Adjustable semiconductor detection positioning device

Abstract

The invention relates to the technical field of semiconductor detection, in particular to an adjustable semiconductor detection positioning device. Comprising a detection table, a mounting column frame is fixedly mounted at the top of the detection table, a placement plate is fixedly mounted at the top of the detection table, a rotating plate is arranged above the placement plate, a connecting plate is slidably sleeved with the rotating plate, and a positioning plate is fixedly mounted on the side, away from the rotating plate, of the connecting plate; a positioning assembly is arranged at the top of the positioning plate, and a rotating assembly is arranged at the other end of the rotating plate. A driving motor is started, so that the driving motor drives a rotating sleeve, a rotating plate and a connecting plate to circumferentially rotate on the outer surface of a mounting column frame, and the connecting plate rotates by virtue of a sliding column at the bottom, so that the connecting plate can rotate more stably; therefore, the connecting plate can sequentially move the semiconductor devices which are limited and placed on the positioning plate through the positioning assembly to the positions below the spectrum detection assembly and the welding spot detection assembly for detection.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor detection, in particular to an adjustable semiconductor detection positioning device. Background Art

[0002] During the production of semiconductor devices, from semiconductor single wafers to final products, many processes are required. In order to ensure that the product performance is qualified, stable and reliable, and has a high yield rate, all process steps have strict requirements according to the production conditions of different semiconductor products. Therefore, in the production process, semiconductor process detection procedures are essential.

[0003] When testing the assembled semiconductor device, the semiconductor device needs to be fixed on the placement plate, and then positioned and transported by the transmission component to the bottom of the testing component for testing.

[0004] However, semiconductor devices need to undergo multiple tests to determine whether they are qualified. Existing testing devices can position and transport semiconductors to the bottom of the testing device for testing. However, when spot-checking semiconductor devices, it is impossible to continuously transport and position the semiconductor devices to different testing devices for testing. Workers are required to place the semiconductor devices on different testing devices for testing. The semiconductor devices need to be taken, placed, and fixed multiple times. Multiple taking and placing can easily cause damage to the semiconductor devices, making the test results inaccurate. Therefore, there is a need for an adjustable semiconductor testing positioning device that can perform continuous positioning and transmission testing on semiconductor devices. Summary of the invention

[0005] The object of the present invention is to provide an adjustable semiconductor detection positioning device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention aims to provide an adjustable semiconductor detection positioning device, including a detection platform, a mounting column frame is fixedly installed on the top of the detection platform, and a spectrum detection component and a solder joint detection component distributed in a circular array are installed on the outer surface of the mounting column frame. A placement plate is fixedly installed on the top of the detection platform, a rotating plate is arranged above the placement plate, a connecting plate is slidably sleeved inside the rotating plate, a positioning plate is fixedly installed on the side of the connecting plate away from the rotating plate, a positioning component for limiting and clamping the semiconductor device is arranged on the top of the positioning plate, and a rotating component is arranged on the other end of the rotating plate, and the rotating component is used to drive the rotating plate and the positioning plate to rotate outside the mounting column frame, so that the positioning plate moves to the bottom of the spectrum detection component and the solder joint detection component; A slide rail is provided on the top of the placement plate, a slide column is slidably installed inside the slide rail, and the slide column is fixedly installed on the bottom of the connecting plate. The slide column slides inside the slide rail to drive the connecting plate to telescopically slide inside the rotating plate.

[0007] As a further improvement of the present technical solution, the rotating assembly includes a rotating sleeve sleeved on the outer surface of the mounting column frame, the bottom of the rotating sleeve passes through the placement plate and the detection table and extends to the interior of the detection table, a driving motor is provided at the bottom of the rotating sleeve, the output shaft of the driving motor passes through the interior of the rotating sleeve, and a rotating gear is fixedly installed on the outer surface of the output shaft of the driving motor, the rotating gear is meshed with the interior of the rotating sleeve, and the driving motor can drive the rotating sleeve to rotate through the rotating gear.

[0008] As a further improvement of the technical solution, one side of the rotating plate is fixedly mounted on the outer surface of the rotating sleeve, and the rotating sleeve can drive the rotating plate to rotate together.

