Wafer grinding detection method, processing method, device, and equipment

Abstract

The embodiments of the present application provide a wafer grinding detection method, processing method, device, and equipment. Among them, the wafer grinding detection method includes the following steps: a determination step, determining whether the grinding wheel of the wafer grinding equipment is in contact with the workbench; an acquisition step, after determining that the grinding wheel is in contact with the workbench, acquiring the spindle position and workbench height of the wafer grinding equipment in real time; an abnormality step, determining whether an abnormality occurs in the workbench grinding according to the spindle position and the workbench height. The embodiment of the present application combines the change of the workbench height with the change of the spindle motor position to determine whether the grinding process is abnormal. By simultaneously monitoring the two parameters of the workbench height and the spindle motor position, it can more accurately identify problems that may occur in the grinding process, reduce the possibility of misjudgment, and improve the accuracy and reliability of detection. In addition, accurate abnormality detection can promptly remind the operator to take measures, thereby reducing the risk of damage to the workbench and the grinding wheel.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing technology, and in particular to a wafer grinding detection method, processing method, device, and equipment. Background Art

[0002] In semiconductor processing technology, wafer grinding equipment is a device that thins wafers, etc., mainly by grinding to thin the wafer to the required thickness. During the processing, the wafer is usually fixed on the workbench of the wafer grinding equipment.

[0003] Generally speaking, before fixing the wafer, the grinding equipment needs to grind the workbench into a certain shape, such as a cone, so that the workbench and the wafer can be better matched and the stability of the wafer during grinding can be improved. At present, in the relevant technology, it is impossible to monitor the abnormalities of the grinding equipment during the grinding process in real time, thereby increasing the risk of damage to the grinding wheel and the workbench. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a wafer grinding detection method, processing method, device, and equipment to at least partially solve the above-mentioned problems.

[0005] According to a first aspect of an embodiment of the present application, a wafer grinding detection method is provided, which is used for a wafer grinding device, and the method comprises the following steps: a determination step, determining whether a grinding wheel of the wafer grinding device is in contact with a worktable; an acquisition step, after determining that the grinding wheel is in contact with the worktable, acquiring a spindle position and a worktable height of the wafer grinding device in real time; and an abnormality step, determining whether an abnormality occurs in the grinding of the worktable according to the spindle position and the worktable height.

[0006] Furthermore, in the above-mentioned wafer grinding detection method, the determining step includes: an acquiring sub-step, acquiring in real time the Z-axis motor torque and the spindle motor current of the wafer grinding equipment, as well as the idling torque of the Z-axis motor and the idling current of the spindle motor; and a determining sub-step, determining whether the grinding wheel is in contact with the workbench based on the Z-axis motor torque, the spindle motor current, the idling torque of the Z-axis motor and the idling current of the spindle motor.

[0007] Furthermore, in the above-mentioned wafer grinding detection method, the determination sub-step includes: determining the change in the Z-axis motor torque within a preset time, and calculating the ratio of the Z-axis motor torque change to the idling torque; determining the spindle motor current change within a preset time, and calculating the ratio of the spindle motor current change to the idling current; when the ratio of the Z-axis torque change to the idling torque is greater than a preset threshold value of the Z-axis torque, and the ratio of the spindle motor current change to the idling current is greater than a preset current threshold value, determining that the grinding wheel is in contact with the workbench.

[0008] Furthermore, in the above-mentioned wafer grinding detection method, the determination step includes: acquiring the motor torque of the workbench in real time; calculating the change of the motor torque of the workbench within a preset time; and determining that the grinding wheel is in contact with the workbench when the change of the motor torque of the workbench is greater than a preset threshold value of the motor torque of the workbench.

[0009] Furthermore, in the above-mentioned wafer grinding detection method, the determining step includes: an acquiring sub-step of acquiring the torque of the Z-axis motor, the spindle motor current, the worktable motor torque, the Z-axis motor idling torque and the spindle motor idling current of the wafer grinding equipment; and a determining sub-step of determining whether the grinding wheel is in contact with the worktable based on the Z-axis motor torque, the spindle motor current, the worktable motor torque, the Z-axis motor idling torque and the spindle motor idling current.

[0010] Furthermore, in the above-mentioned wafer grinding detection method, the determination sub-step includes: determining the change in the Z-axis motor torque within a preset time, and calculating the ratio of the Z-axis motor torque change to the idling torque; determining the spindle motor current change within a preset time, and calculating the ratio of the spindle motor current change to the idling current; determining the motor torque change of the workbench within a preset time; when the ratio of the Z-axis motor torque change to the idling torque is greater than a preset threshold of the Z-axis motor, the ratio of the spindle current change to the idling current is greater than a preset current threshold, and the motor torque change of the workbench exceeds the preset threshold of the motor torque of the workbench, it is determined that the grinding wheel is in contact with the workbench.

[0011] Furthermore, in the above-mentioned wafer grinding detection method, the abnormal step includes: a first sub-step, determining the height change value of the worktable within a preset time; a second sub-step, determining the spindle position change value within a preset time; an abnormal sub-step, determining that an abnormality occurs in the grinding of the worktable when the difference between the height change value of the worktable and the spindle position change value is greater than a first preset threshold value.

[0012] Furthermore, in the above-mentioned wafer grinding detection method, the abnormal step includes: determining the height change value of the worktable within a preset time; determining the spindle position change value within a preset time; when the ratio of the height change value of the worktable to the spindle position change value is less than a second preset threshold value, determining that an abnormality has occurred in the grinding of the worktable.

[0013] Furthermore, in the above-mentioned wafer grinding detection method, the abnormal step also includes: a first step, when it is determined that no abnormality occurs in the grinding of the workbench, calculating the grinding wheel loss within a preset time; a second step, when the grinding wheel loss is less than a preset threshold value of grinding wheel loss, determining that the workbench grinding is abnormal.

