PCB manufacturing method capable of increasing bonding force of bonding pad and PCB

Abstract

The invention provides a PCB manufacturing method capable of increasing bonding force of a bonding pad and a PCB. The manufacturing method of the PCB capable of increasing the bonding force of the bonding pad comprises the following steps: manufacturing an inner-layer circuit on an inner-layer core board; performing lamination operation on the plurality of inner core boards, the plurality of copper foil layers and the plurality of bonding layers to form a multi-layer board; performing outer-layer circuit manufacturing on the multi-layer board; performing drilling operation on a bonding pad of the multilayer board to form a reinforcing blind hole extending into the first dielectric layer; and metalized hole filling operation is carried out on the reinforcing blind hole so as to fill and level up the reinforcing blind hole. When the insertion loss is reduced by reducing the roughness of the copper foil, as the bonding pad is fixedly connected to the first dielectric layer through the metalized copper structure, the bonding force of the bonding pad is improved, the problem of insufficient bonding force of the bonding pad is avoided, the problem of bonding pad separation is inhibited, and the insertion loss is reduced on the premise that the bonding force of the bonding pad is not reduced.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to a PCB manufacturing method and a PCB board capable of increasing the bonding force of pads. Background Art

[0002] With the continuous improvement of PCB technology, high-end PCB products are particularly important, such as high-speed boards, high-frequency high-speed boards, etc. High-end PCB products have various strict requirements, such as insertion loss, which is the loss of load power caused by the insertion of components or devices somewhere in the transmission system.

[0003] In the related art, by reducing the roughness of the copper foil, the current can be distributed more evenly on the surface of the copper foil, reducing the tortuosity of the current path, thereby reducing resistance and conductor loss, which helps to reduce the insertion loss of the entire signal link and improve the signal transmission quality. For example, CN112118666A-A PCB device and processing method for reducing insertion loss.

[0004] However, reducing the roughness of the copper surface will cause insufficient adhesion of the copper surface, making it easier for the pad to fall off. Therefore, the industry basically does not reduce the roughness of the copper surface to avoid the problem of insufficient pad bonding, which in turn increases the insertion loss.

[0005] Therefore, there is an urgent need to reduce the insertion loss without reducing the bonding strength of the pad. Summary of the invention

[0006] The purpose of the present disclosure is to overcome the deficiencies in the prior art and to provide a PCB manufacturing method and a PCB board that can reduce insertion loss and increase pad bonding strength without reducing pad bonding strength.

[0007] The purpose of this disclosure is achieved through the following technical solutions:

[0008] A PCB manufacturing method capable of increasing the bonding strength of a pad, comprising:

[0009] Make inner circuits on the inner core board;

[0010] Laminating the plurality of inner core boards, the plurality of copper foil layers and the plurality of adhesive layers to form a multilayer board;

[0011] Fabricating outer circuits on the multilayer board;

[0012] Performing a drilling operation on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer;

[0013] The reinforced blind hole is subjected to a metallization filling operation to fill the reinforced blind hole with an electroplating layer.

[0014] In some embodiments, the inner layer circuit manufacturing of the inner layer core board includes:

[0015] Obtaining inner layer circuit information of the inner layer core board;

[0016] Determining whether the inner core board has pad space according to the inner layer circuit information;

[0017] If so, inner layer circuits are fabricated on the inner core board to form the inner layer circuits and independent pads.

[0018] In some embodiments, judging whether the inner core board has pad space according to the inner layer circuit information further includes:

[0019] Otherwise, inner layer circuits are fabricated on the inner layer core board to form the inner layer circuits.

[0020] In some embodiments, the drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, including:

[0021] Obtaining the first inner layer circuit information of the first inner layer core board;

[0022] Determine whether the first inner core board has an independent pad according to the first inner circuit information;

[0023] If so, drilling is performed on the pads of the multilayer board to form reinforced blind holes extending into the first dielectric layer, and the reinforced blind holes also extend into the independent pads of the first inner core board.

[0024] In some embodiments, the drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, including:

[0025] A laser drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer.

[0026] In some embodiments, a laser drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, and the method also includes:

[0027] Acquiring circuit data of the multilayer board;

[0028] The laser parameters are adjusted according to the line data.

[0029] In some embodiments, the obtaining of the circuit data of the multilayer board includes:

[0030] Get the first inner layer circuit information of the first inner layer core board.

