LED packaging support and LED packaging structure

Abstract

The invention provides an LED packaging support and an LED packaging structure, the LED packaging support comprises a support main body, the support main body is provided with a heat conduction member, a first conductive member and a second conductive member, and the heat conduction member is used for cooling a light-emitting chip; the first conductive piece and the second conductive piece are respectively connected with the anode and the cathode of the light-emitting chip; and the first conductive part and the second conductive part are arranged at intervals with the heat conduction part through the bracket main body. According to the arrangement, through a thermoelectric separation mode, the area of a heat dissipation area can be increased, the heat dissipation effect is further improved, the chip is prevented from being broken down and damaged by high voltage, and high integration of the light-emitting chip is facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of LED products, and in particular to an LED packaging bracket and an LED packaging structure. Background Art

[0002] In conventional lamp bead products on the market, electrical conduction and heat conduction share the same channel, that is, heat conduction to the LED chip is achieved through the positive and negative pads. However, with the continuous integration of medium and high power LED chips, the heat dissipation effect of the lamp bead is poor, which leads to increased LED junction temperature, poor thermal stability, and affects the light effect and color drift. Moreover, due to high power and high voltage, high voltage creepage and sparking will damage the LED chip, thus affecting the product's voltage resistance performance. Summary of the invention

[0003] In view of this, the present application provides an LED packaging bracket and an LED packaging structure, which have good heat dissipation effect and can prevent high voltage breakdown from damaging the chip.

[0004] In order to achieve the above objectives, this application provides the following technical solutions:

[0005] An LED package bracket comprises a bracket body, on which a heat conductor, a first conductive member and a second conductive member are arranged, wherein the heat conductor is used to dissipate heat from a light-emitting chip; the first conductive member and the second conductive member are used to respectively connect the positive and negative electrodes of the light-emitting chip; and the first conductive member and the second conductive member are both spaced apart from the heat conductor through the bracket body.

[0006] Optionally, the heights of the first conductive member and the second conductive member are both greater than the height of the thermal conductive member.

[0007] Optionally, the difference between the height of the first conductive member and the second conductive member and the height of the thermal conductive member is 0.2-0.3 mm.

[0008] Optionally, a die-bonding region for accommodating the light-emitting chip is formed above the heat-conducting member, and the first conductive member and the second conductive member are arranged at edges of the die-bonding region.

[0009] Optionally, the interval between the first conductive member and the heat conductive member is set to 0.25-0.45 mm, and the interval between the second conductive member and the heat conductive member is set to 0.25-0.45 mm.

[0010] Optionally, the first conductive member and the second conductive member both extend along the edge of the heat conductive member, and the first conductive member and the second conductive member are arranged around the outer circumference of the heat conductive member.

[0011] Optionally, the first conductive member and the second conductive member are configured as two slot-shaped pads with openings facing each other and are respectively located on opposite sides of the heat conductive member.

[0012] Optionally, a plurality of the light-emitting chips are provided and evenly distributed in a matrix above the heat-conducting member, and each row of the light-emitting chips is connected in series between the first conductive member and the second conductive member.

[0013] Optionally, a first avoidance groove and a second avoidance groove are provided on an edge of the heat conducting member, the first conductive member is provided in the first avoidance groove, and the second conductive member is provided in the second avoidance groove.

[0014] Optionally, the first conductive members and the second conductive members are arranged one-to-one in at least two groups, all the first conductive members are arranged adjacent to each other on a first side of the heat conductive member, and all the second conductive members are arranged adjacent to each other on a second side of the heat conductive member.

[0015] Optionally, a plurality of the light-emitting chips are provided and evenly distributed above the heat-conducting member, and a plurality of the light-emitting chips are connected in series between each group of opposite first conductive members and second conductive members.

[0016] An LED packaging structure comprises the LED packaging bracket as described in any one of the above items.

[0017] The LED packaging bracket and LED packaging structure provided in the present application can increase the area of ​​the heat dissipation region through the form of thermal and electrical separation, thereby improving the heat dissipation effect and preventing high voltage breakdown from damaging the chip, which is conducive to achieving a high degree of integration of the light-emitting chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0019] Figure 1 A schematic structural diagram of an LED packaging structure shown in the first embodiment;

[0020] Figure 2 A schematic diagram showing the positions of the heat-conducting member and the electrical conductor in the first embodiment;

[0021] Figure 3 A cross-sectional view of an LED packaging structure shown in a first embodiment;

[0022] Figure 4This is a cross-sectional view of the LED packaging structure shown in the first embodiment after being packaged in a double-layer dispensing manner;

[0023] Figure 5 A schematic structural diagram of an LED packaging structure shown in a second embodiment;

[0024] Figure 6 This is a schematic diagram showing the positions of the heat-conducting member and the electrical conductor in the second embodiment.

