Cleaning device for semiconductor manufacturing

Abstract

The invention relates to a cleaning device for semiconductor manufacturing. Comprising a base, a cleaning bin arranged on the base, a tray used for containing wafers, a first driving device used for driving the tray to ascend and descend, a spraying device used for cleaning the wafers and a rotating device used for driving the spraying device to rotate. The first driving device is mounted at the bottom end of the cleaning bin; the tray is arranged at the driving end of the first driving device; the spraying device is rotationally connected to the top opening of the cleaning bin; the rotating device is installed on the base and is in transmission connection with the spraying device. The technical problems that when the wafer is cleaned by the cleaning equipment in the prior art, the cleaning liquid can only be vertically sprayed from top to bottom, so that the surface of the wafer cannot be in complete contact with the cleaning liquid, and impurities still remain on the surface of the cleaned wafer are solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor cleaning equipment, and in particular to a cleaning device for semiconductor manufacturing. Background Art

[0002] Cleaning is an important part of the semiconductor manufacturing process and one of the most important factors affecting the yield of semiconductor devices. Cleaning is an important part of the wafer processing process. In order to minimize the impact of impurities on chip yield, in the actual production process, it is necessary not only to ensure efficient single cleaning, but also to perform frequent cleaning before and after almost all processes.

[0003] According to the different cleaning media, cleaning technology can be divided into wet cleaning and dry cleaning. Wet cleaning refers to the use of solutions, acids, alkalis, surfactants, water and their mixtures, through corrosion, dissolution, chemical reaction and other methods, so that impurities on the surface of silicon wafers react chemically with solvents to generate soluble substances, gases or directly fall off, so as to obtain silicon wafers that meet the cleanliness requirements. Dry cleaning refers to cleaning technology that does not rely on chemical reagents, including plasma cleaning, atmospheric cleaning, etc. Wet cleaning is usually the main cleaning method on wafer manufacturing production lines and is currently the mainstream cleaning method on the market.

[0004] When the cleaning equipment in the prior art solution cleans the wafer, the cleaning liquid can only be sprayed vertically from top to bottom, which results in that the wafer surface cannot be ensured to be fully contacted with the cleaning liquid, and thus impurities still remain on the wafer surface after cleaning. Summary of the invention

[0005] The embodiment of the present application provides a cleaning device for semiconductor manufacturing, which solves the technical problem that when the cleaning equipment in the prior art solution cleans the wafer, the cleaning liquid can only be sprayed vertically from top to bottom, which results in the wafer surface not being able to ensure complete contact with the cleaning liquid, and further causes impurities to remain on the wafer surface after cleaning.

[0006] The technical solution adopted in the embodiment of the present application is as follows:

[0007] A cleaning device for semiconductor manufacturing comprises a base, a cleaning chamber arranged on the base, a tray for placing wafers, a first driving device for driving the tray to rise and fall, a spraying device for cleaning the wafers, and a rotating device for driving the spraying device to rotate; the first driving device is installed at the bottom end of the cleaning chamber; the tray is arranged on the driving end of the first driving device; the spraying device is rotatably connected to the top opening of the cleaning chamber; the rotating device is installed on the base, and the rotating device is transmission-connected to the spraying device.

[0008] A further technical solution is: the spraying device includes an annular slider, an annular liquid storage tank for storing cleaning liquid and an automatic nozzle for spraying the cleaning liquid; a card slot adapted to the annular slider is provided at the top of the cleaning tank; the annular slider is rotatably connected to the card slot; the annular liquid storage tank is arranged on the annular slider; the inner side of the annular liquid storage tank is arranged as an inclined structure; a plurality of groups of automatic nozzles arranged in a circular array are arranged on the inner side of the annular liquid storage tank; the nozzle of each group of automatic nozzles is facing the tray; a liquid inlet is provided at the top of the annular liquid storage tank.

[0009] A further technical solution is: the rotating device includes a first gear, a second gear arranged on the annular slider, a transmission chain for driving the second gear to rotate, a second driving device for driving the first gear to rotate, and a support seat installed on the base; the transmission chain is arranged around the first gear and the second gear; the first gear is arranged on the output shaft of the second driving device; the second driving device is installed on the support seat.

[0010] A further technical solution is: the tray is provided with a plurality of groups of water leakage holes arranged in a circular array.

[0011] A further technical solution is: the first driving device is a hydraulic cylinder.

[0012] A further technical solution is: the second driving device is a motor.

