meet the SBS standard, such as cell culture well plates, are compatible with most instruments and automation equipment.

[0076] like Figure 1 The figure shows the structure of the XYZ axis precision tester. On a thin rectangular block (can be plastic or other metal materials) the size of the SBS orifice plate, 9 positions are set as positioning points. In order to expand the applicability and convenience of the instrument, the positioning points use the most common tools such as C-shaped rulers, cross marks or standard circles. The length and width of the instrument are known (SBS standard), and the XY axis values ​​of the center points of the 9 positioning points are known. Figure 1 The marked XY axis directions can be divided into three groups in the X axis direction, namely abc, def, ghi, and can also be divided into three groups in the Y axis direction; it can also be divided into at least three groups on the XY axis plane, namely db, gec, hf, or bf, aei, dh. The number of points can be more or less, not necessarily 9, and can be increased or decreased according to actual conditions. The purpose of grouping is to test multiple groups of data under more stringent test conditions.

[0077] As shown in Figure 2(a), this is a microscopic image of a cross-marked line taken by the fully automatic microscopic imager provided in an embodiment of the present invention; Figure 2(b) is a microscopic image of a C-shaped ruler taken by the fully automatic microscopic imager provided in an embodiment of the present invention; Figure 2(c) is a microscopic image of a standard circle taken by the fully automatic microscopic imager provided in an embodiment of the present invention.

[0078] Taking the crosshairs as an example, the core theory of the embodiment of the present invention is: the device is placed on the stage of the fully automatic microscope imager, and the fully automatic microscope imager performs crosshair imaging at the location where the crosshairs are located (the XYZ axis position considered by the instrument), and then randomly moves to other positions, and then returns to this position. Due to the problem of repeated positioning accuracy, the position of the crosshairs in this imaging may be different from the previous position (that is, the actual XYZ axis). A specific algorithm is used to identify the intersection position of the crosshairs of the two images, and the pixels between the two center points are calculated and converted into actual lengths. The displacement (the difference between the XYZ axis considered by the imager and the actual XYZ axis) can be calculated. Repeating the above imaging multiple times, the Bessel formula can be used to calculate the relative deviation and coefficient of variation.

[0079] According to this theory, by fixing any two axes of XYZ and only moving the other axis, the unidirectional positioning accuracy, bidirectional positioning accuracy, unidirectional repeat positioning accuracy, and bidirectional repeat positioning accuracy of the other axis can be detected. For example, FIG3(a) is a first imaging effect diagram of a fixed YZ axis of a fully automatic microscopic imaging device provided in an embodiment of the present invention, in which only the X axis is moved and the device is returned to the point set by the device; FIG3(b) is a second imaging effect diagram of a fixed YZ axis of a fully automatic microscopic imaging device provided in an embodiment of the present invention, in which only the X axis is moved and the device is returned to the point set by the device; FIG3(c) is a second imaging effect diagram of a fixed YZ axis of a fully automatic microscopic imaging device provided in an embodiment of the present invention, in which only the X axis is moved and the device is returned to the point set by the device; A schematic diagram of the displacement of the YZ axis of the fully automatic microscopic imager, which only moves the X axis and returns to the point set by the instrument; FIG4(a) is a first imaging effect diagram of the fixed XZ axis of the fully automatic microscopic imager provided in an embodiment of the present invention, which only moves the Y axis and returns to the point set by the instrument; FIG4(b) is a second imaging effect diagram of the fixed XZ axis of the fully automatic microscopic imager provided in an embodiment of the present invention, which only moves the Y axis and returns to the point set by the instrument; FIG4(c) is a schematic diagram of the displacement of the fixed XZ axis of the fully automatic microscopic imager provided in an embodiment of the present invention, which only moves the Y axis and returns to the point set by the instrument.

