Electronic device

Abstract

An electronic device is provided. The electronic device comprises a shell, a first metal wire, a conductive column, a circuit board and a metal connecting piece, the shell comprises a conductive through hole and a concave hole, and the conductive through hole penetrates through the shell; the first metal wire is arranged on the inner surface of the shell, and the conductive through hole is electrically connected to one end of the first metal wire; the conductive column is arranged in the concave hole and exposed out of the shell, and the conductive column is electrically connected to the conductive through hole; the circuit board is arranged in the shell; the metal connecting piece is arranged on the circuit board and is electrically connected to the first metal wire. According to the electronic device provided by the invention, the conductive circuit is designed on the inner surface of the shell by a plastic metallization process to replace a cable or a secondary circuit board in the prior art; moreover, the metal connecting piece does not occupy the space of the main circuit board, thereby improving the utilization rate of the internal space of a product, and enabling the circuit layout of the main circuit board not to be limited by the insufficient space.

Description

Technical Field

[0001] The invention relates to an electronic device, in particular to an electronic device with a shell subjected to a plastic metallization process. Background Art

[0002] Existing portable electronic products, such as wireless headphones, smart bracelets, and smart watches, have complex internal charging circuit designs, and the charging terminals and the circuit boards inside the products are electrically conductive through indirect contact with multiple sub-circuits or cables. However, such designs require multiple electronic components to be installed inside the product, which is not conducive to product miniaturization and will occupy the internal space of the product, limiting the design of other components.

[0003] Therefore, how to overcome the above-mentioned defects through the improvement of structural design has become one of the important issues that this business wants to solve.

[0004] Therefore, it is necessary to provide an electronic device to solve the above problems. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide an electronic device to address the deficiencies of the prior art, so as to solve the defect that the structural design of the charging terminal of the existing miniaturized electronic products occupies too much internal space of the product.

[0006] In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide an electronic device, which includes a shell, a first metal trace, a conductive column, a circuit board and a metal connector. The shell includes a conductive through hole and a recessed hole, and the conductive through hole passes through the shell. The first metal trace is arranged on an inner surface of the shell, and the conductive through hole is electrically connected to one end of the first metal trace. The conductive column is arranged in the recessed hole and exposed to the shell, and the conductive column is electrically connected to the conductive through hole. The circuit board is arranged inside the shell. The metal connector is arranged on the circuit board and is electrically connected to the first metal trace.

[0007] One of the beneficial effects of the present invention is that the electronic device provided by the present invention can replace the cables or sub-circuit boards of the prior art by designing conductive circuits on the inner surface of the shell by a plastic metallization process through the technical solutions of "a first metal trace is arranged on an inner surface of the shell, and a conductive through-hole is electrically connected to one end of the first metal trace", "a conductive column is arranged in a recessed hole and exposed to the shell, and the conductive column is electrically connected to the conductive through-hole", and "a metal connector is arranged on the circuit board and electrically connected to the first metal trace". The conductive circuit can be designed on the inner surface of the shell by a plastic metallization process depending on the position of the conductive column, and the internal and external circuits are connected through the conductive through-hole. In addition, the conductive circuit and the circuit board can be electrically connected through a metal connector. Since the conductive circuit is freely designed on the inner surface of the shell, the metal connector is not limited to being arranged below the conductive column, so the metal connector will not occupy the space of the main circuit board, thereby improving the utilization rate of the internal space of the product and preventing the circuit layout of the main circuit board from being restricted by insufficient space.

[0008] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 FIG. 1 is a schematic diagram of an electronic device according to a first embodiment of the present invention.

[0010] Figure 2 FIG. 1 is an exploded schematic diagram of an electronic device according to a first embodiment of the present invention.

[0011] Figure 3 It is a partially enlarged schematic diagram of an electronic device according to a first embodiment of the present invention.

[0012] Figure 4 for Figure 3 Schematic cross-sectional view of section IV-IV.

[0013] Figure 5 FIG. 4 is a schematic diagram of an electronic device according to a second embodiment of the present invention.

[0014] Figure 6 It is a partially enlarged schematic diagram of an electronic device according to a second embodiment of the present invention.