[0031] In some embodiments, adjusting laser parameters according to the line data includes:

[0032] Determine whether the first inner core board has an independent pad according to the first inner circuit information;

[0033] If so, setting the laser parameters to the values ​​acting on the independent pads of the first inner core board;

[0034] Otherwise, the laser parameters are set to the values ​​acting on the first dielectric layer.

[0035] In some embodiments, the metallization filling operation is performed on the reinforced blind hole to fill the reinforced blind hole with an electroplating layer, including:

[0036] The reinforced blind hole is electroplated to fill the reinforced blind hole with an electroplated layer.

[0037] A PCB board is prepared by using the PCB manufacturing method capable of increasing the bonding force of pads as described in any of the above embodiments.

[0038] Compared with the prior art, the present invention has at least the following advantages:

[0039] A drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, and a metallization filling operation is performed on the reinforced blind hole so that the metallized copper structure fills the reinforced blind hole, and the metallized copper structure and the pad are integrated, thereby avoiding the problem of increased insertion loss due to the drilling operation, and at the same time, the metallized copper structure is fixedly embedded in the first dielectric layer, so that the pad is fixedly connected to the first dielectric layer through the metallized copper structure. When reducing the insertion loss by reducing the roughness of the copper foil, since the pad is also fixedly connected to the first dielectric layer through the metallized copper structure, the bonding force of the pad is improved, the problem of insufficient bonding force of the pad is avoided, and the problem of pad detachment is suppressed, that is, the insertion loss is reduced without reducing the bonding force of the pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 A flowchart of the steps of a PCB manufacturing method capable of increasing the bonding strength of a pad according to an embodiment;

[0042] Figure 2 This is a schematic diagram of the structure of a PCB board according to an embodiment;

[0043] Figure 3 for Figure 2 Another structural schematic diagram of the PCB board shown;

[0044] Figure 4 A schematic diagram of the structure of a PCB board according to another embodiment;

[0045] Figure 5 for Figure 4 Another structural schematic diagram of a PCB board is shown.

[0046] Figure numerals: 10, PCB board; 100, first copper foil layer; 110, soldering pad; 111, reinforced blind hole; 200, first adhesive layer; 201, first threaded hole; 300, first inner core board; 310, independent soldering pad; 400, metallized copper structure; 500, connecting pin; 510, limiting head; 600, second adhesive layer; 601, second thread; 700, second inner core board. DETAILED DESCRIPTION

[0047] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0048] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0050] The present disclosure provides a PCB manufacturing method capable of increasing the bonding strength of pads, comprising: manufacturing inner-layer circuits on an inner-layer core board; performing a lamination operation on a plurality of inner-layer core boards, a plurality of copper foil layers, and a plurality of adhesive layers to form a multilayer board; manufacturing outer-layer circuits on the multilayer board; performing a drilling operation on the pads of the multilayer board to form a reinforced blind hole extending to the inside of the first dielectric layer; performing a metallization filling operation on the reinforced blind hole to fill the reinforced blind hole with an electroplating layer. The present disclosure also provides a PCB board, comprising the above-mentioned PCB manufacturing method capable of increasing the bonding strength of pads.

[0051] The above-mentioned PCB manufacturing method and PCB board that can increase the bonding strength of the pad perform a drilling operation on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, and perform a metallization filling operation on the reinforced blind hole so that the metallized copper structure fills the reinforced blind hole, and the metallized copper structure and the pad are integrated, avoiding the problem of increased insertion loss due to the drilling operation, and at the same time, the metallized copper structure is fixedly embedded in the first dielectric layer, so that the pad is fixedly connected to the first dielectric layer through the metallized copper structure. When reducing the insertion loss by reducing the roughness of the copper foil, since the pad is also fixedly connected to the first dielectric layer through the metallized copper structure, the bonding strength of the pad is improved, the problem of insufficient bonding strength of the pad is avoided, and the problem of pad detachment is suppressed, that is, the insertion loss is reduced without reducing the bonding strength of the pad.

[0052] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0053] like Figure 1 As shown, a PCB manufacturing method capable of increasing the bonding strength of a pad according to an embodiment includes:

[0054] S101, fabricating inner layer circuits on the inner layer core board.

[0055] In this embodiment, the inner layer circuits are manufactured using the graphic transfer principle. Specifically, the inner layer circuits are manufactured through pre-processing, lamination, exposure, development, etching, stripping and other processes for processing data and signal transmission. These circuits can carry high-speed signals and ensure the transmission quality and speed of the signals on the circuit board.