[0025] In the figure: 1. bracket body; 2. heat-conducting member; 3. first conductive member; 4. second conductive member; 5. light-emitting chip; 6. red fluorescent glue; 7. green fluorescent glue; 8. solid crystal area. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] like Figure 1-Figure 6 As shown, the embodiment of the present application provides an LED package bracket, including a bracket body 1, a heat conductive member 2, a first conductive member 3 and a second conductive member 4. The heat conductive member 2, the first conductive member 3 and the second conductive member 4 are all arranged on the bracket body 1, and the bracket body 1 can support and carry the heat conductive member 2 and the first conductive member 3 and the second conductive member 4. In some embodiments, the material of the bracket body 1 can be set to plastic material; or, in some embodiments, the material of the bracket body 1 can also be set to ceramic material, and the specific material is not limited.

[0028] In the embodiment of the present application, the material of the bracket body 1 is preferably plastic. During processing, the first conductive member 3, the second conductive member 4 and the heat conductive member 2 are all set to metal copper material. The positions of the heat conductive member 2, the first conductive member 3 and the second conductive member 4 can be fixed first, and then the bracket body 1 is formed by injection molding of plastic material, thereby forming an integrated structure. Of course, the bracket body 1 can also be injection molded first, and then the heat conductive member 2, the first conductive member 3 and the second conductive member 4 are bonded and installed.

[0029] Specifically, a crystal-fixing region 8 is formed above the heat-conducting member 2, and the crystal-fixing region 8 is used to accommodate the light-emitting chip 5, so that the heat generated by the light-emitting chip 5 can be dissipated through the heat-conducting member 2 below. For example, a concave cavity is provided above the bracket body 1, the crystal-fixing region 8 is located inside the concave cavity, and the heat-conducting member 2 is located at the bottom of the concave cavity. In this way, the light-emitting chip 5 is located above the heat-conducting member 2, which is conducive to improving the heat dissipation effect of the light-emitting chip 5.

[0030] The first conductive member 3 and the second conductive member 4 are arranged at intervals and constitute the positive electrode and the negative electrode respectively. The first conductive member 3 and the second conductive member 4 are respectively connected to the two ends of the light-emitting chip 5 so that the light-emitting chip 5 is electrically conductive and emits light. The thermal conductive member 2 is located between the first conductive member 3 and the second conductive member 4. For example, the first conductive member 3 and the second conductive member 4 are respectively located on both sides of the thermal conductive member 2, or the first conductive member 3 and the second conductive member 4 are both provided with a plurality of them and are arranged around the circumference of the thermal conductive member 2. Of course, this solution is not limited to the thermal conductive member 2 being located between the first conductive member 3 and the second conductive member 4, and the first conductive member 3 and the second conductive member 4 may also be located on the same side of the thermal conductive member 2.

[0031] Moreover, the first conductive member 3 and the second conductive member 4 are both spaced apart from the heat conductive member 2 through the bracket body 1. For example, the first conductive member 3, the second conductive member 4 and the heat conductive member 2 are respectively fixed at different positions of the bracket body 1, and a partial area of ​​the bracket body is embedded in the spacing area between the above-mentioned members, thereby forming a thermal resistance isolation. In this way, through the form of thermoelectric separation, the area of ​​the solid crystal area 8 and the heat dissipation area is increased, thereby improving the heat dissipation effect, and preventing high voltage breakdown from damaging the light-emitting chip 5, which is conducive to achieving a high degree of integration of the light-emitting chip 5.

