Semiconductor material hardness detection device

Abstract

The invention discloses a semiconductor material hardness detection device, and belongs to the technical field of semiconductor materials. The device comprises a workbench, a support, a first hydraulic rod, a detection ball and a clamping assembly, the workbench is provided with a detection assembly for detecting ball indentations, the detection assembly comprises two groups of sliding grooves formed in the upper side of the support, and the inner side walls of the two groups of sliding grooves are fixedly connected with second hydraulic rods; the output ends of the two sets of second hydraulic rods are fixedly connected with sliding blocks, sleeves are rotationally connected into the sliding blocks in a sleeved mode, a first threaded rod is connected into one sleeve in a threaded mode, and a moving rod is slidably connected into the other sleeve in a sleeved mode. Before a semiconductor material is detected, a second hydraulic rod is started to drive a detection plate and a cleaning plate to integrally move, cleaning operation on the surface of the semiconductor material is formed, cleanliness of the surface of the semiconductor material is kept, in the process, the cleaning plate can move back and forth, and the cleaning effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor materials, and in particular to a semiconductor material hardness detection device. Background Art

[0002] Semiconductor materials are a type of electronic materials that have semiconductor properties (conductivity between conductors and insulators) and can be used to make semiconductor devices and integrated circuits. During the processing of semiconductor materials, it is necessary to test the hardness of semiconductor materials. The commonly used testing method is to use a testing ball to apply corresponding pressure to the semiconductor material and then measure the resulting indentation. The overall operation is simple.

[0003] However, in the actual hardness testing process, it is necessary to manually test the semiconductor material to detect the flatness of the semiconductor material surface and whether there are defects and bubbles on the semiconductor material surface. Manual testing is time-consuming and labor-intensive, and the detection effect is general. At the same time, if bubbles are detected in the semiconductor material, they need to be removed manually, which is very troublesome. Therefore, a semiconductor material hardness testing device is provided. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a semiconductor material hardness detection device.

[0005] The present invention adopts the following technical solutions:

[0006] A semiconductor material hardness detection device comprises a workbench, a bracket, a first hydraulic rod, a detection ball and a clamping assembly, wherein a detection assembly for detecting ball indentation is installed on the workbench, wherein the detection assembly comprises two groups of slide grooves opened on the upper side of the bracket, wherein the inner side walls of the two groups of slide grooves are fixedly connected to second hydraulic rods, wherein the output ends of the two groups of second hydraulic rods are fixedly connected to sliders, wherein a sleeve is rotatably sleeved in the slider, wherein a first threaded rod is threadedly sleeved in one of the sleeves, and a moving rod is slidably sleeved in the other sleeve, wherein the first threaded rod and the lower end of the moving rod are fixedly connected to each other. The side is rotatably connected to the same moving box, the moving rod is located in the moving box and fixedly sleeved with a moving block, a threaded groove is opened on the outer side of the moving block, a moving plate is slidably sleeved up and down in the moving box, a fixed rod is fixedly connected to the upper side of the moving plate, a sliding rod is fixedly connected to the side wall of the fixed rod, the sliding rod and the threaded groove are slidably connected, a plurality of groups of detection grooves are evenly opened on the lower side of the moving plate, detection rods are slidably sleeved in the plurality of detection grooves, a first spring is fixedly connected between the detection rod and the detection groove, and a sensor is also fixedly connected between the detection rod and the detection groove.

[0007] Preferably, a through slot is opened in the bracket, the through slot is communicated with one of the slide slots, a first gear is fixedly sleeved on the outer side of one of the sleeves, a first rack is fixedly connected to the inner side wall of the through slot, and the first gear is meshed with the first rack.

