IC carrier plate carrier

Abstract

The invention discloses an IC carrier plate carrier which can be compatible with horizontal (F) placement / arc (R) placement IC carrier plates and F-form or R-form IC carrier plates on the front and back surfaces at the same time through cooperative arrangement of a carrier body, at least two supporting limiting pieces and at least two limiting blocks, carrier parts of the two forms can be shared, the mounting modes are the same, accessories do not need to be increased or decreased, and the carrier is convenient to mount and dismount. The F / R carriers can be quickly switched, and carriers with two morphological structures do not need to be prepared, so that the cost is effectively saved; and moreover, the IC support plate carriers can be stacked, and each carrier can be used for placing 50PCS + IC support plates, so that the carrier replacement frequency is reduced, the carrying frequency is reduced, and the production capacity is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of carriers, and in particular to an IC carrier. Background Art

[0002] IC substrates are important semiconductor electronic components and are the support for semiconductor chips. FCCSP is a BT-type IC substrate process, which is the most widely used in semiconductor components. IC substrates need to be transferred, transported and stored in different production processes. The traditional storage method requires a separate carrier for each IC substrate. The number of carriers is large, the cost is high, the management is difficult, and the consistency is poor. It cannot meet the production capacity and high-precision and strict process requirements of IC substrates. In addition, the form of IC substrates placed on the carrier is different at different process stages, which is divided into two states: F (horizontal) placement / R (arc) placement. Traditional carriers cannot achieve compatibility and need to develop two independent carriers, which invisibly increases costs. Summary of the invention

[0003] Based on this, it is necessary to provide an IC carrier.

[0004] An IC carrier carrier, comprising a carrier body, at least two support limiters, and at least two limit blocks, wherein the top surface of the carrier body has a horizontal IC carrier placement surface, and the bottom surface of the carrier body corresponding to the top surface has an arc-shaped IC carrier placement surface; The carrier body includes two groups of first support plates and two groups of second support plates, the two groups of first support plates and the two groups of second support plates are detachably connected in sequence, the two support limiters are symmetrically and detachably arranged on the two groups of first support plates, and the two limit blocks are symmetrically and detachably arranged on the two groups of second support plates.

[0005] In one embodiment, the support and limiting member has a stacking support portion at one end away from the first support plate.

[0006] In one embodiment, a support portion mounting groove is provided on one end of the first support plate close to the stack support portion.

[0007] In one of the embodiments, a support limiter installation groove is provided on the first support plate at a position corresponding to the support portion installation groove.

[0008] In one embodiment, the two groups of first support plates are respectively provided with a transport opening.

[0009] In one of the embodiments, two equipment clamping positioning holes are symmetrically arranged on the first support plate.

[0010] In one of the embodiments, the IC carrier further includes four mirror covers, and the four mirror covers are sequentially installed on the side surfaces of the two groups of first support plates and the two groups of second support plates.

[0011] In one embodiment, the IC carrier further includes a device direction identification port, and the device direction identification port is opened at one end of the second support plate.

[0012] In one of the embodiments, the IC carrier further includes a QR code logo, and the QR code logo is attached to a preset position of the carrier body.

[0013] In one of the embodiments, the IC carrier further includes at least one reinforcing rib, and both ends of the reinforcing rib are fixedly or detachably mounted on the two sets of second support plates.

[0014] The above-mentioned IC carrier carrier, through the coordinated arrangement of the carrier body, at least two supporting limit members, and at least two limit blocks, can be compatible with horizontal (F) placement / arc-shaped (R) placement of IC carriers at the same time. F-shaped or R-shaped IC carriers can be placed on both the front and back sides, and the parts of the two forms of carriers can be shared, the installation method is the same, and there is no need to increase or decrease accessories. F / R carriers can be quickly switched, and there is no need to prepare carriers of two forms of structure, which effectively saves costs; and the IC carrier carrier can be stacked, and each carrier can hold 50PCS+IC carriers, reducing the frequency of carrier replacement and handling, thereby greatly improving production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the assembly structure of an IC carrier in a horizontally placed state of an IC carrier carrier according to an embodiment of the present invention; Figure 2 for Figure 1 A schematic diagram of an exploded structure of an IC carrier in a horizontally placed state of an IC carrier carrier according to an embodiment of the present invention; Figure 3 It is a schematic diagram of the assembly structure of an IC carrier in an arc-shaped placement state of an IC carrier carrier according to another embodiment of the present invention; Figure 4 for Figure 3 A schematic diagram of an exploded structure of an IC carrier in an arc-shaped placement state of an IC carrier carrier according to an embodiment of the present invention. DETAILED DESCRIPTION

[0016] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0017] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. On the contrary, when an element is said to be "directly" connected to another element, there is no intermediate element.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0019] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, an IC carrier carrier comprises a carrier body 1, at least two support stoppers 2, and at least two stop blocks 3. The top surface of the carrier body 1 has a horizontal IC carrier placement surface 11, and the bottom surface of the carrier body corresponding to the top surface has an arc-shaped IC carrier placement surface 12; The carrier body 1 includes two groups of first support plates 13 and two groups of second support plates 14, the two groups of first support plates 13 and the two groups of second support plates 14 are detachably connected in sequence, the two support limit members 2 are symmetrically and detachably arranged on the two groups of first support plates 13, and the two limit blocks 3 are symmetrically and detachably arranged on the two groups of second support plates 14; the support limit member 2 has a stacking support portion 21 at one end away from the first support plate 13; the first support plate 13 has a support portion mounting groove 131 at one end close to the stacking support portion 21; and a support portion mounting groove 131 is opened at a position on the first support plate 13 corresponding to the support portion mounting groove 131.