[0056] S103, laminating the plurality of inner core boards, the plurality of copper foil layers and the plurality of adhesive layers to form a multilayer board.

[0057] In this embodiment, a plurality of inner core boards, a plurality of copper foil layers and a plurality of adhesive layers are stacked in a predetermined order to form a laminated board, and the laminated board is pressed by heat pressing to form a multilayer board.

[0058] S105, manufacturing outer layer circuits of the multilayer board.

[0059] In this embodiment, outer circuits are fabricated on the multilayer board to form outer circuits and pads on the surface of the multilayer board, wherein the pads are used to electrically connect to electronic components.

[0060] S107 , performing a drilling operation on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer.

[0061] In this embodiment, the first dielectric layer is the dielectric layer closest to the drilling area. The surface of the multilayer board has a pad, and a drilling operation is performed on the pad to form a reinforced blind hole, which extends from the surface of the pad to the inside of the first dielectric layer, that is, the reinforced blind hole extends to the inside of the first adhesive layer.

[0062] S109, performing a metallization filling operation on the reinforced blind hole to fill the reinforced blind hole with an electroplating layer.

[0063] In this embodiment, the reinforced blind hole is metallized and filled, and the metallized copper structure is integrated with the pad to avoid the problem of increased insertion loss caused by the drilling operation, and the metallized copper structure is also embedded in the first dielectric layer, so that the metallized copper structure is fixedly connected to the first dielectric layer, so that the pad is also fixed to the first dielectric layer through the metallized copper structure.

[0064] The above-mentioned PCB manufacturing method that can increase the bonding strength of the pad performs a drilling operation on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, and performs a metallization filling operation on the reinforced blind hole, so that the metallized copper structure fills the reinforced blind hole, and the metallized copper structure and the pad are integrated, avoiding the problem of increased insertion loss due to the drilling operation, and at the same time, the metallized copper structure is fixedly embedded in the first dielectric layer, so that the pad is fixedly connected to the first dielectric layer through the metallized copper structure. When reducing the insertion loss by reducing the roughness of the copper foil, since the pad is also fixedly connected to the first dielectric layer through the metallized copper structure, the bonding strength of the pad is improved, the problem of insufficient bonding strength of the pad is avoided, and the problem of pad detachment is suppressed, that is, the insertion loss is reduced without reducing the bonding strength of the pad.

[0065] In some embodiments, the inner layer circuit manufacturing of the inner layer core board includes:

[0066] Obtaining inner layer circuit information of the inner layer core board;

[0067] Determining whether the inner core board has pad space according to the inner layer circuit information;

[0068] If so, inner layer circuits are fabricated on the inner core board to form the inner layer circuits and independent pads.

[0069] In this embodiment, the inner layer circuit information of the inner layer core board includes the circuit diagram of the inner layer core board. According to the inner layer circuit information, it is judged whether there is pad space in the inner layer core board, that is, according to the inner layer circuit information, it is judged whether there is sufficient and unoccupied area in the inner layer core board. These areas allow independent pads to be formed after the inner layer circuit is made. When the inner layer core board has pad space, the inner layer circuit is made on the inner layer core board to form the inner layer circuit and independent pads. During the lamination operation, the independent pad can block the adhesive layer from flowing, suppress the problem of lamination glue overflow, improve the lamination effect, and improve the lamination quality of the multilayer board.

[0070] In some embodiments, judging whether the inner core board has pad space according to the inner layer circuit information further includes:

[0071] Otherwise, inner layer circuits are fabricated on the inner layer core board to form the inner layer circuits.

[0072] In this embodiment, when the inner core board has no pad space, that is, when the inner core board has no sufficient and unoccupied area, in the step of making the inner layer circuit of the inner core board, only the inner layer circuit is formed without forming an independent pad.

[0073] In some embodiments, the drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, including:

[0074] Obtaining the first inner layer circuit information of the first inner layer core board;

[0075] Determine whether the first inner core board has an independent pad according to the first inner circuit information;

[0076] If so, drilling is performed on the pads of the multilayer board to form reinforced blind holes extending into the first dielectric layer, and the reinforced blind holes also extend into the independent pads of the first inner core board.

