Carrier for bearing insulating material, insulating component and manufacturing method thereof

Abstract

The invention discloses a carrier for bearing an insulating material, an insulating assembly and a manufacturing method of the insulating assembly. The carrier comprises a first composite layer and a second composite layer which are arranged in a first direction. The first composite layer is provided with an opening, the opening is configured to contain an insulating material, and the opening penetrates through the first composite layer and extends to the surface of the second composite layer; the first composite layer comprises a first release layer, the first release layer is the outermost layer, away from the second composite layer, of the first composite layer in the first direction, and the first direction is the thickness direction of the carrier. The second composite layer comprises a second release layer, the second release layer is connected with the first composite layer, and the second release layer is exposed out of the opening. The bonding force between the insulating material in the external equipment and the carrier is reduced through the first release layer, the residual amount of the insulating material on the periphery of the opening is reduced, the second release layer is exposed out of the opening, so that the insulating material is in contact with the second release layer, and separation of the formed insulating part and the second release layer is facilitated.

Description

Technical Field

[0001] The present application relates to the field of energy storage technology, and in particular to a carrier for carrying insulating materials, an insulating component and a manufacturing method thereof. Background Art

[0002] At present, insulating glue is usually directly coated on products, such as pole pieces. During the process of winding and unwinding the product, the insulating parts stick to each other due to the squeezing of the winding tension, which affects the insulation effect. During the die-cutting process of the product, the die-cutting knife sticks frequently due to the squeezing between the die-cutting knife and the insulating parts. A large amount of glue stains remain on the surface of the die and leave imprints on the surface of the product. In addition, the bonding force between the die and the insulating parts is greater than the strength of the pole piece itself, resulting in a large amount of glue filaments on the product. Summary of the invention

[0003] In view of this, it is necessary to provide a carrier for carrying insulating materials, an insulating assembly and a manufacturing method thereof, so as to facilitate the pasting of insulating parts.

[0004] The embodiment of the present application provides a carrier for carrying insulating materials, including a first composite layer and a second composite layer arranged along a first direction. The first composite layer is provided with an opening, the opening is configured to accommodate insulating materials, the opening penetrates the first composite layer, and extends to the surface of the second composite layer. The first composite layer includes a first release layer, and along the first direction, the first release layer is the outermost layer of the first composite layer away from the second composite layer, and the first direction is the thickness direction of the carrier. The second composite layer includes a second release layer, the second release layer is connected to the first composite layer, and the second release layer is exposed at the opening. The insulating material is injected into the opening through an external device, and the insulating material is cooled to form an insulating part. The present application reduces the adhesion between the insulating material in the external device and the carrier through the first release layer, reduces the residual insulating material around the opening, and exposes the insulating material to the opening through the second release layer, so that the insulating material contacts the second release layer, which is conducive to the separation of the insulating part and the second release layer after molding.

[0005] In one or more of the above optional embodiments, the release force of the first release layer is F1,3g / 25mm≤F1≤300g / 25mm. In this way, the adhesion between the insulating material and the carrier in the external device can be better reduced, the residual insulating material around the opening can be reduced, and the winding is facilitated.

[0006] In one or more optional embodiments above, the first composite layer includes a first base layer connected to the first release layer, the first release layer and the first base layer are arranged along a first direction, and along the first direction, the thickness H1 of the first base layer is 10μm≤H1≤200μm. If the thickness of the first base layer is too thin, the thickness of the insulating member in the opening will be too thin, resulting in difficulty in pasting the insulating member. If the thickness of the first base layer is too thick, the thickness of the insulating member in the opening will be too thick, resulting in an increase in the space occupied by the insulating member. For example, when the insulating member is pasted in the battery cell, it occupies the space inside the battery cell, affecting the energy density of the battery cell. By limiting 10μm≤H1≤200μm, the thickness of the insulating member is limited, the pasting of the insulating member is facilitated, and the space occupied by the insulating member is reduced.

[0007] In one or more optional embodiments above, 20 μm ≤ H1 ≤ 100 μm. The thickness of the insulating member is further limited, so that the insulating member can be better adhered and the space occupied by the insulating member can be reduced.