[0013] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0014] 1. Due to the use of the base, cleaning chamber, tray, first drive device, spray device and rotating device, when the wafer needs to be cleaned, the first drive device driving end is extended first to drive the tray to extend out of the cleaning chamber cavity. After the tray extends out of the cleaning chamber, the staff will then place the wafer to be cleaned on the tray, and then retract the first drive device driving end to drive the tray down into the cleaning chamber cavity with the wafer. At this time, the spray device is driven by the rotating device to start working, so that the spray device rotates along the top of the cleaning chamber, and at the same time, the automatic nozzle in the spray device starts to spray the cleaning liquid on the wafer in the tray, and the impurities on the surface of the wafer can be fully and effectively cleaned. When one side of the wafer placed in the tray is cleaned, the rotating device and the spraying device stop working and are extended again through the driving end of the first driving device to drive the tray to extend out of the inner cavity of the cleaning chamber. At this time, the wafer is turned over and the above cleaning operation is repeated to comprehensively and effectively clean the entire wafer surface. The entire operation process is simple and reliable, and is convenient for staff to operate. At the same time, the spraying device and the rotating device cooperate with each other, so that the cleaning liquid can clean impurities on the wafer surface more comprehensively and effectively.

[0015] 2. Due to the use of an annular slider, an annular liquid storage tank and automatic nozzles, the cleaning liquid can be added to the annular liquid storage tank through the liquid inlet, and the cleaning liquid in the annular liquid storage tank can be sprayed out through the automatic nozzle. The annular slider is driven by the rotating device to rotate along the slot opened at the top of the cleaning tank, and each group of automatic nozzles starts to automatically spray the cleaning liquid. Since the nozzles of each group of automatic nozzles are facing the tray, the annular liquid storage tank is driven to rotate by the annular slider, so that each group of automatic nozzles can rotate and spray around the wafers in the tray, so that the cleaning liquid sprayed by the automatic nozzles can completely cover the surface of the wafer, so that the impurities on the surface of the wafer can be cleaned more comprehensively and effectively.

[0016] 3. Due to the arrangement of the first gear, the second gear, the transmission chain, the second driving device and the supporting seat, the first gear is driven to rotate by the output shaft of the second driving device. Since the transmission chain is wound around the first gear and the second gear, when the first gear rotates, it can drive the transmission chain and the second gear to rotate together. Since the second gear is fixedly connected to the annular slider, when the second gear rotates, it can drive the annular slider to rotate along the slot opened at the top of the cleaning bin.

[0017] 4. Due to the setting of the water leakage hole, the cleaning liquid sprayed into the tray by the automatic nozzle can flow from the water leakage hole into the cleaning bin. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1It is a schematic diagram of the overall structure of a cleaning device for semiconductor manufacturing according to an embodiment of the present invention.

[0019] Figure 2 It is a partial structural schematic diagram for reflecting the interior of the cleaning chamber in an embodiment of the present invention.

[0020] Figure 3 It is a partial structural schematic diagram for reflecting the spraying device in an embodiment of the present invention.

[0021] Figure 4 It is a partial structural schematic diagram for reflecting the rotating device in an embodiment of the present invention.

[0022] In the figure: 1. base; 2. cleaning chamber; 21. slot; 22. drain pipe; 3. tray; 31. leaking hole; 4. first driving device; 5. spraying device; 51. annular slider; 52. annular liquid storage chamber; 521. liquid inlet; 53. automatic nozzle; 6. rotating device; 61. first gear; 62. second gear; 63. transmission chain; 64. second driving device; 65. support seat. DETAILED DESCRIPTION

[0023] The embodiment of the present application provides a cleaning device for semiconductor manufacturing, which solves the technical problem that when the cleaning equipment in the prior art solution cleans the wafer, the cleaning liquid can only be sprayed vertically from top to bottom, which results in the wafer surface not being able to ensure complete contact with the cleaning liquid, and further causes impurities to remain on the wafer surface after cleaning.

[0024] The technical solution in the embodiment of the present application is to solve the above problems, and the overall idea is as follows:

[0025] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0026] A cleaning device for semiconductor manufacturing, such as Figure 1 and Figure 2 As shown, it includes a base 1, a cleaning chamber 2 arranged on the base 1, a tray 3 for placing wafers, a first driving device 4 for driving the tray 3 to rise and fall, a spraying device 5 for cleaning the wafers, and a rotating device 6 for driving the spraying device 5 to rotate. The first driving device 4 is installed at the bottom end of the cleaning chamber 2. The tray 3 is arranged on the driving end of the first driving device 4. The spraying device 5 is rotatably connected to the top opening of the cleaning chamber 2. The rotating device 6 is installed on the base 1, and the rotating device 6 is transmission-connected to the spraying device 5.