[0020] The two groups of first support plates 13 are arranged axially symmetrically, and the two groups of second support plates 14 are also arranged axially symmetrically. The two groups of first support plates 13 are respectively connected to the two groups of second support plates 14 in sequence. A support portion mounting groove 131 is provided at a position corresponding to the support portion mounting groove 131 on the first support plate 13. The number of the support portion mounting groove 131 is set according to the number of the support stopper 2. The support portion mounting groove 131 is correspondingly arranged on the top surface and the bottom surface of the first support plate 13. The second support plate 14 is provided with a limit block mounting groove 141. The number of the limit block mounting groove 141 is adapted to the number of the limit blocks 3. The limit block mounting groove 141 is correspondingly arranged on the top surface and the bottom surface of the second support plate 14. The first support plate 13 and the second support plate 14 are detachably connected, for example, they can be connected by screws or buckles, so as to facilitate the replacement or assembly of the first support plate 13 and the second support plate 14. It can be understood that the height value of the support stopper 2 is greater than the height value of the limit block 3. Example

[0021] When it is necessary to place a horizontal IC carrier, the horizontal IC carrier placement surface 11 of the carrier body 1 is placed on the top surface, and the horizontal IC carriers are placed on the horizontal IC carrier placement surface 11 in turn and respectively abut against the support limit member 2 and the two limit blocks 3. The support limit member 2 and the two limit blocks 3 have a good limiting effect on the horizontal IC carrier. Since the support limit member 2 and the two limit blocks 3 have a certain height, multiple horizontal IC carriers can be placed. The actual height of the support limit member 2 and the two limit blocks 3 can be set according to specific needs. Adjacent horizontal IC carriers are isolated by PP spacer paper. When the height value of the stacked horizontal IC carriers reaches the preset height value, if they need to be placed further, the IC carrier carriers can be stacked, because the end of the support limiter 2 away from the first support plate 13 has a stacking support portion 21, and the end of the first support plate 13 of the newly placed IC carrier carrier close to the stacking support portion 21 has a support portion mounting groove 131, so the stacking support portion 21 of the support limiter 2 can be inserted into the support portion mounting groove 131 to complete the splicing of adjacent IC carrier carriers, and horizontal IC carriers can continue to be placed on the new IC carrier carrier, and the splicing of IC carrier carriers can be carried out according to actual needs. Example

[0022] When it is necessary to place a curved IC carrier, the carrier body 1 is turned over so that the curved IC carrier placement surface 12 of the carrier body 1 is on the top surface, and the support limiter 2 and the two limit blocks 3 are removed from the horizontal IC carrier placement surface 11 of the first support plate 13 and the second support plate 14. Because the top and bottom surfaces of the first support plate 13 and the second support plate 14 have support part mounting grooves 131 and limit block mounting grooves 141, one side of the curved IC carrier placement surface 12 of the carrier body 1 must also have support part mounting grooves 131 and limit block mounting grooves 141. Therefore, the support limiter 2 is inserted into the support part mounting groove 131, and the limit block 3 is inserted into the limit block mounting groove 141. The curved IC carriers are stacked one by one on the curved IC carrier placement surface 12, and adjacent curved IC carriers are isolated by PP spacer paper. When the height value of the stacked arc-shaped IC carriers reaches a preset height value, if they need to be placed further, the IC carrier carriers can be stacked, because the end of the support limiter 2 away from the first support plate 13 has a stacking support portion 21, and the end of the first support plate 13 of the newly placed IC carrier carrier close to the stacking support portion 21 has a support portion mounting groove 131, so the stacking support portion 21 of the support limiter 2 can be inserted into the support portion mounting groove 131 to complete the splicing of adjacent IC carrier carriers, and the arc-shaped IC carriers can continue to be placed on the new IC carrier carrier, and the splicing of the IC carrier carriers can be carried out according to actual needs.

[0023] In this way, the IC carrier carrier, through the coordinated arrangement of the carrier body 1, at least two supporting limit members 2, and at least two limit blocks 3, can be compatible with horizontal (F) placement / arc-shaped (R) placement of IC carriers at the same time. F-shaped or R-shaped IC carriers can be placed on both the front and back sides, and the two forms of carrier parts can be shared, the installation method is the same, and there is no need to increase or decrease accessories, so that F / R carriers can be quickly switched, and there is no need to prepare carriers of two forms of structure, which effectively saves costs; and the IC carrier carrier can be stacked, and each carrier can hold 50PCS+IC carriers, which reduces the frequency of replacing carriers, reduces the frequency of handling, and greatly improves production capacity.