[0008] In one or more optional embodiments above, the first composite layer includes a first adhesive layer, the first adhesive layer connects the first base layer and the second release layer, and the adhesion force F2 between the first adhesive layer and the second release layer is

[0009] 0.001N / mm≤F2≤0.1N / mm. If the adhesive force is too small, the first base layer and the second release layer are easily separated when scraping in the insulating material or rolling up the carrier. When the insulating part is used, the first base layer and the second release layer need to be separated and the insulating part is exposed. If the adhesive force is too large, it is not easy to separate the first base layer from the second release layer, which affects the pasting of the insulating part. By limiting 0.001N / mm≤F2≤0.1N / mm, the separation of the first base layer and the second release layer when scraping in the insulating material or rolling up the carrier can be reduced, and it is easier to separate the first base layer and the second release layer when pasting the insulating part.

[0010] In one or more of the above optional embodiments, the release force F3 of the second release layer is 50g / 25mm≤F3≤500g / 25mm. If the release force F3 is too small, the insulating part is easy to separate from the second release layer. During the process of pasting the insulating film, the insulating film is connected to the residual glue around the opening of the first composite film and separated from the second release layer. If the release force F3 is too large, it is not easy to separate the insulating part from the second release layer after pasting the insulating part. By limiting 50g / 25mm≤F3≤500g / 25mm, the insulating part can be better arranged in the opening, and it is easy to separate from the second release layer 21 after pasting the insulating part.

[0011] In one or more optional embodiments above, the second composite layer includes a second base layer, the second base layer is connected to the second release layer, and along the first direction, the thickness H2 of the second base layer is 30μm≤H2≤80μm. The carrier is set as a coil, and the external device scrapes the insulating material into the opening during the tape running process. The second base layer carries the insulating part. By limiting 30μm≤H2≤80μm, the occurrence of the second base layer being stretched and deformed during the tape running process can be reduced, reducing the impact on the molding of the insulating part, and is conducive to controlling costs.

[0012] In one or more optional embodiments above, the second composite layer includes a third release layer, the third release layer is connected to the second base layer, and the release force F4 of the third release layer is 50g / 25mm<F4<

[0013] 1000g / 25mm. In this way, the second base layer 22 is less likely to adhere to the insulating material remaining in the opening, or the insulating material remaining around the opening is less likely to separate from the first release layer.

[0014] In one or more optional embodiments above, the material of the first release layer includes siloxane, which is conducive to reducing the adhesion between the insulating material around the opening and the first base layer, reducing residual adhesive and reducing the adhesion between the insulating material and the first base layer, and facilitating separation of the insulating member. The material of the first base layer includes one or more of polyethylene terephthalate, polyimide, polytetrafluoroethylene, polyetheretherketone, polyphenylene sulfide, liquid crystal polymer and polybenzimidazole.

[0015] In one or more optional embodiments above, when viewed along the first direction, the shape of the opening includes any one of a triangle, a rectangle, a circle, an ellipse, and an irregular shape.

[0016] An embodiment of the present application provides an insulating assembly, including an insulating member and a carrier in any one of the above embodiments, wherein the insulating member is arranged in an opening.

[0017] In one or more optional embodiments above, along the first direction, the thickness of the first composite layer is D, the thickness of the insulating member is d, and 0.5D≤d≤D.

[0018] In one or more of the above optional embodiments, the material of the insulating part includes one or more of modified polypropylene, modified polyethylene, modified ethylene-based elastomer, modified propylene-based elastomer, modified styrene-based elastomer, modified ionomer resin, modified polyvinylidene fluoride, modified vinylidene fluoride-hexafluoropropylene copolymer, modified polymethyl methacrylate and modified polyethylene glycol.

[0019] In one or more optional embodiments above, the insulating member includes an inorganic filler, and the inorganic filler includes one or more of boehmite, silica, calcium carbonate, talc, wollastonite, quartz powder, alumina, mica powder, titanium dioxide and glass fiber.

[0020] In one or more optional embodiments above, the inorganic filler addition ratio A is 0%<A≤30%. The hardness of the insulating part is increased, and the insulating part is easily deformed, missing, and wrinkled during the pasting process, making the surface of the insulating part drier and easier to paste.

[0021] An embodiment of the present application provides a method for manufacturing an insulating component in any of the above-mentioned embodiments, comprising the following steps: connecting the second composite layer to the first composite layer, setting an opening in the first composite layer to form a carrier; injecting molten insulating material into the opening, and forming an insulating part after the insulating material is cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of the winding member in some embodiments of the present application is shown.

[0023] Figure 2 A schematic cross-sectional view of a winding member in some embodiments of the present application is shown.

