Vapor chamber structure

Abstract

The invention discloses a vapor chamber structure which comprises an upper cover plate, a lower cover plate, at least one capillary structure layer and at least one carbon element unit. The upper cover plate and the lower cover plate are correspondingly covered to define a vacuum chamber, and the vacuum chamber is filled with a working fluid; the capillary structure layer is arranged on the inner side surface of the lower cover plate; the carbon element unit can be arranged between the capillary structure layer and the lower cover plate or on the outer side surface of the lower cover plate; therefore, according to the vapor chamber structure, the temperature uniformity can be greatly improved through the carbon element units, so that more efficient heat conduction and cycle efficiency are achieved.

Description

Technical Field

[0001] The invention relates to a heat dissipation structure, and in particular to a temperature homogenizing plate structure. Background Art

[0002] The development of chip production and manufacturing technology continues to drive the advancement of computers and computing. However, the improvement of chip performance is also accompanied by the generation of a large amount of heat energy, which causes the chip to generate high temperatures and local hot spots. If the heat energy on the chip cannot be effectively and quickly removed, the chip performance and service life will be greatly affected.

[0003] The temperature equalizer is one of the existing technologies used for heat dissipation of electronic components (such as chips). It is filled with a working fluid, which circulates and disperses and conducts heat energy to achieve the desired temperature uniformity. In the existing temperature equalizer structure, the upper and lower cover plates and the capillary structure layer are all made of the same material, such as copper or aluminum. In some temperature equalizers, the working fluid can also undergo phase changes (for example, vapor-liquid) as it circulates, which is also called a two-phase flow temperature equalizer, to improve the heat dissipation capacity and temperature uniformity by phase changes. However, if the temperature uniformity of the temperature equalizer needs to be further improved, it is still limited by the material properties of the temperature equalizer itself.

[0004] In addition, the existing method of directly growing different materials on the wafer during chip manufacturing, such as materials with good thermal conductivity, to improve the heat dissipation of the chip. However, growing different materials on the wafer, such as silicon carbide (SiC)-based gallium nitride (GaN) wafers, will instead cause thermal stress problems; that is, when the chip is working, the high temperature is generated, and the different thermal expansion coefficients between different materials cause stress accumulation at the interface of the materials, which may eventually cause the chip to bend or even break. In this way, not only does the use of different materials increase the difficulty of chip manufacturing, but the thermal stress also reduces the reliability of the chip.

[0005] In addition, referring to TW201350781 A, there is a temperature-dispersing plate structure that is stacked with a material having a good thermal conductivity (such as diamond) and a capillary structure layer 111. Figure 1, the lower cover plate 12 (i.e., the evaporation zone) contacts and conducts the heat energy generated by the electronic element 14 into the vacuum chamber 13; the inner wall surface of the vacuum chamber 13 between the upper cover plate 11 and the lower cover plate 12 is firstly provided with a capillary structure layer 111, and then a diamond structure film layer 112 is provided on the inner side thereof, so that the working fluid therein contacts and evaporates on the surface of the diamond structure film layer 112, and the condensed working fluid circulates back to the bottom layer of the vacuum chamber 13 along the capillary structure layer 111 covering the diamond structure film layer 112 on both sides of the edge of the vacuum chamber 13. However, the invention of this case first absorbs heat energy through the evaporation area of ​​the lower cover plate 12 and then transfers it to the capillary structure layer 111 and the diamond structure film layer 112 of the vacuum chamber 13 in sequence. The heat conduction efficiency of the capillary structure layer 111 is much lower than that of the diamond structure film layer 112, resulting in poor heat transfer efficiency, causing the temperature plate structure to be unable to quickly absorb heat energy to produce phase change to achieve a uniform temperature effect. This not only affects the heat conduction efficiency of the working fluid, but also limits the circulation efficiency of the condensed working fluid, so that the temperature uniformity still needs to be improved.

[0006] Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the inventor of this case and related manufacturers engaged in this industry are eager to study and improve. Summary of the invention

[0007] Therefore, in order to effectively solve the above problems, an object of the present invention is to provide a temperature distribution plate structure with improved temperature uniformity.

[0008] To achieve the above-mentioned purpose, the present invention provides a temperature equalizing plate structure, comprising: an upper cover plate, a lower cover plate, at least one capillary structure layer and at least one carbon element unit.

