Heating tape and heating method

Abstract

The invention discloses a heating tape and a heating method. The heating belt comprises a heating main belt which comprises a first heating layer covering the surface of a heated part; the heating sub-band is connected with the heating main band and comprises a second heating layer and at least one force application structure, the second heating layer covers the surface of the heated part, and the at least one force application structure is located on the upper surface of the second heating layer and used for adjusting pressure applied to the second heating layer; the controller is connected with the heating main belt and is configured to obtain current temperature data of the heating sub-belts in response to the fact that the heating main belt reaches the target temperature; judging whether the current temperature of the heating sub-band reaches the target temperature or not; and in response to the situation that the current temperature of the heating sub-band does not reach the target temperature, the pressure applied to the force application structure is adjusted so as to adjust the heat conductivity coefficient between the second heating layer and the heated part. According to the invention, the heating temperature of the heating sub-band can be reversibly adjusted in real time, and the uniformity and sensitivity of the overall temperature adjustment of the heating band are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a heating belt, a heating method, and a computer-readable storage medium. Background Art

[0002] In current semiconductor equipment, the heating belt is a long belt-shaped structure consisting of an insulation layer and a heating layer. Generally speaking, the power supply (AC) device of the heating belt, as well as some temperature control equipment, such as temperature control thermocouples and over-temperature alarm thermocouples, will only be installed on a certain section of the heating belt, and will not be distributed on the entire section of the belt. This means that the range of temperature control and adjustment for the entire heating belt is limited, and can only be more accurately reflected on the heating belt section including the temperature control equipment, while the temperature of the heating belt area far away from other sections connected to the above-mentioned temperature control devices cannot be well controlled. Therefore, the problem of uneven heating temperature of the heating belt as a whole is prone to occur. At this time, if it is affected by factors such as ambient temperature and differences in processing and installation, it will cause obvious differences in temperature between other sections on the heating belt, which will eventually increase the defect of uneven heating temperature of the heating belt as a whole.

[0003] In order to solve the above problems existing in the prior art, the art urgently needs an improved heating technology that can perform real-time reversible adjustment on the heating temperature of the heating sub-belt, thereby improving the uniformity and sensitivity of the overall temperature regulation of the heating belt. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a heating belt, a heating method, and a computer-readable storage medium, which can perform real-time reversible adjustment on the heating temperature of the heating sub-belt, thereby improving the uniformity and sensitivity of the overall temperature regulation of the heating belt.

[0006] Specifically, the above-mentioned heating belt provided according to the first aspect of the present invention includes: a heating main belt, including a first heating layer, covering the surface of the heat receiving part, and used to heat the heat receiving part; a heating sub-belt, connected to the heating main belt, including a second heating layer and at least one force-applying structure, wherein the second heating layer covers the surface of the heat receiving part, and the at least one force-applying structure is located on the upper surface of the second heating layer, and is used to adjust the pressure applied to the second heating layer; and a controller, connected to the heating main belt, and configured to: in response to the heating main belt reaching a target temperature, obtain current temperature data of the heating sub-belt; determine whether the current temperature of the heating sub-belt reaches the target temperature; and in response to the current temperature of the heating sub-belt not reaching the target temperature, adjust the pressure applied to the force-applying structure to adjust the thermal conductivity between the second heating layer and the heat receiving part.

[0007] Furthermore, in some embodiments of the present invention, in the step of adjusting the pressure applied to the force structure to adjust the thermal conductivity between the second heating layer and the heated part in response to the current temperature of the heating sub-band not reaching the target temperature, the controller is further configured to: in response to the current temperature of the heating sub-band being lower than the target temperature, increase the pressure applied to the force structure to increase the thermal conductivity between the second heating layer and the heated part; and in response to the current temperature of the heating sub-band being higher than the target temperature, reduce the pressure applied to the force structure to reduce the thermal conductivity between the second heating layer and the heated part.