[0014] Furthermore, in the above-mentioned wafer grinding detection method, the abnormal step also includes: when it is determined that no abnormality occurs in the workbench grinding, calculating the change in the workbench removal amount within a preset time; and determining that the workbench grinding is completed when the change in the workbench removal amount reaches a preset threshold value of the removal amount.

[0015] According to the second aspect of the embodiment of the present application, a wafer grinding processing method is provided, which includes all the steps of any one of the above-mentioned wafer grinding detection methods, and further includes, after the abnormality step: an alarm step, sending an alarm signal when it is determined that an abnormality has occurred in the grinding of the workbench; and a shutdown step, performing a shutdown operation after receiving the alarm signal.

[0016] According to a third aspect of an embodiment of the present application, a wafer grinding detection device is provided, comprising: a processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other through the communication bus; the memory is used to store at least one executable instruction, and the executable instruction enables the processor to perform an operation corresponding to any one of the above-mentioned wafer grinding detection methods.

[0017] According to a fourth aspect of an embodiment of the present application, a computer storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, any of the above-mentioned wafer grinding detection methods is implemented.

[0018] According to a fifth aspect of an embodiment of the present application, a computer program product is provided, comprising computer instructions, wherein the computer instructions instruct a computing device to perform operations corresponding to any of the above-mentioned wafer grinding detection methods.

[0019] According to the sixth aspect of the embodiment of the present application, a wafer grinding device is provided, which includes: a main body, a spindle connected to the main body, a spindle motor installed on the main body and used to drive the spindle to rotate, a Z-axis connected to the main body, a Z-axis motor installed on the main body and used to drive the Z-axis to rise and fall, a grinding wheel installed on the spindle, and any of the above-mentioned wafer grinding detection devices.

[0020] The detection method proposed in the embodiment of the present application not only takes into account the change in the height of the workbench, but also combines the change in the position of the spindle motor to comprehensively judge whether the grinding process is abnormal. By simultaneously monitoring the two parameters of the workbench height and the spindle motor position, it is possible to more accurately identify problems that may occur in the grinding process. At the same time, it also reduces the possibility of misjudgment and improves the accuracy and reliability of the detection. In addition, accurate abnormality detection can promptly remind the operator to take measures, thereby reducing the risk of damage to the workbench and the grinding wheel. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0022] Figure 1 A flowchart of a wafer grinding detection method provided in an embodiment of the present application;

[0023] Figure 2 for Figure 1 A flowchart of the steps of a method for determining whether a grinding wheel is in contact with a workbench in the embodiment shown;

[0024] Figure 3 for Figure 1 A flow chart of another step of a method for determining whether a grinding wheel is in contact with a workbench in the illustrated embodiment;

[0025] Figure 4 for Figure 1 A flowchart of another step of a method for determining whether a grinding wheel is in contact with a workbench in the illustrated embodiment;

[0026] Figure 5 for Figure 1 A flow chart of a method for determining whether the grinding of a workbench is abnormal in the illustrated embodiment;

[0027] Figure 6 for Figure 1 A flow chart of another method for determining whether the grinding of a workbench is abnormal in the illustrated embodiment;

[0028] Figure 7 for Figure 1 A flow chart of another method for determining whether the grinding of a workbench is abnormal in the illustrated embodiment;

[0029] Figure 8 Another step flow chart of a wafer grinding detection method provided in an embodiment of the present application;

[0030] Fig. 9 A flowchart of another step of a wafer grinding detection method provided in an embodiment of the present application;

[0031] Fig.10 A flowchart of another step of a wafer grinding detection method provided in an embodiment of the present application;

[0032] Fig.11 A flowchart of a wafer grinding method provided in an embodiment of the present application;

[0033] Fig.12 This is a block diagram of the structure of a wafer grinding device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0035] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0036] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0037] The embodiment of the present application provides a wafer grinding detection method, which can effectively monitor abnormalities occurring in a wafer grinding device during a grinding process.

[0038] The following is an exemplary description of a grinding device applicable to the wafer grinding detection method of an embodiment of the present application.

[0039] It can be understood that wafer grinding equipment usually includes a Z-axis motor and a spindle motor. Among them, the Z-axis motor is responsible for controlling the movement of the grinding wheel in the Z-axis direction, that is, the vertical up and down movement (relative to the use status of the wafer grinding equipment). This action is used to adjust the distance between the grinding wheel and the wafer to control the grinding depth. The spindle is connected to the grinding wheel, and the spindle motor is responsible for driving the spindle to rotate. The rotation speed of the spindle motor determines the grinding speed, and this rotation is the key to removing material during the grinding process.

[0040] In general, the Z-axis motor controls the approach or distance of the grinding wheel to the wafer, thereby controlling the grinding wheel feed, while the spindle motor controls the speed of the grinding wheel. The two work together to complete the thinning of the wafer.

[0041] It should be understood that the wafer grinding equipment also includes a workbench, which is mainly used to load the wafer during the wafer grinding process. For wafers of different specifications, in order to better match the workbench with them to ensure stability and accuracy during the grinding process, the workbench needs to be ground before grinding the wafer. The process of grinding the workbench is similar to grinding the wafer. The Z-axis motor is responsible for controlling the grinding wheel feed, the spindle motor is responsible for controlling the grinding wheel speed, and the workbench motor is used to control the rotation of the workbench.

[0042] Based on the above-mentioned wafer grinding equipment, an embodiment of the present application provides a wafer grinding detection method to detect abnormalities during the grinding process.

[0043] The specific implementation of the embodiment of the present application is further explained below in conjunction with the accompanying drawings of the embodiment of the present application.