[0009] The upper cover plate and the lower cover plate are correspondingly covered to define a vacuum chamber, and the vacuum chamber is filled with a working fluid; the capillary structure layer is at least arranged on the inner surface of the lower cover plate; the carbon element unit is at least arranged between the capillary structure layer and the lower cover plate and on the outer surface of the lower cover plate.

[0010] The temperature homogenizing plate structure, wherein: the vacuum chamber has an evaporation side corresponding to the inner surface of the lower cover plate and a condensation side corresponding to the inner surface of the upper cover plate.

[0011] The temperature equalizing plate structure, wherein: the carbon element unit is arranged between the capillary structure layer and the lower cover plate, the carbon element unit forms a plurality of through holes, the capillary structure layer has a plurality of extension parts corresponding to the plurality of through holes, and the plurality of extension parts are directly combined with the inner surface of the lower cover plate through the plurality of through holes.

[0012] The temperature homogenizing plate structure, wherein: the carbon element units are respectively arranged on the inner surface of the upper cover plate and between the inner surface of the lower cover plate and the capillary structure layer.

[0013] The temperature homogenizing plate structure, wherein: the capillary structure layer is respectively arranged on the inner surface of the upper cover plate and the inner surface of the lower cover plate, and the carbon element unit is respectively arranged between the upper cover plate, the lower cover plate and the capillary structure layer.

[0014] The temperature homogenizing plate structure, wherein: an electronic component is also arranged on the outer surface of the lower cover plate.

[0015] The temperature homogenizing plate structure further comprises a plurality of support columns disposed in the vacuum chamber and abutting between the upper cover plate and the lower cover plate.

[0016] The temperature equalizing plate structure, wherein: the carbon element unit has at least any one or more of the group consisting of amorphous carbon, carbon nanofoam, diamond, blue stearite, wax stone, polymerized diamond nanorods, cyclocarbon graphene, graphite, and fullerene.

[0017] Thus, the present invention provides a temperature distribution plate structure capable of improving temperature uniformity, thereby achieving more efficient heat conduction and circulation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a cross-sectional schematic diagram of a conventional temperature equalizing plate structure;

[0019] Figure 2 It is a three-dimensional exploded schematic diagram of the temperature equalizing plate structure of the present invention;

[0020] Figure 3 It is a three-dimensional cross-sectional schematic diagram of the temperature equalizing plate structure of the present invention;

[0021] Figure 4 It is a cross-sectional schematic diagram of a temperature equalizing plate structure embodiment of the present invention;

[0022] Figure 5 It is a cross-sectional schematic diagram of a temperature equalizing plate structure embodiment of the present invention;

[0023] Figure 6 It is a cross-sectional schematic diagram of a temperature equalizing plate structure embodiment of the present invention;

[0024] Figure 7 It is a cross-sectional schematic diagram of a temperature equalizing plate structure embodiment of the present invention.

[0025] Explanation of the reference numerals: upper cover plate 11; capillary structure layer 111; diamond structure film layer 112; lower cover plate 12; vacuum chamber 13; electronic component 14; upper cover plate 21; lower cover plate 22; carbon element unit 23; through hole 23A; capillary structure layer 24; extension part 24B; support column 25; vacuum chamber 3; evaporation side 31; condensation side 32; electronic component 4. DETAILED DESCRIPTION

[0026] The above-mentioned objects and the structural and functional characteristics of the present invention will be described based on the preferred embodiments shown in the accompanying drawings.

[0027] Please refer to the attached figure. Figure 2 It is a three-dimensional exploded schematic diagram of the temperature equalizing plate structure of the present invention; Figure 3 It is a three-dimensional cross-sectional schematic diagram of the temperature equalizing plate structure of the present invention; Figure 4 It is a cross-sectional schematic diagram of a temperature equalizing plate structure embodiment of the present invention; Figure 5 It is a cross-sectional schematic diagram of a temperature equalizing plate structure embodiment of the present invention; Figure 6 is a cross-sectional schematic diagram of a temperature vapor chamber structure embodiment of the present invention; and, Figure 7 It is a cross-sectional schematic diagram of a temperature equalizing plate structure embodiment of the present invention.

[0028] like Figures 2 to 4 As shown, the present invention provides a temperature homogenizing plate structure, including: an upper cover plate 21 and a lower cover plate 22. The upper cover plate 21 and the lower cover plate 22 are correspondingly covered, so that the upper cover plate 21 and the lower cover plate 22 are sealed together to define a vacuum chamber 3. For example, the outer edges of the upper cover plate 21 and the lower cover plate 22 can both be quadrilaterals, with four sides, and the four sides of the two sides correspond to each other to form a vertical surrounding wall surface, and then the outer edges of the two sides are welded to complete the definition.