[0008] Furthermore, in some embodiments of the present invention, the second heating layer includes a plurality of heating units, and the heating sub-band includes a plurality of the force-applying structures, wherein a first force-applying structure located above the heating unit is used to apply a first pressure, and a second force-applying structure located between adjacent heating units is used to apply a second pressure, and the second pressure is greater than the first pressure.

[0009] Furthermore, in some embodiments of the present invention, the heating belt also includes: a heat-conducting layer, located between the second heating layer and the heat receiving part, wherein the thermal conductivity of the heat-conducting layer is positively correlated with the degree of change of its stress field, and the degree of change of the stress field is positively correlated with the pressure applied on the force-applying structure.

[0010] Furthermore, in some embodiments of the present invention, the force-applying layer is made of a high-temperature resistant material that is deformable and recoverable.

[0011] Furthermore, in some embodiments of the present invention, a scale is provided on the force-applying layer for recording the force-applying pressure scale corresponding to the degree of change of the stress field of the thermal conductive layer.

[0012] Furthermore, in some embodiments of the present invention, a heat insulating layer is included between the second heating layer and the force applying structure, and the force applying structure is detachably fixed on the heat insulating layer.

[0013] Furthermore, in some embodiments of the present invention, the heating belt comprises: a plurality of heating sub-belts, and the plurality of heating sub-belts are connected in series or in parallel with the main heating belt.

[0014] Furthermore, in some embodiments of the present invention, the main heating belt and the sub-heating belt are arranged in a gas delivery pipeline and / or outside an exhaust pipeline in a semiconductor device.

[0015] In addition, the above-mentioned heating method provided according to the second aspect of the present invention includes the following steps: in response to the main heating belt in the above-mentioned heating belt provided by the first aspect of the present invention reaching the target temperature, obtaining the current temperature of the heating sub-belt; judging whether the current temperature of the heating sub-belt reaches the target temperature; and in response to the current temperature of the heating sub-belt not reaching the target temperature, adjusting the pressure applied to the force-applying structure in the heating sub-belt to adjust the thermal conductivity between the second heating layer and the heat receiving part.

[0016] Furthermore, in some embodiments of the present invention, the second heating layer includes a plurality of heating units, the heating sub-band includes a plurality of the force-applying structures, and the step of adjusting the pressure applied to the force-applying structure in the heating sub-band in response to the current temperature of the heating sub-band not reaching the target temperature to adjust the thermal conductivity between the second heating layer and the heated part includes: in response to the current temperature of the heating sub-band not reaching the target temperature, applying a first pressure to a first force-applying structure located above the heating unit, and applying a second pressure to a second force-applying structure located between adjacent heating units to adjust the thermal conductivity of each area between the second heating layer and the heated part in a partitioned manner, wherein the second pressure is greater than the first pressure.

[0017] In addition, according to the third aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the above-mentioned heating method provided by the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0019] Figure 1 A schematic structural diagram of a heating belt provided according to some embodiments of the present invention is shown;

[0020] Figure 2 It shows a schematic structural diagram of a heating belt provided according to some other embodiments of the present invention;

[0021] Figure 3 A schematic diagram showing the structure of a heating sub-belt provided according to some embodiments of the present invention; and

[0022] Figure 4 A flow chart of a heating method provided according to some embodiments of the present invention is shown.

[0023] Reference numerals:

[0024] 100 Heating tape;

[0025] 110 heating main belt;

[0026] 111 first heating layer;

[0027] 112, 214 thermal insulation;

[0028] 120 controller;

[0029] 131 Power supply device;

[0030] 132 Temperature control thermocouple;

[0031] 133 Over temperature alarm thermocouple;

[0032] 134 monitoring thermocouple;

[0033] 210 heating sub-band;

[0034] 211 second heating layer;

[0035] 212 force application structure;