[0044] Figure 1 A flowchart of a wafer grinding detection method provided in an embodiment of the present application, the method comprises the following steps:

[0045] Determine step S101, determine whether the grinding wheel is in contact with the workbench.

[0046] It is understandable that the wafer grinding equipment will have a certain amount of empty cutting distance when the Z axis starts to descend.

[0047] The distance between the Z-axis motor starting to drive the grinding wheel to descend toward the worktable and the grinding wheel contacting the worktable surface is called the air cutting process. During the air cutting process, the Z-axis needs to constantly determine whether the grinding wheel is in contact with the worktable, and then determine whether the grinding process has started.

[0048] In one example, when the grinding wheel contacts the worktable, the torque of the Z-axis motor increases, so the specific implementation

[0049] When grinding, the torque change of the Z-axis motor can be monitored to determine whether the grinding wheel is in contact with the worktable.

[0050] In another example, when the grinding wheel contacts the worktable, the current of the spindle motor will change, so whether the grinding wheel contacts the worktable can be determined by monitoring the change of the current of the spindle motor.

[0051] In another example, when the grinding wheel is in contact with the workbench, the torque of the workbench motor will increase. Therefore, in a specific implementation, whether the grinding wheel is in contact with the workbench can also be determined by detecting the change in the torque of the workbench motor.

[0052] In the acquisition step S102, after it is determined that the grinding wheel is in contact with the workbench, the spindle position and the workbench height of the grinding device are acquired in real time.

[0053] In one example, the height of the workbench and the position of the spindle may be detected by a detection instrument such as a sensor.

[0054] Abnormal step S103, determining whether an abnormality occurs on the worktable during grinding according to the spindle position and the worktable height.

[0055] During the grinding process of the worktable, the position change of the spindle and the height change of the worktable should be basically the same, so whether the grinding is abnormal can be determined based on the position change of the spindle and the height change of the worktable.

[0056] For example, if the instrument for detecting the height of the workbench is damaged and the reading is abnormal, or if the height of the workbench detected does not change due to abnormal descent of the workbench, the grinding process can be confirmed to be abnormal by comparing the change in the Z-axis position with the change in the workbench height, and the grinding can be stopped in case of abnormality to avoid damage to the workbench. When the material of the grinding wheel cannot remove the workbench by grinding, the difference between the Z-axis descent distance and the change in the workbench height will be large. At this time, the comparison between the two can also be used to determine whether the grinding is abnormal, and then stop the machine in time to avoid damage to the grinding wheel.

[0057] The detection method proposed in the embodiment of the present application not only takes into account the change in the height of the workbench, but also combines the change in the position of the spindle motor to comprehensively judge whether the grinding process is abnormal. By simultaneously monitoring the two parameters of the workbench height and the spindle motor position, it is possible to more accurately identify problems that may occur in the grinding process. At the same time, it also reduces the possibility of misjudgment and improves the accuracy and reliability of the detection. In addition, accurate abnormality detection can promptly remind the operator to take measures, thereby reducing the risk of damage to the workbench and the grinding wheel.

[0058] Figure 2 for Figure 1 A flow chart of a method for determining whether a grinding wheel is in contact with a workbench in the embodiment shown, the method comprising the following steps:

[0059] In the acquisition sub-step S201 , the Z-axis motor torque and the spindle motor current, as well as the Z-axis motor idling torque and the spindle motor idling current of the wafer grinding device are acquired in real time.

[0060] In this embodiment, the Z-axis motor idling torque refers to the torque of the Z-axis motor during the air cutting process, when the grinding wheel is not in contact with the workbench and the Z-axis motor is in an unloaded state. The spindle motor idling current refers to the current of the spindle motor during the air cutting process, when the spindle motor is also in an unloaded state.

[0061] In one example, the Z-axis motor idling torque is the average torque value of the Z-axis motor during the air-cutting process, which can be the average value of the sum of m idling torques during the air-cutting process. The spindle motor idling current is the average current value of the spindle motor during the air-cutting process, which can be the average value of the sum of n idling currents during the air-cutting process. It should be noted that the specific values ​​of m and n can be determined according to actual conditions, and the two can be the same or different.

[0062] In specific implementation, the torque of the Z-axis motor, the current of the spindle motor, the idling torque of the Z-axis motor and the idling current of the spindle motor can be obtained through a torque sensor and a current sensor respectively.

[0063] In the determination sub-step S202, it is determined whether the grinding wheel is in contact with the workbench according to the Z-axis motor torque, the spindle motor current, the idling torque of the Z-axis motor and the idling current of the spindle motor.

[0064] When the grinding wheel contacts the worktable and starts grinding, the Z-axis motor torque and spindle motor current will increase compared to the no-load state. During the air cutting process, by real-time detection of the Z-axis motor torque and spindle motor current, and comparing them with the no-load torque and no-load current, it can be determined whether the grinding wheel is in contact with the worktable.

[0065] The embodiment of the present application monitors the Z-axis motor torque and the spindle motor current and combines the two parameters to determine whether the grinding wheel is in contact with the workbench, and the determination result is more reliable.

[0066] In a possible specific implementation, whether the grinding wheel is in contact with the workbench may be determined according to the Z-axis motor torque, the spindle motor current, the idling torque of the Z-axis motor and the idling current of the spindle motor in the following manner.

[0067] Determine the torque change T-T0 of the Z-axis motor within a preset time, and calculate the ratio of the torque change to the idling torque T0 (T-T0) / (T0). The torque change is the change of the Z-axis motor torque T measured in real time relative to the idling torque T0.

[0068] Determine the current change I-I0 of the spindle motor within a preset time, and calculate the ratio of the current change to the idling current I0 (I-I0) / (I0). The current change is the real-time measured change of the spindle motor current I relative to the idling current I0.