[0024] Figure 3 Schematic cross-sectional views of winding members in other embodiments of the present application are shown.

[0025] Figure 4 A schematic structural diagram of an insulating assembly in some embodiments of the present application is shown.

[0026] Figure 5 A schematic cross-sectional view of an insulating assembly in some embodiments of the present application is shown.

[0027] Figure 6 Schematic cross-sectional views of insulation components in other embodiments of the present application are shown.

[0028] Figure 7 A schematic flow chart of a method for manufacturing an insulating component in some embodiments of the present application is shown.

[0029] Figure 8 A simplified schematic diagram of a carrier and external devices in some embodiments of the present application is shown.

[0030] Description of main component symbols:

[0031] Carrier 100

[0032] The first composite layer 10

[0033] Opening 10a

[0034] The first release layer 11

[0035] First base 12

[0036] First adhesive layer 13

[0037] The second composite layer 20

[0038] Second release layer 21

[0039] Second base 22

[0040] The third release layer 23

[0041] Insulation components 200

[0042] Insulation 201

[0043] External device 1

[0044] First direction X

[0045] Second direction Y

[0046] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0047] The following specific embodiments are exemplary and non-limiting, and are intended to provide a basic understanding of the present application, and are not intended to identify the key or decisive elements of the present application or to limit the scope of protection. As long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way.

[0048] When a component is considered to be “provided on” another component, it can be directly provided on the other component or there may be a component in between. When a component is considered to be “connected to” another component, it can be directly connected to the other component or there may be a component in between.

[0049] It can be understood that the term "perpendicular" is used to describe an ideal state between two components. In actual production or use, there may be a state that is approximately perpendicular or equal to each other between the two components. For example, in combination with numerical descriptions, perpendicularity can refer to the angle between two straight lines being between 90°±10°, perpendicularity can also refer to the dihedral angle between two planes being between 90°±10°, and perpendicularity can also refer to the angle between a straight line and a plane being between 90°±10°. The two components described as "perpendicular" may not be absolute straight lines or planes, but may be roughly straight lines or planes. From a macroscopic perspective, a component can be considered a "straight line" or a "plane" if the overall extension direction is a straight line or a plane.

[0050] Unless otherwise defined, when the term "plurality" is used to describe the number of components, it specifically means that the components are two or more.

[0051] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0052] See also Figure 1 and Figure 2 The first embodiment of the present application provides a carrier 100 , including a first composite layer 10 and a second composite layer 20 arranged along a first direction X, wherein the first composite layer 10 is connected to the second composite layer 20 . The first direction X is a thickness direction of the carrier 100 .

[0053] In some embodiments, the first composite layer 10 is provided with an opening 10 a , which penetrates through the first composite layer 10 , and the opening 10 a is configured to receive an insulating material.

[0054] In some embodiments, the first composite layer 10 includes a first release layer 11 . Along the first direction X, the first release layer 11 is located at the outermost side of the first composite layer 10 and faces away from the second composite layer 20 .

[0055] In some embodiments, the second composite layer 20 includes a second release layer 21 . The second release layer 21 is connected to the first composite layer 10 , and the second release layer 21 is exposed in the opening 10 a .

[0056] See also Figure 4 and Figure 7 , the insulating material is injected into the opening 10a through the external device 1, and the insulating material is cooled to form an insulating part 201. The present application reduces the adhesion between the insulating material in the external device 1 and the carrier 100 through the first release layer 11, reduces the residual insulating material around the opening 10a, and exposes the insulating material in the opening 10a through the second release layer 21, so that the insulating material contacts the second release layer 21, which is conducive to the separation of the molded insulating part 201 from the second release layer 21.

[0057] In some embodiments, the carrier 100 includes a plurality of openings 10 a arranged along a second direction Y, where the second direction Y is perpendicular to the first direction X.

[0058] In some embodiments, the release force F1 of the first release layer 11 is 3g / 25mm≤F1≤300g / 25mm. This can better reduce the adhesion between the insulating material in the external device 1 and the carrier 100, reduce the residual insulating material around the opening 10a, and facilitate winding.