[0080] By fixing any one axis, the repeat positioning accuracy after the superposition of the other two axes can be detected and calculated. For example, FIG5(a) is a first imaging effect diagram of fixing the Z axis of the fully automatic microscopic imager provided in an embodiment of the present invention, moving the XY axis and returning to the point set by the instrument; FIG5(b) is a second imaging effect diagram of fixing the Z axis of the fully automatic microscopic imager provided in an embodiment of the present invention, moving the XY axis and returning to the point set by the instrument; and FIG5(c) is a displacement schematic diagram of fixing the Z axis of the fully automatic microscopic imager provided in an embodiment of the present invention, moving the XY axis and returning to the point set by the instrument.

[0081] If XYZ are not fixed, the repeat positioning accuracy after the three-axis superposition can be detected and calculated. Figure 6(a) is a first imaging effect diagram of an embodiment of the present invention in which no axis is fixed, the XYZ axis is moved and returned to the point set by the instrument; Figure 6(b) is a second imaging effect diagram of an embodiment of the present invention in which no axis is fixed, the XYZ axis is moved and returned to the point set by the instrument; Figure 6(c) is a displacement schematic diagram of an embodiment of the present invention in which no axis is fixed, the XYZ axis is moved and returned to the point set by the instrument.

[0082] Since the bidirectional repeatability positioning accuracy has the greatest impact on the performance of the instrument and the actual imaging in actual applications, all tests in the embodiments of the present invention only describe the bidirectional repeatability positioning accuracy, which is referred to as repeatability positioning accuracy.

[0083] like Figure 7The figure shows the flow chart of calculating the center position of the cross-marked lines. The image with the cross-marked lines is converted into a grayscale image using the OpenCV open source visual library. The grayscale image is then subjected to edge detection. The image with the edge binarized is subjected to Hough line transform to find the straight lines in the image. The intersection points of the straight lines in the image are calculated. The cross-marked lines in the image have a certain width. The edge detection will result in the intersection points of four straight lines. The center positions of the four points are calculated as the intersection points of the cross-marked lines. The intersection points calculated using OpenCV are pixel coordinates. The intersection points are converted into length units based on the number of microns per pixel.

[0084] Specifically, the embodiment of the present invention discloses a method for detecting the positioning accuracy and repeatability of an XYZ axis of a fully automatic microscopic imaging device, comprising:

[0085] Determine the location to be tested;

[0086] Move any two axes of the XYZ axes to the position to be tested, perform full-range automatic focusing on the imaging display element at the position to be tested, and find the focus of the imaging display element on the imaging device;

[0087] The positions of any two axes are located according to the position of the XYZ precision testing device, and the imaging display element is not centered on the imaging device, and the ROI area center of the imaging display element is corrected;

[0088] Repeat the test n times. The i-th test is to move one of the two axes from the test position A0 to the random position A, and then move back to the test position A0. The center position of the ROI area of ​​the imaging display element is calculated as P. i (X i ,Y i ,Z i ), its XYZ axis data is (X i ,Y i ,Z i ) ; According to the Pythagorean theorem, the relative deviation of each test is obtained;

[0089] The final relative deviation and coefficient of variation were calculated using the Bessel formula;

[0090] The reference values ​​of standard deviation and coefficient of variation are preset in the automated testing software as the test standard;

[0091] If the coefficient of variation is greater than the test standard, the repeatability accuracy does not meet the standard, and the automated detection software will prompt and provide a graphic report.

[0092] The graphic report includes the deviation value, maximum deviation, coefficient of variation, etc. of each test, so as to guide the test personnel to adjust or correct the instrument; at the same time, the graphic report may also include information such as the test time, test personnel, instrument model, serial number, etc., so as to be displayed to the instrument owner or relevant personnel and kept as a test record.

[0093] Specifically, the ROI area center of the imaging display element is corrected, including:

[0094] Determine the center position of the ROI area of ​​the imaging display element;

[0095] Use the OpenCV open source visual library to convert each image into a grayscale image;

[0096] Perform edge detection on grayscale images;

[0097] Perform Hough transform on the edge binary image to calculate the center position of the ROI area; find the straight line in the image;

[0098] Calculate the intersection points of the straight lines. The cross marks in the image have a certain width. Edge detection will have four intersection points of the straight lines. The center position of the four points is the intersection point of the cross marks.

[0099] The center position calculated using OpenCV is in pixel coordinates. Based on the number of microns per pixel, the center position is converted into length units.

