Display panel, display module and display device

Abstract

The invention provides a display panel, a display module and a display device, the display panel comprises an array substrate, the array substrate comprises a display area and a non-display area, and at least part of the non-display area comprises a bonding area; the packaging layer is located on one side of the array substrate and located in the display area; the COF substrate comprises a first through hole, and the orthographic projection of the first through hole on the array substrate is located in the bonding area; the anisotropic conductive film is positioned between the COF substrate and the array substrate; the first through hole is filled with the connecting structure, and the COF substrate and the anisotropic conductive film are connected through the connecting structure. According to the display panel provided by the invention, the bonding force between the COF substrate and the anisotropic conductive film is enhanced, so that the bonding force between the COF substrate and the array substrate is enhanced, the phenomenon that the bonding end of the COF substrate is peeled due to the fact that the COF substrate is pulled by a circuit board is avoided, and the packaging reliability is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a display module and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) is an active light-emitting device with a sandwich structure consisting of multiple organic layers and electrodes on both sides. At present, display screens based on AMOLED (Active-matrix organic light-emitting diode) have been commercialized in the fields of smart phones, watches and laptops.

[0003] However, the performance of the relevant display screen needs to be improved. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide a display panel that is beneficial to improving the packaging effect and avoiding packaging failure.

[0005] Based on the above purpose, the present application provides a display panel, including:

[0006] The array substrate comprises a display area and a non-display area, wherein at least part of the non-display area comprises a bonding area;

[0007] The encapsulation layer is located in the display area; the display panel also includes: a COF substrate, an anisotropic conductive film and a connection structure; wherein

[0008] The COF substrate comprises a first through hole, and the orthographic projection of the first through hole on the array substrate is located in the bonding area;

[0009] The anisotropic conductive film is located between the COF substrate and the array substrate;

[0010] The connecting structure fills the first through hole to connect the COF substrate to the anisotropic conductive film. In one embodiment, the anisotropic conductive film includes a second through hole, the second through hole is connected to the first through hole, the orthographic projection of the second through hole on the array substrate is located in the bonding area, and the connecting structure fills the first through hole and the second through hole;

[0011] Preferably, the orthographic projections of the first through hole and the second through hole on the array substrate overlap;

[0012] Preferably, the COF substrate includes a plurality of the first through holes, which are arranged in an array on the COF substrate, and the anisotropic conductive film includes a plurality of the second through holes, which are arranged in an array on the anisotropic conductive film.

[0013] In one embodiment, the connection structure includes:

[0014] a first packaging glue, wherein the first packaging glue fills the first through hole and penetrates between the COF substrate and the anisotropic conductive film through the first through hole;

[0015] Preferably, a first gap is formed between the COF substrate and the packaging layer, and the first packaging glue fills the first gap;

[0016] Preferably, a first marking point is provided on the array substrate, and a second marking point is provided on the COF substrate, and the first marking point and the second marking point cooperate to perform alignment;

[0017] Preferably, the first marking point and the second marking point are located in the bonding area.

[0018] In one embodiment, the COF substrate partially extends out of the array substrate to form an extension portion;

[0019] The display panel further includes:

[0020] A second packaging adhesive is filled between an end of the array substrate close to the extension portion and the extension portion.

[0021] In one embodiment, the extension portion includes a third through hole, and the display panel further includes:

[0022] a third packaging glue, the third packaging glue filling the third through hole and connected with the second packaging glue;

[0023] Preferably, the third through holes are arranged in an array on the extension portion.

[0024] In one embodiment, the array substrate comprises a first groove at one end close to the extension portion, and the second packaging glue penetrates into the first groove;

[0025] Preferably, the first groove is located on an end wall of the array substrate close to one end of the extension portion;

[0026] Preferably, the first grooves are arranged in an array on the end wall.

[0027] In one embodiment, the connection structure includes:

[0028] at least one connecting post, wherein the connecting post is formed on the array substrate by glass sintering;

[0029] The array substrate is sleeved on the connecting pillars through second through holes corresponding to the connecting pillars, and the COF substrate is sleeved on the connecting pillars through first through holes corresponding to the connecting pillars.