[0015] Figure 7 for Figure 6 Schematic cross-sectional view of section VII-VII.

[0016] Main component symbols:

[0017] D Electronic Devices

[0018] 1 Housing

[0019] 1A Housing

[0020] 1B Lower case cover

[0021] 101 Inner surface

[0022] 102 External surface

[0023] 11 Chute

[0024] 11S Sloped surface

[0025] 2. First Metal Routing

[0026] 3 Conductive pillars

[0027] 31 Surface

[0028] 4 Circuit Board

[0029] 5 Metal connectors

[0030] 6 Second metal routing

[0031] 60 round metal part

[0032] 7 Waterproof parts

[0033] 8 Metal Department

[0034] A1 First chamfer structure

[0035] A2 Second chamfer structure

[0036] B1 First fillet structure

[0037] B2 Second rounded corner structure

[0038] V Conductive via

[0039] V0 Metal Layer

[0040] V1 Conical hole wall

[0041] V' cavity

[0042] C Concave hole

[0043] C1 medial wall

[0044] C2 bottom surface

[0045] HP Level

[0046] θ1 First tilt angle

[0047] θ2 Second tilt angle DETAILED DESCRIPTION

[0048] The following is a specific embodiment to illustrate the implementation of the "electronic device" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations, not depictions based on actual sizes, and are stated in advance. The following implementations will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention. In addition, it should be understood that although the terms "first", "second", "third" and the like may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another element. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation. In addition, the "connection" in the full text of the present invention is a physical connection between two elements and is a direct connection or an indirect connection.

[0049] [First embodiment]

[0050] See also Figures 1 to 4 , Figure 1 is a schematic diagram of an electronic device according to a first embodiment of the present invention, Figure 2 is an exploded schematic diagram of an electronic device according to a first embodiment of the present invention, Figure 3 is a partially enlarged schematic diagram of an electronic device according to a first embodiment of the present invention, Figure 4 for Figure 3 A first embodiment of the present invention provides an electronic device D, which includes a housing 1A, a first metal trace 2, a conductive column 3, a circuit board 4 and a metal connector 5.

[0051] The shell 1A includes a conductive through hole V and a recessed hole C, and the recessed hole C is adjacent to the conductive through hole V. Specifically, the electronic device D also includes a lower shell cover 1B, and the shell 1A and the lower shell cover 1B together constitute the outer shell 1. The conductive through hole V and the recessed hole C are arranged in the shell 1A. The shell 1A further includes an inner surface 101 and an outer surface 102, and the first metal trace 2 is arranged on the inner surface 101 of the shell 1A. The conductive through hole V passes through the shell 1A, and the two ends of the conductive through hole V are exposed on the inner surface 101 and the outer surface 102 respectively. The recessed hole C is arranged on the outer surface 102, and the conductive column 3 is arranged in the recessed hole C and exposed on the shell 1A. As Figure 3 and Figure 4As shown, the height of the conductive column 3 is not greater than the depth of the recessed hole C. The depth of the recessed hole C refers to the distance from the bottom surface C2 of the recessed hole C to the outer surface 102 of the housing 1A. In other words, the surface 31 of the conductive column 3 will not be higher than the outer surface 102 of the housing 1A, but will be flush with or lower than the outer surface 102. By designing that the height of the conductive column 3 is not greater than the depth of the recessed hole C, the risk of the conductive column 3 falling off due to improper external impact or pulling can be reduced.

[0052] In the present invention, the housing 1A is a plastic housing, and the first metal trace 2 is a metal linear pattern formed on the surface of the housing 1A by a plastic metallization process. For example, the first metal trace 2 can be made by laser direct structuring (LDS). Laser direct structuring technology uses a special plastic to inject and then activate the metal particles on the plastic surface by laser, and then forms metal traces on the plastic surface by electroplating and / or chemical plating. However, the present invention is not limited to the molding method of the first metal trace 2.

[0053] In the first embodiment, the conductive via V is formed by first forming a through hole by injection molding, and then metallizing the inner surface of the through hole. For example, in addition to the above-mentioned LDS process, the metallization process of the inner surface of the through hole may also include laser chemical activation plating (LAP), laser catalytic plating (LCP), laser chemical surface (LCS), cold plasma spray (CPS), physical vapor deposition (PVD), laser shock peening (LSP), and photosensitive patterning (PDS), but the present invention is not limited thereto.