[0029] The vacuum chamber 3 is filled with a working fluid (not shown). For example, the working fluid is water, refrigerant, methanol, acetone, liquid ammonia, etc., that is, a two-phase flow heat dissipation scheme is used to achieve a uniform temperature effect through evaporative steam circulation and condensation reflux.

[0030] Among them, Figure 3 As shown, the temperature equalizing plate structure of the present invention is further provided with at least one capillary structure layer 24, which is at least provided on the inner surface of the lower cover plate 22. The capillary structure layer 24 can be a porous or woven mesh structure made of metal (e.g., copper, aluminum) or non-metallic materials such as rubber and plastic, and is combined on the inner surface of the lower cover plate 22.

[0031] And, at least one carbon element unit 23, which at least has an allotrope of carbon element including but not limited to amorphous carbon, carbon nanofoam, diamond, blue stearite, wax stone, polymerized diamond nanorod, cyclocarbon graphene, graphite, and fullerene. The carbon element unit 23 is at least disposed between the capillary structure layer 24 and the lower cover plate 22 and on the outer surface of the lower cover plate 22. For example, when the carbon element unit 23 is disposed between the capillary structure layer 24 and the lower cover plate 22, the capillary structure layer 24 will be indirectly combined with the inner surface of the lower cover plate 22 through the carbon element unit 23. Specifically, in the present invention, the carbon element unit 23 can be formed by combining particles of an allotrope of carbon element with each other through surface metallization. This not only combines the good thermal conductivity of the allotrope of carbon element (for example, the thermal conductivity of diamond is about five times that of copper), but also enables the carbon element unit 23 to be stably combined with the metal interface of other components (for example, the capillary structure layer 24).

[0032] In actual use, the outer surface of the lower cover plate 22 will contact an electronic component 4 (i.e., a heat source). Figure 3 or Figure 4 As shown, the vacuum chamber 3 has an evaporation side 31 corresponding to the inner surface of the lower cover plate 22 and a condensation side 32 corresponding to the inner surface of the upper cover plate 21. The working fluid in the vacuum chamber 3 will pass through the evaporation side 31 and the condensation side 32 respectively to perform the above-mentioned two-phase flow cycle of repeated evaporation and condensation, and transfer the heat energy from the electronic component 4 through the lower cover plate 22.

[0033] In detail, the heat energy generated by the electronic component 4 will be conducted to the inner surface through the outer surface of the lower cover plate 22. At this time, regardless of whether the carbon element unit 23 is set between the capillary structure layer 24 and the lower cover plate 22, or on the outer surface of the lower cover plate 22, the heat energy generated by the electronic component 4 can be quickly transferred outward through the lower cover plate 22 and the carbon element unit 23 without thermal resistance, thereby greatly improving the heat conduction efficiency and heat exchange efficiency. In addition, the carbon element unit 23 is directly in contact with the electronic component 4, and the high thermal conductivity characteristics of the allotropes of carbon elements such as diamond are utilized to form a fast heat diffusion and high temperature uniformity heat conduction layer at the bottom of the temperature plate structure of the present invention; the heat energy of the electronic component 4 can be quickly conducted to the capillary structure layer 24, and a phase change space is formed through the porous structure of the capillary structure layer 24. The heat from the carbon element unit 23 is quickly transferred (i.e., phase change) and conducted to the surroundings through the phase change of the working fluid to achieve thermal balance or thermal equilibrium, thereby avoiding the possibility of heat accumulation of the electronic component 4.

[0034] In another embodiment, if Figure 5As shown, the carbon element unit 23 can also be respectively arranged on the inner surface of the upper cover plate 21, and between the inner surface of the lower cover plate 22 and the capillary structure layer 24. In this case, the capillary structure layer 24 can be only arranged on the inner surface of the lower cover plate 22, and indirectly combined with the lower cover plate 22 through the carbon element unit 23; or, as shown in FIG. Figure 5 As shown, the carbon element units 23 can be respectively arranged on the inner surface of the upper cover plate 21 and the inner surface of the lower cover plate 22, and the carbon element units 23 are respectively arranged between the upper cover plate 21 and the lower cover plate 22 and the capillary structure layer 24, so that the capillary structure layer 24 is indirectly combined with the upper cover plate 21 and the lower cover plate 22 through the carbon element units 23. It is worth noting that the carbon element units 23 and the capillary structure layer 24 between the upper cover plate 21 and the lower cover plate 22 in the present invention may not contact each other at all, for example, they are completely separated from each other at the outer edges of the upper cover plate 21 and the lower cover plate 22, and the implementation of the present invention is not affected.