[0077] In this embodiment, the first inner core board is the inner core board closest to the pad, the inner line information of the first inner core board is the first inner line information, the first inner line information includes the information of the independent pad of the first inner core board, the first inner line information of the first inner core board is obtained, and whether the first inner core board has an independent pad is confirmed according to the first inner line information. When the first inner core board has an independent pad, drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole, and the reinforced blind hole extends to the inside of the first dielectric layer and the inside of the independent pad of the first inner core board, that is, the reinforced blind hole passes through the first dielectric layer, and the reinforced blind hole also extends to the inside of the independent pad of the first inner core board, so that the subsequently formed metallized copper structure is also fixedly embedded in the independent pad, so that the bonding force of the metallized copper structure is greater. Since the metallized copper structure and the pad are integrated, the bonding force of the pad is greater, and the probability of pad detachment is further reduced after the roughness of the copper foil is further reduced.

[0078] In some embodiments, the step of determining whether the first inner core board has an independent pad according to the first inner layer circuit information further includes:

[0079] Otherwise, a drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer.

[0080] In this embodiment, when the first inner core board is not provided with an independent pad, that is, when the inner core board closest to the pad domain is not provided with an independent pad, a drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole, and the reinforced blind hole extends to the interior of the first dielectric layer, and the reinforced blind hole does not extend to the inner core board to avoid the problem of short circuit of the inner core board caused by the metallized copper structure.

[0081] It can be understood that when the first inner core board does not have an independent solder pad, the copper layer on the first inner core board is a circuit. If the reinforced blind hole extends to the first inner core board, after the reinforced blind hole is metallized and filled, the metallized copper structure will be connected to the circuit of the first inner core board, and there is a risk of short-circuiting the circuit of the first inner core board.

[0082] In some embodiments, the drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, including:

[0083] A laser drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer.

[0084] In this embodiment, a laser machine is used to drill holes on the multilayer board, that is, a laser drilling operation is performed on the pads of the multilayer board to form a reinforced blind hole extending into the first dielectric layer. Laser drilling can achieve micron-level accuracy, which improves the accuracy of the reinforced blind hole. Compared with traditional tool drilling, laser drilling can complete the processing of a large number of holes in a shorter time, reduce the production cycle, and improve production efficiency.

[0085] In some embodiments, a laser drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, and the method also includes:

[0086] Acquiring circuit data of the multilayer board;

[0087] The laser parameters are adjusted according to the line data.

[0088] In this embodiment, the circuit data of the multilayer board includes the thickness of the first dielectric layer and the number of independent pads of the first inner core board. The thickness of the first dielectric layer and whether it has independent pads are related to the adjustment of laser parameters. Specifically, when the first dielectric layer has independent pads, the laser parameters need to ensure that the laser drilling operation can act on the independent pads of the first inner core board, so that the subsequently formed metallized copper structure can be fixedly embedded in the first dielectric layer and the independent pads of the first inner core board, thereby further improving the bonding strength of the pads; when the first dielectric layer does not have independent pads, the laser parameters need to ensure that the laser drilling will not act on the first inner core board to avoid the problem of short circuit in the first inner core board; when the thickness of the first dielectric layer is relatively thick, the diameter of the reinforced blind hole can be appropriately reduced, and the volume of the pad removed is appropriately small, thereby reducing the impact of the drilling operation on the pad.

[0089] In some embodiments, the obtaining of the circuit data of the multilayer board includes:

[0090] Get the first inner layer circuit information of the first inner layer core board.

[0091] In this embodiment, the first inner layer circuit information of the first inner layer core board is obtained, and the first inner layer circuit information includes information of independent solder pads, that is, whether the first inner layer core board has independent solder pads. After obtaining the first inner layer circuit information of the first inner layer core board, it is convenient to adjust the laser parameters according to the first inner layer circuit information.

[0092] In some embodiments, adjusting laser parameters according to the line data includes:

[0093] Determine whether the first inner core board has an independent pad according to the first inner circuit information;

[0094] If so, setting the laser parameters to the values ​​acting on the independent pads of the first inner core board;

[0095] Otherwise, the laser parameters are set to the values ​​acting on the first dielectric layer.

