Resin composition, film, optical filter, solid-state imaging element, image display device, infrared sensor, camera module, and compound

Abstract

The present invention provides a resin composition containing: at least one infrared absorbing dye A selected from the group consisting of a dye A1 represented by formula (1) and a dye multimer A2 containing two or more dye structures derived from the dye A1 in one molecule; and a resin. The invention also provides a film, an optical filter, a solid-state imaging element, an image display device, an infrared sensor, a camera module, and a compound. # imgabs0 #

Description

Technical Field

[0001] The present invention relates to a resin composition containing an infrared absorbing pigment, a film, an optical filter, a solid-state imaging element, an image display device, an infrared sensor, and a camera module using the resin composition, and a compound. Background Art

[0002] Solid-state imaging elements, i.e., CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) are used for color images in video cameras, digital cameras, mobile phones with camera functions, etc. These solid-state imaging elements use silicon photodiodes that are sensitive to infrared rays in their light receiving parts. Therefore, an infrared cutoff filter is sometimes provided for visibility correction. The infrared cutoff filter is manufactured using a resin composition containing an infrared absorbing pigment and a resin.

[0003] Patent Document 1 describes the production of an infrared cut filter or the like using a resin composition containing an infrared absorbing dye including an immonium compound and a resin.

[0004] Previous technical literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2007-233368 Summary of the invention

[0007] Technical issues to be solved by the invention

[0008] In recent years, films obtained using a resin composition containing an infrared absorbing dye and a resin are required to have further improved performance in heat resistance and light resistance.

[0009] Therefore, an object of the present invention is to provide a resin composition capable of forming a film having excellent heat resistance and light resistance. In addition, an object of the present invention is to provide a film, an optical filter, a solid-state imaging element, an image display device, an infrared sensor, a camera module, and a compound.

[0010] Means for solving technical problems

[0011] The present invention provides the following contents.

[0012] <1> A resin composition comprising:

[0013] At least one infrared absorbing dye A selected from the group consisting of a dye A1 represented by formula (1) and a dye multimer A2 containing two or more dye structures derived from the dye A1 in one molecule; and

[0014] Resin,

[0015] [Chemical formula 1]

[0016]

[0017] In formula (1), L 101 Represents -P(=O)(R L101 )-、-P(=S)(R L102 )-、-Si(R L103 )(R L104 )-、-B(R L105 )-, -S(=O)2- or -S(=O)-, R L101 ~R L105 represents a hydrogen atom or a substituent, R L103 With R L104 can bond to form a ring,

[0018] X 101 ~X 103 Each independently represents a nitrogen atom or -CRX 101 -, RX 101 represents a hydrogen atom or a substituent,

[0019] L 102 and L 103 Each independently represents a sulfur atom or -X 104 =X 105 -, X 104 and X 105 Each independently represents a nitrogen atom or -CR X102 -, R X102 represents a hydrogen atom or a substituent,

[0020] Ar 101 and Ar 102 Respectively independently represent -(CR Ar101 =CR Ar102 ) n101 -, an arylene group, a heterocyclic group or a group formed by combining two or more of these groups, R Ar101 and R Ar102 Each independently represents a hydrogen atom or a substituent, n101 represents an integer of 1 to 3,

[0021] Y 101 and Y 102 Represents -OR independently Y101 、-NR Y102 R Y103 or -SR Y104 , R Y101 ~R Y104 Each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, and R Y102 With R Y103They may be bonded via a single bond or a divalent linking group to form a ring,

[0022] Ar 101 With X 101 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0023] Ar 101 With Y 101 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0024] Ar 102 With X 102 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0025] Ar 102 With Y 102 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0026] Z 1 represents the counter ion,

[0027] p1 represents an integer from 0 to 5,

[0028] q1 represents an integer from 1 to 5.

[0029] <2> according to <1> The resin composition, wherein

[0030] X in the above formula (1) 103 For-CR X101 -, R X101 is a hydrogen atom or a substituent,

[0031] L 102 and L 103 are sulfur atoms respectively.

[0032] <3> according to <1> The resin composition, wherein

[0033] X in the above formula (1) 103 For-CR X101 -, R X101 is a hydrogen atom or a substituent,

[0034] L 102 and L 103 are sulfur atoms,

[0035] L 101 =P(=O)(R L101 )-, R L101 is a hydrogen atom or a substituent.

[0036] <4> according to <1> The resin composition, wherein

[0037] X in the above formula (1) 103 For-CR X101 -, R X101 is a hydrogen atom or a substituent,

[0038] L 102 and L 103 are sulfur atoms,

[0039] L 101 =P(=O)(R L101 )-,R L101 is a hydrogen atom or a substituent,

[0040] Y 101 and Y 102 Each independently is -NR Y102 R Y103 , R Y102 and R Y103 are independently a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, R Y102 With R Y103 The groups may be bonded via a single bond or a divalent linking group to form a ring.

[0041] <5> according to <1> The resin composition, wherein

[0042] X in the above formula (1) 103 For-CR X101 -, R X101 is a hydrogen atom or a substituent,

[0043] L 102 and L 103 are sulfur atoms,

[0044] L 101 -Si(R L103 )(R L104 )-or-S(=O)-, R L103 and R L104 are each independently a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group,

[0045] Y 101 and Y 102 Each independently is -NR Y102 R Y103 , R Y102 and R Y103 are independently a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, R Y102 With R Y103 The groups may be bonded via a single bond or a divalent linking group to form a ring.

[0046] <6> according to <1> to <5> The resin composition described above further comprises an infrared absorber other than the infrared absorbing dye A.

[0047] <7> according to <6> The resin composition, wherein

[0048] The maximum absorption wavelength of the infrared absorbing agent other than the infrared absorbing dye A described above exists on the shorter wavelength side than the maximum absorption wavelength of the infrared absorbing dye A described above.

[0049] <8> according to <1> to <7> The resin composition described in any one of the preceding claims, wherein

[0050] The maximum absorption wavelength of the infrared absorbing dye A is within the wavelength range of 700 to 1800 nm.

[0051] <9> according to <1> to <8> The resin composition described above further comprises a polymerizable compound and a photopolymerization initiator.

[0052] <10> A membrane, which is used <1> to <9> The resin composition described in any one of the above is obtained.

[0053] <11> A filter comprising <10> The membrane.

[0054] <12> A solid-state imaging element comprising <10> The membrane.

[0055] <13> An image display device comprising <10> The membrane.

[0056] <14> An infrared sensor comprising <10> The membrane.

[0057] <15> A camera module comprising <10> The membrane.

[0058] <16> A compound represented by formula (4),

[0059] [Chemical formula 2]

[0060]

[0061] In the formula, Ar 401 represents an aryl or heteroaryl group,

[0062] R 401 ~R 404 each independently represents a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group,

[0063] R 405 and R 406each independently represents an alkyl group, an aryl group, a heteroaryl group, an aryloxy group, a heteroaryloxy group, an alkoxy group or a cyano group,

[0064] R 407 and R 408 each independently represents an alkyl group or an aryl group,

[0065] n401 and n402 each independently represent an integer of 0 to 4,

[0066] q4 means 1 or 2,

[0067] Z 4 It represents a q4-valent counter anion.

[0068] <17> A compound represented by formula (5),

[0069] [Chemical formula 3]

[0070]

[0071] In the formula, Ar 501 represents an aryl or heteroaryl group,

[0072] R 501 ~R 504 each independently represents a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group,

[0073] R 505 and R 506 each independently represents an alkyl group, an aryl group, a heteroaryl group, an aryloxy group, a heteroaryloxy group, an alkoxy group or a cyano group,

[0074] n 501 and n 502 Each independently represents an integer from 0 to 4,

[0075] q5 means 1 or 2,

[0076] Z 5 It represents a q5-valent counter anion.

[0077] Effects of the Invention

[0078] According to the present invention, a resin composition capable of forming a film having excellent heat resistance and light resistance can be provided. In addition, the present invention can provide a film, an optical filter, a solid-state imaging element, an image display device, an infrared sensor, a camera module, and a compound. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] Figure 1 This is a schematic diagram showing one embodiment of an infrared sensor. DETAILED DESCRIPTION

[0080] Hereinafter, the contents of the present invention will be described in detail.

[0081] In this specification, "to" is used to mean that the numerical values ​​described before and after it are included as the lower limit and the upper limit.

[0082] In the marking of groups (atomic groups) in this specification, the marking not indicating substituted or unsubstituted includes groups (atomic groups) without substitution and groups (atomic groups) with substitution. For example, "alkyl" includes not only alkyl groups without substitution (unsubstituted alkyl groups) but also alkyl groups with substitution (substituted alkyl groups).

[0083] In this specification, "exposure" includes not only exposure using light, but also drawing using particle beams such as electron beams and ion beams, unless otherwise specified. In addition, examples of light used for exposure include active light or radiation such as the bright line spectrum of a mercury lamp, far ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, and electron beams.

[0084] In the present specification, “(meth)acrylate” means both or either acrylate and methacrylate, “(meth)acrylic acid” means both or either acrylic acid and methacrylic acid, and “(meth)acryloyl” means both or either acryloyl and methacryloyl.

[0085] In this specification, the weight average molecular weight and the number average molecular weight are defined as polystyrene-equivalent values ​​measured by gel permeation chromatography (GPC).

[0086] In the present specification, Me in the chemical formula represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group.

[0087] In this specification, infrared rays refer to light (electromagnetic waves) having a wavelength of 700 to 2500 nm.

[0088] In this specification, the total solid content refers to the total mass of the components excluding the solvent from all the components of the composition.

[0089] In this specification, the term "step" includes not only an independent step but also a step that cannot be clearly distinguished from other steps as long as the expected effect of the step is achieved.

[0090] <Resin composition>

[0091] The resin composition of the present invention comprises at least one infrared absorbing dye A selected from a dye A1 represented by formula (1) and a dye multimer A2 containing two or more dye structures derived from the dye A1 in one molecule; and

[0092] Resin.

[0093] By using the resin composition of the present invention, a film having excellent heat resistance and light resistance can be formed. It is speculated that the infrared absorbing pigment A is easily associated in the resin during film formation. It is speculated that by associating the infrared absorbing pigment A in the resin, the frequency of contact with chemical species that cause decomposition such as oxygen and water is reduced, and the decomposition of the infrared absorbing pigment A is suppressed, and as a result, a film having excellent heat resistance and light resistance can be formed.

[0094] And, by using the above-mentioned infrared absorption pigment A, the transmission slope on the long wavelength side longer than the maximum absorption wavelength is steep, and a film with excellent transmittance and light-shielding contrast can be formed. The film with such spectral characteristics can be preferably used as an infrared cut-off filter, an infrared transmission filter and other optical filters. Therefore, the resin composition of the present invention can be used as a resin composition for an optical filter. As the type of optical filter, an infrared cut-off filter and an infrared transmission filter etc. can be cited.

[0095] Hereinafter, each component used for the resin composition of the present invention will be described.

[0096] 《Specific infrared absorbing pigments》

[0097] The resin composition of the present invention comprises at least one infrared absorbing dye A selected from a dye A1 represented by formula (1) and a dye multimer A2 containing two or more dye structures derived from the dye A1 in one molecule. Hereinafter, the infrared absorbing dye is also referred to as a specific infrared absorbing dye.

[0098] The specific infrared absorbing dye may be a dye or a pigment.

[0099] When the specific infrared absorbing pigment is a pigment, the solubility of the specific infrared absorbing pigment in propylene glycol monomethyl ether acetate and water at 25°C is preferably 0.1g / 100g or less. Furthermore, when the specific infrared absorbing pigment is a pigment, the average particle size of the pigment is preferably 20 to 300nm, more preferably 25 to 250nm, and further preferably 30 to 200nm. The "average particle size" mentioned here refers to the average particle size of the secondary particles formed by the aggregation of the primary particles of the pigment. Furthermore, with respect to the particle size distribution of the secondary particles of the pigment (hereinafter also referred to as "particle size distribution"), the secondary particles present in (average particle size ± 100) nm account for more than 70% by mass of the whole, preferably more than 80% by mass. In addition, the particle size distribution of the secondary particles can be measured using the scattering intensity distribution.

[0100] -Pigment A1-

[0101] First, the dye A1 represented by formula (1) will be described.

[0102] [Chemical formula 4]

[0103]

[0104] L in formula (1) 101 Represents -P(=O)(R L101 )-、-P(=S)(R L102 )-、-Si(R L103 )(R L104 )-、-B(R L105 )-, -S(=O)2- or -S(=O)-, R L101 ~R L105 Each independently represents a hydrogen atom or a substituent.

[0105] As RL 101 ~RL 105 The substituent represented by the present invention includes alkyl, alkenyl, alkynyl, aryl, heteroaryl, alkoxy, aryloxy and alkenyloxy, preferably alkyl or aryl, more preferably aryl. These groups may further have a substituent. As the substituent, the groups listed in the substituent T described later and the groups containing anions described later can be mentioned.

[0106] The number of carbon atoms in the alkyl group is preferably 1 to 10, more preferably 1 to 6, and even more preferably 1 to 4. The alkyl group may be linear, branched, or cyclic.

[0107] The number of carbon atoms in the alkenyl group is preferably 2 to 10, more preferably 2 to 6, and even more preferably 2 to 4. The alkenyl group may be either linear or branched.

[0108] The number of carbon atoms in the alkynyl group is preferably 2 to 10, more preferably 2 to 6, and even more preferably 2 to 4. The alkynyl group may be either linear or branched.

[0109] The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 12. Furthermore, the aryl group is preferably a monocyclic aryl group.

[0110] The heteroaryl group is preferably a 5-membered ring or a 6-membered ring. The heteroatom constituting the ring of the heteroaryl group is preferably an oxygen atom, a nitrogen atom, and a sulfur atom. The number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3.

[0111] The number of carbon atoms in the alkoxy group is preferably 1 to 10, more preferably 1 to 6, and even more preferably 1 to 4. The alkoxy group may be either a linear chain or a branched chain.

[0112] The aryloxy group has preferably 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms.

[0113] The number of carbon atoms of the alkenyloxy group is preferably 1 to 10, more preferably 1 to 6, and even more preferably 1 to 4. The alkenyloxy group may be either linear or branched.

[0114] From the perspective of further improving the maximum absorption wavelength and light resistance, L in formula (1) 101 Preferably -P(=O)(R L101 )-.

[0115] L in formula (1) 101 -Si(R L103 )(R L104 )- or -S(=O)-.

[0116] X in formula (1) 101 ~X 103 Each independently represents a nitrogen atom or -CR X101 -, R X101 represents a hydrogen atom or a substituent. X101 The substituent represented may include the groups listed in the substituent T described later, preferably a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, a hydroxyl group, an alkoxy group, an aryloxy group, an alkenyloxy group or an amino group. These groups may further have a substituent. As the substituent, the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenically unsaturated bonds, etc. may be mentioned. As the groups containing ethylenically unsaturated bonds, vinyl, (meth)allyl, (meth)acryloyl, etc. may be mentioned.

[0117] The number of carbon atoms in the alkyl group is preferably 1 to 10, more preferably 1 to 6, and even more preferably 1 to 4. The alkyl group may be linear, branched, or cyclic.

[0118] The number of carbon atoms in the alkenyl group is preferably 2 to 10, more preferably 2 to 6, and even more preferably 2 to 4. The alkenyl group may be either linear or branched.

[0119] The number of carbon atoms in the alkynyl group is preferably 2 to 10, more preferably 2 to 6, and even more preferably 2 to 4. The alkynyl group may be either linear or branched.

[0120] The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 12. Furthermore, the aryl group is preferably a monocyclic aryl group.

[0121] The heteroaryl group is preferably a 5-membered ring or a 6-membered ring. The heteroatom constituting the ring of the heteroaryl group is preferably an oxygen atom, a nitrogen atom, and a sulfur atom. The number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3.

[0122] The number of carbon atoms in the alkoxy group is preferably 1 to 10, more preferably 1 to 6, and even more preferably 1 to 4. The alkoxy group may be either a linear chain or a branched chain.

[0123] The aryloxy group has preferably 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms.

[0124] The number of carbon atoms of the alkenyloxy group is preferably 1 to 10, more preferably 1 to 6, and even more preferably 1 to 4. The alkenyloxy group may be either linear or branched.

[0125] From the perspective of further improving the solubility and visible transparency of the compound, R X101 It is preferably an aryl group or a heteroaryl group, more preferably an aryl group, further preferably a monocyclic aryl group, further preferably a monocyclic aryl group having a substituent, and particularly preferably a monocyclic aryl group having a substituent at the ortho position. As the substituent, there can be mentioned the groups mentioned in the substituent T described later, the groups containing anions described later, the groups containing ethylenically unsaturated bonds, etc., preferably an alkyl group, a sulfo group, a carboxyl group, a salt of a carboxyl group, a salt of a sulfo group, the groups containing anions described later, or the groups containing ethylenically unsaturated bonds.

[0126] X in formula (1) 101 and X 102 Preferably, each independently is -CR X101 -. And, R X101 Preferred is a hydrogen atom.

[0127] X in formula (1) 103 Preferred is -CR X101 -. And, R X101 It is preferably a substituent, preferably an aryl group or a heteroaryl group, more preferably an aryl group, further preferably a monocyclic aryl group, further preferably a monocyclic aryl group having a substituent, and particularly preferably a monocyclic aryl group having a substituent at the ortho position.

[0128] L in formula (1) 102 and L 103 Each independently represents a sulfur atom or -X 104 =X 105 -, X 104 and X 105 Each independently represents a nitrogen atom or -CR X102 -, R X102 represents a hydrogen atom or a substituent. X102 The substituent represented by may be exemplified as the above R X101 The preferred ranges are also the same as those described for the substituents represented.

[0129] From the perspective of making the maximum absorption wavelength exist on the longer wavelength side, L 102 A sulfur atom is preferred.

[0130] From the perspective of making the maximum absorption wavelength exist on the longer wavelength side, L 103 A sulfur atom is preferred.

[0131] L 102 and L103 Particularly preferred are sulfur atoms, respectively.

[0132] Ar in formula (1) 101 and Ar 102 Respectively independently represent -(CR Ar101 =CR Ar102 ) n101 -, an arylene group, a heterocyclic group or a group formed by combining two or more of these groups, R Ar101 and R Ar102 Each independently represents a hydrogen atom or a substituent, and n101 represents an integer of 1-3.

[0133] As R Ar101 and R Ar102 The substituent represented by may be exemplified as the above R X101 The preferred ranges are also the same as those described for the substituents represented.

[0134] n101 represents an integer of 1 to 3, preferably 1 or 2, and more preferably 1.

[0135] Ar in formula (1) 101 and Ar 102 The number of carbon atoms of the arylene group represented is preferably 6 to 20, more preferably 6 to 12. Furthermore, the arylene group is preferably a monocyclic arylene group.

[0136] Ar in formula (1) 101 and Ar 102 The heterocyclic group represented by is preferably a 5-membered ring or a 6-membered ring. The heteroatom constituting the ring of the heterocyclic group is preferably an oxygen atom, a nitrogen atom and a sulfur atom. The number of heteroatoms constituting the ring of the heterocyclic group is preferably 1 to 3.

[0137] Ar in formula (1) 101 and Ar 102 Preferably, each independently is -(CR Ar101 =CR Ar102 ) n101 -, an arylene group, or a combination of these.

[0138] As a preferred embodiment, Ar 101 and Ar 102 Each independently represents an arylene group.

[0139] As another preferred embodiment, Ar 101 and Ar 102 Each independently is a combination of -(CR Ar101 =CR Ar102 ) n101 - and arylene groups. The above combination - (CR Ar101 =CR Ar102) n101 - and the arylene group are preferably *1 -(CR Ar101 =CR Ar102 ) n101 -Arylene- *2 .and, *2 Preferably, Y of formula (1) 101 or Y 102 The bonding key.

[0140] Y in formula (1) 101 and Y 102 Represents -OR independently Y101 、-NR Y102 R Y103 or -SR Y104 , R Y101 ~R Y104 Each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, and R Y102 With R Y103 The groups may be bonded via a single bond or a divalent linking group to form a ring.

[0141] R Y101 ~R Y104 Preferably, each is independently an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, more preferably an alkyl group or an aryl group, and further preferably an aryl group.

[0142] R Y101 ~R Y104 The number of carbon atoms of the alkyl group represented is preferably 1 to 10, more preferably 1 to 6, and further preferably 1 to 4. The alkyl group may be any of a linear, branched, and cyclic group. The alkyl group may further have a substituent. As the substituent, there may be mentioned the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenically unsaturated bonds, and the like.

[0143] R Y101 ~R Y104 The number of carbon atoms of the alkenyl group represented is preferably 2 to 10, more preferably 2 to 6, and further preferably 2 to 4. The alkenyl group may be any of a straight chain and a branched chain. The alkenyl group may further have a substituent. As the substituent, there may be mentioned the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenically unsaturated bonds, and the like.

[0144] R Y101 ~R Y104The number of carbon atoms of the alkynyl group represented is preferably 2 to 10, more preferably 2 to 6, and further preferably 2 to 4. The alkynyl group may be any of a straight chain and a branched chain. The alkynyl group may further have a substituent. As the substituent, there may be mentioned the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenically unsaturated bonds, and the like.

[0145] R Y101 ~R Y104 The number of carbon atoms of the aryl group represented is preferably 6 to 20, more preferably 6 to 12. Furthermore, the aryl group is preferably a monocyclic aryl group. The aryl group may further have a substituent. Examples of the substituent include the groups listed in the substituent T described below, the groups containing anions described below, and the groups containing ethylenically unsaturated bonds.

[0146] R Y101 ~R Y104 The heteroaryl represented is preferably a 5-membered ring or a 6-membered ring. The heteroatoms constituting the heteroaryl ring are preferably oxygen atoms, nitrogen atoms and sulfur atoms. The number of heteroatoms constituting the heteroaryl ring is preferably 1 to 3. The heteroaryl group may further have a substituent. As the substituent, there may be mentioned the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenically unsaturated bonds, etc.

[0147] -NR Y102 R Y103 R Y102 With R Y103 The ring may be formed by bonding via a single bond or a divalent linking group. Examples of the divalent linking group include -CR Y111 R Y112 , -O-, -S-, and groups formed by combining two or more of these. Y111 and R Y112 Each independently represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group or a heteroaryl group. These groups may further have a substituent. As a substituent, the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenic unsaturated bonds, etc. can be cited.

[0148] Y in formula (1) 101 and Y 102 Preferably, each independently is -NR Y102 R Y103 .

[0149] In formula (1), Ar 101 With X 101 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0150] Ar 101 With Y 101They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0151] Ar 102 With X 102 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0152] Ar 102 With Y 102 The rings may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring.

[0153] Examples of the divalent linking group include -CR Y121 R Y122 , -O-, -S-, and groups formed by combining two or more of these. Y121 and R Y122 Each independently represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group or a heteroaryl group. These groups may further have a substituent. As the substituent, there can be mentioned the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenic unsaturated bonds, etc.

[0154] Z in formula (1) 1 represents a counter ion. Examples of the counter ion include a counter anion and a counter cation.

[0155] The counter cation may be an inorganic cation or an organic cation.

[0156] Examples of inorganic cations include monovalent metal cations such as Na (sodium) cations, Li (lithium) cations, and K (potassium) cations; and divalent or higher metal cations such as Mg (magnesium) cations, Ca (calcium) cations, Sr (strontium) cations, Ba (barium) cations, Ti (titanium) cations, Zr (zirconium) cations, Cr (chromium) cations, Mn (manganese) cations, Fe (iron) cations, Co (cobalt) cations, Ni (nickel) cations, Cu (copper) cations, Zn (zinc) cations, Cd (cadmium) cations, Al (aluminum) cations, In (indium) cations, Sn (tin) cations, Pb (lead) cations, and Bi (bismuth) cations.

[0157] Examples of the organic cation include ammonium cations (tetraalkylammonium cations, trialkylammonium cations, etc.), imidazolium cations, pyridinium cations (pyridinium cations, N-methylpyridinium cations, N-ethylpyridinium cations, etc.), and phosphonium cations.

[0158] The counter cation is preferably an inorganic cation, and more preferably a Na cation, a Li cation, a K cation, a Mg cation, or a Ba cation because the light resistance and the heat resistance can be improved.

[0159] The counter anion may be an organic anion or an inorganic anion. As the counter anion, anions represented by formula (AN1), anions represented by formula (AN2), anions represented by formula (AN3), anions represented by formula (AN4), anions represented by formula (AN5), fluoride anions, chloride anions, bromide anions, iodide anions, cyanide ions, perchlorate anions, carboxylate anions, sulfonic acid anions, phosphoric acid anions, heteropolyacids (phosphotungstic acid, phosphomolybdic acid, phosphotungstomolybdic acid, silicotungstic acid, silicomolybdic acid, silicotungstomolybdic acid, etc.) anions, isopolyacids (tungstic acid, molybdic acid, etc.) anions, etc.

[0160] [Chemical formula 5]

[0161]

[0162] In formula (AN1), R AN1 and R AN2 Each independently represents a halogen atom or an alkyl group, R AN1 With R AN2 can bond to form rings;

[0163] In formula (AN2), R AN3 ~R AN5 Each independently represents a halogen atom or an alkyl group, R AN3 With R AN4 , R AN4 With R AN5 or R AN3 With R AN5 can bond to form rings;

[0164] In formula (AN3), R AN6 ~R AN9 each independently represents a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group or a cyano group;

[0165] In formula (AN4), R AN10 represents a halogenated hydrocarbon group which may be linked via a linking group having a nitrogen atom or an oxygen atom;

[0166] In formula (AN5), R AN11 ~R AN16 Each independently represents a halogen atom or a halogenated hydrocarbon group.

[0167] As R in formula (AN1) AN1 and R AN2 The halogen atom represented by AN3 ~R AN5 The halogen atom represented by and R of formula (AN3) AN6 ~R AN9Examples of the halogen atom represented by include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, and a fluorine atom is preferred.