[0032] In the specific scheme, the distance between the heat conductor 2 and the first conductive member 3 is set to 0.25-0.45 mm, and the distance between the heat conductor 2 and the second conductive member 4 is set to 0.25-0.45 mm. When the distance between the heat conductor 2 and the first conductive member 3 / the second conductive member 4 is less than 0.25 mm, the creepage distance is too short, and it is easy to generate high-voltage arc discharge and damage the light-emitting chip 5. When the distance between the heat conductor 2 and the first conductive member 3 / the second conductive member 4 is greater than 0.45 mm, firstly, the area of ​​the solid crystal region 8 will be narrowed, and the number of light-emitting chips 5 will be reduced, which is not conducive to achieving high integration; secondly, since the heat conductor 2 and the first conductive member 3 / the second conductive member 4 are made of plastic material, the distance greater than 0.45 mm will easily cause the bracket body 1 to break; thirdly, the distance between the heat conductor 2 and the first conductive member 3 / the second conductive member 4 is greater than 0.45 mm, which will cause the arc of the welding wire to be too long, resulting in an unstable arc trajectory. Therefore, by reasonably designing the distance between the heat conductor 2 and the first conductive member 3 and the second conductive member 4, it is possible to avoid high voltage arc discharge from damaging the light emitting chip 5, and improve the structural strength and stability, which is conducive to achieving high integration of the light emitting chip 5.

[0033] In some embodiments, the height of the first conductive member 3 and the second conductive member 4 is greater than the height of the thermal conductive member 2, so that the upper surfaces of the first conductive member 3 and the second conductive member 4 protrude upward from the upper surface of the thermal conductive member 2. The above-mentioned solid crystal region 8 is located between the first conductive member 3 and the second conductive member 4, that is, the first conductive member 3 and the second conductive member 4 constitute the boundary position of the solid crystal region 8, for example, the first conductive member 3 and the second conductive member 4 are respectively located on both sides of the solid crystal region 8, or the first conductive member 3 and the second conductive member 4 are both provided with multiple and arranged around the periphery of the solid crystal region 8. In this way, when the light-emitting chip 5 is fixed by the solid crystal glue in the solid crystal region 8, the solid crystal glue can be prevented from being thrown onto the upper surface of the first conductive member 3 / the second conductive member 4, thereby ensuring the stability and reliability of the secondary welding of the light-emitting chip 5 and the first conductive member 3 / the second conductive member 4. Moreover, due to the height difference formed by the thermal conductor 2 and the first conductive member 3 / the second conductive member 4, it is convenient to use a double-layer glue dispensing method to perform LED packaging operations, thereby improving the excitation efficiency of the phosphor and the luminous brightness of the product. For example, a layer of red fluorescent glue 6 is applied to the solid crystal area 8 close to the thermal conductor 2. The layer of red fluorescent glue is flush with the light-emitting chip 5, and then a layer of green fluorescent glue 7 is applied to the side of the red fluorescent glue 6 away from the thermal conductor 2, thereby improving the excitation efficiency of the phosphor.

[0034] In a specific solution, the height difference between the first conductive member 3 and the second conductive member 4 and the heat conductive member 2 is set to 0.2-0.3 mm, for example, the height difference is set to 0.25 mm. Since the height of the light emitting chip 5 is generally 0.2-0.3 mm, the height difference can be designed according to the height of the required packaged light emitting chip 5. If the height difference is too small, the bonding adhesive will easily adhere to the upper surface of the first conductive member 3 and the second conductive member 4. If the height difference is too large, it will affect the structural stability of the bracket body 1.

[0035] like Figure 1-4 As shown, in the first embodiment, the first conductive member 3 and the second conductive member 4 both extend along the edge of the heat conductive member 2, and the two ends of the first conductive member 3 and the second conductive member 4 are close to each other, so that the first conductive member 3 and the second conductive member 4 form a ring, and the first conductive member 3 and the second conductive member 4 surround one circle of the heat conductive member 2. For example, the extension lengths of the first conductive member 3 and the second conductive member 4 are consistent, and the first conductive member 3 and the second conductive member 4 surround half a circle of the heat conductive member 2 respectively; for another example, the length of the first conductive member 3 is greater than the length of the second conductive member 4, the first conductive member 3 surrounds two-thirds of the circle of the heat conductive member 2, and the second conductive member 4 surrounds one-third of the circle of the heat conductive member 2; in addition, two first conductive members 3 and two second conductive members 4 are each provided, each first conductive member 3 surrounds half a circle of the heat conductive member 2, and each second conductive member 4 surrounds half a circle of the heat conductive member 2.

[0036] It should be noted that there is a gap between the end of the first conductive member 3 and the end of the second conductive member 4 to avoid a short circuit between the positive and negative electrodes.

