Heating disc mechanism and thin film deposition equipment thereof

Abstract

The invention discloses a heating disc mechanism and a thin film deposition device thereof.The heating disc mechanism comprises a heating disc carrier and a plurality of heating wire assemblies embedded in the heating disc carrier, the heating disc carrier is provided with a heating surface, and the heating wire assemblies extend from the center of the heating surface to the edge of the heating surface; the heating wire units extend from the edge of the heating surface to the center of the heating surface and are sequentially connected end to end. According to the heating disc mechanism, the heating wire units are uniformly embedded in the heating disc carrier, so that the uniformity of the surface temperature of the heating disc is improved. The heating wire unit adopts the structural design that at least two layers are stacked, the problem of cold points caused by breakpoints existing at the electric connecting end is avoided, and at least two sets of heating wire assemblies are arranged, so that the problem of power failure and downtime of the heating disc caused by faults of a single heating wire is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of heating equipment, and in particular to a heating disk mechanism and a thin film deposition device thereof. Background Art

[0002] The heating plate is a common heating mechanism in the cavity heating of semiconductor coating equipment. The surface temperature uniformity of the heating plate will affect the coating quality. Since the heating plate at the bottom of the cavity of the semiconductor coating equipment is provided with a purge channel, the surface temperature of the heating plate will be uneven when the resistance wire is heated, thus affecting the heating uniformity at the bottom of the cavity. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a heating disk mechanism and a thin film deposition device thereof to solve the technical problem of uneven surface temperature of the heating disk of the prior semiconductor equipment.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] An embodiment of the present invention provides a heating plate mechanism, which includes: a heating plate carrier and a heating wire assembly buried in the heating plate carrier, the heating plate carrier having a heating surface, and the heating wire assembly is composed of a plurality of heating wire units that extend from the center of the heating surface to the edge of the heating surface and then extend from the edge of the heating surface to the center of the heating surface and are connected end to end in sequence.

[0006] Among them, the extension shapes of the plurality of heating wire units are the same, and are arranged in a central symmetric manner around the center of the heating surface.

[0007] Wherein, the heating surface is a circular surface.

[0008] Wherein, the heating plate carrier is also provided with a docking plug, and both ends of the heating wire assembly are fixedly connected to the docking plug.

[0009] Wherein, the heating wire unit is spirally stacked in at least two layers in the thickness direction of the heating plate.

[0010] Wherein, both ends of the heating wire unit extend from the heating surface, and the ends extending from the heating surface are fixedly connected to the docking plug. An insulating block is also provided between the docking plug and the heating surface, and the ends of the heating wire assembly are insulated by the insulating block.

[0011] Wherein, the docking plug includes: a docking mounting block and a protective cover, the protective cover is clamped on the docking mounting block, and the docking mounting block is provided with a cable socket for an external cable and a heating wire socket for plugging the electrical connection end of the heating wire assembly.

[0012] Wherein, the heating wire unit is a structure in which two heating wires are spirally nested in the same direction.

[0013] Wherein, the heating wire assembly is composed of at least two groups of heating wire units distributed in inner and outer rings on the heating surface.

[0014] An embodiment of the present invention further provides a thin film deposition device, which includes the heating plate mechanism as described above.

[0015] The heating plate mechanism of the present invention evenly buries the heating wire unit in the heating plate carrier, thereby improving the uniformity of the surface temperature of the heating plate. The heating wire unit adopts a structural design of at least two layers of stacking to avoid the problem of cold spots caused by breakpoints at the electrical connection end, and at least two groups of heating wire units are provided to avoid the problem of power failure and downtime of the heating plate due to failure of a single heating wire.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the heating plate mechanism according to an embodiment of the present invention.

[0018] Figure 2 1 is an exploded view of a heating plate mechanism according to an embodiment of the present invention.

[0019] Figure 3 FIG. 4 is a top view of a heating plate mechanism according to an embodiment of the present invention.

[0020] Figure 4 for Figure 3 Middle BB section view.

[0021] Figure 5 It is a partial structural schematic diagram of the heating wire unit of the heating plate mechanism of the present invention.

[0022] Figure 6 for Figure 1 Schematic diagram of the enlarged structure of local A in the middle.

[0023] Figure 7 for Figure 4 Schematic diagram of the enlarged structure of part B in the middle.