[0168] R of formula (AN1) AN1 and R AN2 The alkyl group represented by the formula (AN2) R AN3 ~R AN5 The alkyl group represented by and R of formula (AN3) AN6 ~R AN9 The number of carbon atoms of the alkyl group represented is preferably 1 to 10, more preferably 1 to 6, and further preferably 1 to 3. The alkyl group may be straight chain, branched chain, or cyclic, preferably straight chain or branched chain, and more preferably straight chain. The alkyl group may have a substituent or may be unsubstituted. The alkyl group is preferably an alkyl group having a halogen atom as a substituent, and more preferably an alkyl group having a fluorine atom as a substituent (fluoroalkyl group). Furthermore, the fluoroalkyl group is preferably a perfluoroalkyl group.

[0169] R in formula (AN3) AN6 ~R AN9 The number of carbon atoms of the aryl group represented is preferably 6 to 20, more preferably 6 to 12, and further preferably 6. The aryl group may have a substituent or may be unsubstituted. As the substituent, a halogen atom and an alkyl group may be mentioned. As the halogen atom, a fluorine atom is preferred. As the alkyl group, a fluoroalkyl group is preferred.

[0170] R in formula (AN3) AN6 ~R AN9 The number of carbon atoms of the alkoxy group represented is preferably 1 to 10, more preferably 1 to 6, and further preferably 1 to 3. Examples of the alkoxy group include straight chain, branched chain, and cyclic groups, preferably straight chain or branched chain, and more preferably straight chain. The alkoxy group may have a substituent or may be unsubstituted. Examples of the substituent include a halogen atom and an alkyl group. As the halogen atom, a fluorine atom is preferred. As the alkyl group, a fluoroalkyl group is preferred.

[0171] R in formula (AN3) AN6 ~R AN9 The number of carbon atoms of the aryloxy group represented is preferably 6 to 20, more preferably 6 to 12, and further preferably 6. The aryloxy group may have a substituent or may be unsubstituted. Examples of the substituent include a halogen atom and an alkyl group. The halogen atom is preferably a fluorine atom. The alkyl group is preferably a fluoroalkyl group.

[0172] R of formula (AN1) AN1 With R AN2 They may be bonded to form a ring. AN3 With R AN4 , R AN4 With R AN5 or R AN3 With RAN5 They may be bonded to form a ring.

[0173] R of formula (AN4) AN10 It represents a halogenated hydrocarbon group that can be connected via a linking group having a nitrogen atom or an oxygen atom. A halogenated hydrocarbon group refers to a monovalent hydrocarbon group substituted by a halogen atom, preferably a monovalent hydrocarbon group substituted by a fluorine atom. Examples of the hydrocarbon group include an alkyl group, an aryl group, etc. The monovalent hydrocarbon group substituted by a halogen atom may further have a substituent. Examples of the linking group having a nitrogen atom or an oxygen atom include -O-, -CO-, -COO-, -CO-NH-, etc.

[0174] R of formula (AN5) AN11 ~R AN16 Each independently represents a halogen atom or a halogenated hydrocarbon group. As the halogen atom, a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom can be mentioned, and a fluorine atom is preferably mentioned. As the halogenated hydrocarbon group, an alkyl group having a halogen atom as a substituent is preferably mentioned, and an alkyl group having a fluorine atom as a substituent is more preferably mentioned.

[0175] Specific examples of heteropolyacid anions and isopolyacid anions include tungstate anions ([W6O 19 ] 2- , [W 10 O 32 ] 4- , [WO4] 2- etc.), molybdate anion ([Mo2O7] 2- 、[Mo6O 19 ] 2- 、[Mo8O 26 ] 4- etc.), phosphotungstate anion ([PW4O 20 ] 4- , [PW 12 O 40 ] 3- 、[P2W 15 O 56 ] 12- 、[P2W 17 O 61 ] 10- 、[P2W 18 O 62 ] 6- etc.), phosphomolybdic acid anion ([P2Mo 18 O 62 ] 6- 、[PMo 12 O 40 ] 3- etc.), phosphotungstomolybdate anion ([PW 12-x Mo x O 40 ]3- (x is an integer from 1 to 11), [P2W 18-y Mo y O 62 ] 6- (y is an integer of 1 to 17), silicotungstate anion ([SiW9O 34 ] 10- 、[SiW 10 O 36 ] 8- 、[SiW 11 O 39 ] 8- 、[SiW 12 O 40 ] 4- etc.), silicomolybdate anion ([SiMo 12 O 40 ] 4- etc.), silicotungstomolybdate anion ([SiW 12-x Mo x O 40 ] 4- (x is an integer of 1 to 11), etc.) and tungsten-based isopoly acid anions.

[0176] The counter anion may be a divalent or higher anion. Examples of the divalent or higher anion include anions having two or more monovalent anions in one molecule, such as an imide anion, a methide anion, a borate anion, and a sulfonate anion.

[0177] In formula (1), p1 represents an integer of 0 to 5, and q1 represents an integer of 1 to 5. p1 is preferably an integer of 0 to 3, more preferably an integer of 0 to 2. q1 is preferably an integer of 1 to 3, more preferably 1 or 2, and further preferably 1.

[0178] When the charge in [] in formula (1) is positive, it is preferred that p1 is an integer greater than 1 and Z 1 The counter ion represented by is a counter anion. In addition, the product of the valence of the positive charge in [] in formula (1) and q1 is preferably equal to Z 1 The product of the valence of the counter anion and p1 shown is the same value.

[0179] When the charge in [] in formula (1) is biased toward negative charge, it is preferred that p1 is an integer greater than 1 and Z 1 The counter ion represented by is a counter cation. In addition, the product of the valence of the negative charge in [] in formula (1) and q1 is preferably equal to Z 1 The product of the valence of the charge of the counter cation indicated and p1 is the same value.

[0180] When the charge in [] in formula (1) is neutral, Z is preferably1 does not exist, that is, p1 is 0 and q1 is 1.

[0181] The dye A1 is also preferably a dye represented by formula (2).

[0182] [Chemical formula 6]

[0183]

[0184] In formula (2), L 201 Represents -P(=O)(R L101 )-、-P(=S)(R L102 )-、-Si(R L103 )(RL 104 )-、-B(R L105 )-, -S(=O)2- or -S(=O)-, R L101 ~R L105 Each independently represents a hydrogen atom or a substituent, R L103 With R L104 can bond to form a ring,

[0185] R X111 and R X112 each independently represents a hydrogen atom or a substituent,

[0186] X 203 Represents nitrogen atom or -CR X101 -, R X101 represents a hydrogen atom or a substituent,

[0187] L 202 ~L 205 Each independently represents a sulfur atom or -X 104 =X 105 -, X 104 and X 105 Each independently represents a nitrogen atom or -CR X102 -, R X102 represents a hydrogen atom or a substituent,

[0188] Ar 201 and Ar 202 Respectively independently represent -(CR Ar201 =CR Ar202 ) n201 -, an arylene group, a heterocyclic group or a group formed by combining two or more of these groups, R Ar201 and R Ar202 Each independently represents a hydrogen atom or a substituent, n201 represents an integer of 1 to 3,

[0189] Y 201 and Y 202 Represents -OR independentlyY101 、-NR Y102 R Y103 or -SR Y104 , R Y101 ~R Y104 Each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, and R Y102 With R Y103 They may be bonded via a single bond or a divalent linking group to form a ring,

[0190] Ar 201 With X 201 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0191] Ar 201 With Y 201 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0192] Ar 202 With X 202 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0193] Ar 202 With Y 202 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0194] Z 2 represents the counter ion,

[0195] p2 represents an integer from 0 to 5,

[0196] q2 represents an integer from 1 to 5.

[0197] L in formula (2) 201 , L 202 , L 203 , X 203 , Y 201 , Y 202 , Z 2 , q2, p2 and L in formula (1) 101 , L 102 , L 103 , X 103 , Y 101 , Y 102 , Z 1 , q1, and p1 have the same meanings and the same preferred ranges.

[0198] R in formula (2) X111 and R X112 The substituent represented by can be exemplified as R in formula (1): X101 The preferred ranges of the substituents are the same as those described above.X111 and R X112 Preferred is a hydrogen atom.

[0199] L in formula (2) 204 and L 205 Each independently represents a sulfur atom or -X 104 =X 105 -, preferably a sulfur atom. 104 and X 105 X in formula (1) 104 and X 105 The meanings are the same, and the preferred ranges are also the same.

[0200] Ar in formula (2) 201 and Ar 202 Respectively independently represent -(CR Ar201 =CR Ar202 ) n201 -, an arylene group, a heterocyclic group or a group formed by combining two or more of these groups, R Ar201 and R Ar202 R each independently represents a hydrogen atom or a substituent, and n201 represents an integer of 1 to 3. Ar201 , R Ar202 and n201 and R described in formula (1) Ar101 , R Ar102 and n101 have the same meanings and preferred ranges are also the same.

[0201] Ar in formula (2) 201 and Ar 202 Preferably, each independently is -(CR Ar201 =CR Ar202 ) n201 -, an arylene group, or a combination of these.

[0202] As a preferred embodiment, Ar 201 and Ar 202 Each independently represents an arylene group.

[0203] As another preferred embodiment, Ar 201 and Ar 202 Each independently is a combination of -(CR Ar201 =CR Ar202 ) n201 - and arylene groups. The above combination - (CR Ar201 =CR Ar202 ) n201 - and the arylene group are preferably *1 -(CR Ar201 =CR Ar202 ) n201 -Arylene-*2 .and, *2 Preferably, Y of formula (2) 201 or Y 202 The bonding key.

[0204] In formula (2), Ar 201 With X 201 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0205] Ar 201 With Y 201 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0206] Ar 202 With X 202 They may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring,

[0207] Ar 202 With Y 202 The rings may be bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring.

[0208] Examples of the divalent linking group include -CR Y121 R Y122 , -O-, -S-, and groups formed by combining two or more of these. Y121 and R Y122 Each independently represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group or a heteroaryl group. These groups may further have a substituent. As a substituent, the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenic unsaturated bonds, etc. can be cited.

[0209] The dye A1 is also preferably a dye (compound) represented by the formula (4). The dye (compound) represented by the formula (4) is also a compound of the present invention.

[0210] [Chemical formula 7]

[0211]

[0212] In the formula, Ar 401 represents an aryl or heteroaryl group,

[0213] R 401 ~R 404 each independently represents a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group,

[0214] R 405 and R 406 each independently represents an alkyl group, an aryl group, a heteroaryl group, an aryloxy group, a heteroaryloxy group, an alkoxy group or a cyano group,

[0215] R 407 and R 408 each independently represents an alkyl group or an aryl group,

[0216] n401 and n402 each independently represent an integer of 0 to 4,

[0217] q4 means 1 or 2,

[0218] Z 4 It represents a q4-valent counter anion.

[0219] Ar 401 The number of carbon atoms of the aryl group represented is preferably 6 to 20, more preferably 6 to 12. Furthermore, the aryl group is preferably a monocyclic aryl group.

[0220] Ar 401 The heteroaryl represented by is preferably a 5-membered ring or a 6-membered ring. The heteroatom constituting the ring of the heteroaryl is preferably an oxygen atom, a nitrogen atom, and a sulfur atom. The number of heteroatoms constituting the ring of the heteroaryl is preferably 1 to 3.

[0221] The aryl group and heteroaryl group may further have a substituent. As the substituent, there may be mentioned the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenically unsaturated bonds, etc. As the groups containing ethylenically unsaturated bonds, there may be mentioned vinyl, (meth)allyl, (meth)acryloyl, etc.

[0222] Ar 401 It is preferably an aryl group, more preferably a monocyclic aryl group, further preferably a monocyclic aryl group having a substituent, and particularly preferably a monocyclic aryl group having a substituent at the ortho position. As the substituent, there can be mentioned the groups mentioned in the substituent T described later, the groups containing anions described later, the groups containing ethylenically unsaturated bonds, etc., preferably an alkyl group, a sulfo group, a carboxyl group, a salt of a carboxyl group, a salt of a sulfo group, the groups containing anions described later, or the groups containing ethylenically unsaturated bonds.

[0223] R 401 ~R 404 Each independently represents a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group, and is preferably an alkyl group or an aryl group.

[0224] R 401 ~R 404 The number of carbon atoms of the alkyl group represented is preferably 1 to 10, more preferably 1 to 6, and further preferably 1 to 4. The alkyl group may be any of a linear, branched, and cyclic group. The alkyl group may further have a substituent. As the substituent, there may be mentioned the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenically unsaturated bonds, and the like.

[0225] R 401 ~R 404The number of carbon atoms of the aryl group represented is preferably 6 to 20, more preferably 6 to 12. Furthermore, the aryl group is preferably a monocyclic aryl group. The aryl group may further have a substituent. Examples of the substituent include the groups listed in the substituent T described below, the groups containing anions described below, and the groups containing ethylenically unsaturated bonds.

[0226] R 401 ~R 404 The heteroaryl represented is preferably a 5-membered ring or a 6-membered ring. The heteroatoms constituting the heteroaryl ring are preferably oxygen atoms, nitrogen atoms and sulfur atoms. The number of heteroatoms constituting the heteroaryl ring is preferably 1 to 3. The heteroaryl group may further have a substituent. As the substituent, there may be mentioned the groups listed in the substituent T described later, the groups containing anions described later, the groups containing ethylenically unsaturated bonds, etc.

[0227] R 405 and R 406 Each independently represents an alkyl group, an aryl group, a heteroaryl group, an aryloxy group, a heteroaryloxy group, an alkoxy group or a cyano group.

[0228] n401 and n402 each independently represent an integer of 0 to 4, preferably an integer of 0 to 2, more preferably 0 or 1, and further preferably 0.

[0229] As Z 4 Examples of the q4-valent counter anions represented by include the above-mentioned counter anions.

[0230] The dye A1 is also preferably a dye (compound) represented by formula (5). The dye (compound) represented by formula (5) is also a compound of the present invention.

[0231] [Chemical formula 8]

[0232]

[0233] In the formula, Ar 501 represents an aryl or heteroaryl group,

[0234] R 501 ~R 504 each independently represents a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group,

[0235] R 505 and R 506 each independently represents an alkyl group, an aryl group, a heteroaryl group, an aryloxy group, a heteroaryloxy group, an alkoxy group or a cyano group,

[0236] n 501 and n 502 Each independently represents an integer from 0 to 4,

[0237] q5 means 1 or 2,

[0238] Z 5 It represents a q5-valent counter anion.

[0239] Ar in formula (5) 501 , R 501 ~R 506 、n 501 、n 502 , q5 and Z 5 With Ar in formula (4) 401 , R 401 ~R 406 、n 401 、n 402 , q4 and Z 4 The meanings are the same, and the preferred ranges are also the same.

[0240] - Pigment polymer A2-

[0241] The specific infrared absorbing dye may be a dye multimer A2 (hereinafter also simply referred to as a dye multimer) containing two or more dye structures derived from the dye A1 in one molecule.

[0242] Examples of pigment polymers include pigment polymers having repeating units represented by formula (A) (hereinafter also referred to as pigment polymers (A)), pigment polymers having repeating units represented by formula (C) (hereinafter also referred to as pigment polymers (C)), and pigment polymers represented by formula (D) (hereinafter also referred to as pigment polymers (D)), preferably pigment polymers (A) or pigment polymers (D).

[0243] (Pigment polymer (A))

[0244] Pigment multimer (A) comprises the repeating unit represented by formula (A).The ratio of the repeating unit represented by formula (A) is preferably more than 10 mass % of all repeating units constituting pigment multimer (A), more preferably more than 20 mass %, further preferably more than 30 mass %, especially preferably more than 50 mass %.The upper limit can be set to below 100 mass %, also can be set to below 95 mass %.

[0245] [Chemical formula 9]

[0246]

[0247] In formula (A), A 1 represents a trivalent linking group,

[0248] L 1 represents a single bond or a divalent connecting group,

[0249] DyeI represents a dye structure derived from the above-mentioned dye A1.

[0250] As A of formula (A)1 Examples of the trivalent linking group represented include poly(meth)acrylic acid-based linking groups, polyalkyleneimine-based linking groups, polyester-based linking groups, polyurethane-based linking groups, polyurea-based linking groups, polyamide-based linking groups, polyether-based linking groups, polystyrene-based linking groups, bisphenol-based linking groups, and novolac-based linking groups, and poly(meth)acrylic acid-based linking groups are preferred.

[0251] L in formula (A) 1 represents a single bond or a divalent linking group. Examples of the divalent linking group include an alkylene group, an arylene group, a heterocyclic group, -CH=CH-, -O-, -S-, -CO-, -COO-, -NR-, -CONR-, -OCO-, -SO-, -SO2-, and a linking group formed by connecting two or more of these. R represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group.

[0252] The number of carbon atoms of the alkylene group is preferably 1 to 30. The upper limit is more preferably 25 or less, and further preferably 20 or less. The lower limit is more preferably 2 or more, and further preferably 3 or more. The alkylene group may be linear, branched, or cyclic. The alkylene group may have a substituent or may be unsubstituted.

[0253] The number of carbon atoms in the arylene group is preferably 6 to 20, more preferably 6 to 12. The arylene group may have a substituent or may be unsubstituted.

[0254] The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The heteroatom constituting the ring of the heterocyclic group is preferably an oxygen atom, a nitrogen atom and a sulfur atom. The number of heteroatoms constituting the ring of the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent or may be unsubstituted.

[0255] L 1 It is preferably an alkylene group, an arylene group, -NH-, -CO-, -O-, -COO-, -OCO-, -S-, or a linking group formed by combining two or more of these, and more preferably a linking group formed by combining at least one selected from an alkylene group and an arylene group with one or more selected from -O-, -COO-, -OCO-, and -S-. 1 The divalent linking group represented is also preferably a group containing -S- or -O-.

[0256] L 1 In the connection between DyeI and A 1 The number of atoms in the chain is preferably 2 or more, more preferably 3 or more. The upper limit can be set to, for example, 30 or less, or 25 or less.

[0257] The dye structure derived from the dye A1 represented by DyeI of formula (A) is preferably a residue obtained by removing one hydrogen atom from the dye (dye A1) represented by formula (1) above.

[0258] Furthermore, it is preferred that X in formula (1) 101 ~X 103 , L 101 ~L 103 ,Ar 101 ,Ar 102 , Y 101 , Y 102 Any part of the formula (A) contains L 1 The connecting part is more preferably X of formula (1) 103 Containing L of formula (A) 1 The connection part.

[0259] Pigment polymer (A) can also comprise other repeating units except comprising the repeating unit represented by formula (A).Other repeating units can enumerate the repeating unit with polymerizable group, the repeating unit with acid group etc.As polymerizable group, can enumerate the group containing ethylenic unsaturated bond etc. such as vinyl, (methyl) allyl, (methyl) acryloyl etc.As acid group, can enumerate carboxyl, sulfo group, phosphate group etc.

[0260] The ratio of the repeating unit with polymerizable group is preferably below 50 mass % of all repeating units constituting the pigment multimer (A). The lower limit is preferably above 1 mass %, more preferably above 3 mass %. The upper limit is preferably below 35 mass %, more preferably below 30 mass %.

[0261] The ratio of the repeating unit with acid group is preferably below 50 mass % of all repeating units constituting the pigment polymer (A). The lower limit is preferably above 1 mass %, more preferably above 3 mass %. The upper limit is preferably below 35 mass %, more preferably below 30 mass %.

[0262] Pigment multimer (A) can be synthesized by the following method: (1) by addition polymerization, there is the method for synthesizing the pigment A1 of polymerizable group, (2) making the polymer with high reactive functional groups such as isocyanate group, anhydride group or epoxy group and the pigment A1 with the functional group (hydroxyl, primary or secondary amino group, carboxyl group etc.) that can react with high reactive functional groups react etc. In addition polymerization, known addition polymerization (free radical polymerization, anionic polymerization, cationic polymerization) can be applied, wherein, especially by free radical polymerization, synthesizing can make reaction conditions mild, can not decompose pigment skeleton, therefore preferably. Known reaction conditions can be applied in free radical polymerization. Consider from the viewpoint of heat resistance, pigment multimer (A) is preferably a free radical polymer obtained by free radical polymerization using the pigment A1 with ethylenically unsaturated bond.

[0263] (Pigment polymer (C))

[0264] Pigment multimer (C) comprises the repeating unit represented by formula (C).The ratio of the repeating unit represented by formula (C) is preferably more than 10 mass % of all repeating units constituting pigment multimer (C), more preferably more than 20 mass %, further preferably more than 30 mass %, especially preferably more than 50 mass %.The upper limit can be set to below 100 mass %, also can be set to below 95 mass %.

[0265] [Chemical formula 10]

[0266]

[0267] In formula (C), L 3 represents a single bond or a divalent connecting group,

[0268] DyeIII represents a pigment structure derived from the above-mentioned pigment A1,

[0269] m represents 0 or 1.

[0270] L in formula (C) 3 represents a single bond or a divalent linking group. Examples of the divalent linking group include an alkylene group, an arylene group, a heterocyclic group, -CH=CH-, -O-, -S-, -CO-, -COO-, -NR-, -CONR-, -OCO-, -SO-, -SO2-, and a linking group formed by connecting two or more of these. R each independently represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group.

[0271] The number of carbon atoms in the alkyl group and the alkylene group is preferably 1 to 30. The upper limit is more preferably 25 or less, and further preferably 20 or less. The lower limit is more preferably 2 or more, and further preferably 3 or more. The alkyl group and the alkylene group may be linear, branched, or cyclic.

[0272] The aryl group and the arylene group preferably have 6 to 20 carbon atoms, and more preferably 6 to 12 carbon atoms.

[0273] The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The heteroatom constituting the ring of the heterocyclic group is preferably an oxygen atom, a nitrogen atom, and a sulfur atom. The number of heteroatoms constituting the ring of the heterocyclic group is preferably 1 to 3.

[0274] The alkylene group, arylene group, heterocyclic group, alkyl group and aryl group may be unsubstituted or may have a substituent. Examples of the substituent include the groups exemplified in the substituent T described below, polymerizable groups and acid groups.

[0275] L in formula (C) 3 Preferred are an alkylene group, an arylene group, -NH-, -CO-, -O-, -COO-, -OCO-, -S-, -SO2-, and a linking group formed by combining two or more of these.

[0276] The dye structure derived from the dye A1 represented by DyeIII of formula (C) is preferably a residue obtained by removing two hydrogen atoms from the dye (dye A1) represented by formula (1) above.

[0277] Furthermore, X in formula (1) 101 ~X 103 , L 101 ~L 103 ,Ar 101 ,Ar 102 , Y 101 , Y 102 Any part of the formula (A) preferably contains L 1 The connection part.

[0278] In formula (C), m represents 0 or 1, and 1 is preferred.

[0279] The dye multimer (C) may contain other repeating units described in the dye multimer (A) in addition to the repeating unit represented by the general formula (C).

[0280] (Pigment polymer (D))

[0281] The pigment multimer (D) is a compound represented by the formula (D).

[0282] [Chemical formula 11]

[0283]

[0284] In formula (D), L 4 represents a (n+k)-valent connecting group,

[0285] n represents an integer from 2 to 20,

[0286] k represents an integer from 0 to 20,

[0287] DyeIV represents a pigment structure derived from the above-mentioned pigment A1,

[0288] P 4 represents a substituent,

[0289] n DyeIVs can be different from each other.

[0290] When k is greater than 2, multiple P 4 Can be different from each other,

[0291] n+k represents an integer from 2 to 20.

[0292] In formula (D), n is preferably 2-14, more preferably 2-8, particularly preferably 2-7, and even more preferably 2-6.

[0293] k in formula (D) is preferably 0 to 13. The lower limit may be 1 or more, or 2 or more. The upper limit is preferably 10 or less, more preferably 8 or less, further preferably 7 or less, and further preferably 6 or less.

[0294] As L in formula (D) 4 The (n+k)-valent linking group represented by the present invention includes a group consisting of 1 to 100 carbon atoms, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 200 hydrogen atoms, and 0 to 20 sulfur atoms. As the (n+k)-valent linking group, the following structural unit or the following structural unit is preferably a group consisting of two or more combinations (which can form a ring structure). In the following formula, * represents a bonding bond.

[0295] [Chemical formula 12]

[0296]

[0297] L 4 The (n+k)-valent linking group represented is preferably a linking group derived from a polyfunctional thiol, a linking group derived from a polyfunctional alcohol, or a linking group derived from an acid anhydride, and more preferably a linking group derived from a polyfunctional thiol.

[0298] L 4 The (n+k)-valent linking group represented is preferably a group represented by any one of formulae (Za-1) to (Za-5).

[0299] [Chemical formula 13]

[0300]

[0301] In formula (Za-1), La 2 Represents a divalent group, Ta 2 Represents a single bond or a divalent linking group, and there are 2 Ta 2 They can be the same as each other or different from each other.

[0302] In formula (Za-2), La 3 Indicates a 3-valent group, Ta 3 Represents a single bond or a divalent linking group, and there are 3 Ta 3 They can be the same as each other or different from each other.

[0303] In formula (Za-3), La 4 Represents a 4-valent group, Ta 4 Represents a single bond or a divalent linking group, and there are 4 Ta 4 They can be the same as each other or different from each other.

[0304] In formula (Za-4), La 5 Indicates a 5-valent group, Ta5 Represents a single bond or a divalent linking group, and there are 5 Ta 5 They can be the same as each other or different from each other.

[0305] In formula (Za-5), La 6 Indicates a hexavalent group, Ta 6 Represents a single bond or a divalent linking group, and there are 6 Ta 6 They can be the same as each other or different from each other.

[0306] In the above formula, * represents a bonding bond.

[0307] As La 2 、 2 ~Ta 6 The divalent linking group represented by the above-mentioned group includes an alkylene group, an arylene group, a heterocyclic group, -CH=CH-, -O-, -S-, -CO-, -COO-, -NR-, -CONR-, -OCO-, -SO-, -SO2-, and a linking group formed by connecting two or more of these. R independently represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group.

[0308] The number of carbon atoms in the alkyl group and the alkylene group is preferably 1 to 30. The upper limit is more preferably 25 or less, and further preferably 20 or less. The lower limit is more preferably 2 or more, and further preferably 3 or more. The alkyl group and the alkylene group may be linear, branched, or cyclic.

[0309] The aryl group and the arylene group preferably have 6 to 20 carbon atoms, and more preferably 6 to 12 carbon atoms.