[0037] In a preferred embodiment, both the first conductive member 3 and the second conductive member 4 are configured as grooved pads, which have through grooves for partial embedding of the heat conducting member 2. Specifically, the width of the grooved pad remains consistent in the extending direction, that is, the shape of the grooved pad can be set as U-shaped, V-shaped, n-shaped, C-shaped, semi-circular arc-shaped, C-shaped, etc. Among them, when the heat conducting member 2 is configured as a square, the first conductive member 3 and the second conductive member 4 can be distributed relative to the midline of the heat conducting member 2, or relative to the diagonal of the heat conducting member 2, that is, the shapes of the first conductive member 3 and the second conductive member 4 can be U-shaped, V-shaped, n-shaped, and C-shaped, etc.; when the heat conducting member 2 is configured as a circle, the shapes of the first conductive member 3 and the second conductive member 4 can be semi-circular arc-shaped, C-shaped, etc.

[0038] Moreover, the openings of the first conductive member 3 and the second conductive member 4 face each other and are respectively located on both sides of the heat conducting member 2, and then the first conductive member 3 and the second conductive member 4 surround the outer periphery of the heat conducting member 2. In this way, it is beneficial to simplify the structure and the processing technology. At the same time, the electrical connection positions are widely distributed, which is convenient for realizing the electrical connection of the light-emitting chip 5 and the connection of the external positive and negative circuits.

[0039] In a specific embodiment, the heat conducting member 2 is configured as a square, and the first conductive member 3 and the second conductive member 4 can be distributed on both sides relative to the midline of the heat conducting member 2. A plurality of light-emitting chips 5 are provided and are evenly distributed in a matrix in the die bonding area 8 (that is, above the heat conducting member 2), that is, the plurality of light-emitting chips 5 have multiple rows and multiple columns. Among them, the arrangement directions of the plurality of light-emitting chips 5 in the same row are consistent with the arrangement directions of the first conductive member 3 and the second conductive member 4. The light-emitting chips 5 in each row are connected in series, and the two ends are respectively electrically connected to the first conductive member 3 and the second conductive member 4, so as to realize the electrical connection of the light-emitting chips 5 in each row and each column. In this way, it is beneficial to realize the high integration of the light-emitting chips 5, and then improve the light-emitting brightness of the product.

[0040] Of course, in other embodiments, all the light-emitting chips 5 in the die bonding area 8 can also be connected in series to meet the corresponding design requirements.

[0041] As Figure 5-6 shown, in the second embodiment, a first avoidance groove and a second avoidance groove are provided on the outer periphery of the heat conducting member 2. The first conductive member 3 is arranged in the first avoidance groove, and the second conductive member 4 is arranged in the second avoidance groove. In this way, by embedding the first conductive member 3 and the second conductive member 4 relative to the heat conducting member 2, thermoelectric separation is realized, and the structure is compact.

[0042] In a preferred embodiment, a first conductive member 3 and a second conductive member 4 form a group, and at least two first conductive members 3 and second conductive members 4 are provided and the number is the same, that is, at least two groups of first conductive members 3 and second conductive members 4 are provided relatively to each other. For example, two or three first conductive members 3 and second conductive members 4 are provided. Among them, all first conductive members 3 are arranged adjacent to each other and arranged in sequence along the edge of the heat conductive member 2, all second conductive members 4 are arranged adjacent to each other and arranged in sequence along the edge of the heat conductive member 2, and all first conductive members 3 and second conductive members 4 are respectively located on the first side and the second side of the heat conductive member 2, so that one of the first conductive members 3 is opposite to one of the second conductive members 4. In this way, the first conductive members 3 and the second conductive members 4 of different electrodes are respectively located on both sides of the heat conductive member 2, so as to realize the electrical connection of the light-emitting chip 5 and the electrical connection of the external circuit.

[0043] The heat conducting member 2 is arranged in a circular shape, and the number of the first avoidance groove and the second avoidance groove can be at least two, and they are evenly distributed along the circumference of the heat conducting member 2, and the corresponding central angles between the two adjacent ones are equal. Each first conductive member 3 is arranged one-to-one in the first avoidance groove, and the second conductive member 4 is arranged one-to-one in the second avoidance groove.