[0009] As a further improvement of the present technical solution, the positioning assembly includes a slideway opened on the top of the positioning plate, a moving block is slidably installed inside the slideway, a connecting block is fixedly installed on the top of the moving block, placement clamps are fixedly installed on both sides of the top of the connecting block, and two groups of placement clamps are provided. The two groups of placement clamps are symmetrically distributed on the top of the positioning plate, and the outer wall of the positioning plate is threadedly connected with a threaded column that penetrates into the interior of the moving block. The threaded column rotates to drive the moving block and the connecting block to move toward another group of placement clamps, so that the semiconductor device is placed on the placement clamps for clamping and fixing.

[0010] As a further improvement of the technical solution, a reset spring is installed inside the rotating plate, and the other end of the reset spring is connected to the outer side of the connecting plate for pulling and resetting the connecting plate.

[0011] As a further improvement of the technical solution, a protective cover is installed on the top of the testing platform, and a placement opening is opened on one side of the protective cover for placing and removing semiconductor devices when the positioning plate is rotated to the placement opening.

[0012] As a further improvement of the technical solution, the protective cover is arranged outside the mounting column frame and the placement plate for protection and blocking.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. In the adjustable semiconductor detection and positioning device, when the semiconductor device is detected, the driving motor is started by the control device, so that the driving motor drives the rotating sleeve, the rotating plate and the connecting plate to rotate in a circle on the outer surface of the mounting column frame, and the connecting plate is rotated with the help of the sliding column at the bottom, so that the rotation of the connecting plate can be more stable, so that the connecting plate can move the semiconductor device placed on the positioning plate by the positioning component to the bottom of the spectrum detection component and the solder joint detection component in turn for detection. Other detection components can also be installed in a circular distribution on the outer surface of the mounting column frame to achieve the effect of performing multiple detections on the semiconductor device at one time.

[0014] 2. In the adjustable semiconductor detection and positioning device, when the semiconductor device is placed on the positioning plate, the connecting plate is driven by the driving assembly to rotate to the irregular conical shape of the slide rail, and the sliding column slides inside the slide rail. The sliding column drives the connecting plate to stretch inside the rotating plate, thereby increasing the overall length of the connecting plate and the rotating plate, so that the positioning plate can extend out of the placement port opened on the side of the protective cover, which is convenient for personnel to place and remove the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the rotating assembly of the present invention; Figure 3 It is a schematic diagram of the protective cover structure of the present invention; Figure 4 It is a schematic diagram of the structure of the return spring of the present invention; Figure 5 For the present invention Figure 1 Enlarged structural diagram at A in the middle.

[0016] The meaning of each number in the figure is: 1. Test bench; 11. Mounting column; 12. Spectrum detection component; 13. Solder point detection component; 2. Placement plate; 3. Rotation plate; 31. Connection plate; 32. Positioning plate; 33. Positioning assembly; 3301. Slideway; 3302. Moving block; 3303. Connecting block; 3304. Placement clip; 3305. Threaded column; 34. Rotating assembly; 301. Rotating sleeve; 302. Driving motor; 303. Rotating gear; 4. Slide rail; 41. Sliding column; 5. Return spring; 6. Protective cover; 61. Placement port. DETAILED DESCRIPTION