[0310] The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The heteroatom constituting the ring of the heterocyclic group is preferably an oxygen atom, a nitrogen atom, and a sulfur atom. The number of heteroatoms constituting the ring of the heterocyclic group is preferably 1 to 3.

[0311] The alkylene group, arylene group, heterocyclic group, alkyl group and aryl group may be unsubstituted or may have a substituent. Examples of the substituent include the groups exemplified in the substituent T described below, polymerizable groups and acid groups.

[0312] As La 3 The trivalent group represented by can be a group obtained by removing one hydrogen atom from the above-mentioned divalent linking group. 4 The tetravalent group represented by can be a group obtained by removing two hydrogen atoms from the above-mentioned divalent linking group. 5 The pentavalent group represented by can be a group obtained by removing three hydrogen atoms from the above-mentioned divalent linking group. 6 The hexavalent group represented by can be a group obtained by removing four hydrogen atoms from the above-mentioned divalent linking group. 3 ~La6 The tri- to hexa-valent groups represented may have the above-mentioned substituents.

[0313] Specific examples of the (n+k)-valent linking group include the linking group described in paragraphs 0071 to 0072 of JP-A-2008-222950, ​​the linking group described in paragraph 0176 of JP-A-2013-029760, and the linking group described in paragraphs 0022 to 0024 of International Publication No. 2016 / 031442.

[0314] The dye structure derived from the dye A1 represented by DyeIV of formula (D) is preferably a residue obtained by removing one hydrogen atom from the dye (dye A1) represented by formula (1) above.

[0315] Furthermore, it is preferred that X in formula (1) 101 ~X 103 , L 101 ~L 103 ,Ar 101 ,Ar 102 , Y 101 , Y 102 Any part of the formula (A) contains L 1 The connecting part is more preferably X of formula (1) 103 Containing L of formula (A) 1 The connection part.

[0316] As P of formula (D) 4 The substituent represented by may include the groups listed in the substituent T described later, an acid group, a polymerizable group, and the like. 4 The substituent represented by may be a monovalent polymer chain having a repeating unit. As the monovalent polymer chain having a repeating unit, a monovalent polymer chain having a repeating unit derived from a vinyl compound is preferred. When k is 2 or more, k P 4 It can be the same or different.

[0317] P 4 is a monovalent polymer chain having a repeating unit, and when k is 1, preferably P 4 is a monovalent polymer chain having 2 to 20 (preferably 2 to 15, more preferably 2 to 10) repeating units derived from a vinyl compound. 4 When k is a monovalent polymer chain having a repeating unit and k is 2 or more, k P 4 The average value of the number of repeating units derived from the vinyl compound in the is preferably 2 to 20 (preferably 2 to 15, more preferably 2 to 10).

[0318] P 4In the case of a monovalent polymer chain having repeating units, the number of repeating units and the average number of repeating units can be determined by nuclear magnetic resonance (NMR).

[0319] P 4 When it is a monovalent polymer chain having repeating units, as the constituent P 4 The repeating unit may include other repeating units described in the description of the above-mentioned dye multimer (A). Other repeating units preferably have one or more selected from the repeating units having an acid group and the repeating units having a polymerizable group.

[0320] P 4 When repeating units having an acid group are included, the ratio of repeating units having an acid group to P 4 The content of all repeating units is preferably 10 to 80 mol %, more preferably 10 to 65 mol %.

[0321] P 4 When the repeating unit having a polymerizable group is included, the ratio of the repeating unit having a polymerizable group to P 4 The content of all repeating units is preferably 10 to 80 mol %, more preferably 10 to 65 mol %.

[0322] -Substituent T-

[0323] The substituent T includes the following groups: halogen atom (e.g., fluorine atom, chlorine atom, bromine atom, iodine atom), alkyl group (preferably alkyl group having 1 to 30 carbon atoms), alkenyl group (preferably alkenyl group having 2 to 30 carbon atoms), alkynyl group (preferably alkynyl group having 2 to 30 carbon atoms), aryl group (preferably aryl group having 6 to 30 carbon atoms), amino group (preferably amino group having 0 to 30 carbon atoms), alkoxy group (preferably alkoxy group having 1 to 30 carbon atoms), aryloxy group (preferably aryloxy group having 6 to 30 carbon atoms), heteroaryloxy group, acyl group; (preferably an acyl group having 2 to 30 carbon atoms), an alkoxycarbonyl group (preferably an alkoxycarbonyl group having 2 to 30 carbon atoms), an aryloxycarbonyl group (preferably an aryloxycarbonyl group having 7 to 30 carbon atoms), a heteroaryloxycarbonyl group, an acyloxy group (preferably an acyloxy group having 2 to 30 carbon atoms), an acylamino group (preferably an acylamino group having 2 to 30 carbon atoms), an alkoxycarbonylamino group (preferably an alkoxycarbonylamino group having 2 to 30 carbon atoms), an aryloxycarbonylamino group (preferably an aryloxycarbonyl group having 7 to 30 carbon atoms), alkylamino), sulfonamide (preferably sulfonamide having 0 to 30 carbon atoms), carbamoyl (preferably carbamoyl having 1 to 30 carbon atoms), alkylthio (preferably alkylthio having 1 to 30 carbon atoms), arylthio (preferably arylthio having 6 to 30 carbon atoms), heteroarylthio (preferably having 1 to 30 carbon atoms), alkylsulfonyl (preferably having 1 to 30 carbon atoms), arylsulfonyl (preferably having 6 to 30 carbon atoms), heteroarylsulfonyl (preferably having 1 to 30 carbon atoms), ), alkylsulfinyl group (preferably having 1 to 30 carbon atoms), arylsulfinyl group (preferably having 6 to 30 carbon atoms), heteroarylsulfinyl group (preferably having 1 to 30 carbon atoms), urea group (preferably having 1 to 30 carbon atoms), hydroxyl group, carboxyl group, carboxyl salt, sulfo group, sulfo salt, phosphate group, phosphate salt, carboxylic acid amide group, sulfonic acid amide group, imidic acid group, mercapto group, cyano group, alkylsulfinyl group, arylsulfinyl group, hydrazine group, imino group, heteroaryl group (preferably having 1 to 30 carbon atoms). In the salt of carboxyl group, the salt of sulfonyl group and the salt of phosphate group, examples of the atom or atomic group constituting the salt include alkali metal ion (Li + 、Na + , K + etc.), alkaline earth metal ions (Ca 2+ Mg 2+ The present invention also includes alkyl ions (such as tetraalkyl ammonium ions, trialkyl ammonium ions, etc.), imidazolium ions, pyridinium ions (pyridinium ions, N-methylpyridinium ions, and N-ethylpyridinium ions), phosphonium ions, etc. When these groups are further substituted groups, they may further have a substituent. As the substituent, the groups described in the substituent T above can be cited.

[0324] -Groups containing anions-

[0325] Examples of the group containing an anion include a group represented by the formula (P-1) and a group represented by the formula (P-2).

[0326] [Chemical formula 14]

[0327] *-Lp 1 -Xp 1 (P-1)

[0328]

[0329] Lp of formula (P-1) 1 Represents a single bond or a divalent linking group. 1 Examples of the divalent linking group represented by include an alkylene group having 1 to 6 carbon atoms, an arylene group having 6 to 12 carbon atoms, -NR Lp1 -, -O-, -S-, -CO-, -SO2- or a group consisting of a combination of these. At least a portion of the hydrogen atoms of the above-mentioned alkylene group is preferably substituted by a fluorine atom, and more preferably a perfluoroalkylene group. As specific examples of such alkylene groups, difluoromethylene, tetrafluoroethylene, hexafluoropropylene, etc. can be cited. At least a portion of the hydrogen atoms of the above-mentioned arylene group is preferably substituted by a fluorine atom. As specific examples of such arylene groups, tetrafluorophenylene, hexafluoro-1-naphthylene, hexafluoro-2-naphthylene, etc. can be cited.

[0330] Lp of formula (P-1) 1 Preferably, a single bond, -NR Lp1 -, -SO2 and an alkylene group containing a fluorine atom, a group consisting of a combination of -O- and an arylene group containing a fluorine atom, or -NR Lp1 A group consisting of a combination of -, -SO2 and an alkylene group containing a fluorine atom.

[0331] Xp of formula (P-1) 1 Represents -SO3 - 、-COO - ,-PO4H - or an anion containing a boron atom, preferably -SO3 - or -COO - .

[0332] Lp of formula (P-2) 2 represents a single bond or a divalent linking group, preferably a single bond. 2 Examples of the divalent linking group represented by include an alkylene group having 1 to 6 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -S-, or a group consisting of a combination of these.

[0333] Lp of formula (P-2) 3 It represents -SO2- or -CO-, preferably -SO2-.

[0334] G in formula (P-2) represents a carbon atom or a nitrogen atom, and is preferably a nitrogen atom.

[0335] In the formula (P-2), n represents 2 when G is a carbon atom, and represents 1 when G is a nitrogen atom.

[0336] Rp of formula (P-2) 1 represents an alkyl group containing a fluorine atom or an aryl group containing a fluorine atom. When n is 2, two Rp 1 They can be the same or different. 1 The number of carbon atoms in the fluorine-containing alkyl group represented by is preferably 1 to 10, more preferably 1 to 6, and still more preferably 1 to 3. 1 The number of carbon atoms of the fluorine-containing aryl group represented is preferably 6 to 20, more preferably 6 to 14, and even more preferably 6 to 10. The fluorine-containing alkyl group and the fluorine-containing aryl group may further have a substituent. Examples of the substituent include the groups listed in the substituent T above.

[0337] From the viewpoint of preventing the decomposition of the pigment A1 caused by single electron reduction or nucleophilic agent, it is preferred that the LUMO (Lowest Unoccupied Molecular Orbital: minimum unoccupied molecular orbital) energy level of pigment A1 is high. The LUMO energy level of pigment A1 is preferably more than-6.5eV, more preferably more than-6.0eV, further preferably more than-5.5eV. The LUMO energy level of pigment A1 can for example be obtained as follows: for the structure of the cationic part of pigment A1, using quantum chemical calculation program Gaussian09, under universal function B3LYP / basis function 6-31g (d) / vacuum condition, implement structure optimization calculation.

[0338] -About specific examples-

[0339] As a specific example of a specific infrared absorbing pigment, the compound of the structure shown below can be enumerated. As a specific example of a specific compound, the resonance structure of these compounds can also be enumerated. In the structural formula shown below, Bu represents a butyl group, and Ph represents a phenyl group.

[0340] [Chemical formula 15]

[0341]

[0342] [Chemical formula 16]

[0343]

[0344] [Chemical formula 17]

[0345]

[0346] [Chemical formula 18]

[0347]

[0348] [Chemical formula 19]

[0349]

[0350] [Chemical formula 20]

[0351]

[0352] [Chemical formula 21]

[0353]

[0354] [Chemical formula 22]

[0355]

[0356] [Chemical formula 23]

[0357]

[0358] [Chemical formula 24]

[0359]

[0360] The compound represented by formula (4) can be synthesized, for example, by a known method according to the following synthesis scheme. Synthesis conditions such as the type and amount of the solvent, catalyst, reagent used, and reaction time and reaction temperature can be adjusted appropriately.

[0361] [Chemical formula 25]

[0362]

[0363] [Chemical formula 26]

[0364]

[0365] [Chemical formula 27]

[0366]

[0367] [Chemical formula 28]

[0368]

[0369] Compound 4A is reacted with a brominating agent such as N-bromosuccinimide (NBS) to obtain compound 4B. Then, bispinacolato borate is reacted in the presence of a palladium catalyst to obtain 4C in which bromine is replaced by boron.

[0370] Compound 4D synthesized by a known method is subjected to lithiation of the bromine site with an alkyl lithium and then reacted with a dichlorosilane compound to obtain compound 4E. Compound 4E is reacted with an alkyl lithium and then with 1,2-dibromo-1,1,2,2-tetrachloroethane to obtain compound 4F.

[0371] Compound 4C is reacted with compound 4F in the presence of a palladium catalyst (Suzuki-Miyaura reaction conditions) to obtain compound 4G. Compound 4G is reacted under acidic conditions to deprotect the acetal site, thereby synthesizing compound 4H.

[0372] Compound 4H is reacted with a Grignard reagent to obtain Compound 4I, and then reacted under acidic conditions to obtain Compound 4J.

[0373] By reacting compound 4J with a salt compound having a target anion, a compound represented by formula (4) in which a chloride anion is replaced with the target anion can be obtained.

[0374] The compound represented by formula (5) was synthesized in the same manner as in the synthesis step of compound 4E in synthesizing the compound represented by formula (4), except that thionyl chloride was used instead of the dichlorosilane compound.

[0375] The maximum absorption wavelength of the specific infrared absorbing pigment is preferably within the wavelength range of 700 to 1800 nm, more preferably within the wavelength range of 1000 to 1800 nm, further preferably within the wavelength range of 1030 to 1750 nm, further preferably within the wavelength range of 1050 to 1700 nm, and further preferably within the wavelength range of 1070 to 1650 nm.

[0376] Absorbance A of a specific infrared absorbing pigment at the maximum absorption wavelength max Absorbance A at the wavelength of maximum absorption wavelength + 200nm max+200 A max+200 / A max It is preferably 4.5 or more, more preferably 10 or more, and still more preferably 30 or more. For example, the upper limit is preferably 90 or less. According to this aspect, an optical filter having an excellent contrast between infrared transmittance and light shielding properties can be formed.

[0377] In the total solids component of resin combination, the content of specific infrared absorbing pigment is preferably more than 1 mass %, more preferably more than 2 mass %, further preferably more than 5 mass %.The upper limit of the content of specific infrared absorbing pigment is preferably below 50 mass %, more preferably below 40 mass %, further preferably below 30 mass %.Resin combination can only include 1 specific infrared absorbing pigment, can also include more than 2 kinds.When including more than 2 kinds, preferably these total amount is in the above range.

[0378] 《Other infrared absorbers》

[0379] The resin composition of the present invention may contain an infrared absorber (other infrared absorber) other than the above-mentioned specific infrared absorbing pigment. By further containing other infrared absorbers, a film capable of shielding infrared rays in a wider wavelength range can be formed. Other infrared absorbers may be dyes or pigments.

[0380] The maximum absorption wavelength of other infrared absorbers is preferably within the range of 700 to 1800 nm, more preferably within the range of 1000 to 1800 nm, further preferably within the range of 1030 to 1750 nm, further preferably within the range of 1050 to 1700 nm, and further preferably within the range of 1070 to 1650 nm.

[0381] Furthermore, it is preferred that the maximum absorption wavelength of the other infrared absorbing agent exists on the shorter wavelength side than the maximum absorption wavelength of the specific infrared absorbing dye.

[0382] Furthermore, from the perspective of being able to form a film that can shield infrared rays in a wider wavelength range, the difference between the maximum absorption wavelength of the other infrared absorber and the maximum absorption wavelength of the above-mentioned specific infrared absorbing pigment is preferably 50 to 1000 nm. The upper limit is preferably 800 nm or less, more preferably 500 nm or less. The lower limit is preferably 100 nm or more, more preferably 150 nm or more.

[0383] Other infrared absorbers include pyrrolopyrrole compounds, polymethine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, crotonate compounds, oxocyanine compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiol metal complexes, metal oxides, and metal borides.

[0384] As other infrared absorbers, polymethine compounds, squarylium compounds, and oxonol compounds can be preferably used. Generally, these compounds tend to have low heat resistance and light resistance, but it is estimated that by using the above-mentioned specific infrared absorbing pigment at the same time, they are adsorbed on the association of the above-mentioned specific infrared absorbing pigment or form an association with the above-mentioned specific infrared absorbing pigment during film formation, and since a film with excellent light resistance and heat resistance can be formed, the effect of the present invention is more significantly exerted.

[0385] Examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614, compounds described in paragraphs 0037 to 0052 of JP-A-2011-068731, and compounds described in paragraphs 0010 to 0033 of International Publication No. 2015 / 166873. Examples of the squaric acid compound include compounds described in paragraphs 0044 to 0049 of Japanese Patent Application Publication No. 2011-208101, compounds described in paragraphs 0060 to 0061 of Japanese Patent Application No. 6065169, compounds described in paragraph 0040 of International Publication No. 2016 / 181987, compounds described in Japanese Patent Application Publication No. 2015-176046, and compounds described in paragraph 0072 of International Publication No. 2016 / 190162. , compounds described in paragraphs 0196 to 0228 of Japanese Patent Application Publication No. 2016-074649, compounds described in paragraph 0124 of Japanese Patent Application Publication No. 2017-067963, compounds described in International Publication No. 2017 / 135359, compounds described in Japanese Patent Application Publication No. 2017-114956, compounds described in Japanese Patent No. 6197940, compounds described in International Publication No. 2016 / 120166, etc. Examples of the polymethine compound include compounds described in paragraphs 0044 to 0045 of Japanese Patent Application Laid-Open No. 2009-108267, compounds described in paragraphs 0026 to 0030 of Japanese Patent Application Laid-Open No. 2002-194040, compounds described in Japanese Patent Application Laid-Open No. 2015-172004, compounds described in Japanese Patent Application Laid-Open No. 2015-172102, compounds described in Japanese Patent Application Laid-Open No. 2008-088426, compounds described in paragraph 0090 of International Publication No. 2016 / 190162, compounds described in Japanese Patent Application Laid-Open No. 2017-031394, etc. Examples of the crotonic acid compound include compounds described in Japanese Patent Application Laid-Open No. 2017-082029. Examples of the iminium compound include compounds described in JP-A-2008-528706, compounds described in JP-A-2012-012399, compounds described in JP-A-2007-092060, and compounds described in paragraphs 0048 to 0063 of International Publication No. 2018 / 043564.As phthalocyanine compounds, compounds described in paragraph 0093 of Japanese Patent Publication No. 2012-077153, phthalocyanine titanium oxide described in Japanese Patent Publication No. 2006-343631, compounds described in paragraphs 0013 to 0029 of Japanese Patent Publication No. 2013-195480, vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, and compounds described in International Publication No. 2020 / 071470 can be cited. As naphthalocyanine compounds, compounds described in paragraph 0093 of Japanese Patent Publication No. 2012-077153 can be cited. As disulfide metal complexes, compounds described in Japanese Patent No. 5733804 can be cited. As metal oxides, for example, indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, tungsten oxide, etc. can be cited. For details of tungsten oxide, reference can be made to paragraph 0080 of Japanese Patent Publication No. 2016-006476, which is incorporated into this specification. As metal borides, lanthanum boride and the like can be cited. As commercially available products of lanthanum boride, LaB6-F (manufactured by Japan New Metals Co., Ltd.) and the like can be cited. In addition, as metal borides, compounds described in International Publication No. 2017 / 119394 can also be used. As commercially available products of indium tin oxide, F-ITO (manufactured by DOWA HIGHTECH CO., LTD.) and the like can be cited.

[0386] As other infrared absorbers, the squaric acid compounds described in Japanese Patent Application Laid-Open No. 2017-197437, the squaric acid compounds described in Japanese Patent Application Laid-Open No. 2017-025311, the squaric acid compounds described in International Publication No. 2016 / 154782, the squaric acid compounds described in Japanese Patent No. 5884953, the squaric acid compounds described in Japanese Patent No. 6036689, The squaryl acid compound described in Japanese Patent No. 5810604, the squaryl acid compound described in paragraphs 0090 to 0107 of International Publication No. 2017 / 213047, the pyrrole ring-containing compound described in paragraphs 0019 to 0075 of Japanese Patent Application Laid-Open No. 2018-054760, the pyrrole ring-containing compound described in paragraphs 0078 to 0082 of Japanese Patent Application Laid-Open No. 2018-040955, the The pyrrole ring-containing compound described in paragraphs 0043 to 0069 of Japanese Patent Publication No. 2018-002773, the squarylium compound having an aromatic ring at the amide α position described in paragraphs 0024 to 0086 of Japanese Patent Publication No. 2018-041047, the amide-linked squarylium compound described in Japanese Patent Publication No. 2017-179131, the pyrrole bi-type squarylium compound described in Japanese Patent Publication No. 2017-141215 Compounds having an acid skeleton or a croton acid skeleton, dihydrocarbazole bis-type square acid compounds described in Japanese Patent Application Laid-Open No. 2017-082029, asymmetric compounds described in paragraphs 0027 to 0114 of Japanese Patent Application Laid-Open No. 2017-068120, pyrrole ring-containing compounds (carbazole type) described in Japanese Patent Application Laid-Open No. 2017-067963, phthalocyanine compounds described in Japanese Patent Application No. 6251530, etc.

[0387] As other infrared absorbers, tungsten oxide represented by the following formula described in paragraph 0025 of European Patent No. 3628645 can also be used.

[0388] M 1 a M 2 b W c O d (P(O) n R m ) e

[0389] M 1 、M 2 represents an ammonium cation or a metal cation, a is 0.01 to 0.5, b is 0 to 0.5, c is 1, d is 2.5 to 3, e is 0.01 to 0.75, n is 1, 2 or 3, m is 1, 2 or 3, and R represents a hydrocarbon group which may have a substituent.

[0390] The content of other infrared absorbers is preferably 5 to 500 parts by mass relative to 100 parts by mass of the specific infrared absorbing pigment. The upper limit is preferably 200 parts by mass or less, more preferably 100 parts by mass or less. The lower limit is preferably 10 parts by mass or more, more preferably 15 parts by mass or more.

[0391] In the total solid content of resin combination, the total content of above-mentioned specific infrared absorbing pigment and other infrared absorbers is preferably more than 2 mass %, more preferably more than 5 mass %, further preferably more than 10 mass %.The upper limit of above-mentioned total content is preferably below 50 mass %, more preferably below 40 mass %, further preferably below 30 mass %.

[0392] Resin

[0393] The resin composition of the present invention contains a resin. The resin is mixed with the purpose of dispersing a pigment in the resin composition, for example, or the purpose of an adhesive. In addition, a resin mainly used for dispersing a pigment in a resin composition is also referred to as a dispersant. However, such a use of the resin is an example, and the resin can also be used for purposes other than such a use.

[0394] The weight average molecular weight of the resin is preferably 3000 to 2000000. The upper limit is preferably 1000000 or less, more preferably 500000 or less. The lower limit is preferably 4000 or more, more preferably 5000 or more.

[0395] As resin, (meth) acrylic resin, epoxy resin, ene-thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyphenylene resin, polyarylene ether phosphine oxide resin, polyimide resin, polyamide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, vinyl acetate resin, polyvinyl alcohol resin, polyvinyl acetal resin, polyurethane resin, polyurea resin etc. can be cited. Among these resins, one kind can be used alone, or two or more kinds can be mixed and used. As cyclic olefin resin, from the viewpoint of improving heat resistance, it is preferably norbornene resin. As commercial products of norbornene resin, for example, ARTON series (for example, ARTON F4520) made by JSR Corporation etc. can be cited. Furthermore, as the resin, the resin described in the embodiment of International Publication No. 2016 / 088645, the resin described in Japanese Patent Publication No. 2017-057265, the resin described in Japanese Patent Publication No. 2017-032685, the resin described in Japanese Patent Publication No. 2017-075248, the resin described in Japanese Patent Publication No. 2017-066240, the resin described in Japanese Patent Publication No. 2017-167513, the resin described in Japanese Patent Publication No. 2017-173787, the resin described in Japanese Patent Publication No. 2017-206689, etc. can also be used. The resins described in paragraphs 041 to 0060, the resins described in paragraphs 0022 to 0071 of Japanese Patent Publication No. 2018-010856, the blocked polyisocyanate resins described in Japanese Patent Publication No. 2016-222891, the resins described in Japanese Patent Publication No. 2020-122052, the resins described in Japanese Patent Publication No. 2020-111656, the resins described in Japanese Patent Publication No. 2020-139021, and the resins described in Japanese Patent Publication No. 2017-138503 containing structural units with ring structures in the main chain and structural units with biphenyl groups in the side chain. In addition, as a resin, a resin with a fluorene skeleton can also be preferably used. Regarding the resin with a fluorene skeleton, reference can be made to the description of U.S. Patent Application Publication No. 2017 / 0102610, which is incorporated into this specification. In addition, as the resin, the resin described in paragraphs 0199 to 0233 of Japanese Patent Application Publication No. 2020-186373, the alkali-soluble resin described in Japanese Patent Application Publication No. 2020-186325, the resin represented by Formula 1 described in Korean Patent Application Publication No. 10-2020-0078339, and the resin described in Japanese Patent Application Publication No. 2021-134350 can also be used.

[0396] As the resin, it is preferred to use a resin having an acid group. As the acid group, for example, a carboxyl group, a phosphoric acid group, a sulfonic group, a phenolic hydroxyl group, etc. can be cited. These acid groups can be only one kind, or can be two or more kinds. The resin having an acid group can also be used as a dispersant. The acid value of the resin having an acid group is preferably 30 to 500 mgKOH / g. The lower limit is preferably 50 mgKOH / g or more, and more preferably 70 mgKOH / g or more. The upper limit is preferably 400 mgKOH / g or less, more preferably 200 mgKOH / g or less, further preferably 150 mgKOH / g or less, and most preferably 120 mgKOH / g or less.

[0397] The resin is preferably a resin containing a repeating unit derived from a compound represented by the formula (ED1) and / or a compound represented by the formula (ED2) (hereinafter, these compounds may also be referred to as “ether dimers”).

[0398] [Chemical formula 29]

[0399]

[0400] In formula (ED1), R 1 and R 2 Each independently represents a hydrogen atom or an optionally substituted hydrocarbon group having 1 to 25 carbon atoms.

[0401] [Chemical formula 30]

[0402]

[0403] In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. Specific examples of formula (ED2) can be found in Japanese Unexamined Patent Application Publication No. 2010-168539.

[0404] For specific examples of the ether dimer, reference can be made to paragraph 0317 of JP-A-2013-029760, the contents of which are incorporated herein.

[0405] As the resin, it is also preferable to use a resin having a polymerizable group. The polymerizable group is preferably a group containing an ethylenically unsaturated bond and a cyclic ether group, and more preferably a group containing an ethylenically unsaturated bond.

[0406] As the resin, a resin containing a repeating unit derived from a compound represented by the formula (X) is also preferably used.