[0069] When the ratio of the torque change to the idling torque is greater than the preset threshold value β of the Z-axis torque, and the ratio of the current change to the idling current is greater than the preset current threshold value θ, that is,

[0070] When (T-T0) / (T0)>β, and (I-I0) / (I0)>θ, it is determined that the grinding wheel is in contact with the worktable and grinding begins.

[0071] In the above formula, β and θ are constants, and their specific values ​​can be determined according to actual conditions, and this embodiment does not impose any limitation. In some embodiments, β is 0.015-0.025, and θ is 0.015-0.025. The smaller the values ​​of the two, the higher the corresponding sensitivity.

[0072] In an example, the Z-axis motor torque T is the average of several Z-axis torques taken within a preset time, and the spindle motor current I is the average of several currents taken within a preset time. The time period and the number of samples collected for the torque and current should be the same, and the time period and the number of samples collected can be determined based on actual conditions.

[0073] Furthermore, it can be determined that the grinding wheel is in contact with the workbench after the torque and current meet the above conditions and last for s seconds, so that the determination result is more reliable. Among them, s seconds can be determined according to actual conditions, and the larger the value of s is, the higher the accuracy of the determination is.

[0074] It should be noted that, in specific implementation, the preset time in this embodiment can be determined according to actual conditions, and this embodiment does not impose any limitation thereto.

[0075] Figure 3 for Figure 1 A flow chart of another method for determining whether a grinding wheel is in contact with a workbench in the embodiment shown, the method comprising the following steps:

[0076] Acquisition step S301, real-time acquisition of the motor torque T of the workbench 台 .

[0077] In specific implementation, the motor torque of the workbench can be obtained through a torque sensor.

[0078] Calculation step S302, calculating the change ΔT of the motor torque of the workbench within a preset time 台 .

[0079] The torque variation in this embodiment is the real-time acquired workbench motor torque T 台 Relative to the no-load torque T of the workbench 台0 The no-load torque of the workbench motor is the torque when the grinding wheel is not in contact with the workbench.

[0080] In specific implementation, the preset time can be determined according to actual conditions, and this embodiment does not impose any limitation.

[0081] In step S303, when the change in the motor torque of the workbench is greater than a preset threshold value of the motor torque of the workbench, it is determined that the grinding wheel is in contact with the workbench.

[0082] T 台 -T台0 >[(T 台 -T 台0 ) / T 台0 ]

[0083] Among them, T 台0 is the motor idling torque of the workbench, T 台 -T 台0 The change ΔT of the motor torque of the workbench relative to the no-load torque detected in real time 台 , T 台 is the motor torque of the workbench.

[0084] When the grinding wheel contacts the workbench, the motor torque of the workbench will increase. This embodiment determines whether the grinding wheel contacts the workbench by monitoring the change of the motor torque of the workbench.

[0085] It should be noted that, in specific implementation, the preset time in this embodiment can be determined according to actual conditions, and this embodiment does not impose any limitation thereto.

[0086] Figure 4 for Figure 1 A flow chart of another method for determining whether a grinding wheel is in contact with a workbench in the embodiment shown, the method comprising the following steps:

[0087] In the acquisition sub-step S401, the torque of the Z-axis motor, the current of the spindle motor, the motor torque of the worktable, the idling torque of the Z-axis motor and the idling current of the spindle motor of the wafer grinding device are acquired. Figure 2 and Figure 3 The embodiment shown is sufficient, and this embodiment will not be described in detail here.

[0088] Determine sub-step S402, determining whether the grinding wheel is in contact with the workbench according to the Z-axis motor torque, the spindle motor current, the motor torque of the workbench, the Z-axis motor idling torque and the spindle motor idling current.

[0089] When the grinding wheel contacts the worktable and starts grinding, the Z-axis motor torque, spindle motor current and worktable motor torque will increase compared to the no-load state. During the air cutting process, the Z-axis motor torque, spindle motor current and worktable torque are detected in real time and compared with the no-load state to determine whether the grinding wheel is in contact with the worktable.

[0090] It can be seen that this embodiment combines the three parameters of Z-axis motor torque, spindle motor current and worktable motor torque, which can more accurately identify whether the grinding wheel is in contact with the worktable, reduce the possibility of misjudgment, and more accurately determine the start of the grinding process.

[0091] In a specific implementation, the torque change T-T0 of the Z-axis motor within a preset time is determined, and the ratio of the torque change to the idling torque is calculated; the current change I-I0 of the spindle motor within a preset time is determined, and the ratio of the current change to the idling current is calculated. For the specific implementation process of this step, see Figure 2 The embodiments shown are sufficient and will not be described in detail here.

[0092] Determine the change in motor torque ΔT of the workbench within a preset time 台 For the specific implementation process of this step, see Figure 3 The embodiments shown are sufficient and will not be described in detail here.

[0093] When the ratio of the Z-axis motor torque change to the idling torque is greater than the Z-axis motor preset threshold, and the ratio of the spindle current change to the idling current is greater than the spindle current preset threshold, and the motor torque change of the worktable exceeds the motor torque preset threshold of the worktable, it is determined that the grinding wheel is in contact with the worktable.

[0094] Specifically, when the conditions in the following three formulas are met at the same time, it is determined that the grinding wheel is in contact with the worktable:

[0095] (T-T0) / (T0)>β

[0096] (I-I0) / (I0)>θ

[0097] T 台 -T 台0 >[(T 台 -T 台0 ) / T 台0 ]

[0098] The meaning of each parameter in the above formulas can be found in Figure 2 and Figure 3 The embodiments shown are sufficient and will not be described in detail here.