[0024] Figure 8 4 is a flow chart of the dual-channel temperature control process of the heating plate mechanism of this embodiment.

[0025] Description of reference numerals:

[0026] Heating plate mechanism 100, heating plate carrier 1, heating wire assembly 2, docking plug 3, cable 4, heating surface 10, center 11, edge 12, lower heating wire 21, upper heating wire 22, electrical connection end 211, electrical connection end 212, first part 201, second part 202, protective cover 31, insulating block 32, docking mounting block 33. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0034] The heating plate is a common heating mechanism in the cavity heating of semiconductor coating equipment. The surface temperature uniformity of the heating plate will affect the coating quality. Since the semiconductor coating equipment has a purge channel on the heating plate at the bottom of the cavity, the surface temperature of the heating plate will be uneven when the resistance wire is heating, which will affect the heating uniformity of the bottom of the cavity. At the same time, the end of the existing single heating wire is externally connected to the power cable, so there are breakpoints and cold spots, which will also cause uneven surface temperature of the heating plate. Therefore, based on the above requirements, this embodiment provides a heating plate mechanism 100.

[0035] See also Figures 1 to 7 This embodiment discloses a heating plate mechanism 100, which includes: a heating plate carrier 1 and a heating wire assembly 2 embedded in the heating plate carrier 1, the heating plate carrier 1 having a heating surface 10, and the heating wire assembly 2 is composed of a plurality of heating wire assemblies 20 extending from the center 11 of the heating surface 10 to the edge 12 of the heating surface 10, and then extending from the edge 12 of the heating surface 10 to the center 11 of the heating surface 10, which are connected end to end in sequence. From a top view, the heating wire assembly 2 composed of a plurality of heating wire units 20 is arranged in a ring-shaped wave shape below the heating surface 10.

[0036] The working principle of the heating plate is to generate heat through the embedded heating wire, and then transfer the heat to the heating plate carrier 1, thereby heating the workpiece in contact with it. In this embodiment, the heating wire assembly 20 extends back and forth between the edge 12 and the center 11 of the heating surface 10, and its purpose is to evenly bury the heating wires of the heating wire assembly 20 in the heating plate carrier 1, thereby improving the uniformity of the surface temperature of the heating plate carrier 1.

[0037] Please refer again Figure 4 , one heating wire assembly 20 includes: a first portion 201 extending from the center to the edge of the heating surface 10, and a second portion 202 connected to the end of the first portion 201 and extending from the edge of the heating surface 10 to the center. The first portion 201 and the second portion 202 are both arc-shaped. It can be understood that the heating wire assembly 20 composed of the first portion 201 and the second portion 202 is not formed in a circular shape. Figure 4 The shape shown is limited to this, and it can also be any other shape extending back and forth from the edge to the center of the heating surface 10 , the purpose of which is to allow the heating wires to be evenly arranged in the heating plate carrier 1 .

[0038] In this embodiment, several groups of heating wire assemblies 20 together form a wavy annular heating wire assembly 2. Among them, each heating wire assembly 20 is an integrally formed structure. During processing, the heating wire assembly 2 is formed by bending a single heating wire in the above-mentioned extension direction. It can be understood that in other embodiments, the heating wire assembly 2 can be composed of any number of heating wire units 20, and the extension mode of each heating wire unit 20 can be the same shape or different shapes.

[0039] It should be noted that the single heating wire of the heating wire unit 20 can be a straight rod or an arc rod structure, or a spiral structure. That is, the heating wire assembly 2 can be a single heating wire bent according to the above structure, or a heating spring wire bent according to the above direction.

[0040] In this embodiment, the extension shapes of the plurality of heating wire units 20 are the same, and they are arranged in a central symmetric manner with respect to the center of the heating surface 10. The central symmetry mentioned here means that on the plane of the heating surface 10, with the vertical direction of the center of the heating surface 10 as the rotation axis, after the heating wire assembly 2 rotates once with the same central angle about the rotation axis, the axial projection of the heating wire assembly 2 still overlaps with the initial state. Figure 4 As shown, the number of the heating wire units 20 is five, and the central angle of the central symmetric rotation is 72°. After each rotation of 72°, the projection of the heating wire assembly 2 is still in a coincidence state with the initial position, that is, a central rotation symmetric structure.

[0041] In this embodiment, the heating surface 10 is a circular surface, and the corresponding heating wire units 20 have the same structure, shape and size.