[0036] 213 heat conducting layer; and

[0037] Steps S410 to S430. DETAILED DESCRIPTION

[0038] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0039] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0041] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0042] As mentioned above, in current semiconductor equipment, the heating belt is a long belt-shaped structure, which is composed of an insulation layer and a heating layer. Generally speaking, the power supply (AC) device of the heating belt, as well as some temperature control equipment, such as temperature control thermocouples and over-temperature alarm thermocouples, will only be installed on a certain section of the heating belt, and will not be distributed on the entire section of the belt. This means that the range of temperature control and adjustment for the entire heating belt is limited, and can only be more accurately reflected on the heating belt section including the temperature control equipment, while the temperature of the heating belt area far away from other sections connected to the above-mentioned temperature control devices cannot be well controlled. Therefore, the problem of uneven heating temperature of the heating belt as a whole is prone to occur. At this time, if it is affected by factors such as ambient temperature and processing and installation differences, it will cause differences in temperature between other sections on the heating belt, which will eventually lead to the defect of uneven heating temperature of the heating belt as a whole.

[0043] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a heating belt, a heating method, and a computer-readable storage medium, which can perform real-time reversible adjustment of the heating temperature of the heating sub-belt, thereby improving the uniformity and sensitivity of the overall temperature regulation of the heating belt.

[0044] In some non-limiting embodiments, the heating belt provided in the first aspect of the present invention can be used to implement the heating method provided in the second aspect of the present invention.

[0045] Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the third aspect of the present invention stores computer instructions, which, when executed by a processor, can be used to implement the heating method provided in the second aspect of the present invention.

[0046] The working principle of the above-mentioned heating belt will be described below in conjunction with some embodiments of the heating method. Those skilled in the art will understand that these embodiments of the heating method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the heating belt. Similarly, the heating belt is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the implementation subject of each step in these heating methods.

[0047] Please see Figure 1 , Figure 1 A schematic structural diagram of a heating belt provided according to some embodiments of the present invention is shown.

[0048] like Figure 1As shown, in some embodiments of the present invention, the heating belt 100 may include a heating main belt 110 and a controller 120 connected thereto. A power supply device 131 and a temperature-controlled thermocouple 132 may be connected between the heating main belt 110 and the controller 120 to adjust the temperature of the heating main belt 110. Specifically, the heating main belt 110 may include a first heating layer 111. The first heating layer 111 covers the surface of the heated part (not shown in the drawings) and is used to heat the heated part. Optionally, the first heating layer 111 may be a resistance heating layer, that is, the first heating layer 111 includes a resistance wire. After the heating main belt 110 is powered on, electrical energy is converted into thermal energy, thereby heating the heated part. Preferably, a heat insulating layer 112 may be added between the first heating layer 111 and the heated part to reduce heat loss inside the first heating layer 111.

[0049] like Figure 1 As shown, the controller 120 can directly adjust the temperature of the heating main belt 110 by adjusting the output power of the temperature control thermocouple 132. Specifically, after the target temperature is preset in the controller 120, the controller can then adjust the output power of the temperature control thermocouple 132 to make the first heating layer 111 reach the target temperature. Preferably, an over-temperature alarm thermocouple 133 can also be provided on the heating main belt 110, which is used to timely alarm when the temperature of the heating main belt 110 is too high to remind the staff.

[0050] Furthermore, for the heating belt 100 used in semiconductor equipment, it is usually necessary to configure it in the gas delivery pipeline and / or on the outside of the exhaust pipeline. When the heating belt 100 is configured in the gas delivery pipeline, its main function is to control the temperature of the reaction source so that it remains in a suitable temperature range that is conducive to the process reaction. When the heating belt 100 is configured on the outside of the exhaust pipeline, its main function is to prevent the exhausted gas from condensing and clogging the pipeline. For these heating belts 100 configured in the pipeline, the length of the single-section heating main belt 110 cannot meet the pipeline heating requirements, and the length of the heating belt 100 usually needs to match the length of the pipeline to ensure that the temperature of the gas in the pipeline is uniform during the transmission process.

[0051] In order to further extend the length of the heating belt 100 and improve its heating range, a heating sub-belt 210 may be connected to the heating main belt 110. Figure 2 , Figure 2 A schematic structural diagram of a heating belt provided according to some other embodiments of the present invention is shown.