[0027] The cleaning bin 2 is fixedly mounted on the top of the base 1. The first drive device 4 is fixedly mounted on the bottom of the cleaning bin 2. The first drive device 4 is preferably a hydraulic cylinder. The tray 3 is fixedly connected to the drive end of the first drive device 4. The rotating device 6 is fixedly mounted on the top of the base 1. Since the rotating device 6 is transmission-connected to the spraying device 5, and the spraying device 5 is rotationally connected to the top opening of the cleaning bin 2, the spraying device 5 can be driven to rotate at the top opening of the cleaning bin 2 by starting to work through the rotating device 6. A drain pipe 22 is fixedly mounted on the bottom of the cleaning bin 2. Through the drain pipe 22, the cleaning liquid sprayed into the inner cavity of the cleaning bin 2 can be discharged from the drain pipe 22.

[0028] Due to the arrangement of the base 1, the cleaning chamber 2, the tray 3, the first driving device 4, the spraying device 5 and the rotating device 6, when the wafer needs to be cleaned, the driving end of the first driving device 4 is extended first to drive the tray 3 to extend out of the inner cavity of the cleaning chamber 2. After the tray 3 extends out of the cleaning chamber 2, the staff then places the wafer to be cleaned on the tray 3, and then the driving end of the first driving device 4 is retracted to drive the tray 3 to descend into the inner cavity of the cleaning chamber 2 with the wafer. At this time, the spraying device 5 is driven by the rotating device 6 to start working, so that the spraying device 5 rotates along the top of the cleaning chamber 2, and at the same time, the automatic nozzle 53 in the spraying device 5 starts to spray the cleaning liquid on the wafer in the tray 3, and at this time, the impurities on the surface of the wafer can be fully and effectively cleaned. When one side of the wafer placed in the tray 3 is cleaned, the rotating device 6 and the spraying device 5 stop working and are extended again by the driving end of the first driving device 4 to drive the tray 3 to extend from the inner cavity of the cleaning chamber 2. At this time, the wafer is turned over and the above cleaning operation is repeated to comprehensively and effectively clean the entire wafer surface. The entire operation process is simple and reliable, and is convenient for the staff to operate. At the same time, the spraying device 5 and the rotating device 6 cooperate with each other, so that the cleaning liquid can clean the impurities on the wafer surface more comprehensively and effectively.

[0029] like Figure 2 and Figure 3 As shown, the spraying device 5 includes an annular slider 51, an annular liquid storage tank 52 for storing cleaning liquid, and an automatic nozzle 53 for spraying the cleaning liquid. A slot 21 adapted to the annular slider 51 is provided at the top of the cleaning tank 2. The annular slider 51 is rotatably connected to the slot 21. The annular liquid storage tank 52 is arranged on the annular slider 51. The inner side of the annular liquid storage tank 52 is arranged as an inclined structure. A plurality of groups of automatic nozzles 53 arranged in an annular array are arranged on the inner side of the annular liquid storage tank 52. The nozzles of each group of automatic nozzles 53 are all facing the tray 3. A liquid inlet 521 is arranged at the top of the annular liquid storage tank 52.

[0030] The annular liquid storage bin 52 is fixedly connected to the top of the annular slider 51. A plurality of groups of automatic nozzles 53 arranged in an annular array are fixedly installed inside the annular liquid storage bin 52, and the nozzles of each group of automatic nozzles 53 are facing the tray 3. A liquid inlet 521 is fixedly installed at the top of the annular liquid storage bin 52.

[0031] Due to the arrangement of the annular slider 51, the annular liquid storage tank 52 and the automatic nozzle 53, the cleaning liquid can be added to the annular liquid storage tank 52 through the liquid inlet 521, and the cleaning liquid in the annular liquid storage tank 52 can be sprayed out through the automatic nozzle 53. The annular slider 51 is driven by the rotating device 6 to rotate along the slot 21 opened at the top of the cleaning tank 2, and each group of automatic nozzles 53 starts to automatically spray the cleaning liquid. Since the nozzles of each group of automatic nozzles 53 are facing the tray 3, the annular liquid storage tank 52 is driven by the annular slider 51 to rotate, so that each group of automatic nozzles 53 can rotate and spray around the wafers in the tray 3, and then the cleaning liquid sprayed by the automatic nozzles 53 can completely cover the surface of the wafer, so that the impurities on the surface of the wafer can be cleaned more comprehensively and effectively.