[0042] The heating plate carrier 1 is also provided with a docking plug 3, and both electrical connection ends of the heating wire assembly 2 are fixedly connected to the docking plug 3. The docking plug 3 is connected to the heating plate carrier 1, specifically, the docking plug 3 is connected to the heating plate carrier 1 by screws.

[0043] Please refer again Figure 4 and Figure 7 The heating wire assembly 2 is spirally stacked in at least two layers in the thickness direction of the heating plate carrier 1, namely an upper heating wire 22 and a lower heating wire 21, and the upper heating wire 22 and the lower heating wire 21 are spirally stacked.

[0044] Compared with the heating wire assembly with a single-layer heating wire, the present embodiment adopts a heating wire design with at least two layers of stacked spirals, which has the following advantages: at the electrical connection end 211 and the electrical connection end 212 of the heating wire, since the connection end 211 and the electrical connection end 212 are respectively electrically connected to the positive and negative electrodes of the external power supply, the two must be spaced apart. If it is a single-layer heating wire, there must be a breakpoint at the interval, and there will be a cold spot at the corresponding position of the heating plate carrier 1, which will eventually affect the uniformity of the temperature of the heating surface 10. In the present embodiment, a heating wire design with two or more layers of spiral structure is adopted, and there is no breakpoint at the electrical connection end, thereby reducing the cold spot effect caused by the breakpoint.

[0045] Among them, the two electrical connection ends 211 and 212 of the heating wire unit 20 are both extended from the heating surface 10, and the ends extending from the heating surface 10 are fixedly connected to the docking plug 3. An insulating block 32 is also provided between the docking plug 3 and the heating surface 10, and the two electrical connection ends of the heating wire assembly 2 are insulated and separated by the insulating block 32.

[0046] Please refer again Figure 2 and Figure 6 The butt plug 3 comprises: a butt mounting block 33 and a protective cover 31, wherein the protective cover 31 is clamped on the butt mounting block 33, and the butt mounting block 33 is provided with a cable socket for an external cable 4 and a heating wire socket for plugging the end of the heating wire assembly 2. An insulating block 32 is connected to the bottom of the butt mounting block 33. The butt plug 3 is used to electrically connect the electrical connection end of the heating wire assembly 2 to the external power line, so as to facilitate the subsequent quick and convenient replacement of the power line.

[0047] Furthermore, the heating wire assembly 2 is a structure in which two heating wires are spirally nested in the same direction. That is, the heating wire assembly 2 is a structure in which two heating wires with exactly the same structure and shape are nested in the same direction according to the above structural requirements, and their ends are commonly connected to a docking plug 3. The reason for adopting at least two groups of heating spring wires with the same structure and extending and nesting in the same direction is to avoid equipment downtime caused by the burning or breaking of the heating wires in the heating disk mechanism 100 during long-term operation. Such a heating wire breakage will cause a sudden change in the temperature of the heating disk mechanism 100, thereby affecting the quality of thin film deposition. In this embodiment, the design of two groups of parallel heating wires can avoid the occurrence of the above situation and ensure the quality of thin film deposition.

[0048] In another embodiment, in order to avoid the negative impact of the sudden change in temperature of the heating disk mechanism 100 caused by the breakage or burning of the heating wire, the heating wire assembly 2 is composed of at least two groups of two heating wires distributed in inner and outer rings on the heating surface 10. That is, it can also be composed of at least two heating wires (or heating spring wires) distributed in inner and outer rings on the heating surface 10. It can be understood that, in another embodiment, the heating wire assembly 2 can also be composed of at least two groups of heating wire modules distributed in inner and outer rings on the heating surface 10, and a single heating wire module can be a nested structure of at least two spiral heating wires with the same structure and shape.