[0008] Preferably, a cleaning component for the surface of the semiconductor material to be detected is installed on the outside of the movable box, and the cleaning component includes two groups of connecting plates slidably connected to the side walls of the movable box, the two groups of connecting plates are arranged through the bottom of the movable box, two groups of rotating rods are rotatably connected in the movable box, the outer sides of the two groups of rotating rods are fixedly sleeved with a third gear, the upper side of the connecting plate is fixedly connected with a third rack, the third gear and the third rack are meshed with each other, the outer sides of the two groups of rotating rods are fixedly sleeved with a second gear, the side walls of the fixed rods are symmetrically fixedly connected with two groups of connecting rods, the side walls of the two groups of connecting rods are fixedly connected with a second rack, the second rack and the second gear are meshed, an adjusting groove is opened on the lower side of the connecting plate, an adjusting rod is slidably connected in the adjusting groove, a second spring is fixedly connected between the adjusting rod and the adjusting groove, and a cleaning plate is fixedly connected to the lower side of the adjusting rod.

[0009] Preferably, a deep groove is opened on the lower side of the detection rod, a third hydraulic rod is fixedly connected to the bottom of the deep groove, and a tapered rod is fixedly connected to the output end of the third hydraulic rod.

[0010] Preferably, two groups of button rods are fixedly connected to the side walls of the two groups of cleaning plates, and the two adjacent groups of button rods abut against each other.

[0011] Preferably, the side wall of the cleaning plate is arc-shaped.

[0012] Preferably, the outer side of the detection rod is smooth.

[0013] The beneficial effects of the present invention are:

[0014] 1. First, before testing the semiconductor material, start the second hydraulic rod to drive the testing plate and the cleaning plate to move as a whole, so as to clean the surface of the semiconductor material and keep the surface of the semiconductor material clean. In this process, the cleaning plate will also move back and forth to improve the cleaning effect.

[0015] 2. Moreover, in this process, the pressure effect on the surface of the semiconductor material will be continuously adjusted, so as to better form the detection operation of the defects of the semiconductor material. The constantly changing pressure will not form the phenomenon of excessive or insufficient pressure on the surface of the semiconductor material, and will not have an adverse effect on the subsequent detection effect;

[0016] 3. Finally, in the process of detecting the surface of semiconductor materials, when bubbles are detected on the surface of the semiconductor, the bubble removal operation can be automatically completed, with a high degree of intelligence. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of a semiconductor material hardness detection device proposed by the present invention;

[0018] Figure 2 This is a schematic diagram of the connection between a bracket and a moving box in a semiconductor material hardness detection device proposed by the present invention;

[0019] Figure 3 This is a top view connection diagram of a bracket in a semiconductor material hardness detection device proposed by the present invention;

[0020] Figure 4 This is a schematic diagram of the connection between a moving rod and a moving box in a semiconductor material hardness detection device proposed by the present invention;

[0021] Figure 5 This is a top view connection diagram of a moving box in a semiconductor material hardness detection device proposed by the present invention;

[0022] Figure 6 A schematic diagram of the connection between a fixed rod, a movable plate and a detection rod in a semiconductor material hardness detection device proposed by the present invention;

[0023] Figure 7 A cross-sectional connection diagram of a movable plate in a semiconductor material hardness detection device proposed by the present invention;

[0024] Figure 8 A schematic diagram of the connection between a first rack and a first gear in a semiconductor material hardness detection device proposed by the present invention;

[0025] Fig. 9 for Figure 5 A magnified view of the structure at center A;

[0026] Fig.10 A cross-sectional connection diagram of a connection plate in a semiconductor material hardness detection device proposed by the present invention;

[0027] Fig.11 This is a schematic cross-sectional connection diagram of a detection rod in a semiconductor material hardness detection device proposed by the present invention.