[0052] like Figure 2As shown, the heating belt 100 may include a heating sub-belt 210. The number of sections of the heating sub-belt 210 may be increased or decreased according to the actual needs of the pipeline. Preferably, the heating belt 100 may include multiple sections of heating sub-belts 210, wherein the multiple sections of heating sub-belts 210 may be connected to the heating main belt 110 in series or in parallel. Furthermore, each section of the heating sub-belt 210 may be connected to a monitoring thermocouple 134 for real-time monitoring of the temperature change of the heating sub-belt 210, and feedback to the controller 120, and the temperature of the heating sub-belt 210 is adjusted by the controller 120 to heat or cool.

[0053] Due to the limitation of installation conditions, it is impossible to configure a corresponding controller for each heating sub-belt 210 in the entire heating belt 100 to adjust its temperature. For the multiple heating sub-belts 210 far away from the controller 120, it is impossible to control their temperatures well and make them reach the target temperature uniformly only by adjusting the output power of the controller 120. In this regard, in order to ensure that the heating temperature of the multiple heating sub-belts 210 can be consistent with the heating temperature of the heating main belt 110, please refer to Figure 3 , Figure 3 A schematic structural diagram of a heating sub-band provided according to some embodiments of the present invention is shown.

[0054] like Figure 3 As shown, in some embodiments of the present invention, the heating sub-belt 210 may include a second heating layer 211 and at least one force-applying structure 212. The second heating layer 211 may cover the surface of the heated portion (not shown in the drawings) for heating the heated portion. At least one force-applying structure 212 may be located on the upper surface of the second heating layer 211 for adjusting the pressure applied to the second heating layer 211, thereby adjusting the thermal conductivity between the second heating layer 211 and the heated portion.

[0055] In some optional embodiments, at least one force-applying structure 212 may be provided as a whole layer structure laid on the upper surface of the second heating layer 211. In other embodiments, at least one force-applying structure 212 may also be provided as a plurality of force-applying structures laid on the upper surface of the second heating layer 211 in the form of an array structure.

[0056] In the present invention, the controller 120 connected to the heating main belt 110 can be configured to execute the heating method provided by another aspect of the present invention, which can specifically include the following steps: in response to the heating main belt 110 reaching the target temperature, obtaining the current temperature of the heating sub-belt 210; judging whether the current temperature of the heating sub-belt 210 reaches the target temperature; and in response to the current temperature of the heating sub-belt 210 not reaching the target temperature, adjusting the pressure applied to the force structure 212 to adjust the thermal conductivity between the second heating layer 211 and the heated part.

[0057] Specifically, if Figure 2 As shown, the target temperature of the heating main belt 110 can be preset in the controller 120 in advance so that it meets the temperature requirements of the pipelines in the semiconductor equipment. Then, the controller 120 can adjust the output power of the temperature-controlled thermocouple 132. After the output power is adjusted and the temperature of the heating main belt 110 is stabilized, the heating main belt 110 can reach the target temperature. At this time, by connecting the monitoring thermocouples 134 of each section of the heating sub-belt 210, the controller 120 can obtain the current temperature data of each section of the heating sub-belt 210. Since each section of the heating sub-belt 210 is not equipped with a corresponding temperature-controlled thermocouple 132, the temperature of each section of the heating sub-belt 210 cannot reach the target temperature uniformly. In this regard, the temperature can be further adjusted by adjusting the force applied by the force-applying structure 212 to make the heating temperature of the entire heating belt 100 uniform.

[0058] In some optional embodiments, the controller 120 may compare the difference between the current temperature of the heating sub-belt 210 and the preset target temperature. When it is determined that the current temperature of the heating sub-belt 210 is lower than the target temperature, the pressure applied to the force-applying structure 212 may be increased, thereby increasing the contact area between the second heating layer 211 and the surface of the heated portion, thereby increasing the thermal conductivity between the second heating layer 211 and the heated portion, and thereby increasing the temperature of the heated portion.