[0096] In this embodiment, since the first layer inner layer circuit information includes the information of the independent pad, it is possible to determine whether the first inner layer core board has an independent pad according to the first layer inner layer circuit information. When the first inner layer core board has an independent pad, the laser parameter is set to a value acting on the independent pad of the first inner layer core board, so that the laser drilling operation can act on the first dielectric layer and the independent pad of the first inner layer core board, thereby forming a reinforced blind hole that penetrates the first dielectric layer and the independent pad of the first inner layer core board. When the first inner layer core board does not have an independent pad, the laser parameter is set to a value acting on the first dielectric layer, thereby avoiding the laser acting on the circuit of the first inner layer core board, thereby avoiding the problem of short circuit of the first inner layer core board.

[0097] In some embodiments, the performing a metallization filling operation on the reinforced blind hole to fill the reinforced blind hole with an electroplating layer includes: performing an electroplating operation on the reinforced blind hole to fill the reinforced blind hole with an electroplating layer.

[0098] In this embodiment, the inner wall of the reinforced blind hole of the pad is used as a conductive layer, and the reinforced blind hole is electroplated to make copper ions adhere to the inner wall of the reinforced blind hole, so that the electroplating layer fills the reinforced blind hole and is integrated with the pad, and the electroplating layer is fixedly embedded in the first dielectric layer, so that the pad is fixedly embedded in the first dielectric layer through the electroplating layer, thereby improving the bonding strength of the pad.

[0099] In some embodiments, after the step of drilling a hole on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, and before the step of metallizing the reinforced blind hole to fill the reinforced blind hole with an electroplating layer, the PCB manufacturing method for increasing the bonding strength of the pad further includes:

[0100] Plasma treatment is performed on the reinforced blind hole to miniaturize the inner wall of the reinforced blind hole.

[0101] In this embodiment, the inner wall of the reinforced blind hole is oxidized by plasma treatment, thereby improving the adhesion of electroplated copper in the reinforced blind hole and improving the subsequent electroplating effect. In addition, the plasma treatment can also clean the inner wall of the reinforced blind hole, improving the subsequent electroplating effect.

[0102] like Figure 2 As shown, the present disclosure further provides a PCB board, which is prepared by using the PCB manufacturing method capable of increasing the bonding force of the pad as described in any of the above embodiments.

[0103] like Figure 2As shown, in some embodiments, the PCB board 10 includes a first copper foil layer 100, a first adhesive layer 200 and a first inner core board 300 which are stacked, the first copper foil layer 100 includes a pad 110, and a reinforcement blind hole 111 is opened on the pad 110, and the reinforcement blind hole 111 extends to the inside of the first adhesive layer 200. The PCB board 10 also includes a metallized copper structure 400, which is located in the reinforcement blind hole 111 and is fixedly connected to the pad 110 and the first adhesive layer 200 respectively. Among them, the metallized copper structure 400 and the pad 110 are an integral structure, and the metallized copper structure 400 is flush with the outer layer of the pad 110. It can be understood that the first adhesive layer 200 is a first dielectric layer, that is, a dielectric layer closest to the pad 110.

[0104] The above-mentioned PCB board 10, because the metallized copper structure 400 is located in the reinforcement hole and fixedly connected to the pad 110, and the metallized copper structure 400 and the pad 110 are an integral structure, the problem of increasing insertion loss due to the drilling operation is avoided. In addition, because the metallized copper structure 400 is also fixedly connected to the first adhesive layer 200, that is, the metallized copper structure 400 is also fixedly connected to the dielectric layer, the pad 110 is fixed to the first dielectric layer through the metallized copper structure 400. When reducing the insertion loss by reducing the roughness of the copper foil, because the pad 110 is also fixedly connected to the dielectric layer through the metallized copper structure 400, the bonding force of the pad 110 is improved, the problem of insufficient bonding force of the pad 110 is avoided, and the problem of the pad 110 being detached is suppressed, that is, the insertion loss is reduced without reducing the bonding force of the pad 110.

[0105] like Figure 2 As shown, in some embodiments, the diameter of the reinforced blind hole 111 gradually decreases in the direction toward the inside of the PCB board 10, and the diameter of the metallized copper structure 400 gradually decreases in the direction toward the inside of the PCB board 10, so that the metallized copper structure 400 and the reinforced blind hole 111 are both tapered. In this embodiment, the metallized copper structure 400 is formed by electroplating, that is, the reinforced blind hole 111 is electroplated, so that the metallized copper structure is formed in the reinforced blind hole 111. Since the diameter of the reinforced blind hole 111 gradually decreases in the direction toward the inside of the PCB board 10, the opening of the reinforced blind hole 111 is larger, which is conducive to the copper ions entering the reinforced blind hole 111 during the electroplating operation, thereby facilitating the formation efficiency of the metallized copper structure 400 and improving the efficiency of manufacturing the PCB board 10.