[0032] like Figure 4 As shown, the rotating device 6 includes a first gear 61, a second gear 62 arranged on the annular slider 51, a transmission chain 63 for driving the second gear 62 to rotate, a second driving device 64 for driving the first gear 61 to rotate, and a support seat 65 installed on the base 1. The transmission chain 63 is arranged around the first gear 61 and the second gear 62. The first gear 61 is arranged on the output shaft of the second driving device 64. The second driving device 64 is installed on the support seat 65.

[0033] The second gear 62 is fixedly connected to the outside of the annular slider 51. The support seat 65 is fixedly connected to the top of the base 1. The first gear 61 is fixedly connected to the output shaft of the second drive device 64. The second drive device 64 is fixedly installed on the top of the support seat 65. The second drive device 64 is preferably a motor.

[0034] Due to the arrangement of the first gear 61, the second gear 62, the transmission chain 63, the second driving device 64 and the support seat 65, the first gear 61 is driven to rotate by the output shaft of the second driving device 64. Since the transmission chain 63 is wound around the first gear 61 and the second gear 62, when the first gear 61 rotates, it can drive the transmission chain 63 and the second gear 62 to rotate together. Since the second gear 62 is fixedly connected to the annular slider 51, when the second gear 62 rotates, it can drive the annular slider 51 to rotate along the slot 21 opened at the top of the cleaning chamber 2.

[0035] like Figure 2 As shown, the tray 3 is provided with a plurality of water leakage holes 31 arranged in a circular array.

[0036] Due to the provision of the water leakage hole 31 , the cleaning liquid sprayed into the tray 3 by the automatic nozzle 53 can flow into the cleaning chamber 2 from the water leakage hole 31 .

[0037] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0038] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A cleaning device for semiconductor manufacturing, characterized in that: The invention comprises a base (1), a cleaning chamber (2) arranged on the base (1), a tray (3) for placing wafers, a first driving device (4) for driving the tray (3) to rise and fall, a spraying device (5) for cleaning the wafers, and a rotating device (6) for driving the spraying device (5) to rotate; the first driving device (4) is mounted on the bottom end of the cleaning chamber (2); the tray (3) is arranged on the driving end of the first driving device (4); the spraying device (5) is rotatably connected to the top opening of the cleaning chamber (2); the rotating device (6) is mounted on the base (1), and the rotating device (6) is transmission-connected to the spraying device (5).

2. A cleaning device for semiconductor manufacturing as claimed in claim 1, characterized in that: The spraying device (5) comprises an annular slider (51), an annular liquid storage tank (52) for storing cleaning liquid, and an automatic nozzle (53) for spraying the cleaning liquid; a slot (21) adapted to the annular slider (51) is provided at the top of the cleaning tank (2); the annular slider (51) is rotatably connected to the slot (21); the annular liquid storage tank (52) is arranged on the annular slider (51); the inner side of the annular liquid storage tank (52) is arranged as an inclined surface structure; a plurality of groups of automatic nozzles (53) arranged in an annular array are arranged on the inner side of the annular liquid storage tank (52); the nozzle of each group of automatic nozzles (53) faces the tray (3); and a liquid inlet (521) is provided at the top of the annular liquid storage tank (52).

3. A cleaning device for semiconductor manufacturing as claimed in claim 2, characterized in that: The rotating device (6) comprises a first gear (61), a second gear (62) arranged on the annular slider (51), a transmission chain (63) for driving the second gear (62) to rotate, a second driving device (64) for driving the first gear (61) to rotate, and a support seat (65) installed on the base (1); the transmission chain (63) is arranged around the first gear (61) and the second gear (62); the first gear (61) is arranged on the output shaft of the second driving device (64); and the second driving device (64) is installed on the support seat (65).

4. A cleaning device for semiconductor manufacturing as claimed in claim 1, characterized in that: The tray (3) is provided with a plurality of groups of water leakage holes (31) arranged in a circular array.

5. A cleaning device for semiconductor manufacturing as claimed in claim 1, characterized in that: The first driving device (4) is a hydraulic cylinder.

6. A cleaning device for semiconductor manufacturing as claimed in claim 3, characterized in that: The second driving device (64) is a motor.

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