[0059] Optionally, F1 can be 3g / 25mm, 4g / 25mm, 5g / 25mm, 6g / 25mm, 7g / 25mm, 8g / 25mm, 9g / 25mm, 10g / 25mm, 11g / 25mm, 12g / 25mm, 13g / 25mm, 14g / 25mm, 15g / 25mm, 16g / 25mm, 17g / 25mm, 18g / 25mm, 19g / 25mm,

[0060] The range of any one of 20g / 25mm, 297g / 25mm, 298g / 25mm, 299g / 25mm, and 300g / 25mm or any two of them. In some embodiments, 3g / 25mm≤F1≤100g / 25mm, which is further beneficial to reduce the adhesion between the insulating material in the external device 1 and the carrier 100, and reduce the residual insulating material around the opening 10a.

[0061] See also Figure 2 and Figure 5 In some embodiments, the first composite layer 10 includes a first base layer 12 , the first release layer 11 and the first base layer 12 are arranged along a first direction X, and the first base layer 12 is connected to the first release layer 11 .

[0062] In some embodiments, along the first direction X, the thickness H1 of the first base layer 12 is 10μm≤H1≤200μm. If the thickness of the first base layer 12 is too thin, the thickness of the insulating member 201 in the opening 10a will be too thin, making it difficult to paste the insulating member 201. If the thickness of the first base layer 12 is too thick, the thickness of the insulating member 201 in the opening 10a will be too thick, resulting in an increase in the space occupied by the insulating member 201. For example, when the insulating member 201 is pasted in the battery cell, it occupies the space inside the battery cell, affecting the energy density of the battery cell. By limiting 10μm≤H1≤200μm, the thickness of the insulating member 201 is limited, which facilitates the pasting of the insulating member 201 and reduces the space occupied by the insulating member 201.

[0063] Optionally, H1 can be any one of 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm, 190μm, and 200μm, or a range consisting of any two of them.

[0064] In some embodiments, 20 μm≤H1≤100 μm, which further limits the thickness of the insulating member 201 , thereby facilitating better bonding of the insulating member 201 and reducing the space occupied by the insulating member 201 .

[0065] In some embodiments, the material of the first release layer 11 includes siloxane, which is beneficial to reduce the adhesion between the insulating material around the opening 10a and the first base layer 12, reduce residual glue and reduce the adhesion between the insulating material and the first base layer 12, and facilitate separation of the insulating member 201.

[0066] In some embodiments, the material of the first base layer 12 includes one or more of polyethylene terephthalate, polyimide, polytetrafluoroethylene, polyetheretherketone, polyphenylene sulfide, liquid crystal polymer, and polybenzimidazole.

[0067] In some embodiments, the first composite layer 10 includes a first adhesive layer 13, and the first adhesive layer 13 connects the first base layer 12 and the second release layer 21. The adhesive force F2 between the first adhesive layer 13 and the second release layer 21 is 0.001N / mm≤F2≤0.1N / mm. If the adhesive force is too small, the first base layer 12 and the second release layer 21 are easily separated when the insulating material is scraped in and the carrier 100 is rolled up. When the insulating member 201 is used, it is necessary to separate the first base layer 12 and the second release layer 21 and expose the insulating member 201. If the adhesive force is too large, it is not easy to separate the first base layer 12 from the second release layer 21, which affects the pasting of the insulating member 201. By limiting 0.001N / mm≤F2≤0.1N / mm, the occurrence of separation of the first base layer 12 and the second release layer 21 when the insulating material is scraped in and the carrier 100 is rolled up can be reduced, and it is easier to separate the first base layer 12 and the second release layer 21 when pasting the insulating member 201.

[0068] Optionally, F2 can be 0.001 N / mm, 0.005 N / mm, 0.01 N / mm, 0.015 N / mm, 0.02 N / mm, 0.025 N / mm, 0.03 N / mm, 0.035 N / mm, 0.04 N / mm, 0.045 N / mm, 0.05 N / mm, 0.055 N / mm, 0.06 N / mm, 0.065 N / mm, 0.07 N / mm, 0.075 N / mm,

[0069] The range is any one of 0.08 N / mm, 0.085 N / mm, 0.09 N / mm, 0.095 N / mm, and 0.1 N / mm, or any two of them.

[0070] In some embodiments, the thickness W of the first adhesive layer 13 is 3μm≤W≤5μm. If the thickness of the first adhesive layer 13 is too small, the connection between the first base layer 12 and the second release layer 21 will be affected. If the thickness of the first adhesive layer 13 is too large, when the first base layer 12 and the second release layer 21 are separated, the residual adhesive of the first adhesive layer 13 is likely to take away the insulating component 201. By limiting 3μm≤W≤5μm, the first base layer 12 and the second release layer 21 can be better connected, reducing the occurrence of the residual adhesive of the first adhesive layer 13 taking away the insulating component 201.