[0044] Here, the specific shape of the heat conductor 2 is not limited, and the heat conductor 2 can be set to a square or a circle. When the heat conductor 2 is set to a circle, all the first conductive members 3 are arranged in a semicircular arc line and surround the half circle of the heat conductor 2, and all the second conductive members 4 are arranged in a semicircular arc line and surround the other half circle of the heat conductor 2. Here, the number of the first conductive members 3 and the second conductive members 4 can be set to two, three or four, for example, the first conductive members 3 and the second conductive members 4 are each provided with two, and the two first conductive members 3 and the two second conductive members 4 are distributed in a quadrilateral. Moreover, the specific shape of the first conductive member 3 and the second conductive member 4 is preferably and not limited to being set to a square, as long as it can be partially embedded in the avoidance groove, for example, it can also be set to a circle, a quadrilateral, a pentagon, etc.

[0045] In the specific solution, a plurality of light-emitting chips 5 are provided and evenly distributed in the die-bonding area 8. A first conductive member 3 and a second conductive member 4 located on opposite sides of the heat-conducting member 2 form a group, and a plurality of light-emitting chips 5 are provided between each group of the first conductive member 3 and the second conductive member 4. These light-emitting chips 5 are connected in series in sequence, and the two ends are electrically connected to the first conductive member 3 and the second conductive member 4 of the group, respectively, so as to realize the electrical connection of all the light-emitting chips 5. In this way, it is conducive to realizing the high integration of the light-emitting chips 5, and thus improving the luminous brightness of the product.

[0046] The embodiment of the present application provides an LED packaging structure, including the LED packaging bracket in the above embodiment. In this way, the area of ​​the die-bonding region 8 and the heat dissipation region is increased through the form of thermal and electrical separation, thereby improving the heat dissipation effect and preventing high voltage breakdown from damaging the light-emitting chip 5, which is conducive to achieving a high degree of integration of the light-emitting chip 5.

[0047] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0048] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0049] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0050] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0051] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.

[0052] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. An LED packaging bracket, characterized in that: It includes a bracket body, on which a heat conductor, a first conductive member and a second conductive member are arranged. The heat conductor is used to dissipate heat from a light-emitting chip; the first conductive member and the second conductive member are used to respectively connect the positive and negative electrodes of the light-emitting chip; and the first conductive member and the second conductive member are both spaced apart from the heat conductor through the bracket body.

2. The LED package bracket according to claim 1, characterized in that: The heights of the first conductive member and the second conductive member are both greater than the height of the heat conductive member.

3. The LED package bracket according to claim 2, characterized in that: The difference between the height of the first conductive member and the second conductive member and the height of the thermal conductive member is 0.2-0.3 mm.

4. The LED package bracket according to claim 2, characterized in that: A die-bonding region for accommodating the light-emitting chip is formed above the heat-conducting member, and the first conductive member and the second conductive member are arranged at the edge of the die-bonding region.

5. The LED package bracket according to claim 1, characterized in that: The interval between the first conductive member and the heat conductive member is set to 0.25-0.45 mm, and the interval between the second conductive member and the heat conductive member is set to 0.25-0.45 mm.

6. The LED package bracket according to claim 1, characterized in that: The first conductive member and the second conductive member both extend along the edge of the heat conductive member, and the first conductive member and the second conductive member are disposed around the outer circumference of the heat conductive member.

7. The LED package bracket according to claim 6, characterized in that: The first conductive member and the second conductive member are configured as two slot-shaped pads with openings facing each other and are respectively located at two opposite sides of the heat conductive member.

8. The LED package bracket according to claim 7, characterized in that: The light emitting chips are provided in plurality and are evenly distributed in a matrix above the heat conducting member, and each row of the light emitting chips is connected in series between the first conductive member and the second conductive member.

9. The LED package bracket according to claim 1, characterized in that: A first avoidance groove and a second avoidance groove are arranged at the edge of the heat conducting member, the first conductive member is arranged in the first avoidance groove, and the second conductive member is arranged in the second avoidance groove.

10. The LED package bracket according to claim 1, characterized in that: The first conductive members and the second conductive members are arranged one by one in at least two groups, all the first conductive members are arranged adjacent to each other on a first side of the heat conductive member, and all the second conductive members are arranged adjacent to each other on a second side of the heat conductive member.

11. The LED package bracket according to claim 10, characterized in that: A plurality of the light-emitting chips are arranged and evenly distributed above the heat-conducting member, and a plurality of the light-emitting chips are connected in series between each group of the first conductive member and the second conductive member relative to each other.

12. An LED packaging structure, characterized in that: The LED package bracket comprises the LED package bracket according to any one of claims 1 to 11.

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