[0024] In one embodiment, the two groups of first support plates 13 are respectively provided with a transport opening 5 .

[0025] In this way, the carrying port 5 is a gripping port for manual carrying, and can be a waist-shaped hole, the length of which is greater than the width of a finger. There are two carrying ports 5, which are symmetrically arranged on two groups of first support plates 13. When the IC carrier needs to be carried, the fingers of both hands are inserted into the carrying port 5, and both hands hold the first support plate 13, and the IC carrier can be manually carried.

[0026] In one embodiment, two device clamping positioning holes 6 are symmetrically arranged on the first support plate 13 .

[0027] In this way, the two device clamping positioning holes 6 are symmetrically arranged on the first support plate 13 with the center point of the transport port 5 as the symmetry axis. Two device clamping positioning holes 6 are arranged on each first support plate 13, and the device clamping positioning holes 6 on the two relatively arranged first support plates 13 are symmetrically arranged. The device clamping positioning holes 6 are wedge-shaped holes. When the IC carrier needs to be transported, the external transport equipment can be inserted into the four device clamping positioning holes 6 to complete the transport of a single group or multiple groups of IC carriers.

[0028] In one embodiment, the IC carrier further includes four mirror covers 7 , and the four mirror covers 7 are sequentially mounted on the sides of the two groups of first support plates 13 and the two groups of second support plates 14 .

[0029] In this way, four mirror covers 7 are installed in sequence on the sides of two groups of first support plates 13 and two groups of second support plates 14. The mirror covers 7 are dust-proof, chip-proof, wear-resistant, corrosion-resistant and easy to clean, which can effectively extend the service life of the IC carrier.

[0030] In one embodiment, the IC carrier further includes a device direction identification port 8 , and the device direction identification port 8 is opened at one end of the second support plate 14 .

[0031] In this way, by identifying the device direction identification port 8 through an external optoelectronic device, the IC carrier carriers can be stacked in the same direction. At the same time, when the IC carrier carrier is transported on the device, the direction of the IC carrier carrier can also be identified by the external optoelectronic device.

[0032] In one embodiment, the IC carrier further includes a two-dimensional code mark 9 , and the two-dimensional code mark 9 is attached to a preset position of the carrier body 1 .

[0033] In this way, by setting the QR code identification 9, the IC substrate carrier has a traceability function, and each IC substrate carrier has a unique QR code, which can realize that problems can be checked, responsibilities can be corrected, the whole process can be monitored, and it can be linked with the MES system.

[0034] In one embodiment, the IC carrier further includes at least one reinforcing rib 10 , and both ends of the reinforcing rib 10 are fixedly or detachably mounted on the two sets of second support plates 14 .

[0035] In this way, the reinforcing rib 10 can be one, two or more, and can be set according to actual needs. The setting of the reinforcing rib 10 can make the IC carrier more stable and extend the service life of the IC carrier.

[0036] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An IC carrier, characterized in that: It comprises a carrier body, at least two supporting limiters, and at least two limit blocks, wherein the top surface of the carrier body has a horizontal IC carrier placement surface, and the bottom surface of the carrier body corresponding to the top surface has an arc-shaped IC carrier placement surface; The carrier body includes two groups of first support plates and two groups of second support plates, the two groups of first support plates and the two groups of second support plates are detachably connected in sequence, the two support limiters are symmetrically and detachably arranged on the two groups of first support plates, and the two limit blocks are symmetrically and detachably arranged on the two groups of second support plates.

2. The IC substrate carrier according to claim 1, characterized in that: The support and limiting member has a stacking support portion at one end away from the first support plate.

3. The IC substrate carrier according to claim 2, characterized in that: A support portion mounting groove is formed on one end of the first support plate close to the stack support portion.

4. The IC substrate carrier according to claim 3, characterized in that: A support limiter installation groove is provided on the first support plate at a position corresponding to the support portion installation groove.

5. The IC substrate carrier according to claim 1, characterized in that: The two groups of first support plates are respectively provided with a transport opening.

6. The IC substrate carrier according to claim 1, characterized in that: Two equipment clamping positioning holes are symmetrically arranged on the first supporting plate.

7. The IC substrate carrier according to claim 1, characterized in that: The IC carrier also includes four mirror covers, which are sequentially installed on the sides of the two groups of first support plates and the two groups of second support plates.

8. The IC substrate carrier according to claim 1, characterized in that: The IC carrier also includes a device direction identification port, and the device direction identification port is opened at one end of the second support plate.

9. The IC substrate carrier according to claim 1, characterized in that: The IC carrier also includes a two-dimensional code logo, and the two-dimensional code logo is attached to a preset position of the carrier body.

10. The IC substrate carrier according to claim 1, characterized in that: The IC carrier also includes at least one reinforcing rib, and both ends of the reinforcing rib are fixedly or detachably mounted on the two groups of second support plates.

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