[0407] [Chemical formula 31]

[0408]

[0409] In the formula, R 1 represents a hydrogen atom or a methyl group, R21 and R 22 Each independently represents an alkylene group, and n represents an integer of 0 to 15. 21 and R 22 The number of carbon atoms of the alkylene group represented is preferably 1 to 10, more preferably 1 to 5, further preferably 1 to 3, and particularly preferably 2 or 3. n represents an integer of 0 to 15, preferably an integer of 0 to 5, more preferably an integer of 0 to 4, and further preferably an integer of 0 to 3.

[0410] Examples of the compound represented by formula (X) include ethylene oxide- or propylene oxide-modified (meth)acrylates of para-cumylphenol, and examples of commercially available products include ARONIX M-110 (manufactured by TOAGOSEI CO., LTD.).

[0411] The resin composition of the present invention preferably contains a resin as a dispersant. As the dispersant, an acidic dispersant (acidic resin) and an alkaline dispersant (alkaline resin) can be cited. Here, the acidic dispersant (acidic resin) refers to a resin in which the amount of acid groups is greater than the amount of alkaline groups. As an acidic dispersant (acidic resin), when the total amount of the amount of acid groups and the amount of alkaline groups is set to 100 mol%, a resin in which the amount of acid groups is 70 mol% or more is preferred. The acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably 10 to 105 mgKOH / g. In addition, an alkaline dispersant (alkaline resin) refers to a resin in which the amount of alkaline groups is greater than the amount of acid groups. As an alkaline dispersant (alkaline resin), when the total amount of the amount of acid groups and the amount of alkaline groups is set to 100 mol%, a resin in which the amount of alkaline groups exceeds 50 mol% or more is preferred. The basic group possessed by the alkaline dispersant is preferably an amino group.

[0412] The resin used as the dispersant is also preferably a grafted resin. For details of the grafted resin, reference can be made to paragraphs 0025 to 0094 of JP-A-2012-255128, the contents of which are incorporated herein.

[0413] The resin used as a dispersant is also preferably a polyimine-based dispersant containing nitrogen atoms on at least one of the main chain and the side chain. As a polyimine-based dispersant, it is preferably a resin having a main chain and a side chain and having a basic nitrogen atom on at least one of the main chain and the side chain, wherein the main chain contains a partial structure having a functional group with a pKa of less than 14, and the number of atoms of the side chain is 40 to 10,000. There is no particular limitation on the basic nitrogen atom as long as it is a basic nitrogen atom. Regarding the polyimine-based dispersant, reference can be made to paragraphs 0022 to 0097 of Japanese Patent Publication No. 2009-203462 and paragraphs 0102 to 0166 of Japanese Patent Publication No. 2012-255128, and these contents are incorporated into this specification.

[0414] The resin used as the dispersant is also preferably a resin having a structure in which a plurality of polymer chains are bonded to the core. Examples of such resins include dendritic polymers (including star polymers). Specific examples of dendritic polymers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of Japanese Patent Application Publication No. 2013-043962.

[0415] The resin used as the dispersant is also preferably a resin containing repeating units having a group containing an ethylenically unsaturated bond in the side chain. The content of the repeating units having a group containing an ethylenically unsaturated bond in the side chain is preferably 10 mol% or more, more preferably 10 to 80 mol%, and further preferably 20 to 70 mol% in all repeating units of the resin.

[0416] As the dispersant, the resin described in Japanese Patent Publication No. 2018-087939, the block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077, the polyethyleneimine having a polyester side chain described in International Publication No. 2016 / 104803, the block copolymer described in International Publication No. 2019 / 125940, the block polymer having an acrylamide structural unit described in Japanese Patent Publication No. 2020-066687, the block polymer having an acrylamide structural unit described in Japanese Patent Publication No. 2020-066688, the dispersant described in International Publication No. 2016 / 104803, etc. can also be used.

[0417] Dispersants can also be obtained as commercial products, and specific examples thereof include DISPERBYK series manufactured by BYK-Chemie GmbH, SOLSPERSE series manufactured by Japan Lubrizol Corporation, Efka series manufactured by BASF, and Ajispar series manufactured by Ajinomoto Fine-Techno Co., Inc. In addition, products described in paragraph 0129 of Japanese Unexamined Patent Publication No. 2012-137564 and products described in paragraph 0235 of Japanese Unexamined Patent Publication No. 2017-194662 can also be used as dispersants.

[0418] The content of the resin in the total solid content of the resin composition is preferably 1 to 95% by mass. The lower limit is preferably 2% by mass or more, more preferably 5% by mass or more, further preferably 7% by mass or more, and particularly preferably 10% by mass or more. The upper limit is preferably 90% by mass or less, more preferably 85% by mass or less.

[0419] Furthermore, when the resin composition of the present invention further contains a polymerizable compound described below, the content of the resin in the total solid content of the resin composition is preferably 1 to 75% by mass. The upper limit is preferably 70% by mass or less, more preferably 65% ​​by mass or less. The lower limit is preferably 2% by mass or more, more preferably 5% by mass or more, further preferably 7% by mass or more, and particularly preferably 10% by mass or more.

[0420] When the resin composition of the present invention contains a resin as a dispersant, the content of the resin as a dispersant in the total solid content of the resin composition is preferably 0.1 to 40% by mass. The upper limit is preferably 25% by mass or less, more preferably 20% by mass or less. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. In addition, the content of the resin as a dispersant is preferably 1 to 200 parts by mass relative to 100 parts by mass of the pigment. The upper limit is preferably 150 parts by mass or less, more preferably 125 parts by mass or less, and further preferably 100 parts by mass or less. The lower limit is preferably 2.5 parts by mass or more, more preferably 5 parts by mass or more, and further preferably 10 parts by mass or more.

[0421] The resin composition of the present invention may contain only one resin or two or more resins. When containing two or more resins, the total amount of these resins is preferably within the above range.

[0422] Solvents

[0423] The resin composition of the present invention preferably contains a solvent. As the solvent, water and an organic solvent can be mentioned, preferably an organic solvent. As the organic solvent, ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, hydrocarbon solvents, etc. can be mentioned. For details of these, reference can be made to paragraph 0223 of International Publication No. 2015 / 166779, which is incorporated into this specification. In addition, ester solvents substituted with cyclic alkyl groups and ketone solvents substituted with cyclic alkyl groups can also be preferably used. Specific examples of the organic solvent include polyethylene glycol monomethyl ether, methylene chloride, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether, Propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylpropionamide, 3-butoxy-N,N-dimethylpropionamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, γ-butyrolactone, cyclopentane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, 1,3-butanediol diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropanol, etc. However, it is sometimes preferable to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents for reasons such as environmental considerations (for example, it can be set to 50 mass ppm (parts per million) or less, 10 mass ppm or less, or 1 mass ppm or less relative to the total amount of the organic solvent).

[0424] In the present invention, it is preferred to use an organic solvent with a low metal content, and the metal content of the organic solvent is preferably 10 mass ppb (parts per billion) or less. Organic solvents of mass ppt (parts pertrillion) level can be used as needed, and such organic solvents are provided, for example, by Toyo Gosei Co., Ltd. (Chemical Industry Daily, November 13, 2015).

[0425] As a method for removing impurities such as metals from an organic solvent, for example, distillation (molecular distillation, thin film distillation, etc.) or filtration using a filter can be cited. The filter pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and further preferably 3 μm or less. The material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon.

[0426] The organic solvent may contain isomers (compounds having the same number of atoms but different structures). The isomers may contain only one type or multiple types.

[0427] The content of peroxide in the organic solvent is preferably 0.8 mmol / L or less, and more preferably substantially no peroxide is contained.

[0428] The content of the solvent in the resin composition is preferably 10 to 97% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, further preferably 50% by mass or more, further preferably 60% by mass or more, and particularly preferably 70% by mass or more. The upper limit is preferably 96% by mass or less, more preferably 95% by mass or less. The composition may contain only one solvent or two or more. When two or more are included, the total amount of these is preferably within the above range.

[0429] Pigment derivatives

[0430] The resin composition of the present invention may further contain a pigment derivative. The pigment derivative can be used as a dispersing aid. Examples of the pigment derivative include compounds having a structure in which an acid group or a basic group is bonded to a pigment skeleton.

[0431] Examples of the pigment skeleton constituting the pigment derivative include a squaric acid pigment skeleton, a pyrrolopyrrole pigment skeleton, a diketopyrrolopyrrole pigment skeleton, a quinacridone pigment skeleton, an anthraquinone pigment skeleton, a dianthrone pigment skeleton, a benzisoindole pigment skeleton, a thiazine indigo pigment skeleton, an azo pigment skeleton, a quinophthalone pigment skeleton, a phthalocyanine pigment skeleton, a naphthalocyanine pigment skeleton, a dioxazine pigment skeleton, a perylene pigment skeleton, a perinone pigment skeleton, a benzimidazolone pigment skeleton, a benzothiazole pigment skeleton, a benzimidazole pigment skeleton, and a benzoxazole pigment skeleton.

[0432] Examples of the acid group include a carboxyl group, a sulfonic acid group, a phosphoric acid group, a boric acid group, a carboxylic acid amide group, a sulfonic acid amide group, an imidic acid group, and salts thereof. Examples of the atom or atomic group constituting the salt include an alkali metal ion (Li + 、Na + , K + etc.), alkaline earth metal ions (Ca 2+ Mg 2+ As the carboxylic acid amide group, preferably -NHCOR A1 As the sulfonic acid amide group, preferably -NHSO2R A2 As the imidic acid group, preferably -SO2NHSO2R A3 、-CONHSO2R A4 、-CONHCORA5 or-SO2NHCOR A6 The group represented by is more preferably -SO2NHSO2R A3 . R A1 ~R A6 R each independently represents an alkyl group or an aryl group. A1 ~R A6 The alkyl group and aryl group represented may have a substituent, and the substituent is preferably a halogen atom, and more preferably a fluorine atom.

[0433] Examples of the basic group include amino, pyridyl and salts thereof, ammonium salts and phthalimidomethyl groups. Examples of the atom or atomic group constituting the salt include hydroxide ions, halogen ions, carboxylic acid ions, sulfonic acid ions and phenoxide ions.

[0434] Specific examples of pigment derivatives include compounds described in the examples described below. In addition, Japanese Patent Publication No. 56-118462, Japanese Patent Publication No. 63-264674, Japanese Patent Publication No. 01-217077, Japanese Patent Publication No. 03-009961, Japanese Patent Publication No. 03-026767, Japanese Patent Publication No. 03-153780, Japanese Patent Publication No. 03-045662, Japanese Patent Publication No. 04-285669, Japanese Patent Publication No. 06- The compounds described in Japanese Patent Application No. 145546, Japanese Patent Application Laid-Open No. 06-212088, Japanese Patent Application Laid-Open No. 06-240158, Japanese Patent Application Laid-Open No. 10-030063, Japanese Patent Application Laid-Open No. 10-195326, paragraphs 0086 to 0098 of International Publication No. 2011 / 024896, and paragraphs 0063 to 0094 of International Publication No. 2012 / 102399 are incorporated into the present specification.

[0435] The content of the pigment derivative is preferably 1 to 50 parts by mass relative to 100 parts by mass of the pigment. The lower limit is preferably 3 parts by mass or more, more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, more preferably 30 parts by mass or less. Only one pigment derivative may be used, or two or more pigment derivatives may be used. When two or more pigment derivatives are used, the total amount is preferably within the above range.

[0436] 《Polymeric Compounds》

[0437] The resin composition of the present invention can further contain a polymerizable compound. As the polymerizable compound, there can be mentioned a compound having a group containing an ethylenically unsaturated bond, a compound having a cyclic ether group, a compound having a methylol group, a compound having an alkoxymethyl group, etc. As the group containing an ethylenically unsaturated bond, there can be mentioned a vinyl group, a (meth)allyl group, a (meth)acryloyl group, etc. As the cyclic ether group, there can be mentioned an epoxy group, an oxetanyl group, etc.

[0438] The polymerizable compound is also preferably a radical polymerizable compound. Examples of the radical polymerizable compound include compounds having a group containing an ethylenically unsaturated bond.

[0439] The polymerizable compound may be in any chemical form such as a monomer, a prepolymer, or an oligomer, but is preferably a monomer.

[0440] The molecular weight of the monomer type polymerizable compound (polymerizable monomer) is preferably less than 2000, and more preferably not more than 1500. The lower limit of the molecular weight of the polymerizable monomer is preferably 100 or more, and more preferably 200 or more.

[0441] The compound having a group containing an ethylenically unsaturated bond as a polymerizable monomer is preferably a tri- to penta-functional (meth)acrylate compound, and more preferably a tri- to hexa-functional (meth)acrylate compound. Specific examples include compounds described in paragraphs 0095 to 0108 of JP-A-2009-288705, paragraph 0227 of JP-A-2013-029760, paragraphs 0254 to 0257 of JP-A-2008-292970, paragraphs 0034 to 0038 of JP-A-2013-253224, paragraph 0477 of JP-A-2012-208494, JP-A-2017-048367, Japanese Patent No. 6057891, Japanese Patent No. 6031807, and Japanese Patent No. 2017-194662, and the contents thereof are incorporated into the present specification.

[0442] Examples of the compound having a group containing an ethylenically unsaturated bond include dipentaerythritol tri(meth)acrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra(meth)acrylate (commercially available as KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available as KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available as KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., NK ESTER A-DPH-12E; manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), and compounds having a structure in which the (meth)acryloyl groups of these compounds are bonded via ethylene glycol and / or propylene glycol residues (for example, SARTOMER Company, Inc. commercially available SR454, SR499, etc. As the compound having a group containing an ethylenically unsaturated bond, diglycerol EO (ethylene oxide)-modified (meth)acrylate (commercially available as M-460; manufactured by TOAGOSEI CO., LTD.), pentaerythritol tetraacrylate (manufactured by SHIN-NAKAMURA CHEMICAL CO., LTD., NK ESTER A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.), NK Oligo UA-7200 (manufactured by SHIN-NAKAMURA CHEMICAL CO., LTD.), 8UH-1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL Co., LTD.), etc.

[0443] As the compound having a group containing an ethylenically unsaturated bond, trifunctional (meth)acrylate compounds such as trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide-modified tri(meth)acrylate, trimethylolpropane ethylene oxide-modified tri(meth)acrylate, isocyanurate ethylene oxide-modified tri(meth)acrylate, and pentaerythritol tri(meth)acrylate are also preferably used. Examples of commercially available trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M-306, M-305, M-303, M-452, and M-450 (manufactured by TOAGOSEI CO., LTD.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, A-TMPT, and TMPT (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, and PET-30 (manufactured by Nippon Kayaku Co., Ltd.).

[0444] The compound having a group containing an ethylenically unsaturated bond may further have an acid group such as a carboxyl group, a sulfo group, a phosphoric acid group, etc. Commercially available products of such compounds include ARONIX M-305, M-510, M-520, and ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.).

[0445] As a compound having a group containing an ethylenically unsaturated bond, a compound having a caprolactone structure can also be used. For compounds having a caprolactone structure, reference can be made to paragraphs 0042 to 0045 of Japanese Patent Publication No. 2013-253224, which are incorporated into this specification. For compounds having a caprolactone structure, for example, DPCA-20, DPCA-30, DPCA-60, DPCA-120, etc., which are commercially available as a series from Nippon Kayaku Co., Ltd., can be cited.

[0446] As a compound having a group containing an ethylenically unsaturated bond, a compound having a group containing an ethylenically unsaturated bond and an alkyleneoxy group can also be used. Such a compound is preferably a compound having a group containing an ethylenically unsaturated bond and an ethyleneoxy group and / or a propyleneoxy group, more preferably a compound having a group containing an ethylenically unsaturated bond and an ethyleneoxy group, and further preferably a 3-6 functional (meth) acrylate compound having 4 to 20 ethyleneoxy groups. As commercial products, for example, SR-494, a 4-functional (meth) acrylate having 4 ethyleneoxy groups, manufactured by SARTOMER Company, Inc., KAYARAD TPA-330, a 3-functional (meth) acrylate having 3 isobutyleneoxy groups, manufactured by Nippon Kayaku Co., Ltd., and the like can be cited.

[0447] As the compound having a group containing an ethylenically unsaturated bond, a polymerizable compound having a fluorene skeleton can also be used. Examples of commercially available products include OGSOL EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., a (meth)acrylate monomer having a fluorene skeleton).

[0448] As the compound having a group containing an ethylenically unsaturated bond, it is also preferable to use a compound that does not substantially contain environmentally regulated substances such as toluene. Examples of commercially available products of such a compound include KAYARAD DPHALT and KAYARAD DPEA-12LT (manufactured by Nippon Kayaku Co., Ltd.).

[0449] As the compound having a cyclic ether group, there can be mentioned a compound having an epoxy group, a compound having an oxetane group, etc., preferably a compound having an epoxy group. As the compound having an epoxy group, there can be mentioned a compound having 1 to 100 epoxy groups in one molecule. The upper limit of the number of epoxy groups can be set to, for example, 10 or less, or can be set to 5 or less. The lower limit of the number of epoxy groups is preferably 2 or more.

[0450] The compound having a cyclic ether group may be a low molecular weight compound (e.g., a molecular weight of less than 1000) or a macromolecular compound (e.g., a molecular weight of 1000 or more, and in the case of a polymer, a weight average molecular weight of 1000 or more). The weight average molecular weight of the cyclic ether group is preferably 200 to 100000, more preferably 500 to 50000. The upper limit of the weight average molecular weight is preferably 10000 or less, more preferably 5000 or less, and further preferably 3000 or less.

[0451] As the compound having a cyclic ether group, compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, compounds described in paragraphs 0147 to 0156 of JP-A-2014-043556, compounds described in paragraphs 0085 to 0092 of JP-A-2014-089408, and compounds described in JP-A-2017-179172 can also be used.

[0452] Examples of commercially available compounds having a cyclic ether group include DENACOL EX-212L, EX-212, EX-214L, EX-214, EX-216L, EX-216, EX-321L, EX-321, EX-850L, and EX-850 (all manufactured by Nagase ChemteX Corporation), ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, and EP-4011S (all manufactured by ADEKA CORPORATION), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, and EPPN-502 (all manufactured by ADEKA CORPORATION), CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2083, and CELLOXIDE 2085, EHPE3150, EPOLEAD PB 3600, PB 4700 (all manufactured by Daicel Corporation), CYCLOMER P ACA200M, ACA 230AA, ACA Z250, ACA Z251, ACA Z300, ACA Z320 (all manufactured by Daicel Corporation), jER1031S, jER157S65, jER152, jER154, jER157S70 (all manufactured by Mitsubishi Chemical Corporation), ARONE OXETANE OXT-121, OXT-221, OX-SQ, PNOX (all manufactured by TOAGOSEI CO., LTD.), ADEKA GLYCIROL ED-505 (manufactured by ADEKA CORPORATION, epoxy group-containing monomer), EPICLON N-695 (manufactured by DIC Corporation), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, G-01758 (manufactured by NOF CORPORATION, epoxy group-containing polymer), OXT-101, OXT-121, OXT-212, OXT-221 (these are manufactured by TOAGOSEI Cc., LTD., oxetane group-containing monomer), OXE-10, OXE-30 (these are manufactured by OSAKA ORGANIC CHEMICAL INDUSTRY LTD., oxetane group-containing monomer), etc.

[0453] As the compound with methylol (hereinafter, also referred to as methylol compound), the compound in which methylol is bonded to nitrogen atom or carbon atom forming aromatic ring can be cited. As the compound with alkoxymethyl (hereinafter, also referred to as alkoxymethyl compound), the compound in which alkoxymethyl is bonded to nitrogen atom or carbon atom forming aromatic ring can be cited. As the compound in which alkoxymethyl or methylol is bonded to nitrogen atom, preferably alkoxymethylated melamine, methylolated melamine, alkoxymethylated benzoguanamine, methylolated benzoguanamine, alkoxymethylated glycoluril, methylolated glycoluril, alkoxymethylated urea and methylolated urea etc. can be used. In addition, the compounds described in paragraphs 0134 to 0147 of Japanese Patent Publication No. 2004-295116 and paragraphs 0095 to 0126 of Japanese Patent Publication No. 2014-089408 can also be used.

[0454] The content of polymerizable compounds in the total solid content of the resin composition is preferably 0.1 to 50% by mass. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more, and further preferably 3% by mass or more. The upper limit is preferably 40% by mass or less, more preferably 30% by mass or less, and further preferably 25% by mass or less. The resin composition of the present invention may contain only one polymerizable compound or may contain two or more. When containing two or more polymerizable compounds, it is preferred that the total amount of these is within the above range.

[0455] 《Photopolymerization Initiator》

[0456] When the resin composition of the present invention contains a polymerizable compound, it is preferred that the resin composition of the present invention further contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, it is preferably a compound that is photosensitized to light in the ultraviolet region to the visible region. When a free radical polymerizable compound is used as the polymerizable compound, the photopolymerization initiator is preferably a photo free radical polymerization initiator.

[0457] Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyltriazine compound, a benzyldimethylketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a hexaarylbiimidazole compound, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halomethyloxadiazole compound, and a 3-aryl-substituted coumarin compound, more preferably a compound selected from the group consisting of an oxime compound, an α-hydroxyketone compound, an α-aminoketone compound, and an acylphosphine compound, and even more preferably an oxime compound. In addition, examples of the photopolymerization initiator include compounds described in paragraphs 0065 to 0111 of Japanese Patent Publication No. 2014-130173, compounds described in Japanese Patent Publication No. 6301489, peroxide-based photopolymerization initiators described in MATERIAL STAGE 37 to 60p, vol. 19, No. 3, 2019, photopolymerization initiators described in International Publication No. 2018 / 221177, photopolymerization initiators described in International Publication No. 2018 / 110179, photopolymerization initiators described in Japanese Patent Publication No. 2019-043864, photopolymerization initiators described in Japanese Patent Publication No. 2019-044030, and photopolymerization initiators described in Japanese Patent Publication No. 2019-167313. Peroxide-based initiators, aminoacetophenone-based initiators having an oxazolidinyl group described in Japanese Patent Publication No. 2020-055992, oxime-based photopolymerization initiators described in Japanese Patent Publication No. 2013-190459, polymers described in Japanese Patent Publication No. 2020-172619, compounds represented by formula 1 described in International Publication No. 2020 / 152120, compounds described in Japanese Patent Publication No. 2021-181406, etc., are incorporated into this specification.

[0458] Specific examples of the hexaarylbiimidazole compound include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-biimidazole and the like.

[0459] Examples of commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins BV), Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Examples of commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, and Omnirad 379EG (all manufactured by IGM Resins BV), Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (all manufactured by BASF). Examples of commercially available products of the acylphosphine compound include Omnirad 819, Omnirad TPO (both manufactured by IGM Resins B.V.), Irgacure 819, and Irgacure TPO (both manufactured by BASF).

[0460] Examples of the oxime compound include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, compounds described in JCS Perkin II (1979, pp. 1653-1660), compounds described in JCS Perkin II (1979, pp. 156-162), and compounds described in Journal of Photopolymer Science and Technology. Technology (1995, pp. 202-232), compounds described in Japanese Patent Application Publication No. 2000-066385, compounds described in Japanese Patent Publication No. 2004-534797, compounds described in Japanese Patent Application Publication No. 2006-342166, compounds described in Japanese Patent Application Publication No. 2017-019766, compounds described in Japanese Patent No. 6065596, compounds described in International Publication No. 2015 / 152153, compounds described in International Publication No. 2017 / 051680, Japanese Patent Application Publication No. 2017-198 The compounds described in International Publication No. 865, the compounds described in paragraphs 0025 to 0038 of International Publication No. 2017 / 164127, International Publication No. 2013 / 167515, International Publication No. 2017 / 169819, the compounds described in paragraphs 0029 to 0044 of Japanese Patent Publication No. 2019-168654, the compounds represented by the general formula (1) or the compounds described in paragraphs 0022 to 0024 of Japanese Patent Publication No. 2021-173858, the compounds represented by the general formula (1) or the compounds described in paragraphs 0117 to 0120 of Japanese Patent Publication No. 2021-170089, etc. Specific examples of oxime compounds include 3-benzoyloxyiminobutane-2-one, 3-acetoxyiminobutane-2-one, 3-propionyloxyiminobutane-2-one, 2-acetoxyiminopentane-3-one, 2-acetoxyimino-1-phenylpropane-1-one, 2-benzoyloxyimino-1-phenylpropane-1-one, 3-(4-toluenesulfonyloxy)iminobutane-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropane-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexane-propane-1,2-dione-2-(O-acetyloxime), and the like.Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04 (all manufactured by BASF), TR-PBG-301, TR-PBG-304, TR-PBG-327 (manufactured by TRONLY), and Adeka Optomer N-1919 (manufactured by ADEKA CORPORATION, photopolymerization initiator 2 described in Japanese Patent Application Publication No. 2012-014052). In addition, as the oxime compound, it is also preferred to use a non-coloring compound or a compound that is highly transparent and not prone to discoloration. Commercially available products include ADEKA ARKLS NCI-730, NCI-831, and NCI-930 (all manufactured by ADEKA CORPORATION).

[0461] As a photopolymerization initiator, an oxime compound having a fluorene ring can also be used. As a specific example of an oxime compound having a fluorene ring, compounds described in Japanese Patent Publication No. 2014-137466, compounds described in Japanese Patent No. 6636081, compounds described in Korean Patent Publication No. 10-2016-0109444, fluorenyl amino ketone photoinitiators described in Japanese Patent Publication No. 2020-507664, and oxime ester compounds described in International Publication No. 2021 / 023144 can be cited.

[0462] As the photopolymerization initiator, an oxime compound having a carbazole ring and a skeleton in which at least one benzene ring is a naphthalene ring can also be used. Specific examples of such oxime compounds include compounds described in International Publication No. 2013 / 083505.

[0463] As the photopolymerization initiator, an oxime compound having a fluorine atom can also be used. Specific examples of the oxime compound having a fluorine atom include compounds described in JP-A-2010-262028, compounds 24, 36 to 40 described in JP-A-2014-500852, and compound (C-3) described in JP-A-2013-164471.

