A composite structure ceramic alloy resistor processing method and ceramic alloy resistor

Abstract

The present invention discloses a method for processing a ceramic alloy resistor with a composite structure and a ceramic alloy resistor thereof. The method for processing a ceramic alloy resistor with a composite structure includes the following steps: providing an alloy substrate, using a laser engraving machine to cut the alloy substrate to obtain an alloy resistor graphic frame; providing an adhesive film and a ceramic substrate; pressing the alloy resistor graphic frame, the adhesive film and the ceramic substrate together to obtain a semi-finished product; providing a silk screen support plate; the silk screen support plate has a silk screen printing plate and a release film; covering the silk screen support plate on the semi-finished product, and removing the silk screen support plate after silk screen printing solder resist ink on the semi-finished product; drying the solder resist ink to form an ink protective layer; removing the frame; electroplating, cutting particles, and sorting the entire semi-finished product to obtain a ceramic alloy resistor. Through the above processing method, the accuracy of silk screen printing of ceramic alloy resistors is improved, the consumption of solder resist ink is reduced, the production cost of ceramic alloy resistors is saved, and the defective rate generated by the silk screen printing process is reduced.

Description

Technical Field

[0001] The invention relates to the field of ceramic alloy resistor processing, in particular to a ceramic alloy resistor processing method with a composite structure and a ceramic alloy resistor. Background Art

[0002] See also Figure 2 When making a ceramic alloy resistor, it is necessary to first make a resistor slurry, coat the resistor slurry on a ceramic substrate 11 raw material, then transfer the ceramic substrate 11 raw material to an oven for high-temperature baking, dry the resistor slurry, and form a resistor body layer 12 on the surface of the ceramic substrate, use a laser to adjust the resistance of the resistor body layer 12, and screen-print a layer of solder resist ink on the outside of the resistor body layer 12 after the resistance adjustment to protect the resistor body layer 12, and then perform a granulation operation on the ceramic substrate 11 raw material to obtain a ceramic alloy resistor 10.

[0003] Through the above processing technology, we can obtain Figure 1 The ceramic alloy resistor 10 shown includes a ceramic substrate 11 and a resistor body layer 12. When the resistance is adjusted by laser, a resistance adjustment groove 13 is formed on the resistor body layer 12. Due to the existence of the resistance adjustment groove 13, the surface of the resistor body layer 12 is uneven.

[0004] See also Figure 2 The surface of the resistor layer 12 is uneven due to the concave portion. During screen printing, in order to ensure that the solder resist ink can completely cover the resistor layer 12, the amount of solder resist ink needs to be increased to ensure that the ink protection layer 14 can cover the side of the resistor layer 12.

[0005] However, the above-mentioned screen printing method has the following problems: the screen printing process increases the amount of ink extrusion in order to allow the solder resist ink to cover the side of the resistor layer 12, which will cause the ink to flow to the surface of the ceramic substrate 11 raw material, so that the ink protective layer 14 covers the surface of the ceramic substrate 11 raw material, and a connecting portion 15 is formed between two adjacent resistor layers 12. In the pelletizing process, the ceramic substrate 11 raw material needs to be cut along the center line 16, which will cause the connecting portion 15 to break. The thickness of the connecting portion 15 is large, and the ink protective layer 14 formed by the solder resist ink is brittle. The cutting knife is easy to crush the connecting portion 15 when cutting along the center line 16. The connecting portion 15 and the ink protective layer 14 are integrally formed. When it is crushed by the cutting knife, it is easy to cause the ink protective layer 14 on the side of the resistor layer 12 to fall off, resulting in the ink protective layer 14 being unable to cover the resistor layer 12, making the ink protective layer 14 on the outer wall of the resistor layer 12 incomplete and defective. Before shipment, CCD inspection of product appearance is required to eliminate these defective products with incomplete ink protective layer 14.

[0006] The above process will not only lead to ink waste and increase the production cost of ceramic alloy resistors during the screen printing process, but also easily produce defective products. Therefore, it is necessary to optimize the processing technology of ceramic alloy resistors. Summary of the invention

[0007] The purpose of the present invention is to overcome the deficiencies in the prior art, provide a method for processing a ceramic alloy resistor with a composite structure and a ceramic alloy resistor thereof, and reduce the defect rate produced in the screen printing process.