[0059] For example, in the initial state, there may be a gap between the second heating layer 211 and the heat receiving part, and heat is transferred between the two by thermal radiation. After the second heating layer 211 is pressed down by the force-applying structure 212, the second heating layer 211 is close to the heat receiving part, and the heat transfer method between the two is changed to heat conduction, thereby reducing the thermal resistance between the second heating layer 211 and the heat receiving part and improving the thermal conductivity between the two.

[0060] On the contrary, when it is determined that the current temperature of the heating sub-belt 210 is greater than the target temperature, the pressure applied to the force-applying structure 212 can be reduced, thereby reducing the contact area between the second heating layer 211 and the surface of the heated part, thereby reducing the thermal conductivity between the second heating layer 211 and the heated part, and further reducing the temperature of the heated part.

[0061] For example, in the initial state, the second heating layer 211 can be in close contact with the heated part, and heat is transferred between the two by heat conduction. After the pressure applied to the second heating layer 211 by the force structure 212 is reduced, a gap exists between the second heating layer 211 and the heated part, and the heat transfer method between the two is changed to thermal radiation, thereby increasing the thermal resistance between the second heating layer 211 and the heated part and reducing the thermal conductivity between the two.

[0062] Furthermore, in some preferred embodiments, the second heating layer 211 may also include a plurality of heating units, and the heating sub-belt 210 may also include a plurality of force structures 212 (not shown in the drawings). Optionally, the plurality of heating units and the plurality of force structures 212 in the second heating layer 211 may be arranged in an array, and the number of heating units and force structures 212 may be unequal. The first force structure located above the heating unit may be used to apply a first pressure, and the second force structure located between adjacent heating units may be used to apply a second pressure, wherein the second pressure may be greater than the first pressure. In this embodiment, according to the distribution of the heating units in the second heating layer 211, different pressures are applied to the force structures located at different positions above the second heating layer 211, so that the thermal conductivity of each area between the second heating layer 211 and the heated part can be adjusted in a zoned manner, further achieving uniform heating of the entire heating sub-belt 210, and avoiding the situation where local areas in the heating sub-belt 210 are heated unevenly.

[0063] Those skilled in the art will understand that the arrangement of the above-mentioned multiple heating units and multiple force-applying structures 212 is only a non-limiting implementation method provided by the present invention, which is intended to clearly demonstrate the main concept of the present invention and provide a specific solution that is easy for the public to implement, rather than to limit the scope of protection of the present invention.

[0064] Next, see Figure 3 , Figure 3 A schematic structural diagram of a heating sub-band provided according to some embodiments of the present invention is shown.

[0065] like Figure 3 As shown, in some preferred embodiments, the heating sub-belt 210 may further include a heat-conducting layer 213 whose thermal conductivity can be reversibly adjusted. The heat-conducting layer 213 may be located between the second heating layer 211 and the heated portion, and the thermal conductivity of the heat-conducting layer 213 may be positively correlated with the degree of change of its stress field, and the degree of change of the stress field may be positively correlated with the pressure applied to the force-applying structure 212.

[0066] Specifically, when it is detected that the temperature of the heating sub-belt 210 is lower than the target temperature, the pressure applied to the force-applying structure 212 can be increased to press down the heat-conducting layer 213, which can not only increase the contact area between the second heating layer 211 and the surface of the heat-receiving part, but also increase the degree of change of the stress field of the heat-conducting layer 213, so that the thickness of the heat-conducting layer 213 is reduced. The thermal conductivity of the heat-conducting layer 213 increases as the thickness of the heat-conducting layer 213 decreases, so that the temperature of the heat-receiving part can be increased.

[0067] On the contrary, when it is detected that the temperature of the heating sub-belt 210 is greater than the target temperature, the pressure applied to the force structure 212 can be reduced, which can not only reduce the contact area between the second heating layer 211 and the surface of the heated part, but also reduce the degree of change in the stress field of the heat-conducting layer 213, so that the thickness of the heat-conducting layer 213 can be restored, that is, the thickness of the heat-conducting layer 213 is increased compared to the previous downward pressure state. The thermal conductivity of the heat-conducting layer 213 decreases as the thickness of the heat-conducting layer 213 increases, thereby reducing the temperature of the heated part. Figure 3 In the illustrated embodiment, the force-applying structure 212 may cooperate with the heat-conducting layer 213 to further change the thickness of the heat-conducting layer 213 , thereby adjusting the temperature of the heated portion.