[0028] In the figure: 1 workbench, 2 bracket, 3 first hydraulic rod, 4 detection ball, 5 detection assembly, 501 slide groove, 502 slider, 503 sleeve, 504 first threaded rod, 505 moving rod, 506 moving box, 507 second hydraulic rod, 508 through groove, 509 first gear, 510 first rack, 511 detection rod, 512 cleaning plate, 513 thread groove, 514 moving plate, 515 slide rod, 516 rotating rod, 517 fixed rod, 518 connecting rod, 519 second rack, 520 sensor, 521 first spring, 522 detection groove, 523 second gear, 524 third gear, 525 third rack, 526 connecting plate, 527 button rod, 528 second spring, 529 regulating groove, 530 regulating rod, 531 moving block, 532 third hydraulic rod, 533 tapered rod, 534 deep groove. DETAILED DESCRIPTION

[0029] See also Figure 1-Figure 11 A semiconductor material hardness detection device comprises a workbench 1, a bracket 2, a first hydraulic rod 3, a detection ball 4 and a clamping assembly, wherein the bracket 2 is fixedly mounted on the upper side of the workbench 1, the first hydraulic rod 3 is fixedly mounted on the inner side of the bracket 2, the detection ball 4 is fixedly mounted on the output end of the first hydraulic rod 3, the clamping assembly comprises four groups of fixed plates, the four groups of fixed plates are symmetrically arranged in groups of two, the four groups of fixed plates are fixedly mounted on the upper side of the workbench 1, a second threaded rod is rotatably connected between each group of fixed plates, two groups of clamping plates are arranged between the four groups of fixed plates, the second threaded rod passes through the clamping plates and the clamping plates are threadedly connected, and the detection ball 4 is located between the two clamping plates;

[0030] First, the threads at both ends of the two second threaded rods rotate in opposite directions. The semiconductor material to be tested is placed on the workbench 1, and then the two second threaded rods are rotated. Since the clamping plate and the workbench 1 are connected by sliding back and forth, the rotating two second threaded rods will drive the clamping plate to move in the direction close to each other until the semiconductor material to be tested and the two clamping plates are butted against each other. A suitable detection ball 4 is selected, and the first hydraulic rod 3 is started. The first hydraulic rod 3 drives the detection ball 4 to move downward. The detection ball 4 and the semiconductor material are butted against each other and form a certain pressure on the semiconductor material. After a period of time, the first hydraulic rod 3 is started again, so that the first hydraulic rod 3 drives the detection ball 4 to move upward until the detection ball 4 is removed from the semiconductor material. The indentation of the detection ball 4 on the semiconductor material is measured, and then the hardness detection operation of the semiconductor material is completed. The above are all existing technologies and no unnecessary elaboration is made.

[0031] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7A detection assembly 5 for detecting the indentation of the ball 4 is installed on the workbench 1. The detection assembly 5 includes two groups of slide grooves 501 opened on the upper side of the bracket 2. The inner side walls of the two groups of slide grooves 501 are fixedly connected to the second hydraulic rods 507. The output ends of the two groups of second hydraulic rods 507 are fixedly connected to the sliders 502. A sleeve 503 is rotatably sleeved in the slider 502. One of the sleeves 503 is internally threaded with a first threaded rod 504. A moving rod 505 is slidably sleeved in the other sleeve 503. The lower sides of the first threaded rod 504 and the moving rod 505 are rotatably connected to the same moving box 506. The moving rod 505 is located in the moving box 506 and is fixedly sleeved with a moving rod. Block 531, a thread groove 513 is opened on the outer side of the moving block 531, a moving plate 514 is slidably sleeved up and down in the moving box 506, a fixing rod 517 is fixedly connected to the upper side of the moving plate 514, a sliding rod 515 is fixedly connected to the side wall of the fixing rod 517, the sliding rod 515 and the thread groove 513 are slidably connected, a plurality of groups of detection grooves 522 are evenly opened on the lower side of the moving plate 514, a detection rod 511 is slidably sleeved in the plurality of detection grooves 522, a first spring 521 is fixedly connected between the detection rod 511 and the detection groove 522, a sensor 520 is also fixedly connected between the detection rod 511 and the detection groove 522, and the outer side of the detection rod 511 is smooth;