[0008] The objective of the present invention is achieved through the following technical solutions:

[0009] A method for processing a ceramic alloy resistor of a composite structure, comprising the following steps:

[0010] Step 1, providing an alloy substrate, and using a laser engraving machine to cut the alloy substrate to obtain an alloy resistor graphic frame; the alloy resistor graphic frame includes a frame and a plurality of resistor chips located in the frame, an overflow seam is provided between the frame and the resistor chips, and pins are provided at both ends of the resistor chips;

[0011] Step 2, providing a glue film and a ceramic substrate; pressing the alloy resistor pattern frame, the glue film and the ceramic substrate together to obtain a semi-finished product;

[0012] Step 3, providing a screen printing tray; the screen printing tray has a screen printing plate and a release film;

[0013] Step 4: Cover the semi-finished product with a silk screen tray, so that the silk screen plate fits the resistor body and the release film covers the pins;

[0014] Step 5, after silk-screening the solder mask ink on the semi-finished product, remove the silk-screen tray from the semi-finished product;

[0015] Step 6: Remove the frame;

[0016] Step 7, drying the solder resist ink to form an ink protective layer on the outside of the resistor chip;

[0017] Step eight, electroplating, cutting and sorting the entire semi-finished product to obtain ceramic alloy resistors.

[0018] In one embodiment, in step 1, a plurality of resistor chips are distributed in a rectangular array, and there are residual materials between the frame and the pins and between the pins of adjacent resistor chips, and the resistor chips are connected to the frame through the residual materials.

[0019] In one embodiment, in step six, the remaining material between the frame and the pins is cut off, and the frame is removed separately.

[0020] In one embodiment, in step eight, when cutting the particles, the residual material between the pins of the adjacent resistor chips is removed to separate the adjacent resistor chips.

[0021] In one of the embodiments, in step three, a contoured protrusion matching the pin is provided on the screen printing plate, and the contoured protrusion is used to wrap the side surface of the pin.

[0022] In one embodiment, in step 1, a resistance adjustment groove is formed on the resistor chip by a laser engraving machine.

[0023] A ceramic alloy resistor is prepared by the above-mentioned composite structure ceramic alloy resistor processing method.

[0024] By using the composite structure ceramic alloy resistor processing method, the accuracy of screen printing of ceramic alloy resistors is improved, the consumption of solder resist ink is reduced, the production cost of ceramic alloy resistors is saved, and the defect rate generated in the screen printing process is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 It is a structural schematic diagram of a ceramic alloy resistor;

[0027] Figure 2 It is a cross-sectional schematic diagram of the ink protection layer in the existing process;

[0028] Figure 3 It is a schematic diagram of the pressing sequence of the alloy resistor graphic frame, the adhesive film and the ceramic substrate;

[0029] Figure 4 It is a schematic diagram of the coordination between the resistor chip and the frame;

[0030] Figure 5 This is a schematic diagram of the coordination between the silk-screen pallet and the semi-finished product;

[0031] Figure 6 It is a schematic diagram of the structure of the release film;

[0032] Figure 7 for Figure 6 Magnified view at A;

[0033] Figure 8 It is a schematic diagram of the cooperation between the profiling protrusion and the pin;

[0034] Fig. 9 This is a schematic cross-sectional view of the improved ink protection layer. DETAILED DESCRIPTION

[0035] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0036] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0038] See also Figures 3 to 9 The present invention provides a method for processing a ceramic alloy resistor having a composite structure, which comprises the following steps:

[0039] Step 1: Provide an alloy substrate, and use a laser engraving machine to cut the alloy substrate to obtain an alloy resistor pattern frame 100; the alloy resistor pattern frame 100 includes a frame 110 and a plurality of resistor sheets 120 located in the frame 110, an overflow gap 21 is provided between the frame 110 and the resistor sheet 120, and pins 121 are provided at both ends of the resistor sheet 120, such as Figure 4 shown.

[0040] Step 2: Provide a glue film 200 and a ceramic substrate 300; press the alloy resistor pattern frame 100, the glue film 200 and the ceramic substrate 300 together to obtain a semi-finished product 30. The stacking order of the three is as follows: Figure 3 As shown;

[0041] Step 3, providing a screen printing support plate 400; the screen printing support plate 400 has a screen printing plate 410 and a release film 420, such as Figure 5 shown.