[0100] Specifically, when performing edge detection on a grayscale image, you can use various clarity algorithms provided by OpenCV, such as scharr, sobel, laplacian, blur, canny, etc. According to the image clarity calculation algorithm provided by OpenCV, you can obtain the corresponding clarity of the image, or the focus algorithm provided by the microscope imager or developed by the microscope imager manufacturer.

[0101] Specifically, the corrected XYZ axis data A0 is used as the positioning position; the ROI area center position of the imaging display element at the current position is calculated to be P0 (X0, Y0, Z0), and its XYZ axis data is (X0, Y0, Z0); and a suitable random position A is selected according to requirements.

[0102] Specifically, the random position A is configured as a unidirectional test or a multidirectional test. The unidirectional test is performed on one side of the position A0 to be tested at the random position A, and the multidirectional test is performed on both sides of the position A0 to be tested at the random position A.

[0103] Specifically, the final relative deviation and coefficient of variation are calculated using the Bessel formula, including:

[0104] The relative deviation S is expressed as:

[0105]

[0106] The coefficient of variation CV is expressed as:

[0107]

[0108] Among them, D i represents the relative deviation of the i-th test; Represents the average of the relative deviations of n tests.

[0109] Specifically, the relative deviation of each test is expressed as:

[0110]

[0111] The average relative deviation It is expressed as:

[0112]

[0113] Specifically, the imaging display element is a cross mark, a C-shaped ruler or a standard circle.

[0114] In a specific embodiment of the present invention, Figure 8 As shown in the figure, it is a single test flow chart with fixed YZ axis and moving X axis. Figure 1 A schematic diagram of a well plate is provided, and a position to be tested is selected from the schematic diagram of the well plate. The XY axis is moved to the position to be tested, and the imaging display element at the position, which may be a cross mark, a C-shaped ruler or a standard circle, is fully automatically focused on the imaging display element to find the focus of the imaging display element on the imaging device; the position of the above XY axis is positioned according to the selected well plate position, and the imaging display element is not centered on the imaging device, and the ROI area center of the imaging display element needs to be corrected, and the corrected XYZ axis data A0 is used as the positioning position; the ROI area center position of the imaging display element at the current position is calculated as P0 (X0, Y0, Z0), and its XYZ axis data is (X0, Y0, Z0); the random position A can be configured as a unidirectional or multidirectional test, and the unidirectional test is that the random position A is on one side of the position to be tested A0, and the multidirectional test is that the random position A is on both sides of the position to be tested A0, and the appropriate random position A is selected according to the needs. Repeat the test n times. The i-th test is to move the X axis from the test position A0 to a random position A, and then move back to the test position A0. The center position of the ROI area of ​​the calculated imaging display element is P. i (X i ,Y i ,Z i ) Its XYZ axis data is (X i ,Y i ,Z i); According to the Pythagorean theorem, the relative deviation Di of each test is:

[0115]

[0116] The average relative deviation

[0117]

[0118] Calculate the relative deviation S according to the Bessel formula:

[0119]

[0120] Coefficient of variation CV:

[0121]

[0122] Similarly, we can Figure 8 The flowchart is extended to fix the XZ axis and move the Y axis.

[0123] In the test process of fixing the Z axis and moving the XY axis, the random position A is not selected on a straight line, but on a plane. The test point divides the test surface of the loading platform of the fully automatic microscope imager into four quadrants, and the random position A is selected to move to the four quadrants.

[0124] In the test process without fixing any axis, the movement of XY axis is the same as that of fixed Z axis, except that Z axis is reset to the 0 position of Z axis while XY axis moves to the random position A. After XY axis moves to the positioning position, Z axis needs to be fully automatically focused. The Z axis data after focusing is used as the test data of Z axis.

[0125] Specifically, the XYZ precision testing device is a rectangular parallelepiped structure, and the length and width of the rectangular parallelepiped are the same as the length and width of the SBS orifice plate; a plurality of positioning points are arranged on the rectangular parallelepiped, and any one of the positioning points is selected as the position to be tested.