[0030] In one embodiment, the height of the connecting column is 0.15-0.3 mm;

[0031] Preferably, the height of the connecting pillar is lower than the height of the packaging layer, and the connecting pillar is 0.1-0.25 mm higher than the COF substrate.

[0032] Based on the same inventive concept, the present application also discloses a display module, which includes any one of the display panels described above.

[0033] Based on the same inventive concept, the present application also discloses a display device, which includes the above-mentioned display module.

[0034] Compared with the related art, the display panel provided by the present application connects the COF substrate to the anisotropic conductive film by setting a through hole on the COF substrate and filling a connecting structure in the through hole, thereby enhancing the adhesion between the COF substrate and the anisotropic conductive film, and further enhancing the adhesion between the COF substrate and the array substrate, preventing the COF substrate from being pulled by the circuit board and causing peeling of the bonding end of the COF substrate, thereby preventing water vapor from penetrating into the interior of the display panel and causing circuit corrosion, thereby improving the reliability of the packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 is a structural schematic diagram of a related display panel;

[0037] Figure 2 It is a schematic diagram of a partial structure of a display panel in one embodiment of the present application;

[0038] Figure 3 This is a schematic diagram of the layer structure of a display panel in one embodiment of the present application;

[0039] Figure 4 This is a schematic diagram of the layer structure of a display panel in another embodiment of the present application;

[0040] Figure 5 This is a schematic diagram of the layer structure of a display panel in another embodiment of the present application;

[0041] Figure 6 This is a schematic diagram of the layer structure of a display panel in another embodiment of the present application;

[0042] Figure 7 This is a schematic diagram of the layer structure of a display panel in another embodiment of the present application;

[0043] Figure 8 This is a schematic diagram of the layer structure of a display panel in another embodiment of the present application;

[0044] Fig. 9 This is a schematic diagram of the layer structure of a display panel in another embodiment of the present application;

[0045] Fig.10 This is a schematic diagram of a partial structure of a display panel in another embodiment of the present application;

[0046] Fig.11 FIG. 1 is a schematic diagram of a layer structure of a display panel in another embodiment of the present application.

[0047] Marking Description:

[0048] 100, display panel; 101, driving module; 102, circuit board;

[0049] 1. array substrate; 11. display area; 12. non-display area; 13. bonding area; 14. first marking point; 15. first gap; 16. first groove; 17. circuit;

[0050] 2. Encapsulation layer;

[0051] 3. COF substrate; 31. first through hole; 32. second marking point; 33. extension portion; 34. third through hole;

[0052] 4. anisotropic conductive film; 41. second through hole;

[0053] 5. connection structure; 51. first packaging glue; 52. connection column;

[0054] 6. Second packaging glue;

[0055] 7. The third packaging glue. DETAILED DESCRIPTION

[0056] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0057] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0058] Please refer to Figure 1 As shown, a related display panel 100 includes an array substrate 1 and a COF (Chip On Film) substrate 3. The array substrate 1 includes a display area 11 and a non-display area 12, wherein one of the non-display areas 12 includes a bonding area 13. A driving module 101 is arranged on the COF substrate 3. The driving module 101 is connected to a circuit board 102 and is connected to the array substrate 1 through the bonding area 13.

[0059] During the production process of the display panel, an operator is usually required to pull the circuit board 102 and place the circuit board 102 on the back of the display panel. The inventors have found that in the process of pulling the circuit board 102, the COF substrate 3 is usually pulled, which can easily cause peeling of the bonding end of the COF substrate 3, resulting in water vapor penetrating into the display panel and causing circuit corrosion, resulting in display abnormalities.

[0060] Based on this, the present application provides a display panel solution to solve the above problems.

[0061] Please refer to Figure 1 , 2 As shown in FIG. 3 , a display panel 100 is provided in one embodiment of the present application. The display panel 100 includes an array substrate 1, a packaging layer 2, a COF substrate 3, an anisotropic conductive film 4 and a connection structure 5.