[0042] Step 4: Cover the semi-finished product 30 with the screen printing plate 400, fit the screen printing plate 410 with the resistor body 120, and let the release film 420 cover the pin 121; the release film 420 can prevent the solder mask ink from covering the end surface of the pin 121 during screen printing. Figure 6 and Figure 7 During screen printing, solder resist ink is placed on the screen printing plate 410 , and the solder resist ink is squeezed by a scraper to make the solder resist ink pass through the screen printing plate 410 , and the solder resist ink passing through the screen printing plate 410 adheres to the surface of the resistor body 120 and penetrates into the overflow seam 21 .

[0043] Step 5, after printing solder mask ink on the semi-finished product 30, the screen printing support plate 400 is removed from the semi-finished product 30;

[0044] Step 6: Remove the frame 110, such as Fig. 9 shown.

[0045] Step 7, drying the solder resist ink to form an ink protection layer 14 on the outside of the resistor body 120;

[0046] Step eight, electroplating, cutting and sorting the entire semi-finished product 30 to obtain the ceramic alloy resistor 10.

[0047] In order to avoid damage to the ink protection layer 14 on the outside of the resistor body 120 when cutting particles, the R&D personnel optimized the structure of the alloy resistor graphic frame 100. Specifically, when cutting the alloy substrate with a laser engraving machine, the edge material between adjacent resistor bodies 120 is retained, and an overflow seam 21 is formed between the resistor body 120 and the frame 110. During the screen printing operation, the solder resist ink can penetrate into the overflow seam 21, and then form an ink protection layer 14 on the side of the resistor body 120. Before the solder resist ink is cured, the frame 110 is removed in step six, so that each ink protection layer 14 is independent of each other, and the integrity of the ink protection layer 14 is ensured, such as Fig. 9 The resistor body 120 and the frame 110 are cut from a whole piece of alloy substrate and separated by a laser engraving machine.

[0048] It can be seen that the ink protection layer 14 on the side of the resistor body 120 is formed after the welding ink penetrates into the overflow seam 21, and no connected connection part 15 is formed between adjacent resistor bodies 120. After removing the frame 110 in step six, the ink protection layers 14 on each resistor body 120 are independent of each other, thereby avoiding damage to the ink protection layer 14 when cutting particles.

[0049] Since the overflow seam 21 is a thin seam produced during laser cutting, the thickness of the ink protection layer 14 on the side of the resistor body 120 is controllable, which can reduce the amount of solder resist ink used, reduce the production cost of the ceramic alloy resistor, and make the thickness of the ink protection layer 14 uniform.

[0050] Furthermore, the alloy resistor graphic frame 100, the adhesive film 200 and the ceramic substrate 300 are bonded together by a pressing machine. Compared with the original process, the process of preparing the resistor slurry, applying the resistor slurry and drying the resistor slurry is saved, and when the alloy substrate is cut by a laser engraving machine, the resistor adjustment groove 13 can be processed at the same time, and the resistor chip body 120 can be adjusted, which is beneficial to improving the production efficiency of the ceramic alloy resistor 10.

[0051] However, in the above scheme, the solder resist ink is driven into the overflow seam 21 to form an unconnected ink protection layer 14 on the outer surface of each resistor chip body 120, and the end of the resistor chip body 120 is provided with a pin 121. When the ceramic alloy resistor 10 is adjusted, the pin 121 needs to be powered to detect the resistance value of the product. Therefore, it is necessary to avoid the solder resist ink covering the pin 121. The overflow seam 21 is formed by laser cutting, and in order to ensure the integrity of the ink protection layer 14, the solder resist ink has high fluidity during silk screen printing, and the ink is easy to penetrate, so that the ink protection layer 14 extends to the side of the pin 121, which is easy to cause errors in subsequent resistance adjustment and detection.

[0052] See also Figure 7 , Figure 8 and Fig. 9 In order to solve the above problems, the present application optimizes the processing method of the ceramic alloy resistor with a composite structure as follows:

[0053] In step 3, the screen printing plate 410 is provided with a profiling protrusion 411 matching the pin 121, and the profiling protrusion 411 and the release film 420 are respectively located on both sides of the screen printing plate 410. When the screen printing support plate 400 is covered on the semi-finished product 30, it is necessary to ensure that the profiling protrusion 411 faces the resistor body 120, and the release film 420 is located on the side away from the resistor body 120, so that the profiling protrusion 411 can wrap the side of the pin 121 after the screen printing support plate 400 is covered on the semi-finished product 30.