[0071] Optionally, W may be any one of 3 μm, 3.2 μm, 3.4 μm, 3.6 μm, 3.8 μm, 4 μm, 4.2 μm, 4.4 μm, 4.6 μm, 4.8 μm, and 5 μm, or a range consisting of any two of them.

[0072] In some embodiments, the release force F3 of the second release layer 21 is 50g / 25mm≤F3≤500g / 25mm. If the release force F3 is too small, the insulating member 201 is easy to separate from the second release layer 21, and the insulating member 201 is easy to fall off from the opening 10a during the winding process. If the release force F3 is too large, it is not easy to separate the insulating member 201 from the second release layer 21 after the insulating member 201 is pasted, and the second release layer 21 is easy to pull the insulating member 201, causing the insulating member 201 to deform, affecting the pasting of the insulating member 201. By limiting 50g / 25mm≤F3≤500g / 25mm, the insulating member 201 can be better arranged in the opening 10a, and it is easy to separate from the second release layer 21 after the insulating member 201 is pasted.

[0073] In some embodiments, during the process of attaching the insulating member 201 , the insulating member 201 and the insulating material remaining around the opening 10 a are separated from the second release layer 21 .

[0074] Optionally, F3 can be 50g / 25mm, 52g / 25mm, 54g / 25mm, 56g / 25mm, 58g / 25mm, 60g / 25mm, 62g / 25mm, 64g / 25mm, 66g / 25mm, 68g / 25mm,

[0075] 70g / 25mm, 72g / 25mm, 74g / 25mm, 76g / 25mm, 78g / 25mm, 80g / 25mm,

[0076] 82g / 25mm, 84g / 25mm, 86g / 25mm, 88g / 25mm, 90g / 25mm, 92g / 25mm,

[0077] 94g / 25mm, 96g / 25mm, 98g / 25mm, 100g / 25mm, 102g / 25mm, 104g / 25mm,

[0078] 106g / 25mm, 108g / 25mm, 110g / 25mm, 112g / 25mm, 114g / 25mm, 116g / 25mm, 118g / 25mm, 120 g / 25mm, 122g / 25mm, 124g / 25mm, 126g / 25mm, 128g / 25mm, 130g / 25mm, 132g / 25mm, 134g / 25 The range of any one of or any two of 150g / 25mm, 162g / 25mm, 168g / 25mm, 172g / 25mm, 176g / 25mm, 178g / 25mm, 180g / 25mm, 181g / 25mm, 182g / 25mm, 183g / 25mm, 184g / 25mm, 186g / 25mm, 187g / 25mm, 188g / 25mm, 189g / 25mm, 200g / 25mm, 201g / 25mm, 202g / 25mm, 203g / 25mm, 204g / 25mm, 205g / 25mm, 206g / 25mm, 207g / 25mm, 208g / 25mm, 209g / 25mm, 210g / 25mm, 211g / 25mm

[0079] In some embodiments, 50g / 25mm≤F3≤200g / 25mm, which is further beneficial for placing the insulating member 201 in the opening 10a and facilitating separation of the insulating member 201 from the second release layer 21 after pasting.

[0080] In some embodiments, the second composite layer 20 includes a second base layer 22, the second base layer 22 is connected to the second release layer 21, and the thickness H2 of the second base layer 22 along the first direction X is 30μm≤H2≤80μm. The carrier 100 is set as a roll material, and the external device 1 scrapes the insulating material into the opening 10a during the tape running process. The second base layer 22 carries the insulating member 201. By limiting 30μm≤H2≤80μm, the occurrence of the second base layer 22 being stretched and deformed during the tape running process can be reduced, reducing the impact on the molding of the insulating member 201, and is conducive to controlling costs.

[0081] Optionally, H2 can be any one of 30μm, 32μm, 34μm, 36μm, 38μm, 40μm, 42μm, 44μm, 46μm, 48μm, 50μm, 52μm, 54μm, 56μm, 58μm, 60μm, 62μm, 64μm, 66μm, 68μm, 70μm, 72μm, 74μm, 76μm, 78μm, and 80μm, or a range of any two of them.

[0082] In some embodiments, the thickness of the second base layer 22 is greater than the thickness of the first base layer 12 .