[0099] It should be noted that, in specific implementation, the preset time in this embodiment can be determined according to actual conditions, and this embodiment does not impose any limitation thereto.

[0100] Figure 5 for Figure 1 A flow chart of a method for determining whether the workbench grinding is abnormal in the embodiment shown, Figure 1 The abnormal steps in the illustrated embodiment may further include:

[0101] Step S501, determining a height change value of a workbench within a preset time.

[0102] The height change value of the worktable is the difference between the height of the worktable detected in real time during the grinding process and the height of the worktable when the grinding wheel and the worktable begin to contact.

[0103] In specific implementation, the height of the workbench can be detected by sensors and other instruments, and the preset time can be determined according to actual conditions.

[0104] Step S502, determining the spindle position change value within a preset time.

[0105] The spindle position change value is the difference between the spindle position detected in real time during the grinding process and the spindle position when the grinding wheel and the worktable begin to contact. In specific implementation, the spindle position can be detected by a sensor or other instrument, and the preset time should be consistent with the preset time in step S501 to detect the spindle position change and the height change of the worktable in the same time period.

[0106] Step S503: When the difference between the height change value of the workbench and the spindle position change value is greater than a first preset threshold, it is determined that an abnormality occurs in the grinding of the workbench.

[0107] In specific implementation, the difference between the height change value of the workbench and the spindle position change value during the grinding process is calculated in real time. When the difference between the two is greater than a first preset threshold, it is determined to be a grinding abnormality.

[0108] Theoretically, the height change value of the workbench and the spindle position change value in the same time period should be the same. Considering various errors, when the difference between the two is greater than the first preset threshold, it is determined to be a grinding abnormality. In specific implementation, the first preset threshold can be determined according to actual conditions, and this embodiment does not make any limitation here.

[0109] It should be noted that, in specific implementation, the preset time in this embodiment can be determined according to actual conditions, and this embodiment does not impose any limitation thereto.

[0110] Figure 6 for Figure 1 A flow chart of another method for determining whether the workbench grinding is abnormal in the embodiment shown, the steps include:

[0111] Step S601, determining a height change value of a workbench within a preset time.

[0112] Step S602, determining the spindle position change value within a preset time.

[0113] The specific implementation process of step S601 and step S602 is shown in Figure 5 Step S501 and step S502 of the illustrated embodiment are sufficient and will not be described in detail in this embodiment.

[0114] Step S603: When the ratio of the height change value of the workbench to the spindle position change value is less than a second preset threshold, it is determined that an abnormality occurs in the grinding of the workbench.

[0115] In this embodiment, the smaller the second preset threshold is, the more reliable the judgment result is. In specific implementation, the second preset threshold and the preset time can be determined according to actual conditions, and this embodiment does not make any limitation here.

[0116] Another step flow chart of a wafer grinding detection method provided in an embodiment of the present application is as follows: Figure 7 As shown, the method includes:

[0117] Determining step S701, determining whether the grinding wheel of the wafer grinding equipment is in contact with the workbench.

[0118] In the acquisition step S702, after it is determined that the grinding wheel is in contact with the workbench, the spindle position and the workbench height of the wafer grinding equipment are acquired in real time.

[0119] Abnormal step S703, determining whether an abnormality occurs during table grinding according to the spindle position and the height of the table.

[0120] Among them, the specific implementation process of the determination step S701, the acquisition step S702 and the abnormal step S703 in this embodiment can be referred to the above embodiment, and this embodiment will not be repeated here.

[0121] The first step S704 is to calculate the grinding wheel loss within a preset time when it is determined that the workbench has no abnormality during grinding.

[0122] In a specific implementation, the grinding wheel loss can be calculated according to the following formula:

[0123] w=[(Z1-Z0)-(H1-H0)]×[(H1-H0+M)÷(H1-H0)]

[0124] In the above formula: w is the grinding wheel loss, Z1 is the actual position of the Z axis, Z0 is the position of the Z axis when the grinding wheel starts to contact the worktable, H1 is the actual height of the worktable, H0 is the height of the worktable when the grinding wheel starts to contact the worktable, and M is the minimum removal amount of the worktable.

[0125] It should be noted that, in specific implementation, the preset time in this embodiment can be determined according to actual conditions, and this embodiment does not impose any limitation thereto.

[0126] In this embodiment, after the grinding wheel contacts the workbench for grinding, the grinding wheel loss can be calculated every k seconds. It should be noted that, in specific implementation, the value of k can be determined according to actual conditions, and this embodiment does not make any limitation here.

[0127] The second step S705 is to determine that the workbench grinding is abnormal when the grinding wheel loss is less than a preset grinding wheel loss threshold.

[0128] In a specific implementation, whether the table grinding is abnormal can be determined according to the following formula:

[0129] When w<βHm, it is determined that the workbench grinding is abnormal;

[0130] In the above formula: w is the grinding wheel loss, Hm is the minimum change in the workbench height, which can be calculated for a period of time.

[0131] The minimum change of the table height, Hm is the configuration constant; β is the grinding wheel loss coefficient. It should be noted that the period of time can be determined according to actual conditions, and this embodiment does not make any limitation here.

[0132] In this embodiment, after the grinding wheel loss is calculated every k seconds, if the above conditions are met, it is considered that the grinding is abnormal, an alarm is triggered, and the grinding process is stopped, thereby avoiding damage to the grinding wheel and the workbench.

[0133] Another step flow chart of a wafer grinding detection method provided in an embodiment of the present application is as follows: Figure 8 As shown, the method comprises the following steps:

[0134] Determining step S801, determining whether the grinding wheel of the wafer grinding equipment is in contact with the workbench.

[0135] In the acquisition step S802, after it is determined that the grinding wheel is in contact with the workbench, the spindle position of the wafer grinding equipment and the height of the workbench are acquired in real time.