[0032] First, the sensor 520 is a pressure sensor 520. The pressure sensor 520 is a device or apparatus that can sense pressure signals and convert pressure signals into usable output electrical signals according to a certain rule. Before the hardness of the semiconductor material is detected, the first threaded rod 504 is rotated first, and then the sleeve 503 is pressed. The rotating first threaded rod 504 will drive the moving box 506 to move downward until the moving box 506 is located on the upper side of the semiconductor material. At this time, the detection rod 511 and the semiconductor material are against each other, and the first spring 521 is in a compressed state. Then the first hydraulic rod 3 is started, and the first hydraulic rod 3 drives the slider 502 and the sleeve 503 to move right as a whole. The sleeve 503 moves to the right through the moving rod 505 and the first threaded rod. 504 drives the moving box 506 to move rightward, and the moving box 506 drives the detection rod 511 to move through the moving plate 514. The detection rod 511 is always against the semiconductor material. At this time, the sensor 520 sends a corresponding electrical signal until the detection rod 511 moves from the leftmost side to the rightmost side. In this process, since the first rack 510 is in a fixed state, the first gear 509 and the sleeve 503 will be driven to rotate when the first gear 509 follows the movement of the sleeve 503. The sleeve 503 drives the moving rod 505 to rotate, and the moving rod 505 drives the moving block 531 to rotate. Under the limiting action of the thread groove 513 and the sliding rod 515, the fixed rod 517 will be driven to move up and down as a whole when the moving block 531 rotates. The fixed rod 517 drives the movable plate 514 to move up and down. During this process, the detection rod 511 is always against the semiconductor material, which causes the elastic force of the first spring 521 to be compressed to change, that is, the force on the surface of the semiconductor material is constantly changing, forming an extrusion on the semiconductor material. While cleaning the surface of the semiconductor material, it can well eliminate defects such as bubbles and stains on the surface of the semiconductor material, thereby ensuring the quality of subsequent detection. If the electrical signals emitted by all sensors 520 are the same and the emitted electrical signals change periodically, it means that the surface of the semiconductor material is flat and there are no defects, and the corresponding detection operation can be performed. If there are sensors 520 that emit different electrical signals, or the emitted electrical signals do not change periodically, If the property changes, it means that there are defects on the surface of the semiconductor material and the corresponding detection operation cannot be performed, or the position of the semiconductor material is adjusted so that the signal emitted by the electrical signal at the position where the detection ball 4 is located is in a stable state, and then when the detection operation is performed on the indentation of the detection ball 4, the first hydraulic rod 3 is started again, and the first hydraulic rod 3 drives the slider 502 and the sleeve 503 to move to the left as a whole, and the sleeve 503 drives the moving box 506 to move to the left through the moving rod 505 and the first threaded rod 504, and the moving box 506 drives the detection rod 511 to move through the moving plate 514, and the detection rod 511 is always against the semiconductor material. At this time, the sensor 520 sends a corresponding electrical signal until the detection rod 511 moves from the rightmost side to the leftmost side. In this process,A corresponding graph can be drawn based on the size of the electrical signal sent by the sensor 520, and the size of the indentation can be obtained based on the drawn graph. This is a prior art and will not be described in detail.