[0083] In some embodiments, the material of the second release layer 21 includes siloxane, which is helpful to reduce the adhesion between the insulating material and the second base layer 22 and facilitate separation of the insulating member 201 .

[0084] In some embodiments, the material of the second base layer 22 includes one or more of polyethylene terephthalate, polyimide, polytetrafluoroethylene, polyetheretherketone, polyphenylene sulfide, liquid crystal polymer, and polybenzimidazole.

[0085] See also Figure 3 and Figure 6 In some embodiments, the second composite layer 20 includes a third release layer 23, which is connected to the second base layer 22. When the carrier 100 is rolled up, the second base layer 22 can be less likely to adhere to the insulating material remaining in the opening 10a, thereby reducing the detachment of the insulating member 201 from the opening 10a.

[0086] In some embodiments, the release force F4 between the third release layer 23 and the second base layer 22 is 50g / 25mm≤F4≤1000g / 25mm. In this way, the second base layer 22 is less likely to adhere to the insulating material remaining in the opening 10a, or the insulating material remaining around the opening is less likely to separate from the first release layer 11.

[0087] Optionally, F4 can be 50g / 25mm, 60g / 25mm, 70g / 25mm, 80g / 25mm, 90g / 25mm, 100g / 25mm, 110g / 25mm, 120g / 25mm, 130g / 25mm, 140g / 25mm, 150g / 25mm, 160g / 25mm, 170g / 25mm, 180g / 25mm, 190g / 25mm, 200g / 25mm, 210g / 25mm, 2 The range of any one of 20g / 25mm, 230g / 25mm, 240g / 25mm, 250g / 25mm, 260g / 25mm, 270g / 25mm, 280g / 25mm, 290g / 25mm, 300g / 25mm, 310g / 25mm, 320g / 25mm, 330g / 25mm, 340g / 25mm, 350g / 25mm…990g / 25mm, 1000g / 25mm or any two of them.

[0088] In some embodiments, the material of the third release layer 23 includes siloxane.

[0089] In some embodiments, when viewed along the first direction X, the shape of the opening 10 a includes any one of a triangle, a rectangle, a circle, an ellipse, and a special shape.

[0090] In some embodiments, the opening 10a is formed by die cutting or laser etching.

[0091] See also Figure 5 and Figure 6 An embodiment of the present application provides an insulating assembly 200, including an insulating member 201 and a carrier 100 in any one of the above embodiments, wherein the insulating member 201 is disposed in the opening 10a.

[0092] In some embodiments, along the first direction X, the thickness of the first composite layer 10 is D, the thickness of the insulating member 201 is d, and 0.5D≤d≤D.

[0093] In some embodiments, the thickness d of the insulating member 201 is 10 μm ≤ d ≤ 50 μm. In this way, the insulating performance of the insulating member 201 can be improved and the space occupied by the insulating member 201 can be reduced.

[0094] Alternatively, d may be a range of any one of 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, 21μm, 22μm, 23μm, 24μm, 25μm, 26μm, 27μm, 28μm, 29μm, 30μm, 31μm, 32μm, 33μm, 34μm, 35μm, 36μm, 37μm, 38μm, 39μm, 40μm, 41μm, 42μm, 43μm, 44μm, 45μm, 46μm, 47μm, 48μm, 49μm, or 50μm.

[0095] In some embodiments, the tensile strength of the insulating member 201 is at least 3 Mpa, which facilitates pasting and reduces the risk of the insulating member 201 breaking.

[0096] In some embodiments, the insulating material includes hot melt adhesive. When the insulating material is scraped into the opening 10a, it is in a molten state. The melting point of the insulating material is lower than the melting point of the first base layer 12 , which reduces the effect of temperature on the first base layer 12 and reduces the possibility of adhesion between the insulating material and the first base layer 12 .

[0097] In some embodiments, the melting point of the insulating material is lower than that of the second base layer 22 , which reduces the effect of temperature on the second base layer 22 , helps the second base layer 22 to carry the insulating member 201 , and reduces deformation of the insulating member 201 .

[0098] In some embodiments, the insulating material includes one or more of modified polypropylene, modified polyethylene, modified ethylene-based elastomer, modified propylene-based elastomer, modified styrene-based elastomer, modified ionomer resin, modified polyvinylidene fluoride, modified vinylidene fluoride-hexafluoropropylene copolymer, modified polymethyl methacrylate and modified polyethylene glycol, which is beneficial to improving the bonding strength of the insulating member 201.