[0464] As the photopolymerization initiator, an oxime compound having a nitro group can be used. The oxime compound having a nitro group is also preferably set as a dimer. As specific examples of the oxime compound having a nitro group, there can be cited the compounds described in paragraphs 0031 to 0047 of Japanese Patent Publication No. 2013-114249, paragraphs 0008 to 0012 and 0070 to 0079 of Japanese Patent Publication No. 2014-137466, the compounds described in paragraphs 0007 to 0025 of Japanese Patent Publication No. 4223071, and ADEKA ARKLS NCI-831 (made by ADEKA CORPORATION).

[0465] As the photopolymerization initiator, an oxime compound having a benzofuran skeleton can also be used. Specific examples thereof include OE-01 to OE-75 described in International Publication No. 2015 / 036910.

[0466] As a photopolymerization initiator, an oxime compound having a substituent having a hydroxyl group bonded to a carbazole skeleton can also be used. As such a photopolymerization initiator, compounds described in International Publication No. 2019 / 088055 can be cited.

[0467] Specific examples of the oxime compound preferably used in the present invention are shown below, but the present invention is not limited to these.

[0468] [Chemical formula 32]

[0469]

[0470] [Chemical formula 33]

[0471]

[0472] [Chemical formula 34]

[0473]

[0474] [Chemical formula 35]

[0475]

[0476] The oxime compound is preferably a compound having a maximum absorption wavelength in the range of 350 to 500 nm, more preferably a compound having a maximum absorption wavelength in the range of 360 to 480 nm. In addition, from the viewpoint of sensitivity, the molar absorption coefficient of the oxime compound at a wavelength of 365 nm or a wavelength of 405 nm is preferably high, more preferably 1000 to 300,000, further preferably 2000 to 300,000, and particularly preferably 5000 to 200,000. The molar absorption coefficient of the compound can be measured using a known method. For example, it is preferably measured by a spectrophotometer (Varian Cary-5 spectrophotometer), using an ethyl acetate solvent, at a concentration of 0.01 g / L.

[0477] As the photopolymerization initiator, a photoradical polymerization initiator having difunctional or trifunctional functions or more can be used. By using such photoradical polymerization initiators, more than two free radicals are generated from one molecule of the photoradical polymerization initiator, so good sensitivity can be obtained. In addition, when a compound of an asymmetric structure is used, the crystallinity decreases and the solubility in a solvent etc. becomes high, and becomes difficult to separate out over time, thereby being able to improve the stability over time of the resin combination. Specific examples of bifunctional or trifunctional or higher photoradical polymerization initiators include dimers of oxime compounds described in paragraphs 0407 to 0412 of JP-A-2010-527339, JP-A-2011-524436, International Publication No. 2015 / 004565, JP-A-2016-532675, and International Publication No. 2017 / 033680, compounds described in paragraphs 0039 to 0055, and JP-A-2013-522445 ( E) and compound (G), Cmpd1 to 7 described in International Publication No. 2016 / 034963, the oxime ester initiator described in paragraph 0007 of Japanese Unexamined Patent Application Publication No. 2017-523465, the photoinitiator described in paragraphs 0020 to 0033 of Japanese Unexamined Patent Application Publication No. 2017-167399, the photopolymerization initiator (A) described in paragraphs 0017 to 0026 of Japanese Unexamined Patent Application Publication No. 2017-151342, the oxime ester initiator described in Japanese Patent No. 6469669, etc.

[0478] The content of the photopolymerization initiator in the total solid content of the resin composition is preferably 0.1 to 40% by mass, more preferably 0.5 to 35% by mass, and further preferably 1 to 30% by mass. The resin composition may contain only one photopolymerization initiator or two or more. When two or more are included, the total amount of these is preferably within the above range.

[0479] Curing agent

[0480] When the resin composition of the present invention includes a compound having a cyclic ether group, it is preferably further included a curing agent. As a curing agent, for example, an amine compound, an acid anhydride compound, an amide compound, a phenol compound, a polycarboxylic acid, a thiol compound, etc. can be cited. As a specific example of a curing agent, succinic acid, trimellitic acid, pyromelitic acid, N, N-dimethyl-4-aminopyridine, pentaerythritol tetrakis (3-mercaptopropionic acid) and the like can be cited. The curing agent can also use the compounds described in paragraphs 0072 to 0078 of Japanese Patent Publication No. 2016-075720 and the compounds described in Japanese Patent Publication No. 2017-036379. Relative to 100 parts by mass of the compound having a cyclic ether group, the content of the curing agent is preferably 0.01 to 20 parts by mass, more preferably 0.01 to 10 parts by mass, and further preferably 0.1 to 6.0 parts by mass.

[0481] Color coloring agent

[0482] The resin composition of the present invention may contain a colorant. In the present invention, the colorant refers to a colorant other than a white colorant and a black colorant. The colorant is preferably a colorant having absorption in a wavelength range of 400 nm or more and less than 650 nm.

[0483] As the color coloring agent, red coloring agent, green coloring agent, blue coloring agent, yellow coloring agent, purple coloring agent and orange coloring agent can be mentioned. The color coloring agent can be a pigment or a dye. Pigment and dye can be used simultaneously. In addition, the pigment can be any one of an inorganic pigment and an organic pigment. In addition, the pigment can also use a material in which a part of an inorganic pigment or an organic-inorganic pigment is replaced with an organic chromophore. By replacing an inorganic pigment or an organic-inorganic pigment with an organic chromophore, hue design can be easily performed.

[0484] The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and further preferably 100 nm or less. As long as the average primary particle size of the pigment is within the above range, the dispersion stability of the pigment in the resin composition is good. In addition, in the present invention, the primary particle size of the pigment can be observed by a transmission electron microscope and obtained based on the image photograph. Specifically, the projected area of ​​the primary particles of the pigment is obtained, and the equivalent circle diameter corresponding thereto is calculated as the primary particle size of the pigment. In addition, the average primary particle size in the present invention is set to the arithmetic mean of the primary particle sizes of 400 primary particles of the pigment. In addition, the primary particles of the pigment refer to independent particles that are not agglomerated.

[0485] The crystallite size determined from the half width of a peak originating from any crystal plane in an X-ray diffraction spectrum when CuKα rays of the pigment are used as an X-ray source is preferably 0.1 nm to 100 nm, more preferably 0.5 nm to 50 nm, further preferably 1 nm to 30 nm, and particularly preferably 5 nm to 25 nm.

[0486] The specific surface area of ​​the pigment is preferably 1 to 300 m 2 / g. The lower limit is preferably 10m 2 / g or more, more preferably 30m 2 The upper limit is preferably 250 m 2 / g or less, more preferably 200m 2 The value of the specific surface area can be measured by the BET (Brunauer, Emmett and Teller) method in accordance with DIN 66131: determination of the specific surface area of ​​solids by gas adsorption.

[0487] The color colorant preferably contains a pigment. The content of the pigment in the color colorant is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, and particularly preferably 90% by mass or more. Examples of the pigment include the following.

[0488] Pigment Index (CI) Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128 、129、137、138、139、147、148、150、151、152、153、154、155、156、161、162、164、166、167、168、169、170、171、172、173、174、175、176、177、179、180、181、182、185、187、188、193、194、199、213、214、215、228、231、232(methine series), 233(quinoline series), 234(amino ketone series), 235(amino ketone series), 236(amino ketone series), etc. (the above are yellow pigments),

[0489] CI Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73, etc. (the above are orange pigments),

[0490] CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 269, 270, 272, 279, 291, 294 (xanthine series, Organo Ultramarine (organic ultramarine), Blue Red (blue red)), 295 (monoazo series), 296 (diazo series), 297 (amino ketone) etc. (the above are red pigments),

[0491] CI Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64 (phthalocyanine), 65 (phthalocyanine), 66 (phthalocyanine), etc. (the above are green pigments),

[0492] CI Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60 (triarylmethane series), 61 (xanthenyl series), etc. (the above are violet pigments),

[0493] CI Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87 (monoazo series), 88 (methine series), etc. (the above are blue pigments).

[0494] In addition, as a green pigment, a zinc phthalocyanine halogenide pigment having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms in one molecule can also be used. As a specific example, the compound described in International Publication No. 2015 / 118720 can be cited. In addition, as a green pigment, the compound described in the specification of Chinese Patent Application No. 106909027, the phthalocyanine compound having a phosphate ester as a ligand described in International Publication No. 2012 / 102395, the phthalocyanine compound described in Japanese Patent Publication No. 2019-008014, the phthalocyanine compound described in Japanese Patent Publication No. 2018-180023, the compound described in Japanese Patent Publication No. 2019-038958, the core-shell pigment described in Japanese Patent Publication No. 2020-076995, etc. can also be used.

[0495] Furthermore, an aluminum phthalocyanine compound having a phosphorus atom can also be used as a blue pigment, and specific examples thereof include compounds described in paragraphs 0022 to 0030 of JP-A-2012-247591 and paragraph 0047 of JP-A-2011-157478.

[0496] In addition, as yellow pigments, compounds described in Japanese Patent Publication No. 2017-201003, compounds described in Japanese Patent Publication No. 2017-197719, compounds described in paragraphs 0011 to 0062 and 0137 to 0276 of Japanese Patent Publication No. 2017-171912, compounds described in paragraphs 0010 to 0062 and 0138 to 0295 of Japanese Patent Publication No. 2017-171913, compounds described in paragraphs 0011 to 0062 and 0139 to 0190 of Japanese Patent Publication No. 2017-171914, compounds described in paragraphs 0010 to 0065 and 0142 to 0222 of Japanese Patent Publication No. 2017-171915 can also be used. The compounds described in paragraphs 0011 to 0034 of Japanese Patent Publication No. 2013-054339, the quinophthalone compounds described in paragraphs 0013 to 0058 of Japanese Patent Publication No. 2014-026228, the isoindoline compounds described in Japanese Patent Publication No. 2018-062644, the quinophthalone compounds described in Japanese Patent Publication No. 2018-203798, the quinophthalone compounds described in Japanese Patent Publication No. 2018-062578, the quinophthalone compounds described in Japanese Patent No. 6432076, the quinophthalone compounds described in Japanese Patent Publication No. 2018-155881, and the quinophthalone compounds described in Japanese Patent Publication No. 2018-111757 Quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2018-040835, quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2017-197640, quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2016-145282, quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2014-085565, quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2014-021139, quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2013-209614, quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2013-209435, quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2013-181015, quinophthalone compounds described in Japanese Patent Application Laid-Open No. 2013-0 Quinophthalone compounds described in Japanese Patent Application No. 61622, quinophthalone compounds described in Japanese Patent Application No. 2013-032486, quinophthalone compounds described in Japanese Patent Application No. 2012-226110, quinophthalone compounds described in Japanese Patent Application No. 2008-074987, quinophthalone compounds described in Japanese Patent Application No. 2008-081565, quinophthalone compounds described in Japanese Patent Application No. 2008-074986, quinophthalone compounds described in Japanese Patent Application No. 2008-074985, quinophthalone compounds described in Japanese Patent Application No. 2008-050420, quinophthalone compounds described in Japanese Patent Application No. 2008-031281,Quinophthalone compounds described in Japanese Patent Publication No. 48-032765, quinophthalone compounds described in Japanese Patent Publication No. 2019-008014, quinophthalone compounds described in Japanese Patent No. 6607427, compounds described in Korean Patent Publication No. 10-2014-0034963, compounds described in Japanese Patent Publication No. 2017-095706, compounds described in Taiwan Patent Application Publication No. 201920495, compounds described in Japanese Patent No. 6607427, Japanese Patent No. The compounds described in Japanese Patent Publication No. 2020-033525, the compounds described in Japanese Patent Publication No. 2020-033524, the compounds described in Japanese Patent Publication No. 2020-033523, the compounds described in Japanese Patent Publication No. 2020-033522, the compounds described in Japanese Patent Publication No. 2020-033521, the compounds described in International Publication No. 2020 / 045200, the compounds described in International Publication No. 2020 / 045199, and the compounds described in International Publication No. 2020 / 045197. In addition, from the viewpoint of improving the color value, it is also preferable to use a compound obtained by polymerizing these compounds.

[0497] As the red pigment, the diketopyrrolopyrrole compounds in which at least one bromine atom is substituted in the structure described in Japanese Patent Application Laid-Open No. 2017-201384, the diketopyrrolopyrrole compounds described in paragraphs 0016 to 0022 of Japanese Patent No. 6248838, the diketopyrrolopyrrole compounds described in International Publication No. 2012 / 102399, the diketopyrrolopyrrole compounds described in International Publication No. 2012 / 117965, the naphthol azo compounds described in Japanese Patent Application Laid-Open No. 2012-229344, Compounds, red pigments described in Japanese Patent No. 6516119, red pigments described in Japanese Patent No. 6525101, brominated diketopyrrolopyrrole compounds described in paragraph 0229 of Japanese Patent Publication No. 2020-090632, anthraquinone compounds described in Korean Patent Publication No. 10-2019-0140741, anthraquinone compounds described in Korean Patent Publication No. 10-2019-0140744, perylene compounds described in Japanese Patent Publication No. 2020-079396, etc. In addition, as a red pigment, a compound having a structure in which an aromatic ring group having a group bonded to an oxygen atom, a sulfur atom or a nitrogen atom is introduced into an aromatic ring and bonded to a diketopyrrolopyrrole skeleton can also be used.

[0498] Regarding the preferred diffraction angles of various pigments, reference can be made to the records of Japanese Patent No. 6561862, Japanese Patent No. 6413872, Japanese Patent No. 6281345, and Japanese Patent Publication No. 2020-026503, which are incorporated into this specification. In addition, as pyrrolopyrrole pigments, it is also preferred to use a crystallite size of 0.040 mm / s in the plane direction corresponding to the maximum peak in the X-ray diffraction pattern among the 8 planes in the lattice plane (±1±1±1). The following pigments. In addition, the physical properties of the pyrrolopyrrole-based pigment are preferably set in accordance with the description in paragraphs 0028 to 0073 of JP-A-2020-097744.

[0499] Color coloring agents can also use dyes. As dyes, there is no particular limitation, and known dyes can be used. For example, pyrazole azo dyes, anilino azo dyes, triarylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylidene dyes, oxonol dyes, pyrazolotriazole azo dyes, pyridone azo dyes, cyanine dyes, phenothiazine dyes, pyrrolopyrazole azomethine dyes, xanthene dyes, phthalocyanine dyes, benzopyran dyes, indigo dyes, pyrromethene dyes, etc. can be cited.

[0500] Color colorants can also use pigment polymers. The pigment polymer is preferably a dye used in a solvent. In addition, the pigment polymer can form particles. When the pigment polymer is a particle, it is usually used in a state dispersed in a solvent. The pigment polymer in a particle state can be obtained, for example, by emulsion polymerization. As a specific example, the compounds and production methods described in Japanese Patent Publication No. 2015-214682 can be cited. The pigment polymer has two or more pigment structures in one molecule, preferably three or more pigment structures. The upper limit is not particularly limited and can also be set to 100 or less. The multiple pigment structures in one molecule can be the same pigment structure or different pigment structures. The weight average molecular weight (Mw) of the pigment polymer is preferably 2000 to 50000. The lower limit is more preferably 3000 or more, and more preferably 6000 or more. The upper limit is more preferably 30000 or less, and more preferably 20000 or less. As the pigment multimer, compounds described in JP-A-2011-213925, JP-A-2013-041097, JP-A-2015-028144, JP-A-2015-030742, International Publication No. 2016 / 031442, and the like can also be used.

[0501] The color colorant may include a triarylmethane dye polymer described in Korean Patent Publication No. 10-2020-0028160, a xanthene compound described in Japanese Patent Publication No. 2020-117638, a phthalocyanine compound described in International Publication No. 2020 / 174991, an isoindoline compound described in Japanese Patent Publication No. 2020-160279, or a salt thereof, a compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069442, a compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069730, a compound represented by Formula 1 described in Korean Patent Publication No. 10-2020-0069 070, a compound represented by formula 1 described in Korean Patent Publication No. 10-2020-0069067, a compound represented by formula 1 described in Korean Patent Publication No. 10-2020-0069062, a zinc phthalocyanine halogenide pigment described in Japanese Patent No. 6809649, an isoindoline compound described in Japanese Patent Publication No. 2020-180176, a phenothiazine compound described in Japanese Patent Publication No. 2021-187913, a zinc phthalocyanine halogenide described in International Publication No. 2022 / 004261, and a zinc phthalocyanine halogenide described in International Publication No. 2021 / 250883. Other colorants may be rotaxanes, and the pigment skeleton may be used for the cyclic structure of the rotaxane, for the rod-shaped structure, or for both structures.

[0502] When the resin composition of the present invention contains a colorant, the content of the colorant in the total solid content of the resin composition of the present invention is preferably 1 to 50% by mass. When the resin composition of the present invention contains two or more colorants, the total amount of these colorants is preferably within the above range.

[0503] When the resin composition of the present invention is used as an infrared cut filter, it is preferred that the resin composition of the present invention does not substantially contain a color coloring agent. In addition, the resin composition of the present invention does not substantially contain a color coloring agent means that the content of the color coloring agent in the total solid content of the resin composition of the present invention is 0.5% by mass or less, preferably 0.1% by mass or less, and more preferably does not contain a color coloring agent.

[0504] 《Color material that transmits infrared rays and blocks visible light》

[0505] The resin composition of the present invention may contain a color material that transmits infrared rays and shields visible light (hereinafter also referred to as a visible light shielding color material). The resin composition containing the visible light shielding color material can be preferably used as a resin composition for forming an infrared transmission filter.

[0506] The color material that blocks visible light is preferably a color material that absorbs light in the wavelength range of purple to red. Furthermore, the color material that blocks visible light is preferably a color material that blocks light in the wavelength range of 450 to 650 nm. Furthermore, the color material that blocks visible light is preferably a color material that transmits light in the wavelength range of 900 to 1500 nm. The color material that blocks visible light preferably satisfies at least one of the following necessary conditions (A) and (B).

[0507] (A): Contains two or more color coloring agents, and the combination of the two or more color coloring agents forms black.

[0508] (B): Contains an organic black colorant.

[0509] As color coloring agents, the above coloring agents can be cited. As organic black coloring agents, for example, bisbenzofuranone compounds, azomethine compounds, perylene compounds, azo compounds, etc. can be cited, preferably bisbenzofuranone compounds and perylene compounds. As bisbenzofuranone compounds, compounds described in Japanese Patent Publication No. 2010-534726, Japanese Patent Publication No. 2012-515233, Japanese Patent Publication No. 2012-515234, etc. can be cited, for example, they can be obtained as "Irgaphor Black" manufactured by BASF. As perylene compounds, compounds described in paragraphs 0016 to 0020 of Japanese Patent Publication No. 2017-226821, CI Pigment Black 31, 32, etc. can be cited. Examples of the azomethine compound include compounds described in JP-A-01-170601 and JP-A-02-034664. For example, the azomethine compound is available as "CHROMO FINE BLACK A1103" manufactured by Dainichiseika Color & Chemicals Mfg. Co., Ltd.

[0510] As a combination of color colorants when forming black by combining two or more color colorants, for example, the following aspects (1) to (8) are mentioned.

[0511] (1) A form containing a yellow colorant, a blue colorant, a purple colorant, and a red colorant.

[0512] (2) A form containing a yellow colorant, a blue colorant, and a red colorant.

[0513] (3) A form containing a yellow colorant, a purple colorant, and a red colorant.

[0514] (4) A method containing a yellow colorant and a purple colorant.

[0515] (5) A form containing a green colorant, a blue colorant, a purple colorant, and a red colorant.

[0516] (6) A form containing a purple colorant and an orange colorant.

[0517] (7) A form containing a green colorant, a purple colorant and a red colorant.

[0518] (8) A form containing a green colorant and a red colorant.

[0519] When the resin composition of the present invention contains a colorant that shields visible light, the content of the colorant that shields visible light in the total solid content of the resin composition is preferably 1 to 50% by mass. The lower limit is preferably 5% by mass or more, more preferably 10% by mass or more, further preferably 20% by mass or more, and particularly preferably 30% by mass or more.

[0520] When the resin composition of the present invention is used as an infrared cutoff filter, the resin composition of the present invention preferably does not substantially contain a color material that blocks visible light. In addition, when the resin composition of the present invention does not substantially contain a color material that blocks visible light, it means that the content of the color material that blocks visible light in the total solid content of the resin composition of the present invention is 0.5% by mass or less, preferably 0.1% by mass or less, and more preferably does not contain a color material that blocks visible light.

[0521] Surfactants

[0522] The resin composition of the present invention preferably contains a surfactant. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant can be used. The surfactant is preferably a silicone-based surfactant or a fluorine-based surfactant. Regarding the surfactant, the surfactants described in paragraphs 0238 to 0245 of International Publication No. 2015 / 166779 can be cited, and the content is incorporated into this specification.

[0523] As fluorine-based surfactants, there can be cited surfactants described in paragraphs 0060 to 0064 of Japanese Patent Publication No. 2014-041318 (paragraphs 0060 to 0064 of the corresponding International Publication No. 2014 / 017669), surfactants described in paragraphs 0117 to 0132 of Japanese Patent Publication No. 2011-132503, and surfactants described in Japanese Patent Publication No. 2020-008634, and these contents are incorporated into this specification. As commercially available products of fluorine-based surfactants, for example, MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-563, F-565, F-568, F-575, F-780, EXP, MFS-330, R-01, R-40, R-40-LM, R-41, R-41-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all DIC Corporation), FLUORAD FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC INC.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA SOLUTIONS INC.), Futurgent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, FTX-218 (all manufactured by NEOS COMPANY LIMITED), etc.

[0524] In addition, as a fluorine-based surfactant, an acrylic compound can also be preferably used, which has a molecular structure containing a functional group containing a fluorine atom, and when heated, the part of the functional group containing a fluorine atom is cut off and the fluorine atom is volatilized. As such a fluorine-based surfactant, MEGAFACE DS series (Chemical Industry Daily (February 22, 2016), Nikkei Industry News (February 23, 2016)) manufactured by DIC Corporation can be cited, for example, MEGAFACE DS-21 can be cited.

[0525] Furthermore, as the fluorine-based surfactant, a polymer of a fluorine-containing vinyl ether compound having a fluorinated alkyl or fluorinated alkylene ether group and a hydrophilic vinyl ether compound is also preferably used. Such fluorine-based surfactants include the fluorine-based surfactants described in Japanese Patent Application Publication No. 2016-216602, which are incorporated into this specification.

[0526] As a fluorine-based surfactant, a block polymer can also be used. As a fluorine-based surfactant, a fluorine-containing polymer compound can also be preferably used, which contains: a repeating unit derived from a (meth)acrylate compound having a fluorine atom; and a repeating unit derived from a (meth)acrylate compound having 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy, propyleneoxy). In addition, the fluorine-containing surfactants described in paragraphs 0016 to 0037 of Japanese Patent Publication No. 2010-032698 and the following compounds are also exemplified as fluorine-based surfactants used in the present invention.

[0527] [Chemical formula 36]

[0528]

[0529] The weight average molecular weight of the above compound is preferably 3000 to 50000, for example, 14000. In the above compound, % indicating the ratio of the repeating unit is mol %.

[0530] Furthermore, as a fluorine-based surfactant, a fluorine-containing polymer having a group containing an ethylenically unsaturated bond in a side chain can also be used. As specific examples, compounds described in paragraphs 0050 to 0090 and paragraphs 0289 to 0295 of Japanese Patent Publication No. 2010-164965, and MEGAFACE RS-101, RS-102, RS-718K, and RS-72-K manufactured by DIC Corporation can be cited. Furthermore, as a fluorine-based surfactant, compounds described in paragraphs 0015 to 0158 of Japanese Patent Publication No. 2015-117327 can also be used.

[0531] Furthermore, from the viewpoint of environmental regulation, it is also preferable to use the surfactant described in International Publication No. 2020 / 084854 as a substitute for the surfactant having a perfluoroalkyl group with 6 or more carbon atoms.

[0532] Furthermore, it is also preferred to use a fluorine-containing imide salt compound represented by the formula (fi-1) as a surfactant.

[0533] [Chemical formula 37]

[0534]

[0535] In the formula (fi-1), m represents 1 or 2, n represents an integer of 1 to 4, a represents 1 or 2, and X a+ Indicates a-valent metal ion, primary ammonium ion, secondary ammonium ion, tertiary ammonium ion, quaternary ammonium ion or NH4 + .

[0536] Examples of the nonionic surfactant include glycerol, trimethylolpropane, trimethylolethane, and ethoxylates and propoxylates thereof (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF), SOLSPERSE 20000 (manufactured by Japan Lubrizol Corporation), NCW-101, NCW-1001, NCW-1002 (manufactured by Wako Pure Chemical Industries, Ltd.), PIONIN D-6112, D-6112-W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), OLFIN E1010, Surfynol 104, 400, 440 (manufactured by Nissin Chemical Co., Ltd.), etc.

[0537] Examples of the cationic surfactant include tetraalkylammonium salts, alkylamine salts, benzylalkylammonium salts, alkylpyridinium salts, imidazolium salts, etc. Specific examples include dihydroxyethylstearylamine, 2-heptadecenyl-hydroxyethylimidazoline, lauryldimethylbenzylammonium chloride, cetylpyridinium chloride, stearamidomethylpyridinium chloride, etc.

[0538] Examples of the anionic surfactant include dodecylbenzenesulfonic acid, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium alkyl diphenyl ether disulfonate, sodium alkyl naphthalene sulfonate, sodium dialkyl sulfosuccinate, sodium stearate, potassium oleate, sodium dioctyl sulfosuccinate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkyl ether sulfate, sodium polyoxyethylene alkylphenyl ether sulfate, sodium dialkyl sulfosuccinate, sodium stearate, sodium oleate, and sodium salt of tert-octylphenoxyethoxypolyethoxyethyl sulfate.

[0539] Examples of the silicone surfactant include SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, SF 8419 OIL (all manufactured by Dow Corning Toray Co., Ltd.), TSF-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials Inc.), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-3760, BYK-UV3510 (all manufactured by BYK-Chemie GmbH), etc.

[0540] Furthermore, as the silicone-based surfactant, compounds having the following structures can also be used.