[0054] like Figure 2 and Figure 4As shown, the circuit board 4 and the metal connector 5 are arranged inside the housing 1, and the metal connector 5 is arranged on the circuit board 4 and electrically connected to the electronic components (not shown) arranged on the circuit board 4. For example, the electronic components can be batteries or other IC components, but the present invention is not limited thereto. One end of the first metal trace 2 is electrically connected to the conductive through hole V, and the first metal trace 2 is electrically connected to the metal connector 5. In an embodiment of the present invention, five first metal traces 2 are electrically connected to five conductive through holes V respectively, and the first metal traces 2 extend along the inner surface 101 of the housing 1A to the edge of the housing 1A. Five metal connectors 5 are arranged along the edge of the circuit board 4. Since the circuit board 4 is located below the housing 1A, the metal connectors 5 located at the edge of the circuit board 4 are respectively abutted upward against the first metal traces 2 extending to the edge of the housing 1A, thereby generating electrical conduction. In addition, in the first embodiment, five recessed holes C are arranged in the housing 1A and correspond to the five conductive through holes V respectively, and the five conductive pillars 3 are respectively arranged in the five recessed holes C. However, the above example is only one feasible embodiment and is not intended to limit the present invention. The present invention is not limited to the number, length, and extension track of the first metal traces 2, the number and distribution positions of the metal connectors 5, and the number of the conductive vias V and the recessed holes C. In addition, for example, the metal connector 5 can be a pogo pin or a metal spring, but the present invention is not limited thereto.

[0055] like Figure 3 and Figure 4 As shown, the housing 1A further has an inclined groove 11, which is connected to the concave hole C and is located between the concave hole C and the corresponding conductive through hole V. The inclined groove 11 has an inclined surface 11S, which is inclined downward from the side close to the conductive through hole V toward the side close to the concave hole C. The inclined surface 11S has a first inclination angle θ1 relative to a horizontal plane HP, the first inclination angle θ1 is greater than 30 degrees, and a first rounded structure B1 is provided between the inclined surface 11S and the outer surface 102 of the housing 1A.

[0056] The recessed hole C includes an inner side wall C1 and a bottom surface C2. It should be noted that the outer surface 102 of the housing 1A does not include the inner side wall C1 and the bottom surface C2 of the recessed hole C, nor does it include the inclined surface 11S of the inclined groove 11. Figure 3 and Figure 4 As shown, a first chamfered structure A1 is formed between the outer surface 102 of the housing 1A and the inner sidewall C1 of the recessed hole C, and a second chamfered structure A2 is formed between the inner sidewall C1 of the recessed hole C and the bottom surface C2 of the recessed hole C. By designing the first chamfered structure A1 and the second chamfered structure A2, the conductive pillar 3 can be guided so that it is easier to be placed in the recessed hole C and located at the center of the recessed hole C.

[0057] The conductive through hole V forms a conical hole wall V1 on the side facing the outer surface 102, and the conical hole wall V1 has a second inclination angle θ2 relative to the horizontal plane HP, and the second inclination angle θ2 is greater than 30 degrees. There is a second rounded corner structure B2 between the conical hole wall V1 and the outer surface 102 of the housing 1A. Figure 4 As shown, the tapered hole wall V1 of the conductive through hole V and the inclined surface 11S of the inclined groove 11 are inclined surface structures. Thus, through the design of the first rounded structure B1 and the second rounded structure B2, as well as the design of the tapered hole wall V1 and the inclined surface 11S, it is beneficial to form surface metallization on its surface in the LDS manner, that is, it is convenient to perform laser processing. If the connection between the inclined surface 11S and the outer surface 102 of the shell 1A is an acute angle structure instead of the first rounded structure B1, or the connection between the tapered hole wall V1 and the outer surface 102 of the shell 1A is an acute angle structure instead of the second rounded structure B2, it is more difficult to form a metallization structure on the surface of these connections. Similarly, if the tapered hole wall V1 of the conductive through hole V and the inclined surface 11S of the inclined groove 11 are not inclined enough (the first inclination angle θ1 and the second inclination angle θ2 are less than 30 degrees), it is more difficult for the laser beam to hit the tapered hole wall V1 and the inclined surface 11S at a suitable incident angle to form surface metallization.