[0035] Further, if Figure 6 As shown, in another embodiment, the carbon element unit 23 is arranged between the capillary structure layer 24 and the lower cover plate 22, and the carbon element unit 23 may also be formed with a plurality of through holes 23A, so that the inner surface of the lower cover plate 22 is partially exposed at the plurality of through holes 23A, and is not combined with any of the carbon element units 23. At the same time, the capillary structure layer 24 corresponding to the evaporation side 31 has a plurality of extensions 24B corresponding to the plurality of through holes 23A. The plurality of extensions 24B are formed by protruding from the lower side of the capillary structure layer 24, so that they can be filled in and pass through the plurality of through holes 23A, so that the extensions 24B are directly combined with the inner surface of the lower cover plate 22 exposed through the plurality of through holes 23A. In this way, the working fluid is guided by the capillary adsorption through the capillary structure layer 24, and can enter the plurality of through holes 23A through the plurality of extensions 24B to directly contact the inner surface of the lower cover plate 22. It not only increases the contact area, but also reduces the heat exchange distance between the working fluid and the heat source, so that the heat conduction efficiency and even the temperature uniformity are further improved.

[0036] like Figure 7As shown, in other embodiments, it also includes a plurality of support columns 25 disposed in the vacuum chamber 3 and abutting between the upper cover plate 21 and the lower cover plate 22. Specifically, the plurality of support columns 25 can be made of the same material as the upper cover plate 21 and the lower cover plate 22, and pass through the capillary structure layer 24 and the carbon element unit 23, and the two ends are respectively directly connected or integrally formed between the inner surface of the upper cover plate 21 and the lower cover plate 22 to provide structural strength and directly guide the condensed working fluid to quickly reflux. In addition, the plurality of support columns 25 can also be provided with a support column capillary structure (not shown) to guide the reflux, but the present invention is not limited thereto.

[0037] The above is a detailed description of the present invention, and the above is only a preferred embodiment of the present invention, which should not limit the scope of the present invention. That is, all equivalent changes and modifications made based on the concept of the present invention should still fall within the scope of the patent of the present invention.

Claims

1. A temperature equalizing plate structure, characterized in that: include: an upper cover plate; A lower cover plate, correspondingly covering the upper cover plate to define a vacuum chamber, wherein the vacuum chamber is filled with a working fluid; At least one capillary structure layer is at least disposed on the inner surface of the lower cover plate; At least one carbon element unit is at least arranged between the capillary structure layer and the lower cover plate and on the outer surface of the lower cover plate.

2. The temperature homogenizing plate structure according to claim 1, characterized in that: The vacuum chamber has an evaporation side corresponding to the inner surface of the lower cover plate and a condensation side corresponding to the inner surface of the upper cover plate.

3. The temperature homogenizing plate structure according to claim 2, characterized in that: The carbon element unit is arranged between the capillary structure layer and the lower cover plate, the carbon element unit is formed with a plurality of through holes, the capillary structure layer has a plurality of extension parts corresponding to the plurality of through holes, and the plurality of extension parts are directly combined with the inner surface of the lower cover plate through the plurality of through holes.

4. The temperature homogenizing plate structure according to claim 1, characterized in that: The carbon element units are respectively arranged on the inner surface of the upper cover plate and between the inner surface of the lower cover plate and the capillary structure layer.

5. The temperature homogenizing plate structure according to claim 4, characterized in that: The capillary structure layer is respectively arranged on the inner surface of the upper cover plate and the inner surface of the lower cover plate, and the carbon element unit is respectively arranged between the upper cover plate, the lower cover plate and the capillary structure layer.

6. The temperature homogenizing plate structure according to claim 2, characterized in that: An electronic component is also arranged on the outer surface of the lower cover plate.

7. The temperature homogenizing plate structure according to claim 1, characterized in that: The invention also comprises a plurality of supporting columns which are arranged in the vacuum chamber and abut against the upper cover plate and the lower cover plate.

8. The temperature homogenizing plate structure according to claim 1, characterized in that: The carbon element unit at least comprises any one or more of the group consisting of amorphous carbon, carbon nanofoam, diamond, lonsdaleite, wax stone, polymerized diamond nanorods, cyclocarbon graphene, graphite, and fullerene.

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