[0017] The following will be combined with the accompanying drawings in the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] Example: See also Figure 1-Figure 2 As shown, the purpose of this embodiment is to provide an adjustable semiconductor detection positioning device, including a detection platform 1, a mounting column frame 11 is fixedly installed on the top of the detection platform 1, and a spectrum detection component 12 and a solder joint detection component 13 distributed in a circumferential array are installed on the outer surface of the mounting column frame 11, a placement plate 2 is fixedly installed on the top of the detection platform 1, a rotating plate 3 is arranged above the placement plate 2, a connecting plate 31 is slidably sleeved inside the rotating plate 3, a positioning plate 32 is fixedly installed on the side of the connecting plate 31 away from the rotating plate 3, a positioning component 33 for limiting and clamping the semiconductor device is arranged on the top of the positioning plate 32, and a rotating component 34 is arranged at the other end of the rotating plate 3, and the rotating component 34 is used to drive the rotating plate 3 and the positioning plate 32 to rotate outside the mounting column frame 11, so that the positioning plate 32 moves to the bottom of the spectrum detection component 12 and the solder joint detection component 13; It should be noted that the spectrum detection component 12 detects various elemental components in the new material inside the semiconductor device through a spectrometer to determine whether the new material will affect the performance of the semiconductor device. The solder joint detection component 13 adopts an automatic optical detection device. The AOI system uses a high-resolution camera and image recognition technology to automatically detect semiconductor solder joints. The internal structures of the spectrum detection component 12 and the solder joint detection component 13 are prior arts, and their working principles are common knowledge of the staff in this field, and will not be repeated here. First, show Figure 2 , the specific structure of the rotating assembly 34 is disclosed. The rotating assembly 34 includes a rotating sleeve 301 sleeved on the outer surface of the mounting column frame 11. The bottom of the rotating sleeve 301 penetrates the placement plate 2 and the detection table 1 and extends to the inside of the detection table 1. A driving motor 302 is arranged at the bottom of the rotating sleeve 301. The output shaft of the driving motor 302 penetrates the inside of the rotating sleeve 301. A rotating gear 303 is fixedly installed on the outer surface of the output shaft of the driving motor 302. The rotating gear 303 is meshed with the inside of the rotating sleeve 301. The driving motor 302 can drive the rotating sleeve 301 to rotate through the rotating gear 303.

[0019] One side of the rotating plate 3 is fixedly mounted on the outer surface of the rotating sleeve 301 , and the rotating sleeve 301 can drive the rotating plate 3 to rotate together.

[0020] By installing the column frame 11 on the top of the detection platform 1, the spectrum detection component 12 and the solder joint detection component 13 can be installed on the outer surface of the installation column frame 11, so that the rotating sleeve 301 can be sleeved on the bottom of the outer surface of the installation column frame 11, and the bottom of the rotating sleeve 301 penetrates into the interior of the detection platform 1 and engages with the driving motor 302 through the rotating gear 303. When the driving motor 302 is energized, it can drive the rotating sleeve 301 and the rotating plate 3 fixedly installed on the outer surface of the rotating sleeve 301 to rotate. A connecting plate 31 is installed inside the rotating plate 3, so that the connecting plate 31 can be fixedly connected to the positioning plate 32. When the rotating plate 3 rotates, the connecting plate 31 and the positioning plate 32 can rotate together with the rotating plate 3. The positioning component 33 on the top of the positioning plate 32 can clamp and fix the semiconductor device to the positioning plate 32, so that the positioning plate 32 can drive the semiconductor device placed on the top to rotate to the bottom of the spectrum detection component 12 and the solder joint detection component 13 for detection, thereby achieving the effect of rotating the positioning plate 32 to perform multiple detections on the semiconductor device.

[0021] Secondly, considering that the semiconductor device needs to be tested to avoid external influences, a closed test is required. After the test station 1 is closed, how to place the semiconductor device on the positioning plate 32 is presented. Figure 3 and Figure 4 A slide rail 4 is provided on the top of the placement plate 2. A slide column 41 is slidably installed inside the slide rail 4. The slide column 41 is fixedly installed at the bottom of the connecting plate 31. The slide column 41 slides inside the slide rail 4, driving the connecting plate 31 to telescopically slide inside the rotating plate 3. A reset spring 5 is installed inside the rotating plate 3. The other end of the reset spring 5 is connected to the outer side of the connecting plate 31, and is used to pull and reset the connecting plate 31.

[0022] A notch is provided on one side of the rotating plate 3 so that the connecting plate 31 can be slidably installed inside the rotating plate 3. One end of the reset spring 5 is connected to the inner wall of the notch of the rotating plate 3, and the other end is connected to the side wall of the connecting plate 31 located inside the rotating plate 3, so that the connecting plate 31 can be reset by the reset spring 5 after being pulled inside the rotating plate 3. The sliding column 41 fixedly installed at the bottom of the connecting plate 31 can be slidably installed inside the slide rail 4 provided on the top of the placing plate 2, so that when the rotating plate 3 and the connecting plate 31 rotate, the sliding column 41 is driven to slide inside the slide rail 4, and the slide rail 4 One side is set to be conical and irregular. When the connecting plate 31 rotates to the slide rail 4, the sliding column 41 drives the connecting plate 31 to be pulled outward inside the rotating plate 3, thereby increasing the overall length of the connecting plate 31 and the rotating plate 3. The connecting plate 31 and the positioning plate 32 can be extended to the outside of the protective cover 6 of the detection platform 1, so as to facilitate the placement and removal of semiconductor devices on the positioning plate 32, thereby achieving the effect of driving the rotating plate 3 and the connecting plate 31 to rotate through the rotating component 34, so that the sliding column 41 at the bottom of the connecting plate 31 slides inside the slide rail 4, thereby stretching the connecting plate 31.