[0062] Among them, the array substrate 1 includes a display area 11 and a non-display area 12, at least part of the non-display area 12 includes a bonding area 13, which is located in the display area 11, the COF substrate 3 includes a first through hole 31, and the orthographic projection of the first through hole 31 on the array substrate 1 is located in the bonding area 13, the anisotropic conductive film 4 is located between the COF substrate 3 and the array substrate 1, and the connecting structure 5 fills the first through hole 31 to connect the COF substrate 3 with the anisotropic conductive film 4.

[0063] The anisotropic conductive film 4 has obvious differences in resistance characteristics in the vertical direction (such as the Z direction in the figure) and the horizontal direction (such as the X / Y direction in the figure), and can achieve good conductive connection in the vertical direction, while having good insulation performance in the horizontal direction, which can avoid short circuits between adjacent lines 17, thereby achieving the purpose of conducting only in the Z-axis direction. The encapsulation layer 2 may include structures such as encapsulation glass.

[0064] The display panel 100 provided in the present application connects the COF substrate 3 to the anisotropic conductive film 4 by setting a first through hole 31 on the COF substrate 3 and filling a connecting structure 5 in the first through hole 31, thereby enhancing the adhesion between the COF substrate 3 and the anisotropic conductive film 4, and further enhancing the adhesion between the COF substrate 3 and the array substrate 1, preventing the COF substrate 3 from being pulled by the circuit board and causing peeling of the bonding end of the COF substrate 3, thereby preventing water vapor from penetrating into the interior of the display panel 100 and causing circuit corrosion, thereby improving the reliability of the package.

[0065] Please continue to refer to Figure 2 As shown, in one embodiment, a first marking point 14 is provided on the array substrate 1, and a second marking point 32 is provided on the COF substrate 3. The first marking point 14 and the second marking point 32 cooperate to perform alignment, so as to achieve the bonding of the array substrate 1 and the COF substrate 3 and ensure the bonding accuracy. Preferably, the first marking point 14 and the second marking point 32 are located in the bonding area 13. Furthermore, the first marking point 14 and the second marking point 32 are provided at both ends of the bonding area 13 along the length direction (X direction in the figure), so as to further improve the bonding accuracy.

[0066] In one embodiment, the second marking point 32 is a cross, and the first marking point 14 is four rectangles. During alignment, the second marking point 32 needs to be placed in the middle of the four rectangles to ensure the lamination accuracy of the array substrate 1 and the COF substrate 3. In other embodiments, the first marking point 14 and the second marking point 32 can be other shapes, such as a circle, etc., which are not specifically limited.

[0067] Please continue to refer to Figure 2As shown, in one embodiment, a plurality of connection structures 5 are provided, some of which are provided on the side of the second marking point 32 away from the circuit 17, some of which are provided on the side of the second marking point 32 close to the display area 11, and some of which are provided on the side of the second marking point 32 away from the display area 11. In particular, since the space on the side of the COF substrate 3 where the second marking point 32 is away from the circuit 17 is larger, and the space on the side of the COF substrate 3 where the second marking point 32 is close to the display area 11 and away from the display area 11 is smaller, the connection structure 5 on the COF substrate 3 where the second marking point 32 is away from the circuit 17 can be provided larger, and the connection structure 5 on the side of the COF substrate 3 where the second marking point 32 is close to the display area 11 and away from the display area 11 can be provided smaller, thereby improving the bonding force.

[0068] Reference Figure 4 As shown, in one embodiment, the anisotropic conductive film 4 includes a second through hole 41, the second through hole 41 is connected to the first through hole 31, the orthographic projection of the second through hole 41 on the array substrate 1 is located in the bonding area 13, and the connecting structure 5 fills the first through hole 31 and the second through hole 41 to connect the array substrate 1, the anisotropic conductive film 4, and the COF substrate 3.