[0068] Optionally, in some embodiments, the material of the heat-conducting layer 213 may be compressible graphene foam. The thermal conductivity of the heat-conducting layer 213 made of compressible graphene composite foam may decrease as its thickness increases.

[0069] In some embodiments of the present invention, the force-applying structure 212 may be made of a high-temperature resistant material that is deformable and recoverable. By selecting a material that is deformable and high-temperature resistant, not only can the service life of the force-applying structure 212 be extended, but also the sensitivity of the force change of the force-applying structure 212 can be maintained, thereby avoiding the problem of delayed temperature adjustment of the heating sub-belt 210. The material of the force-applying structure 212 may include, but is not limited to, silicone, polyester, etc.

[0070] Optionally, a scale portion (not shown in the drawings) may be provided on the force-applying structure 212, which may be used to record the force-applying pressure scale corresponding to the degree of change in the stress field of the heat-conducting layer 213. In this embodiment, by adding the scale portion, the purpose is to record the force-applying pressure scale corresponding to the thickness of the heat-conducting layer 213 compressed each time, so as to facilitate the adjustment of the force-applying structure 212 after the heating sub-belt 210 is installed during subsequent equipment maintenance.

[0071] Furthermore, if Figure 3 As shown, a heat insulating layer 214 can be added between the second heating layer 211 and the force structure 212 to reduce the heat loss inside the second heating layer 211. In addition, the force structure 212 can be detachably fixed to the heat insulating layer 214, so as to facilitate the regular replacement of the force structure 212 to maintain its sensitivity to force changes. For example, one end of the force structure 212 can be detachably fixed to the heat insulating layer 214 using Velcro, and the scale portion can be set on the edge of the Velcro by printing or other forms. Alternatively, the force structure 212 can also be fixed to the heat insulating layer 214 by other forms such as gluing and sewing.

[0072] In order to more clearly describe the heating belt 100, please refer to Figure 4 , Figure 4 A flow chart of a heating method provided according to some embodiments of the present invention is shown.

[0073] like Figure 4 As shown, in some embodiments of the present invention, the heating method may include the following steps: First, step S410 may be performed: in response to the main heating zone in the heating zone reaching the target temperature, the current temperature data of the heating sub-zone is acquired.

[0074] Specifically, it can be combined Figure 2 and Figure 3 It is commonly understood that in some embodiments, the target temperature for heating can be pre-set in the controller 120, and then the heating belt 100 is powered on for heating through the power supply device 131. The controller 120 adjusts the output power of the temperature-controlling thermocouple 132 to directly adjust the temperature of the heating main belt 110 to reach the target temperature. After the temperature read by the temperature-controlling thermocouple 132 on the heating main belt 110 is stable, the current temperature data of each heating sub-belt 210 can be collected in real time through the monitoring thermocouple 134 corresponding to each segment of the heating sub-belt 210, and the current temperature signal is fed back to the controller 120.

[0075] Then, step S420 may be performed: determining whether the current temperature of the heating sub-band reaches the target temperature.

[0076] Specifically, if Figure 2 and Figure 3 As shown, since each heating sub-belt 210 is not equipped with a temperature-controlling thermocouple 132 that can directly adjust the temperature like the heating main belt 110, the temperature of the heating sub-belts without the temperature-controlling thermocouple 132, especially some heating sub-belts 210 that are far away from the heating main belt 110, is likely to fail to reach the target temperature due to environmental and processing factors, etc. The controller 120 can compare the difference between the current temperature of each heating sub-belt 210 and the preset target temperature.