[0099] In some embodiments, the insulating material includes an inorganic filler, and the inorganic filler includes one or more of boehmite, silica, calcium carbonate, talc, wollastonite, quartz powder, alumina, mica powder, titanium dioxide, and glass fiber.

[0100] In some embodiments, the inorganic filler addition ratio A is 0%<A≤30%. The hardness of the insulating member 201 is increased, and the insulating member 201 is easily deformed, missing, or wrinkled during the pasting process, so that the surface of the insulating member 201 is drier and easier to paste.

[0101] Optionally, the addition ratio of the inorganic filler can be 0.1%, 0.3%, 0.5%, 0.7%, 0.9%, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, any one of them or the range of any two.

[0102] See also Figure 8 An embodiment of the present application provides a method for manufacturing the insulating assembly 200 in any one of the above embodiments, comprising the following steps:

[0103] Step 1: Connecting the first composite layer 10 to the second composite layer 20, and providing an opening 10a in the first composite layer 10 to form a carrier 100;

[0104] Step 2: injecting the molten insulating material into the opening 10 a and forming the insulating member 201 after the insulating material is cooled.

[0105] See also Figure 7 In some embodiments, step 1 further includes rolling up the formed carrier 100 .

[0106] In some embodiments, step 2 specifically includes heating the insulating material and passing it through the flow channel into the external device 1, bonding the external device 1 to the first release layer 11, pulling the rolled carrier 100 through the device to make the carrier 100 pass through the external device 1, and when the opening 10a passes through the external device 1, the external device 1 scrapes the insulating material into the opening 10a, and after air cooling, solidifies to form the insulating part 201.

[0107] In some embodiments, the manufacturing method further comprises: rolling up the insulating assembly 200 .

[0108] In some embodiments, when the insulating assembly 200 is used, the first composite layer 10 and the second release layer 21 are first separated to expose the insulating member 201 , then the insulating member 201 is adhered, and finally the second release layer 21 is separated from the insulating member 201 .

[0109] The present application will be further described below through specific embodiments.

[0110] Taking the example of the external device 1 continuously scraping insulating material into 100 openings 10a, after the insulating material cools down, observe whether there is any insulating material remaining around the openings 10a, and roll up and paste the carrier 100 to observe whether the insulating part 201 falls off from the openings 10a and the pasting condition.

[0111] In some embodiments, the release force test method is as follows: a 25 mm wide tape (TESA7475) is attached to the test surface of the release film, rolled back and forth twice with a 2KG rubber roller, and allowed to stand for 20 minutes. The release film strip is fixed on a test steel plate with double-sided tape, and a 180° peeling test is performed on a tensile testing machine.

[0112] Table 1 (Except for the parameters mentioned in Table 1, all other parameters of Examples 2 to 7 are the same as those of Example 1.)

[0113] Release force F1 Residual thickness Can you rewind? Example 1 3 none yes Example 2 50 none yes Example 3 100 none yes Example 4 200 ≤8um yes Example 5 300 ≤10um yes Example 6 310 ≤12um yes Example 7 2 none no

[0114] It can be seen from Examples 1 to 6 in Table 1 that when the release force F1 is greater than 3g / 25mm to 100g / 25mm, there is no residual insulating material at the opening 10a. When the release force F1 is greater than 100g / 25mm, the residual thickness of the insulating material around the opening 10a gradually increases. When the release force F1 is less than 3g / 25mm, the surface of the first release layer 11 is too smooth, making it impossible to roll up. The present application can better reduce the adhesion between the insulating material in the external device 1 and the carrier 100 by 3g / 25mm≤F1≤300g / 25mm, reduce the residual insulating material around the opening 10a, and facilitate rolling up.

[0115] Table 2 (Except for the parameters mentioned in Table 2, all other parameters of Examples 2 to 8 are the same as those of Example 1.)

[0116]

[0117]

[0118] It can be seen from Examples 1 to 8 in Table 2 that when the release force F3 is less than 50g / 25mm, the number of insulating members 201 that fall off from the opening 10a increases. When the release force F3 is greater than 200g / 25mm, when the second release layer 21 and the insulating member 201 are separated, the number of insulating members 201 that are not easily separated from the second release layer 21 increases slightly. When the release force F3 is greater than 500g / 25mm, when the second release layer 21 and the insulating member 201 are separated, the number of insulating members 201 that are not easily separated from the second release layer 21 increases significantly. By limiting 50g / 25mm≤F3≤500g / 25mm, the present application can better arrange the insulating member 201 in the opening 10a, and after the insulating member 201 is pasted, it is easy to separate from the second release layer 21, thereby reducing the deformation of the insulating member 201.