[0069] Specifically, the second through hole 41 on the anisotropic conductive film 4 is connected to the first through hole 31, the connecting structure 5 fills the first through hole 31 and the second through hole 41, and the array substrate 1, the anisotropic conductive film 4 and the COF substrate 3 are connected through the connecting structure 5, so that the array substrate 1, the anisotropic conductive film 4 and the COF substrate 3 become a whole, and then the bonding force between the three further prevents the COF substrate 3 from being pulled by the circuit board and causing peeling of the bonding end of the COF substrate 3, thereby further improving the reliability of the package.

[0070] Preferably, the orthographic projections of the first through hole 31 and the second through hole 41 on the array substrate 1 overlap, so that the connection structure 5 directly penetrates the first through hole 31 and the second through hole 41 along a direction perpendicular to the side surface of the array substrate 1 .

[0071] Preferably, the COF substrate 3 includes a plurality of first through holes 31, which are arranged in an array on the COF substrate 3, and the anisotropic conductive film 4 includes a plurality of second through holes 41, which are arranged in an array on the anisotropic conductive film 4. Specifically, the array-arranged through holes can realize an array-arranged connection structure 5, thereby further improving the bonding force among the array substrate 1, the anisotropic conductive film 4 and the COF substrate 3, and further preventing the COF substrate 3 from being pulled by the circuit board, resulting in peeling of the bonding end of the COF substrate 3.

[0072] Reference Figure 5As shown, in one embodiment, the connection structure 5 includes a first packaging glue 51, and the first packaging glue 51 fills the first through hole 31 and penetrates between the COF substrate 3 and the anisotropic conductive film 4 through the first through hole 31. The first packaging glue 51 is initially in a liquid state and can penetrate between the COF substrate 3 and the array substrate 1. Then, the first packaging glue 51 is cured to form a rivet-like structure between the COF substrate 3 and the anisotropic conductive film 4, thereby increasing the overall bonding strength. Furthermore, the first packaging glue 51 can also penetrate between the anisotropic conductive film 4 and the array substrate 1 through the second through hole 41, and can form a rivet-like structure between the anisotropic conductive film 4 and the array substrate 1, thereby further increasing the overall bonding strength.

[0073] Please continue to refer to Figure 4 and 5 As shown, in one embodiment, a first gap 15 is formed between the COF substrate 3 and the encapsulation layer 2, and the first encapsulation glue 51 fills the first gap 15. After the first encapsulation glue 51 fills the first gap 15, the bonding strength between the end face of the COF substrate 3 and the end face of the encapsulation layer 2 is guaranteed. At the same time, the first encapsulation glue 51 can also penetrate to the bottom of the first gap 15, so as to bond the encapsulation layer 2, the COF substrate 3 and the anisotropic conductive film 4 into a whole, thereby increasing the overall bonding strength. Further, a gap connected to the first gap 15 is formed between the anisotropic conductive film 4 and the encapsulation layer 2, and the bottom of the gap is the array substrate 1. The first encapsulation glue 51 can also penetrate to the bottom of the gap, so as to bond the array substrate 1, the encapsulation layer 2, the COF substrate 3 and the anisotropic conductive film 4 into a whole, thereby further increasing the overall bonding strength.

[0074] Please refer to Figure 6 As shown, in one embodiment, the first packaging glue 51 partially covers the side of the COF substrate 3 away from the array substrate 1, and fills the first through hole 31, the second through hole 41 and the first gap 15, so as to bond the array substrate 1, the packaging layer 2, the COF substrate 3 and the anisotropic conductive film 4 into a whole. Specifically, the packaging glue is sealed on the side of the COF substrate 3 away from the array substrate 1, and the first packaging glue 51 penetrates from the side of the COF substrate 3 away from the array substrate 1 to the first through hole 31, the second through hole 41 and the first gap 15.

[0075] Please refer to Figure 7 As shown, in one embodiment, the COF substrate 3 partially extends out of the array substrate 1 and forms an extension portion 33; the display panel 100 also includes a second packaging glue 6, and the second packaging glue 6 is filled between one end of the array substrate 1 close to the extension portion 33 and the extension portion 33, thereby enhancing the bonding force between the COF substrate 3 and the array substrate 1, and preventing the COF substrate 3 from being pulled by the circuit board and causing peeling of the bonding end of the COF substrate 3.