[0058] like Figure 3 and Figure 4 As shown, in the first embodiment, the electronic device D further includes a second metal trace 6, which is disposed on the outer surface 102 of the housing 1A. The second metal trace 6 is formed in the same manner as the first metal trace 2, and will not be described in detail here. It should be noted that in order to clearly show the second metal trace 6, Figure 3 The conductive column 3 is omitted in one of the recessed holes C. One end of the second metal trace 6 extends into the conductive through hole V along the second fillet structure B2 and the tapered hole wall V1, and is electrically connected to the metal layer V0 in the conductive through hole V; the other end of the second metal trace 6 extends into the recessed hole C along the first fillet structure B1 and the inclined surface 11S of the inclined groove 11, and forms a circular metal portion 60 on the bottom surface C2 of the recessed hole C, and the conductive column 3 is disposed in the recessed hole C and connected to the circular metal portion 60 by soldering, so that the conductive column 3 is electrically connected to the conductive through hole V through the second metal trace 6. However, the present invention is not limited to the method of connecting the conductive column 3 to the second metal trace 6. In addition to the soldering method, the conductive column 3 can also be connected to the second metal trace 6 by reflow or conductive adhesive to achieve electrical conduction. Therefore, the second metal trace 6, the conductive through hole V, the first metal trace 2 and the metal connector 5 form a conductive path between the conductive column 3 and the electronic component (not shown) on the circuit board 4. When the electronic component is a battery, the electronic device D can utilize the conductive pillar 3 to be electrically connected to an external power source and charge the battery through the conductive path.

[0059] In addition, it is worth mentioning that Figure 2 and Figure 3 In the embodiment, the second metal trace 6 is exposed on the outer surface 102 of the housing 1A, but in actual application, after the second metal trace 6 is disposed on the outer surface 102, the second metal trace 6 and the outer surface 102 will be covered by a layer of spray paint. Therefore, in actual application, from the appearance of the electronic device D, the second metal trace 6 will not be exposed.

[0060] In addition, if Figure 3 As shown, the electronic device D further includes a waterproof member 7. The waterproof member 7 is disposed in the conductive through hole V and is located on the side of the conductive through hole V facing the outer surface 102. However, the present invention is not limited thereto. In other embodiments, the waterproof member 7 can also be disposed on the side of the conductive through hole V facing the inner surface 101 (i.e. Figure 4 Alternatively, the waterproof member 7 can also be disposed on both sides of the conductive through hole V facing the outer surface 102 and the inner surface 101, that is, it is disposed in the conductive through hole V on the outer side of the housing 1A and in the concave hole V' on the inner side. It should be noted that in order to clearly show the second metal trace 6, Figure 3 The waterproof component 7 is omitted in one of the conductive through holes V.

[0061] The present invention is not limited to the specific implementation of the waterproof member 7. Figure 2 As shown, for example, the waterproof member 7 can be waterproof silica gel, which is filled in the five conductive through holes V respectively by dispensing; or, the waterproof member 7 can be waterproof adhesive, which is directly attached to all the conductive through holes V.

[0062] [Second embodiment]

[0063] See also Figures 5 to 7 As shown, Figure 5 is a schematic diagram of an electronic device according to a second embodiment of the present invention, Figure 6 is a partially enlarged schematic diagram of an electronic device according to a second embodiment of the present invention, Figure 7 for Figure 6 The second embodiment provides an electronic device D, which includes a housing 1A, a first metal trace 2, a conductive column 3, a circuit board 4, and a metal connector 5. The housing 1A includes a conductive through hole V and a recessed hole C. The housing 1 includes a housing 1A and a lower housing cover 1B, and the conductive through hole V and the recessed hole C are provided in the housing 1A. The structure and molding method of the electronic device D of the second embodiment are similar to those of the first embodiment, and the details of the similarities are not repeated.