[0077] Thereafter, step S430 may be performed: in response to the current temperature of the heating sub-belt not reaching the target temperature, adjusting the pressure applied to the force-applying structure in the heating sub-belt to adjust the thermal conductivity between the second heating layer and the heat receiving part.

[0078] Specifically, if Figure 2 and Figure 3As shown, when the controller 120 determines that the current temperature of a certain section (or several sections) of the heating sub-belt 210 is lower than the target temperature, the pressure applied to the force-applying structure 212 in this section of the heating sub-belt 210 can be increased, thereby not only increasing the contact area between the second heating layer 211 and the surface of the heated portion, but also increasing the degree of change of the stress field of the heat-conducting layer 213, so that the thickness of the heat-conducting layer 213 is reduced. Since the thermal conductivity of the heat-conducting layer 213 in the present invention increases as the thickness of the heat-conducting layer 213 decreases, the temperature of the heated portion can be increased so that the section of the heating sub-belt 210 reaches the target temperature.

[0079] When the controller 120 determines that the current temperature of a certain section (or several sections) of the heating sub-belt 210 is greater than the target temperature, the pressure applied to the force-applying structure 212 in this section of the heating sub-belt 210 can be reduced, thereby not only reducing the contact area between the second heating layer 211 and the surface of the heated portion, but also reducing the degree of change in the stress field of the heat-conducting layer 213, so that the thickness of the heat-conducting layer 213 is restored (i.e., increased). Since the thermal conductivity of the heat-conducting layer 213 in the present invention decreases as the thickness of the heat-conducting layer 213 increases, the temperature of the heated portion can be reduced so that the section of the heating sub-belt 210 reaches the target temperature.

[0080] Further, in some preferred embodiments, the second heating layer 211 of the heating sub-belt 210 includes a plurality of heating units, and the heating sub-belt 210 may also include a plurality of force structures 212. When the controller 120 determines that the current temperature of the heating sub-belt 210 has not reached the target temperature, it may control the first force structure located above the heating unit to apply a smaller first pressure, and the second force structure located between adjacent heating units to apply a larger second pressure, so as to adjust the thermal conductivity of each area between the second heating layer 211 and the heated portion. According to the distribution of the heating units in the second heating layer 211, a smaller pressure is applied above the first force structure corresponding to the heating unit to slightly reduce the deformation of the heat-conducting layer 213 in the area where the heating unit is provided, thereby slightly reducing its thermal conductivity. A larger pressure is applied above the second force structure without a heating unit (for example, located between the heating units) to slightly increase the deformation of the heat-conducting layer 213 in the area without the heating unit, thereby slightly increasing its thermal conductivity. In this way, the thermal conductivity of each area between the second heating layer 211 and the heated part in the heating sub-belt 210 can be adjusted regionally to further achieve uniform heating of the entire heating sub-belt 210 as a whole, thereby avoiding the situation in the prior art where the temperature difference between each section of the heating sub-belt is caused by factors such as ambient temperature and processing and installation differences, which will lead to uneven heating temperature of the entire heating belt.

[0081] In some optional embodiments of the present invention, when the adjusted current temperature data measured by the monitoring thermocouple 134 of each heating sub-belt 210 is consistent with the target temperature, the force pressure scale corresponding to the degree of change of the stress field of each thermal conductive layer 213 can be recorded on the scale portion on each heating sub-belt 210, so as to facilitate the rapid adjustment of the force structure 212 after the heating sub-belt 210 is installed during subsequent equipment maintenance.

[0082] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0083] In summary, the present invention provides a heating belt, a heating method, and a computer-readable storage medium, which can perform real-time reversible adjustment on the heating temperature of the heating sub-belt, thereby improving the uniformity and sensitivity of the overall temperature regulation of the heating belt.