[0541] [Chemical formula 38]

[0542]

[0543] In the total solid content of the resin composition, the content of the surfactant is preferably 0.001 to 1% by mass, more preferably 0.001 to 0.5% by mass, and further preferably 0.001 to 0.2% by mass. The resin composition may contain only one surfactant or two or more. When two or more surfactants are included, the total amount of these surfactants is preferably within the above range.

[0544] 《Polymerization Inhibitors》

[0545] The resin composition of the present invention can contain a polymerization inhibitor. As a polymerization inhibitor, hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, gallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis (3-methyl-6-tert-butylphenol), 2,2'-methylenebis (4-methyl-6-tert-butylphenol), N-nitrosophenylhydroxylamine salt (ammonium salt, first cerium salt, etc.), preferably p-methoxyphenol. In the total solid content of the resin composition, the content of the polymerization inhibitor is preferably 0.0001 to 5% by mass. The resin composition may contain only one polymerization inhibitor or more than two. When containing more than two, it is preferred that the total amount of these is within the above range.

[0546] 《Silane coupling agent》

[0547] The resin composition of the present invention can contain a silane coupling agent. In this specification, a silane coupling agent refers to a silane compound having a hydrolyzable group and functional groups other than the hydrolyzable group. In addition, a hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can produce a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. As a hydrolyzable group, for example, a halogen atom, an alkoxy group, an acyloxy group, etc. can be cited, preferably an alkoxy group. That is, a silane coupling agent is preferably a compound having an alkoxysilyl group. In addition, as a functional group other than the hydrolyzable group, for example, a vinyl group, a (meth) acryloyl group, a mercapto group, an epoxy group, an oxetane group, an amino group, a urea group, a thioether group, an isocyanate group, a phenyl group, etc. can be cited, preferably a (meth) acryloyl group and an epoxy group. The silane coupling agent may include compounds described in paragraphs 0018 to 0036 of Japanese Patent Application No. 2009-288703 and compounds described in paragraphs 0056 to 0066 of Japanese Patent Application No. 2009-242604, which are incorporated into this specification. The content of the silane coupling agent is preferably 0.01 to 15.0% by mass, more preferably 0.05 to 10.0% by mass in the total solid content of the resin composition. The resin composition may contain only one silane coupling agent or two or more. When two or more are included, the total amount of these is preferably within the above range.

[0548] 《UV absorber》

[0549] The resin composition of the present invention may contain an ultraviolet absorber. Examples of the ultraviolet absorber include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, triazine compounds, and dibenzoyl. As specific examples of such compounds, there can be mentioned compounds described in paragraphs 0038 to 0052 of Japanese Patent Publication No. 2009-217221, paragraphs 0052 to 0072 of Japanese Patent Publication No. 2012-208374, paragraphs 0317 to 0334 of Japanese Patent Publication No. 2013-068814, paragraphs 0061 to 0080 of Japanese Patent Publication No. 2016-162946, paragraphs 0052 and 0074 of International Publication No. 2021 / 131355, and paragraphs 0022 to 0024 of International Publication No. 2021 / 132247, and these contents are incorporated into this specification. Commercially available products of ultraviolet absorbers include Tinuvin series and Uvinul series manufactured by BASF. And, as benzotriazole compounds, MIYOSHI OIL & FAT CO., LTD. MYUA series (Chemical Industry Daily, February 1, 2016) can be cited. Ultraviolet absorbers can also use compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967, compounds described in paragraphs 0059 to 0076 of International Publication No. 2016 / 181987, thioaryl-substituted benzotriazole type ultraviolet absorbers described in International Publication No. 2020 / 137819, and reactive triazine ultraviolet absorbers described in Japanese Patent Publication No. 2021-178918. In the total solid content of the resin composition, the content of the ultraviolet absorber is preferably 0.01 to 30% by mass, more preferably 0.05 to 25% by mass. The resin composition may contain only one ultraviolet absorber, or may contain more than two. When more than two are included, it is preferred that the total amount of these is within the above range.

[0550] Antioxidants

[0551] The resin composition of the present invention can contain an antioxidant. Examples of the antioxidant include phenolic antioxidants, amine antioxidants, phosphorus antioxidants, sulfur antioxidants, and the like. Examples of the phenolic antioxidant include hindered phenol compounds. The phenolic antioxidant is preferably a compound having a substituent at a position adjacent to the phenolic hydroxyl group (ortho position). As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred. The antioxidant is also preferably a compound having a phenol group and a phosphite group in the same molecule. Examples of the phosphorus-based antioxidant include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphin-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetrakis-tert-butyldibenzo[d,f][1,3,2]dioxaphosphin-2-yl)oxy]ethyl]amine, bis(2,4-di-tert-butyl-6-methylphenyl)ethyl phosphite, and tris(2,4-di-tert-butylphenyl)phosphite. Examples of commercially available antioxidants include ADEKA STAB AO-20, ADEKA STAB AO-30, ADEKA STAB AO-40, ADEKA STAB AO-50, ADEKA STAB AO-50F, ADEKA STAB AO-60, ADEKA STAB AO-60G, ADEKA STAB AO-80, ADEKA STAB AO-330, ADEKA STAB AO-412S, ADEKA STAB 2112, ADEKA STAB PEP-36, and ADEKA STAB HP-10 (all manufactured by ADEKA CORPORATION), and JP-650 (manufactured by JOHOKU CHEMICAL CO., LTD.). Antioxidants can also use compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, compounds described in International Publication No. 2017 / 006600, compounds described in International Publication No. 2017 / 164024, and compounds described in Korean Publication No. 10-2019-0059371. In the total solid content of the resin composition, the content of the antioxidant is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. The resin composition may contain only one antioxidant or more than two. When containing more than two, it is preferred that the total amount of these is within the above range.

[0552] 《Other ingredients》

[0553] The resin composition of the present invention may contain sensitizers, curing accelerators, fillers, thermosetting accelerators, plasticizers and other auxiliary agents (e.g., conductive particles, defoamers, flame retardants, leveling agents, stripping accelerators, fragrances, surface tension regulators, chain transfer agents, etc.) as needed. By appropriately containing these ingredients, properties such as film properties can be adjusted. Regarding these ingredients, for example, the records of paragraphs 0183 and later of Japanese Patent Application Publication No. 2012-003225 (paragraph 0237 of the corresponding U.S. Patent Application Publication No. 2013 / 0034812 specification), paragraphs 0101 to 0104, 0107 to 0109 of Japanese Patent Application Publication No. 2008-250074, etc., can be referenced, and these contents are incorporated into this specification. In addition, the resin composition of the present invention may contain potential antioxidants as needed. As a potential antioxidant, the following compounds can be mentioned: the site that acts as an antioxidant is protected by a protecting group and the protecting group is detached and acts as an antioxidant by heating at 100 to 250 ° C or heating at 80 to 200 ° C in the presence of an acid / base catalyst. As a potential antioxidant, the compounds described in International Publication No. 2014 / 021023, International Publication No. 2017 / 030005, and Japanese Patent Publication No. 2017-008219 can be mentioned. As a commercially available product of a potential antioxidant, ADEKA ARKLS GPA-5001 (made by ADEKA CORPORATION) can be mentioned.

[0554] <Storage Container>

[0555] As the storage container of the resin composition of the present invention, there is no particular limitation, and a known storage container can be used. In addition, as the storage container, for the purpose of suppressing impurities from being mixed into the raw materials and the resin composition, it is also preferred to use a multilayer bottle having a container inner wall composed of 6 kinds of 6 layers of resins, or a bottle having a 7-layer structure of 6 kinds of resins. As such a container, for example, the container described in Japanese Patent Publication No. 2015-123351 can be cited. In addition, the inner wall of the container is also preferably set to glass, stainless steel, etc., for the purpose of preventing metal from dissolving from the inner wall of the container, improving the stability of the resin composition over time, or suppressing the deterioration of components, etc.

[0556] <Method for preparing resin composition>

[0557] The resin composition of the present invention can be prepared by mixing the aforementioned components. When preparing the resin composition, all the components can be dissolved or dispersed in a solvent at the same time to prepare the resin composition, or more than 2 parts of a solution or dispersion liquid appropriately formulated with each component can be prepared in advance as needed, and these can be mixed to prepare the resin composition when used (when applied).

[0558] When preparing resin composition, pigment dispersion process can be included. In pigment dispersion process, as mechanical force for dispersing pigment, compression, extrusion, impact, shearing, pitting etc. can be mentioned. As the specific example of these processes, bead milling, sand milling, roller milling, ball milling, coating stirring, micro jet, high-speed impeller, sand mixing, jet mixing, high-pressure wet micronization, ultrasonic dispersion etc. can be mentioned. And, in the pulverization of pigment in sand mill (bead mill), it is preferably processed under the condition of improving pulverization efficiency by using micro beads with small diameter, increasing the filling rate of micro beads, etc. And, preferably after pulverization, coarse particles are removed by filtering, centrifugation etc. In addition, regarding the pigment dispersion process and disperser, it is preferred to use the process and disperser described in paragraph 0022 of "Dispersion Technology Collection, JOHOKIKO CO., LTD., July 15, 2005" or "Dispersion Technology and Practical Industrial Application Comprehensive Data Collection Centering on Suspension (Solid / Liquid Dispersion System), Business Development Center Publishing Department, October 10, 1978", and Japanese Patent Publication No. 2015-157893. In addition, in the pigment dispersion process, the pigment can be micronized by a salt milling process. For example, the materials, equipment, and processing conditions used in the salt milling process can refer to the records of Japanese Patent Publication No. 2015-194521 and Japanese Patent Publication No. 2012-046629. As microbead materials for dispersion, zirconium dioxide, agate, quartz, titanium dioxide, tungsten carbide, silicon nitride, aluminum oxide, stainless steel, and glass can be cited. Furthermore, the microbeads may be inorganic compounds having a Mohs hardness of 2 or more. The microbeads may be contained in the resin composition in an amount of 1 to 10,000 ppm.

[0559] When preparing resin composition, it is preferred to utilize a filter to filter the resin composition for the purpose of removing foreign matter, reducing defects, etc. As a filter, as long as it is a filter that has always been used for filtering purposes, it can be used without particular limitation. For example, filters using materials such as fluororesins such as polytetrafluoroethylene (PTFE), polyamide resins such as nylon (such as nylon-6, nylon-6,6), polyethylene, polypropylene (PP) and polyolefin resins (including high-density, ultra-high molecular weight polyolefin resins) can be cited. Among these materials, polypropylene (including high-density polypropylene) and nylon are preferred.

[0560] The pore size of the filter is preferably 0.01 to 7.0 μm, more preferably 0.01 to 3.0 μm, and further preferably 0.05 to 0.5 μm. As long as the pore size of the filter is within the above range, fine foreign matter can be removed more reliably. Regarding the pore size value of the filter, the nominal value of the filter manufacturer can be referred to. Regarding the filter, various filters provided by Nihon Pall Ltd. (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., NihonEntegris KK (Formerly Nippon Mykrolis Corporation) and KITZ MICROFILTERCorporation can be used.

[0561] Furthermore, it is also preferred to use a fibrous filter material as the filter. Examples of the fibrous filter material include polypropylene fiber, nylon fiber, glass fiber, etc. Examples of commercially available products include SBP series (SBP008, etc.), TPR series (TPR002, TPR005, etc.), and SHPX series (SHPX003, etc.) manufactured by ROKI TECHNOCO., LTD.

[0562] When using filters, different filters (e.g., a first filter and a second filter, etc.) may be combined. In this case, filtering using each filter may be performed only once or twice or more. Furthermore, filters with different pore sizes may be combined within the above range. Furthermore, filtering using the first filter is performed only on the dispersion, and filtering may be performed using the second filter after mixing other components.

[0563] <Film>

[0564] Next, the film of the present invention is described. The film of the present invention is a film obtained from the resin composition of the present invention described above. The film of the present invention can be preferably used as an optical filter. The purpose of the optical filter is not particularly limited, and examples include infrared cut-off filters, infrared transmission filters, and the like. As infrared cut-off filters, for example, infrared cut-off filters on the light-receiving side of a solid-state imaging element (for example, infrared cut-off filters for wafer-level lenses, etc.), infrared cut-off filters on the back side (the side opposite to the light-receiving side) of a solid-state imaging element, infrared cut-off filters for ambient light sensors (for example, an illumination sensor that senses the illumination and hue of the environment in which an information terminal device is placed and adjusts the hue of the display, and a color correction sensor that adjusts the hue), etc. In particular, it can be preferably used as an infrared cut-off filter on the light-receiving side of a solid-state imaging element. As infrared transmission filters, filters that shield visible light and enable selective transmission of infrared rays above a specific wavelength can be cited.

[0565] The film of the present invention may have a pattern or may be a film without a pattern (flat film). Furthermore, the film of the present invention may be laminated on a support for use or may be peeled off from a support for use. As a support, a semiconductor substrate such as a silicon substrate or a transparent substrate may be cited.

[0566] A charge coupled device (CCD), a complementary metal oxide film semiconductor (CMOS), a transparent conductive film, etc. can be formed on a semiconductor substrate used as a support. In addition, a partition wall is formed on the semiconductor substrate to isolate each pixel. As the partition wall, metal, metal oxide, black matrix, etc. can be cited. In addition, a primer layer for improving the adhesion with the upper layer, preventing the diffusion of substances, or flattening the substrate surface can be provided on the semiconductor substrate as needed.

[0567] As a transparent substrate that can be used as a support, as long as it is composed of a material that can at least transmit visible light, it is not particularly limited. For example, a substrate composed of materials such as glass and resin can be cited. As a resin, polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polyethylene, polypropylene, and ethylene / vinyl acetate copolymers, norbornene resins, polyacrylates, acrylic resins such as polymethyl methacrylate, urethane resins, vinyl chloride resins, fluororesins, polycarbonate resins, polyvinyl butyral resins, polyvinyl alcohol resins, etc. can be cited. As glass, soda-lime glass, borosilicate glass, alkali-free glass, quartz glass, copper-containing glass, etc. can be cited. As copper-containing glass, copper-containing phosphate glass, copper-containing fluorophosphate glass, etc. can be cited. Copper-containing glass can also use commercial products. As commercial products of copper-containing glass, NF-50 (AGC TECHNO GLASS Co., Ltd. system) can be cited.

[0568] The thickness of the film of the present invention can be appropriately adjusted according to the purpose. The thickness of the film can be set to 200 μm or less, 150 μm or less, 120 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. The lower limit of the thickness of the film is preferably 0.1 μm or more, more preferably 0.2 μm or more.

[0569] When the film of the present invention is used as an infrared cut filter, the film of the present invention preferably has a maximum absorption wavelength in the range of wavelengths of 650 to 1500 nm (preferably wavelengths of 660 to 1200 nm, more preferably wavelengths of 660 to 1000 nm). In addition, the average transmittance of light of wavelengths of 420 to 550 nm is preferably 50% or more, more preferably 70% or more, further preferably 80% or more, and particularly preferably 85% or more. In addition, the transmittance in all ranges of wavelengths of 420 to 550 nm is preferably 50% or more, more preferably 70% or more, and further preferably 80% or more. In addition, the transmittance of the film of the present invention at least one point in the range of wavelengths of 650 to 1500 nm (preferably wavelengths of 660 to 1200 nm, more preferably wavelengths of 660 to 1000 nm) is preferably 15% or less, more preferably 10% or less, and further preferably 5% or less. Furthermore, when the absorbance at the maximum absorption wavelength is defined as 1, the average absorbance of the film of the present invention in the wavelength range of 420 to 550 nm is preferably less than 0.030, and more preferably less than 0.025.

[0570] When the film of the present invention is used as an infrared transmission filter, the film of the present invention preferably has any one of the following spectral characteristics (i1) to (i3), for example.

[0571] (i1): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 850 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm. A film having such spectral characteristics can shield light in the wavelength range of 400 to 850 nm and transmit light with a wavelength greater than 950 nm.

[0572] (i2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 950 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm. A film having such spectral characteristics can shield light in the wavelength range of 400 to 950 nm and transmit light with a wavelength greater than 1050 nm.

[0573] (i3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 1050 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm. A film having such spectral characteristics can shield light in the wavelength range of 400 to 1050 nm and transmit light with a wavelength greater than 1150 nm.

[0574] The film of the present invention can also be used in combination with a color filter comprising a color colorant. The color filter can be manufactured using a coloring composition comprising a color colorant. When the film of the present invention is used as an infrared cutoff filter, and when the film of the present invention and the color filter are used in combination, the color filter is preferably configured on the optical path of the film of the present invention. For example, the film of the present invention is preferably stacked with a color filter and used as a laminate. In the laminate, the film of the present invention and the color filter may be adjacent or non-adjacent in the thickness direction. When the film of the present invention and the color filter are non-adjacent in the thickness direction, the film of the present invention may be formed on a support different from the support formed with the color filter, and other components constituting a solid-state imaging element (e.g., microlenses, planarization layers, etc.) may also be sandwiched between the film of the present invention and the color filter.

[0575] The film of the present invention can be used in various devices such as solid-state imaging elements such as CCD (charge coupled device), CMOS (complementary metal oxide semiconductor) (in addition to Si, the imaging part can also use compound semiconductors such as InGaAs, organic semiconductors, quantum dots, etc.), infrared sensors, light-emitting elements, optical communication elements (including transceivers), image display devices, etc.

[0576] <Method for producing film>

[0577] The film of the present invention can be produced through a step of applying the resin composition of the present invention.

[0578] As a support, the above-mentioned support can be cited. As a coating method for the resin composition, a known method can be used. For example, a drop method (drop casting); a slit coating method; a spray method; a roller coating method; a spin coating method (spin coating); a cast coating method; a slit spin coating method; a pre-wetting method (for example, a method described in Japanese Patent Publication No. 2009-145395); various printing methods such as inkjet (for example, on-demand method, piezoelectric method, thermal method), nozzle jetting, etc., flexographic printing, screen printing, gravure printing, reverse offset printing, metal mask printing, etc.; a transfer method using a mold, etc.; a nanoimprint method, etc. There is no particular limitation on the applicable method in inkjet, and examples thereof include the method described in "Expansion and Use of Inkjet - Infinite Possibilities Emerging from Patents -, published in February 2005, Sumitbe Techon Research Co., Ltd." (especially pages 115 to 133) or Japanese Patent Gazette No. 2003-262716, Japanese Patent Gazette No. 2003-185831, Japanese Patent Gazette No. 2003-261827, Japanese Patent Gazette No. 2012-126830, Japanese Patent Gazette No. 2006-169325, etc.

[0579] The resin composition layer formed by the coating resin composition can be dried (prebaked). When prebaking, the prebaking temperature is preferably below 150°C, more preferably below 120°C, and further preferably below 110°C. The lower limit can be set to, for example, above 50°C, and can also be set to above 80°C. The prebaking time is preferably 10 seconds to 3000 seconds, more preferably 40 to 2500 seconds, and further preferably 80 to 220 seconds. Drying can be performed using a hot plate, an oven, or the like.

[0580] The method for manufacturing the film may further include a pattern forming step. As the pattern forming method, a pattern forming method using photolithography and a pattern forming method using dry etching can be cited, preferably a pattern forming method using photolithography. In addition, when the film of the present invention is used as a flat film, the pattern forming step may not be performed. Hereinafter, the pattern forming step will be described in detail.

[0581] (When patterning is performed by photolithography)

[0582] The pattern forming method utilizing photolithography preferably includes a process (exposure process) of pattern-like exposure of the resin composition layer formed by applying the resin composition of the present invention and a process (development process) of removing the resin composition layer of the unexposed portion by development to form a pattern. The process (post-baking process) of baking the developed pattern can be provided as required. Hereinafter, each process is described.

[0583] In the exposure step, the resin composition layer is exposed in a pattern. For example, the resin composition layer is exposed through a mask having a predetermined mask pattern using a stepper or a scanner, thereby exposing the resin composition layer in a pattern. Thus, the exposed portion can be cured.

[0584] As radiation (light) that can be used for exposure, g-rays, i-rays, etc. can be cited. In addition, light with a wavelength of 300nm or less (preferably light with a wavelength of 180 to 300nm) can also be used. As light with a wavelength of 300nm or less, KrF rays (wavelength 248nm), ArF rays (wavelength 193nm), etc. can be cited, preferably KrF rays (wavelength 248nm). In addition, long-wave light sources with a wavelength of more than 300nm can also be used.

[0585] Furthermore, during exposure, light can be continuously irradiated for exposure, or pulsed irradiation can be performed for exposure (pulse exposure). In addition, pulse exposure refers to an exposure method in which light irradiation and pause are repeated in a short time (e.g., less than millisecond level) cycle to perform exposure.

[0586] The irradiation amount (exposure amount) is preferably, for example, 0.03 to 2.5 J / cm 2 , more preferably 0.05 to 1.0 J / cm 2 The oxygen concentration during exposure can be appropriately selected. In addition to exposure under the atmosphere, exposure can also be performed in a low oxygen environment with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially oxygen-free), or in a high oxygen environment with an oxygen concentration exceeding 21% by volume (e.g., 22% by volume, 30% by volume, or 50% by volume). In addition, the exposure illuminance can be appropriately set, usually from 1000 W / m 2 ~100000W / m 2 (For example, 5000W / m 2 , 15000W / m 2 or 35000W / m 2 The oxygen concentration and exposure illuminance conditions can be appropriately combined, for example, the oxygen concentration can be set to 10% by volume and the illuminance can be set to 10000 W / m 2 , oxygen concentration is 35 volume % and illumination is 20000 W / m 2 wait.

[0587] Next, the resin composition layer of the unexposed portion of the resin composition layer after exposure is developed to form a pattern. The development and removal of the resin composition layer of the unexposed portion can be performed using a developer. As a result, the resin composition layer of the unexposed portion in the exposure process is dissolved into the developer, and only the photocured portion remains on the support. The temperature of the developer is preferably 20 to 30° C., for example. The development time is preferably 20 to 180 seconds. In addition, in order to improve the removability of the residue, the following process can be repeated multiple times: the developer is shaken off every 60 seconds, and a new developer is supplied.

[0588] The developer can include organic solvents, alkali developers, etc., and alkali developers can be preferably used. As an alkali developer, an alkaline aqueous solution (alkaline developer) obtained by diluting an alkali agent with pure water is preferably used. As an alkali agent, for example, organic alkaline compounds such as ammonia, ethylamine, diethylamine, dimethylethanolamine, diethylene glycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, choline, pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]-7-undecene, or inorganic alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate, and sodium metasilicate can be mentioned. From the perspective of environment and safety, the alkali agent is preferably a compound with a large molecular weight. The concentration of the alkali agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass. Furthermore, the developer may further contain a surfactant. As the surfactant, a nonionic surfactant is preferred. From the viewpoint of facilitating transportation and storage, the developer may be first prepared as a concentrated solution and diluted to a desired concentration when used. The dilution ratio is not particularly limited, and can be set, for example, in the range of 1.5 to 100 times. Furthermore, it is also preferred to wash (rinse) with pure water after development. Furthermore, regarding rinsing, it is preferred to rotate the support on which the developed resin composition layer is formed while supplying a rinsing liquid to the developed resin composition layer. Furthermore, it is also preferred to move the nozzle that sprays the rinsing liquid from the center of the support to the peripheral portion of the support. At this time, when the nozzle is moved from the center of the support to the peripheral portion, the nozzle can be moved while gradually reducing the moving speed. By rinsing in this way, the unevenness of the rinsed surface can be suppressed. Furthermore, the same effect can be obtained by gradually reducing the rotation speed of the support while moving the nozzle from the center of the support to the peripheral portion.

[0589] After development, it is preferred to perform additional exposure treatment or heating treatment (post-baking) after drying. Additional exposure treatment or post-baking is a post-development curing treatment for making a fully cured film. For example, the heating temperature in the post-baking is preferably 100 to 240°C, more preferably 200 to 240°C. The developed film can be post-baked in a continuous or intermittent manner using a heating mechanism such as a heating plate or a convection oven (hot air circulation dryer), a high-frequency heater, etc. in a manner that meets the above conditions. When performing additional exposure treatment, the light used for exposure is preferably light with a wavelength of less than 400nm. In addition, the additional exposure treatment can be performed by the method described in Korean Patent Gazette No. 10-2017-0122130.

[0590] (In the case of forming a pattern by dry etching)

[0591] When forming a pattern by dry etching, it can be carried out by the following method: the resin composition layer formed by coating the above-mentioned resin composition on the support is cured to form a cured layer, and then a patterned photoresist layer is formed on the cured layer, and then the patterned photoresist layer is used as a mask, and the cured layer is dry-etched using an etching gas. When forming the photoresist layer, it is preferred to perform a pre-baking treatment. For the content of forming a pattern by dry etching, reference can be made to the records of paragraphs 0010 to 0067 of Japanese Patent Publication No. 2013-064993, which are incorporated into this specification.

[0592] <Optical filter>

[0593] The optical filter of the present invention has the above-mentioned film of the present invention. Examples of the types of optical filters include infrared cut filters and infrared transmission filters.

[0594] The optical filter of the present invention may further have a copper-containing layer, a dielectric multilayer film, an ultraviolet absorption layer, etc. in addition to the above-mentioned film of the present invention. As the ultraviolet absorption layer, for example, the absorption layer described in paragraphs 0040 to 0070 and 0119 to 0145 of International Publication No. 2015 / 099060 may be cited. As the dielectric multilayer film, the dielectric multilayer film described in paragraphs 0255 to 0259 of Japanese Patent Publication No. 2014-041318 may be cited. As the copper-containing layer, a glass substrate composed of copper-containing glass (copper-containing glass substrate) and a layer containing a copper complex (copper-containing complex layer) may also be used. As the copper-containing glass substrate, copper-containing phosphate glass, copper-containing fluorophosphate glass, etc. may be cited. As commercial products containing copper glass, NF-50 (AGC TECHNO GLASS Co., Ltd.), BG-60, BG-61 (above, Schott AG), CD5000 (HOYA CORPORATION) and the like can be cited. As preferred substrates, transparent substrates made of materials such as glass and resin can be cited, and it is also preferred to form films directly on various elements. As resins, polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polyethylene, polypropylene, and ethylene / vinyl acetate copolymers, norbornene resins, acrylic acid esters, acrylic resins such as polymethyl methacrylate, carbamate resins, vinyl chloride resins, fluororesins, polycarbonate resins, polyvinyl butyral resins, polyvinyl alcohol resins, and the like can be cited. As glass, soda-lime glass, borosilicate glass, alkali-free glass, quartz glass, copper-containing glass, and the like can be cited.