[0064] like Figure 6 and Figure 7As shown, the main difference between the electronic device D of the second embodiment and the first embodiment is that in the electronic device D of the second embodiment, the recessed hole C is located above the conductive through hole V, and the recessed hole C is connected to the conductive through hole V. In other words, the housing 1A does not have the structure of the inclined groove 11. It should be noted that in order to clearly show the relative relationship between the conductive through hole and the recessed hole C, Figure 6 The conductive column 3 is omitted in one of the recessed holes C.

[0065] In the second embodiment, the conductive via V is formed by laser penetrating the housing 1A. Specifically, the conductive via V is formed by first using laser to penetrate the housing 1A to form a through hole, and then metallizing the inner surface of the through hole. The metallization process of the inner surface of the through hole may include LAP, LCP, LCS, CPS, PVD, LSP and PDS described in the first embodiment, but the present invention is not limited thereto.

[0066] In addition, the electronic device D further includes a metal portion 8, which is disposed on the bottom surface C2 of the recessed hole C. The metal portion 8 can be formed by the above-mentioned surface metallization process, which will not be described in detail here. The conductive via V will extend to the metal portion 8. The conductive via V is electrically connected between the first metal trace 2 and the metal portion 8. The conductive column 3 is disposed in the recessed hole C and is connected to the metal portion 8 by soldering, so that the metal portion 8 is electrically connected to the conductive column 3 and the conductive via V. Thereby, the conductive column 3 can be electrically connected to the first metal trace 2 through the metal portion 8 and the conductive via V, and then electrically connected to the metal connector 5 through the first metal trace 2. The metal connector 5 is disposed on the circuit board 4 and electrically connected to the electronic component (not shown) disposed on the circuit board 4. For example, the electronic component can be, for example, a battery or other IC component, which is not limited to the present invention. Therefore, the metal portion 8, the conductive via V, the first metal trace 2 and the metal connector 5 form a conductive path between the conductive column 3 and the electronic component. When the electronic component is a battery, the electronic device D can utilize the conductive pillar 3 to be electrically connected to an external power source and charge the battery through the conductive path.

[0067] In addition, the electronic device D further includes a waterproof member 7, which is disposed on the side of the conductive through hole V facing the inner surface 101 of the housing 1A. The waterproof member 7 can be filled with glue or covered with waterproof adhesive. It is worth mentioning that in the second embodiment, since a concave hole C is provided on the side of the conductive through hole V facing the outer surface 102, and a conductive column 3 is provided in the concave hole C and connected to the metal part 8 by soldering, and the aperture of the conductive through hole V formed by laser perforation is quite small (between 0.08mm and 0.3mm), it is difficult for external water vapor to penetrate into the interior of the electronic device D from the concave hole C and the conductive through hole V. Therefore, the electronic device D provided in the second embodiment may not be provided with a waterproof member 7. In addition, the present invention is not limited to the method of connecting the conductive column 3 to the metal part 8. In addition to the soldering method, the conductive column 3 can also be connected to the metal part 8 by reflow or conductive glue to achieve electrical conduction with the conductive through hole V.

[0068] [Beneficial Effects of Embodiments]

[0069] One of the beneficial effects of the present invention is that the electronic device D provided by the present invention can replace the cables or multiple sub-circuit boards of the prior art by forming a conductive circuit on the inner surface of the shell by a plastic surface metallization process through the technical schemes of "a first metal trace 2 is arranged on the inner surface of the shell 1A, and a conductive through hole V is electrically connected to one end of the first metal trace 2", "a conductive column 3 is arranged in a recessed hole C and exposed to the shell 1A, and the conductive column 3 is electrically connected to the conductive through hole V" and "a metal connector 5 is arranged on the circuit board 4 and electrically connected to the first metal trace 2". The conductive circuit can be freely designed on the inner surface of the shell according to the position of the charging terminal, and the internal and external circuits are connected through the conductive through hole. In addition, the conductive circuit and the circuit board can be electrically connected through a metal connector. Since the conductive circuit is freely designed on the inner surface of the shell, the metal connector is not limited to being arranged below the charging terminal, so the metal connector will not occupy the space of the main circuit board, thereby improving the utilization rate of the internal space of the product, so that the circuit layout of the main circuit board will not be limited by insufficient space. In addition, through the plastic metallization process, some electronic components can be arranged on the plastic carrier, which is conducive to further improving the utilization of space and achieving the purpose of shrinking electronic products.