[0119] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present application, and are not used as limitations on the present application. As long as they are within the spirit of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.

Claims

1. A carrier for carrying insulating materials, It is characterized in that comprising a first composite layer and a second composite layer arranged along a first direction; The first composite layer is provided with an opening, and the opening is configured to accommodate an insulating material; the opening penetrates the first composite layer and extends to the surface of the second composite layer; the first composite layer includes a first release layer, and along the first direction, the first release layer is the outermost layer of the first composite layer away from the second composite layer, and the first direction is the thickness direction of the carrier; The second composite layer includes a second release layer, the second release layer is connected to the first composite layer, and the second release layer is exposed in the opening.

2. The carrier for carrying insulating material according to claim 1, It is characterized in that The release force F1 of the first release layer is 3g / 25mm≤F1≤300g / 25mm.

3. The carrier for carrying insulating material according to claim 1, It is characterized in that The first composite layer includes a first base layer connected to the first release layer. The first release layer and the first base layer are arranged along the first direction. Along the first direction, the thickness H1 of the first base layer is 10 μm≤H1≤200 μm.

4. The carrier for carrying insulating material according to claim 3, It is characterized in that 20μm≤H1≤100μm.

5. The carrier for carrying insulating material according to claim 3, It is characterized in that The first composite layer further includes a first adhesive layer, the first adhesive layer connects the first base layer and the second release layer, and the adhesion force F2 between the first adhesive layer and the second release layer is 0.001 N / mm≤F2≤0.1 N / mm.

6. The carrier for carrying insulating material according to claim 1, It is characterized in that The release force F3 of the second release layer is 50g / 25mm≤F3≤500g / 25mm.

7. The carrier for carrying insulating material according to claim 1, It is characterized in that The second composite layer includes a second base layer, the second base layer is connected to the second release layer, and along the first direction, the thickness H2 of the second base layer is 30 μm≤H2≤80 μm.

8. The carrier for carrying insulating material according to claim 7, It is characterized in that The second composite layer includes a third release layer, the third release layer is connected to the second base layer, and the release force F4 of the third release layer is 50g / 25mm<F4<1000g / 25mm.

9. The carrier for carrying insulating material according to claim 3, It is characterized in that The material of the first release layer includes siloxane, and the material of the first base layer includes one or more of polyethylene terephthalate, polyimide, polytetrafluoroethylene, polyetheretherketone, polyphenylene sulfide, liquid crystal polymer and polybenzimidazole.

10. The carrier for carrying insulating material according to claim 1, It is characterized in that When viewed along the first direction, the shape of the opening includes any one of a triangle, a rectangle, a circle, an ellipse and an irregular shape.

11. An insulating component, It is characterized in that The invention comprises an insulating member and a carrier for carrying insulating material according to any one of claims 1 to 10, wherein the insulating member is arranged in the opening.

12. The insulation assembly according to claim 11, It is characterized in that Along the first direction, the thickness of the first composite layer is D, the thickness of the insulating member is d, and 0.5D≤d≤D.

13. The insulation assembly according to claim 11, It is characterized in that The material of the insulating part includes one or more of modified polypropylene, modified polyethylene, modified ethylene elastomer, modified propylene elastomer, modified styrene elastomer, modified ionomer resin, modified polyvinylidene fluoride, modified vinylidene fluoride-hexafluoropropylene copolymer, modified polymethyl methacrylate and modified polyethylene glycol.

14. The insulation assembly according to claim 13, It is characterized in that The insulating member includes an inorganic filler, and the inorganic filler includes one or more of boehmite, silicon dioxide, calcium carbonate, talc, wollastonite, quartz powder, alumina, mica powder, titanium dioxide and glass fiber.

15. The insulation assembly according to claim 14, It is characterized in that The addition ratio A of the inorganic filler is 0%<A≤30%.

16. A method for manufacturing an insulation assembly according to any one of claims 11 to 15, It is characterized in that The following steps are involved: Step 1, connecting the second composite layer to the first composite layer, and setting the opening in the first composite layer to form the carrier; Step 2: injecting molten insulating material into the opening, and forming the insulating member after the insulating material is cooled.

Images