[0126] In a specific embodiment of the present invention, an automated detection process and software for XYZ precision testing equipment are designed:

[0127] (1) Test the repeatability of the X-axis:

[0128] Place the XYZ precision tester stably on the stage of the fully automatic microscopic imager, select a certain point as the test position, and clearly image it at this point, fix the Y-axis and Z-axis, move the X-axis to other positions (the test program can randomly move to the maximum and minimum positions of the X-axis), then move it to the test position, image it again, and repeat the above test n times. Take the X-axis position of the test position in the first picture as the reference position, calculate the X-axis displacement difference and offset of each test position, and calculate the standard deviation and coefficient of variation. The test software can have built-in reference values ​​of standard deviation and coefficient of variation as the test standard. If the coefficient of variation is greater than the test standard, the automated detection software will give a prompt that the X-axis repeat positioning accuracy of the instrument is not up to standard, and give a graphic report containing the deviation value, maximum deviation, coefficient of variation, etc. of each test, so as to guide the detection personnel to adjust or correct the instrument. At the same time, the report can also contain information such as the detection time, detection personnel, instrument model, serial number, etc., so as to show it to the instrument owner or relevant personnel and keep it as a detection record.

[0129] Fig. 9 The original data of the X-axis repeatability test results. The built-in standard of the report content is: repeat the test 100 times, the maximum deviation is ≤10um (reference standard 1) and the ratio of standard deviation to total stroke is ≤0.2‰ (reference standard 2) for qualified. Table 1 is the test results of one group.

[0130] Table 1

[0131] Test Results Average value(um) S(Standard Deviation) Maximum deviation(um) Reference standard 1(um) Stroke ratio(‰) Reference Standard 2 Eligibility X-axis 0.2194 0.11570 0.467 10.0 0.000‰ 0.20‰ qualified

[0132] (2) Test the repeatability of the Y-axis:

[0133] Place the XYZ precision tester stably on the stage of the fully automatic microscopic imaging instrument, select a certain point as the test position, and clearly image it at this point, fix the X-axis and Z-axis, move the Y-axis to other positions (the test program can randomly move to the maximum and minimum positions of the Y-axis), then move it to the test position, image it again, and repeat the above test n times. Take the Y-axis position of the test position in the first picture as the reference position, calculate the Y-axis displacement difference and offset of each test position, and calculate the standard deviation and coefficient of variation. The test software can have built-in reference values ​​of standard deviation and coefficient of variation as the test standard. If the coefficient of variation is greater than the test standard, the automated detection software will give a prompt that the X-axis repeat positioning accuracy of the instrument is not up to standard, and give a graphic report containing the deviation value, maximum deviation, coefficient of variation, etc. of each test, so as to guide the inspection personnel to adjust or correct the instrument. At the same time, the report can also contain information such as the inspection time, inspection personnel, instrument model, serial number, etc., so as to show it to the instrument owner or relevant personnel and keep it as a test record.

[0134] Fig.10This is an example of the original data and report content of the Y-axis repeatability test results. The built-in standard of the report of this example is: repeat the test 100 times, the maximum deviation is ≤10um (reference standard 1) and the ratio of standard deviation to total stroke is ≤0.2‰ (reference standard 2) to be qualified. Table 2 shows the test results of one group.

[0135] Table 2

[0136] Test Results Average value(um) S(Standard Deviation) Maximum deviation(um) Reference standard 1(um) Stroke ratio(‰) Reference Standard 2 Eligibility Y-axis 0.6873 0.27969 1.229 10.0 0.000‰ 0.20％0 qualified

[0137] (3) Test the repeatability of the XY axis:

[0138] Place the XYZ precision tester stably on the stage of the fully automatic microscopic imager, select a certain point as the test position, and clearly image it at this point, fix the Z axis, move the XY axis to other positions (the test program can randomly move to the maximum and minimum positions of the XY axis), then move it to the test position, image it again, and repeat the above test n times. Take the XY axis position of the test position in the first figure as the reference position, calculate the XY axis displacement difference and offset of each test position, and calculate the standard deviation and coefficient of variation. The test software can have built-in reference values ​​of standard deviation and coefficient of variation as the test standard. If the coefficient of variation is greater than the test standard, the automated detection software will give a prompt that the X-axis repeat positioning accuracy of the instrument is not up to standard, and give a graphic report containing the deviation value, maximum deviation, coefficient of variation, etc. of each test, so as to guide the detection personnel to adjust or correct the instrument. At the same time, the report can also contain information such as the detection time, detection personnel, instrument model, serial number, etc., so as to show it to the instrument owner or relevant personnel and keep it as a detection record.