[0084] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heating belt, It is characterized in that include: A heating main belt is connected to a temperature-controlling thermocouple for adjusting the temperature of the heating main belt; a heating sub-belt connected to the heating main belt, comprising a second heating layer and at least one force-applying structure, wherein the second heating layer covers the surface of the heated portion, and the at least one force-applying structure is located on the upper surface of the second heating layer and is used to adjust the pressure applied to the second heating layer; and A controller is connected to the main heating belt and is configured to: obtain current temperature data of the heating sub-belt in response to the main heating belt reaching a target temperature; determine whether the current temperature of the heating sub-belt has reached the target temperature; and adjust the pressure applied to the force-applying structure in response to the current temperature of the heating sub-belt not reaching the target temperature to adjust the thermal conductivity between the second heating layer and the heat receiving part.

2. The heating belt according to claim 1, It is characterized in that In the step of adjusting the pressure applied by the force-applying structure to adjust the thermal conductivity between the second heating layer and the heat receiving part in response to the current temperature of the heating sub-belt not reaching the target temperature, the controller is further configured to: In response to the current temperature of the heating sub-band being lower than the target temperature, increasing the pressure applied by the force-applying structure to increase the thermal conductivity between the second heating layer and the heat receiving portion; as well as In response to the current temperature of the heating sub-band being greater than the target temperature, the pressure applied to the force-applying structure is reduced to reduce the thermal conductivity between the second heating layer and the heat receiving portion.

3. The heating belt according to claim 1, It is characterized in that The second heating layer includes a plurality of heating units, and the heating sub-band includes a plurality of force-applying structures, wherein a first force-applying structure located above the heating unit is used to apply a first pressure, and a second force-applying structure located between adjacent heating units is used to apply a second pressure, and the second pressure is greater than the first pressure.

4. The heating belt according to claim 1, It is characterized in that The heating sub-band also includes: A heat-conducting layer is located between the second heating layer and the heat receiving part, wherein the thermal conductivity of the heat-conducting layer is positively correlated with the degree of change of its stress field, and the degree of change of the stress field is positively correlated with the pressure applied by the force-applying structure.

5. The heating belt according to claim 4, It is characterized in that The force-applying structure is made of a high-temperature resistant material that is capable of recovering its deformation.

6. The heating belt according to claim 4, It is characterized in that The force-applying structure is provided with a scale portion for recording the force-applying pressure scale corresponding to the degree of change of the stress field of the heat-conducting layer.

7. The heating belt as claimed in claim 6, It is characterized in that A heat insulating layer is included between the second heating layer and the force applying structure, and the force applying structure is detachably fixed on the heat insulating layer.

8. The heating belt as claimed in claim 1, It is characterized in that include: A plurality of heating sub-bands are connected in series or in parallel with the main heating band.

9. The heating belt according to claim 8, It is characterized in that The main heating belt and the sub-heating belt are arranged in a gas delivery pipeline and / or outside an exhaust pipeline in a semiconductor device.

10. A heating method, It is characterized in that The following steps are involved: In response to the main heating zone in the heating zone according to any one of claims 1 to 9 reaching a target temperature, obtaining current temperature data of the heating sub-zone; Determining whether the current temperature of the heating sub-band reaches the target temperature; as well as In response to the current temperature of the heating sub-belt not reaching the target temperature, the pressure applied on the force-applying structure in the heating sub-belt is adjusted to adjust the thermal conductivity between the second heating layer and the heat receiving portion.

11. The heating method according to claim 10, It is characterized in that The second heating layer includes a plurality of heating units, the heating sub-band includes a plurality of the force-applying structures, and in response to the current temperature of the heating sub-band not reaching the target temperature, the step of adjusting the pressure applied to the force-applying structure in the heating sub-band to adjust the thermal conductivity between the second heating layer and the heat receiving part includes: In response to the current temperature of the heating sub-band not reaching the target temperature, a first pressure is applied to a first force-applying structure located above the heating unit, and a second pressure is applied to a second force-applying structure located between adjacent heating units, so as to adjust the thermal conductivity of each area between the second heating layer and the heat receiving part in a partitioned manner, wherein the second pressure is greater than the first pressure.

12. A computer-readable storage medium having computer instructions stored thereon, It is characterized in that When the computer instructions are executed by a processor, the heating method according to any one of claims 10 to 11 is implemented.

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