[0595] <Solid-state imaging device>

[0596] The solid-state imaging device of the present invention includes the film of the present invention. The structure of the solid-state imaging device is not particularly limited as long as it has the structure of the film of the present invention and functions as a solid-state imaging device. For example, the following structures can be cited.

[0597] The above structure is a transmission electrode composed of a plurality of photodiodes and polysilicon etc. constituting a light receiving area of ​​a solid-state imaging element on a support, a light shielding film composed of tungsten etc. which is opened only in the light receiving part of the photodiode on the photodiode and the transmission electrode, an element protection film composed of silicon nitride etc. formed in a manner covering the entire light shielding film and the light receiving part of the photodiode on the light shielding film, and a film of the present invention on the element protection film. Furthermore, it can also be a structure having a focusing mechanism (for example, a microlens etc., the same below) on the element protection film and below the film of the present invention (close to the support side) or a structure having a focusing mechanism on the film of the present invention. In addition, the color filter can also have the following structure: for example, a film forming each pixel is embedded in a space divided into a grid shape by a partition wall. At this time, the partition wall preferably has a lower refractive index than each pixel. As an example of an imaging device having such a structure, devices described in Japanese Patent Publication No. 2012-227478 and Japanese Patent Publication No. 2014-179577 can be cited.

[0598] <Image Display Device>

[0599] The image display device of the present invention includes the film of the present invention. As the image display device, a liquid crystal display device, an organic electroluminescent (organic EL) display device, etc. can be cited. The definition and details of the image display device are recorded in, for example, "Electronic Display Device (written by Akio Sasaki, Kogyo Chosakai Publishing Co., Ltd., published in 1990)", "Display Device (written by Junzhang Ibuki, Sangyo Tosho Publishing Co., Ltd., published in 1989)", etc. In addition, regarding the liquid crystal display device, it is recorded in, for example, "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, Kogyo Chosakai Publishing Co., Ltd., published in 1994)". There is no particular limitation on the liquid crystal display device to which the present invention can be applied, for example, it can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology". The image display device can have a white organic EL element. As a white organic EL element, a tandem structure is preferred. The series structure of organic EL elements is described in Japanese Patent Publication No. 2003-045676, supervised by Akiyoshi Mikami, "The Forefront of Organic EL Technology Development - High Brightness, High Precision, Long Life, Technology Collection", TECHNICAL INFORMATION INSTITUTE CO., LTD., pp. 326-328, 2008, etc. The spectrum of white light emitted by the organic EL element preferably has strong maximum emission peaks in the blue region (430-485nm), the green region (530-580nm) and the yellow region (580-620nm). It is more preferred that in addition to these emission peaks, it further has a maximum emission peak in the red region (650-700nm). The film of the present invention can also be used as an infrared-transmitting film provided in an opening for infrared communication formed in a frame portion of a protective plate for a display device.

[0600] <Infrared sensor>

[0601] The infrared sensor of the present invention includes the above-mentioned film of the present invention. The structure of the infrared sensor is not particularly limited as long as it functions as an infrared sensor. Hereinafter, one embodiment of the infrared sensor of the present invention will be described with reference to the drawings.

[0602] Figure 1 , reference numeral 110 denotes a solid-state imaging element. An infrared cut filter 111 and an infrared transmission filter 114 are disposed on the imaging region of the solid-state imaging element 110. Furthermore, a color filter 112 is disposed on the infrared cut filter 111. A microlens 115 is disposed on the incident light hv side of the color filter 112 and the infrared transmission filter 114. A planarization layer 116 is formed so as to cover the microlens 115.

[0603] The infrared cut-off filter 111 can be formed using the resin composition of the present invention. The color filter 112 is a color filter formed with pixels that transmit and absorb light of a specific wavelength in the visible region, and is not particularly limited, and a color filter for pixel formation known in the past can be used. For example, a color filter formed with pixels of red (R), green (G), and blue (B) can be used. For example, reference can be made to the records of paragraphs 0214 to 0263 of Japanese Patent Gazette No. 2014-043556, which are incorporated into this specification. The infrared transmission filter 114 can select its characteristics according to the light emission wavelength of the infrared LED used. The infrared transmission filter 114 can be formed using the resin composition of the present invention.

[0604] Figure 1 In the infrared sensor shown, an infrared cut filter (other infrared cut filter) different from the infrared cut filter 111 can be further configured on the flattening layer 116. As other infrared cut filters, those having a copper-containing layer and / or a dielectric multilayer film can be cited. The above contents can be cited for details of these. In addition, as other infrared cut filters, a dual-bandpass filter can be used.

[0605] <Camera Module>

[0606] The camera module of the present invention includes a solid-state imaging element and the above-mentioned film of the present invention. The camera module preferably further has a lens and a circuit for processing an image obtained from the solid-state imaging element. The solid-state imaging element used in the camera module may be the solid-state imaging element involved in the above-mentioned present invention, or a known solid-state imaging element. In addition, as the lens used in the camera module and the circuit for processing the image obtained from the above-mentioned solid-state imaging element, known lenses and circuits can be used. As examples of camera modules, reference can be made to the camera modules described in Japanese Patent Gazette No. 2016-006476 and Japanese Patent Gazette No. 2014-197190, and these contents are incorporated into this specification.

[0607] <Light Emitting Element>

[0608] The film of the present invention can also be used for light-emitting elements. As the structure of the light-emitting element, as long as it is a structure that can function as a light-emitting element, it is not particularly limited, and examples include light-emitting diodes (LEDs), organic light-emitting diodes (OLDs), quantum dot light-emitting diodes (QLEDs), vertical cavity surface-emitting lasers (VICSELs), etc. The film of the present invention can be directly formed on the light-emitting element, and can also be arranged on the light-emitting path.

[0609] <Optical Communication Components>

[0610] The film of the present invention can also be used in optical communication components. As long as the structure of the optical communication component can function as an optical communication component, it is not particularly limited, and can be a transmitting component or a receiving component. As optical communication components, infrared remote controllers, infrared transceivers, optical interposers, optical interconnects, etc. can be cited. The film of the present invention can be directly formed on the receiving component, can be directly formed on the transmitting component, or can be arranged on the transmitting and receiving path.

[0611] Example

[0612] The present invention will be described in further detail below with reference to Examples. The materials, usage amounts, ratios, treatment contents, treatment sequence, etc. shown in the following Examples may be appropriately changed without departing from the gist of the present invention.

[0613] <Measurement of Weight Average Molecular Weight>

[0614] The weight average molecular weight of the resin was determined as follows: HPC-8220GPC (manufactured by TOSOH CORPORATION) was used as a measuring apparatus, a directly connected TSK guard column Super HZ-L was used as a guard column, and columns of TSK gel Super HZ M-M, TSK gel Super HZ4000, TSK gel Super HZ3000, and TSK gel Super HZ2000 were used as columns. The column temperature was set to 40°C, 10 μL of a tetrahydrofuran solution with a sample concentration of 0.1% by mass was injected into the column, and tetrahydrofuran as an elution solvent was allowed to flow at a flow rate of 0.35 mL per minute. The sample peak was detected by an RI (differential refractive index) detection device, and calculations were performed using a calibration curve prepared using standard polystyrene.

[0615] <Synthesis Example of Compound>

[0616] (Synthesis Example 1) Synthesis of Compound 033

[0617] [Chemical formula 39]

[0618]

[0619] [Chemical formula 40]

[0620]

[0621] [Chemical formula 41]

[0622]

[0623] -Synthesis process of compound 033K-

[0624] Bromobenzene 10.0 g (63.7 mmol), 2,4,6-trimethylaniline 8.78 g (65.0 mmol; 1.02 eq.), tert-butoxysodium 9.18 g (95.5 mmol; 1.5 eq.), and toluene 30 mL were mixed. Then, the operation of degassing under reduced pressure and then replacing with nitrogen was repeated three times, and then 0.286 g (1.27 mmol; 0.02 eq.) of palladium acetate and 0.924 g (3.18 mmol; 0.05 eq.) of tri-tert-butylphosphonium tetrafluoroborate were added. Then, the operation of degassing under reduced pressure and then replacing with nitrogen was repeated three times, and then the reaction was allowed to proceed at 120°C for 4 hours in a nitrogen stream. After natural cooling, water was added, and ethyl acetate (EtOAc) was added to separate the liquids. The obtained organic layer was washed with brine, dried over MgSO 4 , concentrated under reduced pressure, and purified by silica gel column chromatography (developing solvent: hexane) to obtain 12.05 g of Compound 033K. The yield was 90%.

[0625] TLC (Thin-Layer Chromatography) f Value = 0.26 (hexane)

[0626] 1 H NMR (CDCl3)d 2.17 (s, 3H), 2.18 (s, 3H), 2.30 (s, 3H), 5.09 (s, 1H), 6.47-6.49 (m, 2H), 6.72 (t, J=7.2Hz, 1H), 6.94 (s, 2H), 7.14 (t, J=7.2Hz, 2H).

[0627] -Synthesis process of compound 033A-

[0628] 4.19 g (19.8 mmol) of compound 033K was dissolved in 49.6 mL of dehydrated DMF (N, N-dimethylformamide), and 0.952 g (23.8 mmol; 1.2 eq.) of sodium hydride was added little by little under ice cooling, and stirred in a water bath for 30 minutes. 4.77 g (23.8 mmol; 1.2 eq.) of ethyl p-toluenesulfonate was added little by little under ice cooling, and the mixture was reacted in an oil bath at 90°C for 2 hours and at 100°C for 3 hours. After natural cooling, water was added, and ethyl acetate was added and the mixture was separated. The obtained organic layer was washed with water 3 times, washed with brine, dried with Na2SO4, concentrated under reduced pressure, and purified by silica gel column chromatography (developing solvent: hexane), thereby obtaining 4.05 g of compound 033A. The yield was 85%.

[0629] TLC R f Value = 0.55 (hexane)

[0630] 1 H NMR(CDCl3)d 1.20 (t, J=7.2Hz, 3H), 2.06 (s, 6H), 2.31 (s, 3H), 3.57 (q, J=7.2Hz, 2H), 6 .39-6.41 (m, 2H), 6.61-6.65 (m, 1H), 6.95 (s, 2H), 7.14 (t, J=7.6Hz, 2H).

[0631] 13 C NMR(CDCl3)d 13.23, 18.31, 20.97, 45.30, 111.16, 115.68, 129.16, 129.60, 136.34, 137.85, 140.30, 147.64.

[0632] -Synthesis process of compound 033B-

[0633] 9.49 g (39.6 mmol) of compound 033A was dissolved in 198 mL of dehydrated DMF, and a solution of 7.06 g (39.6 mmol) of N-bromosuccinimide (1.0 eq.) dissolved in 23.8 mL of dehydrated DMF was added dropwise under ice-cooling for 40 minutes, stirred in an ice bath for 30 minutes, and stirred at room temperature for 3 hours. 100 mL of water was added under ice-cooling, and 200 mL of ethyl acetate and 100 mL of water were added to separate the liquids. The obtained organic layer was washed with water twice, washed with brine, dried with Na2SO4, concentrated under reduced pressure, and purified by silica gel column chromatography (developing solvent: hexane), thereby obtaining 12.31 g of compound 033B. The yield was 98%.

[0634] TLC R f Value = 0.62 (hexane)

[0635] 1 H NMR (CDCl3)d 1.19 (t, J=7.2Hz, 3H), 2.04 (s, 6H), 2.31 (s, 3H), 3.52 (q, J=7.2Hz, 2H), 6.20-6.35 (m, 2H), 6.95 (s, 2H), 7.19 (d, J=8.8Hz, 2H).

[0636] 13 C NMR(CDCl3)d 13.01, 18.20, 20.96, 45.44, 107.52, 112.85, 129.72, 131.82, 136.69, 137.59, 139.75, 146.70.

[0637] -Synthesis process of compound 033C-

[0638] 5.00 g (15.7 mmol) of compound 033B was dissolved in 100 mL of 4-methyltetrahydropyran, and 4.99 g (19.6 mmol; 1.25 eq.) of bis(pinacol)diboron and 1.93 g (19.6 mmol; 1.25 eq.) of potassium acetate were added. Then, the operation of degassing under reduced pressure and replacing with nitrogen was repeated three times, and 0.575 g (0.79 mmol; 5 mol%) of [1,1'-bis(diphenylphosphino)ferrocene]dichloropalladium (dppf) was added. Then, the operation of degassing under reduced pressure and replacing with nitrogen was repeated three times, and then the reaction was allowed to proceed at 100°C in a nitrogen stream for 45 hours. After natural cooling, water and ethyl acetate were added and the liquids were separated. The obtained organic layer was washed with brine, dried over Na2SO4, concentrated under reduced pressure, and purified by silica gel column chromatography (developing solvent: hexane:ethyl acetate = 9:1 (mass ratio)) to obtain 2.90 g of Compound 033C. The yield was 51%.

[0639] TLC R f Value = 0.57 (hexane: ethyl acetate = 9:1 (mass ratio))

[0640] 1 H NMR(CDCl3)d 1.21 (t, J=7.2Hz, 3H), 1.30 (s, 12H), 2.04 (s, 6H), 2.32 (s, 3H), 3.52 (q, J=7.2Hz, 2H), 6.00-6.90 (br, 2H), 6.96 (s, 2H), 7.60-7.70 (br, 2H).

[0641] 13 C NMR(CDCl3)d 13.05, 18.21, 20.96, 24.83, 45.46, 83.08, 127.71, 129.64, 134.73, 136.32, 136.56, 137.50, 139.82, 150.02.

[0642] -Synthesis process of compound 4D-

[0643] Compound 4D was synthesized by the method described in the literature (Angew. Chem. Int. Ed., 2013, Vol. 52, pp. 8990-8994).

[0644] -Synthesis process of compound 033E-

[0645] After dissolving 2.0 g (5.05 mmol) of compound 4D in 105 mL of dehydrated diethyl ether and 34.8 mL of dehydrated THF (tetrahydrofuran), the mixture was cooled in a dry ice-acetone bath, and 6.82 mL (10.9 mmol; 2.16 eq.) of n-butyl lithium (BuLi) (1.6 mol / L) was added dropwise at an internal temperature of -74°C or less, and the mixture was stirred for 2 hours. A solution of 1.28 g (5.05 mmol; 1.0 eq.) of dichlorodiphenylsilane (Ph2SiCl2) dissolved in 14 mL of dehydrated diethyl ether was added dropwise at an internal temperature of -75°C or less over 1 hour, and the mixture was stirred while slowly heating to 0°C over 6 hours while immersed in a cold bath. 50 mL of water was added, and ethyl acetate was added to separate the liquids. The obtained organic layer was washed with brine, dried over Na2SO4, concentrated under reduced pressure, and purified by silica gel column chromatography (developing solvent: hexane:ethyl acetate=19:1 (mass ratio)) to obtain 0.80 g of Compound 033E. The yield was 38%.

[0646] TLC R f =0.24 (hexane:ethyl acetate=19:1 (mass ratio))

[0647] 1 H NMR (CDCl3)d 4.37 (s, 4H), 7.16 (d, J=5.2Hz, 2H), 7.32-7.36 (m, 4H), 7.37-7.42 (m, 4H), 7.58 (dd, J=1.2 and 8.0Hz, 4H).

[0648] 13 C NMR(CDCl3)d 66.20, 104.79, 126.36, 128.07, 129.99, 131.42, 133.29, 133.79, 135.60, 155.25.

[0649] 29 Si NMR (CDCl3) d-33.27.

[0650] -Synthesis process of compound 033F-

[0651] After dissolving 0.50 g (1.2 mmol) of compound 033E in 12 mL of dehydrated THF, the mixture was cooled in a dry ice-acetone bath, and 3.6 mL (3.6 mmol; 3.0 eq.) of a toluene solution of lithium diisopropylamine (LDA) (1 mol / L) was added dropwise at an internal temperature of -76°C or below, and the mixture was stirred for 2 hours. A solution of 0.86 g (2.6 mmol; 2.2 eq.) of 1,2-dibromotetrachloroethane dissolved in 2 mL of dehydrated THF was added dropwise, and the mixture was stirred overnight while slowly heating the mixture in a cold bath. 10 mL of water was added, and ethyl acetate was added to separate the layers. The obtained organic layer was washed with brine, dried over Na2SO4, concentrated under reduced pressure, ultrasonically dispersed with hexane and ethyl acetate, filtered, rinsed with hexane, and dried under reduced pressure (60°C), thereby obtaining 0.56 g of compound 033F. The yield was 81%.

[0652] 1 H NMR(CDCl3)d 4.30(s, 4H), 7.04(s, 2H), 7.36-7.43(m, 4H), 7.44-7.46(m, 2H), 7.54-7.56(m, 4H).

[0653] 13 C NMR(CDCl3)d 66.28, 103.75, 114.31, 128.30, 130.45, 131.90, 133.78, 135.11, 135.55, 155.71.

[0654] 29 Si NMR (CDCl3) d-34.72.

[0655] -Synthesis process of compound 033G-

[0656] 0.859 g (1.49 mmol) of compound 033F, 1.20 g (3.28 mmol; 2.2 eq.) of compound 033C, 1.17 g (3.58 mmol; 2.4 eq.) of cesium carbonate, 85.9 mL of 4-methyltetrahydropyran, and 8.59 mL of water were mixed. Then, the operation of degassing under reduced pressure and then replacing with nitrogen was repeated three times, and then 0.133 g (0.149 mmol; 0.1 eq.) of (2-dicyclohexylphosphino-2',4',6'-triisopropyl-1,1'-biphenyl)[2-(2'-amino-1,1'-biphenyl)]methanesulfonate palladium (XPhos Pd G3) was added.

[0657] Next, the operation of degassing under reduced pressure and then replacing with nitrogen was repeated three times, and then the reaction was allowed to proceed at 110°C for 8 hours in a nitrogen stream. After natural cooling, ethyl acetate was added and the liquids were separated. The obtained organic layer was washed with brine, dried over Na2SO4, concentrated under reduced pressure, and purified by silica gel column chromatography (developing solvent: hexane: ethyl acetate = 4:1 (mass ratio)), thereby obtaining compound 033G. The obtained compound 033G was used directly in the next step.

[0658] TLC R f Value = 0.61 (hexane: ethyl acetate = 4:1 (mass ratio))

[0659] 1 H NMR(CDCl3)d 1.20 (t, J=7.2Hz, 6H), 2.05 (s, 12H), 2.32 (s, 6H), 3.58 (q, J=7.2Hz, 4H), 4.38 (s, 4H) , 6.20-6.50 (m, 4H), 6.95 (s, 4H), 7.09 (s, 2H), 7.31-7.39 (m, 10H), 7.62-7.64 (m, 4H).

[0660] 13 C NMR(CDCl3)d 13.15, 18.27, 20.98, 45.46, 66.15, 77.22, 104.92, 111.34, 121.93, 124.64, 127.44, 128 .02, 129.66, 133.62, 134.79, 135.72, 136.58, 137.63, 139.88, 146.62, 147.43, 151.90.

[0661] -Synthesis process of compound 033H-

[0662] Compound 033G was dissolved in 40 mL of dichloromethane, and 2.56 mL (10.2 mmol, 6.9 eq.) of hydrogen chloride (4 mol / L, 1,4-dioxane solution) was added, and stirred at room temperature overnight. It was neutralized with saturated sodium bicarbonate water and separated. The obtained aqueous layer was extracted with CH2Cl2, and the organic layer was dried with Na2SO4, concentrated under reduced pressure, concentrated and recrystallized with CH2Cl2-methanol, filtered and rinsed with methanol, thereby obtaining 0.98 g of compound 033H. The yield was 77% (derived from the yield of compound 033F).

[0663] TLC R f Value = 0.54 (hexane: ethyl acetate = 4:1 (mass ratio))

[0664] 1H NMR(CDCl3)d 1.22(t, J=7.2Hz, 6H), 2.06(s, 12H), 2.32(s, 6H), 3.61(q, J=7.2Hz, 4H) , 6.20-6.50 (m, 4H), 6.96 (s, 4H), 7.35-7.44 (m, 12H), 7.62-7.64 (m, 4H).

[0665] 13 C NMR(CDCl3)d 13.06, 18.22, 20.98, 45.57, 77.22, 104.92, 111.41, 121.10, 126.17, 127.88, 128.32 , 129.74, 132.14, 135.61, 136.83, 137.40, 139.53, 143.58, 148.44, 154.71, 175.72.

[0666] 29 Si NMR (CDCl3) d-34.78.

[0667] -Synthesis process of compound 033I-

[0668] 3 mg of iodine was added to 0.052 g (2.1 mmol; 12 eq.) of magnesium and 1.5 mL of dehydrated THF, and the mixture was heated to about 40°C. Then, a solution of 0.38 g (1.8 mmol; 10 eq.) of 2-bromo-1,3-dimethoxybenzene dissolved in 1.5 mL of dehydrated THF was slowly added dropwise at an internal temperature of 40°C or higher, and the mixture was stirred at an oil bath of 60°C for 4 hours and then cooled to room temperature to prepare a Grignard reagent solution. 0.15 g (0.18 mmol) of compound 033H was dissolved in 1.5 mL of dehydrated THF, and the prepared Grignard reagent solution was added dropwise at an internal temperature of 4°C or lower under an ice bath, and stirred at an oil bath of 50°C for 5 hours. After natural cooling, the reaction solution was concentrated under reduced pressure, and a saturated aqueous ammonium chloride solution and CH2Cl2 were added to separate the liquids. The obtained organic layer was washed with brine, dried over Na2SO4, concentrated under reduced pressure, and purified by silica gel column chromatography (developing solvent: hexane:ethyl acetate = 4:1 (mass ratio)) to obtain 0.096 g of Compound 033I. The yield was 55%.

[0669] TLC R f Value = 0.32 (hexane: ethyl acetate = 4:1 (mass ratio))

[0670] 1H NMR(CD2Cl2)d 1.21 (t, J=7.2Hz, 6H), 1.29-1.34 (br, 1H), 2.06 (s, 12H), 2.33 (s, 6H), 3.59 (q, J=7.2Hz, 4H), 3.60 (s, 6H), 6.20-6. 60(br, 4H), 6.69-6.71(m, 2H), 6.99(s, 4H), 7.15(s, 2H), 7.32-7.37(m, 5H), 7.38-7.45(m, 6H), 7.71-7.80(m, 4H).

[0671] 13 C NMR(CD2Cl2)d 13.26, 18.36, 21.06, 45.76, 56.97, 75.97, 107.02, 111.63, 122.40, 123.48, 127.40, 128.34, 128.41, 129 .91, 129.94, 130.04, 130.50, 135.94, 136.04, 136.97, 137.95, 140.18, 144.79, 147.70, 158.53, 159.98.

[0672] -Synthesis process of compound 033J-

[0673] 0.096 g (0.097 mmol) of compound 033I was dissolved in 5 mL of dichloromethane, and 0.19 mL (0.78 mmol; 8 eq.) of hydrogen chloride (4 mol / L, 1,4-dioxane solution) was added, and stirred at room temperature for 30 minutes. 5 mL of dilute hydrochloric acid (6 mol / L) and CH2Cl2 were added and stirred, and liquid separation was performed. The obtained organic layer was washed with water until the water layer reached pH 7, dried with Na2SO4, and concentrated under reduced pressure to obtain 0.10 g of compound 033J. The obtained compound 033.]- was used directly in the next step.

[0674] TLC R f Value = 0.00 (hexane:ethyl acetate = 4:1 (mass ratio))

[0675] MS (LDI): m / z 969.38 ([M-Cl] + ).

[0676] -Synthesis process of compound 033-

[0677] Compound 033J was suspended in 10 mL of dichloromethane and potassium bis(trifluoromethanesulfonyl)imide (Tf2N - K +) 0.0310 g (0.097 mmol; 1.0 eq.) dissolved in 1 mL of water was added, stirred at room temperature for 50 minutes, and liquid separation was performed. The obtained organic layer was concentrated under reduced pressure and purified by silica gel column chromatography (the developing solution used initially was hexane: ethyl acetate = 4: 1 (mass ratio), and then the developing solution was changed to CH2Cl2: ethyl acetate = 4: 1 (mass ratio)), thereby obtaining 0.092 g of compound 033. The yield was 76% (yield derived from compound 033I).

[0678] TLC R f Value = 0.73 (CH2Cl2: ethyl acetate = 4:1 (mass ratio))

[0679] 1 H NMR (CDCl3)d1.23 (t, J=7.2Hz, 6H), 2.02 (s, 12H), 2.32 (s, 6H), 3.69 (q, J=7.2Hz, 4H), 3.77 (s, 6H), 5.80-6.20 (br , 4H), 6.69 (q, J=8.8Hz, 2H), 6.97 (s, 4H), 7.30-7.43 (br, 2H), 7.45-7.63 (m, 8H), 7.66-7.76 (m, 5H), 7.82 (s, 2H).

[0680] 13 C NMR(CDCl3)d 12.75, 18.04, 20.98, 46.39, 56.31, 77.23, 104.16, 111.41, 114.65, 120.03 (q, J=321.8Hz), 120.53, 129.00, 129.71, 129.98, 131.48, 133.10, 134.62, 135.52, 136.23, 137.90, 138.13, 147.20, 148.23, 151.21, 152.18, 157.86, 167.74.

[0681] 29 Si NMR (CDCl3) d-32.71.

[0682] 19 F NMR (CDCl3) d -78.62.

[0683] MS (LDI): m / z 969.37 ([M-Tf2N] + ), 279.93(Tf2N - ).

[0684] Maximum absorption wavelength = 995nm (CH2Cl2)e1.35×105 L / mol cm

[0685] (Synthesis Example 2) Synthesis of Compound 034

[0686] In the synthesis step of Compound 033E, Compound 034 was synthesized by the same operation as in Synthesis Example 1 except that dichlorodiphenylsilane was replaced with an equimolar amount of dichlorodimethylsilane.