[0106] like Figure 3As shown, in some embodiments, the PCB board 10 further includes a connecting pin 500, a first end of the connecting pin 500 is fixedly embedded in the first adhesive layer 200, a second end of the connecting pin 500 is located in the reinforcement blind hole 111, and the metallized copper structure 400 is covered and connected to the second end of the connecting pin 500. In this embodiment, since the connecting pin 500 is fixedly connected to the first adhesive layer 200, and the metallized copper structure 400 is covered and connected to the second end of the connecting pin 500, the inside of the metallized copper structure 400 is also fixedly connected to the first adhesive layer 200 through the connecting pin 500, and since the surface of the metallized copper structure 400 is also fixedly connected to the first adhesive layer 200, the inside and the outside of the metallized copper structure 400 are fixedly connected to the first adhesive layer 200, thereby improving the bonding strength of the metallized copper structure 400, and since the metallized copper structure 400 is fixedly connected to the pad 110, the bonding strength of the pad 110 is improved, and the risk of the pad 110 being detached is further reduced.

[0107] like Figure 3 As shown, further, a stopper head 510 is protruded from the outer side of the second end of the connecting pin 500, and the metallized copper structure 400 is covered and connected to the stopper head 510. In this embodiment, since the stopper head 510 protrudes from the outer side of the second end of the connecting pin 500, the stability of the metallized copper structure 400 and the connecting pin 500 is improved, thereby improving the connection stability of the pad 110, thereby improving the bonding force of the pad 110, and further reducing the probability of the pad 110 falling off.

[0108] like Figure 3 As shown, in some embodiments, there is a distance between the connecting needle 500 and the opening of the reinforcement blind hole 111 to ensure that the metallized copper structure 400 can fill the reinforcement blind hole 111, thereby avoiding the problem of the connecting needle 500 increasing the insertion loss.

[0109] like Figure 4 As shown, in other embodiments, the first inner core board 300 has an independent pad 310. Further, the reinforcement blind hole 111 runs through the first adhesive layer 200 and extends to the inside of the independent pad 310 of the first inner core board 300. The metallized copper structure 400 is located in the reinforcement blind hole 111 and is fixedly connected to the first adhesive layer 200 and the independent pad 310 of the first inner core board 300, respectively, so that the connection stability of the metallized copper structure 400 is higher, and then the bonding force of the pad 110 is stronger, and the probability of the pad 110 detaching is further reduced. Furthermore, the reinforcement blind hole 111 also runs through the independent pad 310 of the first inner core board 300.

[0110] like Figure 5As shown, in some embodiments, the PCB board 10 further includes a second adhesive layer 600 and a second inner core board 700, and the first copper foil layer 100, the first adhesive layer 200, the first inner core board 300, the second adhesive layer 600 and the second inner core board 700 are stacked. It can be understood that the second adhesive layer 600 is a second dielectric layer.

[0111] like Figure 5 As shown, further, the PCB board 10 further includes a connecting pin 500, the first end of the connecting pin 500 is fixedly embedded in the second adhesive layer 600, the second end of the connecting pin 500 is located in the reinforcement blind hole 111, and the metallized copper structure 400 is covered and connected to the second end of the connecting pin 500. In this embodiment, since the first end of the connecting pin 500 is fixedly connected to the second adhesive layer 600, and the metallized copper structure 400 is covered and connected to the second end of the connecting pin 500, the inside of the metallized copper structure 400 is also fixedly connected to the second adhesive layer 600 through the connecting pin 500, and since the surface of the metallized copper structure 400 is also fixedly connected to the second adhesive layer 600, the inside and the outside of the metallized copper structure 400 are fixedly connected to the second adhesive layer 600, thereby improving the bonding strength of the metallized copper structure 400, and since the metallized copper structure 400 is fixedly connected to the pad 110, the bonding strength of the pad 110 is improved, and the risk of the pad 110 being detached is further reduced.

[0112] like Figure 5 As shown, further, a stopper head 510 is protruded from the outer side of the second end of the connecting pin 500, and the metallized copper structure 400 is covered and connected to the stopper head 510. In this embodiment, since the stopper head 510 protrudes from the outer side of the second end of the connecting pin 500, the stability of the metallized copper structure 400 and the connecting pin 500 is improved, thereby improving the connection stability of the pad 110, thereby improving the bonding force of the pad 110, and further reducing the probability of the pad 110 falling off.