[0033] like Figure 5 , Figure 8 , Fig. 9 , Fig.10 A through slot 508 is provided in the bracket 2, and the through slot 508 is communicated with one of the slide slots 501, and a first gear 509 is fixedly sleeved on the outer side of one of the sleeves 503, and a first rack 510 is fixedly connected to the inner wall of the through slot 508, and the first gear 509 and the first rack 510 are meshed. A cleaning component for the surface of the semiconductor material to be detected is installed on the outer side of the moving box 506, and the cleaning component includes two groups of connecting plates 526 that are slidably connected to the side walls of the moving box 506, and the two groups of connecting plates 526 are arranged through the bottom of the moving box 506, and two groups of rotating rods 516 are rotatably connected in the moving box 506, and the outer sides of the two groups of rotating rods 516 are fixedly sleeved with a third gear 524, and the upper side of the connecting plate 526 is fixedly connected with a third rack 525, and the third gear 524 and the third rack 525 are meshed. The second gear 523 and the side wall of the fixed rod 517 are symmetrically fixedly connected with two groups of connecting rods 518, and the side walls of the two groups of connecting rods 518 are fixedly connected with the second rack 519, and the second rack 519 is meshed with the second gear 523. A regulating groove 529 is opened on the lower side of the connecting plate 526, and a regulating rod 530 is slidably connected in the regulating groove 529. A second spring 528 is fixedly connected between the regulating rod 530 and the regulating groove 529. A cleaning plate 512 is fixedly connected to the lower side of the regulating rod 530. A deep groove 534 is opened on the lower side of the detection rod 511, and a third hydraulic rod 532 is fixedly connected to the bottom of the deep groove 534. The output end of the third hydraulic rod 532 is fixedly connected to a tapered rod 533. The side walls of the two groups of cleaning plates 512 are fixedly connected with two groups of button rods 527, and the two adjacent groups of button rods 527 are against each other. The side walls of the cleaning plate 512 are set in an arc shape;

[0034] First, the two button rods 527 are similar to contact switches in real life, and when the two button rods 527 are disconnected, the third hydraulic rod 532 can be activated. In the process of the fixed rod 517 moving up and down, the fixed rod 517 drives the second rack 519 to move up and down through the connecting rod 518, and the second rack 519 drives the rotating rod 516 to rotate back and forth through the second gear 523. The rotating rod 516 drives the third rack 525 to move left and right through the third gear 524. The third rack 525 drives the regulating rod 530 to move back and forth left and right through the connecting plate 526 and the second spring 528. The regulating rod 530 drives the cleaning plate 512 to move back and forth to form a half The cleaning operation of the conductor surface maintains the cleanliness of the semiconductor material surface. During this process, if there are bubbles on the semiconductor material surface, there is a certain height difference between the two cleaning plates 512, and the two button rods 527 are disconnected. The third hydraulic rod 532 is activated, and the third hydraulic rod 532 drives the conical rod 533 to move downward. The lower side of the conical rod 533 is sharp, and the conical rod 533 can puncture the bubbles on the semiconductor material surface, thereby completing the bubble removal operation. In the process of detecting the indentation, there is no height difference between the two movable plates 514 on the upper side of the semiconductor material surface, and thus will not have an adverse effect on the indentation detection operation.

[0035] In the present invention, the semiconductor material to be tested is placed on the workbench 1, and then the two second threaded rods are rotated. Since the clamping plate and the workbench 1 are connected by sliding forward and backward, the two rotating second threaded rods will drive the clamping plate to move in the direction close to each other until the semiconductor material to be tested and the two clamping plates are butted against each other. A suitable testing ball 4 is selected, and the first hydraulic rod 3 is started. The first hydraulic rod 3 drives the testing ball 4 to move downward. The testing ball 4 and the semiconductor material are butted against each other and form a certain pressure on the semiconductor material. After a period of time, the first hydraulic rod 3 is started again, so that the first hydraulic rod 3 drives the testing ball 4 to move upward until the testing ball 4 is removed from the semiconductor material. The indentation of the testing ball 4 on the semiconductor material is measured, and then the hardness testing operation of the semiconductor material is completed. The above are all existing technologies and no unnecessary elaboration is made.