[0139] Fig.11 This is an example of the original data and report content of the XY axis repeatability test results. The built-in standard of the report of this example is: divided into three groups, each group repeats the test 60 times, and each group is qualified if the maximum deviation is ≤10um (reference standard 1) and the ratio of standard deviation to total stroke is ≤0.2‰ (reference standard 2). Table 3 is the test result of one of the groups.

[0140] Table 3

[0141] Test Results Average value(um) S(Standard Deviation) Maximum deviation(um) Reference standard 1(um) Stroke ratio(‰) Reference Standard 2 Eligibility XY Offset 0.2395 0.13690 0.579 10.0 0.000％0 0.20‰ qualified

[0142] (4) Test the repeatability of the XYZ axis:

[0143] Place the XYZ precision tester stably on the stage of the fully automatic microscopic imager, select a certain point as the test position, and clearly image it at this point, move the XY axis to other positions (the test program can randomly move to the maximum and minimum positions of the XY axis), then move it to the test position, image it again, use the focus algorithm for imaging, record the Z-axis position of the clearest image, and repeat the above test n times. Take the XYZ coordinate position of the test position in the first figure as the reference position, calculate the XYZ displacement difference and offset of each test position, and calculate the standard deviation and coefficient of variation. The test software can have built-in reference values ​​of standard deviation and coefficient of variation as the test standard. If the coefficient of variation is greater than the test standard, the automated detection software will give a prompt that the X-axis repeat positioning accuracy of the instrument is not up to standard, and give a graphic report containing the deviation value, maximum deviation, coefficient of variation, etc. of each test, so as to guide the inspection personnel to adjust or correct the instrument. At the same time, the report can also contain information such as the inspection time, inspection personnel, instrument model, serial number, etc., so as to show it to the instrument owner or relevant personnel and keep it as a test record.

[0144] Fig.12 This is an example of the original data and report content of the XY axis repeatability test results. The built-in standard of the report of this example is: divided into three groups, each group repeats the test 60 times, and each group is qualified if the maximum deviation is ≤10um (reference standard 1) and the ratio of standard deviation to total stroke is ≤0.2‰ (reference standard 2). Table 4 shows the test results of one of the groups.

[0145] Table 4

[0146] Test Results Average value(um) S(Standard Deviation) Maximum deviation(um) Reference standard 1(um) Stroke ratio(‰) Reference Standard 2 Eligibility XYZ Offset 0.5248 0.30134 1.760 10.0 0.000‰ 0.20‰ qualified

[0147] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0148] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A fully automatic microscopic imaging instrument XYZ axis positioning accuracy and repeatability detection device, characterized in that: include: An XYZ precision testing apparatus, a fixture, a stage, an imaging device and a controller; a plurality of imaging display elements are arranged on the XYZ precision testing apparatus, the XYZ precision testing apparatus is clamped on the fixture, the fixture is horizontally arranged on the stage, the imaging device moves along the XYZ axis relative to the stage, the imaging device is connected to the controller by signal, the imaging device collects position data of the imaging display elements, the controller receives the position data of the plurality of imaging display elements and detects the repeat positioning accuracy.

2. The fully automatic microscopic imaging device XYZ axis positioning accuracy and repeat positioning detection device according to claim 1, characterized in that: The XYZ precision testing device is a rectangular parallelepiped structure, and the length and width of the rectangular parallelepiped are the same as the length and width of the SBS orifice plate.