[0054] Before the silk-screen printing operation, the silk-screen printing support plate 400 is first covered on the semi-finished product 30, so that the silk-screen printing plate 410 is fitted with the resistor body 120, the release film 420 covers the pin 121, and the contoured protrusion 411 is embedded in the gap between two adjacent resistor bodies 120; then the silk-screen printing device is started, and the scraper squeezes the solder resist ink so that the solder resist ink covers the outer surface of the resistor body 120 and extends into the overflow seam 21, and an ink protection layer 14 is formed on the resistor body 120 except for the position of the pin 121, and subsequent processing is performed.

[0055] It should be emphasized that the contoured protrusion 411 fills the gap between two adjacent resistor chips 120 and wraps the side of the pin 121. In this way, the solder resist ink entering the overflow seam 21 during the screen printing process will not contact the pin 121, which can prevent the ink protection layer 14 from extending onto the pin 121, improve the accuracy of the screen printing, and avoid errors in the subsequent resistance adjustment and detection process.

[0056] See also Figure 4 and Figure 8 In step one, a plurality of resistor chips 120 are distributed in a rectangular array, and residual materials 130 are provided between the frame 110 and the pins 121 and between the pins 121 of adjacent resistor chips 120 , and the resistor chips 120 are connected to the frame 110 through the residual materials 130 .

[0057] In step six, the remaining material 130 between the frame 110 and the pins 121 is cut off, and the frame 110 is removed separately.

[0058] In step eight, when cutting the particles, the residual material 130 between the pins 121 of the adjacent resistor chips 120 is removed, so that the adjacent resistor chips 120 are separated.

[0059] By using the composite structure ceramic alloy resistor processing method, the accuracy of screen printing of ceramic alloy resistors is improved, the consumption of solder resist ink is reduced, the production cost of ceramic alloy resistors is saved, and the defect rate generated in the screen printing process is reduced.

[0060] The invention also discloses a ceramic alloy resistor, which is prepared by the ceramic alloy resistor processing method with a composite structure.

[0061] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for processing a ceramic alloy resistor with a composite structure, characterized in that: The steps include: Step 1, providing an alloy substrate, and using a laser engraving machine to cut the alloy substrate to obtain an alloy resistor graphic frame; the alloy resistor graphic frame includes a frame and a plurality of resistor chips located in the frame, an overflow seam is provided between the frame and the resistor chips, and pins are provided at both ends of the resistor chips; Step 2, providing an adhesive film and a ceramic substrate; Pressing the alloy resistor pattern frame, the adhesive film and the ceramic substrate together to obtain a semi-finished product; Step 3, providing a screen printing tray; the screen printing tray has a screen printing plate and a release film; Step 4: Cover the semi-finished product with a silk screen tray, so that the silk screen plate fits the resistor body and the release film covers the pins; Step 5, screen printing solder mask ink on the semi-finished product, the solder mask ink penetrates into the overflow seam during screen printing, and then the screen printing support plate is removed from the semi-finished product; Step 6: Remove the frame; Step 7, drying the solder resist ink to form an ink protection layer on the side of the resistor body; Step eight, electroplating, cutting and sorting the entire semi-finished product to obtain ceramic alloy resistors.

2. The method for processing a ceramic alloy resistor of a composite structure according to claim 1, characterized in that: In step 1, a plurality of resistor chips are distributed in a rectangular array, and residual materials are provided between the frame and the pins and between the pins of adjacent resistor chips, and the resistor chips are connected to the frame through the residual materials.

3. The method for processing a ceramic alloy resistor of a composite structure according to claim 2, characterized in that: In step six, cut off the excess material between the frame and the pins, and remove the frame separately.

4. The method for processing a ceramic alloy resistor of a composite structure according to claim 2, characterized in that: In step eight, when the particles are cut, the excess material between the pins of the adjacent resistor chips is removed, so that the adjacent resistor chips are separated.

5. The method for processing a ceramic alloy resistor of a composite structure according to claim 2, characterized in that: In step three, a contoured protrusion matching the pin is provided on the screen printing plate, and the contoured protrusion is used to wrap the side of the pin.

6. The method for processing a ceramic alloy resistor of a composite structure according to claim 1, characterized in that: In step 1, a resistance adjustment groove is formed on the resistor chip by using a laser engraving machine.

7. A ceramic alloy resistor, characterized in that: The composite structure is prepared by the ceramic alloy resistance processing method according to any one of claims 1 to 6.

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