[0036] Before testing the hardness of the semiconductor material, first rotate the first threaded rod 504, then press the sleeve 503, the rotating first threaded rod 504 will drive the moving box 506 to move downward until the moving box 506 is located on the upper side of the semiconductor material, at this time the detection rod 511 and the semiconductor material are in contact with each other, the first spring 521 is in a compressed state, then start the first hydraulic rod 3, the first hydraulic rod 3 drives the slider 502 and the sleeve 503 to move right as a whole, the sleeve 503 drives the moving box 506 to move right through the moving rod 505 and the first threaded rod 504, the moving box 506 drives the detection rod 511 to move through the moving plate 514, the detection rod 511 is always in contact with the semiconductor material, at this time the sensor 520 The first gear 509 and the sleeve 503 are in a fixed state, so when the first gear 509 follows the movement of the sleeve 503, the first gear 509 and the sleeve 503 are driven to rotate, and the sleeve 503 drives the moving rod 505 to rotate, and the moving rod 505 drives the moving block 531 to rotate. Under the restriction of the thread groove 513 and the sliding rod 515, when the moving block 531 rotates, the fixed rod 517 is driven to move up and down as a whole, and the fixed rod 517 drives the moving plate 514 to move up and down. During this process, the detection rod 511 is always against the semiconductor material, which causes the elastic force of the compressed first spring 521 to occur all the time. Changes, that is, the force on the surface of the semiconductor material keeps changing, forming an extrusion on the semiconductor material. While cleaning the surface of the semiconductor material, it can well eliminate defects such as bubbles and stains on the surface of the semiconductor material to ensure the quality of subsequent detection. If the electrical signals emitted by all sensors 520 are the same and the emitted electrical signals change periodically, it means that the surface of the semiconductor material is flat and has no defects, and the corresponding detection operation can be performed. If there are sensors 520 that emit different electrical signals, or the emitted electrical signals do not change periodically, it means that there are defects on the surface of the semiconductor material, and the corresponding detection operation cannot be performed, or the position of the semiconductor material is adjusted to make the electrical signal emitted at the position where the detection ball 4 is located. The signal is in a stable state. Then, when the indentation of the detection ball 4 is detected, the first hydraulic rod 3 is started again. The first hydraulic rod 3 drives the slider 502 and the sleeve 503 to move to the left as a whole. The sleeve 503 drives the moving box 506 to move to the left through the moving rod 505 and the first threaded rod 504. The moving box 506 drives the detection rod 511 to move through the moving plate 514. The detection rod 511 is always against the semiconductor material. At this time, the sensor 520 sends a corresponding electrical signal until the detection rod 511 moves from the rightmost side to the leftmost side. In this process, a corresponding graph can be drawn according to the size of the electrical signal sent by the sensor 520, and the size of the indentation can be obtained according to the drawn graph. This is a prior art and no unnecessary elaboration is made.

[0037] In the process of the fixed rod 517 moving up and down, the fixed rod 517 drives the second rack 519 to move up and down through the connecting rod 518, the second rack 519 drives the rotating rod 516 to rotate back and forth through the second gear 523, the rotating rod 516 drives the third rack 525 to move left and right through the third gear 524, the third rack 525 drives the regulating rod 530 to move back and forth left and right through the connecting plate 526 and the second spring 528, and the regulating rod 530 drives the cleaning plate 512 to move back and forth, thereby forming a cleaning operation on the semiconductor surface to maintain the cleanliness of the semiconductor material surface, and in this During the process, if there are bubbles on the surface of the semiconductor material, there is a certain height difference between the two cleaning plates 512, the two button rods 527 are disconnected, and the third hydraulic rod 532 is activated. The third hydraulic rod 532 drives the conical rod 533 to move downward. The lower side of the conical rod 533 is sharp, and the conical rod 533 can puncture the bubbles on the surface of the semiconductor material, thereby completing the bubble removal operation. In the process of detecting the indentation, there is no height difference between the two movable plates 514 on the upper side of the surface of the semiconductor material, and thus will not have an adverse effect on the indentation detection operation.