3. The fully automatic microscopic imaging device XYZ axis positioning accuracy and repeat positioning detection device according to claim 1, characterized in that: The imaging display element is a cross-mark, a C-shaped ruler or a standard circle, and the center point of the cross-mark, the scale of the ruler or the center of the standard circle is used as the positioning point.

4. The fully automatic microscopic imaging device XYZ axis positioning accuracy and repeat positioning detection device according to claim 1, characterized in that: The controller receives position data of a plurality of imaging display elements and detects repeated positioning accuracy, including: determining a position to be tested, moving any two axes of the XYZ axes to the position to be tested, performing full-range automatic focusing on the imaging display element at the position to be tested, finding the focus of the imaging display element on the imaging device, locating the positions of any two axes according to the position of the XYZ precision testing device, and correcting the ROI area center of the imaging display element; repeating the test n times; Calculate the center position of the ROI area of ​​the imaging display element, obtain the relative deviation of each test according to the Pythagorean theorem, and use the Bessel formula to calculate the final relative deviation and coefficient of variation; The reference values ​​of standard deviation and coefficient of variation are preset by the automated detection software as the test standard. If the coefficient of variation is greater than the test standard, the repeatability accuracy does not meet the standard, and the automated detection software will prompt and provide a graphic report.

5. The fully automatic microscopic imaging device XYZ axis positioning accuracy and repeat positioning detection device according to claim 1, characterized in that: The imaging device is a fully automatic microscopic imager.

6. A method for detecting the positioning accuracy and repeatability of the XYZ axis of a fully automatic microscopic imaging instrument, characterized in that: include: Determine the location to be tested; Move any two axes of the XYZ axes to the position to be tested, perform full-range automatic focusing on the imaging display element at the position to be tested, and find the focus of the imaging display element on the imaging device; The positions of any two axes are located according to the position of the XYZ precision testing device, and the center of the ROI area of ​​the imaging display element is corrected; Repeat the test n times. The i-th test is to move one of the two axes from the test position A0 to the random position A, and then move back to the test position A0. The center position of the ROI area of ​​the imaging display element is calculated as P. i (X i ,Y i ,Z i ), its XYZ axis data is (X i ,Y i ,Z i ) ; According to the Pythagorean theorem, the relative deviation of each test is obtained; The final relative deviation and coefficient of variation were calculated using the Bessel formula; The reference values ​​of standard deviation and coefficient of variation are preset in the automated testing software as the test standard; If the coefficient of variation is greater than the test standard, the repeatability accuracy does not meet the standard, and the automated detection software will prompt and provide a graphic report.

7. A method for detecting the positioning accuracy and repeatability of XYZ axes of a fully automatic microscopic imaging device according to claim 6, characterized in that: Correct the ROI area center of the imaging display element, including: Determine the center position of the ROI area of ​​the imaging display element; Convert each image into a grayscale image; Perform edge detection on grayscale images; Perform Hough transform on the edge binary image and calculate the center position of the ROI area; The calculated center position is a pixel coordinate, which is converted to length units based on the number of microns per pixel.

8. A method for detecting the positioning accuracy and repeatability of XYZ axes of a fully automatic microscopic imaging device according to claim 6, characterized in that: The corrected XYZ axis data A0 is used as the positioning position; the center position of the ROI area of ​​the imaging display element at the current position is calculated to be P0 (X0, Y0, Z0), and its XYZ axis data is (X0, Y0, Z0); a suitable random position A is selected according to the requirements.

9. A method for detecting the positioning accuracy and repeatability of XYZ axes of a fully automatic microscopic imaging device according to claim 8, characterized in that: The random position A is configured as a unidirectional test or a multidirectional test. The unidirectional test is that the random position A is performed on one side of the position to be tested A0, and the multidirectional test is that the random position A is performed on both sides of the position to be tested A0.

10. A method for detecting the positioning accuracy and repeatability of XYZ axes of a fully automatic microscopic imaging device according to claim 9, characterized in that: The final relative deviation and coefficient of variation are calculated using the Bessel formula, including: The relative deviation S is expressed as: The coefficient of variation CV is expressed as: Among them, D i represents the relative deviation of the i-th test; Represents the average of the relative deviations of n tests.

Images