[0136] Abnormal step S803, determining whether an abnormality occurs during table grinding according to the spindle position and the height of the table.

[0137] The specific implementation process of the determination step S801, the acquisition step S802 and the abnormality step S803 may be referred to the above embodiment and will not be described in detail here.

[0138] Calculation step S804, when it is determined that the workbench has no abnormality during grinding, calculate the change amount of the workbench within a preset time.

[0139] Step S805 is completed, and when the change amount of the workbench reaches a preset threshold value of the removal amount, it is determined that the workbench grinding is completed.

[0140] In specific implementation, before the grinding starts, the amount of removal that needs to be ground on the workbench can be determined, and the removal amount is the preset threshold of the removal amount in this step, and the preset threshold of the removal amount is the theoretical removal amount within a specified time. The change amount of the workbench is calculated in real time during the grinding process, and when the removal amount reaches the preset threshold, the grinding is determined to be completed.

[0141] It should be noted that, during specific implementation, the prescribed time may be determined based on actual conditions, and this embodiment does not limit this.

[0142] The embodiment of the present application controls whether the grinding process is completed by monitoring the amount of workbench removal to avoid over-grinding.

[0143] It should be noted that the preset time in each embodiment of the present application may be the same or different, and may be determined according to actual conditions. This embodiment does not make any limitation here.

[0144] Combine the following Fig. 9 A wafer grinding detection method according to an embodiment of the present application is described in more detail. The method monitors whether the workbench grinding has started by changing the spindle current and the Z-axis torque. The specific process is as follows:

[0145] Before the grinding process begins, the initial height of the worktable is measured by a laser sensor, and the lowest point of the worktable is calculated (the height of the lowest point on the worktable surface is taken as the worktable height). The worktable is rotated so that the lowest point of the worktable is below the Z axis.

[0146] Open the relevant fluid circuits, and the spindle and worktable rotate at the set speed for the set time to warm up. After warming up, the Z axis moves to the air cutting position at the set speed, and the Z axis motor drives the Z axis to drive the grinding wheel to start descending. During the air cutting descent process, the average value of the Z axis idling torque (the average value of the sum of multiple actual torques collected) is calculated, and at the same time, the average value of the spindle no-load current (the average value of the sum of multiple real-time currents collected) is also calculated.

[0147] The Z-axis continues to descend, and the Z-axis torque and spindle current are obtained in real time, and the change of the obtained Z-axis torque relative to the no-load torque and the change of the obtained spindle current relative to the no-load current are calculated to determine whether the conditions in step S901 are met, that is, the torque change / no-load torque>Z-axis torque preset threshold, and the current change / no-load current>spindle current preset threshold. When the above two conditions are met at the same time, it is determined that the grinding wheel is in contact with the workbench, and the position of the Z-axis at this time (Z-axis initial position) and the height of the workbench at this time (initial height) are recorded.

[0148] The spindle descends the grinding table at the set speed, and determines whether the condition in step S902 is met, that is, whether the spindle descent time exceeds the preset threshold (the preset threshold can be pre-calculated based on the spindle descent distance and descent speed). If it exceeds, the alarm monitoring process is started. The height and Z-axis position of the table are collected in real time, and the difference between the initial height and the initial position is calculated respectively, and it is determined whether the condition in step S903 is met, that is, when the ratio of the height change value of the table to the spindle position change value is less than the second preset threshold, if it is met, an alarm is issued and grinding is stopped; if it is not met, the spindle continues to descend and grind, calculates the table removal amount and determines whether the condition in S904 is met, that is, whether the table removal amount reaches the preset threshold. If it is not met, the judgment in step S903 is repeated. If it is met, grinding is completed.

[0149] Next, combine Fig.10 Another wafer grinding detection method according to an embodiment of the present application is described in more detail. The method determines whether the table grinding has started by monitoring the change of the table torque. The specific process is as follows:

[0150] After the grinding process is started, the table motor rotates at the set speed and monitors whether the condition in step S1001 is met, that is, whether the table reaches the set speed. When the table motor reaches the set speed, the no-load torque of the table is recorded. The Z axis starts the grinding process by descending at the set speed. During this process, the torque of the table motor is monitored in real time, and the change in the torque of the table motor ΔT is calculated. 台 , determine whether the condition in step S1002 is met, that is, whether the motor torque change of the workbench is greater than the torque change threshold of the workbench. If so, determine that the grinding wheel begins to contact the workbench, and record the spindle position and workbench height at this time, that is, the initial position and initial height.

[0151] The spindle is ground at the set speed, and it is judged whether the condition in step S1003 is met, that is, whether the spindle descent time exceeds the preset threshold. If it exceeds, the alarm monitoring process is started. The height and Z-axis position of the workbench are collected in real time, and the difference between the initial height and the initial position is calculated respectively, and it is judged whether the condition in step S1004 is met. If it is met, an alarm is issued and grinding is stopped; if it is not met, the spindle continues to descend and grind, and the workbench removal amount is calculated and it is judged whether the condition in S1005 is met, that is, whether the workbench removal amount reaches the preset threshold. If it is not met, the judgment in step S1004 is repeated. If it is met, the grinding is completed.

[0152] The present application also provides a wafer grinding method. Fig.11 The method comprises the following steps:

[0153] Determining step S1101, determining whether the grinding wheel of the wafer grinding equipment is in contact with the workbench.

[0154] In the acquisition step S1102, after the grinding wheel contacts the workbench, the spindle position of the wafer grinding equipment and the height of the workbench are acquired in real time.

[0155] Abnormal step S1103, determining whether an abnormality occurs during table grinding based on the spindle position and the height of the table.