[0070] Furthermore, the conductive via V can be a through hole formed by injection molding, and the conductive via V can be electrically connected to the metal connector on the circuit board through the first metal trace 2, and can also be electrically connected to the conductive column 3 in the recessed hole C through the second metal trace 6. Thereby, the second metal trace 6, the conductive via V, the first metal trace 2 and the metal connector 5 form a conductive path between the conductive column 3 and the electronic components on the circuit board 4. In addition, the design of the first fillet structure B1 and the second fillet structure B2, as well as the design of the tapered hole wall V1 and the inclined surface 11S, is conducive to forming surface metallization on its surface in an LDS manner (i.e., it is conducive to forming the second metal trace 6).

[0071] Furthermore, the conductive via V may also be a through hole formed by laser perforation, and the conductive via V is connected to the recessed hole C. The conductive via V can be electrically connected to the metal connector on the circuit board 4 through the first metal trace 2, and can also be electrically connected to the conductive column 3 in the recessed hole C through the metal portion 8. Thus, the metal portion 8, the conductive via V, the first metal trace 2, and the metal connector 5 form a conductive path between the conductive column 3 and the electronic component on the circuit board 4.

[0072] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the scope of the claims of the present invention.

Claims

1. An electronic device, the electronic device include: A shell, the shell comprising a conductive through hole and a recessed hole, the conductive through hole passing through the shell; a first metal trace, the first metal trace being disposed on an inner surface of the housing, the conductive through hole being electrically connected to one end of the first metal trace; a conductive post, the conductive post being disposed in the recessed hole and exposed from the housing, the conductive post being electrically connected to the conductive through hole; a circuit board disposed inside the housing; and A metal connector is disposed on the circuit board and electrically connected to the first metal trace.

2. The electronic device according to claim 1, in, The height of the conductive column is not greater than the depth of the concave hole.

3. The electronic device as claimed in claim 2, in, A first chamfered structure is formed between an outer surface of the shell and an inner side wall of the concave hole, and a second chamfered structure is formed between the inner side wall of the concave hole and the bottom surface of the concave hole.

4. The electronic device as described in claim 3 further includes a second metal trace, which is arranged on the outer surface of the shell, the recessed hole is adjacent to the conductive through hole, one end of the second metal trace is electrically connected to the conductive through hole, and the other end of the second metal trace extends into the recessed hole and is electrically connected to the conductive column.

5. The electronic device as claimed in claim 4, in, The shell has an inclined groove connected to the concave hole and located between the conductive through hole and the concave hole. The inclined groove has an inclined surface which slopes downward from a side close to the conductive through hole toward a side close to the concave hole.

6. The electronic device as claimed in claim 5, in, The inclined surface has an inclined angle relative to a horizontal plane, the inclined angle is greater than 30 degrees, and a rounded structure is formed between the inclined surface and the outer surface of the shell.

7. The electronic device as claimed in claim 5, in, The conductive through hole forms a conical hole wall on the side facing the outer surface. The conical hole wall has an inclination angle relative to a horizontal plane, the inclination angle is greater than 30 degrees, and a rounded structure is formed between the conical hole wall and the outer surface of the shell.

8. The electronic device as claimed in claim 5, in, The conductive via is formed by injection molding. 9 . The electronic device as claimed in claim 8 , further comprising a waterproof member disposed on a side of the conductive through hole facing the outer surface, or disposed on a side of the conductive through hole facing the inner surface. 10 . The electronic device as claimed in claim 3 , further comprising a metal portion disposed on a bottom surface of the recessed hole, the recessed hole being connected to the conductive through hole, and the metal portion being electrically connected to the conductive pillar and the conductive through hole. The electronic device as claimed in claim 10 , wherein the conductive through hole is formed by laser penetrating the housing. 12 . The electronic device as claimed in claim 11 , further comprising a waterproof member disposed on a side of the conductive through hole facing the inner surface.

13. The electronic device as claimed in claim 1, in, The metal connecting piece is arranged on the edge of the circuit board.

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