[0049] See also Figure 8 , which is a flow chart of the dual-channel temperature control process of the heating plate mechanism of this embodiment. When the heating plate mechanism 100 is working normally, the two sets of heating wire assemblies 2 in parallel are powered on and heated at the same time. The two are started synchronously so that the heating plate reaches the set temperature value. Assume that their respective normal working powers are P1 and P2. When the thin film deposition equipment is started, the current actual temperature t and the rated powers P1 and P2 of the dual-channel resistance wires are collected in real time, and the actual temperature value t is compared with the process set temperature value T. The relationship between the temperature t and the set process temperature T is determined, that is, whether t=T is established. If T=t, the current dual-channel heating wires continue to maintain their respective working powers P1 and P2 unchanged. If not, that is, when t<T, it is further determined whether P1=0 or P2=0 is established. If P1=0 or P2=0, it means that one set of resistance wires is damaged and cannot work normally. Then adjust the other undamaged heating wire to increase the power operation, so that the temperature of the heating plate is quickly restored to the set temperature T. After the processing is completed, the power is turned off to repair the heating plate. If the judgment that P1=0 or P2=0 is not established, that is, both the dual-channel heating wires are working, the manual indicates that the device is currently in the initial heating stage, so return to the first step to obtain the current working temperature t again and make subsequent judgments.

[0050] During the wafer processing, when one set of heating wire assemblies 2 is damaged and cannot work, the other heating wire assembly 2 connected in parallel with it continues to work. At this time, its power needs to be increased to reach the rated power in order to maintain the current working temperature of the heating disk. If any set of heating wires is damaged, the heating disk needs to be replaced or repaired after completing a processing process. During a wafer processing, if a single heating wire is damaged and causes a sudden change in the temperature of the heating disk, the current wafer will be scrapped, resulting in a large economic loss. The dual parallel heating wire assembly design of this embodiment can keep one of the heating wire assemblies working in an increased power mode in this case until the current wafer processing is completed, and then the heating disk mechanism can be repaired or replaced, thereby avoiding the scrapping of the wafer.

[0051] The embodiment of the present invention further provides a thin film deposition device, which includes the heating plate mechanism 100 as described above.

[0052] The heating plate mechanism and thin film deposition device of this embodiment evenly bury the heating wire unit in the heating plate carrier, thereby improving the uniformity of the surface temperature of the heating plate. The heating wire unit adopts a structure design of at least two layers of stacking to avoid the problem of cold spots caused by breakpoints at the electrical connection end, and at least two groups of heating wire units are provided to avoid the problem of power failure and downtime of the heating plate due to failure of a single heating wire.

[0053] The above examples are only used to further illustrate the technical content of the present invention, so that readers can understand it more easily, but they do not mean that the implementation of the present invention is limited to this. Any technical extension or re-creation made according to the present invention is protected by the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A heating plate mechanism, characterized in that: include: A heating plate carrier and a heating wire assembly buried in the heating plate carrier, the heating plate carrier having a heating surface, the heating wire assembly consisting of a plurality of heating wire units extending from the center of the heating surface to the edge of the heating surface and then extending from the edge of the heating surface to the center of the heating surface and connected end to end in sequence.

2. The heating plate mechanism according to claim 1, characterized in that: The extension shapes of the plurality of heating wire units are all the same, and are centrally symmetrically arranged about the center of the heating surface.

3. The heating plate mechanism according to claim 2, characterized in that: The heating surface is a circular surface.

4. The heating plate mechanism according to claim 1, characterized in that: The heating plate carrier is also provided with a docking plug, and the two electrical connection ends of the heating wire assembly are fixedly connected to the docking plug.

5. The heating plate mechanism according to claim 1, characterized in that: The heating wire unit is spirally stacked in at least two layers in the thickness direction of the heating plate carrier.

6. The heating plate mechanism according to claim 5, characterized in that: Both electrical connection ends of the heating wire assembly extend from the heating surface, and the ends extending from the heating surface are fixedly connected to a docking plug. An insulating block is also provided between the docking plug and the heating surface, and the electrical connection ends of the heating wire assembly are insulated by the insulating block.

7. The heating plate mechanism according to claim 6, characterized in that: The butt plug comprises: a butt mounting block and a protective cover, wherein the protective cover is clamped on the butt mounting block, and the butt mounting block is provided with a cable socket for an external cable and a heating wire socket for an external electrical connection end of the heating wire assembly.

8. The heating plate mechanism according to any one of claims 1 to 7, characterized in that: The heating wire assembly is a structure in which two heating wires are spirally nested in the same direction.

9. The heating plate mechanism according to any one of claims 1 to 7, characterized in that: The heating wire assembly is composed of at least two groups of heating wire units distributed in inner and outer rings on the heating surface.

10. A thin film deposition device, characterized in that: The thin film deposition apparatus comprises the heating plate mechanism according to any one of claims 1 to 9.

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