[0023] It should be noted that a protective cover 6 is installed on the top of the test table 1, and a placement opening 61 is opened on one side of the protective cover 6 for placing and removing semiconductor devices when the positioning plate 32 rotates to the placement opening 61. The protective cover 6 is set outside the mounting column frame 11 and the placement plate 2 for protection and isolation.

[0024] The protective cover 6 covers the outside of the mounting column frame 11 and the testing platform 1, protects and seals the internal testing components to prevent the outside from affecting the semiconductor device testing. A placement opening 61 is opened on one side of the protective cover 6. The placement opening 61 is opened at a conical irregular shape with the slide rail 4, so that the sliding column 41 can drive the connecting plate 31 to move to this place and then stretch out the positioning plate 32, and extend the positioning plate 32 from the placement opening 61 to place and take out the semiconductor device, which is convenient for semiconductor device testing.

[0025] Again, considering how the positioning assembly 33 clamps and fixes the semiconductor device, Figure 5, the specific structure of the positioning component 33 is disclosed. The positioning component 33 includes a slideway 3301 opened on the top of the positioning plate 32, a moving block 3302 is slidably installed inside the slideway 3301, a connecting block 3303 is fixedly installed on the top of the moving block 3302, and placement clamps 3304 are fixedly installed on both sides of the top of the connecting block 3303. There are two groups of placement clamps 3304, and the two groups of placement clamps 3304 are symmetrically distributed on the top of the positioning plate 32. The outer wall of the positioning plate 32 is threadedly connected with a threaded column 3305 that penetrates into the interior of the moving block 3302. The threaded column 3305 rotates to drive the moving block 3302 and the connecting block 3303 to move toward another group of placement clamps 3304, so that the semiconductor device is placed on the placement clamps 3304 for clamping and fixing.

[0026] A slideway 3301 is provided at the top of the positioning plate 32 so that the connecting block 3303 can be installed on the top of the positioning plate 32, and the movable block 3302 is fixedly installed at the bottom of the connecting block 3303. The movable block 3302 is inserted into the interior of the slideway 3301, and can drive the connecting block 3303 to slide inside the slideway 3301. The threaded column 3305 is threadedly connected from the outer wall of the positioning plate 32, so that the threaded column 3305 passes through the interior of the slideway 3301 and extends to the interior of the movable block 3302. The movable block 3302 is threadedly connected and the threaded column 3305 is rotated, so that the movable block 3302 can move on the outer surface of the threaded column 3305, and then the two placement clamps 3304 installed on both sides of the top of the connecting block 3303 are moved, and the distance between the placement clamp 3304 on the other side of the top of the positioning plate 32 is adjusted, so that semiconductor devices of different sizes can be placed and clamped, so as to achieve the effect of clamping the semiconductor device and placing it on the positioning plate 32.

[0027] In summary, the working principle of this scheme is as follows: When the semiconductor device is tested, the driving motor 302 is started by the control device, so that the driving motor 302 drives the rotating sleeve 301, the rotating plate 3 and the connecting plate 31 to rotate in a circle on the outer surface of the mounting column frame 11, and the connecting plate 31 is rotated by means of the sliding column 41 at the bottom, so that the connecting plate 31 can rotate more smoothly, so that the connecting plate 31 can move the semiconductor device placed on the positioning plate 32 by the positioning component 33 to the bottom of the spectrum detection component 12 and the solder joint detection component 13 in turn for testing, and other detection components can be installed in a circular distribution on the outer surface of the mounting column frame 11, so as to achieve the effect of performing multiple tests on the semiconductor device at one time; When placing the semiconductor device on the positioning plate 32, the connecting plate 31 is driven by the driving assembly to rotate to the conical irregular shape of the slide rail 4, and the sliding column 41 slides inside the slide rail 4. The sliding column 41 drives the connecting plate 31 to stretch inside the rotating plate 3, increasing the overall length of the connecting plate 31 and the rotating plate 3, so that the positioning plate 32 can extend out of the placement port 61 opened on the side of the protective cover 6, which is convenient for personnel to place and remove the semiconductor device.