Claims

1. A semiconductor material hardness detection device, comprising a workbench (1), a bracket (2), a first hydraulic rod (3), a detection ball (4) and a clamping assembly, characterized in that: The workbench (1) is provided with a detection assembly (5) for detecting the indentation of the ball (4), and the detection assembly (5) comprises two groups of slide grooves (501) provided on the upper side of the bracket (2), the inner side walls of the two groups of slide grooves (501) are fixedly connected with second hydraulic rods (507), the output ends of the two groups of second hydraulic rods (507) are fixedly connected with sliders (502), a sleeve (503) is rotatably sleeved in the slider (502), a first threaded rod (504) is internally threadedly sleeved in one of the sleeves (503), a moving rod (505) is slidably sleeved in the other sleeve (503), the lower sides of the first threaded rod (504) and the moving rod (505) are rotatably connected with the same moving box (506), and the moving rod (505) is located in the moving box (506). A moving block (531) is fixedly sleeved, and a thread groove (513) is provided on the outer side of the moving block (531). A moving plate (514) is slidably sleeved up and down in the moving box (506). A fixed rod (517) is fixedly connected to the upper side of the moving plate (514), and a sliding rod (515) is fixedly connected to the side wall of the fixed rod (517). The sliding rod (515) and the thread groove (513) are slidably connected. A plurality of groups of detection grooves (522) are evenly provided on the lower side of the moving plate (514), and detection rods (511) are slidably sleeved in the plurality of groups of detection grooves (522). A first spring (521) is fixedly connected between the detection rod (511) and the detection groove (522), and a sensor (520) is also fixedly connected between the detection rod (511) and the detection groove (522).

2. A semiconductor material hardness detection device according to claim 1, characterized in that: A through slot (508) is provided in the bracket (2), the through slot (508) is communicated with one of the slide slots (501), a first gear (509) is fixedly sleeved on the outer side of one of the sleeves (503), a first rack (510) is fixedly connected to the inner side wall of the through slot (508), and the first gear (509) and the first rack (510) are meshed.

3. A semiconductor material hardness detection device according to claim 2, characterized in that: A cleaning assembly for the surface of the semiconductor material to be detected is installed on the outer side of the movable box (506), and the cleaning assembly includes two groups of connecting plates (526) slidably connected to the side wall of the movable box (506), and the two groups of connecting plates (526) are arranged through the bottom of the movable box (506). Two groups of rotating rods (516) are rotatably connected in the movable box (506), and the outer sides of the two groups of rotating rods (516) are fixedly sleeved with a third gear (524), and the upper side of the connecting plate (526) is fixedly connected with a third rack (525), and the third gear (524) and the third rack (525) are meshed. The two groups of rotating rods (516) are rotatably connected to each other. ) is fixedly sleeved with a second gear (523) on the outer side, two groups of connecting rods (518) are symmetrically fixedly connected to the side walls of the fixed rod (517), the side walls of the two groups of connecting rods (518) are fixedly connected with a second rack (519), the second rack (519) and the second gear (523) are meshed, a regulating groove (529) is opened on the lower side of the connecting plate (526), ​​a regulating rod (530) is slidably connected in the regulating groove (529), a second spring (528) is fixedly connected between the regulating rod (530) and the regulating groove (529), and a cleaning plate (512) is fixedly connected to the lower side of the regulating rod (530).

4. A semiconductor material hardness detection device according to claim 3, characterized in that: A deep groove (534) is formed on the lower side of the detection rod (511), a third hydraulic rod (532) is fixedly connected to the bottom of the deep groove (534), and a conical rod (533) is fixedly connected to the output end of the third hydraulic rod (532).

5. A semiconductor material hardness detection device according to claim 4, characterized in that: The side walls of the two groups of cleaning plates (512) are fixedly connected with two groups of button rods (527), and the two adjacent groups of button rods (527) are against each other.

6. A semiconductor material hardness detection device according to claim 5, characterized in that: The side wall of the cleaning plate (512) is arranged in an arc shape.

7. A semiconductor material hardness detection device according to claim 6, characterized in that: The outer side of the detection rod (511) is smooth.

Images