[0076] Please refer to Figure 8 As shown, in one embodiment, the extension portion 33 includes a third through hole 34, and the display panel 100 further includes a third packaging glue 7, which fills the third through hole 34 and is connected to the second packaging glue 6. The third packaging glue 7 can further enhance the bonding force between the COF substrate 3 and the second packaging glue 6, and prevent the COF substrate 3 from being pulled by the circuit board, resulting in peeling of the bonding end of the COF substrate 3. Furthermore, the third packaging glue 7 and the second packaging glue 6 are made of the same material.

[0077] Preferably, the third through holes 34 are arranged in an array on the extension portion 33 , which is beneficial to enhancing the adhesive force between the COF substrate 3 and the array substrate 1 .

[0078] Please refer to Fig. 9 As shown, in one embodiment, one end of the array substrate 1 close to the extension portion 33 includes a first groove 16, and the second packaging glue 6 penetrates into the first groove 16. The second packaging glue 6 penetrates into the first groove 16, which can further enhance the bonding force between the array substrate 1 and the second packaging glue 6, thereby enhancing the bonding force between the array substrate 1 and the COF substrate 3, and preventing the COF substrate 3 from being pulled by the circuit board, resulting in peeling of the bonding end of the COF substrate 3.

[0079] Preferably, the first groove 16 is located on the end wall of the array substrate 1 close to the extension portion 33. Further, the first grooves 16 are arranged in an array on the end wall, which is conducive to enhancing the bonding force between the array substrate 1 and the second packaging glue 6. Further, the first groove 16 is hemispherical or cylindrical, etc., which is not specifically limited.

[0080] Please continue to refer to Fig. 9 As shown, in one embodiment, the first packaging glue 51 and the third packaging glue 7 form an integral structure and partially cover the side of the COF substrate 3 away from the array substrate 1. Preferably, the first packaging glue 51, the second packaging glue 6, and the third packaging glue 7 are made of the same material.

[0081] Reference Fig.10 and 11As shown, in one embodiment, the connection structure 5 includes at least one connection column 52, and the connection column 52 is formed on the array substrate 1 by glass sintering. The array substrate 1 is sleeved on the connection column 52 through the second through hole 41 corresponding to the connection column 52, and the COF substrate 3 is sleeved on the connection column 52 through the first through hole 31 corresponding to the connection column 52. Among them, the size of the first through hole 31 and the second through hole 41 is slightly larger than that of the connection column 52, so that the array substrate 1 and the COF substrate 3 are sleeved on the connection column 52. Specifically, the shapes of the first through hole 31 and the second through hole 41 include circular, rectangular, trapezoidal, etc., which are not specifically limited. The cross-sectional shape of the connection column 52 can be set according to the shape of the through hole.

[0082] Preferably, the height of the connecting column 52 is 0.15-0.3 mm, such as 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc., and is not specifically limited. The connecting column 52 of this height can effectively reduce the pulling shear stress on the COF substrate 3. Preferably, the height of the connecting column 52 is lower than the height of the encapsulation layer 2, and the connecting column 52 is 0.1-0.25 mm higher than the COF substrate 3, such as 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, etc., and is not specifically limited. This height difference can effectively prevent the COF substrate 3, the anisotropic conductive film 4 from being separated from the connecting column 52.

[0083] Based on the same inventive concept, another embodiment of the present application further discloses a display module, which includes the display panel 100 in the above embodiment.

[0084] A display module provided in this embodiment has a display panel 100, in which a first through hole 31 is provided on a COF substrate 3, and a connection structure 5 is filled in the first through hole 31, so as to connect the COF substrate 3 with an anisotropic conductive film 4, thereby enhancing the adhesion between the COF substrate 3 and the anisotropic conductive film 4, and further enhancing the adhesion between the COF substrate 3 and the array substrate 1, thereby preventing the COF substrate 3 from being pulled by the circuit board and causing peeling of the bonding end of the COF substrate 3, thereby preventing water vapor from penetrating into the interior of the display panel 100 and causing circuit corrosion, thereby improving the reliability of the package and the performance of the display module.