[0028] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An adjustable semiconductor detection positioning device, comprising a detection platform (1), a mounting column frame (11) being fixedly mounted on the top of the detection platform (1), and a spectrum detection component (12) and a solder joint detection component (13) being mounted on the outer surface of the mounting column frame (11) in a circular array, characterized in that: A placement plate (2) is fixedly mounted on the top of the detection platform (1), a rotating plate (3) is arranged above the placement plate (2), a connecting plate (31) is slidably sleeved inside the rotating plate (3), a positioning plate (32) is fixedly mounted on the side of the connecting plate (31) away from the rotating plate (3), a positioning component (33) for limiting and clamping the semiconductor device is arranged on the top of the positioning plate (32), and a rotating component (34) is arranged at the other end of the rotating plate (3), the rotating component (34) is used to drive the rotating plate (3) and the positioning plate (32) to rotate outside the mounting column frame (11), so that the positioning plate (32) moves to below the spectrum detection component (12) and the solder joint detection component (13); A slide rail (4) is provided on the top of the placement plate (2), a slide column (41) is slidably mounted inside the slide rail (4), and the slide column (41) is fixedly mounted on the bottom of the connecting plate (31). The slide column (41) slides inside the slide rail (4), driving the connecting plate (31) to telescope and slide inside the rotating plate (3).

2. The adjustable semiconductor detection positioning device according to claim 1, characterized in that: The rotating assembly (34) comprises a rotating sleeve (301) sleeved on the outer surface of the mounting column frame (11); the bottom of the rotating sleeve (301) penetrates the placement plate (2) and the detection platform (1) and extends to the interior of the detection platform (1); a driving motor (302) is arranged at the bottom of the rotating sleeve (301); the output shaft of the driving motor (302) penetrates the interior of the rotating sleeve (301); a rotating gear (303) is fixedly mounted on the outer surface of the output shaft of the driving motor (302); the rotating gear (303) is meshed with the interior of the rotating sleeve (301); and the driving motor (302) can drive the rotating sleeve (301) to rotate via the rotating gear (303).

3. The adjustable semiconductor detection positioning device according to claim 2, characterized in that: One side of the rotating plate (3) is fixedly mounted on the outer surface of the rotating sleeve (301), and the rotating sleeve (301) can drive the rotating plate (3) to rotate together.

4. The adjustable semiconductor detection positioning device according to claim 1, characterized in that: The positioning assembly (33) comprises a slideway (3301) provided on the top of the positioning plate (32); a moving block (3302) is slidably mounted inside the slideway (3301); a connecting block (3303) is fixedly mounted on the top of the moving block (3302); placement clamps (3304) are fixedly mounted on both sides of the top of the connecting block (3303); two groups of placement clamps (3304) are provided; the two groups of placement clamps (3304) are symmetrically distributed on the top of the positioning plate (32); a threaded column (3305) is threadedly connected to the outer wall of the positioning plate (32) and penetrates into the interior of the moving block (3302); the threaded column (3305) rotates to drive the moving block (3302) and the connecting block (3303) to move toward another group of placement clamps (3304), so that the semiconductor device is placed on the placement clamps (3304) for clamping and fixing.

5. The adjustable semiconductor detection positioning device according to claim 1, characterized in that: A return spring (5) is installed inside the rotating plate (3), and the other end of the return spring (5) is connected to the outside of the connecting plate (31) for pulling and returning the connecting plate (31).

6. The adjustable semiconductor detection positioning device according to claim 1, characterized in that: A protective cover (6) is installed on the top of the testing platform (1), and a placement opening (61) is provided on one side of the protective cover (6) for placing and removing semiconductor devices when the positioning plate (32) is rotated to the placement opening (61).

7. The adjustable semiconductor detection positioning device according to claim 6, characterized in that: The protective cover (6) is arranged outside the mounting column frame (11) and the placement plate (2) to provide protection and isolation.

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