[0687] MS (LDI): m / z 845.37 ([M-Tf2N] + ), 279.92(Tf2N - ).

[0688] Maximum absorption wavelength = 928nm (CH2Cl2)

[0689] (Synthesis Example 3) Synthesis of Compound 035

[0690] In the synthesis step of Compound 033E, Compound 035 was synthesized by the same operation as in Synthesis Example 1 except that dichlorodiphenylsilane was replaced with an equimolar amount of dichlorodiethylsilane.

[0691] MS (LDI): m / z 873.39 ([M-Tf2N] + ), 279.91(Tf2N - ).

[0692] Maximum absorption wavelength = 909nm (CH2Cl2)

[0693] (Synthesis Example 4) Synthesis of Compound 036

[0694] In the synthesis step of Compound 033B, Compound 036 was synthesized by the same operation as in Synthesis Example 1 except that Compound 033A was replaced with an equimolar amount of diethylaniline.

[0695] MS (LDI): m / z 789.30 ([M-Tf2N] + ), 279.92(Tf2N - ).

[0696] Maximum absorption wavelength = 915nm (CH2Cl2)

[0697] (Synthesis Example 5) Synthesis of Compound 037

[0698] Compound 037 was synthesized by the same operation as in Synthesis Example 1 except that 2-bromo-1,3-dimethoxybenzene was replaced with an equimolar amount of 2-bromomesitylene in the synthesis step of Compound 033I.

[0699] MS (LDI): m / z 951.43 ([M-Tf2N] + ), 279.93(Tf2N - ).

[0700] Maximum absorption wavelength = 1037nm (CH2Cl2)

[0701] (Synthesis Example 6) Synthesis of Compound 038

[0702] In the synthesis step of Compound 033I, Compound 038 was synthesized by the same operation as in Synthesis Example 1 except that 2-bromo-1,3-dimethoxybenzene was replaced with an equimolar amount of bromobenzene.

[0703] MS (LDI): m / z 909.35 ([M-Tf2N] + ), 279.93(Tf2N - ).

[0704] Maximum absorption wavelength = 1021nm (CH2Cl2)

[0705] (Synthesis Example 7) Synthesis of Compound 039

[0706] Compound 039 was synthesized by the same operation as in Synthesis Example 1 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with an equimolar amount of potassium trifluoroacetate in the synthesis step of Compound 033.

[0707] MS(LDI): m / z 845.37([M-CF3CO2] + ), 113.00(CF3CO2 - ).

[0708] Maximum absorption wavelength = 996nm (CH2Cl2)

[0709] (Synthesis Example 8) Synthesis of Compound 040

[0710] Compound 040 was synthesized by the same operation as in Synthesis Example 1 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with an equimolar amount of sodium trifluoromethanesulfonate in the synthesis step of Compound 033.

[0711] MS(LDI): m / z 845.37([M-CF3SO3] + ), 148.95(CF3SO3 - ).

[0712] Maximum absorption wavelength = 995nm (CH2Cl2)

[0713] (Synthesis Example 9) Synthesis of Compound 041

[0714] Compound 041 was synthesized by the same operation as in Synthesis Example 1 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with an equimolar amount of potassium hexafluorophosphate in the synthesis step of Compound 033.

[0715] MS (LDI): m / z 845.37 ([M-PF6] + ), 144.97(PF6 - ).

[0716] Maximum absorption wavelength = 994nm (CH2Cl2)

[0717] (Synthesis Example 10) Synthesis of Compound 042

[0718] Compound 042 was synthesized by the same operation as in Synthesis Example 1 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with an equimolar amount of lithium tetrakis(pentafluorophenyl)borate ethyl ether.

[0719] MS(LDI): m / z 845.37([MB(C6F5)4] + ), 678.97(B(C6F5)4 - ).

[0720] Maximum absorption wavelength = 995nm (CH2Cl2)

[0721] (Synthesis Example 11) Synthesis of Compound 043

[0722] Compound 043 was synthesized by the same operation as in Synthesis Example 1 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with an equimolar amount of potassium tris(trifluoromethanesulfonyl)methanide in the synthesis step of Compound 033.

[0723] MS(LDI): m / z 845.37([MC(SO2CF3)3] + ), 410.88(C(SO2CF3)3 - ).

[0724] Maximum absorption wavelength = 997nm (CH2Cl2)

[0725] (Synthesis Example 12) Synthesis of Compound 044

[0726] Compound 044 was synthesized by the same operation as in Synthesis Example 1 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with 0.5 equivalent of potassium 1,1,2,2,3,3-hexafluoropropane-1,3-disulfonate relative to Compound 033J in the synthesis step of Compound 033.

[0727] MS (LDI): m / z 845.37 ([cation part]), 154.96 ([anion part] / 2).

[0728] Maximum absorption wavelength = 995nm (CH2Cl2)

[0729] (Synthesis Example 13) Synthesis of Compound 045

[0730] In Synthesis Example 1, Compound 045 was synthesized by the same operation as in Synthesis Example 1 except that dichlorodiphenylsilane was replaced with an equimolar amount of thionyl chloride.

[0731] MS (LDI): m / z 835.32 ([M-Tf2N] + ), 279.92(Tf2N - ).

[0732] Maximum absorption wavelength = 1037nm (CH2Cl2)

[0733] (Synthesis Example 14) Synthesis of Compound 046

[0734] In Synthesis Example 4, Compound 046 was synthesized by the same operation as in Synthesis Example 4 except that dichlorodiphenylsilane was replaced with an equimolar amount of thionyl chloride.

[0735] MS (LDI): m / z 655.20 ([M-Tf2N] + ), 279.91(Tf2N - ).

[0736] Maximum absorption wavelength = 932nm (CH2Cl2)

[0737] (Synthesis Example 15) Synthesis of Compound 047

[0738] In Synthesis Example 5, Compound 045 was synthesized by the same operation as in Synthesis Example 5 except that dichlorodiphenylsilane was replaced with an equimolar amount of thionyl chloride.

[0739] MS (LDI): m / z 817.35 ([M-Tf2N] + ), 279.91(Tf2N - ).

[0740] Maximum absorption wavelength = 973nm (CH2Cl2)

[0741] (Synthesis Example 16) Synthesis of Compound 048

[0742] In Synthesis Example 6, Compound 045 was synthesized by the same operation as in Synthesis Example 6 except that dichlorodiphenylsilane was replaced with an equimolar amount of thionyl chloride.

[0743] MS (LDI): m / z 775.27 ([M-Tf2N] + ), 279.92(Tf2N - ).

[0744] Maximum absorption wavelength = 1067nm (CH2Cl2)

[0745] (Synthesis Example 17) Synthesis of Compound 049

[0746] In Synthesis Example 13, Compound 049 was synthesized by the same operation as in Synthesis Example 13 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with an equimolar amount of potassium hexafluorophosphate.

[0747] MS(LDI): m / z 835.32([M-CF3CO2] + ), 113.00(CF3CO2 - ).

[0748] Maximum absorption wavelength = 1038nm (CH2Cl2)

[0749] (Synthesis Example 18) Synthesis of Compound 050

[0750] In Synthesis Example 13, Compound 050 was synthesized by the same operation as in Synthesis Example 13 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with an equimolar amount of sodium trifluoromethanesulfonate.

[0751] MS(LDI): m / z 835.32([M-CF3SO3] + ), 148.95(CF3SO3 - ).

[0752] Maximum absorption wavelength = 1036nm (CH2Cl2)

[0753] (Synthesis Example 19) Synthesis of Compound 051

[0754] In Synthesis Example 13, Compound 051 was synthesized by the same operation as in Synthesis Example 13 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with an equimolar amount of sodium trifluoromethanesulfonate.

[0755] MS (LDI): m / z 835.32 ([M-PF6] + ), 144.97(PF6 - ).

[0756] Maximum absorption wavelength = 1037nm (CH2Cl2)

[0757] (Synthesis Example 20) Synthesis of Compound 052

[0758] Compound 052 was synthesized by the same operation as in Synthesis Example 13 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with an equimolar amount of lithium tetrakis(pentafluorophenyl)borate ethyl ether.

[0759] MS(LDI): m / z 835.32([MB(C6F5)4] + ), 678.97(B(C6F5)4 - ).

[0760] Maximum absorption wavelength = 1038nm (CH2Cl2)

[0761] (Synthesis Example 21) Synthesis of Compound 053

[0762] In Synthesis Example 13, Compound 053 was synthesized by the same operation as in Synthesis Example 13 except that potassium bis(trifluoromethanesulfonyl)imide was replaced with an equimolar amount of potassium tris(trifluoromethanesulfonyl)methanide.

[0763] MS(LDI): m / z 835.31([MC(SO2CF3)3] + ), 410.88(C(SO2CF3)3 - ).

[0764] Maximum absorption wavelength = 1036nm (CH2Cl2)

[0765] (Synthesis Example 22) Synthesis of Compound 054

[0766] In Synthesis Example 12, Compound 054 was synthesized by the same operation as in Synthesis Example 12 except that dichlorodiphenylsilane was replaced with an equimolar amount of thionyl chloride.

[0767] MS (LDI): m / z 835.32 ([cation part]), 154.96 ([anion part] / 2).

[0768] Maximum absorption wavelength = 1038nm (CH2Cl2)

[0769] <Manufacturing of Pigment Dispersion>

[0770] The materials shown in the following table were matched in the proportions shown in the following table to obtain a total of 10 g of a mixture. The mixture was mixed and dispersed for 3 hours using a bead mill (a high-pressure disperser NANO-3000-10 (NipponBEE Co., Ltd.) with a decompression mechanism) using 0.3 mm diameter zirconium oxide beads to prepare each pigment dispersion. The solid content concentration of the pigment dispersion was adjusted by the amount of solvent.

[0771] [Table 1]

[0772]

[0773] The details of the materials listed in the table are as follows.

[0774] (pigment)

[0775] 017, 018: Compounds 017, 018 (infrared absorbing pigment) listed in the specific examples of the above-mentioned specific infrared absorbing pigment

[0776] IR101 to IR103: Compounds of the following structures (infrared absorbing pigments)

[0777] [Chemical formula 42]

[0778]

[0779] PB15:6:CI Pigment Blue 15:6 (blue colorant)

[0780] PR254: CI Pigment Red 254 (red colorant)

[0781] (Pigment derivatives)

[0782] Syn-001, Syn-002: Compounds with the following structures

[0783] [Chemical formula 43]

[0784]

[0785] (Dispersant)

[0786] Dis-001: Resin with the following structure (the value marked on the main chain is the molar ratio, and the value marked on the side chain is the number of repeating units. Weight average molecular weight 25000)

[0787] Dis-002: Resin with the following structure (the value marked on the main chain is the molar ratio, and the value marked on the side chain is the number of repeating units. Weight average molecular weight 9800)

[0788] [Chemical formula 44]

[0789]

[0790] (Solvent)

[0791] S-001: Propylene glycol monomethyl ether acetate

[0792] <Manufacturing of resin composition>

[0793] The materials other than the solvent shown in the following table were mixed in the proportions shown in the following table, and the solvent shown in the following table was added and adjusted to a solid content concentration of 20% by mass, followed by stirring, and filtered using a nylon filter (manufactured by Nihon Pall Ltd.) with a pore size of 0.45 μm, thereby preparing a resin composition. The numerical values ​​in the column of the amount of compounding in the table are values ​​in parts by mass based on the solid content conversion value.

[0794] [Table 2]

[0795]

[0796] [Table 3]

[0797]

[0798] [Table 4]

[0799]

[0800] [Table 5]

[0801]

[0802] The details of the materials described in the above table are as follows.

[0803] (Pigment dispersion)

[0804] D001, D002, D101 to D105: the above pigment dispersions D001, D002, D101 to D105

[0805] (color material)

[0806] 001, 002, 008, 009, 016, 021, 022, 023, 025 to 054: Compounds 001, 002, 008, 009, 016, 021, 022, 023, 025 to 054 listed in the specific examples of the specific infrared absorbing dye

[0807] IR001 to IR007: Compounds of the following structures (infrared absorbing pigments)

[0808] [Chemical formula 45]

[0809]

[0810] (resin)

[0811] B001: Polymethyl methacrylate (weight average molecular weight 24000, dispersion degree 1.8)

[0812] B002: Random copolymer of benzyl methacrylate and methacrylic acid (benzyl methacrylate: methacrylic acid = 60:40 (molar ratio), weight average molecular weight of 20,000, dispersity of 1.9)

[0813] B003: Resin with the following structure (the value marked on the main chain is the molar ratio of the repeating unit, the weight average molecular weight is 15000, and the dispersity is 2.1)

[0814] [Chemical formula 46]

[0815]

[0816] B004: Resin with the following structure (weight average molecular weight: 25,000, dispersion degree: 2.2, glass transition temperature: 310°C)

[0817] [Chemical formula 47]

[0818]

[0819] (Polymerizable compound)

[0820] M-1: ARONIX M-305 (manufactured by TOAGOSEI CO., LTD., a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate. The content of pentaerythritol triacrylate is 55% to 63% by mass.)

[0821] M-2: KAYARAD RP-1040 (ethylene oxide modified pentaerythritol tetraacrylate manufactured by Nippon Kayaku Co., Ltd.)

[0822] M-3: ARONIX M-510 (polyacid-modified acrylic oligomer manufactured by TOAGOSEI CO., LTD.)

[0823] M-4: EPICLON N-695 (o-cresol novolac type epoxy compound manufactured by DIC Corporation)

[0824] (Photopolymerization Initiator)

[0825] C-1: Irgacure OXE01 (oxime ester compound manufactured by BASF)

[0826] C-2: Irgacure OXE02 (oxime ester compound manufactured by BASF)

[0827] (Surfactant)

[0828] F-1: MEGAFACE RS-72-K (fluorinated surfactant manufactured by DIC Corporation)

[0829] F-2: A compound having the following structure (weight average molecular weight: 14,000, and the % value indicating the ratio of the repeating unit is mol %)

[0830] [Chemical formula 48]

[0831]

[0832] F-3: KF-6001 (a polydimethylsiloxane modified with carbinol at both ends manufactured by Shin-Etsu Chemical Co., Ltd., with a hydroxyl value of 62 mgKOH / g, a silicone surfactant)

[0833] (Inhibitor)

[0834] G-1: p-Methoxyphenol

[0835] (Ultraviolet light absorber)

[0836] U-1: Uvinul 3050 (manufactured by BASF)

[0837] (Solvent)

[0838] S-001: Propylene glycol monomethyl ether acetate

[0839] S-002: Propylene glycol monomethyl ether

[0840] <Film Production>

[0841] (Manufacturing Example 1) Method for manufacturing a film using the resin composition of Examples 1, 2, Comparative Examples 1, 2

[0842] The resin composition was spin-coated on a glass substrate or an 8-inch (1 inch = 2.54 cm) silicon wafer until the film thickness after film formation was 1.5 μm. Next, the film was produced by heating at 100° C. for 1 minute using a hot plate.

[0843] (Manufacturing Example 2) Method for manufacturing a film using the resin composition of Example 3

[0844] The resin composition was spin-coated on a glass substrate or an 8-inch (1 inch = 2.54 cm) silicon wafer until the film thickness after film formation was 1.5 μm. Next, the film was heated at 200° C. for 10 minutes using a hot plate to produce a film.

[0845] (Manufacturing Example 3) Method for manufacturing a film using the resin composition of Examples 4 to 53

[0846] The resin composition was spin-coated on a glass substrate or an 8-inch (1 inch = 2.54 cm) silicon wafer until the film thickness after film formation was 1.5 μm. An i-ray stepper exposure apparatus FPA-3000i5+ (manufactured by Canon Inc.) was used at 1000 mJ / cm 2 The entire surface was exposed with an exposure amount of . Next, the film was produced by heating at 200° C. for 2 minutes using a hot plate.

[0847] <Evaluation of Spectral Characteristics>

[0848] (Evaluation of near infrared shielding properties)

[0849] The transmittance of the glass substrate having the above film formed thereon in the wavelength range of 400 to 2000 nm was measured using an ultraviolet visible near infrared spectrophotometer U-4100 (manufactured by Hitachi High-Tech Corporation) to obtain the average transmittance (T) in the wavelength range of 1000 to 1400 nm. The near infrared shielding property was evaluated according to the following criteria.

[0850] A: T < 5%

[0851] B: 5% ≤ T < 10%

[0852] C: 10% ≤ T

[0853] (Evaluation of rectangularity of light shielding area in near-infrared region)

[0854] The transmittance of the glass substrate on which the film was formed in the wavelength range of 400 to 2000 nm was measured using an ultraviolet-visible-near-infrared spectrophotometer U-4100 (manufactured by Hitachi High-Tech Corporation).

[0855] In the wavelength range of 700 to 1800 nm, the wavelength (λ) at which the transmittance is 20% on the longer wavelength side than the maximum absorption wavelength is determined. L20 ) and the wavelength at which the transmittance is 90% (λ L90 ), and a wavelength shorter than the maximum absorption wavelength and with a transmittance of 20% (λ S20 ) and the wavelength at which the transmittance is 90% (λ S90 ), and the rectangularity of each shading area was evaluated according to the following criteria.

[0856] -Evaluation criteria for rectangularity of light shielding area on the short wavelength side (rectangularity on the short wavelength side)-

[0857] A: λ S90 -λS20 <150nm

[0858] B: 150nm≤λ S90 -λ S20 <200nm

[0859] C: 200nm≤λ S90 -λ S20

[0860] -Evaluation criteria for rectangularity of light shielding area on the long wavelength side (rectangularity on the long wavelength side)-

[0861] A: λ L20 -λ L90 <150nm

[0862] B: 150nm≤λ L20 -λ L90 <200nm

[0863] C: 200nm≤λ L20 -λ L90

[0864] <Evaluation of light resistance>

[0865] The transmittance of the glass substrate on which the film was formed in the wavelength range of 400 to 2000 nm was measured using an ultraviolet-visible-near-infrared spectrophotometer U-4100 (manufactured by Hitachi High-Tech Corporation).

[0866] Next, the glass substrate on which the film was formed was irradiated with a xenon lamp at 100,000 lux for 20 hours (corresponding to 2,000,000 lux·h), and the transmittance of the film after irradiation with the xenon lamp was measured.

[0867] The change in transmittance (ΔT) at each wavelength in the range of 800 to 2000 nm before and after xenon lamp irradiation was determined, and the light resistance was evaluated according to the following criteria based on the maximum value of ΔT in the entire measurement wavelength band. The smaller the ΔT value, the better the light resistance.

[0868] Transmittance change (ΔT) = |transmittance of the film before xenon lamp irradiation - transmittance of the film after xenon lamp irradiation|

[0869] A: ΔT < 3%

[0870] B: 3≤ΔT<5%

[0871] C: 5≤ΔT%

[0872] <Evaluation of Heat Resistance>

[0873] The transmittance of the glass substrate on which the film was formed was measured in the wavelength range of 400 to 2000 nm using an ultraviolet-visible-near-infrared spectrophotometer U-4100 (manufactured by Hitachi High-Tech Corporation).

[0874] Next, the glass substrate on which the film was formed was heated at 200° C. for 10 minutes using a hot plate.

[0875] The change in transmittance (ΔT) at each wavelength in the wavelength range of 800 to 2000 nm before and after heating was determined, and the heat resistance was evaluated according to the following criteria based on the maximum value of ΔT in the entire measurement wavelength band. The smaller the ΔT value, the better the heat resistance.

[0876] Transmittance change (ΔT) = |transmittance of the film before heating - transmittance of the film after heating|

[0877] A: ΔT < 5%

[0878] B: 5≤ΔT<10%

[0879] C: 10 ≤ ΔT%

[0880] [Table 6]

[0881]

[0882] [Table 7]

[0883]

[0884] As shown in the above table, the light resistance and heat resistance of the examples were excellent. In addition, the rectangularity of the long wavelength side of the examples was also excellent, the transmission slope on the long wavelength side longer than the maximum absorption wavelength was steep, and the contrast between the transmittance and the light shielding was excellent.

[0885] Furthermore, the average transmittance of the films obtained using the resin compositions of Examples 28 and 53 in the wavelength range of 400 to 1000 nm was less than 5%.

[0886] The resin compositions of Examples 4 to 53 were spin-coated on a glass substrate or an 8-inch (1 inch = 2.54 cm) silicon wafer until the film thickness after film formation reached 1.5 μm, and then heated at 100° C. for 2 minutes using a hot plate. Next, an i-ray stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.) was used at 1000 mJ / cm 2The exposure amount was 2 μm, and a Bayer pattern of 2 μm was exposed through a mask. Then, a 0.3 mass % aqueous solution of tetramethylammonium hydroxide (TMAH) was used for spin immersion development at 23°C for 60 seconds. After that, it was rinsed with a rotary shower, further washed with pure water, and heated at 200°C for 5 minutes with a hot plate, thereby forming a pattern. The result of observing the obtained pattern under a microscope showed that a Bayer pattern was formed.

[0887] Explanation of symbols

[0888] 110 - solid-state imaging element, 111 - infrared cut filter, 112 - color filter, 114 - infrared transmission filter, 115 - microlens, 116 - planarization layer.

Claims

1. A resin composition comprising: At least one infrared absorbing dye A selected from the group consisting of a dye A1 represented by formula (1) and a dye multimer A2 containing two or more dye structures derived from the dye A1 in one molecule; and Resin, In formula (1), L 101 Represents -P(=O)(R L101 )-、-P(=S)(R L102 )-、-Si(R L103 )(R L104 )-、-B(R L105 )-, -S(=O)2- or -S(=O)-, R L101 ~R L105 Each independently represents a hydrogen atom or a substituent, R L103 With R L104 are optionally bonded to form a ring, X 101 ~X 103 Each independently represents a nitrogen atom or -CR X101 -, R X101 represents a hydrogen atom or a substituent, L 102 and L 103 Each independently represents a sulfur atom or -X 104 =X 105 , X 104 and X 105 Each independently represents a nitrogen atom or -CR X102 -, R X102 represents a hydrogen atom or a substituent, Ar 101 and Ar 102 Respectively independently represent -(CR Ar101 =CR Ar102 ) n101 -, an arylene group, a heterocyclic group or a group formed by combining two or more of these groups, R Ar101 and R Ar102 Each independently represents a hydrogen atom or a substituent, n101 represents an integer of 1 to 3, Y 101 and Y 102 Represents -OR independently Y101 、-NR Y102 R Y103 or -SR Y104 , R Y101 ~R Y104 Each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, and R Y102With R Y103 Optionally bonded via a single bond or a divalent linking group to form a ring, Ar 101 With X 101 Optionally bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring, Ar 101 With Y 101 Optionally bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring, Ar 102 With X 102 Optionally bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring, Ar 102 With Y 102 Optionally bonded via a single bond or a divalent linking group to form a 5-membered ring or a 6-membered ring, Z 1 represents the counter ion, p1 represents an integer from 0 to 5, q1 represents an integer from 1 to 5.

2. The resin composition according to claim 1, wherein X in the formula (1) 103 For-CR X101 -, R X101 is a hydrogen atom or a substituent, L 102 and L 103 are sulfur atoms respectively.

3. The resin composition according to claim 1, wherein X in the formula (1) 103 For-CR X101 -, R X101 is a hydrogen atom or a substituent, L 102 and L 103 are sulfur atoms, L 101 =P(=O)(R L101 )-, R L101 is a hydrogen atom or a substituent.

4. The resin composition according to claim 1, wherein X in the formula (1) 103 For-CR X101 -, R X101 is a hydrogen atom or a substituent, L 102 and L 103 are sulfur atoms, L 101 =P(=O)(R L101 )-, R L101 is a hydrogen atom or a substituent, Y 101 and Y 102 Each independently is -NR Y102 R Y103 , R Y102 and R Y103 are independently a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, R Y102 With R Y103 Optionally, the two groups are bonded via a single bond or a divalent linking group to form a ring.

5. The resin composition according to claim 1, wherein X in the formula (1) 103 For -C RX101 -, R X101 is a hydrogen atom or a substituent, L 102 and L 103 are sulfur atoms, L 101 -Si(R L103 )(R L104 )-or-S(=O)-, R L103 and R L104 are each independently a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, Y 101 and Y 102 Each independently is -NR Y102 R Y103 , R Y102 and R Y103 are independently a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group, R Y102 With R Y103 Optionally, the two groups are bonded via a single bond or a divalent linking group to form a ring. The resin composition according to any one of claims 1 to 5, further comprising an infrared absorber other than the infrared absorbing pigment A.

7. The resin composition according to claim 6, wherein The maximum absorption wavelength of the infrared absorbing agent other than the infrared absorbing dye A exists on the shorter wavelength side than the maximum absorption wavelength of the infrared absorbing dye A.

8. The resin composition according to any one of claims 1 to 5, wherein The maximum absorption wavelength of the infrared absorbing dye A exists in the wavelength range of 700 nm to 1800 nm. 9 . The resin composition according to claim 1 , further comprising a polymerizable compound and a photopolymerization initiator. 10 . A film obtained by using the resin composition according to claim 1 .

11. An optical filter comprising the film according to claim 10. 12 . A solid-state imaging element comprising the film according to claim 10 . 13 . An image display device comprising the film according to claim 10 . 14 . An infrared sensor comprising the film according to claim 10 .

15. A camera module comprising the film of claim 10.

16. A compound represented by formula (4), In the formula, Ar 401 represents an aryl or heteroaryl group, R 401 ~R 404 each independently represents a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group, R 405 and R 406 each independently represents an alkyl group, an aryl group, a heteroaryl group, an aryloxy group, a heteroaryloxy group, an alkoxy group or a cyano group, R 407 and R 408 each independently represents an alkyl group or an aryl group, n401 and n402 each independently represent an integer of 0 to 4, q4 means 1 or 2, Z 4 It represents a q4-valent counter anion.

17. A compound represented by formula (5), In the formula, Ar 501 represents an aryl or heteroaryl group, R 501 ~R 504 each independently represents a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group, R 505 and R 506 each independently represents an alkyl group, an aryl group, a heteroaryl group, an aryloxy group, a heteroaryloxy group, an alkoxy group or a cyano group, n 501 and n502 Each independently represents an integer from 0 to 4, q5 means 1 or 2, Z 5 It represents a q5-valent counter anion.

Images