[0085] Based on the same inventive concept, another embodiment of the present application further discloses a display device, which includes the display module in the above embodiment. Further, the display device includes a mobile phone, VR equipment, computer, television, car display equipment, etc.

[0086] A display device provided in this embodiment has a display module including a display panel 100. The display panel 100 connects the COF substrate 3 with the anisotropic conductive film 4 by setting a first through hole 31 on the COF substrate 3 and filling a connection structure 5 in the first through hole 31, thereby enhancing the adhesion between the COF substrate 3 and the anisotropic conductive film 4, and further enhancing the adhesion between the COF substrate 3 and the array substrate 1, preventing the COF substrate 3 from being pulled by the circuit board and causing peeling of the bonding end of the COF substrate 3, thereby preventing water vapor from penetrating into the display panel 100 and causing circuit corrosion, thereby improving the reliability of the package and the performance of the display device.

[0087] Although the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.

[0088] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0089] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: include: The array substrate comprises a display area and a non-display area, wherein at least a part of the non-display area comprises a bonding area; The encapsulation layer is located in the display area; the display panel also includes: a COF substrate, an anisotropic conductive film and a connection structure; wherein The COF substrate comprises a first through hole, the orthographic projection of the first through hole on the array substrate is located in the bonding area; the anisotropic conductive film is located between the COF substrate and the array substrate; and the connecting structure fills the first through hole to connect the COF substrate with the anisotropic conductive film.

2. The display panel according to claim 1, characterized in that: The anisotropic conductive film comprises a second through hole, the second through hole is connected to the first through hole, the orthographic projection of the second through hole on the array substrate is located in the bonding area, and the connecting structure fills the first through hole and the second through hole; Preferably, the orthographic projections of the first through hole and the second through hole on the array substrate overlap; Preferably, the COF substrate includes a plurality of the first through holes, which are arranged in an array on the COF substrate, and the anisotropic conductive film includes a plurality of the second through holes, which are arranged in an array on the anisotropic conductive film.

3. The display panel according to claim 1, characterized in that: The connection structure comprises: a first packaging glue, wherein the first packaging glue fills the first through hole and penetrates between the COF substrate and the anisotropic conductive film through the first through hole; Preferably, a first gap is formed between the COF substrate and the packaging layer, and the first packaging glue fills the first gap; Preferably, a first marking point is provided on the array substrate, and a second marking point is provided on the COF substrate, and the first marking point and the second marking point cooperate to perform alignment; Preferably, the first marking point and the second marking point are located in the bonding area.

4. The display panel according to claim 1, characterized in that: The COF substrate partially extends out of the array substrate to form an extension portion; The display panel further includes: A second packaging adhesive is filled between an end of the array substrate close to the extension portion and the extension portion.

5. The display panel according to claim 4, characterized in that: The extending portion includes a third through hole, and the display panel further includes: a third packaging glue, the third packaging glue filling the third through hole and connected with the second packaging glue; Preferably, the third through holes are arranged in an array on the extension portion.

6. The display panel according to claim 5, characterized in that: One end of the array substrate close to the extension portion comprises a first groove, and the second packaging glue penetrates into the first groove; Preferably, the first groove is located on an end wall of the array substrate close to one end of the extension portion; Preferably, the first grooves are arranged in an array on the end wall.

7. The display panel according to claim 2, characterized in that: The connection structure comprises: at least one connecting post, wherein the connecting post is formed on the array substrate by glass sintering; The array substrate is sleeved on the connecting pillars through the second through holes corresponding to the connecting pillars, and the COF substrate is sleeved on the connecting pillars through the first through holes corresponding to the connecting pillars.

8. The display panel according to claim 7, characterized in that: The height of the connecting column is 0.15-0.3 mm; Preferably, the height of the connecting pillar is lower than the height of the packaging layer, and the connecting pillar is 0.1-0.25 mm higher than the COF substrate.

9. A display module, characterized in that: Comprising a display panel as described in any one of claims 1-8.

10. A display device, characterized in that: Comprising the display module as claimed in claim 9.

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