[0113] like Figure 5 As shown, in some embodiments, there is a distance between the connecting needle 500 and the opening of the reinforcement blind hole 111 to ensure that the metallized copper structure 400 can fill the reinforcement blind hole 111, thereby avoiding the problem of the connecting needle 500 increasing the insertion loss.

[0114] Compared with the prior art, the present invention has at least the following advantages:

[0115] A drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, and a metallization filling operation is performed on the reinforced blind hole so that the metallized copper structure fills the reinforced blind hole, and the metallized copper structure and the pad are integrated, thereby avoiding the problem of increased insertion loss due to the drilling operation, and at the same time, the metallized copper structure is fixedly embedded in the first dielectric layer, so that the pad is fixedly connected to the first dielectric layer through the metallized copper structure. When reducing the insertion loss by reducing the roughness of the copper foil, since the pad is also fixedly connected to the first dielectric layer through the metallized copper structure, the bonding force of the pad is improved, the problem of insufficient bonding force of the pad is avoided, and the problem of pad detachment is suppressed, that is, the insertion loss is reduced without reducing the bonding force of the pad.

[0116] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.

Claims

1. A PCB manufacturing method capable of increasing the bonding strength of a pad, characterized in that: include: Make inner circuits on the inner core board; Laminating the plurality of inner core boards, the plurality of copper foil layers and the plurality of adhesive layers to form a multilayer board; Fabricating outer circuits on the multilayer board; Performing a drilling operation on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer; The reinforced blind hole is subjected to a metallization filling operation to fill the reinforced blind hole with an electroplating layer.

2. The PCB manufacturing method capable of increasing the bonding strength of the pad according to claim 1, characterized in that: The inner layer circuit manufacturing of the inner layer core board includes: Obtaining inner layer circuit information of the inner layer core board; Determining whether the inner core board has pad space according to the inner layer circuit information; If so, inner layer circuits are fabricated on the inner core board to form the inner layer circuits and independent pads.

3. The PCB manufacturing method capable of increasing the bonding strength of the pad according to claim 2, characterized in that: The step of judging whether the inner core board has pad space according to the inner layer circuit information further includes: Otherwise, inner layer circuits are fabricated on the inner layer core board to form the inner layer circuits.

4. The PCB manufacturing method capable of increasing the bonding strength of pads according to claim 1, characterized in that: The drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, comprising: Obtaining the first inner layer circuit information of the first inner layer core board; Determine whether the first inner core board has an independent pad according to the first inner circuit information; If so, drilling is performed on the pads of the multilayer board to form reinforced blind holes extending into the first dielectric layer, and the reinforced blind holes also extend into the independent pads of the first inner core board.

5. The PCB manufacturing method capable of increasing the bonding strength of pads according to claim 1, characterized in that: The drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, comprising: A laser drilling operation is performed on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer.

6. The PCB manufacturing method capable of increasing the bonding strength of the pad according to claim 5, characterized in that: Performing a laser drilling operation on the pad of the multilayer board to form a reinforced blind hole extending into the first dielectric layer, and previously comprising: Acquiring circuit data of the multilayer board; The laser parameters are adjusted according to the line data.

7. The PCB manufacturing method capable of increasing the bonding strength of the pad according to claim 6, characterized in that: The obtaining of the circuit data of the multilayer board comprises: Get the first inner layer circuit information of the first inner layer core board.

8. The PCB manufacturing method capable of increasing the bonding strength of the pad according to claim 7, characterized in that: The adjusting laser parameters according to the line data includes: Determine whether the first inner core board has an independent pad according to the first inner circuit information; If so, setting the laser parameters to the values ​​acting on the independent pads of the first inner core board; Otherwise, the laser parameters are set to the values ​​acting on the first dielectric layer.

9. The PCB manufacturing method capable of increasing the bonding strength of pads according to claim 1, characterized in that: The metallization filling operation is performed on the reinforced blind hole to fill the reinforced blind hole with an electroplating layer, comprising: The reinforced blind hole is electroplated to fill the reinforced blind hole with an electroplated layer.

10. A PCB board, characterized in that: The PCB is prepared by the PCB manufacturing method capable of increasing the bonding strength of the pad according to any one of claims 1 to 9.

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