[0156] The specific implementation process of the determination step S1101, the acquisition step S1102 and the abnormality step S1103 may refer to the above-mentioned wafer grinding detection method, which will not be described in detail here.

[0157] Alarm step S1104, sending an alarm signal when it is determined that the workbench grinding is abnormal.

[0158] The shutdown step S1105 is to perform a shutdown operation after receiving an alarm signal.

[0159] It should be understood that the wafer grinding equipment should be provided with a controller to control the operation of the Z-axis motor, the spindle motor and the worktable motor.

[0160] In specific implementation, when it is determined that the workbench grinding is abnormal, an alarm signal is sent to the controller. After receiving the alarm signal, the controller of the wafer grinding equipment starts the shutdown process, controls the workbench motor and the spindle motor to stop rotating, controls the Z-axis motor to move upward, and then drives the grinding wheel to leave the workbench. After the grinding wheel returns to its position, the Z-axis motor is controlled to stop running, ending the entire grinding process.

[0161] It can be seen that the embodiment of the present application can monitor the grinding anomalies of the workbench and perform shutdown operations when an anomaly occurs, thereby stopping the grinding process in time and reducing the risk of damage to the workbench and the grinding wheel.

[0162] The present application also provides a wafer grinding detection device. Fig.12 , the figure shows a schematic structural diagram of a wafer grinding detection device according to an embodiment of the present application. The specific embodiment of the present application does not limit the specific implementation of the wafer grinding detection device.

[0163] like Fig.12 As shown, the wafer grinding detection device may include: a processor 121 , a communications interface 122 , a memory 123 , and a communications bus 124 . The processor 121 , the communications interface 122 , and the memory 123 communicate with each other via the communications bus 124 .

[0164] The communication interface 124 is used to communicate with other electronic devices or servers.

[0165] The processor 121 is used to execute the program 125, and specifically can execute the relevant steps in the above-mentioned wafer grinding detection method embodiment.

[0166] Specifically, the program 125 may include program codes including computer operation instructions.

[0167] The processor 121 may be a central processing unit (CPU), or an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application. The one or more processors included in the smart device may be processors of the same type, such as one or more CPUs; or processors of different types, such as one or more CPUs and one or more ASICs.

[0168] The memory 123 is used to store the program 125. The memory 123 may include a high-speed RAM memory, and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

[0169] The specific implementation of each step in program 125 can refer to the corresponding description of the corresponding steps and units in the above-mentioned wafer grinding detection method embodiment, which will not be repeated here. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described equipment and modules can refer to the corresponding process description in the above-mentioned method embodiment, which will not be repeated here.

[0170] The wafer grinding detection method of this embodiment can be executed by any appropriate wafer grinding detection device with data processing capability, including but not limited to: a server, a mobile terminal (such as a mobile phone, a PAD, etc.) and a PC, etc.

[0171] The wafer grinding processing device of this embodiment is used to implement the corresponding wafer grinding processing methods in the aforementioned multiple method embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here. In addition, the functional implementation of each module in the wafer grinding processing device of this embodiment can refer to the description of the corresponding parts in the aforementioned method embodiments, which will not be repeated here.

[0172] The embodiment of the present application further proposes a computer storage medium on which a computer program is stored. When the program is executed by a processor, any of the above-mentioned wafer grinding detection methods is implemented.

[0173] An embodiment of the present application further provides a computer program product, including computer instructions, which instruct a computing device to execute operations corresponding to any wafer grinding processing method in the above-mentioned multiple method embodiments.

[0174] The embodiment of the present application also proposes a wafer grinding device, which includes: a main body, a spindle, a spindle motor, a Z-axis, a Z-axis motor, a grinding wheel and any of the above-mentioned wafer grinding devices.

[0175] Specifically, the main body is a support frame of the wafer grinding device. The main shaft and the Z-axis are both connected to the main body, the main shaft can rotate relative to the main body, and the Z-axis motor can rise and fall relative to the main body (relative to the use state of the device). The main shaft motor is installed on the main body to drive the main shaft to rotate. The Z-axis motor is installed on the main body to drive the Z-axis to rise or fall. The grinding wheel is installed on the main shaft, and the main shaft drives the grinding wheel to rotate. The wafer grinding detection device is installed on the main body.

[0176] Since the wafer grinding detection device has the above-mentioned effects, the detection equipment having the wafer grinding detection device also has corresponding technical effects.

[0177] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0178] The above-mentioned method according to the embodiment of the present application can be implemented in hardware, firmware, or implemented as software or computer code that can be stored in a recording medium (such as a CD ROM, RAM, floppy disk, hard disk or magneto-optical disk), or implemented as a computer code originally stored in a remote recording medium or a non-temporary machine-readable medium downloaded through a network and to be stored in a local recording medium, so that the method described herein can be stored in such software processing on a recording medium using a general-purpose computer, a dedicated processor or programmable or dedicated hardware (such as an ASIC or FPGA). It can be understood that a computer, a processor, a microprocessor controller or programmable hardware includes a storage component (e.g., RAM, ROM, flash memory, etc.) that can store or receive software or computer code, and when the software or computer code is accessed and executed by a computer, a processor or hardware, the verification code generation method described herein is implemented. In addition, when a general-purpose computer accesses the code for implementing the verification code generation method shown here, the execution of the code converts the general-purpose computer into a dedicated computer for executing the verification code generation method shown here.

[0179] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present application.

[0180] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A wafer grinding detection method, used for wafer grinding equipment, characterized in that: The steps include: A determination step of determining whether the grinding wheel of the wafer grinding device is in contact with the workbench; an acquisition step, after determining that the grinding wheel is in contact with the workbench, acquiring the spindle position and the workbench height of the wafer grinding device in real time; An abnormality step, determining whether an abnormality occurs during grinding of the workbench according to the spindle position and the workbench height; The abnormal steps include: The first sub-step is to determine the height change value of the workbench within a preset time; The second sub-step is to determine the spindle position change value within a preset time; An abnormality sub-step, when the difference between the height change value of the workbench and the spindle position change value is greater than a first preset threshold, determining that an abnormality occurs in the grinding of the workbench; Alternatively, the abnormal step includes: Determine the height change value of the workbench within a preset time; Determine the spindle position change value within a preset time; When the ratio of the height change value of the workbench to the spindle position change value is less than a second preset threshold, it is determined that an abnormality occurs in the grinding of the workbench.

2. The wafer grinding detection method according to claim 1, characterized in that: The determining step comprises: An acquisition sub-step of acquiring in real time the Z-axis motor torque and the spindle motor current of the wafer grinding device, as well as the idling torque of the Z-axis motor and the idling current of the spindle motor; A determination sub-step, determining whether the grinding wheel is in contact with the workbench according to the Z-axis motor torque, the spindle motor current, the idling torque of the Z-axis motor and the idling current of the spindle motor; The determining sub-step comprises: Determine the torque change of the Z-axis motor within a preset time, and calculate the ratio of the torque change to the idling torque; Determine the current change of the spindle motor within a preset time, and calculate the ratio of the current change to the idling current; When the ratio of the torque variation to the idling torque is greater than the preset threshold of the Z-axis torque, and the ratio of the current variation to the idling current is greater than the preset current threshold, it is determined that the grinding wheel is in contact with the workbench.

3. The wafer grinding detection method according to claim 1, characterized in that: The determining step comprises: Obtain the motor torque of the workbench in real time; Calculate the change in motor torque of the workbench within a preset time; When the change in the motor torque of the workbench is greater than a preset threshold value of the motor torque of the workbench, it is determined that the grinding wheel is in contact with the workbench.

4. The wafer grinding detection method according to claim 1, characterized in that: The determining step comprises: An acquisition sub-step of acquiring the Z-axis motor torque, the spindle motor current, the worktable motor torque, the idling torque of the Z-axis motor, and the idling current of the spindle motor of the wafer grinding device; a determining sub-step, determining whether the grinding wheel is in contact with the workbench according to the Z-axis motor torque, the spindle motor current, the workbench motor torque, the idling torque of the Z-axis motor, and the idling current of the spindle motor; The determining sub-step comprises: Determine the torque change of the Z-axis motor within a preset time, and calculate the ratio of the torque change of the Z-axis motor to the idling torque; Determine the amount of change in the spindle motor current within a preset time, and calculate the ratio of the amount of change in the spindle motor current to the idling current; Determine the change in motor torque of the workbench within a preset time; When the ratio of the Z-axis motor torque change to the idling torque is greater than the Z-axis motor preset threshold, the ratio of the spindle motor current change to the idling current is greater than the current preset threshold, and the motor torque change of the workbench is greater than the motor torque preset threshold of the workbench, it is determined that the grinding wheel is in contact with the workbench.

5. The wafer grinding detection method according to claim 1, characterized in that: The abnormal step also includes: The first step is to calculate the grinding wheel loss within a preset time when it is determined that no abnormality occurs during the grinding of the workbench; In the second step, when the grinding wheel loss is less than a preset grinding wheel loss threshold, it is determined that the workbench grinding is abnormal.

6. The wafer grinding detection method according to claim 5, characterized in that: The first step calculates the grinding wheel loss according to the following formula: w=[(Z1-Z0)-(H1-H0)]×[(H1-H0+M)÷(H1-H0)] In the above formula: w is the grinding wheel loss, Z1 is the actual position of the Z axis, Z0 is the position of the Z axis when the grinding wheel starts to contact the worktable, H1 is the actual height of the worktable, H0 is the height of the worktable when the grinding wheel starts to contact the worktable, and M is the minimum removal amount of the worktable.

7. The wafer grinding detection method according to claim 5, characterized in that: The second step determines the grinding anomaly according to the following formula: When w<βHm, it is determined that the workbench grinding is abnormal; In the above formula: w is the grinding wheel loss, Hm is the minimum change in worktable height, and β is the grinding wheel loss coefficient.

8. The wafer grinding detection method according to claim 1, characterized in that: The abnormal step also includes: When it is determined that the workbench has no abnormality during grinding, calculating the removal amount of the workbench within a preset time; The grinding of the workbench is determined to be completed when the removal amount of the workbench reaches a preset removal amount threshold.

9. A wafer grinding method, characterized in that: The method comprises all the steps of the wafer grinding detection method according to any one of claims 1 to 8, and further comprises, after the abnormal step: An alarm step of sending an alarm signal when it is determined that the grinding of the workbench is abnormal; The shutdown step is to perform a shutdown operation after receiving the alarm signal.

10. A wafer grinding detection device, characterized in that: include: A processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other via the communication bus; The memory is used to store at least one executable instruction, and the executable instruction enables the processor to perform operations corresponding to the wafer grinding detection method as described in any one of claims 1-8.

11. A computer storage medium, characterized in that: A computer program is stored thereon, and when the program is executed by a processor, the wafer grinding detection method as described in any one of claims 1 to 8 is implemented.

12. A computer program product, characterized in that The method comprises computer instructions, wherein the computer instructions instruct a computing device to execute operations corresponding to the wafer grinding detection method as claimed in any one of claims 1 to 8.

13. A wafer grinding device, characterized in that: include: A main body, a spindle connected to the main body, a spindle motor installed on the main body and used to drive the spindle to rotate, a Z-axis connected to the main body, a Z-axis motor installed on the main body and used to drive the Z-axis to rise and fall, a grinding wheel installed on the spindle, and a wafer grinding detection device as described in claim 10.

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